High-efficiency wafer test probe station

Abstract

The invention relates to the technical field of precision machinery manufacturing technology, and discloses a high-efficiency wafer test probe station, which comprises a base, the upper surface of the base is fixedly connected with a loading base and a motion control system, the output end of the motion control system is fixedly connected with a microscope, the upper surface of the loading base is fixedly connected with an objective table, and the objective table is fixedly connected with the output end of the motion control system. The interior of the base is in threaded connection with a synchronous adjusting mechanism and a support protection mechanism, the top of the synchronous adjusting mechanism is fixedly connected with a probe angle adjusting mechanism, and the upper surface of the probe angle adjusting mechanism is clamped with a probe seat, so that simultaneous adjustment of a plurality of probes can be realized, the test time is shortened, and the test efficiency is improved. Adjustment is carried out according to different wafer sizes to adapt to different test scenes; the angle of the probe is adjusted by adjusting the angle of the probe seat, so that the influence of resistance on a test signal is reduced in a low-resistance test.

Description

Technical Field

[0001] The invention relates to the technical field of precision machinery manufacturing technology, and in particular to a high-efficiency wafer testing probe station. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits. In the semiconductor industry, wafer testing is one of the key links in the chip manufacturing process. With the continuous development of semiconductor technology, the integration of chips is getting higher and higher, the size is getting smaller, and the processing and measurement equipment is becoming more and more advanced, which has led to new data characteristics in wafer processing. In the process of wafer processing, a wafer test probe station is required. Traditional wafer test probe stations have some limitations in test efficiency and accuracy. For example, the mechanical structure of the traditional probe station is relatively complex, and the positioning accuracy and movement speed are limited, resulting in a long test time. In addition, the electrical system and software system of the traditional probe station may also have some problems, such as signal interference, poor compatibility, complex operation, etc., which affect the accuracy and reliability of the test.

[0003] In order to meet the semiconductor industry's demand for wafer testing, it is necessary to develop a high-efficiency wafer testing probe station. This probe station should have higher testing efficiency, higher safety protection and convenient precision adjustment to improve the efficiency and accuracy of wafer testing, reduce testing costs, and provide strong support for the development of the semiconductor industry. Summary of the invention

[0004] The object of the present invention is to provide a high-efficiency wafer testing probe station to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-efficiency wafer test probe station, comprising a base, the upper surface of the base is fixedly connected to a carrier base and a motion control system, the output end of the motion control system is fixedly connected to a microscope, the upper surface of the carrier base is fixedly connected to a stage, the internal thread of the base is connected to a synchronous adjustment mechanism and a supporting protection mechanism, the top of the synchronous adjustment mechanism is fixedly connected to a probe angle adjustment mechanism, the upper surface of the probe angle adjustment mechanism is clamped with a probe seat, and also includes: The synchronous adjustment mechanism also includes a lead screw, which is arranged in a slot opened on the upper surface of the base, the outer surface of the lead screw is threadedly connected to a first slider, the outer surface of the first slider is fixedly connected to a second slider, the inner part of the fourth slider is slidably connected to a light bar, the light bar is arranged in a slot opened on the upper surface of the base, the upper surface of the first slider is fixedly connected to a first box body, and the upper surface of the first box body is fixedly connected to a first flexible accordion cover.

[0006] According to the above technical solution, the synchronous adjustment mechanism also includes a first hydraulic pump, three of which are provided, and the bottom of the first hydraulic pump is fixedly connected to the upper surfaces of the first slider and the second slider, the output end of the first hydraulic pump is fixedly connected to the first horizontal plate, the interior of the first horizontal plate is clamped with a first nail-shaped column by opening a card slot, the top of the first nail-shaped column is fixedly connected to the second horizontal plate, the lower surface of the second horizontal plate is fixedly connected to a spring and a second flexible accordion cover, and the bottoms of the spring and the second flexible accordion cover are both fixedly connected to the upper surface of the first horizontal plate.

