Cooling mechanism, electrical assembly and vehicle

Abstract

The invention discloses a cooling mechanism, an electrical assembly and a vehicle, and the cooling mechanism comprises a bottom shell which is provided with a cooling bin with an opening; the cover body is arranged on the opening; and the flow guide mechanism is arranged in the cooling bin and detachably connected with the cover body and / or the bottom shell, and the flow guide mechanism is configured to adjust a flow channel and / or the flow speed of cooling liquid in the cooling bin. By means of the mode, flexible adjustment of the flow channel and / or the flow speed can be achieved, and then heat dissipation control and the heat dissipation effect are improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation devices, and in particular to a cooling mechanism, an electrical component and a vehicle. Background Art

[0002] With the advancement and popularization of science and technology, various electronic devices have long become an indispensable role in people's daily lives. The electronic components inside electronic devices will generate heat when they are in operation, and the high temperature working environment can easily cause damage to the electronic components. Therefore, the cooling mechanism is a very important and necessary component of electronic devices.

[0003] In the related art, the cooling mechanism uses coolant as the heat dissipation medium. The cooling mechanism is provided with a fluid flow channel, through which the coolant is directed to the vicinity of the electronic components to absorb the heat generated by the electronic components, and the coolant after absorbing the heat is discharged through the flow channel, thereby achieving heat dissipation of the electronic components. Summary of the invention

[0004] In view of the above problems, the present application provides a cooling mechanism, an electrical component and a vehicle to achieve flexible adjustment of the flow channel and / or flow rate, thereby improving heat dissipation control and enhancing the heat dissipation effect.

[0005] In order to solve the above technical problems, the present application proposes a cooling mechanism. The cooling mechanism includes: a bottom shell, provided with a cooling chamber with an opening; a cover body, provided on the opening; a flow guide mechanism, provided in the cooling chamber and detachably connected to the cover body and / or the bottom shell, the flow guide mechanism being configured to adjust the flow path and / or flow rate of the coolant in the cooling chamber.

[0006] The cooling chamber of the cooling mechanism is provided with a flow guide mechanism, and the flow channel and / or flow rate of the coolant in the cooling chamber can be adjusted by the flow guide mechanism, so that the flow channel and / or flow rate of the coolant in the cooling chamber can be adjusted according to the heat dissipation requirements of the heat-generating components, thereby improving the heat dissipation effect of the cooling mechanism on the heat-generating components; further, the flow guide mechanism is detachably connected to the cover body and / or the bottom shell, which can improve the convenience of adjusting the flow channel and / or flow rate of the coolant in the cooling chamber. Therefore, the flow channel and / or flow rate can be flexibly adjusted, thereby improving heat dissipation control and enhancing heat dissipation effect.

[0007] In some embodiments, at least one limiting hole is provided on a side of the cover body close to the cooling chamber and / or on an inner side wall of the bottom shell, and at least a portion of the flow guiding mechanism is connected to the limiting hole.

[0008] The flow guide mechanism is installed through the limiting hole on the side of the cover body close to the cooling bin or the inner wall of the bottom shell. The structure is simple and easy to implement, and the volume of the cooling mechanism can be reduced or the volume of the cold zone bin can be increased.

[0009] In some embodiments, the flow guiding mechanism includes: a flow limiting member, including a connecting portion and a flow limiting portion. The connecting portion is arranged in the limiting hole.

[0010] The flow guiding mechanism is realized by the flow limiting piece, and turbulence is formed when the coolant flows through the flow limiting piece. The flow rate of the coolant in the cooling chamber can be reduced by the flow limiting piece, so that the coolant can absorb the heat of the heat-generating components more fully and effectively, thereby improving the heat dissipation effect; and the connecting part of the flow limiting piece is connected by the limiting hole, which can not only improve the sealing of the cover body and / or the bottom shell, but also reduce the height of the flow limiting piece, and realize the detachable connection between the flow limiting piece and the cover body and / or the bottom shell.

[0011] In some embodiments, the flow guide mechanism further includes: a flow guide plate, which is detachably connected to the flow limiting member.

[0012] The guide plate can guide the coolant in the cooling chamber, that is, the guide plate limits the flow path of the coolant in the cooling chamber, so that the flow path can be flexibly adjusted. The guide plate and the flow limiting member are detachably connected, which can improve the flexibility of assembling the guide plate and the flow limiting member, thereby improving the flexibility of adjusting the flow path in the cooling chamber, and further improving the heat dissipation effect.

[0013] In some embodiments, a notch is provided on the side of the flow limiting portion, and one end of the guide plate is arranged in the notch so that the guide plate is connected to the flow limiting member in a detachable manner.

[0014] The flow limiting member and the guide plate are detachably connected through the notch on the side of the flow limiting portion, and no additional connection structure is required. The structure is simple and easy to implement.

[0015] In some embodiments, the notch extends through a side of the restriction.

[0016] The notch runs through the side of the limiting portion, so that the end of the guide plate can be embedded behind the notch, and the side close to the cover body can abut against the cover body, which can reduce the gap between the guide plate and the cover body, thereby improving the guide effect of the guide plate.

[0017] In some embodiments, a plurality of notches are provided on the side of the flow limiting portion, and different notches on the flow limiting portion can be connected to guide plates arranged at different positions of the flow limiting member.

[0018] A plurality of slots are arranged on the side of the flow limiting part, so that it can be connected with guide plates in different directions, and the same flow limiting part can be used to limit multiple flow channels; and after the flow limiting part is connected to the cover body, the flow channel can be adjusted only by adjusting the connection between the guide plate and different slots on the flow limiting part, which can improve the efficiency and flexibility of the flow channel adjustment.

