Sound production assembly and electronic equipment

Abstract

The invention discloses a sound production assembly and electronic equipment. The sound production assembly comprises a shell, a mounting cavity is defined by the shell, and a sound outlet is formed in one side face of the shell; the loudspeaker is arranged in the mounting cavity; a liquid cooling medium is arranged in the vapor chamber, the vapor chamber comprises an evaporation part and a condensation part, the evaporation part is arranged on the loudspeaker, the condensation part extends to the sound outlet, and the liquid cooling medium absorbs heat and evaporates at the evaporation part and condenses and flows back at the condensation part.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a sound-generating component and an electronic equipment. Background Art

[0002] Mobile terminals have evolved from traditional communication tools to platforms that carry many functions such as mobile applications, mobile content, and value-added services. Among the many functions of mobile terminals such as games, audio and video, and Internet access, audio playback is an important function. As mobile terminals have higher and higher requirements for music playback quality, in order to improve the sound quality of audio playback, the audio power is also getting higher and higher, which causes the temperature of the audio position to rise sharply when the device is in use.

[0003] In the related art, the heat dissipation performance of the audio component is poor, and the high temperature of the audio component brings a bad user experience. Summary of the invention

[0004] The embodiments of the present application provide a sound-generating component and an electronic device, which can solve the problem in the prior art that the heat dissipation performance of the sound-generating component is poor, affecting the user experience.

[0005] In a first aspect, an embodiment of the present application provides a sound-emitting component, comprising: a shell, the shell enclosing an installation cavity, a sound outlet being provided on one side of the shell; a speaker, arranged in the installation cavity; a heat spreader, a liquid cooling medium being arranged in the heat spreader, the heat spreader comprising an evaporation portion and a condensation portion, the evaporation portion being arranged on the speaker, the condensation portion extending to the sound outlet, the liquid cooling medium absorbing heat and evaporating in the evaporation portion, and condensing and refluxing in the condensation portion.

[0006] In a second aspect, an embodiment of the present application provides an electronic device, comprising the sound-emitting component of the embodiment of the first aspect mentioned above.

[0007] In this way, in the sound-emitting component and electronic device provided by the embodiments of the present application, the sound-emitting component includes a shell, a speaker and a heat spreader, the shell encloses an installation cavity, a sound outlet is provided on one side of the shell, the speaker is arranged in the installation cavity, the speaker vibrates the air in the cavity to generate sound, and the sound is transmitted to the outside through the sound outlet, a heat spreader is provided in the shell, a liquid cooling medium is provided in the heat spreader, the heat spreader includes an evaporation part and a condensation part, the evaporation part is provided on the speaker, the heat of the speaker is transferred to the evaporation part, the liquid cooling medium evaporates and absorbs heat, the heat is transferred from the evaporation part to the condensation part, the oscillating airflow at the sound outlet transfers the heat of the liquid cooling medium in the condensation part to the outside, and the liquid cooling medium condenses and dissipates heat.

[0008] Therefore, in the embodiment of the present application, a heat spreader is provided in the shell, and the heat spreader transfers the heat of the speaker to the sound outlet and dissipates it to the outside, so as to effectively reduce the temperature of the speaker and improve the heat dissipation performance of the sound-emitting component, so that the user can have a good user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 An exploded view of an audio assembly according to some embodiments of the present application;

[0011] Figure 2 A schematic diagram of the structure of a heat-conducting member of an audio assembly in some embodiments of the present application;

[0012] Figure 3 A schematic diagram of the structure of an audio assembly in some embodiments of the present application;

[0013] Figure 4 The audio components of some embodiments of the present application are Figure 1 Sectional view at AA in the middle;

[0014] Figure 5 Schematic diagram of the structure of the heat-conducting member of the audio assembly of other embodiments of the present application;

[0015] Figure 6 The audio components of other embodiments of the present application are Figure 1 Sectional view at AA in the middle;

[0016] Figure 7 This is a partial structural schematic diagram of the audio assembly of some embodiments of the present application.