[0007] According to the above technical solution, the probe angle adjustment mechanism includes a socket, which is clamped with the probe socket, and the lower surface of the socket is fixedly connected with a first elastic band and a second elastic band, the bottom of the first elastic band and the second elastic band are fixedly connected with the upper surface of the second horizontal plate, the upper surface of the second horizontal plate is fixedly connected with a first rotating shaft connecting block and a fourth rotating shaft connecting block, the outer surface of the first rotating shaft connecting block is rotatably connected to the second hydraulic pump through the rotating shaft, the outer surface of the fourth rotating shaft connecting block is rotatably connected to the third hydraulic pump through the rotating shaft, and the lower surface of the socket is fixedly connected with the second rotating shaft A connecting block and a third rotating shaft connecting block, the outer surface of the rotating shaft of the second rotating shaft connecting block is fixedly connected with a first arc column and a second arc column, the left ends of the first arc column and the second arc column are fixedly connected with the outer surface of the rotating shaft of the third rotating shaft connecting block, the first arc column has an outer surface of the second arc column that is slidably connected with a first ferrule and a second ferrule, the output end of the third hydraulic pump is fixedly connected with a first rough surface block, the first rough surface block is clamped with the first ferrule, the output end of the second hydraulic pump is fixedly connected with a second rough surface block, the second rough surface block is clamped with the second ferrule.

[0008] According to the above technical solution, the supporting and protecting mechanism includes a third slider, the third slider is slidably connected to the outer surface of the light bar, the outer surface of the third slider is fixedly connected to the fourth slider, the fourth slider is threadedly connected to the outer surface of the lead screw, the outer surface of the third slider is fixedly connected to the sensor by opening a card slot, the third slider and the top of the fourth slider are fixedly connected to the second box body, the top of the second box body is fixedly connected to the third flexible accordion cover, the top of the third flexible accordion cover is fixedly connected to the lower surface of the first cross plate, the inner wall of the second box body is fixedly connected to the fourth hydraulic pump, the output end of the fourth hydraulic pump is fixedly connected to the seesaw, the inside of the seesaw is provided with a through hole and is rotatably connected to a roller, and the roller is rotatably connected to the inside of the second box body by opening a card slot The fourth slider is dynamically connected, the top of the fourth slider is fixedly connected with a hinge group, the top of the hinge group is rotatably connected with a first arc column, the right end of the first arc column is hinged with a first slot connecting block through an arc hinge, the outer surface of the first slot connecting block is fixedly connected with a second nail-shaped column, the outer surface of the second nail-shaped column is fixedly connected with a second slot connecting block, the second slot connecting block is hinged with a second arc column through an arc groove, the right end of the second arc column is rotatably connected to the right end of the hinge group, the top of the second nail-shaped column is fixedly connected with a third arc column, the lower surface of the third arc column is fixedly connected with two circular columns, the lower surface of the circular column is fixedly connected with a rectangular column, and the rectangular column is fixedly connected to the outer surface of the second nail-shaped column.

[0009] According to the above technical solution, the spring, the first nail-shaped column and the first hydraulic pump are a group of three groups arranged inside the first box body, the length of the first flexible accordion cover is the same as the output length of the first hydraulic pump, the axis of the first box body and the first cross plate are located at the same position, and the synchronous adjustment mechanism is symmetrically arranged in two groups on both sides of the loading base.

[0010] According to the above technical solution, the outer surface of the first rough surface block contacts the inner surfaces of the first arc-shaped column and the second arc-shaped column, the outer surface of the second rough surface block contacts the outer surfaces of the first arc-shaped column and the second arc-shaped column, and the probe seat and the probe angle adjustment mechanism are arranged in a group.

[0011] According to the above technical solution, the outer surface of the rectangular column is in contact with the interior of the second box body, and the seesaw, the roller and the fourth hydraulic pump are arranged on both sides of the hinge group.

[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. This high-efficiency wafer test probe station can realize the simultaneous adjustment of multiple probes by setting a synchronous adjustment mechanism, which greatly shortens the test time. It can also be flexibly adjusted according to different wafer sizes and test requirements to adapt to different test scenarios.

[0013] 2. This type of high-efficiency wafer test probe station, by setting up a probe angle adjustment mechanism, realizes the angle adjustment of the probe by adjusting the angle of the probe seat. When the angle is small, it is beneficial to low resistance testing to reduce the influence of resistance on the test signal. When the angle is large, the angle is adjusted to reduce the influence of the larger angle on the wafer test.

