Electronic component inspection method and inspection equipment

Abstract

The invention provides an electronic component inspection method and inspection equipment, and the electronic component inspection method comprises the steps: providing a test board which is provided with a seat groove for bearing a to-be-tested component, the to-be-tested component is provided with an upper electrode and a lower electrode, and the upper electrode is higher than the upper surface of the test board; providing an upper terminal which is positioned above the test board and is electrically connected with a lower terminal below the test board; before the to-be-tested element is conveyed to be adjacent to the upper terminal, the upper terminal is lifted up to avoid the to-be-tested element; when the to-be-detected element is conveyed to the position below the upper terminal, the upper terminal moves downwards to abut against the upper electrode at the upper end of the to-be-detected element for inspection; after the inspection is completed, the element to be detected is conveyed to be separated from the contact with the upper terminal; therefore, the to-be-detected element is prevented from being collided and damaged during inspection.

Description

Technical Field

[0001] The present invention relates to an inspection method and an inspection device, and in particular to an electronic component inspection method and an inspection device suitable for testing electronic components. Background Art

[0002] After manufacturing, general electronic components usually need to be tested to determine their physical properties. For example, the device provided in the patent application for "Circuit Component Loading and Unloading Device" with the announcement number 411735 for testing capacitor-type electronic components has one or more concentric ring seats of component slots that can rotate relative to the ring center. The slots are evenly spaced at angles and rotate in increments, and the rotation increment is the angular interval between adjacent slots. The ring seat is inclined at a certain angle, and when the ring seat rotates, the component flow path dumps the component toward the ring seat. The fixed grid plate adjacent to the outer plate side of the slot seat restricts the components that have not been returned to their original position to randomly roll down to the empty slot seat passing through the arc segment of the ring seat rotation path due to the power. The random rolling causes the components to Return to the slot seat, there is an electronic contactor for connecting the component and the test machine in the path of the rotating ring seat, the tested component passes under a spray manifold, the spray manifold plate defines a number of spray holes, and each time the ring seat rotates an increment, the spray holes are aligned with a group of slot seats, the spray pipe is connected to the spray port, the component is sprayed out from the slot seat by the air blowing of each air pressure valve selectively started, the sprayed component falls through the pipe due to the air blowing and gravity, and enters the classification storage box under the guidance of the pipeline plate, the component flow path can be selectively directed to the grid plate in response to the signal of the detector indicating that the grid plate lacks components, and the sensor can detect the components in the seat slot that have not yet been sprayed out by the spray manifold.

[0003] Since the prior art of the patent application with announcement number 411735 uses rolling contact inspection on the components being rotated and transported in the seat groove, the terminals rolling on the surface of the corresponding ring seat are pressed against each other, and the collision between the rollers of the terminals and the components can easily damage the corners of the components. Therefore, there is room for improvement. Summary of the invention

[0004] Therefore, an object of the present invention is to provide an electronic component inspection method that improves at least one disadvantage of the prior art.

[0005] Another object of the present invention is to provide an electronic component inspection device for executing the electronic component inspection method.

[0006] The electronic component inspection method according to the purpose of the present invention includes: providing a test board, on which a seat groove is provided for carrying a component to be tested, and the component to be tested is provided with an upper electrode located at the upper end and a lower electrode located at the lower end, wherein the upper electrode is exposed at the upper end opening of the seat groove and is higher than the upper surface of the test board; providing an upper terminal, which is located above the test board and electrically connected to a lower terminal below the test board; before the component to be tested is transported by the test board to the vicinity of the upper terminal, the upper terminal is lifted up to avoid the component to be tested; when the component to be tested is transported by the test board to the bottom of the upper terminal, the upper terminal is moved down to contact the upper electrode at the upper end of the component to be tested for inspection; after the inspection is completed, the component to be tested is transported by the test board and is out of contact with the upper terminal.

[0007] According to another purpose of the present invention, an electronic component device can be used to execute the electronic component inspection method as described, including: a machine table, on which a machine table top is provided; a supporting chassis, which is arranged on the machine table top, and a test board that can be driven to rotate is arranged on the supporting chassis, and a feeding unit, an inspection unit, and a discharge unit are arranged outside the periphery of the test board; wherein the inspection unit is provided with a frame, a plurality of upper terminal boxes arranged on the frame, and a plurality of lower terminal boxes respectively arranged below each of the upper terminal boxes in a parallel manner with a spacing therebetween; the upper terminal box is provided with a plurality of upper terminals arranged in parallel with a spacing therebetween; the lower terminal box is provided with a plurality of probes arranged in parallel with a spacing therebetween.

