Image sensor packaging structure and image sensor packaging method

Abstract

The invention discloses an image sensor packaging structure and an image sensor packaging method, and belongs to the technical field of chip packaging, the structure comprises a substrate, an image sensor chip, a frame and a light-transmitting part; the image sensor chip is fixed on the first surface of the substrate and is electrically connected with the substrate; the frame is fixed on the first surface of the substrate, is positioned between the image sensor chip and the edge of the substrate, and surrounds the image sensor chip; the light-transmitting part is located on the side, away from the substrate, of the image sensor chip and fixedly connected with the surface of the side, away from the substrate, of the frame. A circle of frame is additionally arranged on the periphery of the image sensor chip, so that the packaging limitation is expanded to the maximum extent, and the current vehicle gauge level requirement can be met; the frame is arranged between the image sensor chip and the edge of the substrate, so that a gap between the frame and the image sensor chip is reduced, and the reliability of the packaging structure is improved; and the light-transmitting part is arranged on the frame, so that the badness caused by traditional packaging is avoided, and the packaging yield is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to an image sensor packaging structure and an image sensor packaging method. Background Art

[0002] Existing image sensors are usually packaged using the iBGA (image mold BGA, image sensing module packaging technology) packaging method. The existing iBGA packaging method in the industry is to apply glue on the surface of the image sensor chip and attach glass to the surface of the image sensor chip to complete the packaging. The disadvantage of this method is that there are requirements for the width of the non-imaging area of ​​the image sensor chip. If it is too narrow, the traditional iBGA packaging method cannot be used. However, automotive-grade image sensor chips pursue a larger imaging area in chip design, and the non-imaging area is narrow or there is no reserved chip packaging. Therefore, the traditional iBGA packaging method will be limited in some automotive-grade image sensor packaging. In addition, since this method requires glue to be applied to the surface of the image sensor chip, once the glue is broken during the application, the glue will overflow into the imaging area, causing defects. Summary of the invention

[0003] The purpose of the present invention is to provide an image sensor packaging structure and an image sensor packaging method, so as to meet the current automotive-grade requirements and achieve high-reliability packaging of the image sensor.

[0004] To achieve the above-mentioned object, the present invention provides an image sensor packaging structure, comprising: a substrate, an image sensor chip, a frame and a light-transmitting member;

[0005] The image sensor chip is fixed on the first surface of the substrate and is electrically connected to the substrate;

[0006] The frame is fixed on the first surface of the substrate, is located between the image sensor chip and the edge of the substrate, and surrounds the image sensor chip;

[0007] The light-transmitting member is located on a side of the image sensor chip away from the substrate, and is fixedly connected to a surface of a side of the frame away from the substrate.

[0008] Optionally, the image sensor chip comprises a substrate; an imaging area on the surface of the substrate is provided with an integrated circuit structure and a sensor in sequence along a thickness direction; a non-imaging area on the surface of the substrate is provided with a wire bonding spot;

[0009] A wire bonding pad is disposed on the first surface of the substrate; the wire bonding point and the wire bonding pad are electrically connected through a wire.

[0010] Optionally, the frame is located between the image sensor chip and the wire bonding pad; and the height of the frame is lower than the height of the wire.

[0011] Optionally, a connecting piece is provided on a surface of a side of the frame facing away from the substrate; the height of the connecting piece exceeds the height of the wire and is not lower than the height of the image sensor chip; the wire passes through the connecting piece;

[0012] The light-transmitting member is fixedly connected to a surface of a side of the frame facing away from the substrate through the connecting member.

[0013] Optionally, a filling piece is disposed on the first surface of the substrate between the frame and the image sensor chip; the filling piece fills the gap between the frame and the image sensor chip; and the filling piece and the connecting piece are an integrated component.

[0014] Optionally, a welding pad is disposed on the second surface of the substrate; a solder ball is disposed on a surface of the welding pad on a side facing away from the substrate;

[0015] The substrate is provided with a through hole; a conductive member is provided in the through hole; the wire bonding pad and the welding pad are electrically connected through the conductive member.

[0016] Optionally, a packaging piece is disposed on the first surface of the substrate between the frame and the edge of the substrate; the packaging piece surrounds the frame; and the height of the packaging piece does not exceed the height of the light-transmitting piece.

[0017] To achieve the above object, the present invention further provides an image sensor packaging method, comprising:

[0018] fixing the image sensor chip on the first surface of the substrate;

[0019] A frame is fixed to the first surface of the substrate between the image sensor chip and the edge of the substrate; the frame surrounds the image sensor chip;

[0020] electrically connecting the image sensor chip and the substrate;

[0021] The light-transmitting member and the surface of the frame on one side facing away from the substrate are fixedly connected to obtain an image sensor packaging structure; the light-transmitting member is located on the side of the image sensor chip facing away from the substrate.

