Electronic packaging device

Abstract

The invention provides electronic packaging equipment, and relates to the technical field of ball mounters, and the electronic packaging equipment comprises a supplied ball mechanism which comprises an implantation site for accommodating an implantation component; the ball supply assembly is arranged above the ball supply receiving mechanism and is used for supplying an implanting component to the ball supply receiving mechanism; and the pressure assembly is arranged on the upper surface of the ball-supplied mechanism and applies downward pressure to the ball-supplied mechanism. The supplied ball mechanism comprises a ball planting net and a base plate, the base plate is located below the ball planting net, and point positions for containing the planting components on the base plate coincide with meshes of the ball planting net to form planting point positions for containing the planting components; the downward pressure applied by the pressure assembly acts on the ball planting net, so that the ball planting net is attached to the base plate. The downward pressure is applied to the ball mounting net of the ball-supplied mechanism through the pressure assembly, ball laying work can be carried out on a warped ball-supplied product, and a gap between the substrate and the ball mounting net can be avoided in the ball laying process, so that solder balls can correctly fall into meshes of the ball mounting net, and the ball mounting yield is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of ball implanting machines, and in particular to an electronic packaging device. Background Art

[0002] Ball implantation is a key electronic packaging technology used to make electrical connections between integrated circuit chips and printed circuit boards (PCBs). It is a process of precisely placing implant components (usually solder alloys) on the implant component locations of the chip.

[0003] The ball implanter is a special device that performs the ball implantation process. It usually has an automated feeding system, a precision heating and cooling system, a precision position control system, and a quality control system. The ball implanter needs to be flexible and able to adapt to different package types (such as the number of balls, ball diameter, pitch, etc.) and chips of different specifications. Therefore, modern ball implanters usually have adjustable parameters and process settings to meet the needs of different customers and applications.

[0004] In the existing technology, when the ball implantation machine is used to implant the ball on a substrate with a large degree of warpage, the implantation effect is poor and the implantation yield rate is greatly reduced. It is difficult for the existing ball implantation machine to solve the problem of implantation on a warped substrate, because when the substrate is warped, a gap will be generated between the substrate and the implantation steel mesh, causing multiple solder balls to leak in the gap and cause defects. Summary of the invention

[0005] In view of the defects in the prior art, an object of the present invention is to provide an electronic packaging device.

[0006] An electronic packaging device provided according to the present invention comprises:

[0007] The ball supply mechanism includes an implantation site for accommodating the implantation member;

[0008] Ball supply assembly: arranged above the ball supply mechanism, providing implant components to the ball supply mechanism;

[0009] Pressure assembly: It is arranged on the upper surface of the ball supply mechanism and applies downward pressure to the ball supply mechanism.

[0010] Preferably, the pressure assembly is configured to move with the ball supply assembly on the supplied ball mechanism.

[0011] Preferably, the ball supply mechanism includes a ball planting net and a substrate, wherein the substrate is located below the ball planting net, and the points on the substrate where the implant components are arranged coincide with the meshes of the ball planting net to form implantation sites for accommodating the implant components; the downward pressure applied by the pressure component acts on the ball planting net to make the ball planting net fit with the substrate.

[0012] Preferably, the relative movement between the pressure component and the upper surface of the ball-supplied mechanism includes translation and / or rolling.

[0013] Preferably, the pressure assembly includes one or more of a plunger assembly, a roller assembly, a drum assembly and a forced deformation self-resetting assembly.

[0014] Preferably, the ball supply assembly includes a ball outlet, the forced deformation self-resetting assembly is installed on the peripheral side of the ball outlet, and the forced deformation self-resetting assembly protrudes from the bottom surface of the ball supply assembly;

[0015] The bottom surface of the forced deformation self-resetting component contacts the ball planting net of the ball supply mechanism, and the deformation amount of the ball planting net caused by the forced deformation self-resetting component can reach or exceed the deformation amount of the product.

[0016] Preferably, the forced deformation self-resetting component is deformed under the action of an external force, and when the external force is reduced or disappears, the shape of the forced deformation self-resetting component is automatically restored.

