An infrared detection device for wafer thickness detection

Abstract

The present invention relates to the technical field of wafer thickness detection, and discloses an infrared detection device for wafer thickness detection, comprising a workbench, a support frame fixedly connected to the top of the workbench, a feeding device arranged on the top of the support frame, a detection bracket fixedly connected to one side of the support frame, a detection device fixedly connected to the top of the detection bracket, and a dust removal device fixedly connected to the side of the support frame away from the detection bracket; the feeding device comprises a feeding frame, a rotating shaft passing through and fixedly connected to the center of the feeding frame, a driving motor fixedly connected to one end of the rotating shaft, a mounting seat fixedly connected to the side of the feeding frame, a feeding slot provided on the side of the mounting seat, and a vacuum suction cup fixedly connected to the bottom of the inner wall of the feeding slot. The infrared detection device for wafer thickness detection is convenient for feeding operation, and at the same time, there is no need to delay the detection time when the wafer is taken out and installed, and the detection efficiency is high.

Description

Technical Field

[0001] The invention relates to the technical field of wafer thickness detection, in particular to an infrared detection device for wafer thickness detection. Background Art

[0002] With the rapid development of semiconductor technology, wafers, as the basic materials for semiconductor manufacturing, have higher and higher quality and precision requirements. The thickness of the wafer is one of the important parameters to measure its quality. Accurately detecting the thickness of the wafer is crucial to the control of the semiconductor manufacturing process and the assurance of product quality. The traditional wafer thickness detection methods mainly include mechanical contact measurement and optical measurement. Although mechanical contact measurement has high accuracy, it is easy to damage the wafer surface, and the measurement speed is slow, which is not suitable for large-scale production. Among the optical measurement methods, infrared detection technology has gradually become the main means of wafer thickness detection due to its advantages of non-contact, fast and high precision. Infrared detection equipment uses the characteristics of infrared light to measure the thickness of the wafer. When infrared light is irradiated on the wafer, it will be reflected on the upper and lower surfaces of the wafer. By detecting the interference fringes or intensity changes of the reflected light, the thickness of the wafer can be calculated. However, the existing infrared detection equipment still has some defects in practical applications.

[0003] The infrared detection equipment currently used is not very convenient for feeding, resulting in low equipment efficiency, and the low air quality during the detection process can easily affect the detection accuracy. Summary of the invention

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: an infrared detection device for wafer thickness detection, comprising a workbench, a support frame is fixedly connected to the top of the workbench, a feeding device is arranged on the top of the support frame, a detection bracket is fixedly connected to one side of the support frame, a detection device is fixedly connected to the top of the detection bracket, and a dust removal device is fixedly connected to the side of the support frame away from the detection bracket;

[0005] The feeding device includes a feeding rack, a rotating shaft passes through and is fixedly connected to the center position of the feeding rack, one end of the rotating shaft is fixedly connected to a driving motor, a mounting seat is fixedly connected to the side of the feeding rack, a feeding groove is opened on the side of the mounting seat, a vacuum suction cup is fixedly connected to the bottom of the inner wall of the feeding groove, one side of the vacuum suction cup is connected to an exhaust pipe, the end of the exhaust pipe away from the vacuum suction cup is connected to an annular pipe, and one side of the annular pipe is connected to an exhaust port of an exhaust pump, so that the feeding operation is convenient, and there is no need to delay the detection time when the wafer is taken out and installed, and the detection efficiency is high.

[0006] Preferably, the driving motor is fixedly connected to a side surface of the support frame, and one end of the rotating shaft away from the driving motor is rotatably connected to the support frame.

[0007] Preferably, the mounting seats are provided in multiple groups and are evenly distributed on the feeding rack, the vacuum pump is fixedly connected to the feeding rack, and an electronic three-way valve is provided on the vacuum pipe.

[0008] Preferably, the dust removal device includes a dust removal fan, the air inlet of the dust removal fan is connected to the filtering device through a connecting pipe, the side of the filtering device away from the dust removal fan is connected to the air inlet pipe, the end of the air inlet pipe away from the filtering device is connected to the air inlet nozzle, the air outlet of the dust removal fan is connected to the air outlet pipe, and the end of the air outlet pipe away from the dust removal fan is connected to the air outlet nozzle, which can prevent impurities in the ambient air from having a significant impact on the detection results of the wafer thickness and make the detection results more accurate.

[0009] Preferably, the dust removal fan and the filter device are both fixedly connected to the side of the support frame via a connecting frame, and the air inlet pipe and the air outlet pipe are both configured as arc-shaped pipes.