[0014] 3. This type of high-efficiency wafer test probe station, by setting up a support and protection mechanism, jointly supports the probe base with the synchronous adjustment mechanism, and cooperates with the probe angle adjustment mechanism to achieve angle adjustment. When a larger angle affects the wafer test, the wafer is protected from damage and the carrier base and the probe seat are protected. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the main structure of the present invention.

[0016] Figure 2 It is a structural schematic diagram of the synchronous adjustment mechanism of the present invention.

[0017] Figure 3 It is a structural sectional view of the synchronous adjustment mechanism of the present invention.

[0018] Figure 4 It is a structural schematic diagram of the probe angle adjustment mechanism of the present invention.

[0019] Figure 5 It is a structural cross-sectional view of the probe angle adjustment mechanism of the present invention.

[0020] Figure 6 It is a schematic diagram of the partial structure of the probe angle adjustment mechanism of the present invention.

[0021] Figure 7 It is a structural schematic diagram of the supporting and protecting mechanism of the present invention.

[0022] Figure 8 It is a structural cross-sectional view of the supporting and protecting mechanism of the present invention.

[0023] Fig. 9 It is a schematic diagram of the partial structure of the supporting and protecting mechanism of the present invention.

[0024] In the figure: 1. base; 2. loading base; 3. Synchronous adjustment mechanism; 301, lead screw; 302, optical bar; 303, first slider; 304, second slider; 305, first box; 306, first hydraulic pump; 307, first flexible accordion cover; 308, first horizontal plate; 309, first nail-shaped column; 310, spring; 311, second horizontal plate; 312, second flexible accordion cover; 4. Motion control system; 5. Microscope; 6. Probe angle adjustment mechanism; 601, card seat; 602, first elastic band; 603, first rotating shaft connecting block; 604, second hydraulic pump; 605, second rotating shaft connecting block; 606, first arc column; 607, third rotating shaft connecting block; 608, second arc column; 609, second elastic band; 610, fourth rotating shaft connecting block; 611, third hydraulic pump; 612, first rough surface card block; 613, first card sleeve; 614, second rough surface card block; 615, second card sleeve; 7. Probe seat; 8. Stage; 9. Support and protection organizations; 901, third slider; 902, fourth slider; 903, sensor; 904, second housing; 905, third flexible accordion cover; 906, fourth hydraulic pump; 907, seesaw; 908, hinge assembly; 909, first arc column; 910, first card slot connecting block; 911, second arc column; 912, second card slot connecting block; 913, second nail-shaped column; 914, rectangular column; 915, circular column; 916, third arc column; 917, roller. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0026] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Example 1: See Figure 1-Figure 3The present invention provides a technical solution: a high-efficiency wafer test probe station, comprising a base 1, the upper surface of the base 1 is fixedly connected with a carrier base 2 and a motion control system 4, the output end of the motion control system 4 is fixedly connected with a microscope 5, the upper surface of the carrier base 2 is fixedly connected with a stage 8, the internal thread of the base 1 is connected with a synchronous adjustment mechanism 3 and a supporting protection mechanism 9, the top of the synchronous adjustment mechanism 3 is fixedly connected with a probe angle adjustment mechanism 6, the upper surface of the probe angle adjustment mechanism 6 is clamped with a probe seat 7, and also includes: The synchronous adjustment mechanism 3 also includes a lead screw 301, which is arranged in a slot opened on the upper surface of the base 1, and the outer surface of the lead screw 301 is threadedly connected to a first slider 303, and the outer surface of the first slider 303 is fixedly connected to a second slider 304, and the interior of the second slider 304 is slidably connected to a light bar 302, which is arranged in a slot opened on the upper surface of the base 1, and the upper surface of the first slider 303 is fixedly connected to a first box body 305, and the upper surface of the first box body 305 is fixedly connected to a first flexible accordion cover 307.

