Backboard, evaporation device and evaporation equipment

Abstract

The invention provides a back plate, an evaporation device and evaporation equipment. The back plate comprises a supporting base plate and a supporting assembly, the supporting assembly is located on the first surface of the supporting base plate, the supporting assembly is configured to abut against a base plate to be evaporated, and at least part of the structure of the supporting assembly is made of a flexible material. According to the application, the materials of partial structures in the supporting assembly are set as the flexible materials, so that soft supporting of the to-be-evaporated substrate can be realized, and damage caused when the to-be-evaporated substrate is supported can be reduced while the supporting stability is ensured.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a backplane, an evaporation device and an evaporation equipment. Background Art

[0002] Evaporation technology is often used to prepare different film layers in display panels. When preparing a display panel, it is necessary to use an evaporation device to perform evaporation on the surface of the substrate to form each film layer in the display panel. When the substrate is placed in the evaporation device, the substrate needs to be supported by the backplane in the evaporation device. In order to improve the supporting strength and stability of the backplane to the substrate, a plurality of supporting protrusions are provided on the surface of the backplane for abutting against the substrate. However, when the supporting protrusions of this backplane abut against the substrate, it is easy to cause damage to the substrate, thereby affecting the accuracy of the film thickness in each evaporation film layer, thereby reducing the yield of the display panel.

[0003] Therefore, a new solution that can reduce substrate damage during evaporation is urgently needed. Summary of the invention

[0004] The embodiments of the present application provide a backplane, an evaporation device and an evaporation equipment to take into account both support stability and low damage.

[0005] In a first aspect, a backplane is provided, comprising: a supporting substrate; a supporting assembly located on a first surface of the supporting substrate, the supporting assembly being configured to abut against a substrate to be evaporated; wherein the material of at least part of the structure in the supporting assembly comprises a flexible material.

[0006] In combination with the first aspect, in some implementations of the first aspect, the support assembly includes: a plurality of first support members distributed on a first surface of the support substrate, the material of the first support members includes a flexible material, and the first support members are configured to abut against the substrate to be evaporated;

[0007] In combination with the first aspect, in some implementations of the first aspect, the flexible material includes at least one of nylon and antistatic rubber.

[0008] In combination with the first aspect, in some implementations of the first aspect, the support assembly further includes: a plurality of second support members distributed on the first surface, the material of the second support members includes a rigid material, and the second support members are configured to abut against the substrate to be evaporated.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the number of first support members is A1, the number of second support members is A2, A1 and A2 are both positive integers, A1≤A2, and the second support members and the first support members are dispersedly arranged on the first surface.

[0010] In combination with the first aspect, in certain implementations of the first aspect, A1=A2, and the first support members and the second support members are arranged alternately.

[0011] In combination with the first aspect, in certain implementations of the first aspect, A2 is less than 2 times A1; or, A1>A2, a plurality of second support members are dispersedly arranged on the first surface, and a plurality of first support members are arranged around the second support members.

[0012] In combination with the first aspect, in certain implementations of the first aspect, in a direction perpendicular to the supporting substrate, a size of the first support member is h1, a size of the second support member is h2, h1>h2, and both h1 and h2 are positive numbers.

[0013] In combination with the first aspect, in some implementations of the first aspect, the difference between h1 and h2 is greater than or equal to 1 mm.

[0014] In combination with the first aspect, the ratio of h1 to h2 ranges from 1.03 to 1.07.

[0015] In combination with the first aspect, the ratio of h1 to h2 is 1.05:1.

[0016] In combination with the first aspect, in certain implementations of the first aspect, the first support member includes: at least one first support portion, the material of the first support portion is a rigid material; at least one second support portion, the second support portion is connected to the first support portion, and the material of the second support portion is a flexible material; wherein the first support portion is connected to the first surface, and the second support portion abuts against the substrate to be evaporated, or the second support portion is connected to the first surface, and the first support portion abuts against the substrate to be evaporated.