[0019] In some embodiments, the connecting portion and the limiting portion of the flow limiting member are arranged along a first direction, a limiting hole is provided on the side of the cover body close to the cooling bin, and the connecting portion is provided in the limiting hole; wherein the first direction is the same as the stacking direction of the cover body and the bottom shell; the size of the flow limiting portion along the second direction is larger than the size of the connecting portion along the second direction, and the end face of the flow limiting portion close to the cover body abuts against the end face of the limiting hole; wherein the second direction is perpendicular to the first direction.

[0020] The end surface of the flow limiting part close to the cover body abuts against the end surface of the limiting hole, which can reduce the gap between the end surface of the flow limiting part and the cover body and improve the flow limiting effect of the flow limiting part.

[0021] In some embodiments, the notch of the flow restriction portion extends along a first direction, and the notch penetrates a side surface of the flow restriction portion along the first direction.

[0022] The notch extends along the stacking direction of the cover body and the bottom shell, and because the end of the guide plate extends along the stacking direction, the guide plate can be detachably connected to the flow limiting portion. The notch penetrates the side of the flow limiting portion along the first direction, so that the end of the guide plate can be embedded behind the notch, and the side close to the cover body can abut against the cover body, which can reduce the gap between the guide plate and the cover body, thereby improving the flow guiding effect of the guide plate.

[0023] In some embodiments, the cover is provided with an inlet and an outlet communicating with the cooling chamber.

[0024] The inlet and outlet of the cooling chamber are arranged on the cover body, so that the inlet and outlet are away from the heat absorbing side of the bottom shell, that is, the side of the bottom shell facing away from the cover body, thereby reducing the erosion of the cooling liquid on the heat-generating components arranged on the heat absorbing side.

[0025] In some embodiments, a side of the air guide mechanism facing away from the cover body abuts against the bottom wall of the cooling bin.

[0026] The side of the flow guiding mechanism facing away from the cover body abuts against the side of the bottom plate of the bottom shell close to the cooling bin, that is, the bottom wall of the cooling bin, which can reduce the gap between the flow guiding mechanism and the bottom shell, thereby improving the flow guiding effect of the flow guiding mechanism.

[0027] In some embodiments, the cooling mechanism further includes: a heat dissipation layer, which is arranged on a side of the cover body away from the cooling chamber, wherein a side of the bottom shell away from the cover body is configured to be provided with a heat generating component.

[0028] The coolant in the cooling bin absorbs heat from the heat-generating components arranged on the side of the bottom shell facing away from the cover body, and takes away the heat through the circulation of the coolant, thereby achieving the effect of cooling the heat-generating components; at the same time, the coolant and / or the shell of the cooling mechanism can also transfer the heat to the heat dissipation layer arranged on the side of the cover body facing away from the cooling bin, so as to dissipate the heat through the heat dissipation layer, thereby improving the heat dissipation effect of the cooling mechanism through the heat dissipation layer.

[0029] To solve the above technical problems, the present application proposes an electrical component. The electrical component comprises: any one of the above cooling mechanisms; a heat generating component, which is arranged on a side of the bottom shell away from the cooling chamber; and the cooling mechanism is configured to cool the heat generating component. For this reason, the heat dissipation control of the heat generating component and the heat dissipation effect can be improved, thereby improving the reliability of the electrical component.

[0030] In some embodiments, the heat generating component is a circuit board or a battery, so as to improve the heat dissipation control of the circuit board or the battery and enhance the heat dissipation effect, thereby improving the reliability of the electrical components.

[0031] In order to solve the above technical problems, the present application proposes a vehicle. The vehicle includes the above electrical components. To this end, the heat dissipation control of the heat-generating components and the heat dissipation effect can be improved, thereby improving the reliability of the electrical components and further improving the reliability of the vehicle.

[0032] In some embodiments, the vehicle further comprises a battery and a thermal management system, wherein the thermal management system is used to perform heat exchange with the battery, and the cooling mechanism is in fluid communication with the thermal management system. To this end, the cooling mechanism can transfer heat absorbed from the heat generating component to the battery through the thermal management system to improve the performance of the battery.

[0033] Different from the prior art: the cooling chamber of the cooling mechanism of the present application is provided with a flow guide mechanism, which can be used to adjust the flow path and / or flow rate of the fluid in the cooling chamber, so that the flow path and / or flow rate of the fluid in the cooling chamber can be adjusted according to the heat dissipation requirements of the heat-generating components, thereby improving the heat dissipation effect of the cooling mechanism on the heat-generating components; further, the flow guide mechanism is detachably connected to the side of the cover body close to the cooling chamber, which can improve the convenience of adjusting the flow path and / or flow rate of the fluid in the cooling chamber. Therefore, the present application can achieve flexible adjustment of the flow path and / or flow rate, thereby improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0035] Figure 1 is a structural schematic diagram of an embodiment of the vehicle of the present application;

[0036] Figure 2 is a schematic diagram of the structure of an embodiment of the electrical component of the present application;

[0037] Figure 3 It is a structural schematic diagram of an embodiment of the cooling mechanism of the present application;

[0038] Figure 4 It is a structural schematic diagram of an embodiment of the cover body and the flow guide mechanism of the present application;

[0039] Figure 5 It is a structural schematic diagram of an embodiment of the current limiting element of the present application;

[0040] Figure 6 It is a structural schematic diagram of another embodiment of the cover body and the flow guide mechanism of the present application;

[0041] Figure 7 is a structural schematic diagram of another embodiment of the cooling mechanism of the present application;

[0042] Figure 8 It is a structural schematic diagram of another embodiment of the cover body and the flow guide mechanism of the present application.

