Chip assembly, manufacturing method thereof and electronic equipment

Abstract

The invention provides a chip assembly, the chip assembly comprises a chip main body and a cooling structure, the cooling structure is arranged on the back surface of the chip main body, the cooling structure comprises a manifold structure plate, the chip assembly is characterized in that the manifold structure plate comprises a plurality of manifold areas, the plurality of manifold areas are discontinuous, and the plurality of manifold areas are arranged on the back surface of the chip main body. And the plurality of manifold regions respectively correspond to different positions of the chip main body so as to cool the different positions of the chip main body. The invention further provides electronic equipment and a manufacturing method of the chip assembly.

Description

Technical Field

[0001] The present disclosure relates to the field of chip technology, and in particular, to a chip assembly, a method for manufacturing the chip assembly, and an electronic device comprising the chip assembly. Background Art

[0002] As chip size becomes smaller and smaller, and heterogeneous chips such as 2.5D and 3D are developing rapidly, the heat dissipation problem of chips is becoming more and more obvious. Microscale liquid cooling (channel width is between a few microns and a few hundred microns) is a key technology for implementing chip-level liquid cooling solutions. Specifically, a microchannel can be set on the back of the chip, and a cooling medium can be introduced into the microchannel to achieve cooling of the chip.

[0003] How to set up a liquid cooling channel on the back of the chip to achieve higher cooling efficiency has become an important research direction in this field. Summary of the invention

[0004] Embodiments of the present disclosure provide a chip assembly, a method for manufacturing the chip assembly, and an electronic device including the chip assembly.

[0005] As a first aspect of the present disclosure, a chip component is provided, which includes a chip body and a cooling structure, wherein the cooling structure is arranged on the back side of the chip body, and the cooling structure includes a manifold structure plate, characterized in that the manifold structure plate includes a plurality of manifold areas, the plurality of manifold areas are discontinuous, and the plurality of manifold areas respectively correspond to different positions of the chip body to cool different positions of the chip body.

[0006] As a second aspect of the present disclosure, a method for manufacturing a chip assembly is provided, the manufacturing method comprising:

[0007] Providing a chip body;

[0008] A cooling structure is provided, wherein the cooling structure is arranged on the back side of the chip body, and the cooling structure includes a manifold structure plate, wherein the manifold structure plate includes a plurality of manifold areas, the plurality of manifold areas are discontinuous, and the plurality of manifold areas respectively correspond to different positions of the chip body, so as to cool different positions of the chip body.

[0009] As a third aspect of the present disclosure, an electronic device is provided, the electronic device comprising a chip component, characterized in that the chip component is the chip component provided by the first aspect of the present disclosure.

[0010] In the chip assembly provided in the present disclosure, each manifold area is provided with a manifold microchannel. The chip body is a heat generating device, and different areas on the chip body generate different amounts of heat. In the present disclosure, the cooling structure includes a plurality of manifold areas, each of which is formed with a manifold microchannel, so that different areas of the chip body can be better cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic diagram of a three-dimensional structure of an embodiment of a chip assembly provided by the present disclosure;

[0012] Figure 2 is an exploded schematic diagram of an embodiment of a chip assembly provided by the present disclosure;

[0013] Figure 3 is a schematic diagram of the flow of a cooling medium in one embodiment of a chip assembly provided by the present disclosure;

[0014] Figure 4 is a bottom view schematic diagram of an embodiment of a cover plate;

[0015] Figure 5 is a top view schematic diagram of an embodiment of a cover plate;

[0016] Figure 6 is a bottom view schematic diagram of one embodiment of a manifold structural plate;

[0017] Figure 7 is a schematic top view of one embodiment of a manifold structural plate;

[0018] Figure 8 It is a three-dimensional structural schematic diagram showing the back side of the chip body;

[0019] Fig. 9 It is a schematic diagram showing the heating area of ​​the chip body;

[0020] Fig.10 is a schematic diagram of one embodiment of a manifold microfluidic channel;

[0021] Fig.11 is a schematic diagram of the flow of cooling medium;

[0022] Fig.12 is a flow chart of an embodiment of the manufacturing method provided by the present disclosure;

[0023] Fig.13 It is a flowchart of an optional implementation of step S120. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the chip assembly provided by the present disclosure, the manufacturing method of the chip assembly and the electronic device including the chip assembly are described in detail below with reference to the accompanying drawings.