[0017] In combination with the first aspect, in some implementations of the first aspect, it also includes: a cooling structure, which is arranged on at least one of the first support member and the second support member, and is used to dissipate heat from the supported substrate to be evaporated.

[0018] In combination with the first aspect, in some implementations of the first aspect, the first support member has a cavity, and the cavity forms a cooling structure, wherein the cavity is configured to accommodate a cooling medium.

[0019] In combination with the first aspect, in some implementations of the first aspect, the first support member includes an airbag structure having a receiving cavity, the support base plate has a pipe communicating with the receiving cavity, and the pipe and the receiving cavity are configured to allow cooling medium to flow.

[0020] In a second aspect, a vapor deposition device is provided, comprising: a mask plate configured to support a substrate to be vapor deposited; a back plate mentioned in any of the above items, spaced apart from the mask plate, the substrate to be vapor deposited is placed between the mask plate and the back plate, and the back plate is configured to abut against the substrate to be vapor deposited to support the substrate to be vapor deposited.

[0021] According to a third aspect, a vapor deposition device is provided for vapor deposition of a substrate to be vapor deposited. The vapor deposition device comprises: a main body having a vapor deposition chamber for placing the substrate to be vapor deposited, and a magnetic plate located in the vapor deposition chamber; the vapor deposition device mentioned in the second aspect, wherein the back plate of the vapor deposition device is in contact with the magnetic plate.

[0022] The present application provides a backplane, an evaporation device and an evaporation equipment. The backplane includes a support substrate and a support component, the support component is located on the first surface of the support substrate, and the support component is configured to abut against the substrate to be evaporated; wherein at least part of the structure of the support component includes a flexible material.

[0023] The embodiment of the present application sets the material of at least part of the structure in the support component to be a flexible material, that is, replaces at least part of the hard support used to support the substrate to be evaporated in the prior art with a flexible support made of flexible material, so that the support component has better supporting stability for the substrate to be evaporated. At the same time, according to the elastic deformation ability of the flexible material, it can avoid scratching the substrate to be evaporated when the support component abuts against the substrate to be evaporated, thereby improving the accuracy of the evaporated film thickness and the display yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0025] Figure 1a It is a schematic diagram of the cross-sectional structure of a backplane, wherein the direction indicated by the arrow H is the height direction of the backplane.

[0026] Figure 1b for Figure 1a Bottom view of the mid-back panel.

[0027] Figure 1c for Figure 1a Schematic diagram of the cross-sectional structure of the mid-back plate in the evaporation equipment in cooperation with the substrate to be evaporated.

[0028] Figure 2 Schematic diagram of the cross-sectional structure of a backplane in one embodiment of the present application.

[0029] Figure 3 This is a schematic diagram of the cross-sectional structure of a backplane in another embodiment of the present application.

[0030] Figure 4 It is a bottom view of the back plate in one embodiment of the present application.

[0031] Figure 5 This is a bottom view of a back plate in another embodiment of the present application.

[0032] Figure 6This is a bottom view of a back plate in another embodiment of the present application.

[0033] Figure 7 This is a bottom view of a back plate in another embodiment of the present application.

[0034] Figure 8 This is a schematic diagram of the cross-sectional structure of a backplane in another embodiment of the present application.

[0035] Fig. 9 for Figure 8 Bottom view of .

[0036] Fig.10 Schematic diagram of the cross-sectional structure of a backplane in one embodiment of the present application.

[0037] Fig.11 This is a schematic diagram of the cross-sectional structure of a backplane in another embodiment of the present application.

[0038] Fig.12 It is a schematic diagram of the cross-sectional structure of the back plate and the glass substrate in one embodiment of the present application.

[0039] Fig.13 FIG. 1 is a schematic diagram of a partial cross-sectional structure of an evaporation device in one embodiment of the present application.

[0040] Fig.14 It is a schematic diagram of a partial cross-sectional structure of a vapor deposition device in one embodiment of the present application. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application. The features and exemplary embodiments of various aspects of the present application will be described in detail below.