[0017] Preferably, the movement of the ball supply assembly includes translation on the upper surface of the ball supply mechanism;

[0018] At least one set of brackets is respectively arranged on the front and rear sides of the ball supply assembly in the translation direction, and any bracket gradually approaches the ball outlet of the ball supply assembly from top to bottom;

[0019] The bottom of the bracket is configured to mount one or more of a plunger assembly, a roller assembly, and a drum assembly.

[0020] Preferably, elastic baffles are arranged on both the front and rear sides of the ball outlet of the ball supply assembly along the translation direction of the ball supply assembly, and the elastic baffles are in contact with the upper surface of the ball planting net.

[0021] Preferably, it also includes:

[0022] An air supply system, wherein the air supply system is configured such that the air outlet extends in a direction close to the ball outlet of the ball supply assembly, and the orifice of the air outlet faces directly below the ball outlet of the ball supply assembly;

[0023] And / or, a vibration system, which acts on the ball supply assembly.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] 1. The present invention applies downward pressure to the ball planting net of the ball supply mechanism through a pressure component, which can adapt to the ball laying work of the warped ball supply product. During the ball laying process, it can avoid the existence of gaps between the substrate and the ball planting net, thereby ensuring that the solder balls can correctly fall into the mesh holes of the ball planting net, thereby improving the ball planting yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0027] Figure 1 The exploded view of the ball box assembly mainly embodies the present invention;

[0028] Figure 2 The present invention mainly embodies the front view of the ball box assembly;

[0029] Figure 3 for Figure 2 AA section view of the middle;

[0030] Figure 4 This is a schematic diagram showing that the implant component falls from the ball storage tank into the mesh of the ball planting net and adheres to the substrate in the first embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of the three-dimensional structure of the second embodiment of the present invention;

[0032] Figure 6 It is a side cross-sectional view of the second embodiment of the present invention;

[0033] Figure 7 for Figure 6 An enlarged schematic diagram of the plunger position;

[0034] Figure 8 This is a schematic diagram of the installation of the plunger according to the second embodiment of the present invention;

[0035] Fig. 9 This is a schematic diagram of the structure of adding an elastic baffle next to the ball outlet of the ball box;

[0036] Fig.10 This is an enlarged schematic diagram of the lateral section of the ball outlet position mainly embodying the present invention;

[0037] Fig.11 This is a schematic diagram of the structure of the elastic roller according to the third embodiment of the present invention;

[0038] Fig.12 This is a schematic diagram of the structure of an elastic roller according to a fourth embodiment of the present invention;

[0039] Fig.13 This is a schematic diagram of the installation of the elastic roller according to the fourth embodiment of the present invention.

[0040] As shown in the figure:

[0041] Base plate 10 Horizontal drive mechanism 420 Plunger head 622

[0042] Implant component 20 horizontal slide rail 421 roller assembly 623

[0043] Ball planting net 200 Support slide plate 423 Roller assembly 624

[0044] Ball supply assembly 400 Lifting drive mechanism 430 Elastic baffle 625

[0045] Ball box 410 Connecting plate 610 Wear-resistant layer 630

[0046] Ball storage tank 411 Ball outlet 611 Bracket 640

[0047] Ball outlet 412 groove 612 vertical rod 641

[0048] Cover plate 413 Air groove 613 Crossbar 642

[0049] Socket 414 Air outlet 614 Cylinder seat 650

[0050] In-ball tube 415 Forced deformation self-reset component 620 Inclined mounting surface 651 Inlet flow channel 416 plunger assembly 621 cylinder 652

[0051] Vibrator 660 DETAILED DESCRIPTION

[0052] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can also be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0053] It should be emphasized that the implant component 20 of the present application can be a columnar structure or a spherical structure. The device of the technical solution of the present application is particularly suitable for spherical implant components 20, and can also be suitable for columnar implant components 20.

[0054] Embodiment 1

[0055] like Figures 1 to 4 As shown, an electronic packaging device provided according to the present invention includes a ball supply mechanism, a ball supply assembly 400 and a pressure assembly. The ball supply mechanism includes an implantation site for accommodating an implant component 20. The ball supply assembly 400 is arranged above the ball supply mechanism to provide the implant component 20 to the ball supply mechanism. The pressure assembly is arranged on the upper surface of the ball supply mechanism to apply downward pressure to the ball supply mechanism.