[0017] Description of Figure Numbers:

[0018] 100. Sound generating component;

[0019] 110, housing; 111, mounting cavity; 112, sound outlet;

[0020] 120, speaker; 121, voice coil; 122, magnetic member; 1221, central magnet; 1222, peripheral magnet; 123, housing; 1231, accommodating cavity; 1232, communication port;

[0021] 130, heat sink; 131, evaporation part; 132, condensation part; 1321, sound outlet hole; 1322, covering section; 1323, connecting section; 133, sealing structure; 134, gap; X, first direction. DETAILED DESCRIPTION

[0022] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0023] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0024] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "middle", "back", "left", "right", "clockwise", "counterclockwise", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0025] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0026] See also Figure 1 and Figure 2 , Figure 1 An exploded view of an audio assembly according to some embodiments of the present application; Figure 2 This is a schematic diagram of the structure of the heat-conducting component of the audio assembly according to some embodiments of the present application.

[0027] First, as Figure 1 and Figure 2As shown, an embodiment of the present application provides a sound-emitting component 100, which includes a shell 110, a speaker 120 and a heat spreader 130. The shell 110 encloses a mounting cavity 111, and a sound outlet 112 is provided on one side of the shell 110; the speaker 120 is disposed in the mounting cavity 111; a liquid cooling medium is provided in the heat spreader 130, and the heat spreader 130 includes an evaporation portion 131 and a condensation portion 132. The evaporation portion 131 is disposed on the speaker 120, and the condensation portion 132 extends to the sound outlet 112. The liquid cooling medium absorbs heat and evaporates in the evaporation portion 131, and condenses and refluxes in the condensation portion 132.

[0028] In the sound-emitting component 100 and the electronic device provided in the embodiment of the present application, the sound-emitting component 100 includes a shell 110, a speaker 120 and a heat spreader 130. The shell 110 encloses a mounting cavity 111. A sound outlet 112 is provided on one side of the shell 110. The speaker 120 is arranged in the mounting cavity 111. The speaker 120 vibrates the air in the cavity to generate sound, and the sound is transmitted to the outside through the sound outlet 112. A heat spreader 130 is arranged in the shell 110. A liquid cooling medium is arranged in the heat spreader 130. The heat spreader 130 includes an evaporation portion 131 and a condensation portion 132. The evaporation portion 131 is arranged on the speaker 120. The heat of the speaker 120 is transferred to the evaporation portion 131. The liquid cooling medium evaporates and absorbs heat. The heat is transferred from the evaporation portion 131 to the condensation portion 132. The oscillating airflow at the sound outlet 112 conducts the heat of the liquid cooling medium in the condensation portion 132 to the outside, and the liquid cooling medium condenses and dissipates heat. By setting a heat spreader 130 in the housing 110, the heat spreader 130 transfers the heat of the speaker 120 to the sound outlet 112 and dissipates it to the outside, so as to effectively reduce the temperature of the speaker 120 and improve the heat dissipation performance of the sound-emitting component 100, so that the user can have a good user experience.

[0029] The speaker 120 is arranged in the installation cavity 111. The speaker 120 is connected to the device control mechanism. The control mechanism can be a main board or a sub-board. The speaker 120 receives the electrical signal transmitted by the control mechanism to cause vibration, squeezes the air in the installation cavity 111 to form sound waves, and the sound waves are transmitted to the outside from the sound outlet 112.

[0030] Exemplarily, the sound outlet 112 may be a speaker hole of the device.

[0031] Optionally, the shape and size of the sound outlet 112 can be designed by oneself. Exemplarily, the sound outlet 112 is circular or rectangular.

[0032] Optionally, the shell 110 may be made of plastic, metal, wood, or the like.

[0033] Optionally, the shape of the shell 110 can be designed by oneself. For example, the shell 110 is in a cubic shape or a cylindrical shape.

