Method for solving creep distance problem of explosion-proof POS machine connector bonding pad

Abstract

The invention belongs to the technical field of explosion-proof POS machines, and discloses a method for solving the problem of the creep distance of a connector bonding pad of an explosion-proof POS machine, and the method comprises the specific steps: 1, firstly obtaining the pin spacing of a connector socket, taking the socket with the pin center point distance of 0.8 mm as an example, and taking the pin center point distance of 0.8 mm as an example; and at the moment, the worker judges that the equipment cannot meet the creepage distance requirement required by explosion prevention. According to the invention, the socket pins and the PCB pads are fully covered with the pouring sealant, the environment between the pins is completely sealed and isolated, contact of air, dust and impurities is effectively prevented, the conductive risk caused by external factors is eliminated, under the design, electrical connection similar to an internal structure is formed between the pins and the pads, the explosion-proof safety of a system is remarkably improved, and the service life of the system is prolonged. According to a specific explosion-proof standard, the minimum distance between the two bonding pads under the sealing structure only needs to meet 0.2 mm, so that the harsh requirement on a physical interval is greatly reduced, and a solution is provided for compact and efficient electrical design.

Description

Technical Field

[0001] The invention belongs to the technical field of explosion-proof POS machines, and in particular is a method for solving the problem of creepage distance of solder pads of connectors of explosion-proof POS machines. Background Art

[0002] An explosion-proof POS machine is a payment terminal device that has been specially designed and certified explosion-proof. It is mainly used for safe and reliable payment transactions in flammable, explosive and other dangerous environments. This type of POS machine has safety features such as anti-static and anti-spark, which can effectively prevent explosion accidents caused by electrical equipment and ensure the safety and stability of the payment process.

[0003] Because POS machines have many functions, many peripherals, and complex circuits, more connector pins are required, and the internal space structure of POS machines is also relatively compact. Therefore, connector sockets can only be selected with relatively small pin spacing, but the explosion-proof intrinsic safety ib or ia level requires at least 0.5mm between the contact pieces exposed to the air, and 0.5mm refers to the distance between the edges of the conductive conductors, that is, the distance between the edges of the two PCB pads of the connector socket is greater than 0.5mm. For example, the distance between the center points of the two pins of the connector is 0.8mm, and the width of the pin package pad recommended by the device specification is 0.5mm, so the edge of the pad is only 0.3mm, and the minimum distance required for explosion-proof is 0.5mm. Therefore, the socket with a pin center point distance of 0.8mm is far from meeting the creepage distance requirements required for explosion-proof. If the creepage distance cannot meet the requirements, when some circuits of the equipment fail and high voltage reaches the socket, sparks may be generated due to insufficient creepage distance, resulting in accidents, and the requirements of explosion-proof products cannot be met. Therefore, this application proposes a method for solving the creepage distance problem of the connector pad of explosion-proof POS machines. Summary of the invention

[0004] The purpose of the present invention is to provide a method for solving the creepage distance problem of the solder pad of an explosion-proof POS machine connector, so as to solve the problem raised in the above-mentioned background technology.

[0005] In order to achieve the above object, the present invention provides the following technical solution: a method for solving the creepage distance problem of the solder pad of an explosion-proof POS connector, the specific steps of the method are:

[0006] Step 1: First, obtain the pin spacing of the connector socket. Take the socket with a pin center distance of 0.8 mm as an example. At this time, the staff determines that the device cannot meet the creepage distance requirements required for explosion-proof.

[0007] Step 2, the staff then selects the encapsulation compound that meets the requirements and uses special tools or equipment to evenly apply the encapsulation compound on the surface of the socket to ensure that all pins and pads are covered;

[0008] Step 3: After the pouring is completed, check the pouring layer to ensure that there are no bubbles and no incomplete coverage. After the inspection is completed, wait for curing;

[0009] Step 4: After curing is completed, use special instruments to test the insulation performance, mechanical strength and other key indicators of the encapsulation layer to ensure that it meets the explosion-proof certification requirements. At the same time, check whether the creepage distance between the pin pads meets the relaxed 0.2mm requirement.

[0010] Preferably, in step 2, the socket surface and PCB pin pads need to be cleaned before encapsulation to remove oil and dust impurities, and the socket and PCB board need to be checked for damage or poor contact to ensure that the equipment is in good condition before encapsulation.

[0011] Preferably, when the method is used for encapsulation, the thickness of the encapsulation needs to be greater than 1 mm, and the encapsulation compound must be made of a material that meets the requirements of explosion-proof certification.

[0012] Preferably, the method requires regular inspection of the state of the encapsulation layer during use of the equipment to keep the equipment use environment clean and dry to avoid adverse effects on the encapsulation layer.

