An intelligent management switch that optimizes heat dissipation

Abstract

The present invention relates to the technical field related to switches, and discloses an intelligent management switch for optimizing heat dissipation effect, including a switch body, a plurality of heat dissipation ports are arranged on both side walls of the switch body, two chips are symmetrically fixedly arranged inside the switch body, a heat dissipation component is arranged inside the switch body, and a temperature detector is arranged inside the switch body; the present invention can make the gas inside the switch body flow quickly through the first movable frame and the second movable frame moving up and down, so as to dissipate heat inside the switch body through the plurality of heat dissipation ports, which is conducive to optimizing the heat dissipation effect inside the switch body. Finally, the first movable frame and the second movable frame are moved up and down, so that the coolant circulates in the first movable frame and the chip and the two second fixed frames and the second movable frame, and optimizes the water-cooling heat dissipation effect of the heat dissipation component on the switch body.

Description

Technical Field

[0001] The present invention belongs to the technical field related to switches, and more specifically, particularly relates to an intelligent management switch for optimizing heat dissipation effect. Background Art

[0002] A switch is a network device that is used to connect multiple devices to achieve network data transmission and exchange. It can connect multiple devices to a computer network and forward data to the destination through data packet exchange. In recent years, people have become more dependent on the Internet. The Internet has become a part of people's daily lives. Many tasks require the Internet as a basis to operate. This shows the importance of switches. Today's switches usually have heat dissipation holes on both sides to achieve the purpose of heat dissipation of the switch. However, the switches in the prior art have the following defects:

[0003] In the prior art, when a switch is in use, heat is generated inside the switch, and generally, heat is dissipated through a heat dissipation port. If the workload of the switch is relatively large, the switch is likely to generate more heat, and the switch cannot dissipate the heat through the heat dissipation port in time, resulting in an increase in the internal temperature, which is likely to cause the switch to malfunction and affect the normal operation of the switch. When not in use, the heat dissipation port is exposed, and dust is likely to enter the switch, thereby affecting its performance.

[0004] In the prior art, the switch is heat-dissipated by installing a heat dissipation fan. Although this can speed up the heat dissipation speed inside the switch, when the switch works for a long time and the temperature rises, the temperature of the switch shell will also rise accordingly. At this time, the heat dissipation fan cannot quickly dissipate the heat of the switch shell, which affects the heat dissipation speed of the switch.

[0005] In the prior art, the switch dissipates heat through heat dissipation grooves and heat dissipation channel rectangular tubes to perform basic natural heat dissipation, and a heat dissipation fan is provided to actively dissipate heat inside the device. However, when the outside temperature is high, it will greatly affect the heat dissipation and cooling efficiency inside the device. Although some devices are equipped with water-cooled heat dissipation pipes, they often use closed shells, resulting in poor air circulation inside the device, which in turn affects the heat dissipation efficiency of the device.

[0006] Therefore, in view of this, the existing structure and defects are studied and improved, and an intelligent management switch with optimized heat dissipation effect is provided, in order to achieve a more practical and valuable purpose. Summary of the invention

[0007] The present invention provides an intelligent management switch for optimizing heat dissipation effect, which is used to overcome the above-mentioned defects in the prior art.

[0008] The purpose and effect of the intelligent management switch for optimizing heat dissipation effect of the present invention are achieved by the following specific technical means:

[0009] An intelligent management switch for optimizing heat dissipation effect comprises a switch body, a plurality of heat dissipation ports are arranged on both side walls of the switch body, two chips are symmetrically fixedly arranged inside the switch body, a heat dissipation assembly is arranged inside the switch body, and a temperature detector is arranged inside the switch body; the heat dissipation assembly comprises a first fixed frame, the first fixed frame is located between the two chips, two second fixed frames are arranged on the sides of the two chips away from each other, a first movable frame and a second movable frame are arranged on the upper and lower sides of the switch body, a plurality of first heat dissipation blocks are fixedly arranged on both side walls of the first fixed frame at intervals, two first movable plates are symmetrically arranged on both sides of the first fixed frame, a plurality of second heat dissipation blocks are arranged on the sides of the two first movable plates away from each other, each of the first heat dissipation blocks is staggered, a first spring is connected between each of the first movable plates and the side wall of the first fixed frame, two first heat conduction plates are symmetrically fixedly arranged on the lower side of the first movable frame, and two second heat conduction plates are symmetrically arranged on the upper side of the second movable frame.

[0010] According to a further technical solution, two first sliding rods are provided for vertical sliding inside the first fixed frame, two first guide blocks are fixedly provided on the sides where the two first movable plates are close to each other, and two second guide blocks are fixedly provided on the sides where the two first sliding rods are away from each other, and the contact surfaces between the two first guide blocks and the two second guide blocks are inclined surfaces, the upper end of each first sliding rod is fixedly connected to the lower side of the first movable frame, and the lower end of each first sliding rod is fixedly connected to the upper side of the second movable frame.

[0011] A further technical solution is that each of the second fixed frames is fixedly provided with a plurality of third heat dissipation blocks at intervals on the side facing the chip, a second movable plate is slidably provided inside each of the second fixed frames on the side facing the chip, a plurality of fourth heat dissipation blocks are arranged at intervals on the side facing the chip, each of the second movable plates is staggeredly distributed with the fourth heat dissipation blocks, a plurality of second springs are connected between one side of each of the second movable plates and the side wall of the second fixed frame, a second sliding rod is vertically slidably provided inside each of the second fixed frames, a third guide block is fixedly provided on one side of each of the second movable plates, a fourth guide block is fixedly provided on one side of each of the second sliding rods, and the contact surface between each of the third guide block and the fourth guide block is an inclined surface.