[0022] Optionally, electrically connecting the image sensor chip and the substrate includes:

[0023] The wire bonding points of the image sensor chip and the wire bonding pads of the substrate are connected by wires; the image sensor chip comprises a substrate; an imaging area on the surface of the substrate is provided with an integrated circuit structure and a sensor in sequence along a thickness direction; the wire bonding points are provided in a non-imaging area on the surface of the substrate; and the wire bonding pads are provided on the first surface of the substrate;

[0024] Accordingly, fixing the frame on the first surface of the substrate between the image sensor chip and the edge of the substrate includes:

[0025] The frame is fixed to the first surface of the substrate between the image sensor chip and the wire bonding pad; the height of the frame is lower than the height of the wire;

[0026] Correspondingly, the step of fixing the light-transmitting member and the surface of the frame on one side facing away from the substrate comprises:

[0027] An integrated component is arranged on a side surface of the frame away from the substrate and on a first surface of the substrate between the frame and the image sensor chip; the integrated component comprises a connector and a filler; the height of the connector exceeds the height of the wire and is not less than the height of the image sensor chip; the wire runs through the connector; and the filler fills the gap between the frame and the image sensor chip;

[0028] The light-transmitting member is placed on the surface of the connecting member, so that the light-transmitting member is fixedly connected to a surface of a side of the frame facing away from the substrate through the connecting member.

[0029] Optionally, after the light-transmitting member is fixedly connected to a surface of the frame on a side facing away from the substrate, the method further comprises:

[0030] forming a dam around the substrate; the dam surrounds the edge of the substrate;

[0031] A packaging member is formed on the first surface of the substrate between the frame and the dam, and the dam is removed; the packaging member surrounds the frame; and the height of the packaging member does not exceed the height of the light-transmitting member.

[0032] An image sensor packaging structure provided by the present invention comprises: a substrate, an image sensor chip, a frame and a light-transmitting member; the image sensor chip is fixed on a first surface of the substrate and is electrically connected to the substrate; the frame is fixed on the first surface of the substrate and is located between the image sensor chip and an edge of the substrate and surrounds the image sensor chip; the light-transmitting member is located on a side of the image sensor chip away from the substrate and is fixedly connected to a side surface of the frame away from the substrate.

[0033] Obviously, the present invention expands the packaging limit of the image sensor chip to the maximum extent by adding a circle of frame around the periphery of the image sensor chip, and can meet the current automotive grade requirements; moreover, the frame is arranged between the edge of the image sensor chip and the substrate, reducing the gap between the frame and the image sensor chip, and improving the reliability of the image sensor packaging structure; at the same time, the light-transmitting member is arranged on the frame, avoiding the defects caused by the traditional packaging directly applying glue to the surface of the image sensor chip, and improving the packaging yield. The present invention also provides an image sensor packaging method, by which the above-mentioned image sensor packaging structure can be obtained, so it also has the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0035] Figure 1 A schematic diagram of an image sensor packaging structure provided by an embodiment of the present invention;

[0036] Figure 2 A flowchart of an image sensor packaging method provided by an embodiment of the present invention;

[0037] Figures 3 to 11 A schematic diagram of a process of an image sensor packaging method provided by an embodiment of the present invention.

[0038] The following are the descriptions of the reference numerals:

[0039] 1-substrate; 10-chip pasting area; 11-wire bonding pad; 111-gold finger; 12-soldering pad; 13-solder ball; 131-tin ball; 141-metal pillar; 2-image sensor chip; 21-substrate; 22-integrated circuit structure; 23-sensor; 24-wire bonding point; 241-metal solder point; 3-frame; 4-light-transmitting part; 41-glass; 5-conductor wire; 51-metal wire; 6-integrated component; 61-UV glue; 7-packaging; 70-glue dispensing position; 71-encapsulation glue; 8-dam; 9-image sensor wafer. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] Please refer to Figure 1 , an image sensor packaging structure provided by an embodiment of the present invention may include: a substrate 1, an image sensor chip 2, a frame 3 and a light-transmitting member 4;

[0042] The image sensor chip 2 is fixed on the first surface of the substrate 1 and is electrically connected to the substrate 1;

[0043] The frame 3 is fixed on the first surface of the substrate 1 and is located between the image sensor chip 2 and the edge of the substrate 1 and surrounds the image sensor chip 2;

[0044] The light-transmitting member 4 is located on a side of the image sensor chip 2 facing away from the substrate 1 , and is fixedly connected to a surface of the frame 3 facing away from the substrate 1 .