[0013] Preferably, after the socket is potted with the potting compound, the two pads of the pin are firmly surrounded by the potting compound, and the two pin pads are equivalent to the internal pins of a device.

[0014] Preferably, after the socket is cast and sealed, there is no air contact between the two pins, and there is no possibility of dust and impurities conducting electricity.

[0015] Preferably, after the encapsulation glue is cured, the method assembles the encapsulated equipment with other components, performs overall debugging and testing of the equipment, and verifies its electrical performance and explosion-proof performance.

[0016] Preferably, the method ensures a uniform coating speed during the coating process of the encapsulating glue, thereby preventing air from being mixed into the encapsulating glue and forming bubbles.

[0017] The beneficial effects of the present invention are as follows:

[0018] The present invention uses a casting sealant to fully cover the socket pins and PCB pads, thereby achieving a completely sealed isolation of the environment between the pins, effectively preventing contact with air, dust and impurities, and eliminating the risk of conduction caused by external factors. Under this design, an electrical connection similar to the internal structure is formed between the pin pads, which significantly improves the explosion-proof safety of the system. According to specific explosion-proof standards, the creepage distance under this sealed structure only needs to meet 0.2mm, which greatly reduces the stringent requirements on physical spacing and provides a solution for compact and efficient electrical design. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a flow chart of the encapsulation process of the present invention;

[0020] Figure 2 The recommended PCB package design dimension drawing of the socket device specification of the present invention;

[0021] Figure 3 This is the PCB LAYOUT package diagram of the socket with a pitch of 0.8 mm of the present invention;

[0022] Figure 4 This is the requirement diagram for creepage distance and spacing for explosion-proof certification of the present invention;

[0023] Figure 5 This is a physical picture of the socket with a pitch of 0.8 mm before encapsulation;

[0024] Figure 6 This is a real picture of the socket with a pitch of 0.8 mm after being cast in the present invention. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] like Figures 1 to 6 As shown, an embodiment of the present invention provides a method for solving the creepage distance problem of the solder pad of an explosion-proof POS machine connector. The specific steps of the method are as follows:

[0027] Step 1: First, obtain the pin spacing of the connector socket. Take the socket with a pin center distance of 0.8 mm as an example. At this time, the staff determines that the device cannot meet the creepage distance requirements required for explosion-proof.

[0028] like Figure 2As shown in the figure, the distance between the center points of the two pins of the connector is 0.8mm. The width of the pin package pad recommended in the device specification is 0.5mm, so the edge of the pad is only 0.3mm, and the minimum distance required for explosion-proof is 0.5mm. Therefore, the socket with a pin center distance of 0.8mm cannot meet the creepage distance requirement required for explosion-proof.

[0029] Step 2, the staff then selects the encapsulation compound that meets the requirements and uses special tools or equipment to evenly apply the encapsulation compound on the surface of the socket to ensure that all pins and pads are covered;

[0030] At this time, the two pads of the pin are not exposed to the air, but are firmly surrounded by the encapsulation glue. The two pin pads are equivalent to the internal pins of a device, and there is no air contact and no possibility of dust or other impurities conducting electricity between the two pins. In this state, the explosion-proof creepage distance requirement only needs to meet 0.2mm;

[0031] Step 3: After the pouring is completed, check the pouring layer to ensure that there are no bubbles and no incomplete coverage. After the inspection is completed, wait for curing;

[0032] Step 4: After curing is completed, use special instruments to test the insulation performance, mechanical strength and other key indicators of the encapsulation layer to ensure that it meets the explosion-proof certification requirements. At the same time, check whether the creepage distance between the pin pads meets the relaxed 0.2mm requirement.

[0033] By using a casting sealant to fully cover the socket pins and PCB pads, the environment between the pins is completely sealed and isolated, effectively preventing contact with air, dust and impurities, and eliminating the risk of conduction caused by external factors. Under this design, an electrical connection similar to the internal structure is formed between the pin pads, which significantly improves the explosion-proof safety of the system. According to specific explosion-proof standards, the creepage distance under this sealed structure only needs to meet 0.2mm, which greatly reduces the stringent requirements for physical spacing and provides a solution for compact and efficient electrical design.

[0034] Among them, step 2 needs to clean the socket surface and PCB pin pads before pouring, remove oil and dust impurities, check whether the socket and PCB board are damaged or have poor contact, and ensure that the equipment is in good condition before pouring.

[0035] Impurities such as oil, dust, etc. will seriously affect the adhesion and sealing of the encapsulant, causing bubbles, delamination or cracks in the encapsulation layer, reducing the overall protective effect. Thorough cleaning can ensure that the encapsulant can fit tightly to the socket and PCB surface to form a solid sealing layer; checking whether the socket and PCB board are damaged or have poor contact can avoid rework or equipment scrapping due to internal defects after encapsulation, reducing maintenance costs and downtime.

