Integrated circuit chip module multifunctional test appearance detection sorting device and method

Abstract

The invention provides a multifunctional testing, appearance detecting and sorting device and method for integrated circuit chip modules. The multifunctional testing, appearance detecting and sorting device comprises a preheating module, a high-normal temperature testing module and an appearance detecting module which are sequentially arranged in the conveying direction of a chip detecting procedure, and a cooling module is arranged in the middle of the high-normal temperature testing module. And a chip conveying device is erected above the preheating module, the high-normal temperature test module and the appearance detection module. A chip is heated and insulated through the heating box, so that the chip can effectively reach an expected temperature, the possibility of oxidation of an electronic element is reduced, meanwhile, the heat preservation in the transferring process is achieved by arranging the heat preservation device on the transferring arm, and the transferring efficiency is improved. And meanwhile, the rapid replacement of the chips on each test station is realized directly through the cooperation of the material bearing device and the displacement mechanism, so that the production efficiency is improved, the problems that the existing equipment is relatively complex and lengthy, and the production efficiency is low are solved, and professional chip detection is facilitated.

Description

Technical Field

[0001] The invention relates to a multifunctional testing appearance detection and sorting device and method for integrated circuit chip modules. Background Art

[0002] At present, the semiconductor industry needs to perform high temperature testing, normal temperature testing, and appearance testing on the chips produced before they are packaged and shipped out of the factory. Conventional chip testing machines only heat the chips quickly and then quickly move them to the test station for testing. Due to the rapid heating, the chips may not reach the required test temperature. At the same time, direct rapid heating of the chips may cause the electronic chips to oxidize. Due to the lack of insulation measures, the temperature of the chips drops during the period when they are sent to the high-temperature test area after being heated, and the chips cannot reach the predetermined temperature. When performing appearance microscopic inspection tests on the chips, conventional microscopic inspection tests directly use a robotic arm to move the chips to different test stations in order for testing. Therefore, cache stations need to be set between each process to avoid process disorder. Therefore, the overall equipment is relatively complex and lengthy, and the production efficiency is low. Summary of the invention

[0003] In view of this, the purpose of the present invention is to provide an integrated circuit chip module multifunctional testing appearance inspection and sorting device and method, which heats and insulates the chip through a heating box so that the chip can effectively reach the expected temperature. At the same time, the sliding cover plate and the protective gas delivery structure are used to prevent oxygen from entering the heating box, thereby reducing the possibility of oxidation of electronic components. At the same time, a heat preservation device is arranged on the transfer arm to achieve heat preservation during the transfer process. At the same time, the starting position of each test station is directly fixed by a material holding device, and then the material holding device is pushed into the test equipment by a pushing mechanism. After that, the chips on each test station are quickly replaced by a shifting mechanism, thereby improving production efficiency, solving the problems of complex and lengthy existing equipment and low production efficiency, and facilitating professional chip testing.

[0004] The present invention is implemented by the following scheme: a multifunctional testing appearance inspection and sorting device for integrated circuit chip modules: comprising a preheating module, a high-normal temperature testing module, and an appearance inspection module which are sequentially arranged along the conveying direction of the chip inspection process, a cooling module being arranged in the middle of the high-normal temperature testing module, and the cooling module separating the high-normal temperature testing module into a high-temperature testing area and a normal temperature testing area along the conveying direction of the chip inspection process, and a chip conveying device being mounted above the preheating module, the high-normal temperature testing module, and the appearance inspection module.

[0005] Furthermore, the chip conveying device includes a chip conveying rail, which is mounted on a preheating module, a high-normal temperature test module, and an appearance inspection module. A plurality of chip moving mechanisms are slidably connected to the chip conveying rail. The chip moving mechanism includes a sliding guide frame, and a transfer arm is slidably connected to the sliding guide frame for lifting and lowering. A chip picking and placing device is installed on the lower end of the transfer arm.

[0006] Furthermore, the chip placement device includes a heat-conducting block, which is fixed on the lower end of the transfer arm, and a chip limiting plate is installed under the heat-conducting block. A plurality of suction holes are opened on the lower surface of the heat-conducting block, and the other ends of the suction holes pass through the heat-conducting block and are connected to an external suction device. A clearance hole is opened on the chip limiting plate corresponding to the suction hole, and a suction nozzle is installed on the lower surface of the heat-conducting block in the end of the suction hole. A limiting bump is set on the lower surface of the chip limiting plate corresponding to the chip, and a heating tube is plugged into the heat-conducting block of the chip moving mechanism on the high-temperature test area of ​​the preheating module.

[0007] Furthermore, the cooling module includes a cooling conveying rail, which is located below the chip conveying rail and perpendicular to the chip conveying rail. A cooling tray is slidably connected to the cooling conveying rail. A plurality of chip cooling placement slots are arranged in an array on the cooling tray. A chip heat dissipation device is arranged next to the cooling tray.

[0008] Furthermore, the preheating module includes a top plate, a heating box is slidably connected below the top plate, a material receiving tray is arranged in the heating box, a heating device is arranged in the heating box below the material receiving tray, an inlet and outlet are provided on the top plate, the inlet is connected with the heating box, an opening and closing mechanism for opening and closing the inlet and outlet is arranged beside the inlet on the top plate; the top of the heating box is not closed, the top of the heating box is abutted against the lower surface of the top plate, the size of the inlet and outlet is not larger than the opening at the top of the heating box; the opening and closing mechanism includes a sliding cover plate for closing the inlet and outlet, the sliding cover plate is located at the side of the inlet and outlet, the sliding cover plate is divided into a plurality of independently sliding branch cover plates, and a sliding cylinder for driving the branch cover plates to slide is installed on the top plate; The heating device includes a heating plate, the material receiving tray is screwed on the heating plate, a plurality of material receiving grooves are arranged in an array on the material receiving tray, a protective gas delivery structure is arranged between the heating plate and the bottom plate of the heating box, the input end of the protective gas delivery structure extends out of the bottom plate of the heating box and is connected to an external protective gas source through a pipeline; the protective gas delivery structure includes a fixed bottom plate, a flow channel plate is installed on the fixed bottom plate, an air inlet is provided in the middle of the flow channel plate, a gas flow channel connected to the air inlet is provided on the upper plate surface of the flow channel plate, a plurality of air supply holes connected to the gas flow channel are provided on the heating plate, and a plurality of air outlet holes corresponding to the air supply holes are provided on the material receiving tray; an air inlet joint connected to the air inlet is provided on the bottom plate surface of the flow channel plate, the air inlet joint passes through the fixed bottom plate and the bottom plate of the heating box and extends out and is connected to an external protective gas source through a pipeline.

[0009] Furthermore, the preheating module also includes a mounting frame, the top plate frame is fixed on the mounting frame, a heating box slide rail is symmetrically installed in the mounting frame, and a heating box slide groove cooperating with the heating box slide rail is installed on the bottom of the heating box, and a heating box driving mechanism for driving the heating box to slide is installed on the mounting frame; the heating box driving mechanism includes horizontal driving pulleys symmetrically arranged front and back, and a driving conveyor belt is jointly sleeved on the two horizontal driving pulleys, and a clamping plate assembly is installed at the bottom of the heating box corresponding to the driving conveyor belt, and the driving clamping plate assembly includes a fixed block and a movable block, the fixed block is screwed to the sliding block, and the driving conveyor belt is clamped between the fixed block and the movable block, and a motor for driving one of the horizontal driving pulleys to rotate is installed on the mounting frame; an L-shaped connecting plate is installed on one side of the branch cover plate corresponding to the sliding cylinder, the vertical part of the L-shaped connecting plate is at the bottom, and the horizontal part is at the top, the vertical part is fixed to the branch cover plate, and the horizontal part is connected to the movable end of the sliding cylinder.

