Semiconductor process equipment and exhaust device and control valve thereof

Abstract

The invention provides a control valve, an exhaust device of semiconductor process equipment and the semiconductor process equipment, the control valve comprises a valve body and a valve core assembly, the valve body is provided with a flow passing cavity, a flow inlet allowing fluid to enter the flow passing cavity and a flow outlet allowing the fluid to flow out of the flow passing cavity; the valve element assembly comprises an adjusting part, an elastic connecting part and a pressure stabilizing part, the adjusting part is movably arranged in the overflowing cavity, the pressure stabilizing part is located on the side, close to the flow inlet, of the adjusting part, and the elastic connecting part is located between the pressure stabilizing part and the adjusting part and used for connecting the pressure stabilizing part and the adjusting part; the elastic connecting part is further used for balancing the fluid pressure borne by the pressure stabilizing part. When the fluid pressure fluctuates instantaneously, the pressure stabilizing part can move along with the change of the fluid pressure under the support of the elastic connecting part to change the cross sectional area of the overflowing channel, so that the fluid pressure is finely adjusted. And after the fluid pressure is recovered, the elastic connecting part can drive the pressure stabilizing part to move to the stress balance position, so that the fluid pressure is rapidly recovered to be stable, and the precision of fluid pressure adjustment is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular, to a semiconductor process equipment and an exhaust device and a control valve thereof. Background Art

[0002] Vertical furnace is an essential process equipment in semiconductor manufacturing process. This equipment involves a variety of complex processing processes, and has a large proportion in semiconductor FAB (Fabrication) and is widely used. The oxygen content and cleanliness inside the main box of the vertical furnace machine are important indicators of the process. The unstable pressure inside the main box will directly cause the oxygen content fluctuation and cleanliness change inside the microenvironment system of the vertical furnace, which will seriously affect the process quality and cause product scrapping.

[0003] The exhaust device of the process equipment is installed above the microenvironment system. When the process equipment is in the oxygen control state, nitrogen is introduced into the microenvironment system, and the air inside it is discharged from the exhaust device to control the pressure inside the microenvironment system and reduce the oxygen content inside the microenvironment system to the process requirement value. Specifically, the process is divided into two stages: rapid oxygen control and stable oxygen control. The rapid oxygen control stage requires manual adjustment, and its adjustment accuracy is difficult to control. It takes repeated adjustments to stabilize the pressure at the target value. The system pressure fluctuates greatly during the adjustment process. The pressure of the microenvironment system is controlled by a butterfly valve in the stable oxygen control stage. The control accuracy of the butterfly valve adjustment angle is limited, which can easily cause fluctuations in the oxygen content and cleanliness changes inside the microenvironment system, seriously affecting the process quality and even causing product scrapping.

[0004] Therefore, how to improve the adjustment accuracy of the valve in the exhaust device and reduce the pressure fluctuation of the microenvironment system is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0005] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes a control valve with high adjustment accuracy, which can reduce the pressure fluctuation of the microenvironment system. Another object of the present application is to provide an exhaust device and a semiconductor process equipment including the above control valve.

[0006] In order to achieve the purpose of the present application, a control valve is provided for use in an exhaust device of a semiconductor process equipment. The control valve comprises a valve body and a valve core assembly, wherein:

[0007] The valve body has a flow cavity, an inlet for fluid to enter the flow cavity, and an outlet for fluid to flow out of the flow cavity;

[0008] The valve core assembly includes a regulating part, an elastic connecting part and a pressure stabilizing part, wherein the regulating part is movably arranged in the flow chamber, the pressure stabilizing part is located on a side of the regulating part close to the flow inlet, and the elastic connecting part is located between the pressure stabilizing part and the regulating part, and is used to connect the pressure stabilizing part and the regulating part;

[0009] When the regulating part is located at the first valve position, the voltage stabilizing part is in contact with the side wall of the flow chamber to isolate the inlet and the outlet, and when the regulating part is away from the first valve position, a flow passage for fluid flow is formed between the voltage stabilizing part and the side wall of the flow chamber;

[0010] The elastic connection portion is used to balance the fluid pressure borne by the pressure stabilizing portion when the regulating portion is away from the first valve position.