[0029] The synchronous adjustment mechanism 3 also includes a first hydraulic pump 306, three of which are provided, and the bottom of the first hydraulic pump 306 is fixedly connected to the upper surface of the first slider 303 and the second slider 304, and the output end of the first hydraulic pump 306 is fixedly connected to the first transverse plate 308, and the first nail-shaped column 309 is clamped in the interior of the first transverse plate 308 by opening a clamping slot, and the top of the first nail-shaped column 309 is fixedly connected to the second transverse plate 311, and the lower surface of the second transverse plate 311 is fixedly connected to the spring 310 and the second flexible accordion cover 312, and the bottoms of the spring 310 and the second flexible accordion cover 312 are both fixedly connected to the upper surface of the first transverse plate 308; The spring 310, the first nail-shaped column 309 and the first hydraulic pump 306 are a group of three groups arranged inside the first box 305, the length of the first flexible accordion cover 307 is the same as the output length of the first hydraulic pump 306, the axis of the first box 305 and the first cross plate 308 are located at the same position, and the synchronous adjustment mechanism 3 is symmetrically arranged in two groups on both sides of the carrier base 2. By setting the synchronous adjustment mechanism 3, the first hydraulic pump 306, the first nail-shaped column 309 and the spring 310 can be used to achieve simultaneous adjustment of multiple probe seats 7, which greatly shortens the test time, and the first slider 303 can be flexibly adjusted according to different wafer sizes and test requirements through the screw 301 to adapt to different test scenarios.

[0030] The working principle of this embodiment is as follows: when using the high-efficiency wafer test probe station, the wafer is first loaded on the stage 8, and the wafer is fixed by the carrier base 2. At this time, the position of the microscope 5 is adjusted by the motion control system 4. At this time, the probe is made to contact with the wafer surface by adjusting the probe seat 7, and the wafer test is performed using the microscope 5. After the test is completed, the probe is removed by adjusting the probe seat 7. When the probe seat 7 needs to be adjusted efficiently, the lead screw 301 rotates through the thread rotation to drive the first slider 303 to move, and drives the second slider 304 and the first box body 305 to move, and drives the synchronous adjustment mechanism 3 to move. At the same time, the first hydraulic pump 306 starts to push the first cross plate 308 to move upward, and pushes the second cross plate 311 to move upward through the first nail-shaped column 309, so as to realize the efficient synchronous movement of the probe seat 7, and the first flexible accordion cover 307 and the second flexible accordion cover 312 perform cross-plate and isolation on their parts so that they do not affect the wafer test.

[0031] Example 2: Please refer to Figure 4-Figure 6 On the basis of the first embodiment, the present invention provides a technical solution: the probe angle adjustment mechanism 6 includes a holder 601, the holder 601 is clamped with the probe holder 7, the lower surface of the holder 601 is fixedly connected with a first elastic band 602 and a second elastic band 609, the bottoms of the first elastic band 602 and the second elastic band 609 are fixedly connected with the upper surface of the second horizontal plate 311, the upper surface of the second horizontal plate 311 is fixedly connected with a first rotating shaft connecting block 603 and a fourth rotating shaft connecting block 610, the outer surface of the first rotating shaft connecting block 603 is rotatably connected with the second hydraulic pump 604 through a rotating shaft, the outer surface of the fourth rotating shaft connecting block 610 is rotatably connected with the third hydraulic pump 611 through a rotating shaft, and the lower surface of the holder 601 is fixedly connected with the second rotating shaft The connecting block 605 is connected to the third rotating shaft connecting block 607, and the outer surface of the rotating shaft of the second rotating shaft connecting block 605 is fixedly connected with the first arc column 606 and the second arc column 608. The left ends of the first arc column 606 and the second arc column 608 are fixedly connected to the outer surface of the rotating shaft of the third rotating shaft connecting block 607. The outer surface of the first arc column 606 and the second arc column 608 are slidably connected with the first clamping sleeve 613 and the second clamping sleeve 615. The output end of the third hydraulic pump 611 is fixedly connected with the first rough surface clamping block 612, and the first rough surface clamping block 612 is clamped with the first clamping sleeve 613. The output end of the second hydraulic pump 604 is fixedly connected with the second rough surface clamping block 614, and the second rough surface clamping block 614 is clamped with the second clamping sleeve 615. The outer surface of the first rough surface block 612 contacts the inner surfaces of the first arc column 606 and the second arc column 608, and the outer surface of the second rough surface block 614 contacts the outer surfaces of the first arc column 606 and the second arc column 608. The probe seat 7 and the probe angle adjustment mechanism 6 are arranged in a group. By setting the probe angle adjustment mechanism 6, the angle adjustment of the probe seat 7 is achieved through the cooperation of the second hydraulic pump 604 and the third hydraulic pump 611 to achieve the angle adjustment of the probe. When the angle is small, it is beneficial to low resistance testing to reduce the influence of resistance on the test signal. When the angle is large, the angle is adjusted to reduce the influence of the large angle on wafer testing.