[0010] Further, the appearance inspection module includes a test mechanism, a material receiving device is arranged on the side of the test mechanism, a pushing mechanism for driving the material receiving device to slide is installed at the lower part of the material receiving device, and a shifting mechanism is arranged above the material receiving device; the material receiving device includes a sliding tray, a plurality of chip placement seats are arranged at intervals on the side of the sliding tray close to the test mechanism, and a chip placement groove for placing chips is arranged on the chip placement seat; the chip placement seat is L-shaped, the vertical part of the chip placement seat is at the bottom and the horizontal part is at the top, the vertical part of the chip placement seat is fixed on the edge of the sliding tray, the end of the horizontal part of the chip placement seat faces the test mechanism, and the chip placement groove is arranged on the end of the horizontal part of the chip placement seat; The pushing mechanism comprises a pushing frame, a pushing slide rail arranged toward the testing mechanism is installed on the pushing frame, a pushing slider cooperating with the pushing slide rail is installed under the sliding tray, and a driving mechanism for driving the sliding tray to slide is installed on the pushing frame; the driving mechanism comprises horizontal pulleys symmetrically installed at both ends of the pushing slide rail, the two horizontal pulleys are jointly sleeved in a conveyor belt, the pushing slide rail is located in the area surrounded by the conveyor belt, the sliding tray is fixed on the conveyor belt, and a pushing motor for driving one of its horizontal pulleys to rotate is installed on the pushing frame; a clamping plate mechanism is installed under the sliding tray, and the clamping plate mechanism comprises an L-shaped fixed plate and a movable plate, the horizontal part of the L-shaped fixed plate is on the top, and the vertical part is on the bottom, the horizontal part of the L-shaped fixed plate is fixed on the sliding tray, the movable plate is screwed on the vertical part of the L-shaped fixed plate, and the conveyor belt is clamped between the vertical part of the L-shaped fixed plate and the movable plate.

[0011] The cam is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers.

[0012] The lifting of the lifting mechanism is a kind of lifting mechanism that can be used for the lifting of the lifting mechanism, and the lifting of the lifting mechanism is a kind of lifting mechanism that can be used for the lifting of the lifting mechanism, and the lifting of the lifting mechanism is a kind of lifting mechanism that can be used for the lifting of the lifting mechanism.

[0013] A method for using a multifunctional test appearance detection and sorting device for integrated circuit chip modules: Step S1: The preheating module opens the inlet and outlet through the opening and closing mechanism, and the transfer arm on the preheating module delivers the chip from the previous process into the heating box. Then the transfer arm returns and closes the inlet and outlet through the opening and closing mechanism, and the heating box heats the chip. Step S2: After the chip is heated in the heating box for a set time, the opening and closing mechanism opens the inlet and outlet, the transfer arm on the preheating module moves the chip out, the opening and closing mechanism closes the inlet and outlet, the transfer arm puts the chip into the cache station between the preheating module and the high-temperature test area, the transfer arm on the preheating module is reset, and then the transfer arm on the high-temperature test area takes the chip out of the cache station and puts it into the high-temperature test station on the high-temperature test area for testing; Step S3: After the chip is tested in the high-temperature test area, the transfer arm on the cooling module takes the qualified chip out of the high-temperature test area and sends it to the chip cooling placement slot on the cooling tray, and the chip cooling device next to the cooling tray cools the chip; Step S4: After the chip has cooled for a predetermined time, the transfer arm on the cooling module takes the heat-dissipated chip out of the chip cooling tank and sends it to the normal temperature test station on the normal temperature test area for testing. After the test is completed, the qualified chip is sent to the appearance inspection module via the transfer arm on the normal temperature test area; Step S5: Send the appearance inspection module to the first chip placement slot of the material receiving device, push the material receiving device to slide by the pushing mechanism, so that the chip enters the testing mechanism, completes the test of the corresponding station, and then pushes the material receiving device to slide and reset by the pushing mechanism, and then the shifting mechanism moves the chip on the material receiving device according to the process, wherein the chip of the last process is moved out of the material receiving device and sent to the next output buffer station, and at the same time, the first test station on the material receiving device is vacated, and the chip that has passed the test at the normal temperature test station is placed in the first test station via the transfer arm; Step S6: The chip on the output buffer station is sent out by an external robot arm to complete the test.

[0014] Compared with the prior art, the present invention has the following beneficial effects: the chip is heated and insulated by a heating box so that the chip can effectively reach the expected temperature, and at the same time, the sliding cover plate and the protective gas delivery structure are used to prevent oxygen from entering the heating box, thereby reducing the possibility of oxidation of electronic components, and at the same time, a heat preservation device is arranged on the transfer arm to achieve heat preservation during the transfer process, and at the same time, the starting position of each test station is directly fixed by the material holding device, and then the material holding device is pushed into the test equipment by the pushing mechanism, and then the chip on each test station is quickly replaced by the shifting mechanism, thereby improving production efficiency, solving the problem that the existing equipment is relatively complex and lengthy and the production efficiency is low, and professional chip testing is convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a preheating module according to an embodiment of the present invention; Figure 3 It is a cross-sectional structural schematic diagram of a preheating module according to an embodiment of the present invention; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 for Figure 3 Enlarged view of point B in the middle; Figure 6 This is a schematic diagram of the structure of an appearance detection module according to an embodiment of the present invention; Figure 7 Schematic diagram of the structure of the pushing mechanism and the material receiving device of the appearance inspection module of the embodiment of the present invention Figure 1 ; Figure 8 Schematic diagram of the structure of the pushing mechanism and the material receiving device of the appearance inspection module of the embodiment of the present invention Figure 1 ; Fig. 9 Schematic diagram of the displacement mechanism structure of the appearance detection module according to an embodiment of the present invention Figure 1 ; Fig.10 Schematic diagram of the displacement mechanism structure of the appearance detection module according to an embodiment of the present invention Figure 2 ; Fig.11 The structure of the closing mechanism of the embodiment of the present invention is shown in FIG. Figure 1 ; Fig.12 The structure of the closing mechanism of the embodiment of the present invention is shown in FIG. Figure 2 ; Fig.13 The structure of the closing mechanism of the embodiment of the present invention is shown in FIG. Figure 3 ; Fig.14 It is a cross-sectional structural schematic diagram of a closing mechanism according to an embodiment of the present invention; Fig.15 for Fig.13 Enlarged view of point A in the middle; Fig.16 This is a schematic diagram of the structure of a high-normal temperature test module according to an embodiment of the present invention; Fig.17 for Fig.16 Enlarged view of center C.