[0042] Figure 1a is a schematic diagram of the cross-sectional structure of a backplane in the prior art, Figure 1b for Figure 1a Bottom view of the mid-back panel. Figure 1c for Figure 1aSchematic diagram of the cross-sectional structure of the middle backplane in the evaporation equipment in cooperation with the substrate to be evaporated. Among them, the direction indicated by the arrow H is the height direction of the backplane, which will not be emphasized separately in the following. The substrate to be evaporated may include a rigid substrate, such as a glass substrate, and may also include other film layers stacked on the rigid substrate, such as a driving circuit layer, a light-emitting layer, etc. The evaporation equipment can be used to evaporate to form different film layers on the substrate to be evaporated. For the sake of ease of explanation, the following description will be based on the example that the substrate to be evaporated only includes a rigid substrate. For the sake of ease of understanding, the substrate to be evaporated will be collectively referred to as a "glass substrate" in the following, but it is not limited to this. Figure 1a and Figure 1b The back plate 10' comprises a supporting substrate 11' and a plurality of supporting protrusions 12', and the plurality of supporting protrusions 12' are arranged at intervals on the surface of the supporting substrate 11'. It can be understood that the materials of the supporting substrate 11' and the supporting protrusions 12' are generally selected from hard metal materials, so that the supporting protrusions 12' can support the glass substrate 40.

[0043] like Figure 1c As shown, in the evaporation device, a magnetic suction plate 20 and a mask plate 30 are also included. Along the height direction H, the back plate 10' is located below the magnetic suction plate 20, and the glass substrate 40 is located between the back plate 10' and the mask plate 30. The magnetic suction plate 20 absorbs the mask plate 30 so that the glass substrate 40 is clamped between the back plate 10' and the mask plate 30, and the surface of the glass substrate 40 facing the back plate 10' is respectively in contact with a plurality of support protrusions 12'. During the evaporation process, the surface of the glass substrate 40 away from the back plate 10' is formed into a film layer through the pattern evaporation on the mask plate 30. Among them, the support protrusion 12' of hard metal can reduce the contact area between the back plate 10' and the glass substrate 40, so as to facilitate the separation of the back plate 10' and the glass substrate 40 after the evaporation is completed. However, the contact between the hard support protrusion 12' and the glass substrate 40 is likely to cause damage or even breakage of the glass substrate 40, affecting the evaporation effect, and then causing display abnormality of the display panel.

[0044] In view of this, the present application provides a backplane, an evaporation device and an evaporation equipment to take into account both the support stability and low damage to the glass substrate.

[0045] Figure 2 FIG. 1 is a schematic diagram of the cross-sectional structure of a backplane in an embodiment of the present application. Figure 2 As shown, the back plate 10 includes a support substrate 11 and a support assembly 12. The support assembly 12 is located on a first surface 111 of the support substrate 11 and is configured to abut against the glass substrate 40. The material of at least part of the structure of the support assembly 12 includes a flexible material.

[0046] In this embodiment, the material of at least part of the structure in the support component 12 is set to be a flexible material, that is, at least part of the hard support used to support the glass substrate 40 is replaced with a flexible support made of a flexible material, so that the support component 12 has better supporting stability for the glass substrate 40. At the same time, by utilizing the characteristics of the flexible material itself, the risk of scratching the surface of the glass substrate 40 when the support component 12 abuts against the glass substrate 40 can be avoided, thereby improving the accuracy of the vapor-deposited film thickness and the display yield.

[0047] It should be emphasized that, for ease of observation, the flexible material in the support assembly 12 is represented by black shadows, and the rigid material is represented by white, and will not be emphasized separately later.

[0048] In one embodiment, the support assembly 12 includes a plurality of first support members 121, and the first support members 121 are distributed on the first surface 111 of the support substrate 11. The material of the first support members 121 includes a flexible material, so that when the first support members 121 abut against the glass substrate 40, the first support members 121 made of the flexible material are in flexible contact with the glass substrate 40, and the first support members 121 will not cause damage or even break the glass substrate 40.