[0012] A further technical solution is that the first fixed frame and the two second fixed frames are separated by a plurality of first partitions on their inner upper sides, the first fixed frame and the two second fixed frames are separated by a plurality of second partitions on their inner lower sides, each of the first partitions is staggered with the second partitions, the interior of the first fixed frame forms an S-shaped channel through the cooperation of the plurality of first partitions and the plurality of second partitions, and the interiors of the two second fixed frames have the same structure as the internal structure of the first fixed frame.

[0013] A further technical solution is that one end of the S-shaped channel in the first fixed frame and the two second fixed frames is respectively connected to the interior of the first movable frame and is provided with three first circular tubes, and the other end of the S-shaped channel in the first fixed frame and the two second fixed frames is respectively connected to the interior of the second movable frame and is provided with three second circular tubes, and the interior of the first movable frame is provided with a first piston plate for vertical sliding, the upper end of each of the first circular tubes is fixedly connected to the lower side of the first piston plate, and the outer side of each of the first circular tubes is in sliding contact with the lower side of the first movable frame, and the interior of the second movable frame is provided with a second piston plate for vertical sliding, the lower end of each of the second circular tubes is fixedly connected to the upper side of the second piston plate, and the outer side of each of the second circular tubes is in sliding contact with the upper side of the second movable frame.

[0014] A further technical solution is that the interiors of the first fixed frame and the two second fixed frames are respectively interconnected with the interiors of the three first circular tubes, the interiors of the first fixed frame and the two second fixed frames are respectively interconnected with the interiors of the three second circular tubes, the interior of each of the first circular tubes is interconnected with the interior lower side of the first movable frame, and the interior of each of the second circular tubes is interconnected with the interior upper side of the second movable frame.

[0015] According to a further technical solution, a small motor is fixed inside the switch body, a circular plate is fixed on the outer side of the output end of the small motor, a round rod is fixed on the circular plate, a slide groove is provided on one side of the first movable frame, and one end of the round rod slides horizontally inside the slide groove.

[0016] According to a further technical solution, two first movable plates are fixedly provided on both sides of the first movable frame, and a plurality of first scrapers are fixedly provided at intervals on the sides of the two first movable plates away from each other, and each of the first scrapers slides vertically inside the corresponding heat dissipation port; and two second movable plates are fixedly provided on both sides of the second movable frame, and a plurality of second scrapers are fixedly provided at intervals on the sides of the two second movable plates away from each other, and each of the second scrapers slides vertically inside the corresponding heat dissipation port.

[0017] A further technical solution is that a first baffle is fixedly provided on the lower side of each of the first scraper blocks, a second baffle is fixedly provided on the upper side of each of the second scraper blocks, each of the first baffles and the second baffles are staggered, an S-shaped channel is formed inside each of the heat dissipation ports through the cooperation of the first baffle and the second baffle, two first filter plates are respectively connected between the two first movable plates and the two second movable plates, and the two first filter plates slide up and down on both sides of the interior of the switch body.

[0018] A further technical solution is that a first opening is provided on one side of the lower part of the switch body, a rotating plate is rotatably provided on the upper inner side of the first opening, a second opening is provided on the rotating plate, a second filter plate is obliquely fixedly provided on the inner side of the second opening, a first fixing seat is fixedly provided on one side of the second movable frame, a second fixing seat is fixedly provided on one side of the rotating plate, a connecting plate is connected between the inner side of the first fixing seat and the inner side of the second fixing seat, the inclined upper end of the connecting plate is rotatably connected to the inner side of the first fixing seat, the inclined lower end of the connecting plate is rotatably connected to the inner side of the second fixing seat, a fixing rod is fixedly provided on the upper inner side of the first opening, and a plurality of elastic blocks are vertically fixedly provided on one side of the fixing rod toward the second filter plate.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] An intelligent management switch for optimizing heat dissipation effect of the present invention is provided with a heat dissipation component. The first movable frame and the second movable frame in the heat dissipation component move up and down, and the first movable frame moves downward to drive two first heat conducting plates to contact two chips respectively, so that the cooling liquid inside the first movable frame can cooperate with the two first heat conducting plates. Thus, the upper side of the two chips can be water-cooled and dissipated. Then, the second movable frame moves upward to drive the two second heat conducting plates to move upward to contact the two chips and cooperate with the cooling liquid inside the second movable frame, so that the lower side of the two chips can be water-cooled and dissipated. Then, the first movable frame and the second movable frame move up and down, so that the gas inside the switch body flows quickly, so that the inside of the switch body can be dissipated through a number of heat dissipation ports, which is conducive to optimizing the heat dissipation effect inside the switch body. Finally, the first movable frame and the second movable frame move up and down, so that the cooling liquid circulates in the first movable frame and the chip and the two second fixed frames and the second movable frame, and the water cooling and heat dissipation effect of the heat dissipation component on the switch body is optimized.

[0021] The intelligent management switch of the present invention optimizes the heat dissipation effect. The structure of the first fixed frame is an S-shaped channel inside, so as to prolong the time for the coolant to flow in the first fixed frame, so that the coolant inside the first fixed frame can cooperate with a plurality of first heat dissipation blocks to achieve water cooling and heat dissipation on the side where two chips are close to each other. Then, by moving a plurality of second heat dissipation blocks back and forth, a gap can be created between the first fixed frame and the chip, so that the gas can flow quickly between the first fixed frame and the chip, thereby dissipating the heat of the chip. Finally, the first heat dissipation block and the second heat dissipation block are in contact with each other and the first heat dissipation block is always in contact with the chip, so that the chip can be heat-conducted, and the coolant inside the first fixed frame can be used to water-cool the second heat dissipation block and the first heat dissipation block, so that the side where the two chips are close to each other can be cooled by water cooling and air cooling.