[0056] Specifically, the ball supply mechanism includes a ball planting net 200 and a substrate 10, wherein the substrate 10 is located below the ball planting net 200, and the points on the substrate 10 where the implant components 20 are arranged overlap with the meshes of the ball planting net 200 to form implantation sites for accommodating the implant components 20. The downward pressure applied by the pressure assembly acts on the ball planting net 200, so that the ball planting net 200 and the substrate 10 are attached to each other.

[0057] More specifically, the substrate 10 is stably installed below the ball planting net 20 through a supporting device. The present application proposes a feasible way to support the substrate 10, which does not constitute a specific limitation on the content to be protected by the present application: the supporting platform is supported by four supporting legs. There is an opening on the supporting platform. A ball planting net 200 is fixed in the opening. The ball planting net 200 is preferably a steel net, but of course, nets of other materials can also be used.

[0058] The supporting device is arranged below the ball planting net 200, and includes a fixed plate, a carrier plate arranged below the fixed plate, a support plate arranged below the carrier plate, and four guide pillars. The fixed plate is located below the ball planting net 200, and both ends are fixed on the supporting platform. The four guide pillars are vertically fixedly connected between the fixed plate and the support plate. Four linear bearings are arranged on the carrier plate. The four linear bearings are sleeved on the four guide pillars to enable the carrier plate to be lifted and lowered along the guide pillars. There is a hole in the middle of the fixed plate. The position on the carrier plate corresponding to the hole is provided with a carrier for positioning and placing the substrate 10. The roots of the four guide pillars are provided with limit pads made of rubber.

[0059] A handle is provided on the lower surface of the carrier. The carrier can be lifted by holding the handle so that the substrate 10 on the carrier passes through the hole of the fixing plate and is lifted to the lower surface of the ball planting net 200. When the substrate 10 is located on the lower surface of the ball planting net 200, the carrier and the fixing plate can be fixed by bolts so that the substrate 10 can be firmly located on the lower surface of the ball planting net 200 when the ball is planted. In this embodiment, the lifting and lowering of the carrier is achieved manually. In addition to this solution, the lifting and lowering of the carrier can also be driven by a motor or a cylinder to realize the automation of the support device.

[0060] The ball supply assembly 400 includes a ball box 410, a horizontal driving mechanism 420 for driving the ball box 410 to move horizontally, and a lifting driving mechanism 430 for driving the ball box 410 to move up and down.

[0061] The ball box 410 is provided with a ball storage tank 411 at the bottom. A ball outlet 412 is provided at the bottom of the ball storage tank 411. A cover plate 413 is provided at the top opening of the ball storage tank 411. The cover plate 413 is provided with insertion holes 414 at intervals. A ball injection tube 415 is fixed to each insertion hole 414. The ball injection tube 415 is connected to an external ball supply device. The ball supply device can inject the implant component 20 into the ball storage tank 411 through the ball injection tube 415.

[0062] The horizontal driving mechanism 420 includes a horizontal slide rail 421, a horizontal linear module and a support slide plate 423. The horizontal slide rail 421 and the horizontal linear module are fixed on the support platform and are disposed on both sides of the opening. One end of the support slide plate 423 is disposed on the horizontal slide rail 421, and the other end is disposed on the horizontal linear module. A through hole is formed on the support slide plate 423. The through hole can pass over the hole of the fixed plate when the support slide plate 423 slides.

[0063] The lifting drive mechanism 430 is fixed on the support slide plate 423 and is located on one side of the hole. The ball box 410 is installed on the lifting drive mechanism 430 and is located above the hole. Under the lifting drive of the lifting drive mechanism 430, the ball box 410 can pass through the hole so that the ball outlet 412 reaches the top of the ball planting net 200. The lifting drive mechanism 430 is a vertical linear module.

[0064] The horizontal linear module and the vertical linear module are both motor-driven linear modules. Since they are in the prior art and can be purchased directly from the market, their specific structures will not be described in detail here.

