Cover member and method for manufacturing same

Abstract

A method for manufacturing a cover member includes a molding step for forming a protruding portion (8) of a cover member (4) by attracting a portion of a sheet glass (GS) while the sheet glass (GS) is fixed to a support table (17). The support base (17) is provided with a fixing part (20) for fixing the frame part (7) of the cover member (4). In the molding step, the fixing section (20) sucks the frame section (7) in the same direction as the direction in which a part of the sheet glass (GS) is suctioned.

Description

Technical Field

[0001] The present invention relates to a cover member for a package and a method for manufacturing the cover member. Background Art

[0002] For example, Patent Document 1 discloses an airtight package including a base (substrate) on which a light emitting element (LED element) is mounted, and a cover member (transparent body) fixed to the base so as to cover the light emitting element.

[0003] The cover member in this package includes a plate-shaped frame portion (eave portion) and a dome-shaped protrusion portion (convex cover portion) protruding from the frame portion.

[0004] A first bonding pattern composed of a metal layer is formed on the base. A second bonding pattern composed of a metal layer is formed on the frame of the cover member. The cover member is bonded to the base by bonding the first bonding pattern and the second bonding pattern using solder. As a result, the accommodation space of the light-emitting element formed between the base and the protruding portion of the cover member is hermetically sealed (see claim 1 of the document).

[0005] As a method of forming a metal layer as a second bonding pattern on the frame of the cover member, for example, a film forming process based on a physical vapor deposition method can be cited. In this method, it is desirable to assemble a masking member on the cover member to prevent metal particles from penetrating into the inside of the protrusion during film formation, so that the metal particles are attached only to the frame.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: International Publication No. 2021 / 251102 Summary of the invention

[0009] Problems to be solved by the invention

[0010] The cover member is formed, for example, by heating a flat plate of plate glass (forming step). In the forming step, a portion of the plate glass is heated to soften so as to form a protrusion, and the remaining plate-shaped portion surrounding the protrusion serves as a frame.

[0011] If a metal layer is formed on the cover member formed as described above, metal particles may penetrate into the protrusion and adhere to the inner surface of the protrusion. When metal particles adhere to the inner surface of the protrusion, the light extraction efficiency of the cover member decreases, which is not preferable.

[0012] The present invention has been made in view of the above circumstances, and a technical object of the present invention is to prevent metal particles from adhering to the inner surface of the protrusion of the cover member when a metal layer is formed on the cover member by a physical vapor deposition method.

[0013] Solutions to Solve Problems

[0014] (1) The present invention is a method for manufacturing a cover member for solving the above-mentioned problems, and the method for manufacturing a glass cover member for manufacturing a package including a light-emitting element is characterized in that the cover member has a plate-shaped frame portion and a protrusion protruding from the frame portion, and the method for manufacturing the cover member includes a forming step of forming the protrusion by sucking a part of the plate glass while the plate glass is fixed to a supporting platform, the supporting platform has a fixing portion for fixing the frame portion, and in the forming step, the fixing portion sucks the frame portion in the same direction as the direction in which the part of the plate glass is sucked.

[0015] According to the in-depth research of the inventors, it is found that the frame of the cover member is warped due to the forming process, and a gap is generated between the frame and the masking member, so that metal particles used to form the metal layer intrude into the protrusion. According to the present invention, in the forming process, the frame is attracted by the fixed part of the support table, so that the warping of the frame can be prevented. As a result, the masking member and the frame can be properly contacted. Therefore, when the metal layer is formed on the cover member by physical vapor deposition, the metal particles can be prevented from adhering to the inner surface of the protrusion of the cover member.

[0016] (2) In the method described in (1) above, in the forming step, the portion of the plate glass and the frame portion may be sucked by the fixing portion using a common suction device. This can also simplify the structure of the device used to implement this method.

[0017] (3) In the method described in (1) or (2), in the forming step, the suction of the portion of the plate glass and the suction of the frame portion by the fixing portion may be performed simultaneously. This allows the forming step to be performed efficiently.

[0018] (4) In the method described in any one of (1) to (3) above, in the forming step, the protruding portion and the frame portion may be formed by heating the plate glass.

[0019] (5) In the method described in any one of (1) to (4) above, the support platform may include a plurality of space portions for forming a plurality of the protrusions on the plate glass, the plurality of space portions being formed in a plurality of rows and columns, and the fixing portion may include a plurality of suction portions for sucking the plate glass, the plurality of suction portions being formed in a plurality of rows and columns in a manner corresponding to the plurality of space portions.

[0020] According to this structure, a plurality of protrusions can be efficiently formed on the plate glass.

[0021] (6) The present invention is a method for manufacturing a cover member for solving the above-mentioned problems, and the method for manufacturing a glass cover member for manufacturing a package including a light-emitting element is characterized in that the cover member has a plate-shaped frame portion and a protrusion protruding from the frame portion, the protrusion having an inner surface and an outer surface, the frame portion having a first main surface connected to the inner surface of the protrusion and a second main surface connected to the outer surface of the protrusion, and the method for manufacturing the cover member includes: a forming step, in which the protrusion is formed by attracting a part of the plate glass while the plate glass is fixed to a support table; a processing step, in which the frame portion is processed after the forming step; and a film forming step, in which a metal layer is formed on the frame portion by a physical vapor deposition method after the processing step, and in the processing step, a processing step is performed to flatten the first main surface of the frame portion.

[0022] According to this configuration, even if the frame portion is warped in the molding step, the first principal surface of the frame portion is flattened in the processing step, thereby allowing the masking member to contact the first principal surface without forming a gap therebetween.

[0023] (7) In the method of (6) above, in the processing step, the first main surface of the frame portion may be physically polished.

[0024] (8) In the method described in (6) or (7), the processing step may be configured to press the frame portion against the grinding tool using a pressing member, wherein the pressing member includes a receiving portion for receiving the protruding portion. According to this configuration, the pressing member can be prevented from contacting the protruding portion during the processing step.

[0025] (9) The present invention is a cover member for solving the above-mentioned problems, which is used for a package including a light-emitting element and is made of glass. The cover member is characterized in that the cover member has a plate-shaped frame portion and a protrusion protruding from the frame portion, the protrusion having an inner surface and an outer surface, the frame portion having a first main surface connected to the inner surface of the protrusion and a second main surface connected to the outer surface of the protrusion, and the first main surface has a polished surface.

[0026] According to this structure, by forming a grinding surface on the first main surface of the frame portion of the cover member, the masking member can be brought into contact with the grinding surface without a gap when the metal layer is formed on the grinding surface. Thus, when the metal layer is formed on the cover member by physical vapor deposition, it is possible to prevent metal particles from adhering to the inner surface of the protruding portion of the cover member.

[0027] (10) The present invention is a cover member for solving the above-mentioned problems, which is used for a package including a light-emitting element and is made of glass. The cover member is characterized in that the cover member has a plate-shaped frame portion and a protrusion protruding from the frame portion, the protrusion has a top portion and a base portion formed integrally with the frame portion, and the frame portion is thinner than the base portion.

[0028] (11) In the cover member described in (10), the protrusion may have a top portion, and the top portion of the protrusion may be thinner than the frame portion. This can improve light extraction efficiency of the cover member used in the package.

[0029] (12) In the cover member described in (10) above, the frame portion may be thicker than the top portion of the protruding portion.

[0030] Effects of the Invention

[0031] According to the present invention, when a metal layer is formed on a cover member by a physical vapor deposition method, it is possible to prevent metal particles from being attached to the inner surface of the protruding portion of the cover member. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a three-dimensional diagram of the package.

[0033] Figure 2 is a cross-sectional view of the package.

[0034] Figure 3 is a cross-sectional view of the substrate.

[0035] Figure 4 is a top view of the substrate.

[0036] Figure 5 is a cross-sectional view of the cover member.

[0037] Figure 6 It is a bottom view of the cover member.

[0038] Figure 7 It is a cross-sectional view showing a preparatory step of a method for manufacturing a package.

[0039] Figure 8 It is a cross-sectional view showing a preparatory step of a method for manufacturing a package.

[0040] Fig. 9 It is a cross-sectional view showing a film forming step in the method of manufacturing a package.

[0041] Fig.10 It is a cross-sectional view showing a film forming step in the method of manufacturing a package.

[0042] Fig.11 It is a cross-sectional view showing a film forming step in the method of manufacturing a package.

