LED chip detection device and method and computer equipment

Abstract

The invention provides an LED chip detection device and method and computer equipment. The device comprises a light source, a beam splitter prism, a camera, a reflector, an objective table and processing equipment, the light source, the beam splitter prism and the objective table are sequentially arranged along a first straight line, the camera, the beam splitter prism and the reflector are sequentially arranged along a second straight line, and the camera is electrically connected with the processing equipment; the beam splitter prism is used for splitting a light beam provided by the light source into a first light beam and a second light beam; the reflector is used for reflecting the first light beam and enabling the reflected first light beam to penetrate through the beam splitter prism to reach the camera; the objective table is used for bearing the LED chip, the LED chip is used for reflecting the second light beam, and the reflected second light beam is reflected to the camera through the beam splitter prism; the camera is used for receiving the first light beam and the second light beam and outputting an interferogram image; the processing equipment is used for processing based on the interferogram image to obtain frequency spectrum information; and obtaining surface height data of the LED chip based on the frequency spectrum information.

Description

Technical Field

[0001] The present disclosure relates to the field of detection technology, and in particular to an LED chip detection device and method, and a computer device. Background Art

[0002] A light emitting diode (LED) is a semiconductor light emitting device that can be used in display, lighting and other display fields.

[0003] When manufacturing LED chips, epitaxial layers, current blocking layers, current diffusion layers, metal contact layers, passivation layers, etc. are grown in sequence. When preparing LED chips, in order to improve the yield rate after the LED chips are prepared, the vertical height of the prepared pattern needs to be measured after each film layer is grown.

[0004] In the related art, most of the LED chip surface height measurement devices are contact type (such as probe profilometers), with low detection efficiency. In actual applications, in order to improve efficiency, only a few points are often measured, which cannot well characterize the overall morphology of the chip surface. Defects and abnormalities in the LED production process cannot be discovered in time, which greatly affects the yield of the LED chip after preparation. Summary of the invention

[0005] The present disclosure provides an LED chip detection device and method, and a computer device. The technical solution at least includes the following solutions:

[0006] In a first aspect, an LED chip detection device is provided, the LED chip detection device comprising: a light source, a beam splitter prism, a camera, a reflector, a stage and a processing device;

[0007] The light source, the beam splitter prism and the stage are arranged in sequence along a first straight line, the camera, the beam splitter prism and the reflector are arranged in sequence along a second straight line, and the camera is electrically connected to the processing device;

[0008] The beam splitter prism is used to split the light beam provided by the light source into a first light beam and a second light beam;

[0009] The reflector is used to reflect the first light beam so that the reflected first light beam passes through the beam splitter prism to reach the camera;

[0010] The stage is used to carry an LED chip, and the LED chip is used to reflect the second light beam so that the reflected second light beam is reflected by the beam splitter prism to reach the camera;

[0011] The camera is used to receive the first light beam and the second light beam and output an interference pattern image;

[0012] The processing device is used to obtain spectrum information based on the interference pattern image; and obtain the surface height data of the LED chip based on the spectrum information.

[0013] Optionally, the processing device is used to perform fast Fourier transform on the interference pattern image to obtain a frequency spectrum of the interference pattern image; perform spatial filtering on the frequency spectrum of the interference pattern image to remove the frequency spectra of the zero-order image and the conjugate image to obtain the frequency spectrum information.

[0014] Optionally, the processing device is used to determine the wrapped phase information of the LED chip surface based on the spectrum information; determine the unwrapped phase distribution based on the wrapped phase information and a phase unwrapping algorithm; and determine the LED chip surface height data based on the unwrapped phase distribution.

[0015] Optionally, the processing device is used to perform an inverse Fourier transform on the spectrum information; and use an inverse tangent function to process the spectrum information after the inverse Fourier transform to obtain the wrapped phase information of the surface of the LED chip.