[0034] The speaker 120 is used to receive electric current and convert electric signals. The speaker 120 is the main heat-generating component of the sound-generating assembly 100. In order to reduce the temperature rise of the speaker 120 when in use, a heat spreader 130 is provided to be thermally connected to the speaker 120.

[0035] The evaporation part 131 is arranged on the speaker 120, which means that the evaporation part 131 and the speaker 120 are thermally connected, and the evaporation part 131 and the speaker 120 are in direct contact for heat exchange; or the evaporation part 131 and the speaker 120 are in indirect contact, and there is a heat conductive medium between the two, and the heat of the speaker 120 is transferred to the evaporation part 131 through the heat conductive medium, and the heat conductive medium can be a metal part, a heat conductive colloid, or air, etc.

[0036] The heat spreader 130 includes a body and a liquid cooling medium. A heat exchange flow channel is formed in the body, and the liquid cooling medium is contained in the heat exchange flow channel. The body can be made of metal, and for example, the body material is copper, aluminum, or stainless steel. In order to prevent the heat spreader 130 from interfering with the magnetic field of the speaker 120, the heat spreader 130 is a non-magnetic material. The liquid cooling medium can be ethanol, glycerol, or water.

[0037] The heat spreader 130 includes an evaporation portion 131 and a heat dissipation portion. The liquid cooling medium absorbs the heat of the speaker 120 at the evaporation portion 131 and evaporates to absorb heat; the gaseous liquid cooling medium is transferred to the condensation portion 132, and the airflow at the sound outlet 112 transfers the heat of the gaseous liquid cooling medium to the outside, the gaseous liquid cooling medium dissipates heat and condenses, and then the liquid liquid cooling medium flows back to the evaporation portion 131.

[0038] The condensation portion 132 may extend to the sound outlet 112 so that the orthographic projection of the condensation portion 132 on the housing 110 at least partially overlaps with the sound outlet 112 , so that the airflow of the sound outlet 112 can cool the heat spreader 130 .

[0039] The heat spreader 130 extends in the mounting cavity 111 . The heat spreader 130 improves the heat dissipation performance of the sound component 100 without increasing the overall size of the sound component 100 , which contributes to the lightweight design of the device.

[0040] Optionally, in order to further improve the heat dissipation effect of the sound-generating component 100 , an auxiliary heat dissipation plate may be provided on the outer surface of the housing 110 , and the auxiliary heat dissipation plate may be a graphite plate or a heat spreader 130 .

[0041] See also Figure 3 and Figure 4 , Figure 3 A schematic diagram of the structure of an audio assembly in some embodiments of the present application; Figure 4 The audio components of some embodiments of the present application are Figure 1 Cross-sectional view at AA in the middle.

[0042] In some embodiments, Figure 3 and Figure 4 As shown, the speaker 120 includes a voice coil 121 , and the evaporation portion 131 is attached to at least a portion of the side wall of the voice coil 121 .

[0043] In these embodiments, the voice coil 121 is a component that generates more heat in the speaker 120 , and the evaporation portion 131 is attached to at least a portion of the side wall of the voice coil 121 , which can conduct the heat of the speaker 120 more efficiently.

[0044] The loudspeaker 120 includes a housing 123, a voice coil 121, a diaphragm and a magnetic member 122. The housing 123 has an opening at one end, and the diaphragm covers the opening. The voice coil 121 and the diaphragm are connected and located in the housing 110. The magnetic member 122 is located in the housing 123 and forms a magnetic field. The voice coil 121 is connected to the control component of the device. The control component applies currents of different frequencies to the voice coil 121 to make the voice coil 121 vibrate in the magnetic field, and make the diaphragm vibrate differently to squeeze the air in the installation cavity 111, thereby generating sound waves. The voice coil 121 is the component in the loudspeaker 120 that receives current and generates the most heat, so the evaporation portion 131 is attached to the voice coil 121, so that the heat spreader 130 can more effectively transfer the heat of the loudspeaker 120.