[0036] Among them, when pouring the seal in this method, the thickness of the seal must be greater than 1mm, and the pouring compound must be selected from materials that can meet the requirements of explosion-proof certification.

[0037] Among them, this method requires regular inspection of the state of the casting layer during the use of the equipment to keep the equipment use environment clean and dry to avoid adverse effects on the casting layer.

[0038] The condition of the cast-in-place layer is ensured through regular inspections, allowing staff to replace it promptly when the cast-in-place layer shows signs of damage or aging.

[0039] Among them, after the socket is potted, the two pads of the pin are firmly surrounded by the potting glue, and the two pin pads are equivalent to the internal pins of a device.

[0040] An electrical connection similar to the internal structure is formed between the pin pads, which significantly improves the explosion-proof safety of the system.

[0041] Among them, after the socket is cast and sealed, there is no air contact between the two pins, and there is no possibility of dust and impurities conducting electricity.

[0042] like Figure 5 and Figure 6 As shown, the encapsulant completely wraps the pin pads and pins, eliminating the possibility of them being exposed to the air, preventing the risk of short circuit or conduction caused by air, dust or other impurities, and providing insulation protection.

[0043] Among them, after the encapsulation glue is cured, the method assembles the encapsulated equipment with other components, conducts overall equipment debugging and testing, and verifies its electrical performance and explosion-proof performance.

[0044] Through multiple tests, the creepage distance of the connector pad is tested to improve safety performance.

[0045] Among them, this method needs to ensure a uniform glue coating speed during the glue coating process of the casting glue, so as to avoid mixing air into the casting glue and forming bubbles.

[0046] By applying the glue evenly, we can avoid the situation where the coating is too thick or too thin in some parts, and make the coating uniform, which is beneficial to improving the sealing performance.

[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for solving the creepage distance problem of the solder pad of an explosion-proof POS machine connector, characterized in that: The specific steps of this method are: Step 1: First, obtain the pin spacing of the connector socket. Take the socket with a pin center distance of 0.8 mm as an example. At this time, the staff determines that the device cannot meet the creepage distance requirements required for explosion-proof. Step 2, the staff then selects the encapsulation compound that meets the requirements and uses special tools or equipment to evenly apply the encapsulation compound on the surface of the socket to ensure that all pins and pads are covered; Step 3: After the pouring is completed, check the pouring layer to ensure that there are no bubbles and no incomplete coverage. After the inspection is completed, wait for curing; Step 4: After curing is completed, use special instruments to test the insulation performance and mechanical strength key indicators of the encapsulation layer to ensure that it meets the explosion-proof certification requirements. At the same time, check whether the creepage distance between the pin pads meets the relaxed 0.2mm requirement.

2. A method for solving the creepage distance problem of explosion-proof POS connector pads according to claim 1, characterized in that: In step 2, the socket surface and PCB pin pads need to be cleaned before encapsulation to remove oil and dust impurities, and the socket and PCB board need to be checked for damage or poor contact to ensure that the equipment is in good condition before encapsulation.

3. A method for solving the creepage distance problem of explosion-proof POS connector pads according to claim 1, characterized in that: When casting, the casting thickness is ensured to be greater than 1 mm, and the casting compound must be selected from materials that meet the requirements of explosion-proof certification.

4. A method for solving the creepage distance problem of explosion-proof POS connector pads according to claim 1, characterized in that: The method requires regular inspection of the state of the casting layer during the use of the equipment to keep the equipment use environment clean and dry to avoid adverse effects on the casting layer.

5. The method for solving the creepage distance problem of the solder pad of an explosion-proof POS machine connector according to claim 1, characterized in that: After the socket is potted, the two pads of the pin are firmly surrounded by the potting glue, and the two pin pads are equivalent to the internal pins of a device.

6. A method for solving the creepage distance problem of explosion-proof POS connector pads according to claim 1, characterized in that: After the socket is cast and sealed, there is no air contact between the two pins, and there is no possibility of electrical conduction due to dust and impurities.

7. A method for solving the creepage distance problem of explosion-proof POS connector pads according to claim 1, characterized in that: After the encapsulation glue is cured, the encapsulated equipment is assembled with other components, and the overall equipment is debugged and tested to verify its electrical performance and explosion-proof performance.

8. The method for solving the creepage distance problem of the solder pad of an explosion-proof POS machine connector according to claim 1, characterized in that: The method ensures a uniform glue coating speed during the glue coating process of the pouring sealant, thereby preventing air from being mixed into the pouring sealant and forming bubbles.

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