[0025] Example embodiments will be described more fully below with reference to the accompanying drawings, but the example embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. On the contrary, the purpose of providing these embodiments is to make the present disclosure thorough and complete and to enable those skilled in the art to fully understand the scope of the present disclosure.

[0026] In the absence of conflict, the various embodiments of the present disclosure and the various features therein may be combined with each other.

[0027] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0028] The terms used herein are only used to describe specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms, unless the context clearly indicates otherwise. It will also be understood that when the terms "comprising" and / or "made of" are used in this specification, the presence of the features, wholes, steps, operations, elements and / or components is specified, but the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof is not excluded.

[0029] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted as having an idealized or overly formal meaning unless explicitly defined as such herein.

[0030] As a first aspect of the present disclosure, a chip assembly is provided, such as Figure 1 As shown, the chip assembly includes a chip body 100 and a cooling structure 200, the cooling structure 200 is arranged on the back of the chip body 100, and the cooling structure 200 includes a manifold structure plate 220. The manifold structure plate 220 includes a plurality of manifold areas 222, the plurality of manifold areas 222 are discontinuous, and the plurality of manifold areas 222 respectively correspond to different positions of the chip body 100, so as to cool different positions of the chip body 100.

[0031] It should be noted that each manifold area 222 is provided with a manifold microchannel. The chip body 100 is a heat generating device, and different areas on the chip body 100 generate different amounts of heat. In the present disclosure, the cooling structure 200 includes a plurality of manifold areas 222, each of which is formed with a manifold microchannel, so that different areas of the chip body 100 can be cooled better.

[0032] In the present disclosure, there is no particular limitation on the specific structure of the cooling structure 200 . Optionally, the cooling structure 200 includes a cover plate 210 and a manifold structure plate 220 that are stacked, and the cooling structure 200 is disposed on the back side of the chip body 100 .

[0033] like Figure 4 As shown, a first medium inlet 211 and a first medium outlet 212 are formed on the cover plate 210 , and both the first medium inlet 211 and the first medium outlet 212 penetrate the cover plate 210 along the thickness direction.

[0034] like Figure 2 , Figure 6 and Figure 7 As shown, a second medium inlet 221, a plurality of manifold areas 222 and at least one second medium outlet 223 are formed on the manifold structure plate 220, each manifold area 222 corresponds to a second medium outlet 223, the second medium inlet 221 penetrates the manifold structure plate 220 along the thickness direction, the second medium outlet 223 penetrates the manifold structure plate 220 along the thickness direction, a manifold type microchannel is formed on the surface of the manifold area 222 facing the chip body 100, the first medium inlet 211 is connected with the second medium inlet 221, and the first medium outlet 212 is connected with the second medium outlet 223.

[0035] The cooling medium flowing in through the second medium inlet 221 flows through the manifold-type microchannels of each manifold area 222 , and flows to the first medium outlet through the second medium outlet 223 corresponding to each manifold area 222 .

[0036] exist Figure 3 In the figure, the black arrows represent the relatively low temperature cooling medium flowing into the cooling structure, and the hollow arrows represent the cooling medium flowing out of the cooling structure after heat exchange. Figure 3 As shown, when the chip assembly is working, a cooling medium (e.g., cooling fluid) is introduced through the first medium inlet 211, and the cooling medium enters the second medium inlet 221 through the first medium inlet 211, and then flows into the manifold microchannels of each manifold area 222 from the second medium inlet 221, and cools the corresponding area of ​​the chip body. After flowing through the manifold area 222, the cooling medium enters the first medium outlet 212 through the second medium outlet 223, and finally flows out from the cooling structure 200, so as to achieve cooling of each area of ​​the chip body 100.

[0037] When manufacturing the chip assembly, the cover plate 210, the manifold structure plate 220, and the chip body 100 can be processed separately, which reduces the processing difficulty.

[0038] In addition, a plurality of manifold areas 222 are provided on the manifold structure plate 220, and the effective length of the manifold microchannel in each manifold area 222 is relatively short, so the pressure drop of the cooling medium when flowing in the cooling structure 200 is also small, and the flow rate of the cooling medium in the cooling structure 200 is more uniform, so that the chip body 100 can be cooled more uniformly. Uniform cooling of the chip body 100 can reduce the occurrence of uneven thermal stress and improve the dimensional accuracy and service life of the chip body.