[0010] Preferably, the air inlet nozzle and the air outlet nozzle are both funnel-shaped, and the air inlet nozzle and the air outlet nozzle are symmetrically arranged on both sides of the feeding device, and the air inlet nozzle and the air outlet nozzle are relatively arranged between the feeding device and the detection device.

[0011] Preferably, the filtering device includes a filter cartridge, the inner wall of the filter cartridge is fixedly connected to an annular slide, the inner wall of the annular slide is slidably connected to a rotating circle, the inner wall of the rotating circle is fixedly connected to a triangular filter screen, the triangular filter screens are provided in multiple groups and are evenly distributed on the inner wall of the rotating circle, the end of the triangular filter screen away from the rotating circle is fixedly connected to a vibrator, a connecting plate is fixedly connected between adjacent triangular filter screens, an electrostatic adsorption column is fixedly connected to the side of the connecting plate, and the bottom of the filter cartridge located on both sides of the annular slide is connected to a collection box, which is convenient for avoiding dust accumulation on the triangular filter screen and causing the mesh to become clogged, so that the triangular filter screen can always maintain a good filtering effect and ventilation effect, and when the device is not in use, the fallen dust can slide off the triangular filter screen and the connecting plate and fall into the collection box, without the need for manual disassembly and cleaning, and is relatively convenient to use.

[0012] Preferably, one side of the filter cartridge is connected to the air inlet of the dust removal fan through a connecting pipe, the side of the filter cartridge away from the dust removal fan is connected to the air inlet pipe, and the filter cartridge is fixedly connected to the side of the support frame through a connecting frame.

[0013] Preferably, the side surface of the rotating circle extends to the inside of the annular slideway and is fixedly connected to the electronic slider inside the annular slideway, and the two ends of the connecting plate are respectively fixedly connected to the inner wall of the rotating circle and the side surface of the vibrator.

[0014] The present invention provides an infrared detection device for wafer thickness detection. It has the following beneficial effects:

[0015] 1. The infrared detection equipment for wafer thickness detection, when in use, places the wafer into the feeding trough, drives the vacuum suction cup to adsorb the wafer inside the feeding trough through the vacuum pump, and then drives the feeding rack to rotate through the driving motor, and the feeding rack drives the mounting seat to rotate, and the mounting seat can drive the wafer inside the feeding trough to move to the bottom of the detection device, which is convenient for complete automatic feeding, and when receiving the material, the mounting seat can be driven to rotate downward by the feeding rack, and then the vacuum suction cup is controlled by the electric three-way valve on the vacuum pipe to release the wafer, and the wafer inside the feeding trough can fall out of the feeding trough. When feeding, the wafer can be directly driven to move to the specified position by the feeding rack, and the feeding operation is convenient. At the same time, when receiving the material, the wafer can be released by the vacuum suction cup to complete the receiving, and the receiving is also convenient. The rotating cycle structure allows the wafer to be tested to be loaded into other feeding troughs during the thickness detection process, thereby realizing the rotating cycle detection, so that the wafer does not need to delay the detection time when it is taken out and installed, and the detection efficiency is high.

[0016] 2. The infrared detection equipment for wafer thickness detection is provided with a dust removal device. When in use, the air between the detection device and the feeding device is drawn into the air inlet nozzle, and enters the air inlet pipe through the air inlet nozzle. The air inside the air inlet pipe is filtered by the filter device, and then enters the dust removal fan, and is discharged from the dust removal fan to the air outlet pipe. The air in the air outlet pipe is discharged again between the detection device and the feeding device through the air outlet nozzle, so that when the detection device detects the wafer below, the air between the two is cleaner, which can avoid the impurities in the ambient air from having a greater impact on the detection result of the wafer thickness, and can make the detection result more accurate.

[0017] 3. The infrared detection equipment for wafer thickness detection is provided with a filtering device. When air enters the filtering device, it first enters the filter cartridge, is filtered by the triangular filter inside the filter cartridge, and is discharged from the other side of the filter cartridge. When the air passes through the triangular filter, the electrostatic adsorption column located near the triangular filter can adsorb the dust in the air. At the same time, since the electrostatic adsorption column is only close to the triangular filter and is not on the main path of air flow, the dust can be adsorbed by the electrostatic adsorption column, and the airflow will not carry away the dust adsorbed on the electrostatic adsorption column, which is convenient for avoiding dust accumulation on the triangular filter and causing the mesh to be blocked, so that the triangular filter can always maintain a good filtering effect and ventilation effect.