[0008] According to the electronic component inspection method and inspection equipment of the embodiments of the present invention, before the component to be tested is transported by the test board to the vicinity of the upper terminal, the upper terminal is lifted up to avoid the component to be tested; after the inspection is completed, the component to be tested is transported by the test board to break away from the contact with the upper terminal; therefore, when the component to be tested is transported by the test board to the vicinity of the upper terminal, it will not be damaged by collision, so that the yield of the inspection results can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a three-dimensional schematic diagram of a component to be tested, used to illustrate the inspection target of an embodiment of the present invention;

[0010] Figure 2 It is a schematic diagram of an electronic component inspection equipment machine;

[0011] Figure 3 It is a schematic diagram of the configuration of various mechanisms on the table of the electronic component inspection equipment;

[0012] Figure 4 is a schematic diagram of the test board in the electronic component inspection device;

[0013] Figure 5 is a partially enlarged schematic diagram of the test board in the electronic component inspection device;

[0014] Figure 6 It is a schematic diagram of the electronic component inspection device in which the component to be tested is protruding from the upper surface of the test board in the test board seat groove;

[0015] Figure 7 It is a schematic diagram of the arrangement of the upper and lower terminals in the upper and lower terminal boxes in the electronic component inspection equipment;

[0016] Figure 8 It is a partially enlarged schematic diagram of the arrangement of the upper and lower terminals in the upper and lower terminal boxes in the electronic component inspection equipment;

[0017] Fig. 9 It is a schematic diagram of the upper terminal being lifted up when the upper terminal is about to approach the transported component to be tested in the electronic component inspection equipment;

[0018] Fig.10 It is a schematic diagram of the upper terminal that has been lifted up in the electronic component inspection equipment and the component to be tested that is transported to the lower side;

[0019] Fig.11 It is a schematic diagram of the upper terminal in the electronic component inspection device moving downward to inspect the component to be tested below;

[0020] Fig.12 It is a schematic diagram showing that after the upper terminal in the electronic component inspection device is inspected, the test board moves the component to be tested out of contact with the upper terminal.

[0021]

Explanation of symbols

[0022] A: Machine

[0023] A1: Machine table

[0024] A2: Desktop

[0025] B: Load-bearing chassis

[0026] C: Test board

[0027] C1: Seat groove

[0028] D: Feeding unit

[0029] E: Inspection unit

[0030] E1: First inspection unit

[0031] E2: Second inspection unit

[0032] E3: The third inspection unit

[0033] E4: Upper terminal box

[0034] E41: Upper terminal

[0035] E42: Box cover

[0036] E421: Gasket

[0037] E422: Cable hole

[0038] E423: Cable

[0039] E43: Box holder

[0040] E431: Connecting seat

[0041] E432: Upper terminal block

[0042] E433: Acupuncture point placement

[0043] E434: Upper terminal block

[0044] E435: Elastic parts

[0045] E436: Conductive sheet

[0046] E437: Adapter

[0047] E438: Connectors

[0048] E439: Shrapnel

[0049] E5: Lower terminal box

[0050] E51: Lower terminal

[0051] E6: Seat frame

[0052] E61: Hollow holes

[0053] F: Discharge unit

[0054] G: Feeding mechanism

[0055] H: Material guide rack

[0056] K: Collection Agency

[0057] K1: Collection Box

[0058] M: Component under test

[0059] M1: Upper electrode

[0060] M2: Lower electrode DETAILED DESCRIPTION

[0061] See also Figure 1 , 2As shown, the embodiment of the present invention is described by an electronic component inspection device for testing a capacitor-type component M, but is not limited to the implementation of capacitor-type electronic components. The component M is provided with an upper electrode M1 at the upper end and a lower electrode M2 ​​at the lower end; the electronic component inspection device is provided with a disc-shaped metal support chassis B on a machine table A1 inclined at about sixty degrees on a machine A, and a test board C that can be driven to rotate intermittently in a clockwise direction is provided on the support chassis B, and a feeding unit D for loading the component M under test, an inspection unit E for testing the characteristics of the component M under test, and a discharge unit F for discharging and collecting the component M under test after the test is completed are provided outside the periphery of the test board C, a feeding mechanism G for providing the component M under test and a guide rack H for guiding the discharge unit F to a collection mechanism K are provided on a machine table A2 horizontal to the machine A, and the collection mechanism K for accommodating a plurality of material boxes K1 is provided on the front side of the machine A.