[0039] In the present disclosure, there is no particular limitation on the specific structure of the manifold structure plate 220 , as long as a manifold-type microchannel can be formed thereon.

[0040] As an optional embodiment, the manifold structure plate 220 includes a plate substrate (not shown), and the manifold area 222 is disposed on the plate substrate, such as Fig.10 As shown, the manifold area 222 includes a plurality of microfluidic units 224 and a plurality of second connecting parts 225, and the second medium inlet 221 penetrates the plate substrate in the thickness direction. That is to say, in the present application, the microfluidic unit 224 and the second connecting part 225 are both part of the manifold area 222. The microfluidic unit 224 is arranged on the surface of the plate substrate facing the chip body 100, and the microfluidic unit 224 includes a first guide part 224a, a second guide part 224b and a first connecting part 224c, and the first end of the first guide part 224a and the first end of the second guide part 224b are connected through the first connecting part 224c. In two adjacent microfluidic units 224, the second guide part 224b of one microfluidic unit 224 is connected to the first guide part 224a of the other microfluidic unit 224 through the corresponding second connecting part 225, and the second connecting part 225 is formed with a main fluid outlet 225a.

[0041] The first guide portion 224a, the first connection portion 224c, the second guide portion 224b and the second connection portion 225 form an "s" shape. The manifold type microfluidic channel includes a first microfluidic channel portion 222a between two adjacent microfluidic channel units 224 and a second microfluidic channel portion 222b between the first guide portion 224a and the second guide portion 224b of the same microfluidic channel unit 224.

[0042] Figure 3The left side of the figure shows a schematic diagram of the flow of cooling medium in the manifold microchannel. The cooling medium with a relatively low temperature first enters the first microchannel section 222a, exchanges heat with the chip body 100, and further flows to the main fluid outlet 225a, and then flows out of the first microchannel section 222a and enters the second microchannel section 222b, and further flows to the second medium outlet 223 with the second microchannel section 222b.

[0043] To further control the flow of the cooling medium in the manifold region 222, optionally, as Figure 6 and Fig.10 As shown, a first guide groove 227 penetrating the first guide groove 224a along the thickness direction is formed at the second end of the first guide portion 224a, an opening of the first guide groove 227 faces the chip body, and a first auxiliary outlet 225b connected to the first guide groove 227 is formed on the second connecting portion 225.

[0044] A second guide groove 228 penetrating the second guide groove 224b along the thickness direction is formed at the second end of the second guide portion 224b, an opening of the second guide groove 228 faces the chip body, and a second auxiliary outlet 225c communicating with the second guide groove 228 is formed on the second connecting portion 225.

[0045] In the embodiment of the present disclosure, the main fluid outlet 225a, the first auxiliary outlet 225b and the second auxiliary outlet 225c correspond to areas with higher heat generation on the chip body. By setting the first auxiliary outlet 225b and the second auxiliary outlet 225c, the flow rate of the cooling medium can be controlled to achieve effective cooling of the areas with higher heat generation.

[0046] In the present disclosure, there is no particular limitation on the number of manifold areas 222 and the specific number of second medium outlets 223. Multiple manifold areas 222 may correspond to one second medium outlet 223, or multiple manifold areas 222 may correspond to multiple second medium outlets 223 one by one.

[0047] like Fig. 9 As shown, in the related art, there are two main heating areas on the chip body, and the two main heating areas 102 are respectively located on both sides of the middle part 101 of the chip body. Figure 2 and Figure 7 As shown in , two manifold areas 222 and two second medium outlets 223 are formed on the manifold structure plate 220 , and the two manifold areas 222 are respectively located on both sides of the second medium inlet 221 .

[0048] It should be noted that the two manifold areas 222 are not connected. Figure 2 , Figure 3 and Figure 6 ,as well as Figure 7In the embodiment shown in FIG. 1 , there is a gap between the two manifold areas 222 , and the second medium inlet 221 is formed at the gap. Also, the width of the second medium inlet 221 is smaller than the width of the manifold area 222 .

