Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus capable of improving the quality of a processed substrate. A substrate processing apparatus according to an embodiment includes: a supply unit that supplies a processing liquid to a substrate rotated by a rotating body; three or more base members disposed along a circle centered on the axis of the rotating body; a clamp pin provided at a position eccentric from the axis of rotation of the base member, the clamp pin being movable between a closed position in contact with / separated from the substrate and an open position in accordance with the rotation of the base member; a support member which is provided at a distance from the clamp pin in a plan view and supports the substrate; and an inclined surface provided on the support member, the inclined surface being heightened from a side close to the shaft of the rotating body toward a side away from the shaft, and being heightened from a side away from the clamp pin toward the side close to the shaft. The base member is movable between a mounting position at which the substrate is mounted and a holding position at which the substrate is held together with the clamp pin at the closed position along with the rotation of the base member.

Description

Technical Field

[0001] The invention relates to a substrate processing device. Background Art

[0002] Regarding substrate processing apparatuses that process substrates such as semiconductor wafers using processing liquids such as chemical liquids or cleaning liquids, single-wafer type apparatuses that process substrates one by one are widely used from the viewpoint of uniformity or reproducibility of processing each substrate. Single-wafer type substrate processing apparatuses rotate a rotating table holding a substrate, supplying processing liquid near the center of the substrate while rotating the substrate, thereby using centrifugal force to spread the processing liquid over the entire processed surface of the substrate, thereby processing the processed surface.

[0003] Such a processing device includes a chuck mechanism for holding a substrate on a rotating table. The chuck mechanism is configured such that a plurality of chuck pins arranged along the periphery of the substrate can move between a closed position in contact with the end surface of the outer periphery of the substrate and an open position away from the end surface. The substrate carried onto the rotating table is held on the rotating table by the plurality of chuck pins in the closed position.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2018-181889 Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] As described above, the processing liquid supplied to the vicinity of the center of the substrate flows toward the periphery of the substrate by the rotation of the rotating table, so that the entire processed surface can be processed. However, the processing liquid is not easy to flow at the position where the chuck pin abuts, so sometimes an unprocessed part or an insufficiently processed part is produced on the substrate. In addition, by rotating the rotating table at a high speed, when the processing liquid on the substrate is thrown off and dried, sometimes the processing liquid is not discharged and remains at the position where the chuck pin abuts the substrate. If the residual processing liquid dries, it becomes a watermark, resulting in a defective product.

[0009] An object of an embodiment of the present invention is to provide a substrate processing apparatus that can improve the quality of a processed substrate.

[0010] [Technical means to solve the problem]

[0011] The substrate processing device of the embodiment comprises: a rotating body that rotates a substrate; a supply unit that supplies a processing liquid to the substrate rotated by the rotating body; a base member that is arranged on the rotating body in a manner that allows it to rotate around an axis parallel to the axis of the rotating body, and three or more base members are arranged along a circle centered on the axis of the rotating body; and a clamping pin that is arranged at a position eccentric from the axis of rotation of the base member for each of the base members and can move between a closed position in contact with the substrate and an open position away from the substrate as the base member rotates. ; a supporting member, for each of the base members, arranged at a distance from the clamping pin in a plan view, and supporting the substrate; and an inclined surface, arranged on the supporting member, increasing in height from a side close to the axis of the rotating body toward a side away from it, and increasing in height from a side away from the clamping pin toward a side close to it, and being able to move between a loading position for loading the substrate when the clamping pin is in the open position, and a holding position for holding the substrate together with the clamping pin in the closed position as the base member rotates.

[0012] [Effects of the Invention]

[0013] According to the embodiments of the present invention, a substrate processing apparatus capable of improving the quality of a processed substrate can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a diagram showing the structure of a substrate processing apparatus according to an embodiment.

[0015] Figure 2 (A) Figure 2 (B) means Figure 1 A plan view of the operation of the holding portion of the substrate processing apparatus, Figure 2 (A) indicates a state where the clamp pin is in the open position and the support member is in the loading position. Figure 2 (B) shows a state where the clamp pin is in the closed position and the support member is in the holding position.

[0016] Figure 3 Yes means Figure 1 A partial cross-sectional view of an internal structure of a substrate processing apparatus in a substrate released state.

[0017] Figure 4 Yes means Figure 1 A partial cross-sectional view of a substrate holding state of an internal structure of a substrate processing apparatus.

[0018] Figure 5 (A) Figure 5 (B) is a three-dimensional diagram showing a clamping pin and a supporting member. Figure 5(A) indicates a state where the clamp pin is in the open position and the support member is in the loading position. Figure 5 (B) shows a state where the clamp pin is in the closed position and the support member is in the holding position.

[0019] Figure 6 (A) is a plan view showing a state where the clamp pin is in an open position and the support member is in a loading position, Figure 6 (B) is a plan view showing a state where the clamp pin is located at the closed position and the support member is located at the holding position.

[0020] Figure 7 (A) is a side view showing that the inclined surface is inclined from the side close to the axis of the rotating body toward the side away from the axis of the rotating body. Figure 7 (B) is a side view showing that the slope of the inclined surface increases from the side away from the clamp pin toward the side close to the clamp pin.

[0021] Figure 8 (A) is a side view showing a state where a substrate is placed on a supporting member located at a placement position, Figure 8 (B) is a side view showing a state where the substrate is held by the clamp pins and the supporting member.

[0022] Fig. 9 It is a plan view showing the positional relationship between the clamp pin and the support member.

[0023] Fig.10 It is a flowchart showing the procedure of substrate processing according to the embodiment.

[0024] Fig.11 It is an explanatory diagram showing an example of liquid accumulation between a substrate and a supporting member according to a comparative example.