[0043] Fig.12 It is a cross-sectional view showing a state where the contact between the cover member and the shielding member is poor.

[0044] Fig.13 It is a cross-sectional view showing a bonding step in the method of manufacturing the package.

[0045] Fig.14 It is a cross-sectional view showing a bonding step in the method of manufacturing the package.

[0046] Fig.15 It is a cross-sectional view showing a glass substrate used for manufacturing a cover member for a package.

[0047] Fig.16 It is a cross-sectional view showing another example of the cover member.

[0048] Fig.17 It is a cross-sectional view showing another example of the cover member.

[0049] Fig.18 It is a plan view showing another example of the cover member.

[0050] Fig.19 is shown for forming Fig.18 A top view of a device for forming a cover member.

[0051] Fig. 20 It is a plan view showing another example of the cover member.

[0052] Fig.21 It is a bottom view showing another example of the cover member.

[0053] Fig. 22 is a cross-sectional view showing another example of the package.

[0054] Fig.23 It is a cross-sectional view showing another example of the cover member.

[0055] Fig.24 is a cross-sectional view showing another example of the package.

[0056] Fig.25 is a cross-sectional view of the cover member.

[0057] Fig.26 is a cross-sectional view of the cover member.

[0058] Fig. 27 It is a cross-sectional view showing another example of the preparatory step of the method for manufacturing the package.

[0059] Fig.28 It is a cross-sectional view showing a preparatory step of a method for manufacturing a package.

[0060] Fig.29 It is a cross-sectional view showing a preparatory step of a method for manufacturing a package.

[0061] Fig.30 It is a cross-sectional view showing a preparatory step of a method for manufacturing a package.

[0062] Fig.31 It is a top view of the forming device.

[0063] Fig.32 It is a top view of the forming device.

[0064] Fig.33 It is a cross-sectional view showing another example of the preparatory step of the method for manufacturing the package.

[0065] Fig.34 It is a cross-sectional view showing a preparatory step of a method for manufacturing a package.

[0066] Fig.35 It is a cross-sectional view showing a processing step in the preparatory step of the method for manufacturing the package.

[0067] Fig.36 It is a cross-sectional view showing a film forming step in the method of manufacturing a package. DETAILED DESCRIPTION

[0068] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figures 1 to 15 An embodiment of a package including a cover member of the present invention and a method for manufacturing the package will be described.

[0069] like Figure 1 as well as Figure 2 As shown, the package 1 includes a base 2 , a light emitting element 3 supported by the base 2 , a cover member 4 covering the base 2 and the light emitting element 3 , and a sealing portion 5 that airtightly bonds the base 2 and the cover member 4 .

[0070] Figure 3 as well as Figure 4 The base 2 is shown before the cover member 4 is bonded. The base 2 has a first main surface 2a supporting the light emitting element 3, a second main surface 2b located on the opposite side of the first main surface 2a, and a metal layer 6 formed on the first main surface 2a.

[0071] Examples of the material of the substrate 2 include ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, glass ceramics obtained by mixing and sintering these ceramics with glass powder, Fe—Ni—Co alloys, Cu—W alloys, and alloys such as Kovar (registered trademark).

[0072] like Figure 4As shown, the metal layer 6 has a frame shape surrounding the light emitting element 3. The metal layer 6 is a quadrilateral shape, but is not limited to this shape. The metal layer 6 may be formed in a circular shape so as to surround the light emitting element 3, for example.

[0073] The metal layer 6 includes three layers, namely, a base layer, an intermediate layer, and a surface layer, in order from the first main surface 2a side. Examples of metals used in the base layer include Cr, Ta, W, Ti, Mo, Ni, Pt, etc. Examples of metals used in the intermediate layer include Ni, Pt, Pd, etc. Examples of metals used in the surface layer include Au, Sn, Ag, Ni, Pt, etc. The metal used in the metal layer 6 may be a single substance or an alloy.

[0074] Examples of a method for forming the metal layer 6 on the first main surface 2 a of the base 2 include film forming methods such as sputtering, vacuum deposition, vacuum deposition using ion assistance or ion plating, and CVD.

[0075] The light emitting element 3 is fixed to the first main surface 2a of the base 2. In this embodiment, the package 1 using an ultraviolet irradiation LED as the light emitting element 3 is exemplified, but the light emitting element 3 of the present invention is not limited to this embodiment, and an infrared LED or a visible light LED may be used.

[0076] Figure 5 as well as Figure 6 The cover member 4 before being joined to the substrate 2 is shown. The cover member 4 is manufactured by molding a part of the plate glass. The glass used in the cover member 4 is preferably alkali-free glass, borosilicate glass, aluminosilicate glass, quartz glass, and crystallized glass. If it is alkali-free glass, borosilicate glass, or aluminosilicate glass, it is possible to achieve a balance between high transmittance and high processability during molding. In addition, if it is quartz glass, it is possible to have a significantly high transmittance in the ultraviolet region while maintaining processability during molding. In addition, if it is crystallized glass, it is possible to achieve a balance between high transmittance and high breaking strength.

[0077] When the glass is borosilicate glass, aluminosilicate glass or alkali-free glass, the glass composition preferably contains, by mass%, 50 to 75% SiO2, 1 to 25% Al2O3, 1 to 30% B2O3, 0 to 20% Li2O+Na2O+K2O, and 0 to 20% MgO+CaO+SrO+BaO. If the glass composition is within the above composition range, it belongs to these glass systems.

[0078] In the case of crystallized glass, as the glass composition, it is preferably a low thermal expansion crystallized glass containing 60 to 80% SiO2, 3 to 30% Al2O3, 1 to 20% Li2O + Na2O + K2O, 5 to 20% MgO + CaO + SrO + BaO in terms of mass %, and β-quartz solid solution or β-spodumene precipitated as crystals from the inside of the glass. Here, low thermal expansion refers to a thermal expansion coefficient of -10×10 -7 ~20×10 -7 / ℃.

[0079] like Figure 2 as well as Figure 5 As shown, the cover member 4 includes a plate-shaped frame 7, a dome-shaped protrusion 8 protruding from the frame 7, and a connection portion 9 connecting the frame 7 and the protrusion 8. The cover member 4 may include a first antireflection film 10a and a second antireflection film 10b.

[0080] The frame 7 has a constant thickness, for example, but is not limited to this embodiment. The thickness of the frame 7 is, for example, not less than 0.2 mm and not more than 2 mm. The frame 7 has a first main surface 7a and a second main surface 7b located on the opposite side of the first main surface 7a. The surface roughness (arithmetic mean roughness) Ra of the first main surface 7a is preferably not more than 1 nm, more preferably not more than 0.5 nm, and further preferably not more than 0.3 nm. The surface roughness Ra of the second main surface 7b is preferably not more than 1 nm, more preferably not more than 0.5 nm, and further preferably not more than 0.3 nm.

[0081] The protrusion 8 is used to form a storage space for the light-emitting element 3 together with the first main surface 2a of the base 2. The protrusion 8 is formed at the central position of the frame 7, but is not limited to this form. The protrusion 8 has an inner surface 8a configured as a concave curved surface, an outer surface 8b configured as a convex curved surface, and an opening 8c formed on the side of the inner surface 8a. In addition, the protrusion 8 includes a base 11, a middle portion 12, and a top 13. The base 11 is integrally formed with the connecting portion 9. The middle portion 12 is located between the base 11 and the top 13.

[0082] It should be noted that the base 11 refers to the portion where a normal line (hereinafter referred to as a "first line") L1 is drawn to the top 13, and a straight line (hereinafter referred to as a "second line") L3 at an angle of 5° with respect to the second line L2 is drawn from the intersection point P1 of the first line L1 and a straight line (hereinafter referred to as a "third line") L2 drawn along the second main surface 7b of the frame 7, and the third line L3 intersects with the protrusion 8. It should be noted that the portion where the third line L3 intersects with the inner surface 8a of the protrusion 8 is set as the first base 11a, and the portion where the third line L3 intersects with the outer surface 8b of the protrusion 8 is set as the second base 11b.

[0083] The midway portion 12 is a portion where a straight line L7 (hereinafter referred to as a “seventh line”) L7 forming an angle of 60° with respect to the second line L2 is drawn from the intersection point P1 of the first line L1 and the second line L2 and the seventh line L7 intersects the protrusion 8 .