[0049] And, in Figure 7 In the embodiment shown in , the second medium inlet 221 is also not located in the middle of the plate substrate, but is located on one side of the plate substrate.

[0050] In the present disclosure, there is no special limitation on the structure of the back side of the chip body 100, as long as it can cooperate with the manifold microchannel to guide the flow of the cooling medium. Figure 2 and Figure 8 As shown, the back of the chip body 100 includes a matching microfluidic area 100a and a plurality of mixed flow areas 130, and the plurality of mixed flow areas 130 correspond to a plurality of second medium outlets 223 one by one. The mixed flow areas 130 are arranged at the periphery of the matching microfluidic area 100a, and the matching microfluidic area 100a is formed with a matching microfluidic channel. After the fluid in the manifold microfluidic channel enters the matching microfluidic channel, heat exchange occurs with the chip body 100. The depth of the matching microfluidic channel is limited. As the cooling medium continuously enters the manifold microfluidic channel, the fluid flows under the guidance of the manifold microfluidic channel, and finally enters the corresponding mixed flow area 130 under the guidance of the manifold microfluidic channel, and after filling the cavity formed by the manifold structure plate 220 and the chip body 100, it enters the corresponding second medium outlet 223 from the mixed flow area 130 under the action of fluid pressure.

[0051] The cooling medium exchanges heat with the chip body 100 through the manifold microchannel and the matching microchannel, and the cooling medium is discharged through the mixed flow area 130 and the second medium outlet 223 .

[0052] The low-temperature cooling medium and the high-temperature cooling medium mix in the mixed flow area 130, so that the temperature of the chip body 100 increases evenly. In addition, the mixed flow area 130 can also reduce the pressure drop of the cooling medium, ensure that the cooling medium can flow out, and promote the circulation of the cooling medium.

[0053] In the present disclosure, the specific structure of the matching microfluidic region is not particularly limited. Figure 2 In the illustrated embodiment, the mating microchannel area 100a includes a middle mating microchannel area 110 and an edge mating microchannel area 120 . The middle mating microchannel area 110 is provided with a plurality of mutually parallel cooling ribs 111 , and the edge mating flow channel area 120 includes a plurality of cooling teeth 121 .

[0054] In the present disclosure, a plurality of cooling teeth 121 are arranged in the edge-matching microfluidic zone 120. Compared with one cooling rib 111, the plurality of cooling teeth 121 arranged in the same row have a larger contact area with the cooling medium. Therefore, an edge-matching microfluidic zone 120 is arranged on the periphery of the middle-matching microfluidic zone 110, which is more suitable for scenarios where the heat generated on the outside of the chip body is higher.

[0055] Through the guidance of the manifold microchannels and the matching microchannels in the matching microchannel area, the cooling medium can better cool the chip.

[0056] exist Fig.11 In the figure, the first microchannel section 222a is connected to the matching microchannel between the second microchannel section 222b and the cooling rib 111. The horizontal arrow and the vertical arrow are both the flow direction of the cooling medium. The cooling medium first enters the first microchannel section 222a and the second microchannel section 222b, and further flows into the matching microchannel between the cooling ribs 111, and flows in the matching microchannel to achieve cooling of the chip. Finally, the cooling medium can flow to the edge matching microchannel area 120 where a plurality of cooling teeth 121 are provided.

[0057] In the present disclosure, the cover plate 210 and the manifold structure plate 220 are sealed together, and the manifold structure plate 220 and the chip body 100 are also sealed together. The cooling medium can only enter the cooling structure 200 through the first medium inlet and flow out of the cooling structure 200 through the first medium outlet.

[0058] As an optional implementation, the interval between two adjacent cooling ribs 111 is between 20 μm and 200 μm; the interval between two adjacent cooling teeth 121 is between 20 μm and 200 μm.

[0059] In the present disclosure, there is no particular limitation on the cross section of the cooling tooth 121. Figure 8 In the embodiment shown in FIG. 1 , the cross section of the cooling tooth 121 is rectangular, but the present disclosure is not limited thereto. For example, the cross section of the cooling tooth 121 may be circular, elliptical, triangular, etc.