[0011] In some embodiments, the valve core assembly further includes a guide portion, the adjusting portion, the elastic connecting portion and the pressure stabilizing portion are coaxially arranged, and the guide portion is used to guide the pressure stabilizing portion to move along its axial direction.

[0012] In some embodiments, a driving assembly is also included, which includes a driving part and an adjusting screw. The adjusting part has a threaded hole, and the adjusting screw is threadedly matched with the threaded hole. The driving part is arranged on the outside of the valve body and is used to drive the valve core assembly to move in the flow chamber through the rotation of the adjusting screw.

[0013] In some embodiments, the voltage stabilizing portion has a through hole coaxially arranged with the threaded hole, the adjusting screw is in clearance fit with the through hole, and the adjusting screw serves as the guiding portion.

[0014] In some embodiments, a side wall of the flow chamber is provided with a limiting protrusion, and the regulating portion has a limiting groove, and the limiting groove is used to cooperate with the limiting protrusion to circumferentially limit the regulating portion.

[0015] In some embodiments, the elastic connection portion is a connection spring, and the connection spring is sleeved on the outer circumference of the adjusting screw.

[0016] In some embodiments, a mounting port is provided on a side of the valve body away from the inlet, and the drive assembly further comprises a mounting member, the mounting member is sealingly connected to the mounting port, the drive unit is fixed on a side of the mounting member away from the valve body, the mounting member has a through axial hole, and the drive shaft of the drive unit passes through the axial hole into the flow chamber.

[0017] In some embodiments, a sealing member is provided between the mounting member and the mounting opening.

[0018] In some embodiments, the drive shaft is connected to the adjusting screw via a coupling, and the coupling is also used to axially limit the adjusting portion.

[0019] The present application also provides an exhaust device for semiconductor process equipment, including a first exhaust pipeline and a second exhaust pipeline, the first exhaust pipeline is used to exhaust gas in a rapid oxygen control stage, the second exhaust pipeline is used to exhaust gas in a stable oxygen control stage, a first exhaust valve is provided in the first exhaust pipeline, and a second exhaust valve is provided in the second exhaust pipeline, and the first exhaust valve and the second exhaust valve are both control valves described in any one of the above-mentioned types.

[0020] The present application further provides a semiconductor process equipment, including a microenvironment chamber and an exhaust device connected to the microenvironment chamber, wherein the exhaust device is the above-mentioned exhaust device.

[0021] This application has the following beneficial effects:

[0022] The control valve provided in the present application is used in an exhaust device of a semiconductor process equipment, and the control valve includes a valve body and a valve core assembly, wherein the valve body has a flow chamber, an inlet for fluid to enter the flow chamber, and an outlet for fluid to flow out of the flow chamber; the valve core assembly includes a regulating part, an elastic connecting part and a voltage stabilizing part, the regulating part is movably arranged in the flow chamber, the voltage stabilizing part is located on a side of the regulating part close to the inlet, the elastic connecting part is located between the voltage stabilizing part and the regulating part, and is used to connect the voltage stabilizing part and the regulating part; when the regulating part is located in the first valve position, the voltage stabilizing part is in contact with the side wall of the flow chamber to isolate the inlet and the outlet, and when the regulating part is away from the first valve position, a flow channel for fluid flow is formed between the voltage stabilizing part and the side wall of the flow chamber; the elastic connecting part is used to balance the fluid pressure borne by the voltage stabilizing part when the regulating part leaves the first valve position.