[0022] The intelligent management switch of the present invention optimizes the heat dissipation effect. The structure of the interior of the two second fixed frames is an S-shaped channel, so as to prolong the time for the coolant to flow in the two second fixed frames, so that the coolant inside the two second fixed frames can cooperate with a plurality of third heat dissipation blocks to respectively perform water cooling and heat dissipation on the side of the two chips away from each other. The gap between the chip and the second fixed frame and the movement of a plurality of fourth heat dissipation blocks back and forth allow the gas to flow quickly between the chip and the second fixed frame, so as to perform air cooling and heat dissipation on the side of the two chips away from each other. Then, the plurality of third heat dissipation blocks are always in contact with the chip and the third heat dissipation block and the fourth heat dissipation block are in sliding contact with each other, so as to conduct heat to the chip, and the coolant inside the second fixed frame can perform water cooling and cooling on the third heat dissipation block and the fourth heat dissipation block, so as to perform water cooling and air cooling and heat dissipation on the side of the two chips away from each other, thereby optimizing the heat dissipation effect on both sides of the chip.

[0023] The intelligent management switch of the present invention optimizes the heat dissipation effect. First, the first baffle and the second baffle are located inside the heat dissipation port, so as to reduce the dust from entering the inside of the switch body through the heat dissipation port. Then, the gas entering the switch body is filtered by the first filter plate to prevent the dust in the gas from entering the inside of the switch body. Next, the first movable frame and the second movable frame move up and down to drive the first movable plate, the first scraper block, the second movable plate, and the second scraper block to move up and down inside the heat dissipation port, so as to clean the dust blocked on the heat dissipation port and prevent the heat dissipation effect on the inside of the switch body from being affected by the blockage of the heat dissipation port. Finally, the first filter plate is driven up and down by the first movable frame and the second movable frame to move up and down, so as to shake the dust adsorbed on the first filter plate up and down to be detached, so as to extend the service life of the first filter plate.

[0024] The intelligent management switch of the present invention optimizes the heat dissipation effect. First, the inside of the switch body is ventilated and heats up normally through the second port. Then, the second filter plate is tilted to filter the gas entering the switch body through the second port, while reducing the dust adsorbed on the second filter plate. Then, the second movable frame moves up and down to push the rotating plate to swing back and forth through the connecting plate, so as to speed up the flow rate of the gas entering the inside of the switch body through the second port and the first port, so as to optimize the air cooling effect inside the switch body. Finally, the rotating plate swings back and forth to drive the second filter plate to swing back and forth and contact with a plurality of elastic blocks, which is conducive to knocking off the dust adsorbed on the second filter plate, so as to extend the service life of the second filter plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0027] Figure 1 It is an isometric structural schematic diagram of the present invention;

[0028] Figure 2 It is a front view structural schematic diagram of the present invention;

[0029] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure at AA in the middle;

[0030] Figure 4 for Figure 3 The structural schematic diagram of the local enlarged view at D in the middle;

[0031] Figure 5 for Figure 2 Schematic diagram of the cross-sectional structure at the middle BB;

[0032] Figure 6 It is a schematic diagram of the top view of the structure of the present invention;

[0033] Figure 7 for Figure 6 Schematic diagram of the cross-section structure at CC in the middle;

[0034] Figure 8 for Figure 7 The structural schematic diagram of the local enlarged view at E in the middle;

[0035] Fig. 9 for Figure 7 Schematic diagram of the structure of the local enlarged view at F in the middle.

[0036] Description of reference numerals:

[0037] Switch body 10, heat dissipation port 12, chip 13, first fixed frame 14, first movable frame 15, second movable frame 16, small motor 17, round plate 18, round rod 19, slide 20, first piston plate 21, second piston plate 22, first round tube 23, second round tube 24, first partition plate 25, first movable plate 26, first scraper block 27, second movable plate 28, second scraper block 29, first heat conducting plate 30, second heat conducting plate 31, first heat dissipation block 32, second heat dissipation block 33, first movable plate 34, first slide bar 35, first movable plate 36, second movable plate 37, first movable plate 38, first movable plate 39, first movable plate 40, first movable plate 41, first movable plate 42, first movable plate 43, first movable plate 44, first movable plate 45, first movable plate 46, first movable plate 47, second movable plate 48, second movable plate 49, first movable plate 50, first movable plate 51, first movable plate 52, second movable plate 53, first movable plate 54, first movable plate 55, first movable plate 56, first movable plate 57, first movable plate 58, first movable plate 59, first movable plate 59, first movable plate 51, first movable plate 52, second movable plate 54, first movable plate 55, first movable plate 56, first movable plate 57, first movable plate 58, first movable plate 59, first movable plate 5 A spring 36, a first guide block 37, a second guide block 38, a second fixed frame 39, a second slide rod 40, a third heat sink 41, a fourth heat sink 42, a second movable plate 43, a second spring 44, a third guide block 45, a fourth guide block 46, a first through port 47, a rotating plate 48, a second through port 49, a first filter plate 50, a fixing rod 51, an elastic block 52, a first fixing seat 53, a second fixing seat 54, a connecting plate 55, a second filter plate 56, a first baffle 57, a second baffle 58, a second partition plate 59, and a temperature detector 60. DETAILED DESCRIPTION

[0038] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0039] In the description of the present invention, unless otherwise specified, "plurality" means two or more than two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] As attached Figure 1 To Attachment Fig. 9 As shown:

[0042] The invention provides an intelligent management switch for optimizing heat dissipation effect.