[0025] [Explanation of Symbols]

[0026] 1: Substrate processing equipment

[0027] 20: Rotating body

[0028] 20a: Taiwan

[0029] 20b: Through hole

[0030] 20c: Support plate

[0031] 21: Fixed base

[0032] 21a: Protective wall

[0033] 22: Motor

[0034] 22a: Rotor

[0035] 22b: Stator

[0036] 22c: Rotation axis

[0037] 22d: Waste pipe

[0038] 30: Maintaining

[0039] 31: Base component

[0040] 31a: Top surface

[0041] 32: Clamping pin

[0042] 32a: Contact surface

[0043] 33. SP: Supporting member

[0044] 34: Rotation mechanism

[0045] 40: Supply Department

[0046] 41: Treatment liquid supply mechanism

[0047] 41a: Treatment tank

[0048] 41b: Single delivery pipe

[0049] 41c: Processing liquid supply pipe

[0050] 41d: Flow control valve

[0051] 41e: Flow meter

[0052] 42: Upper nozzle

[0053] 43: Mobile mechanism

[0054] 44: Lower nozzle

[0055] 50: Control device

[0056] 330, SL: inclined surface

[0057] 341: Shaft component

[0058] 342: Small gear

[0059] 343: Big Gear

[0060] Ax, Bx, Cx: Axes

[0061] d1, d2: distance

[0062] e1, e2: end

[0063] H, r1, r2: area

[0064] L: Treatment liquid

[0065] S1, S2, α, β1, β2, γ: arrows

[0066] S01, S02, S03, S04, S05, S06, S07, S08, S09, S10: Steps

[0067] t1, t2: width

[0068] v1, v2, v3, v4: straight line

[0069] wl: lower edge

[0070] Wu: upper edge

[0071] W: substrate DETAILED DESCRIPTION

[0072] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the direction against gravity is referred to as upward, and the direction following gravity is referred to as downward.

[0073] [summary]

[0074] like Figure 1 As shown, the substrate processing device 1 is a device as follows: a disc-shaped substrate W is held and rotated by using a clamping pin 32 and a supporting member 33, and a processing liquid L from a supply unit 40 is supplied to both the front and back surfaces (processed surfaces) of the substrate W, thereby performing a wet process on the substrate W. The wet process includes a cleaning process using a cleaning liquid, an etching process using a chemical solution, etc. In this embodiment, both the upper side (upper surface) and the lower side (lower surface) of the substrate W held by the clamping pin 32 are processed. However, the processing liquid L may be supplied only to the upper surface of the substrate W or only to the lower surface for processing.

[0075] In addition, the side surface of the outer periphery of the substrate W is defined as the end surface, the boundary between the end surface and the upper surface and the vicinity thereof is defined as the upper edge portion wu, and the boundary between the end surface and the lower surface and the vicinity thereof is defined as the lower edge portion wl (see Figure 8 (A) Figure 8 (B)). The substrate W to be processed is, for example, a circular silicon semiconductor wafer. In addition, the upper edge wu and the lower edge wl of the semiconductor wafer may be chamfered by bevel processing or may be rounded.

[0076] [Substrate processing equipment]

[0077] like Figure 1 As shown, the substrate processing apparatus 1 includes a rotating body 20 , a holding unit 30 , a supply unit 40 , and a control device 50 .

[0078] (rotating body)

[0079] The rotating body 20 rotates the substrate W. The rotating body 20 has a flat table 20a which is spaced apart from and faces the substrate W held by the holding part 30, and is arranged to be rotatable together with the holding part 30. The rotating body 20 is cylindrical in shape with one end blocked by the table 20a. The table 20a is a circular surface with a diameter larger than that of the substrate W. Figure 2 (A) Figure 2 As shown in (B), a circular through hole 20b is formed in the center of the stage 20a.

[0080] The rotating body 20 is provided so as to be rotatable on a fixed base 21 fixed to a setting surface (not shown) or a bracket provided on the setting surface by a motor 22. Ax in the figure is the axis of the rotation center of the rotating body 20. Figure 3 and Figure 4 As shown, the motor 22 is a hollow motor having a hollow rotor 22a and a stator 22b for rotating it. The rotor 22a of the motor 22 is connected to a hollow rotating shaft 22c. The outer periphery of the rotating shaft 22c is connected to a support plate 20c arranged inside the rotating body 20 in a coaxial manner with the rotating body 20. The stator 22b is fixed to the fixed base 21. A waste liquid pipe 22d connected to the through hole 20b is provided inside the rotating shaft 22c. The upper part of the waste liquid pipe 22d is formed with a funnel-shaped (inverted cone, mortar-shaped) inclined surface, and the upper end is open toward the through hole 20b.

[0081] The motor 22 rotates the rotor 22a by supplying electricity to the coil of the stator 22b. The rotating shaft 22c rotates along with the rotation of the rotor 22a, so that the rotating body 20 rotates. Figure 3 and Figure 4 The rotating body 20 shown by the dotted line and the portion surrounded by the dashed line are portions that rotate together with the substrate W, and the rest are portions that are fixed to the fixed base 21 and do not rotate together with the substrate W. However, the waste liquid pipe 22d is supported and fixed on the bracket independently of the rotor 22a, and does not rotate even if the rotating body 20 and the like rotate.

[0082] In addition, a protective wall 21a is provided on the fixed base 21. Figure 3 and Figure 4 As shown, the protective wall 21a is a double cylindrical wall that is concentric with the rotating body 20 and stands on the fixed base 21, and covers the lower edge of the rotating body 20 in a non-contact sandwiching manner. As a result, a labyrinth structure as a curved path is formed between the protective wall 21a and the rotating body 20, and the processing liquid L flowing down along the outer wall of the rotating body 20 is not easy to flow into the inside of the rotating body 20.

[0083] (Maintaining part)

[0084] The holding portion 30 holds the substrate W in parallel with the stage 20a and at a distance therefrom. Figure 3and Figure 4 As shown, the holding portion 30 includes a base member 31 , a clamp pin 32 , a support member 33 , and a rotating mechanism 34 .