[0084] Hereinafter, the distance from the intersection P2 of the first line L1 and the inner surface 8a of the protrusion 8 to the intersection P1 is referred to as the protrusion height of the protrusion 8 and is indicated by reference symbol H. The protrusion height H of the protrusion 8 is, for example, 0.5 mm to 80 mm.

[0085] The outer diameter D of the protrusion 8 is the diameter of the circle of points located at the position of the second base portion 11b, and is, for example, not less than 2 mm and not more than 150 mm. Figure 5 As shown, the thickness of the protrusion 8 gradually decreases from the base 11 toward the top 13. Therefore, the thickness Tmin of the top 13 is thinner than the thickness Tmax of the base 11. In addition, the thickness Tmax of the top 13 is thinner than the thickness of the frame 7.

[0086] The thickness Tmax of the base 11 is, for example, not less than 0.19 mm and not more than 1.9 mm. The thickness Tmin of the top 13 is, for example, not less than 0.15 mm and not more than 1 mm. The ratio Tmin / Tmax of the thickness Tmax of the base 11 to the thickness Tmin of the top 13 is preferably not less than 0.08 and not more than 0.9, more preferably not less than 0.1 and not more than 0.8, and further preferably not less than 0.2 and not more than 0.5.

[0087] like Figure 5 As shown in FIG. 1 , the protrusion 8 protrudes from the frame portion 7 at a predetermined protrusion angle θ. The protrusion angle θ is defined as follows.

[0088] The intersection of the second line L2 and the inner surface 8a of the protrusion 8 is set as the first reference point RP1. In the first line L1, a straight line (hereinafter referred to as the "fourth line") L4 parallel to the second line L2 is drawn from a point P3 located at a height position of half (H / 2) of the protrusion height H, and the intersection of the fourth line L4 and the inner surface 8a of the protrusion 8 is set as the second reference point RP2. A straight line (hereinafter referred to as the "fifth line") L5 passing through the first reference point RP1 and the second reference point RP2 is drawn, and the angle (acute angle) formed by the fifth line L5 and the sixth line L6 drawn in a manner along the first main surface 7a of the frame portion 7 is set as the protrusion angle θ.

[0089] In the present embodiment, the protrusion angle θ is preferably 40° or more, 45° or more, 50° or more, or 60° or more, and is preferably 90° or less, 85° or less, or 80° or less.

[0090] The inner surface 8a and the outer surface 8b of the protrusion 8 are formed as a continuous curved surface from the base 11 to the top 13. The surface roughness Ra of the inner surface 8a is preferably 1 nm or less, more preferably 0.5 nm or less, and further preferably 0.3 nm or less. The surface roughness Ra of the outer surface 8b is preferably 1 nm or less, more preferably 0.5 nm or less, and further preferably 0.3 nm or less.

[0091] The opening 8c of the protrusion 8 is used to allow the light emitting element 3 provided on the base 2 to enter the inner side of the protrusion 8 when the cover member 4 is fixed to the base 2. Figure 6 As shown in the figure, the opening 8c of the protrusion 8 is configured in a circular shape, but the shape is not limited to this.

[0092] The opening length L of the opening 8c (in this embodiment, the diameter of the opening 8c) is, for example, 1.5 mm or more and 80 mm or less. The ratio L / H of the opening length L of the opening 8c to the protrusion height H of the protrusion 8 is preferably 1.6 or more and 2.1 or more, and preferably 5 or less and 3 or less.

[0093] like Figure 2 as well as Figure 5 As shown, the connecting portion 9 has a curved shape for connecting the base 11 to the frame 7. The connecting portion 9 has a first curved surface 9a connecting the first main surface 7a of the frame 7 and the inner surface 8a of the protrusion 8, and a second curved surface 9b connecting the outer surface 8b of the protrusion 8 and the second main surface 7b of the frame 7.

[0094] The radius of curvature of the first curved surface 9a is larger than the radius of curvature of the second curved surface 9b. The radius of curvature of the first curved surface 9a is preferably greater than 0.5 mm and greater than 1 mm, preferably less than 5 mm and less than 4 mm. The radius of curvature of the second curved surface 9b is preferably greater than 0.5 mm and greater than 1.0 mm, preferably less than 5 mm and less than 4 mm. The surface roughness Ra of the first curved surface 9a is preferably less than 1 nm, more preferably less than 0.5 nm, and further preferably less than 0.3 nm. The surface roughness Ra of the second curved surface 9b is preferably less than 1 nm, more preferably less than 0.5 nm, and further preferably less than 0.3 nm.

[0095] The first antireflection film 10a is formed on the inner surface 8a of the protrusion 8 and the first main surface 7a of the frame 7. The first antireflection film 10a preferably has a multilayer film structure including, for example, a silicon oxide film (SiO2) as a first film and a hafnium oxide film (HfO2) as a second film alternately.

[0096] In the first anti-reflection film 10a, a portion (hereinafter referred to as "anti-reflection portion") 10a1 formed on the inner surface 8a of the protrusion 8 is configured so that the film thickness gradually decreases from the top 13 of the protrusion 8 toward the base 11. That is, the thickness of the portion of the anti-reflection portion 10a1 formed on the top 13 is the thickest, and the thickness of the portion of the anti-reflection portion 10a1 formed on the base 11 is the thinnest.

[0097] The thickness of the first anti-reflection film 10a at the base 11 of the protrusion 8 is preferably 0.12 μm or more and 0.64 μm or less. The thickness of the first anti-reflection film 10a at the mid-portion 12 of the protrusion 8 is preferably 0.14 μm or more and 0.72 μm or less. The thickness of the first anti-reflection film 10a at the top 13 of the protrusion 8 is preferably 0.15 μm or more and 0.8 μm or less.

[0098] In the first antireflection film 10a, a portion (hereinafter referred to as a "buffer portion") 10a2 formed on the first main surface 7a of the frame portion 7 has a constant film thickness. The buffer portion 10a2 has a function of preventing reflection of ultraviolet rays and also has a function of relieving stress acting on the frame portion 7 when the cover member 4 is bonded to the base 2.

[0099] The second antireflection film 10b is formed on the outer surface 8b of the protrusion 8 and the second main surface 7b of the frame 7. The second antireflection film 10b preferably has a multilayer film structure including, for example, silicon oxide films (SiO2) as first films and hafnium oxide films (HfO2) as second films alternately.

[0100] In the second anti-reflection film 10b, a portion (hereinafter referred to as "anti-reflection portion") 10b1 formed on the outer surface 8b of the protrusion 8 is configured so that the film thickness gradually decreases from the top 13 toward the base 11. That is, the thickness of the portion of the anti-reflection portion 10b1 formed on the top 13 is the thickest, and the thickness of the portion of the anti-reflection portion 10b1 formed on the base 11 is the thinnest.

[0101] The thickness of the second anti-reflection film 10b at the base 11 of the protrusion 8 is preferably 0.12 μm or more and 0.64 μm or less. The thickness of the second anti-reflection film 10b at the mid-portion 12 of the protrusion 8 is preferably 0.14 μm or more and 0.72 μm or less. The thickness of the second anti-reflection film 10b at the top 13 of the protrusion 8 is preferably 0.15 μm or more and 0.8 μm or less.

[0102] It should be noted that, when the light extraction efficiency is sufficient, it is not necessary to form the second anti-reflection film 10b. However, when a glass with poor weather resistance such as borosilicate glass is used for the cover member, the cover member 4 deteriorates due to the external environment, resulting in a decrease in light extraction efficiency. In this case, instead of forming the second anti-reflection film 10b on the cover member 4, a SiO2 film or an Al2O3 film can be formed as a film with weather resistance. In addition, a SiO2 film or an Al2O3 film can be formed as a film with weather resistance in the form of a laminate on the second anti-reflection film 10b.

[0103] like Figure 2 , Figure 5 as well as Figure 6 As shown, a metal layer 14 and a bonding portion 15 are formed in the buffer portion 10a2 of the first anti-reflection film 10a. The Young's modulus of the buffer portion 10a2 is preferably 250 GPa or less, more preferably 200 GPa or less, further preferably 150 GPa or less, and particularly preferably 100 GPa or less. If the upper limit is set in this way, the buffering property of the buffer portion 10a2 can be improved, and the effect of alleviating the stress caused by the difference in thermal expansion coefficients between the bonding portion 15 and the cover member 4 (frame portion 7) can be obtained. It should be noted that the thermal expansion coefficient of the frame portion 7 is smaller than the thermal expansion coefficient of the bonding portion 15. In addition, the thermal expansion coefficient of the frame portion 7 is smaller than the thermal expansion coefficient of the substrate 2.

