Chip yield detection method and system, computer equipment and computer readable storage medium

Abstract

The invention relates to the technical field of chip detection, in particular to a chip yield detection method and system, computer equipment and a computer readable storage medium, and the method comprises the following steps: identifying a test SNP file of each device on a wafer, and converting the SNP file into test data; customizing an SPEC file, wherein the custom content of the SPEC file comprises a dB value, test items, and a maximum value and a minimum value under each test item; reading test data, correspondingly calculating a test value under each test item according to the test items defined by the SPEC file, comparing the test value with the maximum value and the minimum value under the corresponding test item to obtain a test result of each test item, and judging whether the device is qualified or not according to the test result of each test item; calculating the yield of the whole wafer according to the qualified state of each device, and outputting a yield data file; according to the invention, automatic detection and statistics are realized, the universality is high, and the reliability of yield detection and statistics is high.

Description

Technical Field

[0001] The present invention relates to the field of chip detection technology, and in particular to a chip yield detection method and system, computer equipment, and computer-readable storage medium. Background Art

[0002] As the core device of intelligent equipment, the performance of the chip determines the working performance of the intelligent equipment. In order to detect the performance of the chip, various tests need to be performed on all devices on the chip wafer, which involves the problem of yield statistics. Since there are a large number of devices on the wafer, if the traditional method is used for manual detection and yield statistics, the workload is obviously huge, and the reliability of the statistical results is difficult to guarantee. At present, there are also special detection methods to realize the automatic detection and statistics of chip yield. Since the result presented when the device on the wafer is tested is a waveform, the dB value needs to be set before the yield detection. In order to ensure that the set dB value has a corresponding frequency point on the waveform, the dB value set by the existing detection method usually defaults to the maximum dB value or the minimum dB value in the waveform, but the maximum dB value and the minimum dB value will cause a large fluctuation range with the fluctuation of the device production process. Especially for filter products, the frequency corresponding to the maximum value often fluctuates greatly, resulting in large errors in the test results under the test items and poor versatility, thereby affecting the reliability of yield detection and statistics. Summary of the invention

[0003] The technical problem to be solved by the present invention is: to overcome the deficiencies in the prior art and to provide a chip yield detection method and system, computer equipment, and computer-readable storage medium that have automatic detection and statistics, strong versatility, and high reliability in yield detection and statistics.

[0004] The technical solution adopted by the present invention to solve the technical problem is: a chip yield detection method, the steps are as follows:

[0005] S1, identify the SNP files of each device on the wafer and convert the SNP files into test data;

[0006] S2. Customize the SPEC file. The custom content of the SPEC file includes dB value, test items, and the maximum and minimum values ​​of each test item.

[0007] S3, read the test data, calculate the test value under each test item according to the test items defined in the SPEC file, and compare the test value with the maximum and minimum values ​​under the corresponding test item to obtain the test result of each test item, and determine whether the device is qualified according to the test result of each test item;

[0008] S4. Calculate the yield of the entire wafer according to the qualified status of each device in step S3, and output a yield data file.

[0009] Furthermore, the custom rules for the dB value are as follows:

[0010] Get the maximum dB value in the SNP file, set the preset dB value, add the maximum dB value and the preset dB value to get the custom dB value. If the custom dB value has a corresponding dB value in the SNP file, determine the frequency point corresponding to the dB value; if the custom dB value does not have a corresponding dB value in the SNP file, perform linearization.

[0011] Furthermore, the steps of the linearization process are as follows:

[0012] Taking the custom dB value as the base point, in the test data converted from the SNP file, the frequency point is searched towards the low frequency / high frequency according to the rules defined in the test item, and two positive and negative adjacent frequency points A and B of the custom dB value are obtained, where the dB value of frequency point A is less than the custom dB value, and the dB value of frequency point B is greater than the custom dB value; linearization is performed with frequency points A and B as endpoints, and the frequency point corresponding to the custom dB value is calculated according to the linearization function.

[0013] Furthermore, the test items include minimum insertion loss, left shoulder frequency, right shoulder frequency, bandwidth and center frequency.

[0014] Furthermore, if the test value of the test item in step S3 is between the minimum value and the maximum value of the test item, the test result of the test item is PASS; otherwise, the test result is FAIL.

[0015] Furthermore, when the test results of all the test items of the device on the wafer in step S4 are PASS, the device is qualified; otherwise, the device is unqualified.

[0016] A chip yield detection system, comprising:

[0017] A data conversion module is used to identify the SNP files of each device on the wafer and convert the SNP files into test data;

[0018] Custom module, used to define dB value, test items, maximum and minimum values ​​of each test item in SPEC file;

[0019] The yield output module is used to calculate the test value under each test item according to the test items defined in the SPEC file, and compare the test value with the maximum and minimum values ​​under the corresponding test item to obtain the test result of each test item. It determines whether each device on the wafer is qualified according to the test results of all test items under each device, and then calculates the yield of the entire wafer according to the qualified status of each device, and outputs the yield data file.