[0085] <Base member>

[0086] like Figure 5 (A) Figure 5 As shown in (B), the base member 31 is a cylindrical member. The base member 31 is provided on the rotating body 20 (see Figure 3 , Figure 4 ).like Figure 2 (A) Figure 2 As shown in (B), three or more base members 31 are arranged along a circle centered on the axis Ax of the rotating body 20. The circle corresponds to the outer periphery of the substrate W positioned centered on the axis Ax. Six base members 31 of this embodiment are arranged at equal intervals in the circumferential direction. The top surface 31a of each base member 31 is exposed from the stage 20a.

[0087] <Clamping pin>

[0088] like Figure 5 (A) Figure 5 As shown in (B), the clamp pin 32 is a cylindrical member that rises from the top surface 31a of the base member 31 in a direction parallel to the axis Ax. Figure 6 (A) Figure 6 As shown in (B), the clamp pin 32 is provided at a position eccentric from the rotation axis Bx of the base member 31 for each base member 31. That is, the clamp pin 32 is provided at a position deviated from the axis Bx in a plan view. The clamp pin 32 is provided so as to be able to be in the open position ( Figure 2 (A) Figure 5 (A) Figure 6 (A)) and closed position ( Figure 2 (B) Figure 5 (B) Figure 6 The closed position is a position for holding the substrate W by contacting the substrate W. The open position is a position for releasing the substrate W by leaving the substrate W. In this embodiment, the six clamping pins 32 are synchronously contacted with the substrate W, so that the center of the substrate W is consistent with the axis Ax.

[0089] like Figure 8 (A) Figure 8As shown in (B), the contact surface 32a of the clamping pin 32 that is in contact with / separated from the substrate W is inclined outwardly toward the upper end (the end on the opposite side of the base member 31) so as to be away from the axis Cx. In this embodiment, the clamping pin 32 is cylindrical, and the contact surface 32a is an inverted tapered surface that expands in diameter as it goes upward. The length of the portion of the contact surface 32a in the height direction is greater than the thickness of the substrate W. However, the contact surface 32a may also be formed only in the portion that is in contact with / separated from the substrate W.

[0090] <Supporting member>

[0091] like Figure 6 (A) Figure 6 As shown in (B), the support member 33 is a member that is provided for each base member 31 at a distance from the clamp pin 32 in a plan view and supports the substrate W. Figure 5 (A) Figure 5 As shown in (B), the support member 33 is a member that stands up from the top surface 31a of the base member 31 in a direction parallel to the axis Bx. In addition, the support member 33 is bent in a manner that bulges toward the opposite side of the clamp pin 32 side when viewed from above. The clamp pin 32 and the support member 33 are arranged at a distance, so that a gap is formed between the two for the processing liquid L to flow. That is, there is no member that hinders the flow of the processing liquid L between the clamp pin 32 and the support member 33 except the top surface 31a of the base member 31.

[0092] The support member 33 is provided with an inclined surface 330. The inclined surface 330 is formed at the upper end of the support member 33 (the surface on the opposite side of the base member 31). Figure 6 The side view of (A) viewed from the direction of the black arrow is Figure 7 As shown by arrow S1 in (A), the inclined surface 330 becomes higher from the side close to the axis Ax of the rotating body 20 toward the side away from it. Figure 6 The side view of (A) as viewed from the direction of the white arrow is Figure 7 As shown by arrow S2 in (B), the inclined surface 330 becomes higher from the side away from the clamp pin 32 toward the side close to it. Figure 6 (A) Figure 6 As shown in (B), in the inclined surface 330, the end portion close to the axis Ax and the axis Bx and away from the clamp pin 32 is defined as e1, and the end portion away from the axis Ax and the axis Bx and close to the clamp pin 32 is defined as e2.

[0093] Figure 7 (A) arrow S1, Figure 7The arrow S2 in (B) briefly shows the overall inclination angle of the inclined surface 330. However, the inclination angle does not need to be constant over the entire length of the inclined surface 330. In the present embodiment, the inclination that increases from the side close to the axis Ax of the rotating body 20 toward the side away from the axis Ax becomes gentler as the distance from the axis Ax increases. That is, in the inclined surface 330, the area r2 near the end e2 far from the axis Ax (see FIG. 1 ) is smaller than the area r1 near the end e1 close to the axis Ax. Figure 6 (A) Figure 6 (B) Figure 8 (A) Figure 8 (B)) is closer to the horizontal. In addition, the highest position of the inclined surface 330 does not need to coincide with the end e2 on the side away from the axis Ax, and can also be lowered by chamfering the corners of the end e2 or making it rounded.

[0094] In addition, if Figure 8 (A) Figure 8 As shown in (B), the highest position of the inclined surface 330 is lower than the upper end of the clamp pin 32. More specifically, the highest position of the inclined surface 330 is a height at which the substrate W can be clamped between the contact surface 32a of the clamp pin 32 in a side view. However, as described above, the clamp pin 32 is provided at a distance from the support member 33, so that Figure 6 (A) Figure 6 As shown in (B), the inclined surface 330 is separated from the position of the clamp pin 32 in a plan view.

[0095] like Figure 6 (A) Figure 6 As shown in FIG. 1 (B), the end e2 side of the outer peripheral surface of the support member 33 is formed into a round shape in a plan view. In addition, the support member 33 is formed into a shape curved so as to follow the outer periphery of the clamp pin 32 in a plan view.

[0096] The inclined surface 330 is provided so as to be able to change between the loading position (refer to Figure 2 (A) Figure 3 , Figure 8 (A)) and hold position (refer to Figure 2 (B) Figure 4 , Figure 8 The loading position is a position where the substrate W is supported by the substrate W. In the loading position, the substrate W is supported only by the inclined surface 330, and the clamping pin 32 does not contact the substrate W. Thus, the portion where the substrate W is loaded is the region r1 on the side of the end e1 of the inclined surface 330 (see Figure 6The holding position is a position where the inclined surface 330 and the clamping pin 32 are in contact with the substrate W and the substrate W is held. In the holding position, the substrate W is held by the clamping pin 32 and the inclined surface 330 when viewed from the side. The portion of the inclined surface 330 in contact with the substrate W in the holding position is the region r2 on the side of the end e2 (see Figure 6 (B)). In addition, the inclined surface 330 becomes higher from the side away from the clamp pin 32 toward the side close to the clamp pin 32 (refer to Figure 7 (B)), therefore, in regions r1 and r2, the edge of the inclined surface 330 on the clamping pin 32 side is in contact with the substrate W.