[0016] In the figure: A0-preheating module; A1-top plate; A2-heating box; A3-material tray; A4-heating device; A5-inlet and outlet; A6-opening and closing mechanism; A7-sliding cover plate; A8-branch cover plate; A9-sliding cylinder; A10-heating plate; A11-material trough; A12-protective gas delivery structure; A13-fixed bottom plate; A14-flow channel plate; A15-air inlet; A16-gas flow channel; A17-air delivery hole; A18-air outlet; A19-air inlet connector; A20-sealing strip; A21-mounting frame; A22-heating box slide rail; A23-heating box slide; A24-heating box drive mechanism; A25-horizontal drive pulley; A26-drive conveyor belt; A27-fixed block; A28- - movable block A; A29-L-type connecting plate; B0-appearance inspection module; B1-material bearing device; B2-pushing mechanism; B3-shifting mechanism; B4-sliding tray; B5-chip placement seat; B6-chip placement slot; B7-push material rack; B8-push material slide rail; B9-push material slider; B10-driving mechanism; B11-horizontal pulley; B12-conveyor belt; B13-push material motor; B14-clamping plate mechanism; B15-L-shaped fixed plate; B16-movable plate; B17-shifting bracket; B18-vertical guide plate; B19-shifting plate; B20-cantilever; B21-suction cup; B22-horizontal shifting slide rail; B23-horizontal shifting slider; B24-vertical shifting pulley; B25-vertical shifting conveyor belt; B2 6-shift motor; B27-vertical lifting slide rail; B28-vertical lifting slider; B29-vertical lifting pulley; B30-vertical lifting conveyor belt; B31-lifting motor; B32-vertical fixing block; B33-auxiliary vertical slide plate; C0-closing mechanism; C1-vertical support plate; C2-tray bin; C3-tray bearing structure; C4-tray channel; C5-tray moving platform; C6-traction mechanism; C7-tray bracket; C8-tray bearing slot; C10-traveling wheel; C11-guide rail slot; C12-accommodating slot; C13-vertical guide rail; C14-lifting crane; C15-lifting push plate; C16-avoidance; C17-tray bin driving pulley; C18-tray bin driving transmission belt; C19-tray bin lifting Lowering motor; C20-horizontal platform; C21-limiting slide rail; C22-transport channel; C23-horizontal guide rail; C24-horizontal slide; C25-traction mechanism avoidance; C26-vertical cylinder; C27-fixed arm; C28-latch pin; C29-socket; C30-L-shaped bracket; C31-cantilever; C32-connecting block; C33-traction mechanism drive pulley; C34-traction mechanism drive transmission belt; C35-traction mechanism drive motor; D0-high-normal temperature test module; D1-cooling module; D2-high temperature test area; D3-normal temperature test area; D4-high temperature test station; D5-normal temperature test station; D6-caching station; D7-chip conveying guide rail; D8-sliding guide frame; D9-transfer arm;D10-heat conduction block; D11-chip limit plate; D12-suction hole; D13-allowance hole; D14-suction nozzle; D15-heating tube; D16-cooling conveying guide rail; D17-cooling tray; D18-chip cooling placement slot. ; DETAILED DESCRIPTION

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] It should be noted that the following detailed descriptions are exemplary and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0019] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0020] like Figure 1-17 As shown, a multifunctional test appearance inspection and sorting device for integrated circuit chip modules includes a preheating module A0, a high-normal temperature test module D0, and an appearance inspection module B0 which are sequentially arranged along the conveying direction of the chip inspection process. A cooling module D1 is arranged in the middle of the high-normal temperature test module. The cooling module separates the high-normal temperature test module into a high temperature test area D2 and a normal temperature test area D3 along the conveying direction of the chip inspection process. A chip conveying device is arranged above the preheating module, the high-normal temperature test module, and the appearance inspection module. The input end of the device is , the output end is provided with an existing feeding mechanism and a receiving mechanism, and the input end of the receiving mechanism is provided with a mechanical arm for clamping the chip after the appearance inspection module test is qualified; the high temperature test area is provided with a number of existing high temperature test devices, and the high temperature test device is provided with a high temperature test station D4; the normal temperature test area is provided with a number of existing normal temperature test devices, and the normal temperature test device is provided with a normal temperature test station D5; the preheating module and the high-normal temperature test module, the high-normal temperature test module and the appearance inspection module can all be provided with a cache station D6 for caching chips.

[0021] In this embodiment, in order to realize the specific movement of the chip conveying device, the specific structure of the chip conveying device is as follows: the chip conveying device includes a chip conveying rail D7, and the chip conveying rail is mounted on the preheating module, the high-normal temperature test module, and the appearance inspection module. A plurality of chip moving mechanisms are slidably connected to the chip conveying rail. The chip moving mechanisms correspond to the preheating module, the high-normal temperature test module, and the appearance inspection module one by one, that is, the preheating module, the high temperature test area, the cooling module, the normal temperature test area, and the appearance inspection module are each equipped with a chip moving mechanism, and the chip moving mechanism includes a sliding guide frame D8, and the sliding guide frame is horizontally Sliding on the chip conveying rail, the sliding guide frame is driven to slide by the existing sprocket chain or conveyor belt. Since the driving method is the existing technology, it will not be described in detail. The sliding guide frame is lifted and slidably connected with a transfer arm D9. The lifting and sliding method can be a slide rail type, that is, the sliding guide frame is provided with a vertical lifting rail, and the transfer arm is slidably connected to the lifting rail through a slide groove provided behind it. The sliding guide frame is provided with an existing telescopic rod used to drive the transfer arm to descend or rise. The telescopic rod can be an existing mechanism such as a cylinder, an oil cylinder, a conveyor belt, etc. that can realize the sliding of the transfer arm. A chip picking and placing device is installed on the lower end of the transfer arm; The number of transfer arms on the sliding guide frame corresponds to the settings of the preheating module, high-temperature test area, cooling module, normal temperature test area, and appearance inspection module. Specifically: 1. Two transfer arms are symmetrically arranged on the sliding guide frame corresponding to the preheating module. When in use, one of the two transfer arms is used to absorb the chip to be heated from the feeding mechanism and put the chip to be heated into the preheating module, and the other is used to take out the heated chip and put it into the cache station between the preheating module and the high-normal temperature test module. The process steps are as follows: first, one transfer arm absorbs the chip to be heated on the feeding mechanism, and then the entire sliding guide frame slides to the preheating module, and the other idle transfer arm grabs the heated chip 1. The chip slot is vacant, and then the chip to be heated is placed in the vacant chip slot, and then the heated chip is transferred to the cache station; 2. Two high-temperature test stations can be set in the high-temperature test area, and two transfer arms are symmetrically arranged on the sliding guide frame corresponding to the high-temperature test area. The process steps are as follows: the two transfer arms synchronously absorb the chip on the cache station and the chip on the first high-temperature test station. After absorption, the cache station and the first high-temperature test station are vacated, and the sliding guide frame is moved to synchronously put the chip on the cache station into the first high-temperature test station, and the chip on the first high-temperature test station into the second high-temperature test station to realize the transfer of the chip; 3. The sliding guide frame of the cooling module is similar to the sliding guide frame on the preheating module, both of which have two transfer arms symmetrically arranged on the left and right. When in use, one of the two transfer arms is used to absorb the chip to be cooled from the second high-temperature test station and put the chip to be cooled into the cooling module, and the other is used to take out the cooled chip and put it into the normal temperature test area. The process steps are as follows: first, one transfer arm absorbs the chip to be cooled on the second high-temperature test station, and then the whole sliding guide frame slides to the top of the cooling module, and the other empty transfer arm grabs the cooled chip, leaving a vacant chip cooling placement slot, and then puts the chip to be cooled into the vacant chip cooling placement slot, and then puts the cooled chip The chip is transferred to the normal temperature test area; 4. Three normal temperature test stations can be set in the normal temperature test area, and three transfer arms are set on the sliding guide frame corresponding to the normal temperature test area. The process steps are: the three transfer arms synchronously absorb the chips on the three normal temperature test stations. After absorption, the first normal temperature test station is vacated, and the sliding guide frame is moved to synchronously put the chip of the first normal temperature test station into the second normal temperature test station, the chip of the second normal temperature test station into the third normal temperature test station, and the chip of the third normal temperature test station into the appearance inspection module. At the same time, the transfer arm of the cooling module sends the new chip to the first normal temperature test station, and then realizes the transfer of the chip.