[0016] Optionally, the LED chip detection device further includes: a first displacement platform and a second displacement platform;

[0017] The first displacement platform is connected to the reflector and is used to adjust the position of the reflector;

[0018] The second displacement platform is connected to the stage and is used to adjust the position of the stage.

[0019] Optionally, the LED chip detection device further includes: a first lens group, a second lens group, a third lens group and a fourth lens group;

[0020] The first lens group is located between the light source and the dichroic prism, the second lens group is located between the camera and the dichroic prism, the third lens group is located between the reflector and the dichroic prism, and the fourth lens group is located between the stage and the dichroic prism.

[0021] In a second aspect, a method for detecting an LED chip is also provided. The method is based on the device as described above, and the method comprises:

[0022] Acquire an interference pattern image generated based on the LED chip;

[0023] Processing the interference pattern image to obtain spectrum information;

[0024] Based on the spectrum information, the surface height data of the LED chip is obtained.

[0025] Optionally, the obtaining spectrum information by processing based on the interference pattern image includes:

[0026] Performing a fast Fourier transform on the interference pattern image to obtain a frequency spectrum of the interference pattern image;

[0027] The frequency spectrum of the interference pattern image is spatially filtered to remove the frequency spectrum of the zero-order image and the conjugate image to obtain the frequency spectrum information.

[0028] Optionally, obtaining the surface height data of the LED chip based on the spectrum information includes:

[0029] Determine the wrapping phase information of the surface of the LED chip based on the spectrum information;

[0030] Determining an unwrapped phase distribution based on the wrapped phase information and a phase unwrapping algorithm;

[0031] The LED chip surface height data is determined based on the unwrapped phase distribution.

[0032] In a third aspect, a computer device is provided, comprising: a memory and a processor, wherein at least one computer program is stored in the memory, and the at least one computer program is loaded and executed by the processor, thereby executing the LED chip detection method described in the above embodiment.

[0033] In a fourth aspect, a computer-readable storage medium is further provided, wherein at least one computer program is stored in the computer-readable storage medium, and the at least one computer program is loaded and executed by a processor, thereby executing the LED chip detection method described in the above embodiment.

[0034] In a fifth aspect, a computer program product is provided, comprising a computer program / instruction, wherein when the computer program / instruction is executed by a processor, the method described in the second aspect is implemented.

[0035] The beneficial effects brought by the technical solution provided by the embodiments of the present disclosure include at least:

[0036] In the disclosed embodiment, two beams of light are separated by a beam splitter prism, one beam is reflected by a reflector, and the other beam is reflected by an LED chip, and then they intersect at the camera to form an interference pattern image. The processing device processes the interference pattern image to obtain spectrum information, and further analyzes the spectrum information to obtain the surface height data of the LED chip. Therefore, by using the LED chip detection device, each layer of the film system in the production and manufacturing process of the LED chip can be detected, the longitudinal height of the entire surface can be determined, the error between the design structure and the actual operation in the preparation process of each layer of the film system can be analyzed and measured, and the thickness abnormality of each film system in the LED production and preparation can be discovered in time to improve the yield of LED production and preparation. In addition, the device adopts non-contact measurement, which can greatly reduce the adverse effects of the contact between the probe profilometer and the LED chip on the chip, improve the yield of LED production and preparation, and can effectively reduce the use of the probe profilometer, save the time used for measuring the thickness of the LED chip, and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0038] Figure 1 is a structural schematic diagram of an LED chip detection device provided by an embodiment of the present disclosure;

[0039] Figure 2 is a structural schematic diagram of another LED chip detection device provided by an embodiment of the present disclosure;

[0040] Figure 3 is a flow chart of an LED chip detection method provided by an embodiment of the present disclosure;

[0041] Figure 4 is a flow chart of another LED chip detection method provided by an embodiment of the present disclosure;

[0042] Figure 5 is a schematic diagram of the detection results provided by the embodiment of the present disclosure;

[0043] Figure 6 It is a schematic diagram of the structure of a computer device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0044] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0045] Figure 1Schematic diagram of the structure of an LED chip detection device provided by an embodiment of the present disclosure. Figure 1 The LED chip detection device includes: a light source 101, a beam splitter prism 102, a camera 103, a reflector 104, a stage 105 and a processing device 106.