[0020] A computer device comprises a memory and a processor, wherein a computer program is set in the memory, and the processor executes the above-mentioned chip yield detection method by calling the computer program.

[0021] A computer-readable storage medium stores a computer program, which executes the above-mentioned chip yield detection method when called by a processor.

[0022] The beneficial effects of the present invention are:

[0023] (1) The present invention calculates the test value under each test item from the test items customized in the SPEC file, and compares the test value with the maximum value and the minimum value under the corresponding test item to obtain the test result of each test item. It determines whether the device is qualified according to the test results of all the test items of the device. Finally, it calculates the yield of the whole wafer according to the qualified status of each device, and outputs the yield data file. The detection and statistics of chip yield are automated and highly reliable.

[0024] (2) The dB value in the present invention can be customized, and the maximum dB value or the minimum dB value in the waveform diagram is no longer selected by default. It is customizable, and combined with linearization processing, it is ensured that the customized dB value always has a corresponding frequency point on the waveform diagram, which reduces the fluctuation amplitude, reduces the test error, makes the calculation result more precise, and thus makes the yield result more accurate.

[0025] (3) The SPEC file in the present invention can be customized to facilitate the processing of multiple test items. The same SNP file can be simulated multiple times to obtain yield data under different SPEC files. In addition, specific functions are implemented by defining different characters in the SPEC file, such as different calculation modes and frequency values ​​under different dB. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0027] Figure 1 is a flow chart of the chip yield detection method of the present invention;

[0028] Figure 2 It is a schematic diagram of the linearization processing of the custom dB value in the present invention. DETAILED DESCRIPTION

[0029] The present invention will now be further described in conjunction with the accompanying drawings and preferred embodiments. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0030] Example 1

[0031] like Figure 1As shown, a chip yield detection method, the steps are as follows:

[0032] S1, identify the SNP files of each device on the wafer and convert the SNP files into test data;

[0033] S2. Customize the SPEC file. The custom content of the SPEC file includes dB value, test items, and the maximum and minimum values ​​of each test item.

[0034] S3, read the test data, calculate the test value under each test item according to the test items defined in the SPEC file, and compare the test value with the maximum and minimum values ​​under the corresponding test item to obtain the test result of each test item, and determine whether the device is qualified according to the test result of each test item;

[0035] S4. Calculate the yield of the entire wafer according to the qualified status of each device in step S3, and output a yield data file.

[0036] The test items customized by the SPEC file calculate the test values ​​under each test item accordingly, and compare the test values ​​with the maximum and minimum values ​​under the corresponding test items to obtain the test results of each test item. The device is judged whether it is qualified based on the test results of all test items of the device. Finally, the yield of the entire wafer is calculated based on the qualified status of each device, and the yield data file is output. The detection and statistics of chip yield are automated and highly reliable. At the same time, SPEC files can be customized to facilitate the processing of multiple test items. The same SNP file can be simulated multiple times to obtain yield data under different SPEC files, and specific functions are implemented through the definition of different characters in the SPEC file, such as different calculation modes and frequency values ​​under different dB.

[0037] Specifically, the SNP file contains the waveform diagram of each device, which can be converted into test data through MATLAB software; the test items include minimum insertion loss, left shoulder frequency, right shoulder frequency, bandwidth and center frequency; the yield data file includes the yield of all test items and the yield of the wafer.

[0038] The custom rules for dB values ​​are as follows:

[0039] Get the maximum dB value in the SNP file, set the preset dB value, add the maximum dB value and the preset dB value to get the custom dB value. If the custom dB value has a corresponding dB value in the SNP file, determine the frequency point corresponding to the dB value; if the custom dB value does not have a corresponding dB value in the SNP file, perform linearization.

[0040] The dB value can be customized. The maximum dB value or minimum dB value in the waveform is no longer selected by default. It is customizable and combined with linear processing to ensure that the customized dB value always has a corresponding frequency point on the waveform, reducing the fluctuation amplitude, reducing the test error, making the calculation result more precise, and thus making the yield result more accurate.

[0041] It should be noted that the custom dB value should be selected in the steeper area of ​​the waveform as much as possible, so as to further reduce the fluctuation amplitude of the frequency value.

[0042] The steps of linearization are as follows:

[0043] Taking the custom dB value as the base point, in the test data converted from the SNP file, the frequency point is searched towards the low frequency / high frequency according to the rules defined in the test item, and two positive and negative adjacent frequency points A and B of the custom dB value are obtained, where the dB value of frequency point A is less than the custom dB value, and the dB value of frequency point B is greater than the custom dB value; linearization is performed with frequency points A and B as endpoints, and the frequency point corresponding to the custom dB value is calculated according to the linearization function.