[0022] In this embodiment, in order to realize that the chip placement device can move the chip and at the same time realize heat preservation during movement, the chip placement device includes a heat conductive block D10, the heat conductive block is fixed on the lower end of the transfer arm, a chip limiting plate D11 is installed under the heat conductive block, a plurality of suction holes D12 are opened on the lower surface of the heat conductive block, the other end of the suction hole passes through the heat conductive block and is connected to an external suction device, the suction device can be an existing vacuum pump, a clearance hole 13 is opened on the chip limiting plate corresponding to the suction hole, and a chip limiting plate D11 is installed on the lower surface of the heat conductive block at the end of the suction hole. There is a suction nozzle D14, and a limiting protrusion is set on the lower surface of the chip limiting plate corresponding to the chip. When in use, the chip is attached to the chip through the chip limiting plate, so that the suction nozzle is close to the chip, and the vacuum pump is started to generate negative pressure on the positioning hole to absorb the chip to achieve suction. The chip limiting plate and the heat conductive block are made of existing heat conductive materials. The heat conductive block of the chip moving mechanism on the high-temperature test area of ​​the preheating module is plugged with a heating tube D15. The chip limiting plate and the heat conductive block are preheated by the heating tube, so that the chip limiting plate and the heat conductive block have an initial temperature to achieve heat preservation during transfer.

[0023] In this embodiment, in order to achieve cooling of the chip between the high-temperature test area and the normal temperature test area, the cooling module includes a cooling conveying rail D16, which is located below the chip conveying rail and perpendicular to the chip conveying rail. A cooling tray D17 is slidably connected to the cooling conveying rail. The cooling conveying rail is provided with an existing conveyor belt for driving the cooling tray to move. A plurality of chip cooling placement slots D18 are arranged in an array on the cooling tray. A chip heat dissipation device is provided next to the cooling tray. The chip heat dissipation device can be an existing cooling fan, and the cooling tray can be made of existing thermal conductive materials to facilitate heat conduction and heat dissipation.

[0024] In this embodiment, the preheating module includes a top plate A1, a heating box A2 is slidably connected under the top plate, a material receiving tray A3 is arranged in the heating box, a heating device A4 is arranged in the heating box under the material receiving tray, an inlet and outlet port A5 is opened on the top plate, the feed port is connected to the heating box, and an opening and closing mechanism A6 for opening and closing the inlet and outlet port is arranged on the side of the feed port on the top plate. When in use, the inlet and outlet port is opened by the opening and closing mechanism, which facilitates an external robot arm to send the chip into or out of the heating box. At the same time, when the robot arm sends the chip into or out, the heating box moves synchronously, so that different positions of the material receiving tray are exposed under the inlet and outlet port. At the same time, when there is no robot arm to send the chip into or out, the heating box is closed by the opening and closing mechanism to prevent external oxygen from entering the heating box, which causes oxidation of electrical components on the chip.

[0025] In this embodiment, in order to achieve reasonable design and realize the movable chip into the heating box, the top of the heating box is not closed, the top of the heating box is against the lower surface of the top plate, and the size of the inlet and outlet is not larger than the opening at the top of the heating box. The purpose of the size of the inlet and outlet is not larger than the opening at the top of the heating box is to minimize the exposure of the inside of the heating box after opening the inlet and outlet to reduce the possibility of oxygen entering.

[0026] In this embodiment, in order to realize the opening and closing of the inlet and outlet, the opening and closing mechanism includes a sliding cover plate A7 for closing the inlet and outlet, the sliding cover plate is located on the side of the inlet and outlet, and the sliding cover plate is divided into a plurality of independently sliding branch cover plates A8. A sliding cylinder A9 for driving the branch cover plates to slide is installed on the top plate. When the inlet and outlet are fully open, a plurality of independently sliding branch cover plates may be located together on one side of the inlet and outlet, or may be arranged on both sides of the inlet and outlet in an interlaced or non-sequential manner, or may be located around the inlet and outlet. As long as the inlet and outlet are fully closed, a plurality of independently sliding branch cover plates may form a closed sliding cover plate. At the same time, when the robot arm sends or removes the chip, it only needs to open the branch cover plate at the corresponding position, and other branch cover plates do not need to be opened, thereby further reducing the possibility of oxygen entering.

[0027] In this embodiment, in order to achieve heating, the heating device includes a heating plate A10, the material receiving tray is screwed on the heating plate, and a plurality of material receiving grooves A11 for receiving chips are arranged in an array on the material receiving tray. A protective gas delivery structure A12 is provided between the heating plate and the bottom plate of the heating box, and the input end of the protective gas delivery structure extends out of the bottom plate of the heating box and is connected to an external protective gas source through a pipeline. Specifically, the protective gas can be nitrogen, and the protective gas source can be a nitrogen bottle. By filling the heating box with nitrogen, the possibility of oxygen entering is further reduced.

[0028] In this embodiment, for the sake of reasonable design, the protective gas delivery structure includes a fixed bottom plate A13, on which a flow channel plate A14 is installed, an air inlet A15 is provided in the middle of the flow channel plate, a gas flow channel A16 connected to the air inlet is provided on the upper plate surface of the flow channel plate, a plurality of air supply holes A17 connected to the gas flow channel are provided on the heating plate, and a plurality of air outlet holes A18 corresponding to the air supply holes are provided on the material receiving tray. When in use, the protective gas source is input from the air inlet, enters the air supply holes through the gas flow channel, and then is sent into the inner cavity of the heating box through the air outlet to fill the heating box with protective gas. More specifically, an air inlet connector A19 connected to the air inlet is provided on the bottom plate surface of the flow channel plate, and the air inlet connector extends through the fixed bottom plate and the bottom plate of the heating box and is connected to an external protective gas source through a pipeline.

[0029] In this embodiment, in order to achieve sealing and further prevent oxygen from entering the heating box, a sealing strip A20 is embedded on the outer periphery of the top of the heating box.

[0030] In this embodiment, in order to realize the sliding of the heating box, the preheating module also includes an installation frame A21, the top plate frame is fixed on the installation frame, and the heating box slide rails A22 are symmetrically installed in the installation frame. A heating box slide groove A23 matching the heating box slide rail is installed on the bottom of the heating box, and the sliding of the heating box is realized by the heating box slide rail and the heating box slide groove. A heating box driving mechanism A24 for driving the heating box to slide is installed on the installation frame, and the heating box driving mechanism is located between the two heating box slide rails.