[0046] The light source 101, the beam splitter prism 102 and the stage 105 are arranged in sequence along a first straight line, the camera 103, the beam splitter prism 102 and the reflector 104 are arranged in sequence along a second straight line, and the camera 103 and the processing device 106 are electrically connected;

[0047] The beam splitter prism 102 is used to split the light beam provided by the light source 101 into a first light beam and a second light beam;

[0048] The reflector 104 is used to reflect the first light beam so that the reflected first light beam passes through the beam splitter prism 102 and reaches the camera 103;

[0049] The stage 105 is used to carry an LED chip, and the LED chip is used to reflect the second light beam, so that the reflected second light beam is reflected by the beam splitter prism 102 and reaches the camera 103;

[0050] The camera 103 is used to receive the first light beam and the second light beam and output an interference pattern image;

[0051] The processing device 106 is used to obtain spectrum information based on the interference pattern image; and obtain the surface height data of the LED chip based on the spectrum information.

[0052] In the disclosed embodiment, two beams of light are separated by a beam splitter prism, one beam is reflected by a reflector, and the other beam is reflected by an LED chip, and then they intersect at the camera to form an interference pattern image. The processing device processes the interference pattern image to obtain spectrum information, and further analyzes the spectrum information to obtain the surface height data of the LED chip. Therefore, by using the LED chip detection device, each layer of the film system in the production and manufacturing process of the LED chip can be detected, the longitudinal height of the entire surface can be determined, the error between the design structure and the actual operation in the preparation process of each layer of the film system can be analyzed and measured, and the thickness abnormality of each film system in the LED production and preparation can be discovered in time to improve the yield of LED production and preparation. In addition, the device adopts non-contact measurement, which can greatly reduce the adverse effects of the contact between the probe profilometer and the LED chip on the chip, improve the yield of LED production and preparation, and can effectively reduce the use of the probe profilometer, save the time used for measuring the thickness of the LED chip, and improve production efficiency.

[0053] In addition, the image processing method in the solution provided by the present invention only needs to take one image and then solve it through Fourier transform. Compared with the four-step phase shift method, which requires taking four images and then calculating, the processing speed is faster and the cost of expensive piezoelectric ceramics (the hardware corresponding to the four-step phase shift method) is saved, which is more economical and efficient.

[0054] In the embodiment of the present disclosure, the processing device 106 is used to perform fast Fourier transform on the interference pattern image to obtain a frequency spectrum of the interference pattern image; perform spatial filtering on the frequency spectrum of the interference pattern image to remove the frequency spectrum of the zero-order image and the conjugate image to obtain the frequency spectrum information.

[0055] In this implementation, the spectrum image after Fourier transformation of the interference pattern image includes +1 level, 0 level and -1 level. Spatial filtering is used to separate +1 level, 0 level and -1 level as much as possible, and remove 0 level and -1 level to reduce noise interference. That is, spatial filtering can remove noise in the spectrum information, improve the quality of the spectrum map, and make the final spectrum map better reflect the surface height data of the LED chip.

[0056] Exemplarily, the interference pattern image is subjected to fast Fourier transform, and the obtained spectrum diagram can be expressed as follows:

[0057] FT{I}=A(f x ,f y )+C(f x -f0,f y )+C * (f x +f0,f y )

[0058] Among them, (f x ,f y ) represents the coordinate system in the Fourier domain, A is the DC term, C and C* represent the spectrum information of the real image c(x, y) and the conjugate image c*(x, y) after Fourier transformation, respectively. FT is the abbreviation of Fourier transform, I represents the original interference pattern image, f0 represents the origin of the coordinate reference, and (x, y) is the coordinate of the pixel point in the image.