[0104] The thickness of the buffer portion 10a2 is preferably 0.1 μm or more and 0.2 μm or more, and preferably 1.0 μm or less and 0.8 μm or less. If the lower limit is set in this way, the buffering property of the buffer portion 10a2 can be further improved, and the stress caused by the difference in thermal expansion coefficient between the bonding portion 15 and the cover member 4 (frame portion 7) can be alleviated. In addition, if the upper limit is set in this way, the manufacturing cost of the buffer portion 10a2 can be reduced.

[0105] like Figure 5 as well as Figure 6 As shown in FIG. 1 , the metal layer 14 is formed to overlap the buffer portion 10a2. The metal layer 14 is formed on the surface of the buffer portion 10a2 opposite to the surface of the buffer portion 10a2 in contact with the first main surface 7a of the frame portion 7. Figure 6 As shown, the metal layer 14 has a quadrilateral frame shape in a manner corresponding to the shape of the metal layer 6 of the substrate 2. The shape of the metal layer 14 is not limited to this embodiment. The metal layer 14 may also have a circular shape or other various frame shapes. The metal layer 14 includes three layers, namely, a base layer, an intermediate layer, and a surface layer, in order from the buffer portion 10a2 side.

[0106] As the metal used in the base layer, for example, Cr, Ta, W, Ti, Mo, Ni, Pt, etc. can be cited. When Cr is used in the base layer, the Young's modulus of the base layer is preferably 279 GPa or less. As the metal used in the intermediate layer, for example, Ni, Pt, Pd, etc. can be cited. As the metal used in the surface layer, for example, Au, Sn, Ag, Ni, Pt, etc. can be cited. The metal used in the metal layer 14 can be a single substance or an alloy.

[0107] like Figure 5 as well as Figure 6 As shown, the bonding portion 15 is formed in a layered manner so as to overlap with the metal layer 14. Figure 5 As shown, the bonding portion 15 is in contact with a portion of the metal layer 14 on the opposite side of the portion in contact with the buffer portion 10a2. Figure 6 As shown, the bonding portion 15 has a quadrilateral frame shape corresponding to the shapes of the buffer portion 10a2 and the metal layer 14. The shape of the bonding portion 15 is not limited to the present embodiment, and may be circular or other various frame shapes.

[0108] The joint 15 is made of a metal-based joint material. As the metal-based joint material, a commercially available material as a solder or a brazing material can be used. As the metal-based joint material, for example, Au-Sn alloy, Pb-Sn alloy, Au-Ge alloy, Sn-Ni alloy, etc. can be cited. It should be noted that by making the width of the joint 15 narrower than the width of the buffer portion 10a2, the influence of the stress caused by the difference in thermal expansion coefficient between the joint 15 and the cover member 4 can be reduced. In this embodiment, the case of using an Au-Sn alloy as a metal-based joint material is described.

[0109] The sealing portion 5 is formed by integrally joining the metal layer 6 of the base 2 and the metal layer 14 of the cover member 4 via the joining portion 15 .

[0110] Next, a method for manufacturing the package 1 will be described. This method includes a preparation step of preparing the base 2 and the cover member 4 and a bonding step of bonding the base 2 and the cover member 4.

[0111] In the preparation step, after the metal layer 6 is formed on the first main surface 2 a of the base 2 , the light emitting element 3 is mounted on the first main surface 2 a .

[0112] In addition, in the preparation process, after the cover member 4 is formed by molding the protruding portion 8 on the plate glass, the first anti-reflection film 10a is formed on the cover member 4. Thereafter, the metal layer 14 and the bonding portion 15 are formed on the buffer portion 10a2 of the first anti-reflection film 10a. It should be noted that the light extraction efficiency can be further improved by forming the second anti-reflection film 10b on the cover member 4.

[0113] Below, refer to Figures 7 to 12 The process of manufacturing the cover member 4 will be described. This process includes a molding process by heating and a film forming process by a physical vapor deposition method.

[0114] Figure 7 The forming device 16 includes a support table 17 for supporting the plate glass GS, a heat source 18 for thermally deforming a part of the plate glass GS to form the protrusion 8 of the cover member 4, and an external force generating device 19 for applying an external force to a part of the plate glass GS.

[0115] The support 17 includes a fixing portion 20 that fixes the plate glass GS, and a space portion 21 that allows thermal deformation of a portion of the plate glass GS. The support 17 also includes an opening 17a that is surrounded by the fixing portion 20, and a suction portion 17b that suctions a portion of the plate glass GS. Examples of the material constituting the support 17 include metals, ceramics, and the like.

[0116] The fixing part 20 of the support platform 17 has a supporting surface 20a that supports the plate glass GS and a suction part 20b that suctions the main surface of the plate glass GS. The supporting surface 20a is composed of a flat surface. The suction part 20b of the fixing part 20 is formed so as to be exposed to a part of the supporting surface 20a. The suction part 20b is connected to the external force generating device 19.

[0117] The space portion 21 of the support stand 17 is formed inside the concave portion having a bottom. The space portion 21 of the support stand 17 is configured to mold the entire protrusion 8 of the cover member 4 in a non-contact state.

[0118] The opening 17a of the support 17 has a circular opening edge in a plan view, but is not limited thereto, and may also have a triangular shape, a quadrilateral shape, a polygonal shape, an elliptical shape, or the like. The suction portion 17b of the support 17 is formed at the bottom of the recess and communicates with the space 21. The suction portion 17b is connected to the external force generating device 19 together with the suction portion 20b of the fixing portion 20. That is, the external force generating device 19 can perform suction by the suction portion 17b and suction by the suction portion 20b of the fixing portion 20 using a common suction device.

[0119] The present invention is not limited to the above-mentioned structure. In order to mold the shape of the cover member 4 with high precision, a lower receiving jig for receiving the plate glass GS may be provided in the space portion 21. The lower receiving jig is made of metal or ceramic. As mentioned above, it is preferable to mold the entire protrusion 8 of the cover member 4 in a non-contact state. However, by improving the quality of the surface of the lower receiving jig in contact with the plate glass GS (reducing the surface roughness and surface undulation), the cover member 4 can be molded with high precision even when the lower receiving jig is used.

[0120] The heating source 18 is arranged above the support 17. The heating source 18 of this embodiment is a burner that sprays flame FL toward the plate glass GS. By using the burner, the plate glass GS can be softened relatively quickly. It should be noted that the heating method of the heating source 18 may be, for example, resistance heating, laser heating, or heating using superheated steam. Here, superheated steam means high-temperature steam that is further heated by heating saturated steam generated by boiling water. In addition, the heating source 18 may also be composed of a combination of heating sources of different heating methods.

[0121] As the external force generating device 19, for example, a suction device (exhaust device) can be used. The suction device exhausts the gas existing in the space 21 of the support table 17, thereby setting the space 21 of the support table 17 to a negative pressure. As a result, a part of the plate glass GS is sucked into the space 21 of the support table 17, so that the thermal deformation of a part of the plate glass GS can be promoted. As the suction device, for example, a pump using a Venturi mechanism is suitable.

[0122] like Figure 7 As shown, in the forming process, the plate glass GS is placed on the fixing portion 20 of the support 17 in a state where the external force generating device 19 is stopped. Next, the external force generating device 19 is started to fix the plate glass GS on the fixing portion 20. In this forming process, the suction by the suction portion 17b of the support 17 and the suction by the suction portion 20b of the fixing portion 20 can be performed simultaneously. In this case, the suction direction D1 of the suction portion 17b to the plate glass GS and the suction direction D2 of the suction portion 20b to the plate glass GS of the fixing portion 20 can be set to the same direction.

[0123] Then, the plate glass GS is heated from above the support table 17 by the heat source 18. Figure 8 As shown, a part of the plate glass GS is thermally deformed to form the protrusion 8. In addition, a part of the plate glass GS fixed to the fixing portion 20 becomes the frame 7 to constitute the cover member 4. In order to suppress the warping of the frame 7 during the forming process, it is preferable to heat the frame 7 as well.

[0124] When the forming step is completed, a film forming step is performed, which includes a first film forming step of forming antireflection films 10 a and 10 b on cover member 4 and a second film forming step of forming metal layer 14 on frame portion 7 of cover member 4 after the first film forming step.