[0062] See also Figure 3 As shown, the inspection unit E is provided with a first inspection unit E1 for inspecting the insulation resistance (commonly known as IR) of the capacitor, and two second inspection units E2 and a third inspection unit E3 for inspecting the capacitance, loss or quality factor (commonly known as CD) of the capacitor, which are respectively located before and after the first inspection unit E1 in the direction in which the test board C intermittently rotates; wherein the third inspection unit E3 located after the first inspection unit E1 in the direction in which the test board C intermittently rotates can be omitted as needed.

[0063] Please refer to the figure As shown, the upper surface of the test board C is provided with a plurality of rows (8 rows are provided in this embodiment) of concentrically arranged rectangular seat grooves C1 at intervals in the radial direction, and a plurality of the seat grooves C1 are arranged in each row at intervals in the ring shape, and the seat grooves C1 corresponding to each row are linearly arranged in a plurality of rows at intervals in the radial direction; the component M to be tested is placed in the seat groove C1 with the upper electrode M1 at the upper end facing upward and the lower electrode M2 ​​at the lower end facing downward, and is intermittently transported by the test board C, wherein the upper surface of the upper electrode M1 is exposed at the upper end opening of the seat groove C1 and is slightly higher than the upper surface of the test board C.

[0064] See also Figure 7 , 8 The inspection unit E uses a rotatable wheel body disposed in the lower part of the box-shaped upper terminal box E4 above the test board C as an upper terminal E41, and cooperates with a probe extending from the upper part of the box-shaped lower terminal box E5 disposed below the test board C and corresponding to each of the upper terminal boxes E4 as a lower terminal E51 extending through the supporting chassis B for inspection; in this embodiment, the first inspection unit E1 is taken as an example for illustration. Figure 3The second inspection unit E2 and the third inspection unit E3 are different from the frame E6 of the first inspection unit E1 in terms of the frame structure, and are also provided with the upper terminal E41 and the lower terminal E51;

[0065] Taking the first inspection unit E1 as an example, the upper terminal box E4 is provided with a box cover E42 located at the top and a box seat E43 located at the bottom. The upper terminal box E4 is arranged in a hollow hole E61 of a frame E6 which can be driven to move up and down, and the box cover E42 is located above the hollow hole E61, and the box seat E43 is located in the hollow hole E61 and extends below it. When the frame E6 is driven to move up and down, the upper terminal E41 is linked to move up and down; the box cover E42 is located on a cushion E421 on the upper surface of the frame E6; the box seat E43 is located below the box cover E42, and includes a connecting seat E431 located at the top and an upper terminal seat E432 located at the bottom; a plurality of upper terminals E41 (8 in this embodiment) are arranged in parallel with a spacing therebetween on the box seat 43, and each upper terminal E41 has a There are provided, from bottom to top, in sequence, an upper terminal seat E434 for installing the upper terminal E41 in a recessed cavity E433 on the box seat E43, an elastic member E435 composed of a spring and located above the upper terminal seat E434 in the cavity E433 to provide an elastic driving force for the upper terminal E41, a slender sheet-shaped conductive piece E436 whose one end is connected to the upper terminal E41 and electrically conductive, a transition portion E437 to fix the other end of the conductive piece E436, a connecting piece E438 located in the connecting seat E431 at one end and electrically conductive to the other end of the conductive piece E436 at the transition portion E437 and the other end of which protrudes from the box cover E42, and a cable E423 in the box cover E42 that is welded and conductively connected to the connecting piece E438 and extends to the outside of the upper terminal box E4 through a cable hole E422 on the box cover E42.

[0066] See also Figure 8 , 9 The upper terminal E41 formed by the rolling wheel has its axle supported by an elastic sheet E439 and can be kept at a certain height position despite the downward elastic force of the elastic member E435;

[0067] When conducting an electrical inspection, before the component M to be tested is transported by the test board C to the vicinity of the upper terminal E41, the upper terminal E41 is lifted up to a height that is a predetermined distance higher than the upper electrode M1 on the upper surface of the component M to be tested so as to avoid the component M to be tested and not collide with the component M to be tested being transported; before the upper terminal E41 is lifted up, the upper terminal E41 may maintain contact with the surface of the test board C or maintain a distance without contact; if the contact is maintained, the upper terminal E41 is lifted up from the surface of the test board C; if the contact is maintained at a distance without contact, the upper terminal E41 may be located at the same height as the upper surface of the component M to be tested, and the upper terminal E41 is lifted up from the same height as the upper surface of the component M to be tested.