[0059] Exemplarily, the processing device 106 is used to match the spectrum diagram +1-order spectrum according to the spatial filtering algorithm, and perform filtering to obtain a spectrum with the zero-order image and the conjugate image removed.

[0060] In this implementation, the +1 level spectrum contains the information of the sample being tested, and levels 0 and -1 are interference phases. Therefore, the +1 level spectrum is matched and other interferences are filtered out, so that only the +1 level spectrum is retained.

[0061] In the embodiment of the present disclosure, the processing device 106 is used to determine the wrapped phase information of the LED chip surface based on the spectrum information; determine the unwrapped phase distribution based on the wrapped phase information and the phase unwrapping algorithm; and determine the LED chip surface height data based on the unwrapped phase distribution.

[0062] Among them, the phase information in the spectrum information will have a deviation of an integer multiple of 2pi, which is also called the wrapped phase. On this basis, the phase obtained by adding or subtracting integer multiples of 2pi is the unwrapped phase, and the unwrapped phase can reflect the height of the actual object.

[0063] Since the phase information of the measured object is obtained by reproducing the complex amplitude of the light wave, that is, by applying the inverse tangent function to the ratio of the real part and the imaginary part of the complex amplitude, the inverse tangent function is a periodic function and has a limited range, so the obtained phase value is limited to (-π,π]. We call the phase information obtained at this time the wrapped phase. However, the phase diagram that can be used to characterize the three-dimensional morphology distribution of the object must be continuously changing within the entire real number range. Therefore, it is necessary to perform phase unwrapping on the wrapped phase diagram to calculate its true continuously changing phase distribution. This process is called phase unwrapping.

[0064] In this implementation, the wrapped phase of the LED chip surface is determined based on the spectrum information, and the wrapped phase is processed by the phase unwrapping algorithm to obtain the unwrapped phase distribution, thereby obtaining the real phase distribution of the LED chip surface. Based on the real phase distribution of the LED chip surface, the LED chip surface height data can be determined. The LED chip surface height data determined by this method has high accuracy.

[0065] In the disclosed embodiment, the processing device 106 is used to perform an inverse Fourier transform on the spectrum information; and use an inverse tangent function to process the spectrum information after the inverse Fourier transform to obtain the wrapped phase information of the surface of the LED chip.

[0066] In this implementation, the phase information can be simplified into a complex number containing a real number and an imaginary number. By using this value, the inverse tangent function is used to calculate the ratio of the imaginary part to the real part to obtain the phase information, which is the wrapped phase information.

[0067] Exemplarily, the inverse tangent function is as follows:

[0068]

[0069] Among them, tan -1 represents the inverse tangent function; Im represents the imaginary part of a complex number; Re represents the real part of a complex number, represents the experimental error, f0 represents the origin of the coordinate reference, (x, y) is the coordinate of the pixel in the image, and c' represents the real image.

[0070] Exemplarily, the processing device 106 is used to determine the surface height data of the LED chip using the following formula:

[0071]

[0072] Among them, h(i,j) is the surface height data of the LED chip, is the unwrapped phase distribution on the LED chip surface, and λ is the central wavelength of the light source.

[0073] In the embodiment of the present disclosure, the light source 101 may be an LED light source or other light sources (eg, a laser light source).

[0074] Exemplarily, the light source 101 may be an LED light source with a central wavelength of 620 nm or 520 nm.

[0075] In the embodiment of the present disclosure, the light generated by the light source 101 is weak coherent light, which can effectively reduce coherent noise.

[0076] In the embodiment of the present disclosure, the beam splitter prism 102 may be a non-polarizing beam splitter prism.

[0077] In the embodiment of the present disclosure, the camera 103 may be a charge coupled device (CCD) high-speed camera.

[0078] In the embodiment of the present disclosure, the processing device 106 may be a computer device, such as a personal computer, a mobile terminal, a server, etc.