[0043] Figure numerals: power load 1, power distribution system 2, controller 3, thermal management system 4, cooling mechanism 21, circuit board 22, bottom shell 211, cover 212, flow guide mechanism 213, flow limiting member 513, connecting part 610, flow limiting part 620, limiting hole 630, notch 640, flow guide plate 710, heat dissipation layer 810, inlet A, outlet B, first direction x, second direction y, heat generating component 80. DETAILED DESCRIPTION

[0044] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0046] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0047] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0048] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0049] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0050] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0051] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0052] With the advancement and popularization of science and technology, various electronic devices have long become an indispensable role in people's daily lives. The electronic components inside electronic devices will generate heat when they are in operation, and the high temperature working environment can easily cause damage to the electronic components. Therefore, the cooling mechanism is a very important and necessary component of electronic devices.

[0053] Taking vehicles as an example, Figure 1As shown, the vehicle includes: an electric load 1, a power distribution system 2 and a controller 3. The power distribution system 2 is connected to the electric load 1 and the controller 3 respectively. The power distribution system 2 distributes power to the electric load 1 under the control of the controller 3.

[0054] Specifically, the controller 3 refers to a circuit or integrated chip with logic processing functions that can generate corresponding control signals based on power demand and power status to control the operation of the power distribution system 2, etc.; the controller 3 can be an independent controller or integrated into the vehicle controller of the vehicle. The power distribution system 2 refers to a power grid that distributes electric energy to the power load 1 and can realize power distribution; the power distribution system 2 is also used to monitor and control the power distribution status and power consumption information.

[0055] The electrical load 1 may include multiple loads, such as a vehicle control domain controller, an electronic stability system, an electronic power steering system, an air-conditioning compressor, a PTC heater, an instrument, etc.

[0056] Furthermore, the vehicle also includes a thermal management system 4, which includes a cooling mechanism, a heating mechanism, a valve, etc., wherein the cooling mechanism, the heating mechanism, the valve, etc. are connected through pipelines, and different pipelines in the thermal management system 4 are connected through valves, and the pipelines are filled with coolant. The valve is used to switch the connection between different pipelines in the thermal management system 4 or adjust the opening size of the pipeline to achieve the flow of coolant in different pipelines, different directions or different flow rates, thereby achieving the switching of different thermal management modes.

[0057] The electrical components of the power distribution system 2 are also connected to a refrigeration mechanism through valves and pipelines, and the refrigeration mechanism is used to provide cooling liquid for the electrical components of the power distribution system 2.

[0058] The power distribution system 2 can be applied to electric vehicles / electric vehicles, pure electric vehicles, hybrid vehicles, extended-range electric vehicles, plug-in hybrid vehicles, electric buses, electric motorcycles, hydrogen energy vehicles and other new energy vehicles in the field of vehicle technology.

[0059] At present, the power distribution system of the vehicle is implemented with a large number of electronic devices. As the power level of the electronic devices increases, the heat generated becomes higher and higher, and the heat accumulation becomes more and more serious, which has an increasingly serious impact on the electronic devices in the power distribution system 2, resulting in reduced reliability of the power distribution system 2 and reduced safety of the vehicle.

[0060] In order to solve the above problems, the present application proposes an electrical component. The power distribution system 2 includes an electrical component, such as Figure 2 As shown, the electrical component includes: a cooling mechanism 21 and a circuit board 22, wherein the circuit board 22 is provided with a circuit, especially a power distribution circuit, and the cooling mechanism 21 and the circuit board 22 are stacked and arranged close to each other for cooling and dissipating the heat of the circuit board 22.

[0061] Among them, the distribution circuit is used to realize power management of the vehicle's electrical load 1, such as supplying power to or cutting off power to the electrical load 1; the circuit board 22 can be used as a carrier of the distribution circuit, which can realize the integrated setting of various components in the distribution circuit, and can also provide a distribution signal loop between various components in the distribution circuit, avoiding the use of wires to realize the electrical signal loop, and can improve the integration.

[0062] Optionally, the circuit board 22 may be a printed circuit board (PCB) or a flexible printed circuit (FPC), etc.

[0063] The stacking arrangement of the cooling mechanism 21 and the circuit board 22 means that the circuit board 22 is arranged with the cooling mechanism 21 along its thickness direction, so that each device in the distribution circuit arranged on the circuit board 22 (the surface extending in the width and length directions) can be arranged corresponding to the cooling mechanism 21, which can improve the uniformity and efficiency of heat dissipation.

[0064] The electrical components of this embodiment are provided with a cooling mechanism 21, which can dissipate the heat generated by the power distribution circuit, and the cooling mechanism 21 is stacked with the circuit board 22 on which the power distribution circuit is provided, so that the heating device or heating area of ​​the circuit board 22 can directly or indirectly contact the cooling mechanism 21, preferably directly contact the cooling mechanism 21, which can improve the cooling effect and cooling efficiency of the cooling mechanism 21. Therefore, this embodiment can improve the heat dissipation performance of the power distribution system 2, improve the problems such as abnormality of the power distribution circuit due to heat accumulation, and thus improve the reliability of the power distribution system 2 and the safety of the vehicle.

[0065] In some embodiments, Figure 3 and Figure 4 , Figure 3 is a schematic structural diagram of an embodiment of the cooling mechanism of the present application, Figure 4 2 is a schematic diagram of the structure of an embodiment of the cover and the flow guide mechanism of the present application. The cooling mechanism 21 of the present embodiment comprises: a bottom shell 211, a cover 212 and a flow guide mechanism, wherein the bottom shell 211 is provided with a cooling bin with an opening; the cover 212 is provided on the opening; the flow guide mechanism is provided in the cooling bin and is detachably connected to the cover 212 and / or the bottom shell 211, and the flow guide mechanism is configured to adjust the flow path and / or flow rate of the coolant in the cooling bin.

