Infrared light source module capable of emitting light from two sides

The double-sided infrared light source module addresses the low power issue of quantum cascade lasers by employing a cross-shaped heat sink design with reflectors and collimating mirrors, enhancing output power and optical symmetry for improved detection and countermeasures.

CN119196565APending Publication Date: 2024-12-27宁夏长鼎夜视新技术开发有限公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202411519824.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-29
Publication Date
2024-12-27

AI Technical Summary

Technical Problem

Medium-wave infrared quantum cascade semiconductor lasers have limited output power, restricting their effectiveness in countermeasures and detection at longer distances.

Method used

A double-sided luminous infrared light source module with a cross-shaped arrangement of module bodies on a heat sink, incorporating a heat-conducting base, reflectors, and collimating mirrors to enhance power and direct light output vertically, using a heat sink and thermal conductive materials to manage heat and improve optical path symmetry.

Benefits of technology

The module significantly increases output power, achieving symmetrical and efficient light distribution, facilitating enhanced optical shaping and countermeasure capabilities.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119196565A_ABST
    Figure CN119196565A_ABST
Patent Text Reader

Abstract

The invention relates to an infrared light source module capable of emitting light from two sides, and belongs to the technical field of laser optical shaping, the infrared light source module comprises a heat dissipation plate, five module bodies arranged in a cross shape are arranged on the upper surface of the heat dissipation plate, each module body comprises a tube shell fixed on the upper surface of the heat dissipation plate, and a heat conduction base is arranged on the upper surface of an inner cavity of each tube shell. According to the infrared light source module capable of emitting light from the two sides, the heat conduction base is placed in the tube shell, the bolts are inserted into the mounting holes through the through holes and screwed tightly, the heat conduction base is fixed, the laser chip is welded to the transition heat sink, the transition heat sink with the laser chip is welded to the heat conduction base, the laser chip is powered up, and the laser chip is welded to the heat conduction base. The reflectors are respectively adhered to the lower surface of the inner cavity of the tube shell near the light emitting surface, so that the light emitted by the laser chip is output perpendicular to the bottom surface of the tube shell, the laser chip is powered up, and the vertically output laser is collimated by the collimating mirror, so that the light path is simple, the assembly is convenient, the output light path is equal, and the later optical shaping is facilitated.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the technical field of laser optical shaping, in particular to a double-sided luminous infrared light source module. Background Art

[0002] Infrared light source is a non-illumination electric light source whose main purpose is to produce infrared radiation. It has a wide range of uses and is often used in analytical instruments, heating, physical therapy, night vision, communications, navigation, plant cultivation, and livestock breeding.

[0003] Medium-wave infrared quantum cascade semiconductor lasers are widely used in the detection of special gases and laser countermeasures. However, due to the small output power of a single chip, it limits the countermeasures and detection at longer distances. It is necessary to increase the overall power through optical means. Therefore, a double-sided infrared light source module is proposed to solve the above problem. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a double-sided luminous infrared light source module, which has the advantages of high output power, etc., and solves the problem of low output power of the existing infrared light source module.

[0005] To achieve the above object, the present invention provides the following technical solution: a double-sided luminous infrared light source module, comprising a heat sink, the upper surface of which is provided with five module bodies arranged in a cross shape;

[0006] The module body includes a tube shell fixed on the upper surface of the heat dissipation plate, a heat conductive base is provided on the upper surface of the inner cavity of the tube shell, a transition heat sink is fixed on the upper surface of the heat conductive base, a laser chip is fixed on the upper surface of the transition heat sink, reflectors are fixed on the left and right sides of the lower surface of the inner cavity of the tube shell, a sealing window sheet is fixed on the upper surface of the inner cavity of the tube shell, two collimating mirrors are fixed on the upper surface of the sealing window sheet, and two mounting holes are provided on the lower surface of the inner cavity of the tube shell, and bolts are connected to the internal threads of the mounting holes.

[0007] Furthermore, the upper surface of the heat-conducting base is provided with two through holes, and the bolts are slidably connected to the inside of the through holes.

[0008] Furthermore, the bolt is T-shaped, and the bolt abuts against the heat-conducting base.