[0045] The present embodiment does not limit the specific type of the substrate 1, and the substrate 1 may be, but is not limited to, an organic substrate. An organic substrate is a substrate 1 prepared from an organic material. The present embodiment does not limit the specific type of the frame 3, and the frame 3 may be, but is not limited to, an organic frame. An organic frame is a frame 3 prepared from an organic material.

[0046] The present embodiment does not limit the specific method of fixing the frame 3 and the substrate 1, as long as the frame 3 can be fixed on the surface of the substrate 1, for example, the frame 3 and the substrate 1 can be connected by gluing. The present embodiment does not limit the specific method of gluing the frame 3 and the substrate 1, as long as the frame 3 can be gluing on the surface of the substrate 1, for example, the frame 3 and the substrate 1 can be connected by gluing with common chip gluing glue or adhesive film.

[0047] The present embodiment does not limit the specific method of fixing and connecting the image sensor chip 2 and the substrate 1, as long as it is ensured that the image sensor chip 2 can be fixed on the surface of the substrate 1, for example, the first surface of the substrate 1 can be provided with a chip pasting area; in the chip pasting area, the image sensor chip 2 and the substrate 1 can be pasted and connected. The present embodiment does not limit the specific method of pasting and connecting the image sensor chip 2 and the substrate 1, as long as it is ensured that the image sensor chip 2 can be pasted on the surface of the substrate 1, for example, the image sensor chip 2 and the substrate 1 can be pasted and connected by using a common chip pasting glue or film.

[0048] The present embodiment does not limit the specific structure of the image sensor chip 2, as long as it can realize the image sensing function, for example, the image sensor chip 2 may include a substrate; the imaging area on the surface of the substrate may be sequentially provided with an integrated circuit structure and a sensor along the thickness direction; the non-imaging area on the surface of the substrate may be provided with a wire bonding pad 24. The present embodiment does not limit the specific type of the wire bonding pad 24, as long as it has conductivity, for example, the wire bonding pad 24 may be a metal bonding pad.

[0049] The present embodiment does not limit the specific manner in which the image sensor chip 2 and the substrate 1 are electrically connected, as long as the image sensor chip 2 and the substrate 1 can be electrically connected. For example, the first surface of the substrate 1 may be provided with a wire bonding pad 11; the wire bonding pad 24 and the wire bonding pad 11 may be electrically connected through the wire 5. The present embodiment does not limit the specific type of the wire bonding pad 11, as long as it is conductive, for example, the wire bonding pad 11 may be a gold finger. The present embodiment does not limit the specific type of the wire 5, as long as it is conductive, for example, the wire 5 may be a metal wire such as a gold wire, a silver wire, a copper wire or an alloy wire.

[0050] Furthermore, in the present embodiment, a welding pad may be provided on the second surface of the substrate 1; a solder ball 13 may be provided on the side surface of the welding pad facing away from the substrate 1; the substrate 1 may be provided with a through hole; a conductive member may be provided in the through hole; the wire bonding pad 11 and the welding pad may be electrically connected through the conductive member. The present embodiment does not limit the specific type of the conductive member, as long as it has conductivity, for example, the conductive member may be a metal column. The present embodiment does not limit the specific type of the solder ball 13, as long as it has conductivity, for example, the solder ball 13 may be a tin ball. It should be noted that in the present embodiment, by providing welding pads and solder balls 13 on the lower surface of the substrate 1, it is possible to facilitate electrical connection with the motherboard. In addition, the present embodiment may also directly provide a plurality of solder balls 13 on the second surface of the substrate 1 to fix the substrate 1 on the surface of the motherboard.

[0051] Furthermore, the frame 3 in this embodiment can be located between the image sensor chip 2 and the wire bonding pad 11; the height of the frame 3 can be lower than the height of the wire 5. It should be noted that in this embodiment, the frame 3 is arranged between the image sensor chip 2 and the wire bonding pad 11, which can further reduce the gap between the frame 3 and the image sensor chip 2, thereby further improving the reliability of the image sensor packaging structure. In this embodiment, one end of the wire 5 is connected to the wire bonding pad 24, and because the height of the frame 3 is lower than the height of the wire 5, the other end of the wire 5 can cross the frame 3 and connect to the wire bonding pad 11.