[0045] The evaporation portion 131 is disposed on the side wall of the voice coil 121 to increase the contact area between the heat spreader 130 and the voice coil 121 , so that the heat spreader 130 can effectively conduct the heat of the speaker 120 .

[0046] Optionally, the evaporation portion 131 may be disposed on the inner wall or the outer wall of the voice coil 121 .

[0047] The evaporation portion 131 is attached to the side wall of the voice coil 121 , which means that the evaporation portion 131 and the voice coil 121 are thermally connected.

[0048] See also Figure 5 and Figure 6 , Figure 5 Schematic diagram of the structure of the heat-conducting member of the audio assembly of other embodiments of the present application; Figure 6 The audio components of other embodiments of the present application are Figure 1 Cross-sectional view at AA in the middle.

[0049] In some embodiments, Figure 5 and Figure 6 As shown, the heat spreader 130 includes two evaporation portions 131 that are spaced apart from each other. The two evaporation portions 131 are attached to the inner wall and the outer wall of the voice coil 121 , respectively.

[0050] In these embodiments, the heat spreader 130 includes two evaporation portions 131 spaced apart from each other. The two evaporation portions 131 are respectively attached to the inner wall and the outer wall of the voice coil 121 to increase the contact area between the heat spreader 130 and the voice coil 121 so that the heat spreader 130 can better transfer the heat of the voice coil 121.

[0051] The heat spreader 130 includes two evaporation parts 131 spaced apart from each other, and the voice coil 121 is disposed between the two evaporation parts 131 . The heat of the voice coil 121 can be transferred to the two evaporation parts 131 through its inner and outer side walls and dissipated to the outside at the condensation part 132 .

[0052] Optionally, the two evaporation portions 131 are coaxially arranged, and the voice coil 121 is located between the two evaporation portions 131 .

[0053] Optionally, the two evaporation sections 131 are connected to the same condensation section 132 to reduce the volume of the entire heat spreader 130 ; or the two evaporation sections 131 are respectively connected to one condensation section 132 to reduce the difficulty of designing the flow channel in the heat spreader 130 .

[0054] In some embodiments, Figure 2 and Figure 4 As shown, the evaporation portion 131 is disposed around the circumference of the voice coil 121 .

[0055] In these embodiments, the evaporation portion 131 is disposed around the voice coil 121 to increase the contact area between the heat spreader 130 and the voice coil 121 , so that the heat spreader 130 can better transfer the heat of the voice coil 121 .

[0056] Optionally, the shape of the evaporation portion 131 matches the shape of the voice coil 121, and the evaporation portion 131 is attached to the voice coil 121, so as to reasonably design the volume of the evaporation portion 131 and improve the heat dissipation effect of the heat spreader 130. For example, if the voice coil 121 is in a circular ring shape, the evaporation portion 131 is in a circular ring shape; or if the voice coil 121 is in a rectangular frame shape, the evaporation portion 131 is in a rectangular frame shape.

[0057] In some embodiments, Figure 1 , Figure 2 and Figure 4 As shown, a gap 134 is formed between two ends of the evaporation portion 131 along the circumference of the voice coil 121 , extending in the thickness direction of the speaker 120 and penetrating the evaporation portion 131 .

[0058] In these embodiments, a gap 134 is formed between the two ends of the evaporation portion 131 along the circumferential side of the voice coil 121, extending in the thickness direction of the speaker 120 and penetrating the evaporation portion 131. The relative positions of the ends of the evaporation portion 131 on both sides of the gap 134 are adjustable, that is, the inner diameter of the evaporation portion 131 is adjustable, so that the evaporation portion 131 can fit the voice coil 121 as closely as possible, thereby improving the thermal conductivity of the evaporation portion 131 and reducing the difficulty of assembling the evaporation portion 131 and the voice coil 121.

[0059] The evaporation portion 131 includes a first end and a second end, and the first end and the second end are spaced apart to form a gap 134. The distance between the first end and the second end is adjustable through the gap 134. The specific size and shape of the gap 134 can be flexibly designed. For example, the gap 134 is a rectangular gap 134 or a wavy gap 134.