[0097] In addition, if Figure 6 (A) Figure 6 As shown in (B), the support member 33 is formed such that the width of the side close to the axis Bx of rotation of the base member 31 is larger than that of the side far from the axis Bx of rotation of the base member 31, that is, the length in the horizontal direction is longer. Therefore, the width t1 of the side of the end e1 close to the axis Bx of the base member 31 in the inclined surface 330 is wider than the width t2 of the side of the end e2 far from the axis Bx of the base member 31. In addition, the width t1 mentioned here is the length of the tangent direction of the part of the inclined surface 330 that is in contact with the substrate W at the loading position, with the part on the inclined surface 330 in the outer periphery of the substrate W as the tangent point. In addition, the width t2 is the length of the tangent direction of the part of the inclined surface 330 that is in contact with the substrate W at the holding position, with the part on the inclined surface 330 in the outer periphery of the substrate W as the tangent point.

[0098] like Figure 8 As shown in (A), the substrate W is placed on the region r1 (see Figure 6 As the base member 31 rotates, the substrate W rises through the inclined surface 330 (black arrow in the figure). Figure 8 As shown in (B), the inclined contact surface 32a of the clamp pin 32 contacts the upper edge portion wu of the substrate W to form a closed position, and the region r2 of the inclined surface 330 (refer to Figure 6 (B)) is in contact with the lower edge portion wl of the substrate W to become a holding position.

[0099] <Position relationship>

[0100] More specifically, the base member 31 , the clamp pin 32 , and the inclined surface 330 of the support member 33 have the following positional relationship in a plan view.

[0101] (1) Figure 6 (A) Figure 6As shown in (B), the distance d1 between the rotation axis Bx of the base member 31 and the end e1 of the inclined surface 330 closest to the axis Bx is longer than the distance d2 between the rotation axis Bx of the base member 31 and the clamp pin 32. The distance d2 between the axis Bx and the clamp pin 32 is the shortest distance between the outer circumference of the clamp pin 32 and the axis Bx in a plan view.

[0102] (2) Figure 6 (A) Figure 6 As shown in (B), the rotation axis Bx of the base member 31 is located inside the outer periphery of the substrate W placed on the inclined surface 330. Inside the outer periphery means being located close to the center of the substrate W.

[0103] (3) Fig. 9 As shown, a portion of the inclined surface 330 is disposed in a region H at a distance from the axis Bx of the base member 31 that is the same as the distance from the axis Bx of the clamp pin 32 to the base member 31. Preferably, the end e1 of the inclined surface 330 is disposed in the region H. The region H is an annular shape having a width of the diameter of the outer circumference of the clamp pin 32. The so-called region H refers to a region that overlaps with the region H in a plan view and does not include the inner circular region of the annular shape. In addition, the end e2 of the inclined surface 330 is disposed outside the region H.

[0104] In addition, the end e2 of the inclined surface 330 is located in the following area in the area surrounded by the straight line v1 passing through the rotation axis Bx of the base member 31 and the axis Cx of the clamp pin 32, the straight line v2 on the outer periphery side of the base member 31 which is a tangent to the outer periphery of the clamp pin 32 and is orthogonal to the straight line v1, and the outer periphery of the base member 31, that is, the rotation direction ( Fig. 9 In the area on the downstream side (in the direction of the arrow).

[0105] In addition, a straight line v3 passing through the rotation axis Bx of the base member 31 and serving as a tangent line passing through the outer periphery of the clamp pin 32 between the clamp pin 32 and the support member 33 is in contact with an end e2 of the inclined surface 330 on the side away from the rotation axis Bx of the base member 31 .

[0106] (4) When the clamping pin 32 is located in the open position, the area r1 on the inclined surface 330 for mounting the substrate W is the area on the downstream side in the rotation direction when the base member 31 rotates to change the clamping pin 32 from the open position to the closed position, compared with the following straight line v4, wherein the straight line v4 is orthogonal to the straight line v3 which is a tangent line passing through the outer periphery of the clamping pin 32 between the clamping pin 32 and the supporting member 33 and passes through the axis Cx of the rotation of the base member 31 and passes through the axis Cx of the clamping pin 32.

[0107] <Rotation Mechanism>

[0108] The rotating mechanism 34 rotates the base member 31 to move the clamp pin 32 between the closed position and the open position and to move the support member 33 between the placement position and the holding position. Figure 2 (A)~ Figure 4 As shown, the rotating mechanism 34 has a shaft member 341, a small gear 342, and a large gear 343. Figure 5 (A) Figure 5 As shown in FIG. 2(B) , the shaft member 341 is a cylindrical member provided coaxially with the rotation axis Bx of the base member 31 on the opposite side of the top surface 31 a of the base member 31 .

[0109] The pinion 342 is a sector gear provided at the end of the shaft member 341 on the opposite side to the base member 31. The pinion 342 is rotatably provided on the support plate 20c. The large gear 343 is a gear having gear grooves intermittently formed thereon corresponding to the pinion 342. The large gear 343 is rotatably provided on the outer periphery of the rotating shaft 22c via a bearing (not shown). That is, the large gear 343 is provided to be coaxially rotatable with the rotating body 20 by the motor 22 that rotates the rotating body 20. The large gear 343 is formed with six convex portions at prescribed intervals in the circumferential direction at intervals corresponding to the pinion 342, and a gear groove engaging with the pinion 342 is formed on the outer peripheral surface of the front end of each convex portion.