[0125] Fig. 9 as well as Fig.10 In the present embodiment, a sputtering device such as a magnetron sputtering device is exemplified as the film forming device, but the present invention is not limited to this structure, and a film forming device that performs other physical vapor deposition methods such as vacuum vapor deposition may also be used.

[0126] like Fig. 9 as well as Fig.10 As shown, the film forming apparatus 22 includes a vacuum chamber 23 and targets 24 a to 24 c for scattering particles of a film forming material that will form the anti-reflection films 10 a and 10 b .

[0127] The vacuum chamber 23 accommodates the targets 24a to 24c therein. The internal space of the vacuum chamber 23 is set to a predetermined vacuum degree by a vacuum pump. Inert gas such as argon gas can be supplied into the vacuum chamber 23 .

[0128] The targets 24 a to 24 c include a first target 24 a for forming the first antireflection film 10 a on the cover member 4 , a second target 24 b for forming the second antireflection film 10 b on the cover member 4 , and a third target 24 c for forming the metal layer 14 on the frame 7 of the cover member 4 .

[0129] The first target 24 a and the second target 24 b include a plurality of targets in order to form the first film (SiO 2 ) and the second film (HfO 2 ) in the first anti-reflection film 10 a and the second anti-reflection film 10 b .

[0130] like Fig. 9 As shown, in the first film forming step, the cover member 4 is accommodated in the vacuum chamber 23. Then, the first anti-reflection film 10a is formed by making the particles scattered from the first target material 24a adhere to the inner surface 8a of the protrusion 8 of the cover member 4 and the first main surface 7a of the frame 7. Similarly, the second anti-reflection film 10b is formed by making the particles scattered from the second target material 24b adhere to the outer surface 8b of the protrusion 8 of the cover member 4 and the second main surface 7b of the frame 7.

[0131] The amount of particles attached to the protrusion 8 of the cover member 4 is the largest at the top 13 and the smallest at the base 11. The difference in the amount of particles attached to the protrusion 8 is caused by the effect of the protrusion angle θ of the protrusion 8.

[0132] In the second film forming step, a masking member 25 is attached to the plate glass GS to form the metal layer 14 at a predetermined position of the frame 7. The masking member 25 has an opening 25a for allowing particles scattered from the third target material 24c to pass therethrough and adhere to the frame 7.

[0133] In the second film forming step, after the first film forming step, the metal layer 14 is formed so as to overlap with the buffer portion 10a2 of the first anti-reflection film 10a. Fig.10 As shown, particles scattered from the third target material 24c pass through the opening 25a and adhere to the first main surface 7a via the buffer portion 10a2 of the frame 7. Thus, a frame-shaped metal layer 14 having a constant thickness is formed.

[0134] Fig.11 as well as Fig.12 It is a diagram for comparing the assembled state of the masking member 25 with respect to the cover member 4 . Fig.11 The cover member 4 as an example formed in a state where the plate glass GS is fixed to the fixing portion 20 of the support stand 17 in the forming step is shown. Fig.12 A cover member 4 a is shown as a comparative example in which the plate glass GS is not fixed to the fixing portion 20 but is molded.

[0135] like Fig.11 As shown, in the cover member 4 after the molding process of this embodiment, the entire opening 25a of the masking member 25 is closed by the first main surface 7a of the frame 7. Thus, the metal layer 14 of uniform thickness can be stably formed on the first main surface 7a of the frame 7.

[0136] On the other hand, when the cover member 4a is formed without using the suction by the fixing portion 20 of the support table 17, warping occurs in the frame portion 7. When warping occurs in the frame portion 7, as shown in FIG. Fig.12 As shown, a gap is generated between the frame 7 and the masking member 25, and the opening 25a of the masking member 25 is not blocked by the first main surface 7a of the frame 7. When the film forming process is performed in this state, the metal particles scattered from the third target material 24c pass through the opening 25a of the masking member 25, and penetrate into the inner side of the protrusion 8 through the gap between the frame 7 and the masking member 25. In this case, the metal particles attached to the inner surface 8a of the protrusion 8 result in a decrease in the light extraction efficiency of the cover member 4.

[0137] When the film forming step is completed, the bonding portion 15 is formed so as to overlap with the metal layer 14. The bonding portion 15 is formed, for example, by a step (coating step) of coating a paste-like metal-based bonding material so as to overlap with the metal layer 14. Specific examples of the coating step include a printing method (screen printing method) using a mask, a coating method using a dispenser, and the like.

[0138] The bonding portion 15 is not limited to the above method, and may be formed, for example, by placing a molded body of a metal bonding material formed in advance into a predetermined frame shape so as to overlap the metal layer 14 on the first main surface 7 a of the frame portion 7 .

[0139] When the metal bonding material for the bonding portion 15 is applied to the first main surface 7a of the frame 7, a heat treatment step is performed to fix the metal bonding material to the metal layer 14 of the first main surface 7a. The heat treatment step includes a heating step and a cooling step.

[0140] In the heating step, the cover member 4 is heated by using a heating device such as a reflow furnace, so that the metal bonding material can be melted. The heating step can also be performed in a state where the furnace is filled with nitrogen. In the heating step, the cover member 4 is heated to a temperature of 300° C. or higher.

[0141] In the cooling process, the melted metal bonding material on the first main surface 7a of the frame 7 is cooled and solidified. The cooling process is preferably performed slowly at a cooling rate of 50°C / min. In the cooling process, stress is generated in the cover member 4 due to the difference in thermal expansion coefficient between the frame 7 and the bonding portion 15, but the buffer portion 10a2 of the first anti-reflection film 10a can relieve the stress.

[0142] like Fig.13 As shown, in the bonding step, the cover member 4 manufactured in the preparation step is overlapped with the base 2. Specifically, the first main surface 7a of the frame 7 of the cover member 4 is opposed to the base 2, and the bonding portion 15 is in contact with the metal layer 6 formed on the first main surface 2a of the base 2.

[0143] Next, if Fig.14 As shown, the pressing member 26 is placed on the frame portion 7 of the cover member 4. The pressing member 26 includes a weight 26a and a support member 26b that supports the weight 26a. As the weight 26a and the support member 26b, for example, metal or ceramic members are used.

[0144] The support member 26 b has a first support portion 26 b 1 that supports the weight 26 a and a second support portion 26 b 2 that supports the first support portion 26 b 1 .

[0145] The first support portion 26b1 has a support surface (upper surface) on which the weight 26a is placed. The second support portion 26b2 includes a plurality of rod-shaped members. The second support portion 26b2 protrudes downward from the lower surface of the first support portion 26b1.

[0146] The second support portion 26b2 has a contact portion 26b3 that contacts the frame portion 7 of the cover member 4. The contact portion 26b3 is configured in a pointed shape. The contact portion 26b3 contacts the second main surface 7b of the frame portion 7 via the second antireflection film 10b.

[0147] The pressing member 26 contacts the frame portion 7 via the contact portions 26b3 of the plurality of second supporting portions 26b2, thereby pressing the cover member 4 in a state of being self-supporting on the cover member 4. By pressing the cover member 4 with the pressing member 26, the joint portion 15 formed on the frame portion 7 of the cover member 4 can be brought into close contact with the metal layer 6 formed on the first main surface 2a of the base 2.

[0148] After that, the metal layer 6 and the joint portion 15 are heated in a state where they are pressed together (heating process). As a result, the metal-based joint material of the joint portion 15 is in a molten state. It should be noted that in this heating process, the pointed contact portion 26b3 of the second support portion 26b2 contacts the frame portion 7 of the cover member 4, so the contact area between the contact portion 26b3 and the frame portion 7 can be minimized. As a result, the heat transfer from the frame portion 7 to the second support portion 26b2 of the pressing member 26 can be suppressed to a minimum.

[0149] After that, the melted metal-based bonding material is solidified by cooling (cooling process). In the cooling process, stress is generated in the frame 7 due to the difference in thermal expansion coefficient between the base 2 and the frame 7 of the cover member 4. In this case, the buffer portion 10a2 of the first anti-reflection film 10a is deformed in a manner to relieve the stress. Thus, damage to the frame 7 can be reduced.

[0150] When the cooling process is completed, the sealing portion 5 is formed by integrally bonding the metal layer 6 of the base 2 and the metal layer 14 of the cover member 4 at the bonding portion 15. As described above, the package 1 having airtightness ensured is completed.