[0066] Specifically, the bottom shell 211 includes a bottom plate arranged opposite to the opening, and a side plate connected to the edge area of ​​the bottom plate and extending from the bottom plate toward the opening, the bottom plate and the side plate cooperate with each other to form a containing space, and the containing space serves as a cooling bin; the cooling bin refers to a containing space capable of containing a cooling liquid; the cover 212 refers to a component or assembly used to seal the cooling bin; the flow guide mechanism refers to a component or assembly capable of controlling the flow direction and / or flow rate of the fluid. Preferably, the bottom plate or side plate of the bottom shell 211 is in contact with the heat generating component to receive the heat generated by the heat generating component.

[0067] Specifically, the detachable connection between components means that the connection between the components can be established and released repeatedly, multiple times, and non-destructively without damaging the components and their performance.

[0068] Optionally, the coolant in this embodiment may be water or other fluids that can absorb heat, and is used to absorb the heat generated by the heat-generating components, thereby achieving heat dissipation of the heat-generating components by the cooling mechanism 21 .

[0069] The cooling chamber of the cooling mechanism 21 of this embodiment is provided with a flow guide mechanism, and the flow channel and / or flow rate of the coolant in the cooling chamber can be adjusted by the flow guide mechanism, so that the flow channel and / or flow rate of the coolant in the cooling chamber can be adjusted according to the heat dissipation requirements of the heat-generating components, thereby improving the heat dissipation effect of the cooling mechanism 21 on the heat-generating components; further, the flow guide mechanism is detachably connected to the cover body 212 and / or the bottom shell 211, which can improve the convenience of adjusting the flow channel and / or flow rate of the coolant in the cooling chamber. Therefore, this embodiment can realize flexible adjustment of the flow channel and / or flow rate, thereby improving heat dissipation control and enhancing the heat dissipation effect.

[0070] In some embodiments, at least one limiting hole 630 is provided on a side of the cover 212 close to the cooling chamber and / or on an inner wall of the bottom shell 211 , and at least a portion of the flow guide mechanism is connected to the limiting hole 630 .

[0071] The guide mechanism is installed through the limiting holes on the side of the cover 212 close to the cooling bin or on the inner wall of the bottom shell 211. The structure is simple and easy to implement, and can reduce the volume of the cooling mechanism 21 or increase the volume of the cold zone bin.

[0072] In some embodiments, the flow guiding mechanism includes: a flow limiting member 513 , the flow limiting member 513 includes a connecting portion 610 and a flow limiting portion 620 , and the flow limiting member 513 is disposed on a side of the cover 212 close to the cooling chamber.

[0073] Specifically, the flow restricting member 513 refers to a component or assembly that prevents the fluid from flowing in a certain direction.

[0074] In this embodiment, the flow guide mechanism is realized by the flow limiter 513. When the coolant flows through the flow limiter 513, turbulence is formed, and the flow rate of the coolant in the cooling chamber can be reduced by the flow limiter 513, so that the coolant can absorb the heat of the heat-generating components more fully and effectively, thereby improving the heat dissipation effect. And the connection part of the flow limiter 513 is connected through the limiting hole 630, which can not only improve the sealing of the cover body 212 and / or the bottom shell 211, but also reduce the height of the flow limiter 513, and realize the detachable connection between the flow limiter 513 and the cover body 212 and / or the bottom shell 211.

[0075] In one application scenario, according to the heat dissipation requirements of heat-generating components, such as a circuit board 22, a flow limiting member 513 can be set on the cover 212 at a position corresponding to the high heat generation area of ​​the circuit board 22, so that the flow limiting member 513 can reduce the speed of the coolant in the cooling chamber when it flows through the area corresponding to the high heat generation area of ​​the circuit board 22 and create turbulence, so that the coolant has more time to more fully absorb the heat generated by the high heat generation area, thereby improving the heat dissipation effect on the high heat generation area.

[0076] In some embodiments, Figure 6 As shown, Figure 6 It is a structural schematic diagram of another embodiment of the cover body and the guide mechanism of the present application. The guide mechanism of this embodiment also includes a guide plate 710, and the guide plate 710 is connected to the flow limiting member 513 in a detachable manner.

[0077] In this embodiment, the guide plate 710 can be used to divert or guide the coolant in the cooling chamber, that is, the guide plate 710 limits the flow path of the coolant in the cooling chamber, thereby realizing flexible adjustment of the flow path. The guide plate 710 is detachably connected to the flow limiting member 513, which can improve the flexibility of assembling the guide plate 710 and the flow limiting member 513, thereby improving the flexibility of adjusting the flow path in the cooling chamber, and further improving the heat dissipation effect.

[0078] In some embodiments, the guide plate 710 is disposed on a side of the cover body 212 close to the cooling bin and connected to the cover body 212 , and is preferably disposed perpendicular to the cover body 212 .

[0079] Specifically, the guide plate 710 is capable of diverting or restricting the fluid and directing part of the fluid to a certain area. The guide plate 710 is arranged perpendicularly to the cover 212, which means that the width direction of the guide plate 710 is arranged perpendicularly to the cover 212, so as to extend into the cooling chamber; the length direction of the guide plate 710 is arranged parallel to the cover 212, so as to abut against the cover 212 and reduce the gap between the two.

[0080] The guide plate 710 is connected to the cover body 212 via the flow limiting member 513 , and no additional connection structure for connecting the guide plate 710 is provided on the cover body 212 , thereby simplifying the cooling mechanism.

[0081] In some embodiments, the flow guide mechanism may include multiple flow guide plates 710 and / or multiple flow limiting members 513. The same flow limiting member 513 may connect two adjacent flow guide plates 710. The two ends of the same flow guide plate 710 may also be connected to the cover body 212 through two flow limiting members 513 respectively.