[0031] In this embodiment, the heating box driving mechanism includes a horizontal driving pulley A25 which is symmetrically arranged front and back, and the horizontal driving pulley is rotatably connected to the mounting frame. A driving conveyor belt A26 is commonly sleeved on the outside of the two horizontal driving pulleys, that is, the driving conveyor belt is installed outside the two horizontal driving pulleys to form a ring. A driving clamping plate assembly is installed at the bottom of the heating box corresponding to the driving conveyor belt. The driving clamping plate assembly includes a fixed block A27 and a movable block A28. The fixed block is fixed under the heating box, and the fixed block is screwed to the sliding block. Part of the driving conveyor belt is clamped between the fixed block and the movable block. A motor for driving one of the horizontal driving pulleys to rotate is installed on the frame. The reciprocating motion of the motor realizes the reciprocating motion of the driving conveyor belt, thereby driving the reciprocating sliding of the heating box.

[0032] In this embodiment, in order to specifically realize the connection between the branch cover plate and the sliding cylinder, an L-shaped connecting plate A29 is installed on one side of the branch cover plate corresponding to the sliding cylinder. The vertical part of the L-shaped connecting plate is at the bottom and the horizontal part is at the top. The vertical part is fixed on the branch cover plate, and the horizontal part is connected to the movable end of the sliding cylinder.

[0033] In this embodiment, the appearance inspection module includes a testing mechanism, which is an existing multi-station appearance microscopy machine. Since it is a prior art, it will not be described in detail. A material holding device B1 is arranged on the side of the testing mechanism, and a pushing mechanism B2 for driving the material holding device to slide is installed at the lower part of the material holding device. A shifting mechanism B3 is arranged above the material holding device. When in use, the chips are distributed on the material holding device at intervals, and the material holding device is pushed to slide by the pushing mechanism so that the chip enters the testing mechanism to complete the test of the corresponding station. Thereafter, the material holding device is pushed to slide and reset by the pushing mechanism, and then the shifting mechanism moves the chip on the material holding device according to the process, wherein the chip of the last process is moved out of the material holding device, and at the same time the first test station on the material holding device is vacated, and a new chip to be tested is placed in the first test station by an external robotic arm.

[0034] In this embodiment, in order to enable the material holding device to place the chip and facilitate microscopic inspection, the material holding device includes a sliding tray B4, and a plurality of chip placement seats B5 are arranged at intervals on the side of the sliding tray close to the testing mechanism. The chip placement seats are provided with chip placement grooves B6 for placing the chips, and the chip placement grooves are hollow grooves for facilitating microscopic inspection.

[0035] In this embodiment, since the appearance microscopy machine mainly uses a camera to perform post-photographing inspection, the chip needs to enter the working position of the appearance microscopy machine, and the chip placement seat is L-shaped, with the vertical portion of the chip placement seat at the bottom and the horizontal portion at the top. The vertical portion of the chip placement seat is fixed on the edge of the sliding tray, and the horizontal portion of the chip placement seat faces the testing mechanism. The chip placement groove is arranged on the horizontal portion of the chip placement seat, so that the chip placement seat can be inserted into the corresponding appearance microscopy machine for easy microscopy inspection.

[0036] In this embodiment, in order to realize the pushing mechanism driving the material receiving device to slide, the pushing mechanism includes a pushing frame B7, a pushing rail B8 arranged toward the testing mechanism is installed on the pushing frame, a pushing slider B9 cooperating with the pushing rail is installed under the sliding tray, and a driving mechanism B10 for driving the sliding tray to slide is installed on the pushing frame. More specifically, the driving mechanism includes horizontal pulleys B11 symmetrically installed at both ends of the pushing rails, the horizontal pulleys are rotatably connected to the pushing frame, and the two horizontal pulleys are jointly sleeved in a conveyor belt B12, that is, the conveyor belt is sleeved on two horizontal pulleys to form an annular conveyor belt. The pushing rail is located in the area surrounded by the conveyor belt, and the sliding tray is fixed on the conveyor belt. A pushing motor B13 for driving one of its horizontal pulleys to rotate is installed on the pushing frame, and the reciprocating motion of the conveyor belt is realized by the forward and reverse rotation of the pushing motor, thereby driving the sliding of the sliding tray.

[0037] In this embodiment, in order to realize the connection between the sliding tray and the conveyor belt, a clamping plate mechanism B14 is installed under the sliding tray, and the clamping plate mechanism includes an L-shaped fixed plate B15 and a movable plate B16. The horizontal part of the L-shaped fixed plate is on the top and the vertical part is on the bottom. The horizontal part of the L-shaped fixed plate is fixed on the sliding tray, and the movable plate is screwed on the vertical part of the L-shaped fixed plate. The conveyor belt is clamped between the vertical part of the L-shaped fixed plate and the movable plate, that is, part of the conveyor belt is clamped in the clamping plate mechanism, thereby realizing the connection between the sliding tray and the conveyor belt.

[0038] In this embodiment, in order to realize the movement of chips according to the process, the shift mechanism includes a shift bracket B17, and a vertical guide plate B18 is slidably connected to the shift bracket along a horizontal direction perpendicular to the sliding direction of the sliding tray. A shift jig is slidably connected to the vertical guide plate for lifting and lowering. The shift jig includes a shift plate B19, that is, the shift plate is slidably connected to the vertical guide plate, and the shift plate is located above the sliding tray. A plurality of cantilevers B20 are provided on the shift plate corresponding to the chip placement grooves, and a suction cup B21 for adsorbing the chip is installed on the end of the cantilever. When in use, the suction cup and the chip are adsorbed and detached by the vertical lifting and lowering of the shift plate, and the chip is moved according to the process through the horizontal sliding of the vertical guide plate.

[0039] In this embodiment, in order to realize the sliding of the vertical guide plate, horizontal shift rails B22 are symmetrically installed on the upper and lower sides of the shift bracket, and a horizontal shift slider B23 cooperating with the horizontal shift rails is installed on the vertical guide plate. A shift drive mechanism for driving the vertical guide plate to slide is installed between the two horizontal shift rails on the shift bracket, and the shift drive mechanism includes a vertical shift pulley B24 symmetrically installed on the left and right, and the vertical shift pulley is rotatably connected to the shift bracket. The two vertical shift pulleys are jointly mounted in a vertical shift conveyor belt B25, and the vertical guide plate is fixed on the conveyor belt in the same way as the sliding tray fixes the conveyor belt. Of course, it can also be achieved by other similar methods, as long as the fixation can be achieved. A shift motor B26 for driving one of its vertical shift pulleys to rotate is installed on the shift bracket, and the reciprocating motion of the vertical shift conveyor belt is realized by the forward and reverse rotation of the shift motor, thereby driving the sliding of the vertical guide plate.

[0040] In this embodiment, in order to realize the vertical lifting of the shift plate, a vertical lifting rail B27 is installed on the middle part of the vertical guide plate on the side facing away from the shift bracket, and a vertical lifting slider B28 cooperating with the vertical lifting rail is installed on the side of the shift plate close to one end of the vertical guide plate. A vertical lifting driving mechanism for driving the shift plate to slide is installed on the vertical guide plate, and the vertical lifting driving mechanism includes vertical lifting pulleys B29 symmetrically installed at both ends of the vertical lifting rail, and the two vertical lifting pulleys are jointly sleeved on a vertical lifting conveyor belt B3. 0, the vertical lifting pulley is rotatably connected to the vertical guide plate, the vertical lifting slide rail is located in the area surrounded by the vertical lifting conveyor belt, the shift plate is fixed on the vertical lifting conveyor belt, and the fixing method is the same as the method of fixing the conveyor belt with a sliding tray. Of course, it can also be achieved by other similar methods, as long as the fixation can be achieved. A lifting motor B31 for driving one of the vertical lifting pulleys to rotate is installed on the vertical guide plate, and the reciprocating motion of the vertical lifting conveyor belt is achieved by the forward and reverse rotation of the lifting motor, thereby driving the sliding of the shift plate.