[0151] According to the present embodiment described above, in the forming process, the frame portion 7 of the cover member 4 is attracted by the fixing portion 20 of the support 17, thereby preventing the frame portion 7 from warping. Thus, the frame portion 7 can be closed by the masking member 25, thereby preventing the metal particles scattered from the third target material 24c from adhering to the inner surface 8a of the protrusion 8.

[0152] It should be noted that, in the above-mentioned embodiment, the thickness of the top 13 of the protruding portion 8 of the cover member 4 is thinner than the thickness of the base 11, and in contrast, the thickness of the anti-reflection films 10a and 10b is thicker at the top 13 and thinner at the base 11. According to the above-mentioned structure of the protruding portion 8, the light emitted from the light emitting element 3 is relatively easy to pass through the top 13 of the protruding portion 8, and is relatively difficult to pass through the base 11. That is, in this embodiment, the thickness of the anti-reflection films 10a and 10b is made thicker at the portion where light is relatively easy to pass through, and the thickness of the anti-reflection films 10a and 10b is made thinner at the portion where light is relatively difficult to pass through.

[0153] The anti-reflection films 10a and 10b absorb a small amount of light that is transmitted. The thicker the anti-reflection films 10a and 10b are, the more the light is absorbed. Therefore, as described above, the thickness of the anti-reflection films 10a and 10b at the base 11 of the protrusion 8, where light is difficult to transmit, is thin, so that light can be transmitted relatively evenly in the base 11 and the top 13.

[0154] Fig.15 An example of a glass substrate for manufacturing a cover member 4 is shown. The glass substrate G includes a frame portion 7 and a plurality of protrusions 8 protruding from the frame portion 7. In addition, the glass substrate G can include anti-reflection films 10a and 10b. Each protrusion 8 has the same structure as the protrusion 8 of the cover member 4 described above. Each protrusion 8 is formed by thermally deforming a plurality of portions of a large plate glass GS using the above-mentioned forming device 16. If the glass substrate G is cut along the cutting line CL, a plurality of cover members having the protrusion 8, the frame portion 7, and the anti-reflection films 10a and 10b can be efficiently manufactured. It should be noted that a metal layer 14 and a bonding portion 15 may also be formed on the first anti-reflection film 10a.

[0155] Fig.16 1 shows another example of a cover member. In this example, the cover member 4 includes a frame portion 7 and a plurality of protrusions 8 protruding from the frame portion 7. In addition, the cover member 4 can include anti-reflection films 10a, 10b, a metal layer 14, and a bonding portion 15. The components of the cover member 4 have the same structure as described above ( Figure 5 ) has the same structure as the cover member 4. When a plurality of light emitting elements 3 are mounted on the base body 2, the cover member 4 can seal each light emitting element 3 individually using a plurality of protrusions 8.

[0156] Fig.17 Another example of the cover member is shown. In this example, the inner surface 8a of the cover member 4 has a first curved surface 8a1 and a second curved surface 8a2 having different curvature radii and a boundary portion 8a3 located between the first curved surface 8a1 and the second curved surface 8a2. The curvature radius of the first curved surface 8a1 formed on the base 11 side of the protrusion 8 is smaller than the curvature radius of the second curved surface 8a2 formed on the top 13 side of the protrusion 8.

[0157] The outer surface 8b of the cover member 4 has a first curved surface 8b1 and a second curved surface 8b2 having different curvature radii and a boundary portion 8b3 between the first curved surface 8b1 and the second curved surface 8b2. The first curved surface 8b1 formed on the base 11 side of the protrusion 8 has a smaller curvature radius than the second curved surface 8b2 formed on the top 13 side of the protrusion 8.

[0158] Fig.18 1 is a top view showing another example of a cover member. In this example, the cover member 4 has a plurality of protrusions 8 arranged in a plurality of rows and columns and having a circular shape in a top view. In addition, the cover member 4 can have anti-reflection films 10a, 10b (the first anti-reflection film 10a is not shown in the figure), a metal layer 14 (not shown in the figure), and a bonding portion 15 (not shown in the figure).

[0159] Fig.19 Shown for manufacturing Fig.18 The support platform 17 is a support platform for forming a cover member 4 shown in FIG. The support platform 17 is capable of forming a plurality of protrusions 8 on the plate glass GS. The support platform 17 has a plurality of space portions 21 and an opening portion 17a and a suction portion 17b corresponding to each space portion 21. The space portion 21, the opening portion 17a and the suction portion 17b are formed in a plurality of rows and columns in a plan view. The fixed portion 20 of the support platform 17 has a support surface 20a and a plurality of suction portions 20b configured to surround each opening portion 17a. The suction portion 20b of the fixed portion 20 is formed in a plurality of rows and columns in a manner corresponding to the space portion 21. The suction portion 20b is configured in a circular ring shape, but is not limited thereto and may also be configured in other shapes.

[0160] Fig. 20 : is a top view showing another example of a cover member. In this example, the cover member 4 has a plurality of protrusions 8 configured in a quadrilateral shape when viewed from above. It should be noted that, with respect to the cover member 4 having a plurality of protrusions 8 arranged in a plurality of rows and columns, by engraving a score line on the smooth surface between adjacent protrusions 8, cutting the cover member 4 along the score line or cutting by a blade cutting method or a laser ablation method, a plurality of cover members can be obtained, and a cover member of any shape can be obtained.

[0161] Fig.21 4 is a bottom view showing another example of a cover member. Fig. 20 The example shown also has a protrusion 8 configured in a quadrilateral shape in plan view. With this structure, the opening 8c of the protrusion 8 is configured in a quadrilateral shape (for example, a square shape). When the opening 8c is configured in a square shape, its opening length L is equivalent to the length of one side of the square. When the opening 8c is configured in a rectangular shape, its opening length L is equivalent to the length of the long side of the rectangle.

[0162] Fig. 22 Another example of a package is shown. The package 1 in this example includes a base 2 on which a plurality of light emitting elements 3 are mounted and Fig.16 The cover member 4 is illustrated in FIG. The cover member 4 seals each light emitting element 3 mounted on the base 2 individually using a plurality of protrusions 8 and a sealing portion 5 .

[0163] Fig.23 Another example of the cover member is shown. In this example, the inner surface 8a of the cover member 4 has a first curved surface 8a1 convex toward the inner side of the protrusion 8, a second curved surface 8a2 convex toward the outer side of the protrusion 8, and an inflection point 8a3 located between the first curved surface 8a1 and the second curved surface 8a2. The first curved surface 8a1 is formed at a position closer to the base 11 of the protrusion 8 than the second curved surface 8a2. The center of curvature of the first curved surface 8a1 is located outside the protrusion 8. The second curved surface 8a2 is formed at a position closer to the top 13 than the first curved surface 8a1. The center of curvature of the second curved surface 8a2 is located inside the protrusion 8.

[0164] The outer surface 8b of the cover member 4 has a first curved surface 8b1 convex toward the inner side of the protrusion 8, a second curved surface 8b2 convex toward the outer side of the protrusion 8, and an inflection point 8b3 located between the first curved surface 8b1 and the second curved surface 8b2. The first curved surface 8b1 is formed at a position closer to the base 11 of the protrusion 8 than the second curved surface 8b2. The center of curvature of the first curved surface 8b1 is located outside the protrusion 8. The second curved surface 8b2 is formed at a position closer to the top 13 of the protrusion 8 than the first curved surface 8b1. The center of curvature of the second curved surface 8b2 is located inside the protrusion 8. The inflection point 8a3 and the inflection point 8b3 are provided at a position above (top 13 side) the second main surface 7b of the frame portion 7.

[0165] The inflection points 8a3 and 8b3 of the inner surface 8a and the outer surface 8b can be Figure 7 as well as Figure 8 The protrusion 8 is formed on the cover member 4 by the molding device and molding method shown in the figure. When the protrusion 8 forms the inflection points 8a3 and 8b3, the protrusion angle θ of the protrusion 8 becomes smaller during the molding process, and there is a risk of reducing the light extraction efficiency. In the present invention, in order to ensure that the protrusion angle θ of the protrusion 8 is large, it is desirable to use the molding device 16 (see Figure 7 ) of the heating source 18 to sufficiently heat the plate glass GS.