[0043] Refer to the attached Figure 1 To Attachment Fig. 9 , including a switch body 10, a plurality of heat dissipation ports 12 are arranged on both side walls of the switch body 10, two chips 13 are symmetrically fixedly arranged inside the switch body 10, a heat dissipation component is arranged inside the switch body 10, and a temperature detector 60 is arranged inside the switch body 10; the heat dissipation component includes a first fixed frame 14, the first fixed frame 14 is located between the two chips 13, two second fixed frames 39 are arranged on the sides of the two chips 13 away from each other, a first movable frame 15 and a second movable frame 16 are arranged on the upper and lower sides of the switch body 10, and the first A plurality of first heat dissipation blocks 32 are fixedly provided at intervals on both side walls of the fixed frame 14, two first movable plates 34 are symmetrically provided on both sides of the interior of the first fixed frame 14, a plurality of second heat dissipation blocks 33 are provided at intervals on the sides of the two first movable plates 34 away from each other, each first heat dissipation block 32 is staggered with the second heat dissipation block 33, a first spring 36 is connected between each first movable plate 34 and the side wall of the first fixed frame 14, two first heat conducting plates 30 are symmetrically fixedly provided on the lower side of the first movable frame 15, and two second heat conducting plates 31 are symmetrically provided on the upper side of the second movable frame 16.

[0044] Preferably, see Attachment Figure 7 , Attachment Figure 8 Two first sliding rods 35 are provided for vertical sliding inside the first fixed frame 14, two first guide blocks 37 are fixedly provided on the sides where the two first movable plates 34 are close to each other, and two second guide blocks 38 are fixedly provided on the sides where the two first sliding rods 35 are away from each other. The contact surfaces between the two first guide blocks 37 and the two second guide blocks 38 are inclined surfaces, respectively. The upper end of each first sliding rod 35 is fixedly connected to the lower side of the first movable frame 15, and the lower end of each first sliding rod 35 is fixedly connected to the upper side of the second movable frame 16.

[0045] Preferably, see Attachment Figure 7 , Attachment Fig. 9A plurality of third heat dissipation blocks 41 are fixedly provided at intervals on one side of each second fixed frame 39 facing the direction of the chip 13, a second movable plate 43 is slidably provided on the inner side of each second fixed frame 39 facing the direction of the chip 13, a plurality of fourth heat dissipation blocks 42 are arranged at intervals on the inner side of each second movable plate 43 facing the direction of the chip 13, each third heat dissipation block 41 is staggered with the fourth heat dissipation block 42, a plurality of second springs 44 are connected between one side of each second movable plate 43 and the side wall of the second fixed frame 39, a second slide bar 40 is vertically slidably provided inside each second fixed frame 39, a third guide block 45 is fixedly provided on one side of each second movable plate 43, a fourth guide block 46 is fixedly provided on one side of each second slide bar 40, and the contact surface between each third guide block 45 and the fourth guide block 46 is an inclined surface.

[0046] Preferably, see Attachment Figure 3 , Attachment Figure 4 A plurality of first partitions 25 are provided on the upper inner sides of the first fixed frame 14 and the two second fixed frames 39, and a plurality of second partitions 59 are provided on the lower inner sides of the first fixed frame 14 and the two second fixed frames 39. Each first partition 25 is staggered with the second partition 59. The interior of the first fixed frame 14 forms an S-shaped channel through the cooperation of the plurality of first partitions 25 and the plurality of second partitions 59, and the interior of the two second fixed frames 39 has the same structure as the internal structure of the first fixed frame 14.

[0047] Preferably, see Attachment Figure 3 , Attachment Figure 4 One end of the S-shaped channel in the first fixed frame 14 and the two second fixed frames 39 is respectively connected to the interior of the first movable frame 15 and is provided with three first circular tubes 23, and the other end of the S-shaped channel in the first fixed frame 14 and the two second fixed frames 39 is respectively connected to the interior of the second movable frame 16 and is provided with three second circular tubes 24, and the interior of the first movable frame 15 is vertically slidably provided with a first piston plate 21, the upper end of each first circular tube 23 is fixedly connected to the lower side of the first piston plate 21, and the outer side of each first circular tube 23 is in sliding contact with the lower side of the first movable frame 15, and the interior of the second movable frame 16 is vertically slidably provided with a second piston plate 22, the lower end of each second circular tube 24 is fixedly connected to the upper side of the second piston plate 22, and the outer side of each second circular tube 24 is in sliding contact with the upper side of the second movable frame 16.

[0048] Preferably, see Attachment Figure 3 , Attachment Figure 4The interiors of the first fixed frame 14 and the two second fixed frames 39 are respectively interconnected with the interiors of the three first circular tubes 23, the interiors of the first fixed frame 14 and the two second fixed frames 39 are respectively interconnected with the interiors of the three second circular tubes 24, the interior of each first circular tube 23 is interconnected with the inner lower side of the first movable frame 15, and the interior of each second circular tube 24 is interconnected with the inner upper side of the second movable frame 16.

[0049] Preferably, see Attachment Figure 3 , Attachment Figure 4 A small motor 17 is fixed inside the switch body 10, a circular plate 18 is fixed on the outer side of the output end of the small motor 17, a round rod 19 is fixed on the circular plate 18, a slide groove 20 is provided on one side of the first movable frame 15, and one end of the round rod 19 slides horizontally inside the slide groove 20.

[0050] Preferably, see Attachment Figure 7 Two first movable plates 26 are fixedly provided on both sides of the first movable frame 15, and a plurality of first scraping blocks 27 are fixedly provided at intervals on the sides of the two first movable plates 26 away from each other. Each first scraping block 27 slides vertically inside the corresponding heat dissipation port 12. Two second movable plates 28 are fixedly provided on both sides of the second movable frame 16, and a plurality of second scraping blocks 29 are fixedly provided at intervals on the sides of the two second movable plates 28 away from each other. Each second scraping block 29 slides vertically inside the corresponding heat dissipation port 12.