[0065] The pressure component is configured to move with the ball supply component 400 on the ball supply mechanism. The pressure component of the present application can be installed on the ball supply component 400, or it can be installed on other transmission components, and the transmission component drives the pressure component to move with the ball supply component 400 on the ball supply mechanism. The relative movement between the pressure component and the upper surface of the ball supply mechanism includes translation and / or rolling. The pressure component includes one or more of the plunger component 621, the roller component 623, the roller component 624 and the forced deformation self-reset component 620.

[0066] This specific implementation is further described by taking the pressure component as a forced deformation self-resetting component 620 as an example:

[0067] It should be noted that the forced deformation self-resetting component 620 of the present application is deformed under the action of an external force, and when the external force is reduced or disappears, the shape of the forced deformation self-resetting component 620 is automatically restored. The forced deformation self-resetting component 620 of the present application may include non-metallic elastic parts such as rubber, sponge, and foamed cotton, or metal elastic parts such as springs and thin-walled metal parts, or a composite elastic structure made using the elastic properties of elastic elements or materials, for example, a hollow metal drum structure, and the hollow drum made using the ductility of metal has a certain deformation recovery ability.

[0068] The ball supply assembly 400 includes a ball outlet 412, and a forced deformation self-resetting assembly 620 is embedded and installed on the peripheral side of the ball outlet 412, and the forced deformation self-resetting assembly 620 protrudes from the bottom surface of the ball supply assembly 400. The bottom surface of the forced deformation self-resetting assembly 620 contacts the ball planting net 200 of the ball supply mechanism, and the forced deformation self-resetting assembly 620 applies a downward force to the ball planting net 200 by means of the adaptive deformation capability, and the deformation amount of the ball planting net caused by the forced deformation self-resetting assembly 620 can reach or exceed the deformation amount of the product.

[0069] Specifically, a connecting plate 610 is detachably fixed to the lower surface of the bottom of the ball box 410, for example, the connecting plate 610 is fixed to the bottom of the ball box 410 by bolts. A ball drop hole 611 of the same size as the ball outlet 412 is provided on the connecting plate 610 below the ball outlet 412. A groove 612 is provided on the lower surface of the connecting plate 610 around the ball outlet 412. A forced deformation self-resetting component 620 surrounding the ball outlet 412 is provided in the groove 612.

[0070] The forced deformation self-resetting component 620 is fixed in the groove 612 by glue bonding and protrudes from the lower surface of the connecting plate 610. The non-metallic elastic member 620 is connected to the bottom of the ball box 410 through the connecting plate 610, which can facilitate the replacement of the forced deformation self-resetting component 620 and the maintenance of the bottom of the ball box 410.

[0071] The forced deformation self-resetting component 620 is preferably a sponge. The thickness of the forced deformation self-resetting component 620 should be greater than the maximum warping amount of the supplied ball. In a feasible embodiment, the thickness of the sponge is 15-25mm, and the density of the sponge is 90kg / cm 3 .

[0072] The lower surface of the forced deformation self-resetting component 620 is also provided with a wear-resistant layer 630. The wear-resistant layer 630 is a wear-resistant coating applied to the lower surface of the forced deformation self-resetting component 620 or a wear-resistant sheet adhered to the lower surface of the forced deformation self-resetting component 620. By adding the wear-resistant layer 630, it is possible to avoid the forced deformation self-resetting component 620 from directly contacting and rubbing with the ball planting net 200. For example, when the wear-resistant layer 630 is a wear-resistant sheet, a film is used. The wear-resistant layer 630 can also be made of anti-static material, such as a stainless steel sheet or a conductive plastic with a thickness of 0.1-0.3mm. It should be further explained that the material and / or structure of some forced deformation self-resetting components 620 themselves have anti-wear functions and adapt to deformation amounts, and in this case, there is no need to add an additional wear-resistant layer 630.