[0044] Combine the following Figure 2 Specific description of linearization processing:

[0045] Figure 2 There are several frequency points corresponding to several test data, and the maximum dB value is -1dB: if the preset dB value is -4dB, the custom dB value is -5dB. Obviously, the custom dB value has a corresponding dB value in the SNP file, so the frequency point corresponding to the dB value is determined; if the preset dB value is -5dB, the custom dB value is -6dB. Obviously, the custom dB value does not have a corresponding dB value in the SNP file, so linearization is performed with frequency point A and frequency point B as endpoints, and the frequency point corresponding to the custom dB value is calculated according to the linearization function.

[0046] If the test value of the test item in step S3 is between the minimum value and the maximum value under the test item, the test result of the test item is PASS; otherwise, the test result is FAIL.

[0047] When the test results of all the test items of the device on the wafer in step S4 are PASS, the device is qualified; otherwise, the device is unqualified.

[0048] Example 2

[0049] A chip yield detection system, comprising:

[0050] A data conversion module is used to identify the SNP files of each device on the wafer and convert the SNP files into test data;

[0051] Custom module, used to define dB value, test items, maximum and minimum values ​​of each test item in SPEC file;

[0052] The yield output module is used to calculate the test value under each test item according to the test items defined in the SPEC file, and compare the test value with the maximum and minimum values ​​under the corresponding test item to obtain the test result of each test item. It determines whether each device on the wafer is qualified according to the test results of all test items under each device, and then calculates the yield of the entire wafer according to the qualified status of each device, and outputs the yield data file.

[0053] Example 3

[0054] A computer device includes a memory and a processor. The memory is provided with a computer program. The processor executes the chip yield detection method in Example 1 by calling the computer program.

[0055] Example 4

[0056] A computer-readable storage medium stores a computer program, and when the computer program is called by a processor, the chip yield detection method in Example 1 is executed.

[0057] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. They cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip yield detection method, characterized in that: Here are the steps: S1, identify the SNP files of each device on the wafer and convert the SNP files into test data; S2. Customize the SPEC file. The custom content of the SPEC file includes dB value, test items, and the maximum and minimum values ​​of each test item. S3, read the test data, calculate the test value under each test item according to the test items defined in the SPEC file, and compare the test value with the maximum and minimum values ​​under the corresponding test item to obtain the test result of each test item, and determine whether the device is qualified according to the test result of each test item; S4. Calculate the yield of the entire wafer according to the qualified status of each device in step S3, and output a yield data file.

2. The chip yield detection method according to claim 1, characterized in that: The custom rules for the dB value are as follows: Get the maximum dB value in the SNP file, set the preset dB value, add the maximum dB value and the preset dB value to get the custom dB value. If the custom dB value has a corresponding dB value in the SNP file, determine the frequency point corresponding to the dB value; if the custom dB value does not have a corresponding dB value in the SNP file, perform linearization.

3. The chip yield detection method according to claim 2, characterized in that: The steps of the linearization process are as follows: Taking the custom dB value as the base point, in the test data converted from the SNP file, the frequency point is searched towards the low frequency / high frequency according to the rules defined in the test item, and two positive and negative adjacent frequency points A and B of the custom dB value are obtained, where the dB value of frequency point A is less than the custom dB value, and the dB value of frequency point B is greater than the custom dB value. Linearization is performed with frequency points A and B as endpoints, and the frequency point corresponding to the custom dB value is calculated according to the linearization function.

4. The chip yield detection method according to claim 1, characterized in that: The test items include minimum insertion loss, left shoulder frequency, right shoulder frequency, bandwidth and center frequency.

5. The chip yield detection method according to claim 1, characterized in that: If the test value of the test item in step S3 is between the minimum value and the maximum value of the test item, the test result of the test item is PASS; otherwise, the test result is FAIL.

6. The chip yield detection method according to claim 5, characterized in that: When the test results of all the test items of the device on the wafer in the step S4 are PASS, the device is qualified; otherwise, the device is unqualified.

7. A chip yield detection system, characterized in that: include A data conversion module is used to identify the SNP files of each device on the wafer and convert the SNP files into test data; Custom module, used to define dB value, test items, maximum and minimum values ​​of each test item in SPEC file; The yield output module is used to calculate the test value under each test item according to the test items defined in the SPEC file, and compare the test value with the maximum and minimum values ​​under the corresponding test item to obtain the test result of each test item. It determines whether each device on the wafer is qualified according to the test results of all test items under each device, and then calculates the yield of the entire wafer according to the qualified status of each device, and outputs the yield data file.

8. A computer device, characterized in that: It comprises a memory and a processor, wherein the memory is provided with a computer program, and the processor executes the chip yield detection method according to any one of claims 1 to 6 by calling the computer program.

9. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is called by a processor, the chip yield detection method according to any one of claims 1 to 6 is executed.

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