[0041] In this embodiment, in order to facilitate the sliding of the shift plate, a vertical fixed block B32 is installed on the middle part of one end side of the shift plate close to the vertical guide plate, and the vertical fixed block is fixed on an auxiliary vertical slide plate B33. The vertical lifting slider is installed on the auxiliary vertical slide plate to achieve a sliding connection. The auxiliary vertical slide plate is fixed on the vertical lifting conveyor belt, that is, the T-shaped combination of the shift plate and the vertical fixed block is installed on the auxiliary vertical slide plate. The connection method between the auxiliary vertical slide plate and the vertical lifting conveyor belt is the same as the method of fixing the conveyor belt for the sliding tray. Of course, it can also be achieved through other similar methods as long as the drive can be achieved.

[0042] In this embodiment, a tray collection mechanism C0 is arranged beside the material receiving mechanism, which is used for classifying and recovering defective products in different workstations. The specific structure is as follows: it includes a vertical support plate C1, and a tray bin C2 is slidably connected to the upper side of the vertical support plate. A plurality of tray bearing structures C3 are spaced from top to bottom in the tray bin. A tray channel C4 through which the feed tray bearing structure passes is arranged on the plate surface of the vertical support plate. A tray moving platform C5 connected to the tray channel is installed on the plate surface of the vertical support plate on the side away from the tray bin. A traction mechanism C6 which is the same as the push-pull tray bearing structure is installed on the tray moving platform. When in use, the tray bin is raised and lowered, and the defective products of different inspection processes transmitted by the robot arm are raised and lowered to the corresponding tray bearing structure to align with the tray channel. Then the traction mechanism slides to the end to pass through the tray channel and is clamped on the tray bearing structure. Then the traction mechanism pulls out the tray bearing structure, the robot arm falls, and the chip is placed on the tray bearing structure. Finally, the traction mechanism pushes the tray bearing structure back into the tray bin.

[0043] In this embodiment, for the sake of reasonable design, the specific structure of the tray bearing structure is as follows: the tray bearing structure includes a tray bracket C7, a tray bearing groove C8 is provided in the middle of the tray bracket, a tray is installed in the tray bearing groove, and running wheels C10 are rotatably connected to the four corners of the tray bracket, and the sliding of the tray bracket is achieved by the running wheels.

[0044] In the present embodiment, in order to realize the tray bin accommodating the tray bearing groove, the tray bin is slidably connected to an open side on the vertical support plate, and a plurality of guide rail mechanisms for guiding the tray bearing structure are arranged from top to bottom in the tray bin, and the guide rail mechanism includes a guide rail groove C11 symmetrically arranged on the left and right, and the corresponding accommodating grooves on the left and right at the same horizontal height constitute an accommodating groove C12 for accommodating the tray bearing structure, that is, the tray bearing structure slides into the tray bin from the open side of the tray bin, and the tray bin is raised or lowered according to the defective products transmitted from different inspection processes, so that the required tray bearing structure is aligned with the tray channel, and the walking wheel is rollingly connected to the guide rail groove on the same side, and each guide rail groove can be connected to the tray channel.

[0045] In this embodiment, in order to realize the lifting and lowering of the material tray bin, a lifting mechanism for driving the lifting of the material tray bin is installed on the side of the vertical support plate away from the material tray bin. The lifting mechanism is located below the material tray channel and does not cause interference. The lifting mechanism includes vertical guide rails C13 symmetrically arranged on the left and right, and a lifting trolley C14 is slidably connected between the two guide rails. A horizontal lifting push plate C15 is installed on the lifting trolley. An avoidance opening C16 for the lifting push plate to pass through is provided on the vertical support plate. The lifting push plate extends through the avoidance opening, and the protruding end is fixedly connected to the bottom of the material tray bin. The lifting and lowering of the lifting trolley drives the lifting and lowering of the lifting push plate, thereby realizing the lifting and lowering of the material tray bin.

[0046] In the present embodiment, a lifting conveyor belt mechanism for driving the lifting trolley to lift is arranged between the vertical guide rails on the side of the vertical support plate away from the material tray bin, and the lifting conveyor belt mechanism includes vertical material tray bin driving pulleys C17 correspondingly arranged above and below, the material tray bin driving pulley is rotatably connected to the vertical support plate, and a material tray bin driving transmission belt C18 is commonly sleeved on the two material tray bin driving pulleys, and the lifting trolley is fixed on the material tray bin driving transmission belt, that is, part of the belt body of the material tray bin driving transmission belt is fixedly connected to the lifting trolley, and the specific connection method can be an existing fixed connection method such as screw connection and clamping. An avoidance notch is arranged on the lifting push plate corresponding to the material tray bin driving transmission belt to avoid interference, and a material tray bin lifting motor C19 for driving one of the material tray bin driving pulleys to move is installed on the vertical support plate. When in use, the lifting trolley is lifted and lowered through the forward and reverse rotation of the material tray bin lifting motor, which drives the lifting and lowering of the lifting push plate, thereby realizing the lifting and lowering of the material tray bin.

[0047] In this embodiment, in order to realize the sliding connection of the feed tray bearing structure on the feed tray moving platform, the feed tray moving platform includes a horizontal platform plate C20, and the left and right sides of the horizontal platform plate are symmetrically installed with limiting slide rails C21 that cooperate with the walking wheels. The left and right two limiting slide rails constitute a conveying channel C22 for the sliding movement of the feed tray bearing structure, and the conveying channel is connected to the feed tray channel.

[0048] In this embodiment, in order to realize the sliding of the traction mechanism, horizontal guide rails C23 parallel to the limiting slide rails are symmetrically installed on the left and right sides of the bottom of the horizontal platform, and a horizontal slide plate C24 is slidably connected between the two horizontal guide rails. The traction mechanism is installed in the middle of the horizontal slide plate. A traction mechanism avoidance opening C25 is opened in the middle of the horizontal platform between the two limiting slide rails along the sliding direction of the tray bearing structure for the traction mechanism to pass through from bottom to top. The sliding of the traction mechanism is driven by the sliding of the horizontal slide plate.

[0049] In this embodiment, in order to realize the connection between the traction mechanism and the tray bracket, the traction mechanism includes a vertical cylinder C26, which is fixed on the horizontal slide. The vertical cylinder extends upward from the traction mechanism avoidance port, and the telescopic end of the vertical cylinder is upward. A fixed arm C27 is installed on the telescopic end of the vertical cylinder, and a downward latch C28 is provided on the end of the fixed arm. A socket C29 is provided on the tray bracket corresponding to the latch. When in use, the traction mechanism approaches the tray channel driven by the horizontal slide, and the end of the fixed arm extends into the tray bin through the tray channel. At this time, the latch is located above the socket, the movable end of the vertical cylinder descends, the latch is engaged with the socket, and the traction mechanism slides out, driving the tray bearing structure to leave the tray bin.