[0060] exist Figure 8 In the embodiment shown in , the cross section of the cooling rib 111 is still rectangular, so that the microchannel in the middle of the microchannel zone is a rectangular channel, but the present disclosure is not limited thereto. For example, the shape of the cooling rib 111 can be changed to make the microchannel in the middle of the microchannel zone a wavy channel.

[0061] In the present disclosure, there is no particular limitation on the arrangement of the plurality of cooling teeth 121. Figure 8 In the embodiment shown in FIG. 1 , the plurality of cooling teeth 121 are arranged in a matrix including a plurality of rows and a plurality of columns.

[0062] As an optional implementation, the length direction of the cooling rib 111 intersects with the length direction of the first microchannel portion in the manifold type microchannel, and also intersects with the length direction of the second microchannel portion.

[0063] In order to facilitate the circulation of the cooling medium, optionally, a liquid inlet cavity 213 and a liquid outlet cavity 214 are formed on the surface of the cover plate 210 facing the manifold structure plate 220, the liquid inlet cavity 213 and the liquid outlet cavity 214 are isolated from each other, a first medium inlet 211 is formed on the top wall of the liquid inlet cavity 213, and a first medium outlet 212 is formed on the top wall of the liquid outlet cavity 214.

[0064] like Figure 4 As shown, in order to ensure that the liquid outlet cavity 214 is connected with each second medium outlet, the liquid outlet cavity includes sub-liquid outlet cavities corresponding to the plurality of second medium outlets one by one and a connecting cavity connecting each sub-liquid outlet cavity.

[0065] To facilitate the circulation of the cooling medium, optionally, Figure 1 and Figure 5 As shown, the chip assembly may further include a medium inlet pipe 300 and a medium outlet pipe 400, wherein the medium inlet pipe 300 is disposed in the first medium inlet 211 and the medium outlet pipe 400 is disposed in the first medium outlet 212. When cooling the chip body, the medium inlet pipe 300 is connected to an external inlet medium pipeline, and the medium outlet pipe 400 is connected to an external outlet medium pipeline.

[0066] In the present disclosure, the height of the chip body 100 can be silicon. The material of the cover plate 210 can be silicon or high borosilicate glass material, and the material of the manifold structure plate 220 can be silicon or high borosilicate glass material. The thickness of the chip body 100, the cover plate 210, and the manifold structure plate 220 can be between 1 mm and 3 mm.

[0067] As a second aspect of the present disclosure, a method for manufacturing a chip assembly is provided, wherein: Fig.12 As shown, the manufacturing method comprises:

[0068] In step S110, a chip body is provided;

[0069] In step S120, a cooling structure is provided, wherein the cooling structure is arranged on the back side of the chip body, and the cooling structure includes a manifold structure plate, wherein the manifold structure plate includes a plurality of manifold areas, the plurality of manifold areas are discontinuous, and the plurality of manifold areas respectively correspond to different positions of the chip body, so as to cool different positions of the chip body.

[0070] The chip assembly provided in the first aspect of the present disclosure can be obtained by the manufacturing method provided in the present disclosure. The beneficial effects of the cooling structure in the chip assembly have been described in detail above, and will not be repeated here.

[0071] In the present disclosure, there is no particular limitation on how to provide the cooling structure. As an optional embodiment, Fig.13 As shown, step S120 may include:

[0072] In step S121, an initial cover plate is provided;

[0073] In step S122, a manifold structure plate is provided, on which a second medium inlet, a plurality of manifold areas and a plurality of second medium outlets are formed, the plurality of manifold areas correspond to the plurality of second medium outlets one by one, the second medium inlet penetrates the manifold structure plate along the thickness direction, the second medium outlet penetrates the manifold structure plate along the thickness direction, and a manifold-type microchannel is formed on the surface of the manifold area facing the chip body;

[0074] In step S123, the initial cover plate is connected to the manifold structure plate, and the manifold structure plate is connected to the back side of the chip body, so that the manifold area faces the back side of the chip body;

[0075] In step S124, a first medium inlet and a first medium outlet are formed on the initial cover plate, and the first medium inlet is connected to the second medium inlet, and the first medium outlet is connected to the second medium outlet, so that the cooling medium flowing in through the second medium inlet flows through the manifold microchannels of each manifold area respectively, and flows to the first medium outlet through the second medium outlet corresponding to each manifold area.