[0051] Preferably, see Attachment Figure 7 A first baffle 57 is fixedly provided on the lower side of each first scraper block 27, and a second baffle 58 is fixedly provided on the upper side of each second scraper block 29. Each first baffle 57 and the second baffle 58 are staggered. The interior of each heat dissipation port 12 forms an S-shaped channel through the cooperation of the first baffle 57 and the second baffle 58. Two first filter plates 50 are connected between the two first movable plates 26 and the two second movable plates 28 respectively. The two first filter plates 50 slide up and down on both sides of the interior of the switch body 10.

[0052] Preferably, see Attachment Figure 3 , Attachment Figure 4A first opening 47 is provided on one side of the lower part of the switch body 10, a rotating plate 48 is rotatably provided on the upper side of the interior of the first opening 47, a second opening 49 is provided on the rotating plate 48, a second filter plate 56 is obliquely fixedly provided inside the second opening 49, a first fixed seat 53 is fixedly provided on one side of the second movable frame 16, a second fixed seat 54 is fixedly provided on one side of the rotating plate 48, a connecting plate 55 is connected between the interior of the first fixed seat 53 and the interior of the second fixed seat 54, the inclined upper end of the connecting plate 55 is rotatably connected to the interior of the first fixed seat 53, and the inclined lower end of the connecting plate 55 is rotatably connected to the interior of the second fixed seat 54, a fixing rod 51 is fixedly provided on the upper side of the interior of the first opening 47, and a plurality of elastic blocks 52 are vertically fixedly provided on one side of the fixing rod 51 facing the second filter plate 56.

[0053] In the initial state, the upper side of the interior of the second movable frame 16 is filled with coolant, the interiors of the first fixed frame 14 and the two second fixed frames 39 are filled with coolant, the first movable frame 15 and the second movable frame 16 are both located at the highest point, and the two sides of the two second heat conducting plates 31 are in contact with the lower sides of the two chips 13 respectively.

[0054] Specific use of the present invention:

[0055] When the temperature detector 60 detects that the temperature inside the switch body 10 is low, normal heat dissipation is performed at this time. First, a number of heat dissipation ports 12 are provided on both side walls of the switch body 10, thereby achieving preliminary heat dissipation inside the switch body 10; then, the first fixed frame 14 is located between the sides where the two chips 13 are close to each other, and the two second fixed frames 39 are respectively located on the sides where the two chips 13 are far away from each other, so that water cooling and heat dissipation can be performed on both sides of the chip 13, so as to effectively cool and dissipate the temperature of the chip 13. Finally, the upper side of the interior of the second movable frame 16 is filled with coolant, and the two sides of the two second heat conducting plates 31 are respectively in contact with the lower sides of the two chips 13, so as to further perform water cooling and heat dissipation on the chip 13, so as to optimize the heat dissipation effect inside the switch body 10.

[0056] When the temperature detector 60 detects that the temperature inside the switch body 10 is high, it is necessary to quickly dissipate the heat inside the switch body 10. The control system controls the heat dissipation component to start, and the small motor 17 starts to drive the circular plate 18 to rotate, and the rotation of the circular plate 18 drives the round rod 19 to rotate. One end of the round rod 19 slides horizontally in the slide groove 20 to cooperate with the rotation of the round rod 19 to achieve the up and down movement of the first movable frame 15. The up and down movement of the first movable frame 15 drives the two first slide bars 35 and the two second slide bars 40 to move up and down, and the up and down movement of the two first slide bars 35 and the two second slide bars 40 drives the second movable frame 16 to move up and down, so that the first movable frame 15 and the second movable frame 16 alternately contact with the two chips 13 for water cooling and heat dissipation. The up and down movement of the first movable frame 15 and the second movable frame 16 makes the gas inside the switch body 10 flow quickly, so as to dissipate the heat inside the switch body 10 through a number of heat dissipation ports 12, which is conducive to optimizing the effect of heat dissipation inside the switch body 10.

[0057] At the same time, the second movable frame 16 moves downward to cooperate with the second piston plate 22 and the second round tube 24 to fix, so that the coolant on the upper side of the second movable frame 16 enters the first fixed frame 14 and the two second fixed frames 39 through the three second round tubes 24. Then, the first fixed frame 14 and the two second fixed frames 39 are both in an S-shaped channel structure, extending the time for the coolant to flow in the first fixed frame 14 and the two second fixed frames 39, so as to fully cool the two chips 13. Then, the coolant in the first fixed frame 14 and the two second fixed frames 39 enters the lower side of the first movable frame 15 through the three first round tubes 23. Finally, the first movable frame 15 moves downward to cooperate with the first piston plate 21 and the first round tube 23 to be fixed, so that the coolant on the lower side of the first movable frame 15 enters the first fixed frame 14 and the two second fixed frames 39 through the three first round tubes 23, and the coolant in the first fixed frame 14 and the two second fixed frames 39 returns to the upper side of the interior of the second movable frame 16 through the three second round tubes 24, so as to move up and down through the first movable frame 15 and the second movable frame 16, so that the coolant circulates in the first movable frame 15 and the first fixed frame 14 and the two second fixed frames 39 and the second movable frame 16, thereby optimizing the water-cooling heat dissipation effect of the heat dissipation component on the switch body 10.

[0058] The first movable frame 15 moves downward to drive the two first slide bars 35 and the two second guide blocks 38 to move downward, and the second guide blocks 38 contact the inclined surfaces of the first guide blocks 37, so that the two first slide bars 35 and the two second guide blocks 38 move downward to move the two first movable plates 34 away from each other, and the two first movable plates 34 move away from each other to drive the plurality of second heat sinks 33 to move and contact the chip 13. At this time, the two first movable plates 34 move away from each other to compress the plurality of first springs 36 to generate elastic force. Next, the second movable frame 16 moves upward to drive the two first slide bars 35 and the two second guide blocks 38, and the two second guide blocks 38 move upward to disengage from the two first guide blocks 37 respectively, so that under the action of the elastic force of the first springs 36, the two first movable plates 34 are brought close to each other, and the two first movable plates 34 are brought close to each other to disengage from the second heat sinks 33 and the chip 13, so that the second heat sinks 33 move back and forth, so that there is a gap between the first fixed frame 14 and the chip 13, so that the gas can flow quickly between the first fixed frame 14 and the chip 13, so as to dissipate heat for the chip 13. Then, the first heat sink 32 and the second heat sink 33 are in contact with each other and the first heat sink 32 is always in contact with the chip 13, so as to conduct heat to the chip 13, and the coolant inside the first fixed frame 14 is used to cool the second heat sink 33 and the first heat sink 32 by water, so as to dissipate heat by combining water cooling and air cooling on the side where the two chips 13 are close to each other.