[0082] In an application scenario, this embodiment can be provided with four flow limiting members 513 and four flow guide plates 710 on the cover 212 according to the heat dissipation requirements of the circuit board 22. The four flow limiting members 513 and the four flow guide plates 710 are cross-connected in sequence, which can improve the stability of the flow guiding mechanism and reduce the number of the flow limiting members 513 and the flow guide plates 710. This flow guiding mechanism can guide the coolant coming from the inlet A to the high heat dissipation area of ​​the circuit board 22 to improve the heat dissipation effect of the circuit board 22.

[0083] In some embodiments, Figure 5 As shown, a notch 640 is provided on the side of the flow limiting portion 620 , and one end of the guide plate 710 is disposed in the notch 640 so that the guide plate 710 is connected to the flow limiting member 513 in a detachable manner.

[0084] The flow limiting member 513 and the guide plate 710 are detachably connected through the notch 640 on the side of the flow limiting portion 520, without the need for additional connection structure, and the structure is simple and easy to implement.

[0085] In some embodiments, the notch 640 penetrates through a side surface of the restrictor 620 .

[0086] The slot 640 passes through the side of the limiting portion 620 , so that the end of the guide plate 710 can be embedded behind the slot 640 , and the side close to the cover body 212 can abut against the cover body 212 , thereby reducing the gap between the guide plate 710 and the cover body 212 , thereby improving the guide effect of the guide plate 710 .

[0087] In some embodiments, the side of the guide plate 710 facing away from the cover body 212 is also in contact with the bottom shell 211 , which can reduce the gap between the guide plate 710 and the bottom shell 211 , thereby improving the guide effect of the guide plate 710 .

[0088] In some embodiments, a plurality of notches 640 are disposed on the side of the flow limiting portion 620 , and different notches 640 on the flow limiting portion 620 can be connected to guide plates 710 disposed at different positions of the flow limiting member 513 .

[0089] A plurality of slots 640 are provided on the side of the flow limiting portion 620, so that it can be connected to the guide plates 710 in different directions, and the same flow limiting member 513 can be used to limit a plurality of flow channels; and after the flow limiting member 513 is connected to the cover body 212, the flow channel can be adjusted by only adjusting the connection between the guide plates 710 and different slots 640 on the flow limiting member 513, thereby improving the efficiency and flexibility of the flow channel adjustment.

[0090] In some embodiments, the cover body 212 is provided with a plurality of limiting holes 630 arranged in an array, and the side of the limiting portion 620 is provided with eight equally spaced slots 640, so that the limiting member 513 can be connected to the guide plate 710 with other limiting members 513 located at eight positions on its periphery, thereby realizing a guide structure in eight positions.

[0091] In some embodiments, the connecting portion 610 and the limiting portion 620 of the flow limiting member 513 are arranged along a first direction x, and a limiting hole 630, especially a plurality of limiting holes 630, is provided on a side of the cover body 212 close to the cooling bin, and the connecting portion 610 is arranged in the limiting hole 630; wherein, the first direction x is the same as the stacking direction of the cover body 212 and the bottom shell 211; the size of the limiting portion 610 along the second direction y is greater than the size of the connecting portion 610 along the second direction y, and after the connecting portion 610 is inserted into the limiting hole 630, the end face of the limiting portion 620 close to the cover body 212 abuts against the end face of the limiting hole 630; wherein, the second direction y is perpendicular to the first direction x.

[0092] Specifically, the stacking direction of the cover body 212 and the bottom shell 211 refers to the direction of the line connecting the two, which can also be called the thickness direction of the cover body 212 .

[0093] The end surface of the flow limiting portion 620 close to the cover body 212 abuts against the end surface of the limiting hole 630 , which can reduce the gap between the end surface of the flow limiting portion 620 and the cover body 212 and improve the flow limiting effect of the flow limiting portion 620 .

[0094] In some embodiments, the notch 640 of the restrictor 610 extends along the first direction x, and the notch 640 penetrates the side surface of the restrictor 610 along the first direction x.

[0095] The notch 640 extends along the stacking direction of the cover 212 and the bottom shell 211, and the first direction x. Since the end of the guide plate 710 extends along the stacking direction, the guide plate 710 can be detachably connected to the flow limiting portion 620. The notch 640 penetrates the side of the flow limiting portion 610 along the first direction x, so that the end of the guide plate 710 is embedded behind the notch 640, and the side close to the cover 212 can abut against the cover 212, which can reduce the gap between the guide plate 710 and the cover 212, thereby improving the flow guiding effect of the guide plate 710.

[0096] In some embodiments, the cover 212 is provided with an inlet A and an outlet B which are connected to the cooling chamber.

[0097] In this embodiment, the inlet A and outlet B of the cooling chamber are arranged on the cover body 212, so that the inlet A and outlet B can be kept away from the heat absorbing side of the bottom shell 211, that is, the bottom shell 211 is away from the cover body 212, thereby reducing the erosion of the cooling liquid on the heat-generating components arranged on the heat absorbing side.

[0098] In other embodiments, an inlet and an outlet may be provided on the side panel of the bottom shell.

[0099] In some embodiments, the side of the air guide mechanism facing away from the cover 212 abuts against the bottom wall of the cooling chamber.

[0100] The side of the guide mechanism facing away from the cover body 212 abuts against the side of the bottom plate of the bottom shell 211 close to the cooling bin, that is, the bottom wall of the cooling bin, which can reduce the gap between the guide mechanism and the bottom shell 211, thereby improving the guide effect of the guide mechanism.

[0101] In some embodiments, Figure 7 As shown, Figure 7 It is a structural schematic diagram of another embodiment of the cooling mechanism of the present application. The cooling mechanism 21 of this embodiment also includes a heat dissipation layer 810, which is arranged on the side of the cover body 212 away from the cooling chamber, wherein the side of the bottom shell 211 away from the cover body 212 is configured to be close to the heat-generating component 80.