[0049] It is understood that the flexible material may be, for example, nylon or antistatic adhesive. In the embodiment of the present application, antistatic adhesive is selected as the flexible material, and the first support member 121 including the antistatic adhesive can produce a micro-deformation and abut against the glass substrate 40, so as to realize flexible support for the glass substrate 40, and the antistatic adhesive can reduce the electrostatic adsorption of the glass substrate 40. Therefore, after the evaporation is completed, it is easy to realize the rapid separation of the back plate 10 and the glass substrate 40, thereby improving efficiency.

[0050] It should be emphasized that the flexible material selected for the first support member 121 can be other materials with elastic deformation ability in addition to the nylon and anti-static glue mentioned above, as long as the first support member 121 has sufficient flexible supporting strength for the glass substrate 40, it can be adaptively adjusted according to actual needs and is not specifically limited here.

[0051] Figure 3 FIG. 1 is a schematic diagram of the cross-sectional structure of a backplane in another embodiment of the present application. Figure 3As shown, the material selected for the first support member 121 includes not only a flexible material, but also a rigid material. Specifically, the first support member 121 may include at least one first support portion 1212 and at least one second support portion 1211. The material of the first support portion 1212 is a rigid material, and the material of the second support portion 1211 is a flexible material. The first support portion 1212 and the second support portion 1211 are connected. One of the first support portion 1212 and the second support portion 1211 is used to connect with the first surface 111, and the other is used to abut against the glass substrate 40.

[0052] In this embodiment, through the cooperation between the first support portion 1212 and the second support portion 1211, when the support assembly 12 is used to support the glass substrate 40, only the second support portion 1211 in the first support member 121 undergoes elastic deformation. The partial elastic deformation enables the first support member 121 to achieve flexible support for the glass substrate 40, while the partial rigid material enables the first support member 121 to still maintain sufficient support stability and support strength for the glass substrate 40, which is beneficial for the back panel 10 to simultaneously take into account support stability and avoid scratching the glass substrate 40.

[0053] It can be understood that which one of the first support portion 1212 and the second support portion 1211 is used to connect with the first surface 111 and which one is used to abut against the glass substrate 40 can be adaptively adjusted according to actual needs without specific limitation. For example, in the entire support assembly 12, multiple first support portions 1212 are used to connect with the first surface 111, and multiple second support portions 1211 are used to abut against the glass substrate 40, so that the surface of the glass substrate 40 does not directly contact the rigid material, thereby effectively preventing the glass substrate 40 from being scratched. For another example, in the entire support assembly 12, part of the first support portion 1212 is used to connect with the first surface 40, and part of the first support portion 1212 is used to abut against the glass substrate 40, so that part of the rigid material is in contact with the surface of the glass substrate 40, so that the support assembly 12 has a better supporting effect on the glass substrate 40.

[0054] Optionally, the first support member 121 may further include a third support portion, a fourth support portion, etc., in which rigid materials and flexible materials are alternately arranged, without specific limitation.

[0055] In one embodiment, the support assembly 12 further includes a plurality of second support members 122, which are distributed on the first surface 111. The material of the second support members 122 includes a rigid material, and the second support members 122 are configured to abut against the glass substrate 40. In this embodiment, on the basis of arranging a plurality of first support members 121 on the first surface 111 of the support substrate 11, a plurality of second support members 122 are further arranged on the first surface 111 to abut against the glass substrate 40 respectively. The combination of hard support and flexible support for the glass substrate 40 is achieved by the arrangement of the first support members 121 and the second support members 122, which can ensure that the glass substrate 40 has sufficient support stability and support strength, while reducing the damage or even breakage of the support members to the glass substrate 40, thereby improving the accuracy of evaporation and ensuring the consistency of the film thickness of the film formed on the glass substrate 40 during the evaporation process.