[0073] Furthermore, it also includes an air supply system, which is configured so that the air outlet 614 extends in the direction close to the ball outlet 412 of the ball supply assembly 400, and the opening of the air outlet 614 faces directly below the ball outlet 412 of the ball supply assembly 400. Specifically, an air groove 613 is also provided inside the connecting plate 610. A plurality of air outlets 614 connected to the air groove 613 are provided on the lower surface of the connecting plate 610. The plurality of air outlets 614 are spaced around the ball outlet 412. The opening of the air outlet 614 is located on the inner side of the forced deformation self-resetting assembly 620, and the air outlet 614 is an inclined hole with the opening inclined toward the ball outlet 412. The inclined hole allows the gas coming out of the air outlet 614 to blow onto the implant component 20 of the ball planting net 200, so that the implant component 20 can jump, and the implant component 20 can be dispersed and fall into the mesh of the ball planting net 200. In this embodiment, an inlet air passage 416 communicating with the air groove 613 is provided in the plate body at the bottom of the ball box 410. The inlet air passage 416 is connected to an external air source through an air pipe.

[0074] The working process is as follows:

[0075] 1. The substrate 10 is lifted to the lower surface of the ball planting net 200 to wait for ball laying;

[0076] 2. The lifting drive mechanism 430 drives the ball box 410 to descend to the upper surface of the ball planting net 200 and presses down the ball planting net 200 to complete the ball laying preparation action;

[0077] 3. The external ball supply device supplies balls to the ball storage slot 411 of the ball box 410;

[0078] 4. The horizontal driving mechanism 420 drives the ball box 410 forward. During the forward movement, the ball-laying mechanism presses down the ball-planting net 200 with the help of the elastic force of the sponge so that the ball-planting net 200 is completely fitted with the substrate 10 and the implanted component 20 is confined in the area surrounded by the sponge and drives the implanted component 20 forward to lay the balls. When the implanted component 20 passes through the mesh holes of the ball-planting net 200, it enters the mesh holes by its own gravity. After the ball box 410 passes through the mesh area of ​​the ball-planting net 200, the ball-laying action is completed.

[0079] During the ball laying process, the sponge is elastic and can adapt to the warped shape of the substrate 10 , thereby ensuring that the sponge, the steel mesh and the substrate 10 are completely fitted together, thereby completing the ball laying of the warped substrate 10 .

[0080] During the ball laying process, gas is introduced into the inlet flow channel 416 and blown out from the outlet through the air groove 613. The blown gas can blow the implant components 20 on the surface of the ball planting net 200, so that the implant components 20 can jump during the ball laying process to disperse and fall into each mesh hole.

[0081] Embodiment 2

[0082] Based on the first embodiment, an electronic packaging device that can adapt to a warped substrate 10 is provided according to the present invention. This specific embodiment is further described by taking the pressure component as a plunger component 621 as an example:

[0083] like Figures 5 to 10 As shown, in this specific embodiment, the ball storage groove 411 of the ball box 410 is an inverted trapezoidal narrow groove, the ball outlet 412 is a narrow opening, and the width of the ball outlet 412 is between 1 mm and 2 mm.

[0084] The movement of the ball supply assembly 400 includes translation on the upper surface of the ball supply mechanism. At least one set of brackets 640 is respectively provided on the front and rear sides of the translation direction of the ball supply assembly 400, and any bracket 640 gradually approaches the ball outlet 412 of the ball supply assembly 400 from top to bottom. The bottom of the bracket 640 is configured for installing a plunger assembly 621. The plunger assembly 621 includes an elastic plunger, and the plunger head 622 of the elastic plunger is a spherical surface, which is pressed on the ball planting net 200 by the action of an internal spring. The elastic plunger can be purchased directly from the market.

[0085] The bracket 640 includes two vertical rods 641 and a cross bar 642 connected between the lower ends of the two vertical rods 641. A cylinder seat 650 is provided on the left and right sides of the ball box 410 on the support slide 423, and inclined mounting surfaces 651 with a lower outer side and a higher inner side are symmetrically distributed on the cylinder seat 650. A cylinder 652 is installed on each inclined mounting surface 651. The upper end of the vertical rod 641 is connected to the cylinder 652, and the elastic plunger is arranged and fixed on the cross bar 642, and the plunger head 622 faces downward. In this embodiment, due to the use of the inclined mounting surface 651, the cylinder 652 and the bracket 640 are both installed at an inclination, and finally the plunger head 622 of the elastic plunger is installed at both sides of the ball box 410 in a manner of being deflected in the direction of the ball box 410, and the outer walls of the front and rear sides of the ball box 410 are inclined walls with the bottom inclined inward, and the wall thickness of the front and rear sides of the ball box 410 at the ball outlet 412 is 1.2mm to 1.8mm. This allows the plunger head 622 of the plunger assembly 621 to be as close to the ball outlet 412 as possible (that is, the elastic force point is as close to the ball laying point as possible). In order to ensure that the force points are linear and uniform, as many elastic plungers as possible should be arranged on both sides of the ball laying box 410.