[0102] The coolant in the cooling chamber absorbs heat from the heat-generating component 80 disposed on the side of the bottom shell 211 away from the cover body 212, and takes away the heat through the circulation of the coolant, thereby achieving the effect of cooling the heat-generating component 80; at the same time, the coolant and / or the shell of the cooling mechanism can also transfer the heat to the heat dissipation layer 810 disposed on the side of the cover body 212 away from the cooling chamber, so as to dissipate the heat through the heat dissipation layer 810. Therefore, this embodiment can improve the heat dissipation effect of the cooling mechanism 21 through the heat dissipation layer 810.

[0103] Optionally, the heat dissipation layer 810 includes a heat dissipation film layer, heat dissipation fins or a heat sink.

[0104] In some embodiments, Figure 3 and Figure 8 As shown, Figure 8 It is a structural schematic diagram of another embodiment of the cover and guide structure of the present application. The cooling mechanism 21 of this embodiment includes: a bottom shell 211, a cover 212 and a guide mechanism 213, wherein the bottom shell 211 is provided with a cooling bin with an opening; the cover 212 is provided on the opening; the guide mechanism 213 is provided in the cooling bin and is detachably connected to a side of the cover 212 close to the cooling bin, and the guide mechanism 213 is configured to adjust the flow path and / or flow rate of the coolant in the cooling bin.

[0105] The cooling chamber of the cooling mechanism 21 of this embodiment is provided with a flow guide mechanism 213, and the flow channel and / or flow rate of the coolant in the cooling chamber can be adjusted by the flow guide mechanism 213, so that the flow channel and / or flow rate of the coolant in the cooling chamber can be adjusted according to the heat dissipation requirements of the heat-generating components, thereby improving the heat dissipation effect of the cooling mechanism 21 on the heat-generating components; further, the flow guide mechanism 213 is detachably connected to the side of the cover body 212 close to the cooling chamber, which can improve the convenience of adjusting the flow channel and / or flow rate of the coolant in the cooling chamber. Therefore, this embodiment can realize flexible adjustment of the flow channel and / or flow rate, thereby improving heat dissipation control and enhancing the heat dissipation effect.

[0106] The bottom plate or the side plate of the bottom shell 211 is in contact with the heat-generating component to receive the heat generated by the heat-generating component.

[0107] In other embodiments, the side of the cover 212 facing away from the bottom shell 211 may also be in contact with the heat-generating component.

[0108] Optionally, the flow guide mechanism 213 of this embodiment includes: a flow limiting member 513 and a flow guide plate 710, the flow limiting member 513 is arranged on the side of the cover body 212 close to the cooling bin; the flow guide plate 710 is arranged on the side of the cover body 212 close to the cooling bin and is arranged vertically to the cover body 212, and both ends of the flow guide plate 710 are connected to the flow limiting member 513.

[0109] When the coolant flows through the flow limiting member 513, turbulence will be formed, and the flow limiting member 513 can reduce the flow rate of the coolant in the cooling chamber, so that the coolant can more fully and effectively absorb the heat of the heat-generating components and improve the heat dissipation effect. The coolant in the cooling chamber can be guided by the guide plate 710, that is, the flow channel of the coolant in the cooling chamber is limited by the guide plate 710, so that the flow channel can be flexibly adjusted. The guide plate 710 is connected to the cover body 212 through the flow limiting member 513, and an additional connection structure for connecting the guide plate 710 can be omitted on the cover body 212, thereby simplifying the construction of the flow channel, and further simplifying the construction of the cooling mechanism.

[0110] The flow guide mechanism 213 may include a plurality of flow guide plates 710 and a plurality of flow limiters 513. The same flow limiter 513 may connect two adjacent flow guide plates 710. The two ends of the same flow guide plate 710 may also be connected to the cover 212 through two flow limiters 513. The required flow channel design is constructed by arranging and constructing the positions of the plurality of flow limiters 513 and the connection relationship between the flow guide plates 710 and the flow limiters 513.

[0111] Optionally, the guide plate 710 and the flow limiting member 513 are detachably connected, which can improve the flexibility of assembling the guide plate 710 and the flow limiting member 513, thereby improving the flexibility of adjusting the flow channel in the cooling chamber, and further improving the heat dissipation effect.

[0112] Optionally, the present embodiment further includes other independently arranged flow limiting members 513 , which can be independently arranged corresponding to the high heat dissipation areas of the circuit board to form turbulence in the high heat dissipation areas and improve the heat dissipation effect.

[0113] In other embodiments, the flow restricting member and the guide plate may be independently or combinedly arranged, or the two may be combined again.

[0114] Optionally, Figure 5 As shown, the flow limiting member 513 includes a connecting portion 610 and a flow limiting portion 620 arranged along a first direction x, and a limiting hole 630 is provided on the side of the cover body 212 close to the cooling bin. The limiting hole 630 is a blind hole and does not penetrate the cover body 212, and the connecting portion 610 is arranged in the limiting hole 630; wherein, the first direction x is the same as the stacking direction of the cover body 212 and the bottom shell 211.

[0115] In this embodiment, the connection portion 610 of the flow limiting member 513 is connected by a limiting hole 630 arranged on the side of the cover body 212 close to the cooling bin, which can not only improve the sealing of the cover body 212, but also reduce the height of the flow limiting member 513 and realize the detachable connection between the flow limiting member 513 and the cover body 212.

[0116] Optionally, the dimension of the limiting portion 620 along the second direction y is greater than the dimension of the connecting portion 610 along the second direction y, and the end surface of the limiting portion 620 close to the cover body 212 abuts against the end surface of the limiting hole 630; wherein the second direction y is perpendicular to the first direction x.