[0052] This embodiment does not limit the specific type of the light-transmitting member 4, as long as it can play a role of light transmission and protection, for example, the light-transmitting member 4 can be glass. This embodiment does not limit the specific way of fixing the light-transmitting member 4 and the frame 3, as long as it can ensure that the light-transmitting member 4 can be fixed on the surface of the frame 3, for example, a connector can be provided on the side surface of the frame 3 away from the substrate 1; the height of the connector can exceed the height of the wire 5 and is not less than the height of the image sensor chip 2; the wire 5 can pass through the connector; the light-transmitting member 4 can be fixedly connected to the side surface of the frame 3 away from the substrate 1 through the connector. This embodiment does not limit the specific type of the connector, as long as it can ensure that the light-transmitting member 4 and the frame 3 can be fixedly connected, for example, the connector can be a UV (Ultraviolet) glue layer. The UV glue layer is formed by UV glue after curing by ultraviolet rays. It should be noted that in this embodiment, the height of the connector exceeds the height of the wire 5 crossing the frame 3, and the light-transmitting member 4 is fixed on the frame 3 through the connector to form a closed cavity, which can prevent the light-transmitting member 4 from sinking and touching the wire 5. The wire 5 passes through the connecting piece, and the connecting piece can support and fix the wire 5, thereby improving the reliability of the image sensor packaging structure.

[0053] Furthermore, in the present embodiment, a filler may be provided on the first surface of the substrate 1 between the frame 3 and the image sensor chip 2; the filler may fill the gap between the frame 3 and the image sensor chip 2. The present embodiment does not limit the specific type of the filler, as long as it can fill the gap between the frame 3 and the image sensor chip 2. For example, the filler may be a UV adhesive layer. Furthermore, in the present embodiment, the filler and the connector may be an integrated component 6; the integrated component 6 may be, but is not limited to, a UV adhesive layer. It should be noted that in the present embodiment, a filler is provided on the first surface of the substrate 1 between the frame 3 and the image sensor chip 2 so that the filler completely fills the gap between the frame 3 and the image sensor chip 2. This can eliminate the gap between the frame 3 and the image sensor chip 2, and further improve the reliability of the image sensor packaging structure.

[0054] Furthermore, in the present embodiment, a packaging member 7 may be provided on the first surface of the substrate 1 between the frame 3 and the edge of the substrate 1; the packaging member 7 may surround the frame 3; and the height of the packaging member 7 may not exceed the height of the light-transmitting member 4. The present embodiment does not limit the specific type of the packaging member 7, as long as it can play a sealing role, for example, the packaging member 7 may be a packaging glue layer. The packaging glue layer is formed after the packaging glue is baked and cured. It should be noted that the packaging member 7 in the present embodiment can cover the side of the light-transmitting member 4, the part of the wire 5 after crossing the frame 3, and the first surface of the substrate 1 between the frame 3 and the edge of the substrate 1, and can further protect the image sensor chip 2, the wire 5 and the substrate 1, thereby improving the reliability of the image sensor packaging structure.

[0055] Based on the above embodiments, the present invention maximizes the packaging limitations of the image sensor chip by adding a circle of frame around the periphery of the image sensor chip, which can meet the current automotive-grade requirements; moreover, the frame is arranged between the edge of the image sensor chip and the substrate, which reduces the gap between the frame and the image sensor chip and improves the reliability of the image sensor packaging structure; at the same time, the light-transmitting member is arranged on the frame, which avoids the defects caused by the traditional packaging of directly applying glue on the surface of the image sensor chip, thereby improving the packaging yield.

[0056] Please refer to Figure 2 , a flowchart of an image sensor packaging method provided by an embodiment of the present invention may include:

[0057] S101: Fixing an image sensor chip on a first surface of a substrate.

[0058] It should be noted that, before step S101, the present embodiment needs to provide an image sensor chip and a substrate. The present embodiment does not limit the specific types and structures of the image sensor chip and substrate provided, and the above description of the image sensor chip and substrate can be referred to, which will not be repeated here.

[0059] This embodiment does not limit the specific method of providing the image sensor chip, for example, the following method may be used:

[0060] An image sensor wafer is provided, wherein the image sensor wafer may include a substrate; an imaging area on the surface of the substrate may be provided with an integrated circuit structure and a sensor in sequence along a thickness direction; and a non-imaging area on the surface of the substrate may be provided with a wire bonding spot;

[0061] The wafer thinning technology is used to grind the substrate surface of the image sensor wafer to remove a certain thickness; the substrate surface is the side corresponding to the sensor and integrated circuit structure;

[0062] Cut the image sensor wafer into individual image sensor chips.