[0050] In this embodiment, in order to realize the connection between the telescopic end of the vertical cylinder and the fixed arm, an L-shaped bracket C30 is installed on the telescopic end of the vertical cylinder, the horizontal part of the L-shaped bracket is on the top and the vertical part is on the bottom, the horizontal part of the L-shaped bracket is fixed on the telescopic end of the vertical cylinder, and the vertical part of the L-shaped bracket is slidably connected to the side of the vertical cylinder. The fixed arm includes a cantilever C31, one end of the cantilever is fixedly connected to the connecting block C32, and a downward pin is provided on the other end, and the connecting block is fixed to the side of the vertical part of the L-shaped bracket.

[0051] In this embodiment, in order to realize the movement of the driving traction mechanism, a sliding conveyor belt mechanism for driving the horizontal slide plate to slide is arranged between two horizontal guide rails on the lower surface of the horizontal platform. The sliding conveyor belt mechanism includes a traction mechanism driving pulley C33 correspondingly arranged in the front and rear. The traction mechanism driving pulley is rotatably connected to the lower surface of the horizontal platform. A traction mechanism driving transmission belt C34 is commonly sleeved on the two traction mechanism driving pulleys. The horizontal slide plate is fixed on the traction mechanism driving transmission belt, that is, part of the belt body of the traction mechanism driving conveyor belt is fixedly connected to the horizontal slide plate. The specific connection method can be an existing fixed connection method such as screw connection and clamping connection. The traction mechanism is located in the middle of the traction mechanism driving transmission belt. A traction mechanism driving motor C35 for driving one of the traction mechanism driving pulleys to move is installed on the horizontal platform. When in use, the horizontal slide plate is driven to slide by the forward and reverse rotation of the traction mechanism driving motor, thereby realizing the movement of the driving traction mechanism.

[0052] In this embodiment, an NG material receiving guide rail may be provided beside the chip conveying guide rail, and an existing chip clamp is slidably connected to the NG material receiving guide rail to facilitate the clamping of defective products, and the NG material receiving guide rail is provided corresponding to the input end of the closing mechanism.

[0053] A method for using a multifunctional test appearance detection and sorting device for integrated circuit chip modules: Step S1: The preheating module opens the inlet and outlet through the opening and closing mechanism, and the transfer arm on the preheating module delivers the chip from the previous process into the heating box. Then the transfer arm returns and closes the inlet and outlet through the opening and closing mechanism, and the heating box heats the chip. Step S2: After the chip is heated in the heating box for a set time, the opening and closing mechanism opens the inlet and outlet, the transfer arm on the preheating module moves the chip out, the opening and closing mechanism closes the inlet and outlet, the transfer arm puts the chip into the cache station between the preheating module and the high-temperature test area, the transfer arm on the preheating module is reset, and then the transfer arm on the high-temperature test area takes the chip out of the cache station and puts it into the high-temperature test station on the high-temperature test area for testing; Step S3: After the chip is tested in the high-temperature test area, the transfer arm on the cooling module takes the qualified chip out of the high-temperature test area and sends it to the chip cooling placement slot on the cooling tray, and the chip cooling device next to the cooling tray cools the chip; Step S4: After the chip has cooled for a predetermined time, the transfer arm on the cooling module takes the heat-dissipated chip out of the chip cooling tank and sends it to the normal temperature test station on the normal temperature test area for testing. After the test is completed, the qualified chip is sent to the appearance inspection module via the transfer arm on the normal temperature test area; Step S5: Send the appearance inspection module to the first chip placement slot of the material receiving device, push the material receiving device to slide by the pushing mechanism, so that the chip enters the testing mechanism, completes the test of the corresponding station, and then pushes the material receiving device to slide and reset by the pushing mechanism, and then the shifting mechanism moves the chip on the material receiving device according to the process, wherein the chip of the last process is moved out of the material receiving device and sent to the next output buffer station, and at the same time, the first test station on the material receiving device is vacated, and the chip that has passed the test at the normal temperature test station is placed in the first test station via the transfer arm; Step S6: The chip on the output buffer station is sent out by an external robot arm to complete the test.

[0054] Unless otherwise stated, any technical solution disclosed in the present invention disclosed above, if it discloses a numerical range, then the disclosed numerical range is a preferred numerical range, and any technician in the field should understand that the preferred numerical range is only a numerical value with a more obvious technical effect or representative value among many implementable numerical values. Since there are too many numerical values ​​to be exhaustive, the present invention discloses some numerical values ​​to illustrate the technical solution of the present invention, and the numerical values ​​listed above should not constitute a limitation on the scope of protection of the present invention.

[0055] If the words "first", "second" and so on are used in this article to limit components, those skilled in the art should know that the use of "first" and "second" is only for the convenience of description to distinguish the components. Unless otherwise stated, the above words have no special meaning.

[0056] If the present invention discloses or involves components or structures that are fixedly connected to each other, then, unless otherwise stated, the fixed connection can be understood as: a detachable fixed connection (for example, connection using bolts or screws), and can also be understood as: a non-detachable fixed connection (for example, riveting, welding). Of course, the mutual fixed connection can also be replaced by an integrated structure (for example, manufactured by integrated molding using a casting process) (except when it is obviously impossible to use an integrated molding process).

[0057] In addition, the orientations or positional relationships indicated by terms such as "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", and "outside" used in any of the technical solutions disclosed in the above-mentioned invention are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this patent, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this patent. Unless otherwise stated, the terms used to indicate shapes used in any of the technical solutions disclosed in the above-mentioned invention include shapes that are approximate, similar, or close to them.

[0058] Any component provided by the present invention may be assembled from a plurality of separate components, or may be a separate component manufactured by an integral forming process.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the specific implementation methods of the present invention can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the present invention, which should be included in the scope of the technical solution for protection of the present invention.

Claims

1. A multifunctional test appearance inspection and sorting device for integrated circuit chip modules, characterized in that: It includes a preheating module, a high-normal temperature test module, and an appearance inspection module which are arranged in sequence along the conveying direction of the chip inspection process. A cooling module is arranged in the middle of the high-normal temperature test module. The cooling module separates the high-normal temperature test module into a high-temperature test area and a normal temperature test area along the conveying direction of the chip inspection process. A chip conveying device is mounted above the preheating module, the high-normal temperature test module, and the appearance inspection module.

2. The detection and sorting device according to claim 1, characterized in that; The chip conveying device includes a chip conveying rail, which is mounted on a preheating module, a high-normal temperature test module, and an appearance inspection module. A plurality of chip moving mechanisms are slidably connected to the chip conveying rail. The chip moving mechanisms include a sliding guide frame, a transfer arm is slidably connected to the sliding guide frame, and a chip picking and placing device is installed on the lower end of the transfer arm.

3. The detection and sorting device according to claim 2, characterized in that: The chip placement device includes a heat-conducting block, which is fixed on the lower end of the transfer arm. A chip limiting plate is installed under the heat-conducting block. A plurality of suction holes are opened on the lower surface of the heat-conducting block. The other ends of the suction holes pass through the heat-conducting block and are connected to an external suction device. A clearance hole is opened on the chip limiting plate corresponding to the suction hole. A suction nozzle is installed on the lower surface of the heat-conducting block in the end of the suction hole. A limiting bump is set on the lower surface of the chip limiting plate corresponding to the chip. A heating tube is plugged into the heat-conducting block of the chip moving mechanism on the high-temperature test area of ​​the preheating module.

4. The detection and sorting device according to claim 3, characterized in that: The cooling module includes a cooling conveying rail, which is located below the chip conveying rail and perpendicular to the chip conveying rail. A cooling tray is slidably connected to the cooling conveying rail. A plurality of chip cooling placement slots are arranged in an array on the cooling tray. A chip heat dissipation device is arranged next to the cooling tray.