[0056] It is understood that the rigid material can be, for example, a hard and non-magnetic metal material such as copper and aluminum. In the embodiment of the present application, the material of the second support member 122 is set to be the same as the material of the support substrate 11, for example, both are aluminum, and the support substrate 11 and the second support member 122 can be an integrated molding structure, thereby improving the stability and strength of the second support member 122 supporting the glass substrate 40, while not being adsorbed by the magnetic suction plate 20.

[0057] The following combination Figures 4 to 10 , taking the example that the support assembly 12 includes a plurality of first support members 121 and a plurality of second support members 122, the first support members 121 and the second support members 122 are both used to abut against the glass substrate 40, and the material of the first support members 121 is completely flexible material, and the material of the second support members 122 is completely rigid deformable material, the exemplary structure of the back panel 10 is described in detail.

[0058] The second support members 122 and the first support members 121 are dispersedly arranged on the first surface 111. The first support members 121 are made of flexible materials, and the second support members 122 are made of rigid materials. The number of the first support members 121 is A1, and the number of the second support members 122 is A2, and both A1 and A2 are positive integers.

[0059] In one embodiment, Figures 4 to 7 As shown, A1≤A2, that is, the number of the second support members 122 arranged on the first surface 111 is not less than the number of the first support members 121, so that the support assembly 12 has sufficient supporting strength and supporting stability for the glass substrate 40 by using the second support members 122, and avoids arranging too many first support members 121 to affect the supporting effect on the glass substrate 40.

[0060] In an alternative embodiment, Figure 4 FIG. 1 is a bottom view of a back plate in one embodiment of the present application. Figure 4As shown, A1=A2, and the first support member 121 and the second support member 122 are arranged alternately. By means of the alternate arrangement of the first support member 121 and the second support member 122, the supporting forces provided by the first support member 121 and the second support member 122 to the glass substrate 40 are dispersed and relatively balanced, thereby improving the supporting stability and reducing the damage to the glass substrate 40.

[0061] like Figures 5 to 7 As shown, when A2 is less than 2 times of A1, the second support members 122 are dispersedly arranged on the first surface 111, and the first support members 121 are interspersed and arranged at the gap positions between the second support members 122. For example, Figure 5 FIG. 1 is a bottom view of a back plate in another embodiment of the present application. Figure 5 As shown, every 9 supporting members arranged in multiple rows and columns form a group, and multiple groups are arranged at intervals on the first surface 111. In each group, only four supporting members located at the four corners are set as first supporting members 121, and the others are set as second supporting members 122. For another example, Figure 6 FIG. 1 is a bottom view of a back plate in another embodiment of the present application. Figure 6 As shown, the support members on the first surface 111 are arranged in a plurality of sleeved annular structures, in each layer of the annular structure, the first support members 121 and the second support members 122 are arranged alternately, and the second support member 122 is arranged at the center. Or, Figure 7 FIG. 1 is a bottom view of a back plate in another embodiment of the present application. Figure 7 As shown, the first support members 121 and the second support members 122 are respectively arranged at different layers of annular structures, so that the first support members 121 and the second support members 122 are alternately arranged in the spaced rings.

[0062] It is understandable that the first support member 121 and the second support member 122 may also be arranged on the first surface 111 using other schemes, which are not specifically limited.

[0063] It should be emphasized that the first support member 121 and the second support member 122 can be configured as follows: Figure 5 The square columnar structure in can also be set as Figure 6 and Figure 7 The circular columnar structure may be a structure of other shapes, which is not specifically limited here.

[0064] In one embodiment, Figure 8 This is a schematic diagram of the cross-sectional structure of a backplane in another embodiment of the present application. Fig. 9 for Figure 8 Bottom view of the Figure 8 and Fig. 9As shown, A1>A2, a plurality of second support members 122 are dispersedly arranged on the first surface 111, and a plurality of first support members 121 are arranged around the second support member 122. The first support member 121 is arranged at a position close to the second support member 122, so that when the second support member 122 implements hard support for the glass substrate 40, the first support member 121 implements flexible support for the glass substrate 40 at a position beside the second support member 122. The support of the first support member 121 to the second support member 122 can disperse the supporting force, avoid putting all the supporting force on the second support member 122, and thus reduce the risk of scratching the glass substrate 40 by the hard support of the second support member 122.