[0018] 4. The infrared detection equipment for wafer thickness detection, when the device is not in use, can drive the triangular filter and the connecting plate to vibrate through the vibrator, and the connecting plate drives the electrostatic adsorption column to vibrate. When the electrostatic adsorption column vibrates, the dust on it can fall off from the electrostatic adsorption column. At the same time, the annular slide drives the rotating circle to rotate, and the rotating circle drives the triangular filter and the connecting plate to rotate. At this time, the fallen dust can slide off the triangular filter and the connecting plate and fall into the collection box. There is no need for manual disassembly and cleaning, and it is convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the right side structure of the infrared detection device for wafer thickness detection of the present invention;

[0020] Figure 2 It is a schematic diagram of the left side structure of the infrared detection device for wafer thickness detection of the present invention;

[0021] Figure 3 It is a schematic diagram of the structure of the feeding device of the present invention;

[0022] Figure 4 It is a schematic diagram of the structure of the dust suppression device of the present invention;

[0023] Figure 5 It is a schematic diagram of the structure of the filtering device of the present invention;

[0024] Figure 6 This is a schematic diagram of the internal structure of the filter device of the present invention;

[0025] Figure 7 It is a schematic diagram of the connection structure of the tripod filter of the present invention.

[0026] In the figure: 1. workbench; 2. support frame; 3. feeding device; 31. feeding frame; 32. rotating shaft; 33. driving motor; 34. feeding trough; 35. vacuum suction cup; 36. exhaust pipe; 37. mounting seat; 38. annular pipe; 39. exhaust pump; 4. detection bracket; 5. detection device; 6. dust removal device; 61. dust removal fan; 62. filtering device; 621. filter cartridge; 622. annular slide; 623. rotating circle; 624. triangular filter; 625. vibrator; 626. connecting plate; 627. electrostatic adsorption column; 628. collecting box; 63. air inlet pipe; 64. air inlet nozzle; 65. air outlet pipe; 66. air outlet nozzle. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] See also Figure 1-Figure 3 The present invention provides a technical solution to solve the problem that the currently used infrared detection equipment for wafer thickness is inconvenient to feed materials: an infrared detection equipment for wafer thickness detection, comprising a workbench 1, a support frame 2 is fixedly connected to the top of the workbench 1, a feeding device 3 is arranged on the top of the support frame 2, a detection bracket 4 is fixedly connected to one side of the support frame 2, a detection device 5 is fixedly connected to the top of the detection bracket 4, and a dust removal device 6 is fixedly connected to the side of the support frame 2 away from the detection bracket 4;

[0029] The feeding device 3 includes a feeding rack 31, a rotating shaft 32 passes through and is fixedly connected to the center of the feeding rack 31, one end of the rotating shaft 32 is fixedly connected to a driving motor 33, a mounting seat 37 is fixedly connected to the side of the feeding rack 31, a feeding trough 34 is provided on the side of the mounting seat 37, a vacuum suction cup 35 is fixedly connected to the bottom of the inner wall of the feeding trough 34, one side of the vacuum suction cup 35 is connected to an exhaust pipe 36, the end of the exhaust pipe 36 away from the vacuum suction cup 35 is connected to an annular pipe 38, one side of the annular pipe 38 is connected to the exhaust port of an exhaust pump 39, the driving motor 33 is fixedly connected to the side of the support frame 2, the end of the rotating shaft 32 away from the driving motor 33 is rotatably connected to the support frame 2, a plurality of mounting seats 37 are arranged and are evenly distributed on the feeding rack 31, the exhaust pump 39 is fixedly connected to the feeding rack 31, and an electronic three-way valve is arranged on the exhaust pipe 36.

[0030] When in use, the wafer is placed in the feeding trough 34, and the vacuum suction cup 35 is driven by the air pump 39 to absorb the wafer in the feeding trough 34, and then the feeding rack 31 is driven by the driving motor 33 to rotate, and the feeding rack 31 drives the mounting seat 37 to rotate, and the mounting seat 37 can drive the wafer in the feeding trough 34 to move to the bottom of the detection device 5, which is convenient for complete automatic feeding. When collecting materials, the mounting seat 37 can be driven by the feeding rack 31 to rotate to the bottom, and then the vacuum suction cup 35 can be controlled by the electric three-way valve on the air extraction pipe 36 to suck the wafer. When the wafer is released from the feeding trough 34, the wafer in the feeding trough 34 can fall out from the feeding trough 34. When feeding, the wafer can be directly moved to the specified position by the feeding rack 31. The feeding operation is convenient. At the same time, when collecting, the wafer can be released by the vacuum suction cup 35 to complete the collection. The collection is also convenient. Through the rotating cycle structure, the wafer to be tested can be loaded into other feeding troughs 34 during the thickness detection process, thereby realizing rotating cycle detection, so that the wafer does not need to delay the detection time when it is taken out and installed, and the detection efficiency is high.