[0032] The working principle of this embodiment is: by adjusting the angle, the probe seat 7 is efficiently moved and the test effect is improved. At this time, the second hydraulic pump 604 is started to push the second rough surface block 614 to move, and the second rough surface block 614 pushes the second clamping sleeve 615 to rotate on the outer surface of the first arc column 606 and the second arc column 608. At this time, the second rough surface block 614 is in contact with the outer surface of the first arc column 606 and the second arc column 608, so that it cannot rotate, thereby driving the first arc column 606 and the second arc column 608 to move, and the first shaft connecting block 603 changes the movement. In order to rotate around its axis, the third hydraulic pump 611 is not started at this time, so the first sleeve 613 is rotated on the outer surface of the first arc column 606 and the second arc column 608, and the first rough surface block 612 is rotated around the axis of the fourth axis connecting block 610. At this time, the angle of the holder 601 is changed by the rotation of the first arc column 606 and the second arc column 608, so that it rotates clockwise, and the angle between the probe seat 7 and the wafer surface is increased. If a smaller angle needs to be adjusted, the third hydraulic pump 611 is started, and the second hydraulic pump 604 is stopped to rotate it counterclockwise to reduce the angle.

[0033] Example 3: Please refer to Figure 7-Figure 9On the basis of the first and second embodiments, the present invention provides a technical solution: the supporting and protecting mechanism 9 includes a third slider 901, the third slider 901 is slidably connected to the outer surface of the light bar 302, the outer surface of the third slider 901 is fixedly connected to the fourth slider 902, the fourth slider 902 is threadedly connected to the outer surface of the lead screw 301, the outer surface of the third slider 901 is fixedly connected to the sensor 903 through a slot, the third slider 901 and the top of the fourth slider 902 are fixedly connected to the second box 904, the top of the second box 904 is fixedly connected to the third flexible accordion cover 905, the top of the third flexible accordion cover 905 is fixedly connected to the lower surface of the first horizontal plate 308, the inner wall of the second box 904 is fixedly connected to the fourth hydraulic pump 906, the output end of the fourth hydraulic pump 906 is fixedly connected to the seesaw 907, the inside of the seesaw 907 is provided with a through hole and is rotatably connected to a roller 917, the roller 917 is connected to the second box 90 4 is rotatably connected by opening a card slot, the top of the fourth slider 902 is fixedly connected with a hinge group 908, the top of the hinge group 908 is rotatably connected with a first arc column 909, the right end of the first arc column 909 is hinged with a first card slot connection block 910 through an arc hinge, the outer surface of the first card slot connection block 910 is fixedly connected with a second nail-shaped column 913, the outer surface of the second nail-shaped column 913 is fixedly connected with a second card slot connection block 912, and the second card slot The connecting block 912 is hinged with a second curved column 911 through an arc groove, the right end of the second curved column 911 is rotatably connected to the right end of the hinge group 908, the top of the second nail-shaped column 913 is fixedly connected to a third curved column 916, the lower surface of the third curved column 916 is fixedly connected to two circular columns 915, the lower surface of the circular column 915 is fixedly connected to a rectangular column 914, and the rectangular column 914 is fixedly connected to the outer surface of the second nail-shaped column 913; The outer surface of the rectangular column 914 is in contact with the interior of the second box body 904, and the seesaw 907, the roller 917 and the fourth hydraulic pump 906 are arranged on both sides of the hinge group 908. By setting a supporting protection mechanism 9, the probe seat 7 is supported together with the synchronous adjustment mechanism 3, and cooperates with the probe angle adjustment mechanism 6. When the angle adjustment is achieved by the fourth hydraulic pump 906, the seesaw 907 and the roller 917, when a larger angle affects the wafer test, the wafer is protected from damage, and the carrier base 2 and the probe seat 7 are protected.