[0110] The large gear 343 is moved toward Figure 2 As a result, the pinion 342 applies force in the clockwise direction indicated by the arrow β1, so that the base member 31 rotates in conjunction with the pinion 342, and the clamping pin 32 moves toward the center of the rotating body 20, as shown in FIG. Figure 2 As shown in (B), the closed position is maintained in contact with the end surface of the substrate W. In addition, when the substrate is processed, the base member 31, the shaft member 341, the clamp pin 32, the small gear 342, the large gear 343 and the rotating body 20 are kept in the closed position. Figure 2 ( Figure 2 The device is rotated in the direction of the white arrow in (B).

[0111] In addition, the large gear 343 is prevented from rotating by a stop mechanism not shown. Figure 2 As shown in (B), when the rotating body 20 is rotated in the direction of arrow γ by a predetermined angle, the small gear 342 meshing with the large gear 343 whose rotation is blocked rotates in the counterclockwise direction indicated by arrow β2. As a result, the base member 31 rotates, and the clamping pin 32 moves in a direction away from the end surface of the substrate W, as shown in FIG. Figure 2 As shown in (A), it comes to the open position.

[0112] (Supply Department)

[0113] like Figure 1 As shown, the supply unit 40 supplies the processing liquid L to the processing surface of the substrate W. The supply unit 40 includes a processing liquid supply mechanism 41 , an upper nozzle 42 , a moving mechanism 43 , and a lower nozzle 44 .

[0114] The treatment liquid supply mechanism 41 is a mechanism for supplying a plurality of treatment liquids L. In the present embodiment, for example, an aqueous solution containing hydrogen fluoride (HF) (hereinafter referred to as a hydrofluoric acid solution), ultrapure water (hereinafter referred to as DIW (Deionized Water)), ozone (O 3 The treatment liquid supply mechanism 41 includes a treatment liquid tank 41a for storing each treatment liquid L.

[0115] From each processing liquid tank 41a, a separate delivery pipe 41b is connected in parallel to a processing liquid supply pipe 41c. The front end of the processing liquid supply pipe 41c is connected to the upper nozzle 42 and the lower nozzle 44. Thus, the processing liquid L from each processing liquid tank 41a is supplied to the processing surface of the substrate W via the separate delivery pipe 41b and the processing liquid supply pipe 41c. A flow rate adjustment valve 41d and a flow meter 41e are respectively provided in each separate delivery pipe 41b.

[0116] The upper nozzle 42 is connected to the processing liquid supply mechanism 41 via a processing liquid supply pipe 41c, and sprays the processing liquid L to the vicinity of the center of the upper surface of the substrate W. The moving mechanism 43 has an arm that swings by a driving source, and moves the upper nozzle 42 provided at the front end of the arm between a supply position above the vicinity of the center of the substrate W and a retreat position retreated from the upper side of the substrate W.

[0117] The lower nozzle 44 is connected to the processing liquid supply mechanism 41 via the processing liquid supply pipe 41c, and sprays the processing liquid L to the vicinity of the center of the lower surface of the substrate W. The front end of the lower nozzle 44 is installed in the through hole formed on the inclined surface of the waste liquid pipe 22d, and faces the vicinity of the center of the lower surface of the substrate W.

[0118] (Control device)

[0119] The control device 50 controls various parts of the substrate processing apparatus 1. In order to realize various functions of the substrate processing apparatus 1, the control device 50 has: a processor to execute a program; a memory to store various information such as programs or operation conditions; and a drive circuit to drive various elements. That is, the control device 50 controls the motor 22, the rotating mechanism 34, the processing liquid supply mechanism 41, the moving mechanism 43, etc.

[0120] [Substrate processing]

[0121] Next, for the substrate processing performed by the substrate processing apparatus 1, in the Figures 1 to 9 Based on this, we also refer to Fig.10 The process described below is an example of a cleaning process using DIW, a hydrofluoric acid solution, and ozone water.

[0122] First, in Figure 2 In the state shown in (B), the rotating body 20 is rotated in the γ direction by a predetermined angle, and the pinion 342 is rotated in the β2 direction. Figure 2 As shown in (A), the clamp pin 32 comes to a position away from the area where the substrate W is placed ( Figure 2 (A) Figure 2 At this time, a portion of the region r1 of the inclined surface 330 of the support member 33 is located further inside the outer periphery of the region where the substrate W is placed (see Fig. 9 ).

[0123] like Figure 3 As shown, the substrate W mounted on the robot arm of the transfer robot is loaded onto the rotating body 20 and its edge is supported by the region r1 of the inclined surface 330 of the plurality of support members 33 (step S01). Then, the robot arm retreats from the substrate processing apparatus 1 (step S02).

[0124] Next, when the force caused by the rotation of the rotating body 20 in the γ direction is stopped, as shown in FIG. Figure 2 As shown in (A), the large gear 343 is biased in the α direction by the spring and rotates, so the base member 31 rotates in the β1 direction together with the small gear 342. Figure 8 As shown in (A), as the clamp pin 32 moves toward the direction of contact with the end surface of the substrate W, the support member 33 moves while pushing up the edge of the substrate W through the inclined surface 330, as shown in FIG. Figure 8 As shown in (B) of FIG. 1 , the clamp pin 32 stops at the closed position in contact with the end surface of the substrate W (step S03). Figure 2 (B) Figure 6 As shown in (B), the inclined surface 330 is at the holding position, so the substrate W is held by the region r2 of the inclined surface 330 together with the clamp pins 32 .

[0125] In this way, the upper edge wu and the lower edge wl of the substrate W are held by the clamp pins 32 and the supporting member 33, so that the substrate W can be held on the table 20a of the rotating body 20. At this time, the six clamp pins 32 are used to position the substrate W so that the center of the substrate is aligned with the rotation axis Ax of the rotating body 20.

[0126] Next, the rotating body 20 rotates at a relatively low predetermined speed (e.g., about 50 rpm). As a result, the substrate W rotates at the predetermined speed together with the holding portion 30 (step S04). Then, the processing liquid L is supplied to the upper and lower surfaces of the substrate W from the upper nozzle 42 and the lower nozzle 44, and the substrate processing is started (step S05).