[0086] It should be noted that the elastic plungers of the technical solution of the present application are arranged on the cross bar 642 at as many intervals as possible along the length direction of the cross bar 642, and the number and size of the elastic plungers can be selected according to actual working conditions. The more elastic plungers there are, the more reasonable arc deformation can be achieved when pressed onto the ball planting net 200, and there will be no situation where a single pit is pressed out of the crimping point.

[0087] In this embodiment, the elastic member driving mechanism adopts a cylinder 652, and of course other driving mechanisms may also be adopted, for example, a linear module driven by a motor may also be adopted.

[0088] The plunger assembly 621 can be raised and lowered under the synchronous drive of the two cylinders 652 on the same side. During the ball laying process, the row of plunger assemblies 621 on the forward direction side is driven by the cylinder 652 to descend to press the ball planting net 200, and the plunger assembly 621 on the opposite direction side is driven by the cylinder 652 to rise and separate from the ball planting net 200. During the ball laying process, the row of plunger assemblies 621 on the forward side presses down the ball planting net 200 with the help of elastic force so that the ball planting net 200 is completely attached to the substrate 10.

[0089] Furthermore, a vibration system is included, and the vibration system acts on the ball supply assembly 400. The vibration system includes a vibrator 660, and the vibrator 660 is also installed on the top of the ball box 410. Through the vibration of the vibrator 660, the solder balls in the ball box 410 can be made to jump, which can effectively improve the ball laying yield.

[0090] The positioning groove of the carrier is provided with a vacuum suction hole. The substrate 10 is positioned in the positioning groove of the carrier and is sucked by vacuum and fixed by means of buckles or bolts.

[0091] Further preferably, the ball outlet 412 of the ball supply assembly 400 is provided with elastic baffles 625 on both the front and rear sides along the translation direction of the ball supply assembly 400, and the elastic baffles 625 are in contact with the upper surface of the ball planting net 200. Specifically, elastic baffles 625 are further added on the front and rear sides of the ball outlet 412 of the ball box 410. Specifically, the elastic baffles 625 are fixed on the outer walls on the front and rear sides of the ball box 410, and the ends extend beyond the lower surface of the bottom of the ball box 410 and bend inwards to contact the ball planting net 200. Adding the elastic baffles 625 can prevent the implant component 20 from leaking from the side during the ball laying process. The elastic baffles 625 are made of stainless steel or spring steel.

[0092] It can be seen from the above detailed description that the electronic packaging equipment of the present invention can adapt to the ball laying work on the warped substrate 10, and can avoid the existence of gaps between the substrate 10 and the ball planting net 200 during the ball laying process, thereby ensuring that the solder balls can correctly fall into the mesh holes of the ball planting net 200, thereby improving the ball planting yield.

[0093] It should be noted that, in addition to being used for ball laying on the substrate 10, the technical solution of the present application can also be used for ball laying on other products, for example, it can also be used for ball laying on chips or wafers.

[0094] The other structures are the same as those in the first embodiment and will not be described again here.

[0095] Embodiment 3

[0096] Based on the second embodiment, according to an electronic packaging device provided by the present invention, this specific implementation is further described by taking the pressure component as the roller component 623 as an example:

[0097] like Fig.11 As shown, this specific embodiment uses a roller assembly 623 to replace the plunger assembly 621 in the second embodiment, and the other structures are the same as those in the second embodiment, which will not be elaborated here. The roller assembly 623 includes an elastic roller, which is composed of an elastic telescopic column and a roller installed at the lower end of the elastic telescopic column. The elastic roller can also be purchased directly from the market.

[0098] Similarly, during the ball laying process, a row of elastic rollers on one side of the forward direction are driven by the cylinder 652 to descend to press the ball planting net 200, while the elastic rollers on the opposite side are driven by the cylinder 652 to rise and separate from the ball planting net 200.

