Thermal management system of quantum computer

Abstract

The invention relates to the field of computer thermal management, and provides a thermal management system of a quantum computer, which comprises a flexible heat conduction module, a thermal diode module and a heat balance module. And the flexible heat conduction module can seal heat in the module, so that the influence on the environment is reduced. One end of the thermal diode module is connected with the flexible heat conduction module, the thermal diode module can achieve one-way conduction of heat, and unnecessary heat loss is reduced. The middle layer of the heat balance module is provided with multiple closed flow channels used for storing cooling liquid and achieving the cooling function, and the top layer of the heat balance module is provided with a multi-fin type heat dissipation structure used for dissipating heat to the outside. According to the thermal management system, the situation that a traditional thermal management system can only dissipate heat and cannot supplement heat is changed through the micro heating module. When the environment temperature is too high, heat can be automatically taken away, and the temperature of the quantum computer is reduced. And when the environment temperature is too low, heat can be automatically supplemented, so that the temperature meets the operation requirement.

Description

Technical Field

[0001] The present application relates to the field of computer thermal management, and in particular to a thermal management system for a quantum computer. Background Art

[0002] Quantum computers are mainly composed of quantum registers, quantum measurement devices, control systems and other components. The computing system generates a lot of heat due to high speed, high frequency and high load. High temperature seriously restricts the computing power of the processor, and high temperature will also affect the operating accuracy of the optical components inside the quantum computer.

[0003] Therefore, thermal management of quantum computers is a very urgent measure that can significantly improve their performance. This system can ensure that the quantum computer is always in a suitable temperature range. When the ambient temperature is too high, it can automatically take away the heat and reduce the temperature of the quantum computer. At the same time, too low an ambient temperature will also affect the operating performance of the quantum computer. For example, in a low temperature environment, the carrier (electron and hole) migration rate of the semiconductor material in the quantum computer chip will decrease, which will directly affect its computing power.

[0004] Existing thermal management methods such as air cooling and liquid cooling still have problems such as high noise, high requirements for the sealing performance of the device, and inability to replenish heat under low temperature conditions. Quantum computers involve a large number of precision optical devices and special semiconductor components, which require stable ambient temperature, high heat dissipation efficiency and little impact on the computer. Therefore, a new type of thermal management system is needed to ensure the normal use of quantum computers. Summary of the invention

[0005] The present application aims to solve the problems of existing thermal management methods such as air cooling, liquid cooling, etc., which still have large noise, high requirements on the sealing performance of the device, and cannot replenish heat under low temperature conditions. A thermal management system for a quantum computer is provided, including: a flexible thermal conductive module, a thermal diode module and a heat balancing module; One end of the flexible heat-conducting module is provided with an interface matching the heat source of the quantum computer, and the other end is provided with a standard buckle, and the flexible heat-conducting module is buckled with one end of the thermal diode module through the buckle; The thermal diode module material is a phonon thermal conductivity material with an asymmetric structure; The heat balancing module comprises a connecting layer, a heat absorbing layer and a heat dissipating layer, wherein the heat absorbing layer is arranged between the connecting layer and the heat dissipating layer; The connection layer is provided with a groove, and the other end of the thermal diode module is embedded in the groove; The interior of the heat absorption layer is filled with cooling liquid.

[0006] In a feasible implementation, the flexible heat-conducting module is provided with a heat shielding layer, and the heat shielding layer is a double-layer structure filled with aerogel.

[0007] In a feasible implementation, the flexible heat-conducting module further includes an inner layer, the inner layer is adhered to the inner surface of the heat shielding layer, and the material of the inner layer is graphene powder and an adhesive.

[0008] In a feasible implementation, the outer layer of the heat shielding layer is made of metal.

[0009] In a feasible implementation, a curved channel is provided inside the heat absorption layer, both ends of the curved channel are closed, and the coolant is stored in the curved channel.

[0010] In a feasible implementation, the coolant is a fluorinated liquid, and the specific heat capacity of the fluorinated liquid is: 1.0~1.5KJ / Kg℃.