[0079] Figure 2 is a schematic diagram of the structure of another LED chip detection device provided by an embodiment of the present disclosure. Figure 2 , the LED chip detection device further includes: a first displacement platform 107 and a second displacement platform 108;

[0080] The first displacement platform 107 is connected to the reflector 104 and is used to adjust the position of the reflector 104;

[0081] The second displacement platform 108 is connected to the stage 105 and is used to adjust the position of the stage 105 .

[0082] In this implementation, the positions of the reflector 104 and the stage 105 can be adjusted by the first displacement platform 107 and the second displacement platform 108 so that the reflector 104 and the LED chip can better reflect light.

[0083] See also Figure 2, the LED chip detection device further includes: a first lens group 109, a second lens group 110, a third lens group 111 and a fourth lens group 112;

[0084] The first lens group 109 is located between the light source 101 and the beam splitter prism 102 , the second lens group 110 is located between the camera 103 and the beam splitter prism 102 , the third lens group 111 is located between the reflector 104 and the beam splitter prism 102 , and the fourth lens group 112 is located between the stage 105 and the beam splitter prism 102 .

[0085] In this implementation, the above-mentioned lens group is provided to converge and focus the light, thereby enhancing the quality of the obtained image.

[0086] Exemplarily, the first lens group 109 may include a converging microscope objective 1091 , a pinhole stop 1092 , a converging lens 1093 , a polarizer 1094 and a converging lens 1095 , which are sequentially arranged from the light source 101 to the beam splitter prism 102 .

[0087] In this implementation, since the LED light source produces divergent light, the function of the converging microscope objective 1091, the pinhole aperture 1092 and the polarizer 1094 is to synthesize a collimating and beam expanding system to collimate and expand the light source; the converging lens 1093 and the converging lens 1095 utilize the collimated light beam.

[0088] Exemplarily, the second lens group 110 may include a converging lens located between the camera 103 and the beam splitting prism 102 .

[0089] Exemplarily, the third lens group 111 may include a microscope objective lens 1111 and a light intensity attenuation plate 1112 which are sequentially arranged from the reflector 104 to the beam splitter prism 102 .

[0090] In this implementation, because the light path is divided into two beams, the light intensity reflected by the object being measured is smaller. In order to make the light intensities of the two beams approximately equal, a light intensity attenuation plate needs to be added on the other side to achieve approximately equal light intensities of the two beams to improve accuracy.

[0091] Exemplarily, the fourth lens group 112 may include a microscope objective lens located between the stage 105 and the beam splitter prism 102 .

[0092] Figure 3 is a flow chart of an LED chip detection method provided by an embodiment of the present disclosure. Figure 3 , this method is based on Figure 1 or Figure 2 The device shown in the figure comprises the following steps:

[0093] 201: Acquire an interference pattern image generated based on the LED chip.

[0094] 202: Process the interference pattern image to obtain spectrum information.

[0095] 203: Obtaining surface height data of the LED chip based on the spectrum information.

[0096] In the disclosed embodiment, two beams of light are separated by a beam splitter prism, one beam is reflected by a reflector, and the other beam is reflected by an LED chip, and then they intersect at the camera to form an interference pattern image. The processing device processes the interference pattern image to obtain spectrum information, and further analyzes the spectrum information to obtain the surface height data of the LED chip. Therefore, by using the LED chip detection device, each layer of the film system in the production and manufacturing process of the LED chip can be detected, the longitudinal height of the entire surface can be determined, the error between the design structure and the actual operation in the preparation process of each layer of the film system can be analyzed and measured, and the thickness abnormality of each film system in the LED production and preparation can be discovered in time to improve the yield of LED production and preparation. In addition, the device adopts non-contact measurement, which can greatly reduce the adverse effects of the contact between the probe profilometer and the LED chip on the chip, improve the yield of LED production and preparation, and can effectively reduce the use of the probe profilometer, save the time used for measuring the thickness of the LED chip, and improve production efficiency.