[0023] During the operation of the control valve, the fluid can enter the flow chamber from the flow inlet, and the regulating part drives the pressure stabilizing part to move in the flow chamber to adjust the fluid pressure. When the fluid pressure fluctuates instantaneously, the pressure stabilizing part can move with the change of fluid pressure under the support of the elastic connection part, change the cross-sectional area of ​​the flow channel, and then fine-tune the fluid pressure. After the fluid pressure is restored, the elastic connection part can drive the pressure stabilizing part to move to the force balance position, so that the fluid pressure can quickly return to stability. In this process, the regulating part does not need to move, which avoids the instantaneous fluid pressure fluctuation being amplified by the regulating part, and improves the accuracy of fluid pressure regulation.

[0024] The present application also provides an exhaust system and semiconductor process equipment including the above control valve, and having the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A cross-sectional view of a control valve provided in a specific embodiment of the present application;

[0026] Figure 2 for Figure 1 A cross-sectional view of the control valve taken along line AA;

[0027] Figure 3 A schematic diagram of the structure of an exhaust system provided in a specific embodiment of the present application;

[0028] Figure 4 A schematic diagram of the structure of a microenvironment system provided in a specific implementation manner of the present application.

[0029] in, Figures 1 to 4 The reference numerals in the drawings are:

[0030] 100, control valve; 110, valve body; 111, inlet; 112, outlet; 113, limit protrusion; 120, valve core assembly; 121, regulating valve plate; 122, connecting spring; 123, voltage stabilizing block; 130, drive assembly; 131, drive motor; 132, adjusting screw; 133, coupling; 134, motor connecting plate; 135, sealing gasket; 200, first air collecting box; 300, first exhaust pipeline; 400, second exhaust pipeline; 500, first exhaust valve; 600, third exhaust valve; 700, second exhaust valve; 800, second air collecting box; 900, microenvironment chamber; 910, nitrogen inlet pipe; 920, pressure monitoring device. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solution of the present application, the exhaust device and the control valve thereof provided by the present application are described in detail below in conjunction with the accompanying drawings.

[0032] The control valve 100 provided in the present application is as follows: Figure 1 As shown, it includes a valve body 110 and a valve core assembly 120. The valve body 110 has a flow chamber, an inlet 111 and an outlet 112. The fluid can enter the flow chamber from the inlet 111 and flow out from the outlet 112. The valve core assembly 120 is movably arranged in the flow chamber. When the valve core assembly 120 is located in the first valve position, the valve core assembly 120 isolates the inlet 111 and the outlet 112, and the fluid cannot pass through the flow chamber, and the control valve 100 is closed; when the valve core assembly 120 is located in the second valve position, the valve core assembly 120 is located at the farthest distance from the inlet 111, and the control valve 100 is fully opened. The valve core assembly 120 includes an adjusting part, an elastic connecting part and a pressure stabilizing part. As shown Figure 1As shown, the voltage stabilizing part is located on one side of the regulating part close to the inlet 111, a fine-tuning gap is formed between the voltage stabilizing part and the regulating part, and the elastic connecting part is located in the fine-tuning gap, elastically connecting the voltage stabilizing part and the regulating part. The voltage stabilizing part moves relative to the regulating part to change the width of the fine-tuning gap, and the elastic connecting part also expands and contracts accordingly. The width of the fine-tuning gap can be specifically the distance between the voltage stabilizing part and the regulating part.

[0033] When the regulating part moves, the voltage stabilizing part will also be driven to move. When the regulating part is located at the first valve position, the outer peripheral surface of the voltage stabilizing part fits with the side wall of the flow chamber, isolating the inlet 111 from the outlet 112. When the regulating part leaves the first valve position, a flow channel surrounding the voltage stabilizing part is formed between the voltage stabilizing part and the side wall of the flow chamber, and the fluid can flow through the flow channel to the outlet 112. The farther the regulating part is from the inlet 111, the larger the cross-sectional area of ​​the flow channel, that is, the larger the flow area, the lower the resistance to fluid flow, thereby increasing the flow rate of the fluid and reducing the fluid pressure. Therefore, the movement of the regulating part toward the inlet 111 can increase the fluid pressure, and the movement of the regulating part away from the inlet 111 can reduce the fluid pressure. The movement of the regulating part realizes the active adjustment of the control valve and can achieve rapid adjustment of the fluid pressure.