[0031] See also Figure 1-Figure 7The present invention provides a technical solution to solve the problem that the dust or smoke particles in the air environment of the detection position during the wafer thickness detection process affect the detection accuracy: the dust removal device 6 includes a dust removal fan 61, the air inlet of the dust removal fan 61 is connected to the filter device 62 through a connecting pipe, the side of the filter device 62 away from the dust removal fan 61 is connected to the air inlet pipe 63, the end of the air inlet pipe 63 away from the filter device 62 is connected to the air inlet nozzle 64, the air outlet of the dust removal fan 61 is connected to the air outlet pipe 65, and the end of the air outlet pipe 65 away from the dust removal fan 61 is connected to the air outlet nozzle 66, the dust removal fan 61 and the filter device 62 are both fixedly connected to the side of the support frame 2 through a connecting frame, the air inlet pipe 63 and the air outlet pipe 65 are both configured as arc pipes, the air inlet nozzle 64 and the air outlet nozzle 66 are both configured as funnel-shaped, the air inlet nozzle 64 and the air outlet nozzle 66 are symmetrically arranged on both sides of the feeding device 3, and the air inlet nozzle 64 and the air outlet nozzle 66 are relatively arranged at the position between the feeding device 3 and the detection device 5;

[0032] A dust removal device 6 is provided. When in use, the air between the detection device 5 and the feeding device 3 is sucked into the air inlet nozzle 64, and enters the air inlet pipe 63 through the air inlet nozzle 64. The air in the air inlet pipe 63 is filtered by the filter device 62, and then enters the dust removal fan 61, and is discharged from the dust removal fan 61 to the air outlet pipe 65. The air in the air outlet pipe 65 is discharged again to between the detection device 5 and the feeding device 3 through the air outlet nozzle 66, so that when the detection device 5 detects the wafer below, the air between the two is cleaner, which can prevent the impurities in the ambient air from having a greater impact on the detection result of the wafer thickness, and can make the detection result more accurate;

[0033] The filtering device 62 includes a filter cartridge 621, the inner wall of the filter cartridge 621 is fixedly connected to an annular slide 622, the inner wall of the annular slide 622 is slidably connected to a rotating circle 623, the inner wall of the rotating circle 623 is fixedly connected to a triangular filter 624, the triangular filter 624 is provided with multiple groups and is evenly distributed on the inner wall of the rotating circle 623, the end of the triangular filter 624 away from the rotating circle 623 is fixedly connected to a vibrator 625, adjacent triangular filter screens 624 are fixedly connected to a connecting plate 626, and the side of the connecting plate 626 is fixedly connected to an electrostatic adsorption column 627, The bottom of the filter cartridge 621 located on both sides of the annular slide 622 is connected to the collection box 628. One side of the filter cartridge 621 is connected to the air inlet of the dust removal fan 61 through a connecting pipe. The side of the filter cartridge 621 away from the dust removal fan 61 is connected to the air inlet pipe 63. The filter cartridge 621 is fixedly connected to the side of the support frame 2 through a connecting frame. The side of the rotating circle 623 extends to the inside of the annular slide 622 and is fixedly connected to the electronic slider inside the annular slide 622. The two ends of the connecting plate 626 are fixedly connected to the inner wall of the rotating circle 623 and the side of the vibrator 625 respectively.

[0034] A filter device 62 is provided. When air enters the filter device 62, it first enters the filter cartridge 621, and is filtered by the triangular filter screen 624 inside the filter cartridge 621, and then is discharged from the other side of the filter cartridge 621. When the air passes through the triangular filter screen 624, the electrostatic adsorption column 627 located near the triangular filter screen 624 can adsorb dust in the air. At the same time, since the electrostatic adsorption column 627 is only close to the triangular filter screen 624 and is not on the main path of air flow, the dust can be adsorbed by the electrostatic adsorption column 627, and the airflow will not carry away the dust adsorbed on the electrostatic adsorption column 627, which is convenient for avoiding dust accumulation on the triangular filter screen 624 and causing mesh holes to be damaged. The blockage situation allows the triangular filter 624 to always maintain a good filtering effect and ventilation effect. When the device is not in use, the vibrator 625 can drive the triangular filter 624 and the connecting plate 626 to vibrate, and the connecting plate 626 can drive the electrostatic adsorption column 627 to vibrate. When the electrostatic adsorption column 627 vibrates, the dust on it can fall off from the electrostatic adsorption column 627. At the same time, the annular slide 622 drives the rotating circle 623 to rotate, and the rotating circle 623 drives the triangular filter 624 and the connecting plate 626 to rotate. At this time, the fallen dust can slide off the triangular filter 624 and the connecting plate 626 and fall into the collection box 628. There is no need for manual disassembly and cleaning, which is convenient to use.