[0063] This embodiment does not limit the specific method of cutting the image sensor wafer, as long as it can be cut into single image sensor chips. For example, the image sensor wafer can be cut into single image sensor chips using a blade or laser processing technology.

[0064] This embodiment does not limit the specific method of fixing the image sensor chip on the first surface of the substrate, as long as it is ensured that the image sensor chip can be fixed on the surface of the substrate, for example, the image sensor chip can be placed in the chip bonding area of ​​the first surface of the substrate, and the image sensor chip and the substrate can be bonded and connected. This embodiment does not limit the specific method of bonding the image sensor chip and the substrate, as long as it is ensured that the image sensor chip can be bonded to the surface of the substrate, for example, the image sensor chip and the substrate can be bonded and connected by using commonly used chip bonding glue or adhesive film.

[0065] S102: fixing a frame on a first surface of the substrate between the image sensor chip and an edge of the substrate; the frame surrounds the image sensor chip.

[0066] It should be noted that, in this embodiment, before step S102, a framework needs to be provided first. This embodiment does not limit the specific type and structure of the provided framework, and the above description of the framework can be referred to, which will not be repeated here.

[0067] This embodiment does not limit the specific method of fixing the frame to the first surface of the substrate, as long as the frame can be fixed to the surface of the substrate, for example, the frame and the substrate can be glued together. This embodiment does not limit the specific method of gluing the frame and the substrate, as long as the frame can be glued to the surface of the substrate, for example, the frame and the substrate can be glued together using commonly used chip gluing glue or adhesive film.

[0068] S103: electrically connecting the image sensor chip and the substrate.

[0069] This embodiment does not limit the specific method of electrically connecting the image sensor chip and the substrate, as long as it can ensure that the image sensor chip and the substrate can be electrically connected, for example, when the image sensor chip includes a substrate; the imaging area on the surface of the substrate is sequentially provided with an integrated circuit structure and a sensor along the thickness direction; the non-imaging area on the surface of the substrate is provided with a wire bonding spot; and the first surface of the substrate is provided with a wire bonding pad, a wire can be used to connect the wire bonding spot of the image sensor chip and the wire bonding pad of the substrate. This embodiment does not limit the specific types of wire bonding spots, wire bonding pads, and wires. You can refer to the above description of wire bonding spots, wire bonding pads, and wires, which will not be repeated here.

[0070] Accordingly, step S102 in this embodiment may include: fixing a frame on the first surface of the substrate between the image sensor chip and the wire bonding pad; the height of the frame is lower than the height of the wire.

[0071] It should be noted that in this embodiment, the frame is arranged between the image sensor chip and the wire bonding pad, which can further reduce the gap between the frame and the image sensor chip, thereby further improving the reliability of the image sensor packaging structure. In this embodiment, one end of the wire is connected to the wire bonding pad, and because the height of the frame is lower than the height of the wire, the other end of the wire can cross the frame and connect to the wire bonding pad.

[0072] Accordingly, step S104 in this embodiment may include:

[0073] A connecting piece is arranged on a surface of a side of the frame away from the substrate; the height of the connecting piece exceeds the height of the wire and is not less than the height of the image sensor chip; the wire runs through the connecting piece;

[0074] The light-transmitting member is placed on the surface of the connecting member, so that the light-transmitting member is fixedly connected to the surface of the side of the frame facing away from the substrate through the connecting member.

[0075] It should be noted that in this embodiment, the height of the connector exceeds the height of the wire crossing the frame, and the light-transmitting member is fixed to the frame through the connector to form a closed cavity, which can prevent the light-transmitting member from sinking and touching the wire. The wire passes through the connector, and the connector can support and fix the wire, thereby improving the reliability of the image sensor packaging structure.

[0076] This embodiment does not limit the specific type of the connecting member, as long as it can ensure that the light-transmitting member and the frame can be fixedly connected. For example, the connecting member can be a UV adhesive layer.

[0077] When the connecting member is a UV adhesive layer, correspondingly, the connecting member is arranged on a surface of the frame facing away from the substrate, which may include:

[0078] Apply UV glue on the surface of the frame facing away from the substrate;

[0079] Accordingly, placing the light-transmitting member on the surface of the connecting member so that the light-transmitting member is fixedly connected to a surface of a side of the frame facing away from the substrate through the connecting member may include:

[0080] The light-transmitting component is placed on the surface of the UV glue, and the UV glue is cured by ultraviolet rays to form a UV glue layer as a connecting piece to fix the position of the light-transmitting component, so that the light-transmitting component is attached to the surface of the frame on one side away from the substrate.