[0009] Furthermore, the reflector is triangular in shape, and the inclined surfaces of the two reflectors correspond to each other.

[0010] Furthermore, the positive electrode and the negative electrode of the laser chip are respectively welded to two pins of the tube shell, and the thermal conductive base is diamond.

[0011] Furthermore, thermally conductive silicone grease is filled between the tube shell and the thermally conductive base.

[0012] Furthermore, the upper surface of the heat dissipation plate is provided with six module bodies arranged in two rows and three columns.

[0013] Furthermore, four connecting frames and four mounting columns are fixed on the upper surface of the heat sink, a fixing frame is fixed on the upper surface of the four mounting columns, a focusing mirror is fixed inside the fixing frame, and a module body is fixed on the upper surface of the heat sink and the side opposite to the four connecting frames.

[0014] Furthermore, the fixing frame is annular and the heat sink is octagonal.

[0015] Furthermore, the connecting frame is T-shaped, and the heights of the four module bodies are higher than the height of the middle module body.

[0016] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0017] The double-sided infrared light source module places a heat-conducting base into the interior of a tube shell, inserts bolts through through holes into mounting holes and tightens the bolts, fixes the heat-conducting base, welds a laser chip on a transition heat sink, welds a transition heat sink with a laser chip to the heat-conducting base, powers up the laser chip, and sticks reflectors on the lower surface of the tube shell cavity near the light-emitting surface, so that the light emitted by the laser chip is output vertically from the bottom surface of the tube shell, powers up the laser chip, and uses a collimator to collimate the vertically output laser. Not only is the optical path simple and the assembly is convenient, but the output light has an equal optical path, which is beneficial to later optical shaping. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the present invention;

[0019] Figure 2 is a schematic structural diagram of a second embodiment of the present invention;

[0020] Figure 3 is a schematic structural diagram of a third embodiment of the present invention;

[0021] Figure 4 It is a schematic diagram of the explosion structure of the third embodiment of the present invention;

[0022] Figure 5 It is a structural schematic diagram of the module body of the present invention;

[0023] Figure 6 It is a schematic diagram of the explosion structure of the module body of the present invention.

[0024] In the figure: 1 heat sink, 2 connecting frame, 3 module body, 301 tube shell, 302 thermal conductive base, 303 transition heat sink, 304 laser chip, 305 reflector, 306 sealing window piece, 307 collimator, 308 bolt, 309 mounting hole, 4 mounting column, 5 fixing frame, 6 converging mirror. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] Embodiment 1:

[0027] See also Figure 1 In this embodiment, a double-sided infrared light source module includes a heat sink 1, and the upper surface of the heat sink 1 is provided with five module bodies 3 arranged in a cross shape, and the heat sink 1 is used to dissipate heat from the module bodies 3.

[0028] It can be understood that the five module bodies 3 are uniformly mounted on a large heat sink 1 to form 10 optical outputs, the overall output power is increased by 5 times, and the output is symmetrically distributed about the central module axis.

[0029] See also Figures 5 to 6 In order to improve the power, the module body 3 in this embodiment includes a tube shell 301 fixed to the upper surface of the heat sink 1. The tube shell 301 is made of copper and is machined. It is provided with two pins for leading out the laser electrode. The upper surface of the inner cavity of the tube shell 301 is provided with a heat-conducting base 302. A transition heat sink 303 is fixed on the upper surface of the heat-conducting base 302. A laser chip 304 is fixed on the upper surface of the transition heat sink 303. The heat-conducting base 302 is used to conduct the heat emitted by the laser chip 304 to the tube shell 301 to improve the heat dissipation effect. Reflectors 305 are fixed on both sides of the lower surface of the inner cavity of the tube shell 301. The reflectors 305 are triangular in shape. The inclined surfaces of the reflectors 305 correspond to each other, and are used to reflect the light emitted by the laser chip 304. A sealing window piece 306 is fixed on the upper surface of the inner cavity of the tube shell 301, and is used to seal the laser chip 304 in the tube shell 301 to reduce the influence of active gases such as water vapor and oxygen on the life of the laser chip 304. Two collimating lenses 307 are fixed on the upper surface of the sealing window piece 306, and the sealing window piece 306 is used as a fixed supporting component for the collimating lenses 307. Two mounting holes 309 are provided on the lower surface of the inner cavity of the tube shell 301, and bolts 308 are connected to the internal threads of the mounting holes 309, and the thermal conductive base 302 is installed and fixed by the bolts 308.