[0034] The working principle of this embodiment is as follows: during use, the wafer, the carrier base 2 and the probe seat 7 need to be protected. When protection is required, the sensor 903 senses a signal, starts the fourth hydraulic pump 906, pushes the seesaw 907 to rotate around the outer surface of the roller 917, pushes the compression of the hinge group 908, moves the hinge group 908 upward, and drives the first arc column 909 and the second arc column 911 to rotate around the rotating shaft of the hinge group 908. The first arc column 909 and the second arc column 911 drive the first slot connection block 910 and the second slot through the hinge. The connecting block 912 moves upward, driving the second nail-shaped column 913 to move upward, pushing the rectangular column 914 and the circular column 915 to move together, driving the third arc-shaped column 916 to move upward, and driving the probe seat 7 to move upward away from the wafer and the carrier base 2 by pushing the synchronous adjustment mechanism 3. When the sensor 903 senses, the motion control system 4 starts and the microscope 5 moves away from the carrier base 2. The screw 301 starts and drives the synchronous adjustment mechanism 3, the probe angle adjustment mechanism 6 and the support protection mechanism 9 away from the carrier base 2, thereby protecting the probe seat 7, the wafer and the carrier base 2.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0036] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-efficiency wafer test probe station, comprising a base (1), the upper surface of the base (1) is fixedly connected to a carrier base (2) and a motion control system (4), the output end of the motion control system (4) is fixedly connected to a microscope (5), the upper surface of the carrier base (2) is fixedly connected to a stage (8), the internal thread of the base (1) is connected to a synchronous adjustment mechanism (3) and a supporting protection mechanism (9), the top of the synchronous adjustment mechanism (3) is fixedly connected to a probe angle adjustment mechanism (6), and the upper surface of the probe angle adjustment mechanism (6) is clamped with a probe seat (7), characterized in that: Also includes: The synchronous adjustment mechanism (3) further comprises a lead screw (301), wherein the lead screw (301) is arranged in a slot provided on the upper surface of the base (1), a first slider (303) is threadedly connected to the outer surface of the lead screw (301), a second slider (304) is fixedly connected to the outer surface of the first slider (303), a light bar (302) is slidably connected to the interior of the second slider (304), the light bar (302) is arranged in a slot provided on the upper surface of the base (1), a first box (305) is fixedly connected to the upper surface of the first slider (303), and a first flexible accordion cover (307) is fixedly connected to the upper surface of the first box (305).

2. A high-efficiency wafer test probe station according to claim 1, characterized in that: The synchronous adjustment mechanism (3) further comprises a first hydraulic pump (306), three of which are provided, and the bottom of each of the first hydraulic pumps (306) is fixedly connected to the upper surfaces of the first slider (303) and the second slider (304), the output end of the first hydraulic pump (306) is fixedly connected to a first transverse plate (308), the interior of the first transverse plate (308) is clamped with a first nail-shaped column (309) via a clamping slot, the top of the first nail-shaped column (309) is fixedly connected to a second transverse plate (311), the lower surface of the second transverse plate (311) is fixedly connected to a spring (310) and a second flexible accordion cover (312), and the bottoms of the spring (310) and the second flexible accordion cover (312) are both fixedly connected to the upper surface of the first transverse plate (308).