[0081] Furthermore, this embodiment may further include: disposing a filling member on the first surface of the substrate between the frame and the image sensor chip; the filling member may fill the gap between the frame and the image sensor chip.

[0082] It should be noted that, in this embodiment, a filling piece is provided on the first surface of the substrate between the frame and the image sensor chip so that the filling piece completely fills the gap between the frame and the image sensor chip. This can eliminate the gap between the frame and the image sensor chip, thereby further improving the reliability of the image sensor packaging structure.

[0083] The present embodiment does not limit the specific type of the filling member, as long as it can fill the gap between the frame and the image sensor chip. For example, the filling member may be a UV adhesive layer.

[0084] When the filling member is a UV adhesive layer, accordingly, the filling member is provided on the first surface of the substrate between the frame and the image sensor chip, which may include:

[0085] UV glue is coated on the first surface of the substrate between the frame and the image sensor chip, so that the UV glue fills the gap between the frame and the image sensor chip, and the UV glue is cured by ultraviolet rays to form a UV glue layer as a filling member.

[0086] Furthermore, in this embodiment, the filling piece and the connecting piece may be an integrated component; the integrated component may be, but is not limited to, a UV adhesive layer.

[0087] When the filling member and the connecting member are an integrated component, accordingly, step S104 in this embodiment may include:

[0088] An integrated component is arranged on a side surface of the frame facing away from the substrate and on a first surface of the substrate between the frame and the image sensor chip; the integrated component includes a connector and a filler; the height of the connector exceeds the height of the wire and is not less than the height of the image sensor chip; the wire runs through the connector; and the filler fills the gap between the frame and the image sensor chip;

[0089] The light-transmitting member is placed on the surface of the connecting member, so that the light-transmitting member is fixedly connected to the surface of the side of the frame facing away from the substrate through the connecting member.

[0090] When the integrated component is a UV adhesive layer, correspondingly, the integrated component is arranged on a side surface of the frame facing away from the substrate and on a first surface of the substrate between the frame and the image sensor chip, which may include:

[0091] Apply UV glue on the surface of the frame facing away from the substrate, and fill the gap between the frame and the image sensor chip with the UV glue;

[0092] Accordingly, placing the light-transmitting member on the surface of the connecting member so that the light-transmitting member is fixedly connected to a surface of a side of the frame facing away from the substrate through the connecting member may include:

[0093] The light-transmitting component is placed on the surface of the UV glue, and the UV glue is cured by ultraviolet rays to form a UV glue layer to fix the position of the light-transmitting component, so that the light-transmitting component is attached to the surface of the side of the frame away from the substrate; the UV glue layer is an integrated component.

[0094] S104: The light-transmitting member is fixedly connected to a surface of a side of the frame facing away from the substrate to obtain an image sensor packaging structure; the light-transmitting member is located on a side of the image sensor chip facing away from the substrate.

[0095] This embodiment does not limit the specific type of the light-transmitting member. Please refer to the above description of the light-transmitting member, which will not be repeated here.

[0096] Furthermore, after the light-transmitting member is fixedly connected to the surface of the frame on one side facing away from the substrate, the present embodiment may further include:

[0097] forming a dam around the substrate; the dam surrounds an edge of the substrate;

[0098] A packaging member is formed on the first surface of the substrate between the frame and the dam, and the dam is removed; the packaging member surrounds the frame; and the height of the packaging member does not exceed the height of the light-transmitting member.

[0099] It should be noted that the packaging in this embodiment can cover the side of the light-transmitting member, part of the wires across the frame, and the first surface of the substrate between the frame and the edge of the substrate, and can further protect the image sensor chip, wires and substrate, thereby improving the reliability of the image sensor packaging structure.

[0100] The present embodiment does not limit the specific type of the dam, as long as it can play a blocking role, for example, the dam can be a UV adhesive layer.

[0101] When the dam is a UV adhesive layer, accordingly, forming the dam around the substrate may include:

[0102] UV glue is coated around the substrate, and the UV glue is cured by ultraviolet light to form a UV glue layer as a dam.

[0103] Furthermore, in order to ensure that the formed package can completely cover the side of the light-transmitting member and the part of the wires behind the frame, the height of the dam in this embodiment can be higher than the height of the light-transmitting member.

[0104] The present embodiment does not limit the specific type of the packaging member, as long as it can play a sealing role, for example, the packaging member can be a packaging adhesive layer.

[0105] When the packaging element is a packaging adhesive layer, correspondingly, forming the packaging element on the first surface of the substrate between the frame and the dam may include:

[0106] The packaging glue is poured between the frame and the dam, and after the glue pouring is completed, the packaging glue is baked and cured to form a packaging glue layer as a packaging piece.