[0030] Among them, two through holes are opened on the upper surface of the thermal conductive base 302, and the bolts 308 are slidably connected to the inside of the through holes. The bolts 308 are T-shaped and abut against the thermal conductive base 302. The thermal conductive base 302 is installed and fixed by the bolts 308 to improve the stability of the thermal conductive base 302.

[0031] In addition, the positive and negative electrodes of the laser chip 304 are respectively welded to the two pins of the tube shell 301, which is convenient for powering the laser chip 304. Thermal grease is filled between the tube shell 301 and the thermal base 302 to improve the heat transfer effect between the tube shell 301 and the thermal base 302, and the heat of the thermal base 302 is better transferred to the tube shell 301 through the thermal grease.

[0032] It can be understood that the thermal conductive base 302 is used to conduct the heat emitted by the laser chip 304 to the tube shell 301, and to raise the light-emitting height of the laser chip 304, so that the 45° reflector 305 can completely receive the light emitted by the laser chip 304 and reflect it 90° to make it output perpendicular to the bottom of the tube shell 301, so that the two beams of light that originally had an output direction difference of 180° are rotated 90° towards each other and become co-directional propagation. After passing through the reflector 305, the original light output direction is changed to be perpendicular to the paper surface and transmitted away from the thermal conductive substrate.

[0033] It should be noted that the thermal conductive base 302 is diamond, and the thermal conductivity of this material should be greater than 1800 W / m·k. The diamond is first ground to the required thickness, which is 0.3 mm in this example, and cut into small pieces of 3x8 mm. Then, Ti: 200 nm, Pt: 200 nm, Au: 600 nm are evaporated on both the upper and lower surfaces, and annealed to strengthen the bonding strength of the metallization.

[0034] The module body 3 in this embodiment, puts the thermal conductive base 302 into the interior of the tube shell 301, inserts the bolt 308 into the mounting hole 309 through the through hole and tightens it, fixes the thermal conductive base 302, welds the laser chip 304 on the transition heat sink 303, welds the transition heat sink 303 with the laser chip 304 to the thermal conductive base 302, powers up the laser chip 304, and sticks the reflector 305 on the lower surface of the inner cavity of the tube shell 301 near the light emitting surface, so that the light emitted by the laser chip 304 is output vertically from the bottom surface of the tube shell 301, powers up the laser chip 304, and uses the collimator 307 to collimate the vertically output laser.

[0035] Embodiment 2:

[0036] See also Figure 2 In this embodiment, the upper surface of the heat sink 1 is provided with six module bodies 3 arranged in two rows and three columns, forming 12 optical outputs, and the overall output power is increased by 6 times.

[0037] Embodiment three:

[0038] See also Figures 3 to 4 In this embodiment, four connecting frames 2 and four mounting columns 4 are fixed on the upper surface of the heat sink 1, a fixing frame 5 is fixed on the upper surface of the four mounting columns 4, a focusing mirror 6 is fixed inside the fixing frame 5, and a module body 3 is fixed on the upper surface of the heat sink 1 and the side opposite to the four connecting frames 2.

[0039] The fixing frame 5 is annular, which is convenient for installing the focusing mirror 6 , the heat sink 1 is octagonal, the connecting frame 2 is T-shaped, and the heights of the four module bodies 3 are higher than the height of the middle module body 3 .

[0040] It can be understood that one of the five module bodies 3 is first installed on the upper surface of the heat sink 1, and then four connecting frames 2 are installed around it. The module bodies 3 are respectively fixed on one side of the four connecting frames 2 close to the middle module body 3. The four module bodies 3 are placed at 90° to the first module body 3. In front of the output light of the four module bodies 3, a 45° reflector 305 is placed to make the output light parallel to the output light of the first module body 3. The front and rear positions of each 45° reflector 305 can be adjusted to make the output light closely arranged.