[0034] In addition, there are often instantaneous fluctuations in fluid pressure. The voltage stabilizing part forms a fine-tuning gap with the regulating part under the support of the elastic connecting part. At this time, the fluid pressure borne by the voltage stabilizing part and the elastic force applied to the voltage stabilizing part by the elastic connecting part are balanced. When the fluid pressure fluctuates instantaneously, the force balance of the voltage stabilizing part is broken, and the voltage stabilizing part moves due to the change in force, thereby changing the flow area of ​​the flow channel and realizing passive regulation of the fluid pressure. For example, when the fluid pressure increases, the voltage stabilizing part moves away from the flow inlet 111 under the push of the fluid pressure, thereby increasing the flow area of ​​the flow channel, reducing the fluid pressure, and reducing the fluctuation of the fluid pressure. The control valve realizes passive regulation of the pressure by supporting the voltage stabilizing part through the elastic connecting part. The passive regulation fine-tunes the pressure, which can reduce the fluctuation of the fluid pressure and improve the process stability of the process related to the pressure.

[0035] Optionally, the control valve further includes a drive assembly 130, and the drive assembly 130 is used to drive the valve core assembly 120 to move between the first valve position and the second valve position. Specifically, the drive assembly 130 can cooperate with the regulating part to drive the regulating part to move in the flow chamber. The drive assembly 130 changes the position of the regulating part to control the fluid pressure and realize active regulation of the fluid pressure. The drive assembly 130 drives the regulating part to move through components such as motors and cylinders, and can also drive the regulating part to move manually, which is not limited here.

[0036] Optionally, the regulating part is specifically a regulating valve plate 121, such as Figure 1As shown, the flow chamber includes a cylindrical section and a conical section, which are coaxially arranged, and the cross-sectional area of ​​the conical section gradually decreases in the direction away from the cylindrical section. The inlet 111 is located at one end of the conical section away from the cylindrical section, and the side wall of the cylindrical section is connected to an exhaust pipe, and the exhaust port is located at one end of the exhaust pipe away from the cylindrical section. The shape of the regulating valve plate 121 is adapted to the cross-section of the cylindrical section, and the regulating valve plate 121 moves along the axial direction of the cylindrical section under the drive of the driving assembly 130. The pressure stabilizing part can be specifically a pressure stabilizing block 123, and the shape of the pressure stabilizing block 123 is adapted to the shape of the conical section, and the outer peripheral surface of the pressure stabilizing part can be sealed with the side wall of the conical section. The relative surfaces of the regulating valve plate 121 and the pressure stabilizing block 123 can be parallel to each other, and the distance between the two surfaces is the width of the fine-tuning gap. When the fluid pressure increases, the width of the fine-tuning gap decreases, and when the fluid pressure decreases, the width of the fine-tuning gap increases. Of course, the shapes of the flow chamber, the regulating part and the pressure stabilizing part can be set according to the needs of the user, and are not limited here. The inner circumference of the tapered section and the outer circumference of the pressure stabilizing block 123 are both tapered, which can increase the contact area between the two, thereby improving the sealing effect when the control valve is closed.

[0037] Optionally, the valve core assembly 120 may further include a guide portion. The regulating valve plate 121, the elastic connection portion and the pressure stabilizing block 123 are coaxially arranged, and the guide portion is used to guide the moving direction of the pressure stabilizing block 123 so that it always moves along its own axial direction. The pressure stabilizing block 123 moves along its axial direction. On the one hand, it can prevent the pressure stabilizing block 123 from getting stuck with the side wall of the flow chamber due to tilting. On the other hand, it can keep the cross section of the flow channel in an annular shape, which is convenient for calculating the flow area, thereby improving the control accuracy of the control valve 100.