5. The detection and sorting device according to claim 4, characterized in that: The preheating module includes a top plate, a heating box is slidably connected below the top plate, a material receiving tray is arranged in the heating box, a heating device is arranged in the heating box below the material receiving tray, an inlet and outlet are opened on the top plate, the inlet is connected with the heating box, and an opening and closing mechanism for opening and closing the inlet and outlet is arranged on the side of the inlet on the top plate; the top of the heating box is not closed, the top of the heating box is attached to the lower surface of the top plate, and the size of the inlet and outlet is not larger than the opening at the top of the heating box; the opening and closing mechanism includes a sliding cover plate for closing the inlet and outlet, the sliding cover plate is located at the side of the inlet and outlet, the sliding cover plate is divided into a plurality of independently sliding branch cover plates, and a sliding cylinder for driving the branch cover plates to slide is installed on the top plate; The heating device includes a heating plate, the material receiving tray is screwed on the heating plate, a plurality of material receiving grooves are arranged in an array on the material receiving tray, a protective gas delivery structure is arranged between the heating plate and the bottom plate of the heating box, the input end of the protective gas delivery structure extends out of the bottom plate of the heating box and is connected to an external protective gas source through a pipeline; the protective gas delivery structure includes a fixed bottom plate, a flow channel plate is installed on the fixed bottom plate, an air inlet is provided in the middle of the flow channel plate, a gas flow channel connected to the air inlet is provided on the upper plate surface of the flow channel plate, a plurality of air supply holes connected to the gas flow channel are provided on the heating plate, and a plurality of air outlet holes corresponding to the air supply holes are provided on the material receiving tray; an air inlet joint connected to the air inlet is provided on the bottom plate surface of the flow channel plate, the air inlet joint passes through the fixed bottom plate and the bottom plate of the heating box and extends out and is connected to an external protective gas source through a pipeline.

6. The detection and sorting device according to claim 5, characterized in that: The preheating module also includes a mounting frame, the top plate frame is fixed on the mounting frame, and a heating box slide rail is symmetrically installed in the mounting frame, and a heating box slide groove cooperating with the heating box slide rail is installed on the bottom of the heating box, and a heating box driving mechanism for driving the heating box to slide is installed on the mounting frame; the heating box driving mechanism includes horizontal driving pulleys symmetrically arranged front and back, and a driving conveyor belt is jointly sleeved on the two horizontal driving pulleys, and a clamping plate assembly is installed at the bottom of the heating box corresponding to the driving conveyor belt, and the driving clamping plate assembly includes a fixed block and a movable block, the fixed block is screwed to the sliding block, and the driving conveyor belt is clamped between the fixed block and the movable block, and a motor for driving one of the horizontal driving pulleys to rotate is installed on the mounting frame; an L-shaped connecting plate is installed on one side of the branch cover plate corresponding to the sliding cylinder, the vertical part of the L-shaped connecting plate is at the bottom, and the horizontal part is at the top, the vertical part is fixed on the branch cover plate, and the horizontal part is connected to the movable end of the sliding cylinder.

7. The detection and sorting device according to claim 6, characterized in that: The appearance inspection module includes a test mechanism, a material receiving device is arranged beside the test mechanism, a pushing mechanism for driving the material receiving device to slide is installed at the lower part of the material receiving device, and a shifting mechanism is arranged above the material receiving device; the material receiving device includes a sliding tray, a plurality of chip placement seats are arranged at intervals on a side of the sliding tray close to the test mechanism, and a chip placement groove for placing chips is arranged on the chip placement seat; the chip placement seat is L-shaped, the vertical part of the chip placement seat is at the bottom and the horizontal part is at the top, the vertical part of the chip placement seat is fixed on the edge of the sliding tray, the end of the horizontal part of the chip placement seat faces the test mechanism, and the chip placement groove is arranged on the end of the horizontal part of the chip placement seat; The pushing mechanism comprises a pushing frame, a pushing slide rail arranged toward the testing mechanism is installed on the pushing frame, a pushing slider cooperating with the pushing slide rail is installed under the sliding tray, and a driving mechanism for driving the sliding tray to slide is installed on the pushing frame; the driving mechanism comprises horizontal pulleys symmetrically installed at both ends of the pushing slide rail, the two horizontal pulleys are jointly sleeved in a conveyor belt, the pushing slide rail is located in the area surrounded by the conveyor belt, the sliding tray is fixed on the conveyor belt, and a pushing motor for driving one of its horizontal pulleys to rotate is installed on the pushing frame; a clamping plate mechanism is installed under the sliding tray, and the clamping plate mechanism comprises an L-shaped fixed plate and a movable plate, the horizontal part of the L-shaped fixed plate is on the top, and the vertical part is on the bottom, the horizontal part of the L-shaped fixed plate is fixed on the sliding tray, the movable plate is screwed on the vertical part of the L-shaped fixed plate, and the conveyor belt is clamped between the vertical part of the L-shaped fixed plate and the movable plate.

8. The detection and sorting device according to claim 7, characterized in that; The cam is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, each of which is provided with a plurality of cantilevers, 9. The detection and sorting device according to claim 8, characterized in that: The lifting of the lifting mechanism is a kind of by-product.

10. A method for using a multifunctional appearance inspection and sorting device for testing integrated circuit chip modules, using the inspection and sorting device as claimed in claim 9, characterized in that: Step S1: The preheating module opens the inlet and outlet through the opening and closing mechanism, and the transfer arm on the preheating module delivers the chip from the previous process into the heating box. Then the transfer arm returns and closes the inlet and outlet through the opening and closing mechanism, and the heating box heats the chip. Step S2: After the chip is heated in the heating box for a set time, the opening and closing mechanism opens the inlet and outlet, the transfer arm on the preheating module moves the chip out, the opening and closing mechanism closes the inlet and outlet, the transfer arm puts the chip into the cache station between the preheating module and the high-temperature test area, the transfer arm on the preheating module is reset, and then the transfer arm on the high-temperature test area takes the chip out of the cache station and puts it into the high-temperature test station on the high-temperature test area for testing; Step S3: After the chip is tested in the high-temperature test area, the transfer arm on the cooling module takes the qualified chip out of the high-temperature test area and sends it to the chip cooling placement slot on the cooling tray, and the chip cooling device next to the cooling tray cools the chip; Step S4: After the chip has cooled for a predetermined time, the transfer arm on the cooling module takes the heat-dissipated chip out of the chip cooling tank and sends it to the normal temperature test station on the normal temperature test area for testing. After the test is completed, the qualified chip is sent to the appearance inspection module via the transfer arm on the normal temperature test area; Step S5: Send the appearance inspection module to the first chip placement slot of the material receiving device, push the material receiving device to slide by the pushing mechanism, so that the chip enters the testing mechanism, completes the test of the corresponding station, and then pushes the material receiving device to slide and reset by the pushing mechanism, and then the shifting mechanism moves the chip on the material receiving device according to the process, wherein the chip of the last process is moved out of the material receiving device and sent to the next output buffer station, and at the same time, the first test station on the material receiving device is vacated, and the chip that has passed the test at the normal temperature test station is placed in the first test station via the transfer arm; Step S6: The chip on the output buffer station is sent out by an external robot arm to complete the test.

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