[0060] Exemplarily, when the evaporation portion 131 is disposed on the outer wall of the voice coil 121, the first end and the second end are separated from each other, the gap 134 is increased, the inner diameter of the evaporation portion 131 is increased, and the evaporation portion 131 is easily mounted on the voice coil 121. After the evaporation portion 131 is mounted on the voice coil 121, the first end and the second end are close to each other, the gap 134 is reduced, the inner diameter of the evaporation portion 131 is reduced, and the evaporation portion 131 is attached to the outer wall of the voice coil 121; when the evaporation portion 131 is disposed on the inner wall of the voice coil 121, the first end and the second end are close to each other, the gap 134 is reduced, the outer diameter of the evaporation portion 131 is reduced, and the evaporation portion 131 is easily mounted in the voice coil 121. Thereafter, the first end and the second end are separated from each other, the gap 134 is increased, the outer diameter of the evaporation portion 131 is increased, and the evaporation portion 131 is attached to the inner wall of the voice coil 121.

[0061] Optionally, the heat exchange channel extends from the first end to the second end and to the condensation portion 132. Through the gap 134 between the first end and the second end, it is possible to avoid the liquid cooling medium from flowing back and forth between the first end and the second end instead of flowing to the condensation portion 132, resulting in poor heat dissipation effect of the heat spreader 130.

[0062] In some embodiments, Figure 1 , Figure 2 and Figure 4 As shown, the speaker 120 also includes a magnetic member 122, and the magnetic member 122 includes a central magnet 1221 and peripheral magnets 1222, the peripheral magnets 1222 are arranged around the central magnet 1221, the voice coil 121 is arranged around the central magnet 1221, and the evaporation portion 131 is attached to the side wall of the voice coil 121 facing the central magnet 1221, or the evaporation portion 131 is attached to the side wall of the voice coil 121 facing the peripheral magnet 1222.

[0063] In these embodiments, the circumferential magnets 1222 are arranged around the central magnet 1221, and the voice coil 121 is sleeved on the circumferential side of the central magnet 1221. The voice coil 121 can move in the magnetic field formed by the circumferential magnets 1222 and the central magnet 1221. The evaporation portion 131 is attached to the side wall of the voice coil 121 facing the central magnet 1221, or the evaporation portion 131 is attached to the side wall of the voice coil 121 facing the circumferential magnet 1222, so as to reasonably configure the positions of the magnetic component 122, the heat spreader 130 and the voice coil 121. The heat spreader 130 is close to the voice coil 121, so as to improve the heat dissipation effect of the heat spreader 130 on the voice coil 121.

[0064] In the above embodiment, the inner wall of the voice coil 121 is the side wall of the voice coil 121 facing the central magnet 1221 ; the outer wall of the voice coil 121 is the side wall of the voice coil 121 facing the peripheral magnet 1222 .

[0065] Optionally, the evaporation portion 131 is disposed around the side wall of the voice coil 121 facing the central magnet 1221, or the evaporation portion 131 is disposed around the side wall of the voice coil 121 facing the peripheral magnet 1222, so as to increase the contact area between the evaporation portion 131 and the voice coil 121 and enhance the heat dissipation effect of the heat spreader 130 on the voice coil 121.

[0066] Exemplarily, the circumferential magnets 1222 and the central magnet 1221 are arranged at intervals, a plurality of circumferential magnets 1222 surround the circumference of the central magnet 1221 , and the voice coil 121 is located between the central magnet 1221 and the circumferential magnets 1222 .

[0067] In some embodiments, Figures 1 to 4 As shown, the condensation portion 132 covers the sound outlet 112 , and the condensation portion 132 is provided with a plurality of sound outlet through holes 1321 .