[0065] It should be emphasized that the number and arrangement of the first support members 121 and the second support members 122 on the first surface 111 can be adaptively adjusted according to actual needs. For example, the first support members 121 and the second support members 122 can be evenly arranged on the first surface 111, or the density of the second support members 122 arranged in the central area of ​​the first surface 111 can be greater than the density of the first support members 121, and the density of the first support members 121 arranged in the edge area can be greater than the density of the second support members 122, without specific limitation.

[0066] In one embodiment, Figure 2 As shown, in the direction perpendicular to the support substrate 11, that is, along the height direction H, the size of the first support member 121 is h1, and the size of the second support member 122 is h2, h1>h2, and both h1 and h2 are positive numbers. The difference between h1 and h2 is greater than or equal to 1mm. When the second support member 122 abuts against the glass substrate 40, the first support member 121 can produce elastic deformation and abut against the glass substrate 40. In this way, the support assembly 12 realizes a combination of hard support and flexible support for the glass substrate 40, reducing the damage of the hard support to the glass substrate 40.

[0067] It is understandable that the difference between h1 and h2 can be between 1.5 mm and 5 mm, for example, the difference between h1 and h2 can be 2 mm or 3 mm, so that the first support member 121 can have sufficient deformation so that the first support member 121 and the second support member 122 can abut against the glass substrate 40 at the same time, and the first support member 121 can use its restoring force when deformed to support the glass substrate 40, thereby improving the stability of the support for the glass substrate 40.

[0068] Optionally, the ratio of h1 to h2 is in the range of 1.03 to 1.07, such as 1.04, 1.05, 1.06, to ensure a high support stability for the glass substrate 40. It is understandable that the ratio of h1 to h2 may specifically be 1.05:1.

[0069] It should be emphasized that the height of the plurality of first support members 121 and the height of the plurality of second support members 122 can be as follows: Figure 2 As shown in , the heights of the plurality of first support members 121 are the same, and the heights of the plurality of second support members 122 are the same. Alternatively, the heights of the plurality of first support members 121 and the heights of the plurality of second support members 122 may be set to be different. Fig.10 FIG. 1 is a schematic diagram of the cross-sectional structure of a backplane in an embodiment of the present application. Fig.10 As shown, from the center position to the edge position of the first surface 111, the height of the plurality of first support members 121 decreases from the center position to the edge position, and the height of the plurality of second support members 122 decreases from the center position to the edge position. During evaporation, the glass substrate 40 is suspended in the middle, and under the action of gravity, the glass substrate 40 as a whole produces a certain arc deformation. Therefore, when the back plate 10 above the glass substrate 40 supports the glass substrate 40, the height of the first support member 121 and the second support member 122 arranged on the support assembly 12 can be designed with reference to the deformation degree of the glass substrate 40, so that the first support member 121 and the second support member 122 can better support the glass substrate 40 and improve the stability and strength of the support.

[0070] On the basis of the above embodiments, the back plate 10 of the embodiment of the present application may further include a cooling structure 13 , which is disposed on at least one of the first support member 121 and the second support member 122 for dissipating heat from the supported glass substrate 40 .

[0071] In this embodiment, by setting the cooling structure 13 on the support assembly 12, the cooling structure 13 can be closer to the glass substrate 40, so as to achieve a better cooling effect on the contact area between the support assembly 12 and the glass substrate 40, and avoid the hard support from causing damage to the glass substrate 40 more easily when the temperature of the glass substrate 40 is too high during the evaporation process, thereby further avoiding damage to the glass substrate 40. In addition, the cooling structure 13 is conducive to the film formation speed and uniformity of the film layer on the glass substrate 40 during evaporation.