[0127] The following describes the details of the substrate processing. Figure 1 As shown in the figure, the moving mechanism 43 moves the upper nozzle 42 to above the center of the upper surface of the substrate W. Then, the processing liquid L is sprayed from the upper nozzle 42 and the lower nozzle 44 to the center of the upper surface and the lower surface of the substrate W. When the processing liquid L is supplied to the processing surface of the rotating substrate W, the processing liquid L moves toward the outer periphery of the substrate W in sequence, so that the entire upper surface and the lower surface of the substrate W can be processed by the processing liquid L. In addition, the processing liquid L flowing out from the outer periphery of the substrate W toward the holding part 30 is discharged to the outside from between the clamping pin 32 and the supporting member 33. In addition, the bottom of the substrate W connected to the clamping pin 32 is completely empty, so the processing liquid L will not be retained.

[0128] The inclined surface 330 becomes higher from the side away from the clamp pin 32 toward the side close to the clamp pin 32 (see Figure 7 (B)), therefore, only the edge of the inclined surface 330 on the clamping pin 32 side is in contact with the substrate W, and the portion that blocks the flow from the center of the substrate W to the outside is small, so the processing liquid L will not be retained. In addition, the highest position in the inclined surface 330 is lower than the upper end of the clamping pin 32, so the processing liquid L flowing toward the outside will not hit the upper part of the inclined surface 330 and hinder the flow. In addition, the inclination of the inclined surface 330 becomes gentler as it moves away from the axis Ax of the rotating body 20, and is close to horizontal at a high position, so the processing liquid L is easy to flow. Furthermore, compared with the width t1 of the end e1 side of the inclined surface 330 close to the axis Bx, the width t2 of the end e2 side away from the axis Bx is narrower, so the width t2 of the region r2 of the inclined surface 330 existing at the lower part of the substrate W is narrowed, and the processing liquid L is easy to flow.

[0129] When the prescribed processing time has passed, the supply of the processing liquid L is stopped through the upper nozzle 42 and the lower nozzle 44, and the processing in the substrate processing device 1 is ended (step S06 is (YES)), and the rotating body 20 rotates at a relatively high rotation speed (for example, above 300 rpm), shakes off the processing liquid L and dries it, and then stops rotating (step S07).

[0130] During the rotation of the substrate W as described above, the processing liquid L supplied from the upper nozzle 42 and the lower nozzle 44 can be switched according to the desired processing. For example, after the substrate W is cleaned by supplying DIW to remove particles or dirt on the upper and lower surfaces of the substrate W, a hydrofluoric acid solution is supplied to remove the oxide layer of the substrate W. Then, after the hydrofluoric acid and the reaction product are removed by supplying DIW, ozone water is supplied to oxidatively decompose organic matter to remove fine impurities on the surface.

[0131] After the above treatment, Figure 2 As shown in (B), by rotating the rotating body 20 in the γ direction at a predetermined angle, the pinion 342 rotates in the β2 direction, so that Figure 2 (A) Figure 6 As shown in (A) of FIG. 1 , the clamp pin 32 comes to the open position away from the end surface of the substrate W (step S08 ). At this time, the inclined surface 330 of the support member 33 is at the placement position.

[0132] In this state, the robot arm of the transfer robot is inserted under the substrate W and raised to support the substrate W (step S09 ). Then, the robot arm raises the substrate W and carries it out of the substrate processing apparatus 1 (step S10 ).

[0133] [Effect]

[0134] (1) The substrate processing apparatus 1 of the present embodiment comprises: a rotating body 20 for rotating a substrate W; a supply unit 40 for supplying a processing liquid L to the substrate W rotated by the rotating body 20; a base member 31 provided on the rotating body 20 so as to be rotatable about an axis Bx parallel to the axis Ax of the rotating body 20, and three or more base members 31 are arranged along a circle centered about the axis Ax of the rotating body 20; and a clamping pin 32 provided at a position eccentric from the rotation axis Bx of the base member 31 for each base member 31, and capable of being moved between a closed position in contact with the substrate W and a position away from the substrate as the base member 31 rotates. W can be moved between the open position of the substrate W; a supporting member 33, which is arranged at a distance from the clamping pin 32 for each base member 31 when viewed from above, and supports the substrate W; and an inclined surface 330, which is arranged on the supporting member 33, and increases in height from the side close to the axis Ax of the rotating body 20 toward the side away from it, and increases in height from the side away from the clamping pin 32 toward the side close to it, and can move between a loading position for loading the substrate W when the clamping pin 32 is in the open position, and a holding position for holding the substrate W together with the clamping pin 32 in the closed position as the base member 31 rotates.

[0135] Therefore, the processing liquid L flowing out from the outer periphery of the substrate W is discharged from between the clamping pin 32 and the supporting member 33. Then, the bottom of the substrate W in contact with the clamping pin 32 is empty, so the processing liquid L does not accumulate. In addition, the inclined surface 330 becomes higher from the side close to the axis Ax of the rotating body 20 toward the side away from it, so the position in contact with the substrate W becomes the lower edge wl of the substrate W. Moreover, the inclined surface 330 becomes higher from the side away from the clamping pin 32 toward the side close to it, so it is in contact with the substrate W only at the edge on the clamping pin 32 side. Therefore, the area in contact with the substrate W can be minimized, and the part that blocks the flow of the processing liquid L from the center of the substrate W to the outside can be minimized, so the processing liquid L is not easily retained.

[0136] Here, if Fig.11 As shown in the figure, when the support member SP having the inclined surface SL is integrally formed with the clamp pin 32, liquid accumulation caused by the processing liquid L occurs between the lower surface of the substrate W and the inclined surface SL. However, in the present embodiment, the clamp pin 32 is separated from the inclined surface 330, the lower part of the substrate W in contact with the clamp pin 32 is empty, and the processing liquid L easily flows outward between the substrate W and the inclined surface 330, so that liquid accumulation does not occur. Therefore, it is not easy to generate an unprocessed portion or an insufficiently processed portion on the substrate W, and the generation of watermarks caused by the drying of the residual processing liquid L can be prevented, thereby improving product quality.