[0059] At the same time, the first movable frame 15 moves downward to drive the two second slide bars 40 and the two fourth guide blocks 46 to move downward. Through the contact between the fourth guide block 46 and the inclined surface of the third guide block 45, the two second slide bars 40 and the two fourth guide blocks 46 move downward to make the two second movable plates 43 approach each other. The two second movable plates 43 approach each other and respectively drive the fourth heat sinks 42 to contact the side of the two chips 13 that are away from each other. At this time, the two second movable plates 43 approach each other to compress the second springs 44 to generate elastic force. Then, the second movable frame 16 moves upward to drive the two second slide bars 40 and the two fourth guide blocks 46 to move upward. The two fourth guide blocks 46 move upward and respectively disengage from the two third guide blocks 45, so that under the elastic force of the second springs 44, the two second movable plates 43 are moved away from each other, so that the fourth heat sinks 42 move back and forth. By providing a gap between the chip 13 and the second fixed frame 39 and allowing the fourth heat sinks 42 to move back and forth, the gas can flow quickly between the chip 13 and the second fixed frame 39, so as to facilitate air cooling and heat dissipation on the side where the two chips 13 are away from each other. Then, by allowing the third heat sinks 41 to always be in contact with the chip 13 and the third heat sinks 41 and the fourth heat sinks 42 to slide in contact with each other, the chip 13 can be thermally conductive. The coolant inside the second fixed frame 39 can be used to water-cool the third heat sink 41 and the fourth heat sink 42, so as to facilitate water cooling and air cooling on the side where the two chips 13 are away from each other, thereby optimizing the heat dissipation effect on both sides of the chip 13.

[0060] Secondly, the first baffle 57 and the second baffle 58 are located inside the heat dissipation port 12, so as to reduce the dust from entering the switch body 10 through the heat dissipation port 12. Then, the first filter plate 50 is used to filter the gas entering the switch body 10, so as to prevent the dust in the gas from entering the switch body 10. Next, the first movable frame 15 and the second movable frame 16 move up and down to drive the first movable plate 26, the first scraper 27, the second movable plate 28, and the second scraper 29 to move up and down inside the heat dissipation port 12, so as to clean the dust blocked on the heat dissipation port 12, so as to prevent the heat dissipation inside the switch body 10 from being blocked. Finally, the first movable frame 15 and the second movable frame 16 move up and down to drive the first filter plate 50 to move up and down, so as to shake the dust adsorbed on the first filter plate 50 up and down to be separated, so as to extend the service life of the first filter plate 50.

[0061] Finally, the inside of the switch body 10 is first ventilated and cooled normally through the second opening 49. The second filter plate 56 is then tilted to filter the gas entering the switch body 10 through the second opening 49 while reducing the dust adsorbed on the second filter plate 56. Then the second movable frame 16 moves up and down to push the rotating plate 48 to swing back and forth through the connecting plate 55, so as to speed up the flow rate of the gas entering the inside of the switch body 10 through the second opening 49 and the first opening 47, so as to optimize the air cooling effect on the inside of the switch body 10. Finally, the rotating plate 48 swings back and forth to drive the second filter plate 56 to swing back and forth and contact with a plurality of elastic blocks 52, which is conducive to knocking off the dust adsorbed on the second filter plate 56, so as to extend the service life of the second filter plate 56.

[0062] An intelligent management switch for optimizing heat dissipation effect of the present invention is provided with a heat dissipation component. The first movable frame 15 and the second movable frame 16 in the heat dissipation component move up and down. The first movable frame 15 moves downward to drive two first heat conducting plates 30 to contact two chips 13 respectively, so that the cooling liquid inside the first movable frame 15 can cooperate with the two first heat conducting plates 30. Thus, the upper side of the two chips 13 can be water-cooled. Then, the second movable frame 16 moves upward to drive the two second heat conducting plates 31 to move upward to contact the two chips 13 and cooperate with the cooling liquid inside the second movable frame 16, so that the lower side of the two chips 13 can be water-cooled. Then, the first movable frame 15 and the second movable frame 16 move up and down, so that the gas inside the switch body 10 flows quickly, so that the inside of the switch body 10 can be cooled through a plurality of heat dissipation ports 12, which is conducive to optimizing the heat dissipation effect inside the switch body 10. Finally, by moving the first movable frame 15 and the second movable frame 16 up and down, the coolant circulates in the first movable frame 15, the chip 13, the two second fixed frames 39 and the second movable frame 16, optimizing the water cooling effect of the heat dissipation component on the switch body 10.

[0063] The intelligent management switch of the present invention optimizes the heat dissipation effect. The first fixed frame 14 has an S-shaped channel structure inside, so as to prolong the time for the coolant to flow in the first fixed frame 14, so that the coolant inside the first fixed frame 14 can cooperate with a plurality of first heat dissipation blocks 32 to achieve water cooling and heat dissipation on the side where two chips 13 are close to each other. Then, by moving back and forth by a plurality of second heat dissipation blocks 33, a gap can be formed between the first fixed frame 14 and the chip 13, so that the gas can flow quickly between the first fixed frame 14 and the chip 13, so as to dissipate heat for the chip 13. Finally, the first heat dissipation block 32 and the second heat dissipation block 33 are in contact with each other and the first heat dissipation block 32 is always in contact with the chip 13, so as to conduct heat to the chip 13, and the coolant inside the first fixed frame 14 can cool the second heat dissipation block 33 and the first heat dissipation block 32 by water, so as to dissipate heat by water cooling and air cooling on the side where the two chips 13 are close to each other.