[0099] Embodiment 4

[0100] Based on the second embodiment, according to an electronic packaging device provided by the present invention, this specific implementation is further described by taking the pressure component as the roller component 624 as an example:

[0101] like Fig.12 and Fig.13 As shown, this specific embodiment adopts a roller assembly 624 to replace the plunger assembly 621 in Example 2. The roller assembly 624 includes an elastic roller, and an elastic roller is connected between the lower ends of the two vertical rods 641. The elastic roller can be purchased directly from the market. The surface of the elastic roller has an elastic rubber coating, and the rubber material can be rubber or plastic. The roller assembly 624 can also preferably adopt a hollow roller. The hollow roller can be made of metal. It uses the deformation recovery ability of the metal hollow structure itself to act on the ball planting net 200, so that when it is pressed on the ball planting net 200, the ball planting net 200 will produce an arc deformation, and no single pit will be pressed out.

[0102] Similarly, during the ball laying process, the elastic roller on one side of the forward direction is driven by the cylinder 652 to descend to press the ball planting net 200, while the roller on the opposite side is driven by the cylinder 652 to rise and separate from the ball planting net 200.

[0103] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0104] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. An electronic packaging device, characterized in that: include: The ball supply mechanism includes an implantation site for accommodating the implantation member; Ball supply assembly: arranged above the ball supply mechanism, providing implant components to the ball supply mechanism; Pressure assembly: It is arranged on the upper surface of the ball supply mechanism and applies downward pressure to the ball supply mechanism.

2. The electronic packaging device according to claim 1, characterized in that: The pressure assembly is configured to move with the ball supply assembly on the supplied ball mechanism.

3. The electronic packaging device according to claim 1, characterized in that: The ball supply mechanism comprises a ball planting net and a base plate, wherein the base plate is located below the ball planting net, and the points on the base plate where the implant components are arranged overlap with the meshes of the ball planting net to form an implantation site for accommodating the implant components; The downward pressure applied by the pressure assembly acts on the ball planting net, so that the ball planting net is attached to the substrate.

4. The electronic packaging device according to claim 1, characterized in that: The relative movement between the pressure component and the upper surface of the ball-supplied mechanism includes translation and / or rolling.

5. The electronic packaging device according to claim 1, characterized in that: The pressure component includes one or more of a plunger component, a roller component, a drum component and a forced deformation self-resetting component.

6. The electronic packaging device according to claim 5, characterized in that: The ball supply assembly includes a ball outlet, the forced deformation self-resetting assembly is installed on the peripheral side of the ball outlet, and the forced deformation self-resetting assembly protrudes from the bottom surface of the ball supply assembly; The bottom surface of the forced deformation self-resetting component contacts the ball planting net of the ball supply mechanism, and the deformation amount of the ball planting net caused by the forced deformation self-resetting component can reach or exceed the deformation amount of the product.

7. The electronic packaging device according to claim 5, characterized in that: The forced deformation self-resetting component is deformed under the action of external force, and when the external force is reduced or disappears, the shape of the forced deformation self-resetting component is automatically restored.

8. The electronic packaging device according to claim 5, characterized in that: The movement of the ball supply assembly includes translation on the upper surface of the ball supply mechanism; At least one set of brackets is respectively arranged on the front and rear sides of the ball supply assembly in the translation direction, and any bracket gradually approaches the ball outlet of the ball supply assembly from top to bottom; The bottom of the bracket is configured to mount one or more of a plunger assembly, a roller assembly, and a drum assembly.

9. The electronic packaging device according to claim 8, characterized in that: The ball outlet of the ball supply component is provided with elastic baffles at both the front and rear sides along the translation direction of the ball supply component, and the elastic baffles are in contact with the upper surface of the ball planting net.

10. The electronic packaging device according to claim 5, characterized in that: Also includes: An air supply system, wherein the air supply system is configured such that the air outlet extends in a direction close to the ball outlet of the ball supply assembly, and the orifice of the air outlet faces directly below the ball outlet of the ball supply assembly; And / or, a vibration system, which acts on the ball supply assembly.

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