[0068] See also Fig.10 , 11 When the device under test M is transported by the test board C to the bottom of the upper terminal E41, the upper terminal E41 moves downward to contact the upper electrode M1 at the upper end of the device under test C for inspection.

[0069] See also Fig.12 After the inspection is completed, the component under test M is transported by the test board C and is out of contact with the upper terminal E41; the "out of contact" can be achieved by maintaining the lower edge of the upper terminal E41 at the height of the upper surface of the component under test M during the inspection, and only the test board C transports the component under test M out of contact with the upper terminal E41, thereby disengaging the component under test M; or after the inspection is completed, before the component under test M is transported by the test board C and is out of contact with the upper terminal E41, the upper terminal E41 is lifted to a height and maintains a distance from the upper surface of the component under test M without contact, and the test board C transports the component under test M away from the upper terminal E41 to disengage the component under test M.

[0070] In the electronic component inspection method and inspection equipment of the embodiment of the present invention, before the component M to be tested is transported by the test board C to be adjacent to the upper terminal E41, the upper terminal E41 is lifted up to avoid the component M to be tested; after the inspection is completed, the component M to be tested is transported by the test board C to be out of contact with the upper terminal E41; therefore, when the component M to be tested is transported by the test board C to be adjacent to the upper terminal E41, no collision damage will be caused to the component M to be tested, so that the yield of the inspection result can be improved.

[0071] The above descriptions are merely embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention. All simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the patent specification are still within the scope of the patent of the present invention.

Claims

1. A method for inspecting an electronic component, comprising: A test board is provided, on which a seat groove is provided for carrying a device to be tested, the device to be tested is provided with an upper electrode located at the upper end and a lower electrode located at the lower end, wherein the upper electrode is exposed at the upper end opening of the seat groove and is higher than the upper surface of the test board; Providing an upper terminal, located above the test board, electrically connected to a lower terminal below the test board; Features: Before the device under test is transported by the test board to be adjacent to the upper terminal, the upper terminal is lifted up to avoid the device under test; When the device under test is transported by the test board to the bottom of the upper terminal, the upper terminal moves downward to contact the upper electrode at the upper end of the device under test for inspection; After the inspection is completed, the component to be tested is transported by the test board and is separated from the upper terminal.

2. The electronic component inspection method according to claim 1, wherein: Before the device under test is transported by the test board to be adjacent to the upper terminal, the upper terminal is advanced upward, and the upper terminal maintains a distance from the surface of the test board without contacting it.

3. The electronic component inspection method according to claim 1, wherein: Before the device under test is transported by the test board to be adjacent to the upper terminal, the upper terminal is advanced upward, and the upper terminal is kept in contact with the surface of the test board.

4. The electronic component inspection method according to claim 1, wherein: After the inspection is completed, before the DUT is transported by the test board and loses contact with the upper terminal, the upper terminal is lifted to a height and keeps a distance from the upper surface of the DUT without contacting it.

5. The electronic component inspection method according to claim 1, wherein: After the inspection is completed, when the DUT is transported by the test board and loses contact with the upper terminal, the lower abutment edge of the upper terminal is maintained at the height of the upper surface of the DUT and loses contact with the DUT.

6. An electronic component inspection device, which can be used to perform the electronic component inspection method according to claims 1 to 5, comprising: A machine platform, on which a machine table is provided; A supporting chassis is arranged on the table of the machine, a test plate which can be driven to rotate is arranged on the supporting chassis, and a feeding unit, an inspection unit, and a discharge unit are arranged outside the periphery of the test plate; wherein, The inspection unit is provided with a base frame, a plurality of upper terminal boxes arranged on the base frame, and a plurality of lower terminal boxes respectively arranged in parallel with a spacing therebetween under each of the upper terminal boxes; the upper terminal box is provided with a plurality of upper terminals arranged in parallel with a spacing therebetween; the lower terminal box is provided with a plurality of probes arranged in parallel with a spacing therebetween.

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