[0117] The end surface of the flow limiting portion 620 close to the cover body 212 abuts against the end surface of the limiting hole 630 , which can reduce the gap between the end surface of the flow limiting portion 620 and the cover body 212 and improve the flow limiting effect of the flow limiting portion 620 .

[0118] Optionally, a notch 640 is provided on a side surface of the flow limiting portion 620 , the notch 640 extends along the first direction, and one end of the guide plate 710 is embedded in the notch 640 .

[0119] The notch 640 extends along the stacking direction of the cover body 212 and the bottom shell 211 . Since the end of the guide plate 710 extends along the stacking direction, the guide plate 710 and the flow limiting portion 620 can be detachably connected.

[0120] Optionally, the slot 640 passes through the side of the limiting portion 620 along the first direction, so that the end of the guide plate 710 can be embedded behind the slot 640, and the side close to the cover body 212 can abut against the cover body 212, thereby reducing the gap between the guide plate 710 and the cover body 212, thereby improving the guide effect of the guide plate 710.

[0121] Furthermore, the side of the guide plate 710 and the flow limiting portion 620 facing away from the cover body 212 is also in contact with the bottom shell 211, which can reduce the gap between the guide plate 710 and the flow limiting portion 620 and the bottom shell 211, thereby improving the guide effect of the guide plate 710.

[0122] A plurality of notches 640 are disposed on the side of the flow limiting portion 620 , and different notches 640 on the flow limiting portion 620 can be connected to guide plates 710 disposed at different positions of the flow limiting member 513 .

[0123] A plurality of slots 640 extending along the first direction are arranged on the side of the flow limiting portion 620, so as to be connected to the guide plates 710 in different directions, and to enable the same flow limiting member 513 to limit a plurality of flow channels; and after the flow limiting member 513 is connected to the cover body 212, the flow channel can be adjusted by only adjusting the connection between the guide plates 710 and different slots 640 on the flow limiting member 513, so as to improve the efficiency and flexibility of the flow channel adjustment.

[0124] Specifically, the cover body 212 of this embodiment is provided with a plurality of limiting holes 630 arranged in an array, such as a nine-square grid, and the side of the flow limiting portion 620 is provided with eight equally spaced slots 640, so that the flow limiting member 513 can be connected to the guide plate 710 with other flow limiting members 513 located at eight positions on its periphery, thereby realizing a flow guiding structure in eight positions.

[0125] Optionally, the cover 212 is provided with an inlet A and an outlet B connected to the cooling chamber, so that the inlet A and the outlet B are away from the heat absorbing side of the bottom shell 211, that is, the bottom shell 211 is away from the side of the cover 212, thereby reducing the erosion of the coolant on the heat-generating components arranged on the heat absorbing side.

[0126] In other embodiments, an inlet and an outlet may be provided on the side panel of the bottom shell.

[0127] Optionally, the cooling mechanism 21 of this embodiment may further include a heat dissipation layer, which is disposed on a side of the cover 212 away from the cooling chamber, wherein a side of the bottom shell 211 away from the cover 212 is configured to be provided with a heat generating component.

[0128] The cooling liquid in the cooling bin absorbs heat from the heat-generating components arranged on the side of the bottom shell 211 away from the cover body 212, and takes away the heat through the circulation of the cooling liquid, thereby achieving the effect of cooling the heat-generating components; at the same time, the cooling liquid and / or the shell of the cooling mechanism can also transfer the heat to the heat dissipation layer arranged on the side of the cover body 212 away from the cooling bin, so as to dissipate the heat through the heat dissipation layer. Therefore, this embodiment can improve the heat dissipation effect of the cooling mechanism 21 through the heat dissipation layer.

[0129] The shape of the flow limiting component of the present application is not limited to a columnar shape.

[0130] In one application scenario, the cooling mechanism 21 of the present application can be used as a heat dissipation verification device for heat-generating components such as circuit boards. The flow channel and / or flow rate of the coolant of the cooling mechanism 21 can be quickly adjusted based on the heat dissipation requirements of the circuit board, thereby improving the efficiency of the heat dissipation verification of the circuit board. A cooling mechanism with high heat dissipation effect can be designed and produced for the circuit board based on the verification results and the corresponding flow channel and / or flow rate.

[0131] In another application scenario, the cooling mechanism of the present application can be used as an actual liquid cooling device for heat-generating components such as circuit boards, and can be directly installed and used with the circuit boards.

[0132] The present application can quickly adjust the flow channel structure and / or flow rate of the coolant through a flow guiding mechanism, and can solve the problems of the existing circuit board cooling mechanism having a single water channel structure, being difficult to adjust, and being unable to efficiently dissipate heat, as well as the problems of a long adjustment cycle and high cost of the water channel structure. The cooling mechanism can be constructed simply, efficiently, and quickly to adapt to a variety of different heat-generating components, such as circuit boards; and the present application can also shorten the heat dissipation verification cycle of the circuit board.

[0133] The present application further proposes an electrical component, such as Figure 2 As shown, the electrical component includes: a cooling mechanism 21 and a circuit board 22 , wherein the circuit board 22 is provided with a circuit, especially a power distribution circuit, and the cooling mechanism 21 and the circuit board 22 are stacked to dissipate heat from the circuit board 22 .

[0134] The power distribution system 2 of this embodiment includes an electrical component, and a cooling mechanism 21 is provided in the electrical component. The heat generated by the power distribution circuit can be dissipated through the cooling mechanism 21, and the cooling mechanism 21 is stacked with a circuit board 22 on which the power distribution circuit is provided, which can improve the heat dissipation efficiency of the cooling mechanism 21. Therefore, this embodiment can improve the heat dissipation performance of the power distribution system 2, improve the problems such as abnormality of the power distribution circuit caused by heat accumulation, and thus improve the reliability of the power distribution system 2 and the safety of the vehicle.