[0038] In this embodiment, a flow passage is formed between the outer peripheral surface of the pressure stabilizing block 123 and the side wall of the flow chamber. The flow area of ​​the flow passage can be changed by adjusting the position of the pressure stabilizing block 123, thereby adjusting the pressure of the fluid. The valve core assembly 120 includes a regulating valve plate 121 and an elastic connection portion. The regulating valve plate 121 can drive the pressure stabilizing block 123 to move, thereby realizing active regulation of the fluid pressure. The elastic connection portion is used to support the pressure stabilizing block 123, so that a fine-tuning gap is formed between the pressure stabilizing block 123 and the regulating valve plate 121. When the fluid pressure changes, the pressure stabilizing block 123 moves under the impetus of the fluid pressure or elastic force, thereby reducing the fluctuation of the fluid pressure and realizing passive regulation of the fluid pressure. In particular, when the fluid pressure changes slightly, the regulation accuracy of active regulation may be greater than the fluid pressure change. If active regulation is adopted, the fluid pressure fluctuation in the system may be increased. At this time, the position of the regulating valve plate 121 remains unchanged, and the passive regulation makes adaptive adjustments according to the pressure change of the fluid, which can reduce the fluctuation of the fluid pressure and improve the pressure regulation accuracy.

[0039] In some embodiments, Figure 1As shown, the drive assembly 130 includes a drive unit and an adjusting screw 132, the rotating shaft of the drive unit is connected to the adjusting screw 132, and the adjusting screw 132 can be arranged along the axis of the cylindrical section and the conical section. The center of the regulating valve plate 121 has a threaded hole, and the adjusting screw 132 is threadedly matched with the threaded hole. The drive unit is arranged on the outer side of the valve body 110, and is used to drive the adjusting screw 132 to rotate. During the rotation of the adjusting screw 132, the valve core assembly 120 can be driven to move in the flow chamber. The adjusting screw 132 is threadedly matched with the threaded hole of the regulating valve plate 121, and the rotation of the adjusting screw 132 is converted into the axial movement of the regulating valve plate 121. The smaller the pitch of the adjusting screw 132, the slower the moving speed of the regulating valve plate 121 at the same rotating speed of the adjusting screw 132, and the higher the adjustment accuracy of the active adjustment of the control valve 100. Reasonable setting of the pitch of the adjusting screw 132 can ensure that the control valve 100 has high adjustment efficiency and adjustment accuracy. Of course, other driving modes may also be used between the driving assembly 130 and the valve core, which are not limited here.

[0040] Optional, such as Figure 2 As shown, the cross section of the cylindrical section of the flow chamber is circular, and the corresponding regulating valve plate 121 is also circular. The side wall of the flow chamber is provided with a limiting protrusion 113, and the limiting protrusion 113 extends along the moving direction of the valve core assembly 120. The regulating valve plate 121 has a limiting groove, and the limiting groove cooperates with the limiting protrusion 113 to limit the regulating valve plate 121 circumferentially, so as to prevent the regulating valve plate 121 from rotating under the drive of the adjusting screw 132. Of course, other structures can also be provided in the control valve 100 to limit the regulating valve plate 121 circumferentially, which is not limited here.

[0041] Optionally, the driving unit may be a driving motor 131, which can drive the adjusting screw 132 to rotate in response to a driving instruction to achieve automatic control of the control valve 100. The driving motor 131 may be connected to a controller, which may send a control instruction to the driving motor 131 according to the current pressure and target pressure of the fluid. The specific control method may refer to the prior art and will not be described in detail here. The controller accurately adjusts the opening of the control valve according to the current pressure of the fluid, can achieve automatic adjustment of the fluid pressure, and quantitatively controls the control valve according to the current pressure of the fluid, thereby improving the stability and accuracy of the pressure regulation.