[0011] In a feasible implementation, the heat dissipation layer is provided with a plurality of heat dissipation columns, the heat dissipation columns are fixed on the upper surface of the heat absorption layer, and a plurality of fins are fixed on the heat dissipation columns.

[0012] In a feasible implementation, it further includes a micro heating module, which is fixed on the flexible heat-conducting module and disposed between the interface and the buckle; The micro heat generating module is configured to heat the quantum computer row.

[0013] In a feasible implementation, it further includes a temperature monitoring module, and the temperature monitoring module is electrically connected to the micro heating module; The temperature monitoring module is configured to detect the ambient temperature of the quantum computer, obtain ambient temperature data, and send the ambient temperature data to the micro heating module; The micro heating module is further configured to receive the ambient temperature data, compare the ambient temperature data with a preset temperature, and start heating when the ambient temperature data is lower than the preset temperature; When the ambient temperature data is higher than or equal to the preset temperature, heating is stopped.

[0014] In a feasible implementation, the temperature monitoring module is composed of a plurality of miniature high-resolution sensors.

[0015] The present application provides a thermal management system for a quantum computer, which can perform all-round environmental monitoring and heat management on the quantum computer. The micro-heating module changes the situation that the traditional thermal management system can only dissipate heat but cannot replenish heat. When the ambient temperature is too high, the heat can be automatically taken away to reduce the temperature of the quantum computer. When the ambient temperature is too low, the heat can be automatically replenished so that the temperature meets the operating requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the implementation of the present invention, and together with the specification are used to explain the principles of the embodiments of the present invention. Obviously, the accompanying drawings described below are only some embodiments of the implementation of the present invention, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0017] Figure 1 is a schematic diagram of a thermal management system of a quantum computer shown in an exemplary embodiment of the present application; Figure 2 is a schematic structural diagram of a flexible heat-conducting module shown in an exemplary embodiment of the present application; Figure 3 yes Figure 2 sectional view of Figure 4 yes Figure 2 Stereoscopic image of Figure 5 is a schematic structural diagram of a thermal diode module shown in an exemplary embodiment of the present application; Figure 6 yes Figure 5 sectional view of Figure 7 yes Figure 5 Stereoscopic image of Figure 8 is a structural schematic diagram of a heat balancing module shown in an exemplary embodiment of the present application; Fig. 9 yes Figure 8 A cross-section of one side; Fig.10 yes Figure 8 Cross-section of the other side.

[0018] Notes on the attached drawings: 100-flexible thermal conductive module; 200-thermal diode module; 300-heat balancing module; 400-temperature monitoring module; 500-micro heating module; 110-thermal shielding layer; 120-inner layer; 310-connecting layer; 320-heat absorbing layer; 330-heat dissipation layer; 331-heat dissipation column; 332-fins. DETAILED DESCRIPTION

[0019] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that the embodiments of the present invention will be more comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to provide a full understanding of the implementation of the embodiments of the present invention.

[0020] Quantum computers are mainly composed of quantum registers, quantum measurement devices, control systems and other components. The computing system generates a lot of heat due to high speed, high frequency and high load. High temperature seriously restricts the computing power of the processor, and high temperature will also affect the operating accuracy of the optical components inside the quantum computer. At the same time, too low ambient temperature will also affect the operating performance of the quantum computer. For example, in a low temperature environment, the carrier (electron and hole) migration rate of the semiconductor material in the quantum computer chip will decrease, which will directly affect its computing power.

[0021] Therefore, thermal management of quantum computers is a very urgent measure that can significantly improve their performance. This system can ensure that the quantum computer is always in a suitable temperature range. When the ambient temperature is too high, it can automatically take away the heat and reduce the temperature of the quantum computer. When the ambient temperature is too low, it can automatically add heat to make the temperature meet the operating requirements.

[0022] Existing quantum computer thermal management usually uses the following solutions: Air-cooled convection heat dissipation mainly uses the airflow generated by the rotation of the fan to take away the heat from the surface of the heating component, relying on the heat exchange between the air and the surface of the heat source to take away the heat, thereby reducing the temperature. The advantages of this solution are low cost, simple structure and easy maintenance. However, it has many disadvantages and is demanding on the environment. When the equipment is dusty, its heat dissipation performance will be seriously affected. At the same time, the heat dissipation efficiency is low, and the fan is noisy when running. The noise generated by the fan when running is essentially a mechanical wave. When these waves are transmitted to the optical instrument, it will cause the instrument to vibrate, thereby affecting the operating efficiency of the quantum computer.