[0076] In the above optional implementation of the manufacturing method, the cover plate, the manifold structure plate, and the chip body can be processed separately, thereby reducing the processing cost.

[0077] In the present disclosure, the size of the initial cover plate, the size of the chip body, and the size of the manifold structure plate may be the same.

[0078] After step S124 is completed, the obtained combined structure may be diced.

[0079] In the present disclosure, there is no special limitation on how to connect the cover plate and the manifold structure plate, and how to connect the manifold structure plate and the chip body.

[0080] For example, the cover plate may be connected to the manifold structure plate, and the manifold structure plate may be connected to the chip body by bonding and annealing.

[0081] As an optional implementation, the surface to be connected of the cover plate may be activated, the two surfaces to be connected of the manifold structure plate may be activated, and the back side of the chip body may be activated.

[0082] The activated cover plate, the activated manifold structure plate, and the activated chip body are aligned and then bonded or pre-bonded.

[0083] In the present disclosure, "activation treatment" is not particularly limited. For example, the surface to be activated may be bombarded with plasma-enhanced inert gas, or the surface to be activated may be plated (eg, copper or silver).

[0084] In the present disclosure, the temperature and time of the annealing are not particularly limited. For example, the annealing can be low-temperature annealing, and the annealing temperature does not exceed 400°C.

[0085] It should be pointed out that in the step of providing the chip body, a matching microfluidic zone and multiple mixed flow zones can be formed on the chip body, the multiple mixed flow zones correspond one-to-one to the multiple second medium outlets, the mixed flow zones are arranged on the periphery of the matching microfluidic zone, and the matching microfluidic zone is formed with matching microfluidics.

[0086] In the present disclosure, a matching microchannel area and a plurality of mixed flow areas can be formed on the back side of the chip body by Bosch deep silicon etching.

[0087] In the present disclosure, the manifold microchannel of the manifold structure plate 3 can be formed by large-scale etching processes such as laser etching and plasma etching. Similarly, the first medium inlet and the first medium outlet can be formed on the initial cover plate by large-scale etching processes such as laser etching and plasma etching.

[0088] As a third aspect of the present disclosure, an electronic device is provided, the electronic device comprising a chip component, wherein the chip component is the chip component provided by the first aspect of the present disclosure.

[0089] The working principle and effects of the chip assembly have been described in detail above and will not be repeated here.

[0090] Example embodiments have been disclosed herein, and although specific terms are employed, they are used and should be interpreted only in a general illustrative sense and not for limiting purposes. In some instances, it will be apparent to those skilled in the art that, unless otherwise expressly noted, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments. Therefore, those skilled in the art will appreciate that various changes in form and detail may be made without departing from the scope of the present disclosure as set forth in the appended claims.

Claims

1. A chip assembly, comprising a chip body and a cooling structure, wherein the cooling structure is arranged on the back of the chip body, and the cooling structure comprises a manifold structure plate, characterized in that: The manifold structure plate includes a plurality of manifold areas, the plurality of manifold areas are discontinuous, and the plurality of manifold areas respectively correspond to different positions of the chip body to cool different positions of the chip body.

2. The chip assembly according to claim 1, characterized in that: The cooling structure includes a stacked cover plate and a manifold structure plate, the cooling structure is arranged on the back side of the chip body, a first medium inlet and a first medium outlet are formed on the cover plate, the first medium inlet and the first medium outlet both penetrate the cover plate along the thickness direction, a second medium inlet, a plurality of manifold areas and at least one second medium outlet are formed on the manifold structure plate, each manifold area corresponds to a second medium outlet, the second medium inlet penetrates the manifold structure plate along the thickness direction, the second medium outlet penetrates the manifold structure plate along the thickness direction, a manifold-type microfluidic channel is formed on the surface of the manifold area facing the chip body, the first medium inlet is connected to the second medium inlet, and the first medium outlet is connected to the second medium outlet, wherein the cooling medium flowing in through the second medium inlet flows through the manifold-type microfluidic channels of each manifold area respectively, and flows to the first medium outlet through the second medium outlet corresponding to each manifold area.