[0064] The intelligent management switch of the present invention optimizes the heat dissipation effect. The two second fixed frames 39 are both in an S-shaped channel structure, so as to prolong the time for the coolant to flow in the two second fixed frames 39, so that the coolant in the two second fixed frames 39 can cooperate with a plurality of third heat dissipation blocks 41 to respectively perform water cooling and heat dissipation on the side of the two chips 13 that are away from each other. The gap between the chip 13 and the second fixed frame 39 and the movement of a plurality of fourth heat dissipation blocks 42 make the gas flow quickly between the chip 13 and the second fixed frame 39, so as to perform air cooling and heat dissipation on the side of the two chips 13 that are away from each other. Then, the plurality of third heat dissipation blocks 41 are always in contact with the chip 13 and the third heat dissipation block 41 and the fourth heat dissipation block 42 are in sliding contact with each other, so as to conduct heat to the chip 13, and the coolant in the second fixed frame 39 can perform water cooling and cooling on the third heat dissipation block 41 and the fourth heat dissipation block 42, so as to perform water cooling and air cooling to the side of the two chips 13 that are away from each other to optimize the heat dissipation effect on both sides of the chip 13.

[0065] The intelligent management switch for optimizing heat dissipation effect of the present invention firstly locates the first baffle plate 57 and the second baffle plate 58 inside the heat dissipation port 12, thereby reducing the dust from entering the switch body 10 through the heat dissipation port 12. Then, the first filter plate 50 filters the gas entering the switch body 10, thereby preventing the dust in the gas from entering the switch body 10. Then, the first movable frame 15 and the second movable frame 16 move up and down to drive the first movable plate 26, the first scraper block 27, the second movable plate 28, and the second scraper block 29 to move up and down inside the heat dissipation port 12, thereby cleaning the dust blocked on the heat dissipation port 12, thereby preventing the heat dissipation effect on the inside of the switch body 10 from being affected by the blockage of the heat dissipation port 12. Finally, the first movable frame 15 and the second movable frame 16 move up and down to drive the first filter plate 50 to move up and down, thereby shaking the dust adsorbed on the first filter plate 50 up and down to be separated, so as to extend the service life of the first filter plate 50.

[0066] The intelligent management switch of the present invention optimizes the heat dissipation effect. First, the inside of the switch body 10 is ventilated and cooled normally through the second port 49. Then, the second filter plate 56 is tilted to filter the gas entering the switch body 10 through the second port 49, while reducing the dust adsorbed on the second filter plate 56. Then, the second movable frame 16 moves up and down to push the rotating plate 48 to swing back and forth through the connecting plate 55, so as to speed up the flow rate of the gas entering the inside of the switch body 10 through the second port 49 and the first port 47, so as to optimize the air cooling effect on the inside of the switch body 10. Finally, the rotating plate 48 swings back and forth to drive the second filter plate 56 to swing back and forth and contact with a plurality of elastic blocks 52, which is conducive to knocking off the dust adsorbed on the second filter plate 56, so as to extend the service life of the second filter plate 56.

[0067] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. An intelligent management switch for optimizing heat dissipation, characterized in that: The invention comprises a switch body (10), wherein two side walls of the switch body (10) are provided with a plurality of heat dissipation openings (12), two chips (13) are symmetrically fixedly arranged inside the switch body (10), a heat dissipation component is arranged inside the switch body (10), and a temperature detector (60) is arranged inside the switch body (10); the heat dissipation component comprises a first fixed frame (14), the first fixed frame (14) is located between the two chips (13), two second fixed frames (39) are respectively arranged on the sides of the two chips (13) away from each other, a first movable frame (15) and a second movable frame (16) are respectively arranged on the upper and lower sides inside the switch body (10), and the heat dissipation component comprises a first fixed frame (14), the first fixed frame (14) is located between the two chips (13), two second fixed frames (39) are respectively arranged on the sides of the two chips (13) away from each other, and the switch body (10) is provided with a first movable frame (15) and a second movable frame (16) on the upper and lower sides, respectively. A plurality of first heat dissipation blocks (32) are fixedly arranged at intervals on both side walls of the first fixed frame (14); two first movable plates (34) are symmetrically arranged on both sides of the interior of the first fixed frame (14); a plurality of second heat dissipation blocks (33) are arranged at intervals on the sides of the two first movable plates (34) that are away from each other; each of the first heat dissipation blocks (32) and the second heat dissipation blocks (33) are staggered; a first spring (36) is connected between each of the first movable plates (34) and the side wall of the first fixed frame (14); two first heat conduction plates (30) are symmetrically fixedly arranged on the lower side of the first movable frame (15); and two second heat conduction plates (31) are symmetrically arranged on the upper side of the second movable frame (16).

2. The intelligent management switch for optimizing heat dissipation effect according to claim 1, characterized in that: Two first sliding rods (35) are vertically slidably arranged inside the first fixed frame (14); two first guide blocks (37) are fixedly arranged on the sides of the two first movable plates (34) that are close to each other; two second guide blocks (38) are fixedly arranged on the sides of the two first sliding rods (35) that are away from each other; the contact surfaces of the two first guide blocks (37) and the two second guide blocks (38) are inclined surfaces; the upper end of each first sliding rod (35) is fixedly connected to the lower side of the first movable frame (15); and the lower end of each first sliding rod (35) is fixedly connected to the upper side of the second movable frame (16).