[0072] The following Figure 2 Taking the arrangement of the first support member 121 and the second support member 122 in the embodiment as an example, that is, the first support member 121 is completely made of flexible material, and the material of the second support member 122 is completely made of rigid material, the cooling structure 13 arranged on the first support member 121 is described in detail. It can be understood that the cooling structure 13 can also be arranged on the second support member 122, and when the first support member 121 includes the first support portion 1212 and the second support portion 1211, the cooling structure 13 can also be arranged on at least one of the first support portion 1212 and the second support portion 1211, which will not be described in detail here.

[0073] Fig.11FIG. 1 is a schematic diagram of the cross-sectional structure of a backplane in another embodiment of the present application. Fig.11 As shown, that is, Figure 2 On the basis of the first support member 121 which is entirely made of flexible material, the cooling structure 13 is arranged on the first support member 121. Specifically, the first support member 121 has a cavity 123, and the cavity 123 forms the cooling structure 13, wherein the cavity 123 is configured to accommodate a cooling medium 131. By setting the cooling structure 13, when the back plate 10 is used to support the glass substrate 40, the cooling medium 131 can be closer to the glass substrate 40, so as to better cool the glass substrate 40, avoid the glass substrate 40 from being more easily damaged when the temperature is too high, thereby reducing the risk of the glass substrate 40 being damaged.

[0074] Fig.12 FIG. 1 is a schematic diagram of a cross-sectional structure of a back plate and a glass substrate in accordance with an embodiment of the present application. Fig.12 As shown, the first support member 121 includes an airbag structure with an accommodating cavity, and the support substrate 11 has a pipe 112 connected to the accommodating cavity, and the pipe 112 and the accommodating cavity are configured to allow the cooling medium 131 to flow. On the one hand, the first support member 121 is directly set as the airbag structure with the accommodating cavity, so that when the first support member 121 abuts against the glass substrate 40, the airbag structure can have a larger contact area with the glass substrate 40 when flexibly deformed, so as to improve the support stability and strength of the glass substrate 40.

[0075] On the other hand, a cooling medium 131 connected to the pipe 112 is arranged in the accommodating cavity, so that when the airbag structure is deformed, the contact area between the airbag structure and the glass substrate 40 increases, so that the cooling medium 131 is closer to the glass substrate 40, thereby improving the cooling effect on the glass substrate 40. In addition, when the airbag structure abuts against the glass substrate 40 through flexible deformation, the cooling medium 131 in the accommodating cavity is squeezed, and under the action of the cooling medium 131 in the connected pipe 112, the cooling medium 131 can provide a reaction force, thereby acting on the glass substrate 40, thereby improving the stability and support strength of the glass substrate 40.

[0076] Optionally, the cooling medium 131 may be, for example, a medium with a cooling function such as a liquid or a gas, which is not specifically limited. In the embodiment of the present application, the cooling medium 131 is set to be a gas.

[0077] The embodiment of the present application also provides a vapor deposition device, which is applied to vapor deposition equipment. Fig.13 FIG. 1 is a schematic diagram of a cross-sectional structure of a portion of a vapor deposition device in an embodiment of the present application. Fig.13As shown, the evaporation device includes a mask plate 30, which is configured to support a glass substrate 40. The back plate 10 and the mask plate 30 are spaced apart, and the glass substrate 40 is placed between the mask plate 30 and the back plate 10. The back plate 10 is configured to abut against the glass substrate 40 to support the glass substrate 40. The back plate 10 can be the back plate 10 described in any of the above embodiments. When the magnetic suction plate 20 adsorbs the mask plate 30, the support component 12 in the clamped back plate 10 can be used to support the glass substrate 40, thereby taking into account the stability of the support and the low damage to the glass substrate 40.