[0042] Optional, such as Figure 1As shown, the drive shaft is connected to the adjusting screw 132 through a coupling 133. The outer diameter of the coupling 133 is larger than the diameter of the adjusting screw 132, and is also larger than the diameter of the threaded hole in the adjusting valve plate 121. The coupling 133 can axially limit the stroke of the adjusting valve plate 121. When the adjusting valve plate 121 is in contact with the coupling 133, the valve core assembly 120 reaches the second valve position, and the coupling 133 can prevent the adjusting valve plate 121 from continuing to move away from the inlet 111. Of course, the user can also limit the stroke of the adjusting valve plate 121 in other ways, for example, by limiting the length of the thread on the adjusting screw 132, which is not limited here. The drive shaft of the drive motor 131 can also be connected to the adjusting screw 132 in other ways, for example, welding, etc.

[0043] Optionally, a mounting port is provided on one side of the valve body 110 away from the inlet 111, and the drive assembly further comprises a mounting member, which is sealed and connected to the mounting port, and the drive motor 131 is fixedly connected to the valve body 110 via the mounting member. Figure 1 As shown, the mounting part is a motor connecting plate 134, and the outer side of the valve body 110 has a flange set around the mounting port. The motor connecting plate 134 and the flange are connected by bolts, and the drive motor 131 is connected to the motor connecting plate 134 by bolts. The center of the motor connecting plate 134 has an axial hole that penetrates along the thickness direction. The drive shaft of the drive motor 131 passes through the flow cavity through the axial hole, and the coupling 133 is set in the flow cavity. Of course, the drive motor 131 and the motor connecting plate 134 and the motor connecting plate 134 and the flange can also be connected in other ways, which are not limited here.

[0044] Optionally, a seal is provided between the motor connecting plate 134 and the mounting port, and the seal can improve the sealing between the motor connecting plate 134 and the valve body 110 to prevent fluid leakage. The seal can be specifically a sealing gasket 135, which can be made of materials such as rubber, silicone or graphite. The motor connecting plate 134 and the flange plate press the sealing gasket 135 tightly, thereby ensuring the sealing of the valve body 110.

[0045] Optionally, the pressure stabilizing block 123 has a through hole coaxially arranged with the threaded hole, and the adjusting screw 132 is passed through the through hole and matches with the through hole gap. In this embodiment, the adjusting screw 132 is used as a guide portion of the valve core assembly 120, and the adjusting screw 132 matches with the through hole to radially limit the pressure stabilizing block 123 to prevent the pressure stabilizing block 123 from tilting during movement.

[0046] Optionally, the elastic connection part is a connection spring 122, and the connection spring 122 is sleeved on the outer circumference of the adjusting screw 132. The connection spring 122, the regulating valve plate 121 and the pressure stabilizing block 123 are coaxially arranged, and the elastic force of the connection spring 122 is evenly distributed along the circumference of the pressure stabilizing block 123, thereby preventing the pressure stabilizing block 123 from tilting during movement, thereby improving the reliability of the control valve 100.

[0047] The present application also provides an exhaust device for semiconductor process equipment, comprising a first gas collecting box 200, a second gas collecting box 800, a first exhaust pipeline 300 and a second exhaust pipeline 400. Figure 3 and Figure 4 As shown, the exhaust device is arranged at the top of the microenvironment chamber 900, and a nitrogen inlet pipe 910 and a pressure monitoring device 920 are arranged on one side of the microenvironment chamber 900. The nitrogen inlet pipe 910 delivers nitrogen to the microenvironment chamber 900, and the original gas (mainly air) in the microenvironment chamber 900 is discharged through the exhaust device, thereby achieving the purpose of reducing the oxygen content in the microenvironment chamber 900.