[0023] Air cooling can only meet the cooling requirements. When the quantum computer is in a low temperature condition, it cannot provide thermal compensation for the computer. Therefore, air cooling does not meet the functional requirements for computer thermal management.

[0024] There are two main ways to achieve liquid cooling. The first is indirect liquid cooling, which is to enclose the cooling medium in a closed pipe or heat dissipation module. After the cooling medium absorbs heat, the heat is transferred to the external radiator for dissipation. Or directly immerse the heat-generating components in the coolant and rely on the coolant to absorb heat. The advantages of this solution are high heat dissipation efficiency and long service life. The disadvantages are high requirements for system sealing and complex structure. And it is impossible to perform thermal compensation for quantum computers in low-temperature conditions. Therefore, this solution also cannot meet the thermal management needs of quantum computers.

[0025] In summary, the current traditional thermal management methods are not suitable for the thermal management of quantum computers. Because quantum computers involve a large number of precision optical devices and special semiconductor components, they require a stable ambient temperature. Therefore, a new type of thermal management system is needed to ensure the normal use of quantum computers.

[0026] In order to solve the above problems, the present application embodiment provides a thermal management system for a quantum computer, referring to Figure 1 As shown, it includes: a flexible thermal conductive module 100, a thermal diode module 200 and a heat balancing module 300; one end of the flexible thermal conductive module 100 is equipped with an interface that fits tightly with various precision optical devices and special semiconductor components inside the quantum computer. This customized interface ensures the directness and efficiency of heat conduction and reduces the loss during heat transfer. The other end adopts a standard snap-on design, which is convenient for quick installation and removal, and also ensures a stable connection with the thermal diode module 200.

[0027] The main function of the flexible heat conduction module 100 is to quickly and effectively conduct the heat generated inside the quantum computer to the next link in the thermal management system. Its flexible characteristics enable it to adapt to the complex and compact layout inside the quantum computer, ensuring the continuity and integrity of the heat transfer path.

[0028] The material of the thermal diode module 200 is a phonon thermal conductivity material with an asymmetric structure. Figure 5-Figure 7 As shown, the thermal diode module 200 is made of a phonon thermal conductivity material with an asymmetric structure. Phonon thermal conductivity refers to the ability of a material to transfer heat through phonons. The asymmetric structure means that the material has different thermal conductivities in different directions, thereby allowing heat to be efficiently transferred in one direction.

[0029] Specifically, in this material, the scattering mechanism of phonons (energy quanta of lattice vibration) is different in two directions. When heat is transferred from one direction, phonons can pass through the material relatively smoothly; when heat is transferred from the opposite direction, phonons are strongly scattered, which greatly hinders the reverse transfer of heat. When the temperature of the quantum computer is too high, the heat is transferred to the heat balance module to release the heat to reduce the temperature. When the external temperature is too high, the heat is transferred from the outside to the thermal diode module 200. The thermal diode module 200 has the characteristic of unidirectional conduction, which will block the transfer of heat and reduce the heat interference of the external environment on the quantum computer.

[0030] The thermal diode module 200 uses the asymmetric thermal conductivity of the material to achieve directional control of heat. Under normal working conditions, it allows heat to flow from the inside of the quantum computer (high temperature side) to the external heat sink (low temperature side), while preventing heat from flowing back in the opposite direction, effectively maintaining the temperature stability of the internal environment of the quantum computer.

[0031] Reference Figure 8-Figure 10 As shown, the heat balancing module 300 includes a connecting layer 310, a heat absorbing layer 320 and a heat dissipating layer 330, wherein the heat absorbing layer 320 is arranged between the connecting layer 310 and the heat dissipating layer 330; the connecting layer 310 is provided with a groove, and the other end of the thermal diode module 200 is embedded in the groove; the interior of the heat absorbing layer 320 is filled with coolant.