[0107] The above-mentioned method for forming a package is applicable to a substrate having an image sensor chip disposed thereon. Furthermore, in order to improve packaging efficiency, the present embodiment may be provided with a plurality of image sensor chips arranged in an array on a substrate. This structure may adopt the following method for forming a package:

[0108] forming a dam around the substrate; the dam surrounds an edge of the substrate;

[0109] A packaging member is formed on the first surface of the substrate between the frame and the dam, and on the first surface of the substrate between adjacent frames, and the dam is removed; the packaging member surrounds the frame; and the height of the packaging member does not exceed the height of the light-transmitting member;

[0110] After removing the dam, the substrate is cut into individual image sensor package structures.

[0111] When the packaging element is a packaging adhesive layer, correspondingly, the first surface of the substrate between the frame and the dam and the first surface of the substrate between adjacent frames form the packaging element, which may include:

[0112] Packaging glue is poured between the frame and the dam, and between adjacent frames. After the glue pouring is completed, the packaging glue is baked and cured to form a packaging glue layer as a packaging piece.

[0113] It should be noted that, in this method, before forming the package, each image sensor chip can be packaged using the above-mentioned packaging method, which will not be described in detail here.

[0114] Furthermore, after the light-transmitting member is fixedly connected to the surface of the frame on one side facing away from the substrate, the present embodiment may further include:

[0115] A through hole is provided on the substrate, and a conductive member is formed in the through hole;

[0116] A welding pad is arranged on the second surface of the substrate; the wire bonding pad and the welding pad are electrically connected via a conductive member;

[0117] Printing flux and placing solder balls on the surface of the solder pad facing away from the substrate;

[0118] After passing through a reflow oven, the solder balls and solder pads are combined.

[0119] It should be noted that in this embodiment, by providing solder pads and solder balls on the lower surface of the substrate, it is possible to facilitate electrical connection with the motherboard.

[0120] This embodiment does not limit the specific types of the conductive member and the solder ball. Please refer to the above description about the conductive member and the solder ball, which will not be repeated here.

[0121] Based on the above embodiments, the above image sensor packaging structure can be obtained, so it also has the above beneficial effects.

[0122] The following is a specific example to illustrate the above image sensor packaging process. Please refer to Figures 3 to 11 , the process is as follows:

[0123] 1. Provide an image sensor wafer 9, such as Figure 3 As shown, there is a substrate 21, and the upper surface of the substrate 21 has a sensor 23, a metal pad 241 and an integrated circuit structure 22;

[0124] First, the substrate surface of the image sensor wafer 9 (the surface corresponding to the sensor 23 and the integrated circuit structure 22) is ground by using wafer thinning technology to remove a certain thickness;

[0125] 2. Cut the image sensor wafer 9 into individual image sensor chips 2 using a blade. Figure 4 As shown; laser processing and other technologies may also be used to cut and divide the image sensor wafer 9;

[0126] 3. Provide a substrate 1, such as Figure 5 As shown, the substrate 1 has two surfaces, the upper surface has a chip pasting area 10, and has a gold finger 111 of the substrate 1 for electrical connection, and the lower surface is provided with a welding pad 12, and the two pads are interconnected inside the substrate 1 through a metal column 141; the image sensor chip 2 of step 2 is placed in the chip pasting area 10 on the substrate 1, as shown in FIG. Figure 6 As shown, the substrate 1 and the image sensor chip 2 are adhered to each other by using a common chip adhesive glue or adhesive film to fix the image sensor chip 2; the material of the substrate 1 is not limited, and an organic substrate is preferred;

[0127] 4. Provide a frame 3. The material of the frame 3 is not limited, and an organic frame is preferred. Fix the frame 3 to the substrate 1 between the image sensor chip 2 and the gold finger 111 by using a common chip adhesive glue or adhesive film, such as Figure 7 As shown;

[0128] 5. Connect the metal wire 51, using metal materials such as gold wire / silver wire / copper wire / alloy wire to connect the metal pad 241 of the image sensor chip 2 and the gold finger 111 of the substrate 1, such as Figure 8 As shown, the electrical connection between the image sensor chip 2 and the substrate 1 is achieved;

[0129] 6. Apply UV glue 61 on the frame 3. The height of the UV glue 61 needs to be higher than the height of the metal wire 51 across the frame 3. The UV glue 61 fills the gap between the frame 3 and the image sensor chip 2. Then, attach the glass 41 to the frame 3. Fig. 9 As shown, the UV glue 61 is cured by ultraviolet rays, and the position of the glass 41 is fixed; the sealed cavity prevents the glass 41 from sinking and touching the metal wire 51;