[0137] (2) The highest position of the inclined surface 330 is lower than the upper end of the clamp pin 32. Therefore, the inclined surface 330 does not exist at a position that obstructs the flow of the processing liquid L, so that the processing liquid L can be prevented from stagnating.

[0138] (3) In a plan view, the width t1 of the inclined surface 330 on the side of the end e1 close to the rotation axis Bx of the base member 31 is wider than the width t2 on the side of the end e2 away from the base member 31. Therefore, when the substrate W is loaded, the substrate W can be stably supported in the region r1 with the wide width t1. In addition, when the substrate W is processed, it is held in the region r2 with the narrow width t2, so that the flow of the processing liquid L is not hindered and can flow easily. Furthermore, it is possible to prevent the processing liquid L discharged from the substrate W due to the centrifugal force from colliding and scattering and adhering to the substrate W again.

[0139] (4) The inclined surface 330 is inclined from the side close to the rotation axis Ax of the rotating body 20 to the side away from it, and the inclination becomes gentler as it moves away from the rotation axis Ax of the rotating body 20. Therefore, the inclination of the side from which the processing liquid L is discharged is close to horizontal, and the processing liquid L on the substrate W and the processing liquid L attached to the supporting member 33 are easily discharged due to centrifugal force.

[0140] (5) The contact surface 32a of the clamping pin 32 that contacts / separates from the substrate W is inclined toward the upper end and outwardly away from the axis Cx of the clamping pin 32. Therefore, the contact surface 32a can contact the upper edge portion wu of the substrate W pushed up by the inclined surface 330 and hold the substrate W, thereby reducing the contact area. In addition, the processing liquid L is easily discharged through the gap formed by the inclined contact surface 32a. In particular, the contact surface 32a is an inverted cone (inclined curved surface), so the contact area with the substrate W can be reduced and the gap for the processing liquid L to flow can be increased.

[0141] (6) The support member 33 is curved so as to bulge toward the side opposite to the clamp pin 32 side in a plan view. The processing liquid L flowing on the upper and lower surfaces of the substrate W becomes spiral due to the rotation of the substrate W, so the discharge direction of the processing liquid L is not a straight radial direction but an inclined direction. Since the support member 33 is curved, the processing liquid L can be discharged more smoothly along the flow of the processing liquid L.

[0142] (7) In a plan view, a distance d1 between the rotation axis Bx of the base member 31 and the end e1 of the inclined surface 330 closest to the axis Bx is longer than a distance d2 between the rotation axis Bx of the base member 31 and the clamp pin 32. Therefore, when the inclined surface 330 is in the loading position, the clamp pin 32 can be separated from the substrate W.

[0143] (8) In a plan view, the rotation axis Bx of the base member 31 is located further inside than the outer periphery of the substrate W placed on the support member 33. Therefore, the rotation amount of the base member 31 for moving the clamp pin 32 and the support member 33 can be reduced, and the size of the support member 33 can be suppressed. In addition, the size of the base member 31 and the rotating body 20 can also be suppressed.

[0144] (9) In a plan view, a portion of the inclined surface 330 is provided in a region H at the same distance from the axis Bx of rotation of the base member 31 as the distance from the clamp pin 32 to the axis Bx of rotation of the base member 31. Therefore, as the inclined surface 330 moves together with the clamp pin 32 as the base member 31 rotates, the substrate W placed on the inclined surface 330 can be held between the clamp pin 32 and the inclined surface 330.

[0145] (10) The end e1 of the inclined surface 330 is disposed within the region H. That is, the inclined surface 330 is not disposed inside the region H, but is disposed at a position avoiding a circular region that is further inside the region H. Therefore, when the substrate W is in the holding position, the area of ​​the inclined surface 330 that enters under the substrate W can be reduced, so that the processing liquid L supplied to the lower surface of the substrate W is not easily blocked from being discharged due to centrifugal force.

[0146] In addition, the end e2 of the inclined surface 330 is disposed outside the region H. Therefore, when the inclined surface 330 moves together with the clamp pins 32 as the base member 31 rotates, the substrate W placed on the inclined surface 330 can be reliably held between the clamp pins 32 and the inclined surface 330 .

[0147] (11) In a plan view, an end e2 of the inclined surface 330 on the side away from the rotation axis Bx of the base member 31 is located in an area surrounded by a straight line v1 passing through the rotation axis Bx of the base member 31 and the axis Cx of the clamp pin 32, a straight line v2 on the outer periphery of the base member 31 which is a tangent to the outer periphery of the clamp pin 32 and is orthogonal to the straight line v1, and the outer periphery of the base member 31, that is, a rotation direction ( Fig. 9 Therefore, the rotation amount of the base member 31 for moving the support member 33 can be reduced before the inclined surface 330 changes from the loading position to the holding position, and the enlargement of the support member 33 can be suppressed.

[0148] (12) In a plan view, a straight line v3 passing through the axis Bx of rotation of the base member 31, which is a tangent line passing through the outer periphery of the clamp pin 32 between the clamp pin 32 and the support member 33, is in contact with an end e2 of the inclined surface 330 on the side away from the axis Bx of rotation of the base member 31. Therefore, the amount of rotation of the base member 31 for moving the support member 33 can be reduced before the inclined surface 330 changes from the loading position to the holding position, and the size increase of the support member 33 can be suppressed.

[0149] (13) In a plan view, when the clamp pin 32 is located at the open position, the region r1 on the support member 33 where the substrate W is placed is located in a region that is downstream in the rotation direction when the base member 31 rotates to change the clamp pin 32 from the open position to the closed position, compared to a straight line v4 that is orthogonal to a straight line v3 that is a tangent line to the outer periphery of the clamp pin 32 between the clamp pin 32 and the support member 33 and passes through the axis Cx of the clamp pin 32. Therefore, the loaded substrate W can be reliably placed on the support member 33.