[0032] The heat balancing module 300 consists of three parts: a connection layer 310, a heat absorption layer 320, and a heat dissipation layer 330. The connection layer 310 is designed with a groove for docking and fixing the other end of the thermal diode module 200 to ensure the continuity of heat transfer. The heat absorption layer 320 is located between the connection layer 310 and the heat dissipation layer 330, and is filled with a high-efficiency coolant to absorb and disperse the heat from the thermal diode module 200. The heat dissipation layer 330 is responsible for further dissipating the absorbed heat to the external environment.

[0033] The heat balance module 300 efficiently absorbs heat through the coolant in the heat absorption layer 320, and releases it to the external environment through the heat dissipation layer 330, thereby achieving effective heat transfer and balance. This design not only improves the heat dissipation efficiency of the system, but also enhances the thermal stability of the system, providing a more stable operating temperature environment for quantum computers.

[0034] As can be seen from the above, the thermal management system of the quantum computer provided by the embodiment of the present application ensures the unidirectional transmission of heat through the asymmetric thermal conductivity characteristics of the thermal diode module 200, effectively preventing the reverse reflux of heat, thereby maintaining the temperature stability of the internal environment of the quantum computer and ensuring the accuracy and reliability of quantum computing. The design of the flexible thermal conductive module enables it to adapt to the complex and compact layout inside the quantum computer, improving the flexibility and applicability of the system. The synergy of the flexible thermal conductive module 100, the thermal diode module 200 and the heat balance module 300 can efficiently transfer the heat generated inside the quantum computer to the external environment, effectively reducing the operating temperature of the quantum computer.

[0035] In some embodiments of the present application, reference Figure 2-Figure 4 As shown, the flexible thermally conductive module 100 is provided with a heat shielding layer 110 . The heat shielding layer 110 is a double-layer structure and is filled with aerogel.

[0036] The heat shielding layer 110 is designed as a double-layer structure, which not only enhances its structural strength, but also improves its thermal insulation performance. The double-layer structure is filled with high-performance aerogel material. Aerogel is a material with extremely low thermal conductivity and excellent thermal insulation performance, which can effectively block heat transfer while maintaining light weight and good flexibility. The heat shielding layer 110 fits tightly to the outer layer of the flexible thermal conductive module 100, forming an effective thermal insulation barrier, located between the flexible thermal conductive module 100 and the external environment, which can prevent external heat from interfering with the internal quantum computer and reduce the ineffective loss of internal heat to the outside.

[0037] The heat shielding layer 110 achieves efficient heat isolation through its double-layer structure and the aerogel material filled inside. When the quantum computer is running, the flexible thermal conductive module 100 quickly conducts the heat generated inside to the next link in the thermal management system, and the heat shielding layer 110 ensures that the heat transfer in this process is unidirectional and efficient, avoiding reverse reflux and ineffective heat loss.

[0038] The newly added heat shielding layer 110 in the embodiment of the present application not only further optimizes the performance of the flexible thermal conductive module 100, but also significantly improves the heat dissipation efficiency of the entire thermal management system, reduces noise, simplifies the maintenance process, and enhances the flexibility and adaptability of the system.

[0039] In some embodiments of the present application, continue to refer to Figure 2-Figure 4 As shown, the flexible thermally conductive module 100 further includes an inner layer 120 , which is attached to the inner surface of the thermal shielding layer 110 , and the material of the inner layer 120 is graphene powder and adhesive.

[0040] The inner layer 120 is tightly attached to the heat shielding layer 110, and together they form the outer structure of the flexible heat conductive module 100. The graphene powder and adhesive mixture of the inner layer 120 has a high thermal conductivity, so that heat can quickly and efficiently pass through this layer and be transferred to the heat shielding layer 110. At the same time, the addition of the adhesive ensures a firm connection between the inner layer 120 and the heat shielding layer, avoiding energy loss during heat transfer.

[0041] In some embodiments of the present application, the outer layer of the heat shielding layer 110 is made of metal.