[0130] 7. Use UV glue to form a dam 8 around the substrate 1. The height of the dam 8 can be higher than the surface of the glass 41. After the dam 8 is formed, fix the position by ultraviolet irradiation. After the dam 8 is completed, fill the glue dispensing position 70 (between the frame 3 and the dam 8, and between adjacent frames 3) with encapsulation glue 71. Fig.10 As shown; the encapsulation glue 71 should cover the side of the glass 41, the metal wire 51 and the substrate 1, and the height should not exceed the upper surface of the glass 41; after the glue is poured, the encapsulation glue 71 is baked and cured;

[0131] 8. After the cured joint board is printed with flux and ball implantation on the wire bonding pad 11, it passes through a reflow oven, and the solder ball 131 is combined with the wire bonding pad 11. Fig.11 As shown;

[0132] 9. The solidified joint board is cut into single finished products.

[0133] The principles and implementation methods of the present invention are described herein using specific examples, and the various embodiments are in a progressive relationship. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. For those of ordinary skill in the art, without departing from the principle of the present invention, the present invention can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the present invention.

[0134] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

Claims

1. An image sensor packaging structure, characterized in that: include: Substrate, image sensor chip, frame and light-transmitting member; The image sensor chip is fixed on the first surface of the substrate, and the image sensor chip includes a substrate; a non-imaging area on the surface of the substrate is provided with a wire bonding spot; the first surface of the substrate is provided with a wire bonding pad; the wire bonding spot and the wire bonding pad are electrically connected through a wire; The frame is fixed on the first surface of the substrate and is located between the image sensor chip and the wire bonding pad, and surrounds the image sensor chip; the height of the frame is lower than the height of the wire; a connector is provided on the surface of the frame facing away from the substrate; the height of the connector exceeds the height of the wire and is not lower than the height of the image sensor chip; the wire runs through the connector; a filler is provided on the first surface of the substrate between the frame and the image sensor chip; the filler fills the gap between the frame and the image sensor chip; the filler and the connector are an integrated component; The light-transmitting member is located at a side of the image sensor chip away from the substrate; the light-transmitting member is fixedly connected to a surface of a side of the frame away from the substrate via the connecting member.

2. The image sensor packaging structure according to claim 1, characterized in that: The imaging area on the substrate surface is provided with integrated circuit structures and sensors in sequence along the thickness direction.

3. The image sensor packaging structure according to claim 1, characterized in that: A welding pad is disposed on the second surface of the substrate; a solder ball is disposed on a surface of the welding pad facing away from the substrate; The substrate is provided with a through hole; a conductive member is provided in the through hole; the wire bonding pad and the welding pad are electrically connected through the conductive member.

4. The image sensor packaging structure according to claim 1, characterized in that: A packaging member is disposed on the first surface of the substrate between the frame and the edge of the substrate; the packaging member surrounds the frame; and the height of the packaging member does not exceed the height of the light-transmitting member.

5. An image sensor packaging method, characterized in that: include: fixing the image sensor chip on the first surface of the substrate; The image sensor chip comprises a substrate; a non-imaging area on the surface of the substrate is provided with wire bonding points; A wire bonding pad is provided on the first surface of the substrate; A frame is fixed to the first surface of the substrate between the image sensor chip and the wire bonding pad; the height of the frame is lower than the height of the wire; The frame surrounds the image sensor chip; Using the wire to connect the wire bonding point of the image sensor chip and the wire bonding pad of the substrate; An integrated component is arranged on a side surface of the frame away from the substrate and on a first surface of the substrate between the frame and the image sensor chip; the integrated component comprises a connector and a filler; the height of the connector exceeds the height of the wire and is not less than the height of the image sensor chip; the wire runs through the connector; and the filler fills the gap between the frame and the image sensor chip; The light-transmitting member is placed on the surface of the connecting member so that the light-transmitting member is fixedly connected to the surface of the frame on the side away from the substrate through the connecting member to obtain an image sensor packaging structure; the light-transmitting member is located on the side of the image sensor chip away from the substrate.

6. The image sensor packaging method according to claim 1, characterized in that: After the light-transmitting member is fixedly connected to a surface of the frame on one side facing away from the substrate through the connecting member, the invention further comprises: forming a dam around the substrate; the dam surrounds the edge of the substrate; A packaging member is formed on the first surface of the substrate between the frame and the dam, and the dam is removed; the packaging member surrounds the frame; and the height of the packaging member does not exceed the height of the light-transmitting member.

Images