[0041] The working principle of the above embodiment is:

[0042] The bottom of the heat-conducting base 302 is coated with thermal grease, and then the heat-conducting base 302 is placed inside the tube shell 301. The heat-conducting base 302 and the tube shell 301 are closely contacted by the thermal grease. The bolt 308 is inserted into the mounting hole 309 through the through hole, and the bolt 308 is tightened to fix the heat-conducting base 302. The laser chip 304 is soldered to the transition heat sink 303 with indium solder. The transition heat sink 303 with the laser chip 304 is soldered to the heat-conducting base 302 with low-temperature solder. The positive and negative electrodes of the laser chip 304 are led out by a gold wire bonding machine. The electrode is welded to the pin of the tube shell 301, the laser chip 304 is powered on, and the reflector 305 is respectively glued to the lower surface of the inner cavity of the tube shell 301 near the light-emitting surface, so that the light emitted by the laser chip 304 is output vertically from the bottom surface of the tube shell 301, and the reflector 305 is preliminarily fixed with UV glue, and then reinforced with AB glue. In the nitrogen box, the sealing window piece 306 is bonded and fixed to the tube shell 301 with sealant, and the laser chip 304 is powered on. The vertically output laser is collimated with a collimator 307, and the collimator 307 is preliminarily fixed to the glass window with UV glue, and then reinforced with AB glue.

[0043] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A double-sided infrared light source module, comprising a heat sink (1), characterized in that: The upper surface of the heat dissipation plate (1) is provided with five module bodies (3) arranged in a cross shape; The module body (3) comprises a tube shell (301) fixed to the upper surface of the heat sink (1); a heat conductive base (302) is provided on the upper surface of the inner cavity of the tube shell (301); a transition heat sink (303) is fixed on the upper surface of the heat conductive base (302); a laser chip (304) is fixed on the upper surface of the transition heat sink (303); reflectors (305) are fixed on both the left and right sides of the lower surface of the inner cavity of the tube shell (301); a sealing window sheet (306) is fixed on the upper surface of the inner cavity of the tube shell (301); two collimating mirrors (307) are fixed on the upper surface of the sealing window sheet (306); and two mounting holes (309) are provided on the lower surface of the inner cavity of the tube shell (301); bolts (308) are connected to the internal threads of the mounting holes (309).

2. The double-sided infrared light source module according to claim 1, characterized in that: The upper surface of the heat-conducting base (302) is provided with two through holes, and the bolts (308) are slidably connected inside the through holes.

3. The double-sided infrared light source module according to claim 1, characterized in that: The bolt (308) is T-shaped, and the bolt (308) abuts against the heat-conducting base (302).

4. The double-sided infrared light source module according to claim 1, characterized in that: The reflector (305) is triangular in shape, and the inclined surfaces of the two reflectors (305) correspond to each other.

5. The double-sided infrared light source module according to claim 1, characterized in that: The positive electrode and the negative electrode of the laser chip (304) are respectively welded to two pins of the tube shell (301), and the heat conductive base (302) is diamond.

6. The double-sided infrared light source module according to claim 1, characterized in that: Thermally conductive silicone grease is filled between the tube shell (301) and the thermally conductive base (302).

7. The double-sided infrared light source module according to claim 1, characterized in that: The upper surface of the heat dissipation plate (1) is provided with six module bodies (3) arranged in two rows and three columns.

8. The double-sided infrared light source module according to claim 1, characterized in that: Four connecting frames (2) and four mounting columns (4) are fixed on the upper surface of the heat dissipation plate (1); a fixing frame (5) is fixed on the upper surface of the four mounting columns (4); a focusing mirror (6) is fixed inside the fixing frame (5); and a module body (3) is fixed on the upper surface of the heat dissipation plate (1) and on the side opposite to the four connecting frames (2).

9. The double-sided infrared light source module according to claim 8, characterized in that: The fixing frame (5) is annular in shape, and the heat dissipation plate (1) is octagonal in shape.

10. The double-sided infrared light source module according to claim 8, characterized in that: The connecting frame (2) is T-shaped, and the heights of the four module bodies (3) are higher than the height of the middle module body (3).