[0068] In these embodiments, the condensation portion 132 covers the sound outlet 112 so that the condensation portion 132 has a larger area to contact the vibrating airflow at the sound outlet 112, so that the high temperature of the heat spreader 130 is transferred to the outside by the airflow. The condensation portion 132 is provided with a plurality of sound outlet holes 1321, and the sound outlet holes 1321 are used to connect the installation cavity 111 and the external environment. Therefore, after the condensation portion 132 covers the sound outlet 112, the speaker 120 can transmit sound waves to the outside through the sound outlet holes 1321, and the sound outlet holes 1321 provided in the condensation portion 132 also increase the contact area between the sound outlet holes 1321 and the external environment, thereby improving the heat dissipation effect of the heat spreader 130 on the speaker 120.

[0069] The condenser 132 covers the sound outlet 112, and the sound outlet 112 is located within the orthographic projection of the condenser 132 on the housing 110. Exemplarily, the condenser 132 is connected to the inner wall of the sound outlet 112 to reduce the size of the heat sink 130 while covering the sound outlet 112; or the condenser 132 is attached to the inner wall of the housing 110 to increase the contact area between the condenser 132 and the housing 110, thereby improving the sealing performance and connection reliability.

[0070] Optionally, the condensing portion 132 is bonded or snap-connected to the shell 110 to improve the connection reliability between the heat spreader 130 and the shell 110 .

[0071] Optionally, a plurality of sound outlet holes 1321 are arranged in rows and columns on the condenser 132, and the specific number, size and shape of the sound outlet holes 1321 can be designed by oneself. Exemplarily, the sound outlet holes 1321 are circular holes or rectangular holes.

[0072] In some embodiments, Figures 1 to 4 As shown, the condensation portion 132 includes a connecting section 1323 and a covering section 1322, the connecting section 1323 is connected between the covering section 1322 and the evaporation portion 131, the covering section 1322 covers the sound outlet 112, and the sound outlet hole 1321 is arranged in the covering section 1322, wherein the size of the connecting section 1323 in the first direction X is smaller than the size of the covering section 1322 in the first direction X.

[0073] In these embodiments, the size of the connecting section 1323 in the first direction X is smaller than the size of the covering section 1322 in the first direction X. The smaller connecting section 1323 can reduce the influence of the heat spreader 130 on the sound effect of the sound-emitting component 100 when the heat spreader 130 extends in the installation cavity 111; the larger covering section 1322 can increase the contact area with the external environment, facilitate the airflow to transfer the heat of the heat spreader 130 to the outside, and enhance the heat dissipation effect of the heat spreader 130 on the speaker 120.

[0074] Optionally, the connecting section 1323 and the covering section 1322 are integrally formed to improve the sealing performance of the heat spreader 130 .

[0075] Optionally, the size of the evaporation portion 131 in the first direction X is greater than the size of the connecting section 1323 , so as to increase the contact area between the evaporation portion 131 and the voice coil 121 .

[0076] The first direction X may be a width direction of the vapor chamber 130 . The first direction X intersects or is perpendicular to an extension direction of the vapor chamber 130 . The extension direction of the vapor chamber 130 may be an arrangement direction of the evaporation portion 131 and the condensation portion 132 .

[0077] See also Figure 7 , Figure 7This is a partial structural schematic diagram of the audio assembly of some embodiments of the present application.

[0078] In some embodiments, Figure 1 , Figure 4 and Figure 7 As shown, the speaker 120 also includes a shell 123, which encloses a accommodating cavity 1231. The voice coil 121 is arranged in the accommodating cavity 1231. A connecting port 1232 is penetrated through one side of the shell 123. The condensation part 132 is connected to the evaporation part 131 through the connecting port 1232, and a sealing structure 133 is arranged between the condensation part 132 and the connecting port 1232.

[0079] In these embodiments, the shell 123 encloses a accommodating cavity 1231 for accommodating the voice coil 121, the magnetic component 122 and the evaporation portion 131, etc. A connecting port 1232 is provided through one side of the shell 123, the condensation portion 132 is connected to the evaporation portion 131 through the connecting port 1232, and a sealing structure 133 is provided between the condensation portion 132 and the connecting port 1232 to improve the sealing performance between the condensation portion 132 and the shell 123 to prevent the speaker 120 from leaking at the connecting port 1232, thereby affecting the performance of the sound-emitting component 100.