[0035] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. An infrared detection device for wafer thickness detection, characterized in that: The workbench (1) comprises a support frame (2) fixedly connected to the top of the workbench (1), a feeding device (3) being arranged on the top of the support frame (2), a detection frame (4) fixedly connected to one side of the support frame (2), a detection device (5) fixedly connected to the top of the detection frame (4), and a dust removal device (6) fixedly connected to the side of the support frame (2) away from the detection frame (4); The feeding device (3) comprises a feeding frame (31), a rotating shaft (32) passing through and fixedly connected to the center of the feeding frame (31), one end of the rotating shaft (32) being fixedly connected to a driving motor (33), a mounting seat (37) being fixedly connected to the side of the feeding frame (31), a feeding trough (34) being provided on the side of the mounting seat (37), a vacuum suction cup (35) being fixedly connected to the bottom of the inner wall of the feeding trough (34), one side of the vacuum suction cup (35) being connected to an exhaust pipe (36), one end of the exhaust pipe (36) away from the vacuum suction cup (35) being connected to an annular pipe (38), and one side of the annular pipe (38) being connected to an exhaust port of an exhaust pump (39); The dust removal device (6) comprises a dust removal fan (61), the air inlet of the dust removal fan (61) is connected to a filter device (62) via a connecting pipe, the side of the filter device (62) away from the dust removal fan (61) is connected to an air inlet pipe (63), the end of the air inlet pipe (63) away from the filter device (62) is connected to an air inlet nozzle (64), the air outlet of the dust removal fan (61) is connected to an air outlet pipe (65), and the end of the air outlet pipe (65) away from the dust removal fan (61) is connected to an air outlet nozzle (66); The dust removal fan (61) and the filter device (62) are both fixedly connected to the side of the support frame (2) via a connecting frame, and the air inlet pipe (63) and the air outlet pipe (65) are both configured as arc-shaped pipes; The air inlet nozzle (64) and the air outlet nozzle (66) are both arranged in a funnel shape, and the air inlet nozzle (64) and the air outlet nozzle (66) are symmetrically arranged on both sides of the feeding device (3), and the air inlet nozzle (64) and the air outlet nozzle (66) are arranged relatively between the feeding device (3) and the detection device (5); The filtering device (62) comprises a filter cartridge (621), the inner wall of the filter cartridge (621) being fixedly connected to an annular slideway (622), the inner wall of the annular slideway (622) being slidably connected to a rotating circle (623), the inner wall of the rotating circle (623) being fixedly connected to a triangular filter screen (624), a plurality of triangular filter screens (624) being provided and evenly distributed on the inner wall of the rotating circle (623), a vibrator (625) being fixedly connected to one end of the triangular filter screen (624) away from the rotating circle (623), connecting plates (626) being fixedly connected between adjacent triangular filter screens (624), and electrostatic adsorption columns (627) being fixedly connected to the sides of the connecting plates (626), and the bottom of the filter cartridge (621) located on both sides of the annular slideway (622) being connected to a collection box (628).

2. The infrared detection device for wafer thickness detection according to claim 1, characterized in that: The driving motor (33) is fixedly connected to the side of the support frame (2), and one end of the rotating shaft (32) away from the driving motor (33) is rotatably connected to the support frame (2).

3. The infrared detection device for wafer thickness detection according to claim 1, characterized in that: The mounting seats (37) are provided in multiple groups and are evenly distributed on the feeding rack (31); the air extraction pump (39) is fixedly connected to the feeding rack (31); and an electronic three-way valve is provided on the air extraction pipe (36).

4. The infrared detection device for wafer thickness detection according to claim 1, characterized in that: One side of the filter cartridge (621) is connected to the air inlet of the dust removal fan (61) via a connecting pipe, the side of the filter cartridge (621) away from the dust removal fan (61) is connected to the air inlet pipe (63), and the filter cartridge (621) is fixedly connected to the side of the support frame (2) via a connecting frame.

5. The infrared detection device for wafer thickness detection according to claim 1, characterized in that: The side surface of the rotating circle (623) extends into the interior of the annular slideway (622) and is fixedly connected to the electronic slider inside the annular slideway (622), and the two ends of the connecting plate (626) are respectively fixedly connected to the inner wall of the rotating circle (623) and the side surface of the vibrator (625).

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