3. The intelligent management switch for optimizing heat dissipation effect according to claim 1, characterized in that: A plurality of third heat dissipation blocks (41) are fixedly arranged at intervals on one side of each second fixed frame (39) facing the chip (13); a second movable plate (43) is slidably arranged inside each second fixed frame (39) on one side facing the chip (13); a plurality of fourth heat dissipation blocks (42) are arranged at intervals on one side of each second movable plate (43) facing the chip (13); each of the third heat dissipation blocks (41) and the fourth heat dissipation blocks (42) are staggered; a plurality of second springs (44) are connected between one side of each second movable plate (43) and the side wall of the second fixed frame (39); a second slide bar (40) is vertically slidably arranged inside each second fixed frame (39); a third guide block (45) is fixedly arranged on one side of each second movable plate (43); a fourth guide block (46) is fixedly arranged on one side of each second slide bar (40); and a contact surface between each third guide block (45) and the fourth guide block (46) is an inclined surface.

4. The intelligent management switch for optimizing heat dissipation effect according to claim 1, characterized in that: The first fixed frame (14) and the two second fixed frames (39) are separated by a plurality of first partitions (25) on their inner upper sides, and the first fixed frame (14) and the two second fixed frames (39) are separated by a plurality of second partitions (59) on their inner lower sides. Each of the first partitions (25) and the second partitions (59) are staggered. The interior of the first fixed frame (14) forms an S-shaped channel through the cooperation of the plurality of first partitions (25) and the plurality of second partitions (59). The interior of the two second fixed frames (39) has the same internal structure as the first fixed frame (14).

5. The intelligent management switch for optimizing heat dissipation effect according to claim 4, characterized in that: One end of the S-shaped channel in the first fixed frame (14) and the two second fixed frames (39) is respectively connected to the interior of the first movable frame (15) and is provided with three first circular tubes (23); the other end of the S-shaped channel in the first fixed frame (14) and the two second fixed frames (39) is respectively connected to the interior of the second movable frame (16) and is provided with three second circular tubes (24); a first piston plate (21) is vertically slidably provided inside the first movable frame (15); the upper end of each of the first circular tubes (23) is fixedly connected to the lower side of the first piston plate (21); the outer side of each of the first circular tubes (23) is in sliding contact with the lower side of the first movable frame (15); a second piston plate (22) is vertically slidably provided inside the second movable frame (16); the lower end of each of the second circular tubes (24) is fixedly connected to the upper side of the second piston plate (22); the outer side of each of the second circular tubes (24) is in sliding contact with the upper side of the second movable frame (16).

6. The intelligent management switch for optimizing heat dissipation effect according to claim 5, characterized in that: The interiors of the first fixed frame (14) and the two second fixed frames (39) are respectively interconnected with the interiors of the three first circular tubes (23); the interiors of the first fixed frame (14) and the two second fixed frames (39) are respectively interconnected with the interiors of the three second circular tubes (24); the interior of each of the first circular tubes (23) is interconnected with the lower interior side of the first movable frame (15); and the interior of each of the second circular tubes (24) is interconnected with the upper interior side of the second movable frame (16).

7. The intelligent management switch for optimizing heat dissipation effect according to claim 6, characterized in that: A small motor (17) is fixedly arranged inside the switch body (10), a circular plate (18) is fixedly arranged outside the output end of the small motor (17), a round rod (19) is fixedly arranged on the circular plate (18), a sliding groove (20) is arranged on one side of the first movable frame (15), and one end of the round rod (19) slides horizontally inside the sliding groove (20).

8. The intelligent management switch for optimizing heat dissipation effect according to claim 7, characterized in that: Two first movable plates (26) are fixedly provided on both sides of the first movable frame (15), and a plurality of first scraping blocks (27) are fixedly provided at intervals on the sides of the two first movable plates (26) away from each other, and each of the first scraping blocks (27) slides vertically inside the corresponding heat dissipation port (12). Two second movable plates (28) are fixedly provided on both sides of the second movable frame (16), and a plurality of second scraping blocks (29) are fixedly provided at intervals on the sides of the two second movable plates (28) away from each other, and each of the second scraping blocks (29) slides vertically inside the corresponding heat dissipation port (12).

9. The intelligent management switch for optimizing heat dissipation effect according to claim 8, characterized in that: A first baffle (57) is fixedly provided on the lower side of each first scraper block (27), a second baffle (58) is fixedly provided on the upper side of each second scraper block (29), each first baffle (57) and the second baffle (58) are staggered, the interior of each heat dissipation port (12) forms an S-shaped channel through the cooperation of the first baffle (57) and the second baffle (58), two first filter plates (50) are connected between the two first movable plates (26) and the two second movable plates (28), and the two first filter plates (50) slide up and down on both sides of the interior of the switch body (10).

10. The intelligent management switch for optimizing heat dissipation effect according to claim 1, characterized in that: A first opening (47) is provided on one side of the lower part of the switch body (10); a rotating plate (48) is rotatably provided on the upper side of the first opening (47); a second opening (49) is provided on the rotating plate (48); a second filter plate (56) is obliquely fixedly provided inside the second opening (49); a first fixing seat (53) is fixedly provided on one side of the second movable frame (16); a second fixing seat (54) is fixedly provided on one side of the rotating plate (48); a connecting plate (55) is connected between the inside of the first fixing seat (53) and the inside of the second fixing seat (54); the oblique upper end of the connecting plate (55) is rotatably connected to the inside of the first fixing seat (53); the oblique lower end of the connecting plate (55) is rotatably connected to the inside of the second fixing seat (54); a fixing rod (51) is fixedly provided on the upper side of the first opening (47); a plurality of elastic blocks (52) are vertically fixedly provided on one side of the fixing rod (51) facing the second filter plate (56).

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