[0078] The embodiment of the present application also provides an evaporation device for evaporating a substrate to be evaporated. Fig.14 FIG. 1 is a schematic diagram of a cross-sectional structure of a portion of a vapor deposition device in an embodiment of the present application. Fig.14 As shown, the evaporation device includes a main body 50, which has an evaporation chamber for placing a glass substrate 40, and a magnetic suction plate 20 is located in the evaporation chamber; an evaporation device, which is the evaporation device described above, and the back plate 10 of the evaporation device is in contact with the magnetic suction plate 20. The mask plate 30 is adsorbed by the adsorption force of the magnetic suction plate 20, so that the back plate 10 and the glass substrate 40 are clamped between the magnetic suction plate 20 and the mask plate 30. At this time, the back plate 10 is used to support the glass substrate 40, and the support assembly 12 provided on the back plate 10 is used to support the glass substrate 40, so as to take into account the stability of the support and the low damage to the glass substrate 40.

[0079] It should be noted that in the drawings of the present application document, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0080] In addition, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0081] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A backplane, characterized in that: include: A supporting substrate; A support assembly, located on the first surface of the support substrate, and configured to abut against the substrate to be evaporated; Wherein, the material of at least part of the structure of the support component includes flexible material.

2. The back plate according to claim 1, characterized in that: The support assembly comprises: A plurality of first support members, distributed on the first surface of the support substrate, wherein the material of the first support members comprises a flexible material, and the first support members are configured to abut against the substrate to be evaporated; Preferably, the flexible material comprises at least one of nylon and antistatic rubber.

3. The back plate according to claim 2, characterized in that: The support assembly also includes: A plurality of second support members are distributed on the first surface, the second support members are made of a rigid material, and the second support members are configured to abut against the substrate to be evaporated.

4. The back plate according to claim 3, characterized in that: The number of the first supporting members is A1, the number of the second supporting members is A2, A1 and A2 are both positive integers, A1≤A2, and the second supporting members and the first supporting members are dispersedly arranged on the first surface; Preferably, A1=A2, the first supporting member and the second supporting member are arranged alternately; Preferably, A2 is less than 2 times A1; or, A1>A2, the plurality of second support members are dispersedly arranged on the first surface, and the plurality of first support members are arranged around the second support member.

5. The back plate according to claim 3, characterized in that: In a direction perpendicular to the supporting substrate, the size of the first supporting member is h1, the size of the second supporting member is h2, h1>h2, and both h1 and h2 are positive numbers; Preferably, the difference between h1 and h2 is greater than or equal to 1 mm; Preferably, the ratio of h1 to h2 is between 1.03 and 1.07; Preferably, the ratio of h1 to h2 is 1.05:

1.

6. The back plate according to claim 2, characterized in that: The first support member comprises: At least one first supporting portion, wherein the material of the first supporting portion is a rigid material; at least one second supporting portion, the second supporting portion is connected to the first supporting portion, and the material of the second supporting portion is a flexible material; The first supporting portion is connected to the first surface, and the second supporting portion is in contact with the substrate to be evaporated, or the second supporting portion is connected to the first surface, and the first supporting portion is in contact with the substrate to be evaporated.

7. The back plate according to any one of claims 3 to 6, characterized in that: Also includes: The cooling structure is arranged on at least one of the first supporting member and the second supporting member, and is used for dissipating heat from the supported substrate to be evaporated.

8. The back plate according to claim 7, characterized in that: The first support member has a cavity, the cavity forming the cooling structure, wherein the cavity is configured to accommodate a cooling medium; Preferably, the first support member comprises an airbag structure having a receiving cavity, the support base plate comprises a pipe communicating with the receiving cavity, and the pipe and the receiving cavity are configured to allow the cooling medium to flow.

9. A vapor deposition device, characterized in that: include: A mask plate is configured to support a substrate to be evaporated; The back plate according to any one of claims 1 to 8 is spaced apart from the mask plate, the substrate to be evaporated is placed between the mask plate and the back plate, and the back plate is configured to abut against the substrate to be evaporated to support the substrate to be evaporated.

10. A vapor deposition device, characterized in that: Used for evaporating a substrate to be evaporated, the evaporation device comprises: The main body has a vapor deposition chamber for placing the substrate to be vapor deposited. A magnetic plate, located in the evaporation chamber; The evaporation device as claimed in claim 9, wherein a back plate of the evaporation device is in contact with the magnetic attraction plate.

Images