[0135] Although in the above embodiments, the limiting hole is arranged inside the cover body, and the flow limiting member is connected to the limiting hole inside the cover body so that the flow guiding mechanism is connected to the inside of the cover body, the present application is not limited thereto, and the limiting hole may also be arranged on the inside of the bottom shell, for example, on the inner side surface or side surface of the bottom shell opposite to the cover body. The limiting hole is not limited to being arranged on only one surface, and may also be arranged on at least two surfaces.

[0136] For other introductions to the power distribution system, please refer to the above embodiments.

[0137] In other embodiments, the heat generating component may also be a battery to improve the heat dissipation control of the battery and enhance the heat dissipation effect, thereby improving the reliability of the electrical components.

[0138] Alternatively, the heat generating components may also include other components that generate heat, such as electric motors, gearboxes, chargers, controllers, battery management systems, air conditioning systems, heating systems, and cooling systems.

[0139] The cooling mechanism of the present application can be used not only in power distribution systems, but also in other circuit systems.

[0140] The present application further provides a vehicle, such as Figure 1 As shown, the vehicle includes: an electric load 1, a power distribution system 2 and a controller 3. The power distribution system 2 is connected to the electric load 1 and the controller 3 respectively. The power distribution system 2 distributes power to the electric load 1 under the control of the controller 3.

[0141] Furthermore, the vehicle also includes a thermal management system 4, which includes a cooling mechanism, a heating mechanism, a valve, and the like.

[0142] The electrical components are also connected to a refrigeration mechanism through valves and pipelines, and the refrigeration mechanism is used to provide cooling liquid for the electrical components.

[0143] In some embodiments, the vehicle further includes a battery, the thermal management system 4 is used to perform heat exchange with the battery, and the cooling mechanism is in fluid communication with the thermal management system. To this end, the cooling mechanism can transfer the heat absorbed from the heat generating component to the battery through the thermal management system 4 to heat the battery, thereby at least improving the performance of the battery in a low temperature environment.

[0144] For other introductions of the vehicle, please refer to the above embodiments.

[0145] The power distribution system of the present application can be used not only in vehicles but also in other electronic devices.

[0146] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A cooling mechanism, characterized in that: include: A bottom shell is provided with a cooling chamber having an opening; A cover body, which is arranged on the opening; The flow guiding mechanism is arranged in the cooling bin and is detachably connected to the cover body and / or the bottom shell. The flow guiding mechanism is configured to adjust the flow path and / or flow rate of the coolant in the cooling bin.

2. The cooling mechanism according to claim 1, characterized in that: At least one limiting hole is provided on the side wall of the cover body close to the cooling bin and / or on the inner side wall of the bottom shell, and at least a part of the flow guiding mechanism is connected to the limiting hole.

3. The cooling mechanism according to claim 2, characterized in that: The flow guiding mechanism comprises: The flow limiting component comprises a connecting portion and a flow limiting portion, wherein the connecting portion is arranged in the limiting hole.

4. The cooling mechanism according to claim 3, characterized in that: The flow guiding mechanism further comprises: A guide plate is connected to the flow limiting member in a detachable manner.

5. The cooling mechanism according to claim 4, characterized in that: A notch is provided on the side of the flow limiting portion, and one end of the guide plate is arranged in the notch so that the guide plate is connected to the flow limiting member in a detachable manner.

6. The cooling mechanism according to claim 5, characterized in that: The notch penetrates through a side surface of the restrictor.

7. The cooling mechanism according to claim 5 or 6, characterized in that: A plurality of the notches are provided on the side of the flow limiting portion, and different notches on the flow limiting portion can be connected to the guide plates arranged at different positions of the flow limiting member.

8. The cooling mechanism according to any one of claims 3 to 7, characterized in that: The connection part and the flow limiting part of the flow limiting member are arranged along the first direction, the cover body is provided with a limiting hole on a side close to the cooling bin, and the connection part is provided in the limiting hole; wherein the first direction is the same as the stacking direction of the cover body and the bottom shell; the size of the flow limiting part along the second direction is larger than the size of the connection part along the second direction, and the end face of the flow limiting part close to the cover body abuts against the end face of the limiting hole; The second direction is perpendicular to the first direction.

9. The cooling mechanism according to claim 8, characterized in that: The notch of the flow restricting portion extends along the first direction, and the notch penetrates through a side surface of the flow restricting portion along the first direction.

10. The cooling mechanism according to any one of claims 1 to 9, characterized in that: The cover body is provided with an inlet and an outlet communicated with the cooling chamber.

11. The cooling mechanism according to any one of claims 1 to 9, characterized in that: The side of the air guide mechanism facing away from the cover body abuts against the bottom wall of the cooling bin.

12. The cooling mechanism according to any one of claims 1 to 9, characterized in that: The cooling mechanism also includes: The heat dissipation layer is arranged on a side of the cover body away from the cooling chamber, wherein a side of the bottom shell away from the cover body is configured as a heat generating component.

13. An electrical component, characterized in that: include: A cooling mechanism according to any one of claims 1 to 12; A heat generating component is arranged on a side of the bottom shell away from the cooling chamber; The cooling mechanism is configured to cool the heat generating component.

14. The electrical component according to claim 13, characterized in that The heat generating component is a circuit board or a battery.

15. A vehicle, characterized in that: Comprising an electrical assembly as claimed in claim 13 or 14.

16. The vehicle according to claim 15, characterized in that The vehicle further includes a battery and a thermal management system, wherein the thermal management system is configured to perform heat exchange with the battery, and the cooling mechanism is in fluid communication with the thermal management system.

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