[0097] In addition, the image processing method in the solution provided by the present invention only needs to take one image and then solve it through Fourier transform. Compared with the four-step phase shift method, which requires taking four images and then calculating, the processing speed is faster and the cost of expensive piezoelectric ceramics (the hardware corresponding to the four-step phase shift method) is saved, which is more economical and efficient.

[0098] Figure 4 is a flow chart of another LED chip detection method provided by an embodiment of the present disclosure. Figure 4 , this method is based on Figure 1 or Figure 2 The device shown, the method includes:

[0099] 301: Acquire an interference pattern image generated based on the LED chip.

[0100] 302: Perform fast Fourier transform on the interference pattern image to obtain a frequency spectrum of the interference pattern image.

[0101] Exemplarily, the interference pattern image is subjected to fast Fourier transform, and the obtained spectrum diagram can be expressed as follows:

[0102] FT{I}=A(f x ,f y )+C(f x -f0,f y)+C * (f x +f0,f y )

[0103] Among them, (f x ,f y ) represents the coordinate system in the Fourier domain, A is the DC term, C and C* represent the spectrum information of the real image c(x, y) and the conjugate image c*(x, y) after Fourier transformation, respectively. FT is the abbreviation of Fourier transform, I represents the original interference pattern image, f0 represents the origin of the coordinate reference, and (x, y) is the coordinate of the pixel point in the image.

[0104] 303: Perform spatial filtering on the frequency spectrum of the interference pattern image to remove the frequency spectrum of the zero-order image and the conjugate image to obtain the frequency spectrum information.

[0105] Exemplarily, according to the spatial filtering algorithm, the spectrum diagram +1-order spectrum is matched and filtered to obtain a spectrum with the zero-order image and the conjugate image removed.

[0106] In this implementation, the +1 level spectrum contains the information of the sample being tested, and levels 0 and -1 are interference phases. Therefore, the +1 level spectrum is matched and other interferences are filtered out, so that only the +1 level spectrum is retained.

[0107] In this implementation, the spectrum image after Fourier transformation of the interference pattern image includes +1 level, 0 level and -1 level. Spatial filtering is used to separate +1 level, 0 level and -1 level as much as possible, and remove 0 level and -1 level to reduce noise interference. That is, spatial filtering can remove noise in the spectrum information, improve the quality of the spectrum map, and make the final spectrum map better reflect the surface height data of the LED chip.

[0108] 304: Determine the wrapping phase information of the surface of the LED chip based on the spectrum information.

[0109] In the embodiment of the present disclosure, step 304 may include:

[0110] The spectrum information is subjected to an inverse Fourier transform; the spectrum information after the inverse Fourier transform is processed using an inverse tangent function to obtain the wrapped phase information of the surface of the LED chip.

[0111] In this implementation, the phase information can be simplified into a complex number containing a real number and an imaginary number. By using this value, the inverse tangent function is used to calculate the ratio of the imaginary part to the real part to obtain the phase information, which is the wrapped phase information.

[0112] Exemplarily, the inverse tangent function is as follows:

[0113]

[0114] Among them, tan -1 represents the inverse tangent function; Im represents the imaginary part of a complex number; Re represents the real part of a complex number, represents the experimental error, f0 represents the origin of the coordinate reference, (x, y) is the coordinate of the pixel in the image, and c' represents the real image.

[0115] 305: Determine an unwrapped phase distribution based on the wrapped phase information and a phase unwrapping algorithm.

[0116] Among them, the phase information in the spectrum information will have a deviation of an integer multiple of 2pi, which is also called the wrapped phase. On this basis, the phase obtained by adding or subtracting integer multiples of 2pi is the unwrapped phase, and the unwrapped phase can reflect the height of the actual object.