[0048] Optionally, the second gas collecting box 800 is connected to the microenvironment chamber 900, the first gas collecting box 200 can be connected to the atmosphere, and the first exhaust pipeline 300 and the second exhaust pipeline 400 can both connect the second gas collecting box 800 to the first gas collecting box 200. During the oxygen control process, the original gas in the microenvironment chamber 900 first enters the second gas collecting box 800, then enters the first gas collecting box 200 through the first exhaust pipeline 300 or the second exhaust pipeline 400, and is finally discharged into the atmosphere from the first gas collecting box 200.

[0049] The oxygen control process of the microenvironment chamber 900 generally includes a rapid oxygen control stage and a stable oxygen control stage. In the rapid oxygen control stage, the nitrogen input amount of the nitrogen inlet pipe 910 is relatively large, and the original gas in the microenvironment chamber 900 is quickly replaced to achieve the purpose of reducing the oxygen content in the microenvironment chamber 900. The exhaust volume in the rapid oxygen control stage is relatively large. The first exhaust pipeline 300 is used to exhaust gas in the rapid oxygen control stage. The first exhaust pipeline 300 is provided with a first exhaust valve 500 and a third exhaust valve 600, wherein the first exhaust valve 500 is a main exhaust valve, which can adopt the control valve 100 in any of the above embodiments, and the third exhaust valve 600 can refer to the electric valve or pneumatic valve in the prior art. In the rapid oxygen control stage, the control valve 100 and the second exhaust valve 700 are closed, and the pressure monitoring device 920 measures the current pressure of the microenvironment chamber 900, and automatically adjusts the opening of the first exhaust valve 500 according to the current pressure and the pressure control range to control the pressure in the microenvironment chamber 900 to be stable. The second exhaust pipeline 400 is used to exhaust gas in the stable oxygen control stage. The second exhaust pipeline 400 is provided with a second exhaust valve 700, which can adopt the control valve 100 in any of the above embodiments. In the stable oxygen control stage, the control valve 100 is closed, the third exhaust valve 600 is closed, the pressure monitoring device 920 measures the current pressure of the microenvironment chamber 900, and automatically adjusts the opening of the second exhaust valve 700 according to the current pressure and the pressure control range, so as to control the pressure in the microenvironment chamber 900 to be stable.

[0050] In this embodiment, the control valve 100 is used as the main exhaust valve of the first exhaust pipeline 300, which realizes automatic pressure control in the rapid oxygen control stage, avoids the safety risk of manual control, and reduces manpower consumption. The control valve 100 is used as the exhaust valve of the second exhaust pipeline 400, which improves the pressure control accuracy in the stable oxygen control stage and reduces the gas pressure fluctuation in the microenvironment chamber 900.

[0051] The present application also provides a semiconductor process equipment, such as Figure 4 As shown, the semiconductor process equipment includes a microenvironment chamber 900 and an exhaust device in any of the above embodiments, and the exhaust device can be installed on the top of the microenvironment chamber 900. The microenvironment chamber 900 is also connected to a nitrogen inlet pipe 910 and a pressure monitoring device 920. The nitrogen inlet pipe 910 is used to transport nitrogen into the microenvironment chamber 900, and the original gas in the microenvironment chamber 900 is discharged by the exhaust device, thereby completing the gas replacement in the microenvironment chamber 900. The pressure monitoring device 920 detects the pressure in the microenvironment chamber 900, and controls the intake and exhaust speeds according to the pressure to avoid overpressure in the microenvironment chamber 900. The structures of other parts of the semiconductor process equipment can refer to the prior art and will not be repeated here.

[0052] In a specific embodiment of the present application, the rapid oxygen control stage is from 0 hours to 1 hour, the nitrogen flow rate in this stage is 700L / min to 1000L / min, and the pressure of the microenvironment chamber 900 is preferably controlled within the range of 2000±100Torr; the stable oxygen control stage is after 1 hour, the nitrogen flow rate in this stage is 200L / min to 500L / min, and the pressure of the microenvironment chamber 900 is preferably controlled within the range of 3000±100Torr. Of course, the user can set the time range and parameter range of the rapid oxygen control stage and the stable oxygen control stage as needed, which is not limited here.