[0166] In the case of the cover member 4 of this example, when the protrusion 8 is formed with the inflection points 8a3 and 8b3, the light extraction efficiency of the cover member 4 can be improved by setting the protrusion angle θ to be greater than 40° and less than 90°. The protrusion angle θ is preferably greater than 45°, greater than 50°, greater than 55°, greater than 60°, greater than 65°, and greater than 70°. On the other hand, the protrusion angle θ is preferably less than 90°, and more preferably less than 85°. In this example, the protrusion angle θ is specified as follows: Figure 5 The implementation methods are different.

[0167] In this example, the protrusion angle θ is the angle (acute angle) formed by the tangent line L8 at the inflection point 8a3 and the first main surface 7a of the frame 7. Specifically, the angle (acute angle) formed by the tangent line L8 at the inflection point 8a3 and the sixth line L6 drawn along the first main surface 7a of the frame 7 is defined as the protrusion angle θ. In this example, the opening length L and the protrusion height H of the opening 8c are the same as Figure 5 The embodiments shown are identical.

[0168] In this example, the anti-reflection films (10a, 10b) are not necessarily required, but are preferably provided. The preferred material and thickness of the anti-reflection films (10a, 10b) are the same as those of the embodiment of the present invention. Figure 5 In this example, the preferred embodiment of the protrusion 8 is the same as that of the embodiment shown in FIG. Figure 5 The embodiments shown are identical.

[0169] Figure 24 to Figure 26 Another example of a package and a cover member is shown. In this example, the shape of the cover member is different from that of the above-mentioned embodiment. The top 13 of the cover member 4 in this example is configured in a flat plate shape. By forming the flat plate-shaped top 13 on the cover member 4 in this way, anti-reflection films 10a and 10b of uniform thickness can be formed on the inner surface 8a and the outer surface 8b of the cover member 4 at the top 13. In addition, by forming the flat plate-shaped top 13 on the cover member 4, the distance Da between the top 13 and the light-emitting element 3 can be minimized. In addition, the light emitted from the light-emitting element 3 is easily incident perpendicularly to the flat plate-shaped top 13. The light extraction efficiency of the cover member 4 can be greatly improved. It should be noted that the energy EN1 of the light emitted from the light-emitting element 3 without passing through the cover member 4 can be measured, and the energy EN2 of the light emitted from the light-emitting element 3 when the light is transmitted through the cover member 4 can be measured, and the light extraction efficiency can be calculated based on the ratio of these energies (EN2 / EN1).

[0170] Next, a method for manufacturing the cover member 4 in this example is described. Figure 7 as well as Figure 8 The forming process is carried out in the same manner as in the example shown. Fig. 27 As shown in FIG. 1 , the forming device 16 includes a support table 17, a heating source 18, and an external force generating device 19. The structures of the heating source 18 and the external force generating device 19 are similar to those in FIG. Figure 7 The structure shown in the example is the same.

[0171] The support 17 has a molding surface 27 for molding a part of the plate glass GS softened by heating. The molding surface 27 is formed in the space 21 and is configured as a flat surface. Figure 7 as well as Figure 8 The structures shown are identical.

[0172] like Fig. 27 As shown in FIG. 1 , in the forming process, the plate glass GS is placed on the fixing portion 20 of the support table 17. Next, in the forming process, the external force generating device 19 is activated to fix the plate glass GS to the fixing portion 20. Thereafter, the plate glass GS is heated by the heat source 18. As a result, a portion of the plate glass GS is thermally deformed. At this time, as shown in FIG. Fig.28 As shown, part of the deformed plate glass GS contacts the forming surface 27. Thus, part of the plate glass GS is formed into a flat plate. Through this forming step, the cover member 4 having the frame portion 7, the protruding portion 8 including the flat plate-shaped top portion 13, and the connecting portion 9 is formed.

[0173] By implementing the cover member 4 Figures 9 to 11 , Fig.13 , Fig.14 The package is manufactured by performing the film forming steps and bonding steps exemplified in FIG.

[0174] Figure 29 to Figure 32 Another example of a forming device used in the forming process is shown. Fig.29 As shown, the forming device 16 includes a support table 17, a first heating source 18a and a second heating source 18b. The first heating source 18a has Fig. 27 The second heating source 18b has the same structure as the heating source 18 shown in the figure. The second heating source 18b is arranged inside the support table 17. The support table 17 has a recessed portion capable of accommodating the second heating source 18b. A portion of the second heating source 18b is exposed to the space portion 21 of the support table 17. The second heating source 18b can locally apply high-temperature air to the plate glass GS fixed to the support table 17. Thereby, the plate glass GS supported by the support table 17 can be heated from the lower surface side.

[0175] like Fig.30As shown, the second heat source 18b can promote the forming of the protrusion 8 (base 11 and midway portion 12) of the cover member 4 in the forming process. As a result, the protrusion angle θ of the protrusion 8 is made larger, so that the warping of the frame portion 7 of the cover member 4 can be effectively prevented. Not limited to the above structure, the second heat source 18b can also be arranged above the support table 17. The protrusion 8 (base 11 and midway portion 12) of the plate glass GS can also be locally heated from above by the second heat source 18b.

[0176] like Fig.29 as well as Fig.30 As shown, the space portion 21 of the support platform 17 includes: a first space portion 21a formed above the molding surface 27; and a second space portion 21b formed between the molding surface 27 and the fixing portion 20. The first space portion 21a has Fig. 27 The suction portion 17c is connected to the second space portion 21b. The suction portion 17c is formed between the molding surface 27 and the fixing portion 20 on the bottom surface of the support table 17 that divides the second space portion 21b. Fig.31 As shown in the figure, four suction parts 17c are provided on the support stand 17, but the number of the suction parts 17c is not limited to this embodiment.

[0177] With this configuration, the second space 21b and the suction portion 17c can be used to suction the base 11 and the midway portion 12 during the molding of the protrusion 8 of the cover member 4 formed on the plate glass GS. This increases the protrusion angle θ of the protrusion 8, and effectively prevents the frame 7 from warping.

[0178] like Figure 29 to Figure 31 As shown, the fixing portion 20 of the support platform 17 has a recessed portion 20c connected to the suction portion 20b in addition to the support surface 20a and the suction portion 20b. Fig.31 As shown, the recess 20c is formed as a groove portion that surrounds the space portion 21 of the support platform 17 when viewed from above. The groove portion has a quadrilateral frame shape. The shape of the groove portion of the recess 20c when viewed from above is not limited to the present embodiment, and may also be formed in a circular ring shape or other shapes. The end portion (suction port) of the suction portion 20b is connected to the bottom surface of the corner portion of the quadrilateral recess 20c. Fig.31 As shown in the figure, four suction parts 20b are provided in the fixing part 20 of the support table 17, but the number of the suction parts 20b is not limited to this embodiment.

[0179] With this structure, the plate glass GS placed on the support surface 20a of the fixing portion 20 is sucked by the suction portion 20b via the recessed portion 20c. That is, the recessed portion 20c has a function of assisting the suction portion 20b to suck the plate glass GS (auxiliary suction portion). By sucking the plate glass GS using the recessed portion 20c and the suction portion 20b, the warping of the frame portion 7 of the cover member 4 can be effectively prevented.

[0180] It is not limited to the above structure. Figure 29 to Figure 31 In the example shown in FIG. 1 , the recessed portion 20c may be omitted from the fixing portion 20 of the support platform 17. In addition, the position of the suction portion 20b formed in the fixing portion 20 may be changed. Fig.32 As shown, each suction portion 20b may be provided at a middle position of each side of the fixing portion 20 configured in a quadrilateral shape in a plan view.

[0181] Figure 33 to Figure 36 Another example of the method of manufacturing the cover member is shown. Fig.33 The support table 17 of the forming device 16 shown does not have Figure 7 The other structures in the support platform 17 are similar to those in the above-mentioned embodiment. Figure 7 The structures shown are the same.

[0182] The method for manufacturing the cover member 4 in this example includes a molding step, a processing step of processing the frame portion 7 of the cover member 4 after the molding step, and a film forming step performed after the processing step.

[0183] In the forming process, Fig.33 As shown, while the plate glass GS placed on the fixing portion 20 of the support 17 is heated by the heat source 18, a part (central part) of the plate glass GS is sucked by the external force generating device 19 and the suction portion 17b of the support 17. Figure 7 As shown in the example, it is attracted by the attracting portion 20b of the fixing portion 20, so that Fig.33 As shown in FIG. 1 , the film is warped in a manner separated from the support surface 20a of the fixing portion 20. When the film forming process is performed in this state, as in Fig.12 As illustrated in FIG. 2 , the first main surface 7 a of the frame 7 cannot completely block the opening 25 a of the masking member 25 .