[0117] Since the phase information of the measured object is obtained by reproducing the complex amplitude of the light wave, that is, by applying the inverse tangent function to the ratio of the real part and the imaginary part of the complex amplitude, the inverse tangent function is a periodic function and has a limited range, so the obtained phase value is limited to (-π,π]. We call the phase information obtained at this time the wrapped phase. However, the phase diagram that can be used to characterize the three-dimensional morphology distribution of the object must be continuously changing within the entire real number range. Therefore, it is necessary to perform phase unwrapping on the wrapped phase diagram to calculate its true continuously changing phase distribution. This process is called phase unwrapping.

[0118] 306: Determine the surface height data of the LED chip based on the unwrapped phase distribution.

[0119] In the embodiment of the present disclosure, step 306 may include:

[0120] The following formula is used to determine the surface height data of the LED chip:

[0121]

[0122] Among them, h(i,j) is the surface height data of the LED chip, is the unwrapped phase distribution on the LED chip surface, and λ is the central wavelength of the light source.

[0123] In this implementation, the wrapped phase of the LED chip surface is determined based on the spectrum information, and the wrapped phase is processed by the phase unwrapping algorithm to obtain the unwrapped phase distribution, thereby obtaining the real phase distribution of the LED chip surface. Based on the real phase distribution of the LED chip surface, the LED chip surface height data can be determined. The LED chip surface height data determined by this method has high accuracy.

[0124] Figure 5 is a schematic diagram of the detection results provided by the embodiment of the present disclosure. Figure 5In the process of preparing LED chips, SiO2 is used to prepare the current blocking layer. After the preparation, the above-mentioned device and method are used for testing. The results are as follows Figure 5 As shown, it can be seen that the device and method can obtain complete height data of the current blocking layer (the height shown on the z-axis, and the pixels formed by the x-axis and the y-axis correspond to the various positions of the LED).

[0125] Figure 6 Schematic diagram of the structure of the computer device provided by the embodiment of the present disclosure. Figure 6 As shown, the computer device 1300 includes: a processor 1301 and a memory 1302 .

[0126] The processor 1301 may include one or more processing cores, such as a 4-core processor, an 8-core processor, etc. The processor 1301 may be implemented in at least one hardware form of DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array). The processor 1301 may also include a main processor and a coprocessor. The main processor is a processor for processing data in the awake state, also known as a CPU (Central Processing Unit); the coprocessor is a low-power processor for processing data in the standby state. In some embodiments, the processor 1301 may be integrated with a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content to be displayed on the display screen. In some embodiments, the processor 1301 may also include an AI (Artificial Intelligence) processor, which is used to process computing operations related to machine learning.

[0127] The memory 1302 may include one or more computer-readable storage media, which may be non-transitory. The memory 1302 may also include a high-speed random access memory and a non-volatile memory, such as one or more disk storage devices and flash memory storage devices. In some embodiments, the non-transitory computer-readable storage medium in the memory 1302 is used to store at least one instruction, which is used to be executed by the processor 1301 to implement the LED chip detection method provided in the embodiment of the present disclosure.

[0128] Those skilled in the art will understand that Figure 6The structure shown in the figure does not constitute a limitation on the computer device 1300, and the computer device 1300 may include more or less components than shown in the figure, or combine some components, or adopt a different component arrangement.

[0129] The embodiment of the present disclosure also provides a non-temporary computer-readable storage medium. When the instructions in the storage medium are executed by a processor of a computer device, the computer device can execute the LED chip detection method provided in the embodiment of the present disclosure.

[0130] The embodiments of the present disclosure further provide a computer program product, including a computer program / instruction, which implements the LED chip detection method provided in the embodiments of the present disclosure when the computer program / instruction is executed by a processor.