[0053] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present application, but the present application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of the present application, and these modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. A control valve, characterized in that: An exhaust device for semiconductor process equipment, the control valve comprises a valve body and a valve core assembly, wherein: The valve body has a flow cavity, an inlet for fluid to enter the flow cavity, and an outlet for fluid to flow out of the flow cavity; The valve core assembly includes a regulating part, an elastic connecting part and a pressure stabilizing part, wherein the regulating part is movably arranged in the flow chamber, the pressure stabilizing part is located on a side of the regulating part close to the flow inlet, and the elastic connecting part is located between the pressure stabilizing part and the regulating part, and is used to connect the pressure stabilizing part and the regulating part; When the regulating part is located at the first valve position, the voltage stabilizing part is in contact with the side wall of the flow chamber to isolate the inlet and the outlet, and when the regulating part is away from the first valve position, a flow passage for fluid flow is formed between the voltage stabilizing part and the side wall of the flow chamber; The elastic connection portion is used to balance the fluid pressure borne by the pressure stabilizing portion when the regulating portion is away from the first valve position.

2. The control valve according to claim 1, characterized in that: The valve core assembly also includes a guide portion, and the regulating portion, the elastic connecting portion and the pressure stabilizing portion are coaxially arranged, and the guide portion is used to guide the pressure stabilizing portion to move along its axial direction.

3. The control valve according to claim 2, characterized in that: It also includes a driving assembly, which includes a driving part and an adjusting screw. The adjusting part has a threaded hole, and the adjusting screw is threadedly matched with the threaded hole. The driving part is arranged on the outside of the valve body and is used to drive the valve core assembly to move in the flow chamber through the rotation of the adjusting screw.

4. The control valve according to claim 3, characterized in that: The voltage stabilizing portion has a through hole coaxially arranged with the threaded hole, the adjusting screw is in clearance fit with the through hole, and the adjusting screw serves as the guiding portion.

5. The control valve according to claim 3, characterized in that: The side wall of the flow chamber is provided with a limiting protrusion, and the regulating part has a limiting groove, and the limiting groove is used to cooperate with the limiting protrusion to limit the regulating part circumferentially.

6. The control valve according to claim 3, characterized in that: The elastic connection part is a connection spring, and the connection spring is sleeved on the outer circumference of the adjusting screw.

7. The control valve according to any one of claims 3 to 6, characterized in that: A mounting port is provided on a side of the valve body away from the inlet port, and the drive assembly also includes a mounting member, which is sealed and connected to the mounting port. The drive unit is fixed on a side of the mounting member away from the valve body, and the mounting member has a through axial hole, and the drive shaft of the drive unit passes through the axial hole into the flow chamber.

8. The control valve according to claim 7, characterized in that: A sealing member is provided between the mounting member and the mounting opening.

9. The control valve according to claim 7, characterized in that: The driving shaft is connected to the adjusting screw via a coupling, and the coupling is also used to axially limit the adjusting portion.

10. An exhaust device for semiconductor process equipment, characterized in that: The invention comprises a first exhaust pipeline and a second exhaust pipeline, wherein the first exhaust pipeline is used to exhaust gas in a rapid oxygen control stage, and the second exhaust pipeline is used to exhaust gas in a stable oxygen control stage. A first exhaust valve is arranged in the first exhaust pipeline, and a second exhaust valve is arranged in the second exhaust pipeline. Both the first exhaust valve and the second exhaust valve are control valves according to any one of claims 1 to 9.

11. A semiconductor process equipment, characterized in that: It comprises a microenvironment chamber and an exhaust device connected to the microenvironment chamber, and the exhaust device is the exhaust device as claimed in claim 10.

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