3. The chip assembly according to claim 2, characterized in that: The manifold structure plate includes a plate substrate, the manifold area is arranged on the plate substrate, the manifold area includes a plurality of microfluidic units and a plurality of second connecting parts, the second medium inlet penetrates the plate substrate along the thickness direction, the microfluidic unit is arranged on the surface of the plate substrate facing the chip body, the microfluidic unit includes a first guide part, a second guide part and a first connecting part, the first end of the first guide part and the first end of the second guide part are connected through the first connecting part, and in two adjacent microfluidic units, the second end of the second guide part of one microfluidic unit is connected to the second end of the first guide part of the other microfluidic unit through the corresponding second connecting part; a main fluid outlet is formed on the second connecting part.

4. The chip assembly according to claim 3, characterized in that: A first guide groove penetrating the first guide groove along the thickness direction is formed at the second end of the first guide portion, an opening of the first guide groove faces the chip body, and a first auxiliary outlet communicating with the first guide groove is formed on the second connecting portion; A second guide groove penetrating the second guide groove along the thickness direction is formed at the second end of the second guide portion, an opening of the second guide groove faces the chip body, and a second auxiliary outlet communicating with the second guide groove is formed on the second connecting portion.

5. The chip assembly according to claim 2, characterized in that: Two manifold areas and two second medium outlets are formed on the manifold structure plate, and the two manifold areas are respectively located on both sides of the second medium inlet.

6. The chip assembly according to any one of claims 2 to 5, characterized in that: The back side of the chip body includes a matching microchannel area and a plurality of mixed flow areas, the plurality of mixed flow areas correspond to a plurality of second medium outlets one by one, the mixed flow areas are arranged at the periphery of the matching microchannel area, and the matching microchannel area is formed with matching microchannels; wherein, The fluid in the manifold microfluidic channel enters the corresponding mixing zone through the matching microfluidic channel, and enters the corresponding second medium outlet from the mixing zone.

7. The chip assembly according to claim 6, characterized in that: The matching micro-channel area includes a middle matching micro-channel area and an edge matching micro-channel area. The middle matching micro-channel area is provided with a plurality of cooling ribs parallel to each other, and the edge matching flow channel area includes a plurality of cooling teeth.

8. The chip assembly according to claim 7, characterized in that: The interval between two adjacent cooling ribs is between 20 μm and 200 μm; the interval between two adjacent cooling teeth is between 20 μm and 200 μm.

9. The chip assembly according to any one of claims 2 to 5, characterized in that: A liquid inlet cavity and a liquid outlet cavity are formed on the surface of the cover plate facing the manifold structure plate, the liquid inlet cavity and the liquid outlet cavity are isolated from each other, the first medium inlet is formed on the top wall of the liquid inlet cavity, and the first medium outlet is formed on the top wall of the liquid outlet cavity.

10. A method for manufacturing a chip assembly, characterized in that: The manufacturing method comprises: Providing a chip body; A cooling structure is provided, wherein the cooling structure is arranged on the back side of the chip body, and the cooling structure includes a manifold structure plate, wherein the manifold structure plate includes a plurality of manifold areas, the plurality of manifold areas are discontinuous, and the plurality of manifold areas respectively correspond to different positions of the chip body, so as to cool different positions of the chip body.

11. The manufacturing method according to claim 10, characterized in that: The providing of the cooling structure comprises: Provide initial cover; A manifold structure plate is provided, wherein a second medium inlet, a plurality of manifold areas and a plurality of second medium outlets are formed on the manifold structure plate, the plurality of manifold areas correspond to the plurality of second medium outlets one by one, the second medium inlet penetrates the manifold structure plate along the thickness direction, the second medium outlet penetrates the manifold structure plate along the thickness direction, and a manifold-type microchannel is formed on the surface of the manifold area facing the chip body; Connecting the initial cover plate to the manifold structure plate, and connecting the manifold structure plate to the back side of the chip body, so that the manifold area faces the back side of the chip body; A first medium inlet and a second medium outlet are formed on the initial cover plate, the first medium inlet is connected to the second medium inlet, and the first medium outlet is connected to the second medium outlet, so that the cooling medium flowing in through the second medium inlet flows through the manifold microchannels of each manifold area respectively, and flows to the first medium outlet through the second medium outlet corresponding to each manifold area.

12. An electronic device, comprising a chip assembly, characterized in that: The chip assembly is the chip assembly according to any one of claims 1 to 9.

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