[0131] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A LED chip detection device, characterized in that: The LED chip detection device comprises: a light source (101), a beam splitter prism (102), a camera (103), a reflector (104), a stage (105) and a processing device (106); The light source (101), the beam splitter prism (102) and the stage (105) are arranged in sequence along a first straight line, the camera (103), the beam splitter prism (102) and the reflector (104) are arranged in sequence along a second straight line, and the camera (103) and the processing device (106) are electrically connected; The beam splitter prism (102) is used to split the light beam provided by the light source (101) into a first light beam and a second light beam; The reflector (104) is used to reflect the first light beam so that the reflected first light beam passes through the beam splitter prism (102) and reaches the camera (103); The stage (105) is used to carry an LED chip, and the LED chip is used to reflect the second light beam, so that the reflected second light beam is reflected by the beam splitter prism (102) and reaches the camera (103); The camera (103) is used to receive the first light beam and the second light beam and output an interference pattern image; The processing device (106) is used to obtain spectrum information based on the interference pattern image; and obtain the surface height data of the LED chip based on the spectrum information.

2. The LED chip detection device according to claim 1, characterized in that: The processing device (106) is used to perform fast Fourier transform on the interference pattern image to obtain a frequency spectrum of the interference pattern image; perform spatial filtering on the frequency spectrum of the interference pattern image to remove the frequency spectrum of the zero-order image and the conjugate image to obtain the frequency spectrum information.

3. The LED chip detection device according to claim 1, characterized in that: The processing device (106) is used to determine the wrapped phase information of the surface of the LED chip based on the spectrum information; determine the unwrapped phase distribution based on the wrapped phase information and a phase unwrapping algorithm; and determine the height data of the surface of the LED chip based on the unwrapped phase distribution.

4. The LED chip detection device according to claim 3, characterized in that: The processing device (106) is used to perform an inverse Fourier transform on the spectrum information; and use an inverse tangent function to process the spectrum information after the inverse Fourier transform to obtain the wrapped phase information of the surface of the LED chip.

5. The LED chip detection device according to any one of claims 1 to 4, characterized in that: The LED chip detection device further comprises: a first displacement platform (107) and a second displacement platform (108); The first displacement platform (107) is connected to the reflector (104) and is used to adjust the position of the reflector (104); The second displacement platform (108) is connected to the object carrier (105) and is used to adjust the position of the object carrier (105).

6. The LED chip detection device according to any one of claims 1 to 4, characterized in that: The LED chip detection device further comprises: a first lens group (109), a second lens group (110), a third lens group (111) and a fourth lens group (112); The first lens group (109) is located between the light source (101) and the beam splitter prism (102), the second lens group (110) is located between the camera (103) and the beam splitter prism (102), the third lens group (111) is located between the reflector (104) and the beam splitter prism (102), and the fourth lens group (112) is located between the stage (105) and the beam splitter prism (102).

7. A method for detecting LED chips, characterized in that: The method is based on the apparatus according to claim 1, and the method comprises: Acquire an interference pattern image generated based on the LED chip; Processing the interference pattern image to obtain spectrum information; Based on the spectrum information, the surface height data of the LED chip is obtained.

8. The LED chip detection method according to claim 7, characterized in that: The obtaining of spectrum information by processing based on the interference pattern image includes: Performing a fast Fourier transform on the interference pattern image to obtain a frequency spectrum of the interference pattern image; The frequency spectrum of the interference pattern image is spatially filtered to remove the frequency spectrum of the zero-order image and the conjugate image to obtain the frequency spectrum information.

9. The LED chip detection method according to claim 7, characterized in that: The step of obtaining the surface height data of the LED chip based on the spectrum information includes: Determine the wrapping phase information of the surface of the LED chip based on the spectrum information; Determining an unwrapped phase distribution based on the wrapped phase information and a phase unwrapping algorithm; The LED chip surface height data is determined based on the unwrapped phase distribution.

10. A computer device, characterized in that: The computer device comprises: a memory and a processor, wherein at least one computer program is stored in the memory, and the at least one computer program is loaded and executed by the processor to implement the method according to any one of claims 7 to 9.

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