[0042] The outer layer of the heat shielding layer 110 is made of a metal material with high thermal conductivity, such as aluminum, copper, etc. These metal materials not only have good thermal conductivity and can quickly transfer heat from the inner layer to the external environment, but also have high mechanical strength and corrosion resistance, which can protect the heat shielding layer 110 from damage by the external environment. With its excellent thermal conductivity, the outer layer of the metal material can quickly transfer the heat accumulated inside the heat shielding layer to the external environment, thereby effectively reducing the temperature of the flexible thermal conductive module 100 and the entire thermal management system. At the same time, its metal strength and corrosion resistance ensure the stability and reliability of the heat shielding layer 110 during long-term use.

[0043] Therefore, the efficient heat conduction performance of the metal outer layer enables heat to be transferred to the external environment more quickly, thereby improving the heat dissipation efficiency of the entire thermal management system. It can also protect the thermal shielding layer 110 from physical damage from the external environment, such as scratches, impacts, etc., extending the service life of the thermal management system. The metal outer layer usually has good corrosion resistance and can resist erosion by environmental factors such as moisture and oxidation, ensuring that the thermal shielding layer 110 maintains its performance during long-term use, thereby improving the reliability and stability of the entire thermal management system.

[0044] In some embodiments of the present application, reference Fig.10 As shown, a curved channel is provided inside the heat absorption layer 320, and both ends of the curved channel are closed, and the coolant is stored in the curved channel. The curved channel structure can increase the contact area between the coolant and the inner wall of the heat absorption layer 320. Both ends of the curved channel are closed to form a closed coolant circulation system. Therefore, the coolant will not leak or evaporate. This ensures the stability and reliability of the thermal management system during long-term use. The coolant is stored in this closed system, and flows in the curved channel as heat is transferred, thereby absorbing and transferring heat. At the same time, the closed coolant circulation system reduces the complexity of maintenance. Users do not need to regularly replace or replenish the coolant, which reduces maintenance costs and time.

[0045] When a quantum computer or other high-performance computing device is running, a large amount of heat is generated. This heat is transferred to the heat absorption layer 320 by heat conduction and radiation. The curved channel inside the heat absorption layer 320 uses the fluidity of the coolant to efficiently transfer the heat from the inner wall of the heat absorption layer 320 to the coolant. As the coolant flows, the heat is taken away and dissipated to the external environment, thereby achieving effective heat management. And because the coolant is circulated in the closed curved channel, direct contact with the external environment is reduced, thereby reducing the risk of corrosion and contamination, which helps to extend the service life of the thermal management system.

[0046] In some embodiments of the present application, the coolant is a fluorinated liquid, and the specific heat capacity of the fluorinated liquid is: 1.0~1.5KJ / Kg℃.

[0047] Fluorinated liquid becomes a heat conduction medium with its high specific heat capacity. When a quantum computer or other high-performance computing device is running, a large amount of heat will be generated by the internal components. The fluorinated liquid flows through the curved channel inside the heat absorption layer 320, closely contacts the inner wall of the heat absorption layer 320, and quickly absorbs and takes away the heat. Its high specific heat capacity ensures that the temperature of the fluorinated liquid will not rise rapidly after absorbing heat, thereby maintaining efficient heat conduction performance. Specifically, when the fluorinated liquid absorbs heat, the fluorinated liquid changes from liquid to gas, absorbing a large amount of heat, thereby reducing the temperature of the device. When the temperature drops, the fluorinated liquid changes from liquid to gas again.

[0048] In this embodiment, the specific heat capacity of the fluorinated liquid is in the range of 1.0~1.5KJ / Kg℃, which plays an important role in optimizing the performance and improving the stability of the thermal management system. This numerical range enables the fluorinated liquid to efficiently transfer heat, optimize heat dissipation performance, improve system stability, reduce energy consumption, and adapt to a wide temperature range of use environment.

[0049] In addition, fluorinated liquid has low volatility, which means that when used in a closed system, fluorinated liquid is not easy to evaporate or leak. This feature ensures the stability and reliability of the thermal management system and reduces maintenance costs and time. At the same time, fluorinated liquid can remain stable over a wide temperature range and will not undergo significant physical and chemical changes due to temperature changes, further enhancing the thermal stability of the system.