[0080] The sealing structure 133 may be a sealing colloid disposed between the condensation portion 132 and the communication port 1232 ; or the sealing structure 133 may be a sealing rubber ring that is interference fitly disposed between the condensation portion 132 and the communication port 1232 .

[0081] The shape of the connecting port 1232 matches the shape of the condensation portion 132. Exemplarily, the connecting port 1232 is a rectangular hole, a waist-shaped hole, or a circular hole.

[0082] Optionally, the heat sink 130 includes a plurality of condensation portions 132 , and the condensation portions 132 and the communication ports 1232 are arranged in a one-to-one correspondence; or a plurality of condensation portions 132 are arranged in one communication port 1232 .

[0083] In a second aspect, an embodiment of the present application provides an electronic device, comprising the sound-emitting component of the embodiment of the first aspect mentioned above.

[0084] Since the electronic device provided in the second aspect of the present application includes the sound-emitting component of any one of the first aspect embodiments, the electronic device provided in the second aspect of the present application has the beneficial effects of the sound-emitting component of any one of the first aspect embodiments, which will not be repeated here.

[0085] The electronic devices in the embodiments of the present application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, laptops, televisions, Bluetooth speakers, and other devices with sound-generating components.

[0086] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A sound-generating component, characterized in that: include: A housing, the housing encloses a mounting cavity, and a sound outlet is provided on one side of the housing; A speaker is arranged in the installation cavity; A heat spreader is provided with a liquid cooling medium, the heat spreader includes an evaporation portion and a condensation portion, the evaporation portion is provided on the speaker, the condensation portion extends to the sound outlet, the liquid cooling medium absorbs heat and evaporates in the evaporation portion, and condenses and refluxes in the condensation portion.

2. The sound generating assembly according to claim 1, characterized in that: The loudspeaker comprises a voice coil, and the evaporation portion is attached to at least a portion of a side wall of the voice coil.

3. The sound generating assembly according to claim 2, characterized in that: The heat spreader includes two evaporation parts that are spaced apart from each other, and the two evaporation parts are respectively attached to the inner wall and the outer wall of the voice coil.

4. The sound generating assembly according to claim 2, characterized in that: The evaporation portion is disposed around the circumference of the voice coil.

5. The sound generating assembly according to claim 4, characterized in that: A gap extending in a thickness direction of the speaker and penetrating the evaporation portion is formed between two ends of the evaporation portion along the circumference of the voice coil.

6. The sound generating assembly according to claim 2, characterized in that: The speaker also includes a magnetic component, which includes a central magnet and peripheral magnets. The peripheral magnets are arranged around the central magnet, the voice coil is arranged around the central magnet, and the evaporation portion is attached to the side wall of the voice coil facing the central magnet, or the evaporation portion is attached to the side wall of the voice coil facing the peripheral magnets.

7. The sound generating assembly according to claim 1, characterized in that: The condensation portion covers the sound outlet, and the condensation portion is provided with a plurality of sound outlet through holes.

8. The sound generating assembly according to claim 7, characterized in that: The condensation part includes a connecting section and a covering section, wherein the connecting section is connected between the covering section and the evaporation part, the covering section covers the sound outlet, and the sound outlet through hole is arranged in the covering section. Wherein, the dimension of the connecting section in the first direction is smaller than the dimension of the covering section in the first direction.

9. The sound generating assembly according to claim 2, characterized in that: The speaker also includes a shell, which encloses a housing cavity, and the voice coil is arranged in the housing cavity. A connecting port is provided through one side of the shell, and the condensation part is connected to the evaporation part through the connecting port. A sealing structure is provided between the condensation part and the connecting port.

10. An electronic device, characterized in that: The sound-generating component comprises the sound-generating component as described in any one of claims 1 to 9.

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