3. The high-efficiency wafer test probe station according to claim 1, characterized in that: The probe angle adjustment mechanism (6) comprises a clamping seat (601), wherein the clamping seat (601) is clamped with the probe seat (7); the lower surface of the clamping seat (601) is fixedly connected with a first elastic band (602) and a second elastic band (609); the bottoms of the first elastic band (602) and the second elastic band (609) are fixedly connected with the upper surface of the second transverse plate (311); the upper surface of the second transverse plate (311) is fixedly connected with a first rotating shaft connecting block (603) and a fourth rotating shaft connecting block (610); the outer surface of the first rotating shaft connecting block (603) is rotatably connected with a second hydraulic pump (604) via a rotating shaft; the outer surface of the fourth rotating shaft connecting block (610) is rotatably connected with a third hydraulic pump (611) via a rotating shaft; the lower surface of the clamping seat (601) is fixedly connected with a second rotating shaft connecting block (605) and a third rotating shaft connecting block (606); A shaft connecting block (607), the outer surface of the shaft of the second shaft connecting block (605) is fixedly connected with a first arc column (606) and a second arc column (608), the left ends of the first arc column (606) and the second arc column (608) are fixedly connected with the outer surface of the shaft of the third shaft connecting block (607), the outer surface of the first arc column (606) and the second arc column (608) are slidably connected with a first clamping sleeve (613) and a second clamping sleeve (615), the output end of the third hydraulic pump (611) is fixedly connected with a first rough surface clamping block (612), the first rough surface clamping block (612) is clamped with the first clamping sleeve (613), the output end of the second hydraulic pump (604) is fixedly connected with a second rough surface clamping block (614), the second rough surface clamping block (614) is clamped with the second clamping sleeve (615).

4. The high-efficiency wafer test probe station according to claim 1, characterized in that: The supporting and protecting mechanism (9) comprises a third slider (901), the third slider (901) is slidably connected to the outer surface of the optical rod (302), the outer surface of the third slider (901) is fixedly connected to a fourth slider (902), the fourth slider (902) is threadedly connected to the outer surface of the lead screw (301), the outer surface of the third slider (901) is fixedly connected to a sensor (903) via a slot, the top of the third slider (901) and the fourth slider (902) are fixedly connected to a second box (904), The top of the second box (904) is fixedly connected to a third flexible accordion cover (905), the top of the third flexible accordion cover (905) is fixedly connected to the lower surface of the first horizontal plate (308), the inner wall of the second box (904) is fixedly connected to a fourth hydraulic pump (906), the output end of the fourth hydraulic pump (906) is fixedly connected to a seesaw (907), the seesaw (907) has a through hole inside and is rotatably connected to a roller (917), the roller (917) is connected to the inside of the second box (904) by a card opening The fourth slider (902) is rotatably connected to the top of the fourth slider (902), the top of the hinge group (908) is rotatably connected to the first arc-shaped column (909), the right end of the first arc-shaped column (909) is hinged to the first slot connection block (910) through an arc hinge, the outer surface of the first slot connection block (910) is fixedly connected to the second nail-shaped column (913), the outer surface of the second nail-shaped column (913) is fixedly connected to the second slot connection block (912), and the second slot connection block (91 2) A second curved column (911) is hingedly connected via an arc groove, the right end of the second curved column (911) is rotatably connected to the right end of the hinge group (908), the top of the second nail-shaped column (913) is fixedly connected to a third curved column (916), the lower surface of the third curved column (916) is fixedly connected to two circular columns (915), the lower surface of the circular column (915) is fixedly connected to a rectangular column (914), and the rectangular column (914) is fixedly connected to the outer surface of the second nail-shaped column (913).

5. The high-efficiency wafer testing probe station according to claim 2, characterized in that: The spring (310), the first nail-shaped column (309) and the first hydraulic pump (306) form a group and are arranged in three groups inside the first box (305). The length of the first flexible accordion cover (307) is the same as the output length of the first hydraulic pump (306). The axes of the first box (305) and the first horizontal plate (308) are located at the same position. The synchronous adjustment mechanism (3) is symmetrically arranged in two groups on both sides of the loading base (2).

6. The high-efficiency wafer testing probe station according to claim 3, characterized in that: The outer surface of the first rough surface block (612) contacts the inner surfaces of the first curved column (606) and the second curved column (608), the outer surface of the second rough surface block (614) contacts the outer surfaces of the first curved column (606) and the second curved column (608), and the probe seat (7) and the probe angle adjustment mechanism (6) are arranged in a group.

7. The high-efficiency wafer testing probe station according to claim 4, characterized in that: The outer surface of the rectangular column (914) is in contact with the interior of the second box body (904), and the seesaw (907), the roller (917) and the fourth hydraulic pump (906) are arranged on both sides of the hinge group (908).

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