[0184] Therefore, in the processing step after the forming step, processing is performed to flatten at least a portion of the first main surface 7a so that the first main surface 7a of the frame 7 can close the opening 25a of the masking member 25. In this example, an example of performing a physical grinding process on the first main surface 7a of the frame 7 as a processing step is described.

[0185] Fig.34 as well as Fig.35 The grinding device used in the processing step is shown. Fig.34 As shown, the polishing device includes a polishing tool 28 and a pressing member 29 for pressing the cover member 4 against the polishing tool 28. As the polishing tool 28, for example, a polishing pad is used, but the configuration of the polishing tool 28 is not limited to this example.

[0186] The pressing member 29 includes a frame body 30 that accommodates the protruding portion 8 of the cover member 4 , a buffer member 31 that is interposed between the frame portion 7 of the cover member 4 and the frame body 30 , and a weight 32 that is placed on the frame body 30 .

[0187] The frame body 30 is, for example, plate-shaped and has a hole 30a that penetrates in the thickness direction. A space (accommodation portion) for accommodating the protrusion 8 of the cover member 4 is formed inside the hole 30a. The hole 30a is configured to be larger than the protrusion 8. Therefore, the frame body 30 can accommodate the protrusion 8 inside without contacting the protrusion 8. The frame body 30 can press the frame portion 7 of the cover member 4 via the buffer member 31.

[0188] The cushioning member 31 is in contact with the second main surface 7b of the frame 7. The cushioning member 31 is made of, for example, a shrinkable sponge-like resin, but the structure of the cushioning member 31 is not limited to this example.

[0189] The weight 32 is placed on the upper portion of the frame 30. A plurality of weights 32 may be placed on the upper portion of the frame 30.

[0190] like Fig.34 As shown, in the processing step, the frame 7 of the cover member 4 is pressed toward the grinding tool 28 by the pressing member 29 while the first main surface 7a of the frame 7 in the cover member 4 is in contact with the grinding tool 28. In this state, the grinding tool 28 is relatively moved relative to the cover member 4, so that the first main surface 7a of the frame 7 can be ground.

[0191] Therefore, if Fig.35 As shown, a grinding surface 7a1 is formed on at least a portion of the first main surface 7a of the frame 7 by a grinding tool 28. The surface roughness Ra of the grinding surface 7a1 is preferably 0.1 nm or more and 1 nm or less.

[0192] like Fig.36 As shown, the polished surface 7a1 can completely block the opening 25a of the masking member 25 used in the film forming step (second film forming step). Thus, in the film forming step, it is possible to prevent metal particles used to form the metal layer 14 from infiltrating into the inner side of the protrusion 8, and form a metal layer 14 of uniform thickness on the first main surface 7a of the frame 7.

[0193] In this example, the thickness of the frame portion 7 of the cover member 4 can be made thicker than the thickness Tmax (see FIG. 1 ) of the base portion 11 of the protrusion 8 by a processing step. Figure 5 Thus, for example, when the bonding portion 15 is heated by laser in the bonding process, the bonding portion 15 can be appropriately heated via the frame portion 7 having a relatively thin thickness.

[0194] It should be noted that the present invention is not limited to the configuration of the above-described embodiment, nor is it limited to the above-described effects. The present invention can be modified in various ways without departing from the gist of the present invention.

[0195] In the above embodiment, the cover member 4 and the glass substrate G are formed with the first anti-reflection film 10a and the second anti-reflection film 10b, but the present invention is not limited to this structure. The cover member 4 and the glass substrate G of the present invention may have only the first anti-reflection film 10a or only the second anti-reflection film 10b.

[0196] In the above embodiment, the cover member 4 is exemplified as having the protrusion 8 whose top 13 is thinner than the base 11, but the present invention is not limited to this structure. The present invention can also be applied to the cover member 4 having the protrusion 8 whose thickness is constant from the base 11 to the top 13.

[0197] In the above Figure 33 to Figure 36 In the example shown, the first main surface 7a of the frame 7 of the cover member 4 is processed by physical polishing, but the present invention is not limited to this structure. The first main surface 7a of the frame 7 may be processed by chemical polishing by etching.

[0198] Description of Reference Numerals

[0199] 1 Package

[0200] 3 Light-emitting components

[0201] 4 Cover member

[0202] 7 Frame

[0203] 7a First main surface of the frame

[0204] 7b Second main surface of the frame

[0205] 8 Protrusion

[0206] 8a Inner surface of the protrusion

[0207] 8b Outer surface of the protrusion

[0208] 9 Connection

[0209] 11 Base

[0210] 14 Metal layer

[0211] 17 Supporting platform

[0212] 19 External force generating device (attraction device)

[0213] 20 Fixed part

[0214] 20b Suction part of fixed part

[0215] 21 Space Department

[0216] 28 Grinding tools

[0217] 29 Pressing member

[0218] D1 Direction in which a portion of the plate glass is attracted

[0219] D2 attracts the direction of the frame

[0220] GS Sheet Glass.

Claims

1. A method for manufacturing a cover member, comprising manufacturing a glass cover member for a package including a light emitting element, The method for manufacturing the cover member is characterized in that: The cover member includes a plate-shaped frame portion and a protrusion protruding from the frame portion. The method for manufacturing the cover member includes a forming step of forming the protruding portion by sucking a part of the plate glass in a state where the plate glass is fixed to a support stand, The support platform includes a fixing portion for fixing the frame portion. In the forming step, the fixing portion attracts the frame portion in the same direction as a direction in which the portion of the plate glass is attracted.

2. The method for manufacturing a cover member according to claim 1, wherein: In the forming step, the part of the plate glass is sucked and the frame portion is sucked by the fixing portion using a common suction device.

3. The method for manufacturing a cover member according to claim 1 or 2, characterized in that: In the forming step, suction of the portion of the plate glass and suction of the frame portion by the fixing portion are performed simultaneously.

4. The method for manufacturing a cover member according to claim 1 or 2, wherein: In the forming step, the protruding portion and the frame portion are formed by heating the plate glass.

5. The method for manufacturing a cover member according to claim 1 or 2, wherein: The support platform includes a plurality of space portions for forming a plurality of the protrusions on the plate glass. The plurality of space portions are formed in a plurality of rows and columns, The fixing part includes a plurality of suction parts for sucking the plate glass. The plurality of suction portions are formed in a plurality of rows and columns so as to correspond to the plurality of space portions.

6. A method for manufacturing a cover member, comprising manufacturing a glass cover member for a package including a light emitting element, The method for manufacturing the cover member is characterized in that: The cover member includes a plate-shaped frame portion and a protrusion protruding from the frame portion. The protrusion has an inner surface and an outer surface, The frame portion has a first main surface connected to the inner surface of the protrusion and a second main surface connected to the outer surface of the protrusion. The method for manufacturing the cover member comprises: a forming step of forming the protruding portion by sucking a portion of the plate glass while the plate glass is fixed to a support; a processing step of processing the frame portion after the forming step; and a film forming step of forming a metal layer on the frame portion by a physical vapor deposition method after the processing step, In the processing step, processing is performed to flatten the first main surface of the frame portion.

7. The method for manufacturing a cover member according to claim 6, wherein: In the processing step, the first main surface of the frame portion is physically polished.

8. The method for manufacturing a cover member according to claim 6 or 7, characterized in that: The processing step is configured to press the frame portion against the grinding tool using a pressing member, The pressing member includes a receiving portion that receives the protruding portion.

9. A cover member, which is used for a package including a light emitting element and is made of glass, The cover member is characterized in that The cover member includes a plate-shaped frame portion and a protrusion protruding from the frame portion. The protrusion has an inner surface and an outer surface, The frame portion has a first main surface connected to the inner surface of the protrusion and a second main surface connected to the outer surface of the protrusion. The first main surface has a polished surface.

10. A cover member, which is used for a package including a light emitting element and is made of glass, The cover member is characterized in that The cover member includes a plate-shaped frame portion and a protrusion protruding from the frame portion. The protruding portion includes a top portion and a base portion integrally formed with the frame portion, The frame portion is thinner than the base portion.

11. The cover member according to claim 10, wherein: The top portion of the protruding portion is thinner than the frame portion.

12. The cover member according to claim 10, wherein: The frame portion is thicker than the top portion of the protruding portion.

Images