[0150] [Modifications]

[0151] (1) This embodiment is not limited to the above-described form. The inclined surface 330 may have a constant inclination angle as a whole. The inclined surface 330 may not be curved. The width of the inclined surface 330 may be constant.

[0152] (2) The clamp pin 32 is not limited to a specific shape as long as it is a protruding portion having an outer peripheral surface capable of holding the end surface of the substrate W. For example, the outer shape of the clamp pin 32 may be a simple cylindrical shape, or may have a portion with an expanded diameter at the upper portion as in the above-mentioned form. In addition, the clamp pin 32 as a whole may also be an inverted cone (inverted truncated cone). Wrinkles, grooves, etc. may also be formed on the outer peripheral surface of the clamp pin 32.

[0153] (3) The present embodiment can be widely applied to a substrate processing device 1 that supplies a processing liquid L to a rotating substrate W and performs processing. Therefore, the type of the processing liquid L used is not limited to that exemplified in the above embodiment. For example, various processing liquids L can be applied, such as an aqueous solution containing phosphoric acid, an ammonia-hydrogen peroxide aqueous mixture (APM (ammonia-hydrogen peroxide mixture)), a hydrochloric acid-hydrogen peroxide aqueous mixture (HPM (hydrochloric acid-hydrogenperoxide mixture)), a sulfuric acid-hydrogen peroxide aqueous mixture (SPM (sulfuric acid-hydrogen peroxide mixture)), a dilute hydrofluoric acid solution (diluted hydrofluoric acid, DHF), a hydrofluoric acid-hydrogen peroxide aqueous mixture (FPM (hydrofluoric acid-hydrogenperoxide mixture)), and a hydrofluoric acid (HF)-ozone aqueous mixture. In addition, in the case of an apparatus using a processing liquid L that needs to be heated, a heating unit that heats the processing liquid L and maintains the temperature can also be provided.

[0154] [Other embodiments]

[0155] The above describes the embodiments of the present invention and the variations of each part, but the embodiments or variations of each part are provided as examples and are not intended to limit the scope of the invention. The novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, changes, and combinations can be made without departing from the scope of the invention. These embodiments or their variations are included in the scope or the main idea of ​​the invention and are included in the invention described in the claims.

Claims

1. A substrate processing device, characterized in that have: A rotating body for rotating the substrate; a supplying unit that supplies a processing liquid to the substrate rotated by the rotating body; a base member provided on the rotating body so as to be rotatable around an axis parallel to the axis of the rotating body, and three or more base members are arranged along a circle centered around the axis of the rotating body; a clamp pin, for each of the base members, disposed at a position eccentric from the axis of rotation of the base member, and movable between a closed position in contact with the substrate and an open position away from the substrate as the base member rotates; a supporting member, which is provided for each of the base members at a distance from the clamping pin in a plan view and supports the substrate; as well as The inclined surface is provided on the supporting member, and becomes higher from a side close to the axis of the rotating body toward a side away from it, and becomes higher from a side away from the clamping pin toward a side close to it. As the base member rotates, the inclined surface can move between a loading position for loading the substrate when the clamping pin is located at the open position, and a holding position for holding the substrate together with the clamping pin located at the closed position.

2. The substrate processing device according to claim 1, characterized in that: The highest position of the inclined surface is lower than the upper end of the clamping pin.

3. The substrate processing device according to claim 1, characterized in that: The width of the inclined surface at an end portion close to the axis of rotation of the base member is wider than that at an end portion away from the base member in a plan view.

4. The substrate processing device according to claim 1, characterized in that: The inclined surface has an inclination that increases from a side close to the axis of rotation of the rotating body toward a side away from the axis of rotation of the rotating body, and the inclination becomes gentler as it moves away from the axis of rotation of the rotating body.

5. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: The contact surface of the clamp pin that contacts and separates from the substrate faces the upper end and is inclined outwardly so as to be separated from the axis of the clamp pin.

6. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: The support member is curved so as to bulge toward a side opposite to the clamp pin side in a plan view.

7. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: In a plan view, a distance between the rotation axis of the base member and an end of the inclined surface closest to the axis is longer than a distance between the rotation axis of the base member and the clamp pin.

8. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: In a plan view, the rotation axis of the base member is located inside the outer periphery of the substrate placed on the support member.

9. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: In a plan view, a portion of the inclined surface is provided in a region where a distance from the rotation axis of the base member is the same as a distance from the clamp pin to the rotation axis of the base member.

10. The substrate processing apparatus according to claim 9, wherein: In a plan view, an end portion of the inclined surface closer to the rotation axis of the base member is disposed within the region, and an end portion of the inclined surface farther from the rotation axis of the base member is disposed outside the region.

11. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: In a top view, the end of the inclined surface on the side away from the axis of rotation of the base member is located in the following area surrounded by a straight line passing through the axis of rotation of the base member and the axis of the clamping pin, a straight line on the outer peripheral side of the base member which is a tangent to the outer periphery of the clamping pin and is orthogonal to the straight line, and the outer periphery of the base member, that is, an area on the downstream side in the rotation direction when the base member rotates to change the clamping pin from the open position to the closed position.

12. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: In a plan view, a straight line passing through the rotation axis of the base member, which is a tangent line passing through the outer periphery of the clamp pin between the clamp pin and the support member, contacts an end of the inclined surface on a side away from the rotation axis of the base member.

13. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: In a top view, when the clamping pin is located in the open position, the area on the support member for mounting the substrate is located in the following area: an area on the downstream side in the rotation direction when the base member rotates to change the clamping pin from the open position to the closed position, compared with the following straight line, which is orthogonal to a straight line that passes through the axis of rotation of the base member and is a tangent to the outer periphery of the clamping pin between the clamping pin and the support member, and passes through the axis of the clamping pin.

Images