[0050] In some embodiments of the present application, reference Figure 8 As shown, the heat dissipation layer 330 is provided with a plurality of heat dissipation columns 331 , the heat dissipation columns 331 are fixed on the upper surface of the heat absorption layer 320 , and a plurality of fins 332 are fixed on the heat dissipation columns 331 .

[0051] A close heat transfer link is formed between the heat sink 331 and the fin 332. When the heat absorption layer 320 absorbs heat, the heat is transferred to the fin 332 through the heat sink 331. The fin 332 efficiently dissipates heat to the external environment by increasing the surface area and optimizing the flow path. This design not only improves the heat conduction efficiency, but also enhances the overall stability and reliability of the heat dissipation structure.

[0052] In some embodiments of the present application, continue to refer to Figure 1 and Figure 2 As shown, it also includes a micro heating module 500, which is fixed on the flexible thermal conductive module 100 and arranged between the interface and the buckle; the micro heating module 500 is configured to heat the quantum computer.

[0053] In some embodiments of the present application, continue to refer to Figure 1 and Figure 5 As shown, it also includes a temperature monitoring module 400, which is electrically connected to the micro heating module 500; the temperature monitoring module 400 is configured to detect the ambient temperature of the quantum computer, obtain ambient temperature data, and send the ambient temperature data to the micro heating module 500; the micro heating module 500 is also configured to receive the ambient temperature data, compare the ambient temperature data with the preset temperature, and start heating when the ambient temperature data is lower than the preset temperature; when the ambient temperature data is higher than or equal to the preset temperature, stop heating.

[0054] The temperature monitoring module 400 is electrically connected to the micro heating module 500, and can send the monitored ambient temperature data to the micro heating module 500 in real time. The temperature monitoring module 400 is configured to detect the ambient temperature of the quantum computer and can accurately obtain ambient temperature data. After obtaining the ambient temperature data, the temperature monitoring module 400 will compare it with the preset temperature. If the ambient temperature is lower than the preset temperature, a heating instruction will be sent to the micro heating module 500; if the ambient temperature is higher than or equal to the preset temperature, an instruction to stop heating will be sent.

[0055] Through real-time monitoring of the temperature monitoring module 400 and precise heating of the micro-heating module 500, the system can achieve precise control of the operating temperature of the quantum computer. This ensures that the quantum computer can maintain the best operating state at any ambient temperature. In a low temperature environment, the performance of the quantum computer may be affected. By introducing the micro-heating module 500, the system can quickly increase the temperature when necessary, thereby avoiding performance degradation and improving the overall stability of the system. At the same time, the temperature monitoring module 400 can intelligently determine when heating is needed and when heating should be stopped. This intelligent management avoids unnecessary energy consumption and achieves the goal of energy saving and consumption reduction.

[0056] The introduction of the micro heating module 500 and the temperature monitoring module 400 greatly improves the performance and intelligence level of the thermal management system. When the ambient temperature is lower than the normal temperature limit of the quantum computer, heat compensation can be performed on it through the micro heating module 500 and the temperature monitoring module 400. This not only realizes the precise control of the temperature of the quantum computer, but also improves the stability, energy saving, maintenance convenience and adaptability of the system. These improvements make the thermal management system more perfect and provide a strong guarantee for the stable operation of the quantum computer.

[0057] In some embodiments of the present application, the temperature monitoring module 400 is composed of a plurality of micro high-resolution sensors. Each micro sensor has the characteristic of high resolution, which means that they can capture tiny temperature changes and thus provide more accurate temperature data. These micro sensors can transmit data with the main body of the temperature monitoring module 400 via an internal communication protocol or wirelessly. In this way, the system can obtain the temperature data of each sensor in real time, and perform comprehensive analysis and processing. The temperature monitoring module 400 receives temperature data from each micro high-resolution sensor, and processes and integrates it. It can convert this data into meaningful temperature information and provide a decision-making basis for the temperature control of the system.

[0058] In this embodiment, the temperature monitoring module 400 composed of multiple micro high-resolution sensors can accurately monitor the temperature of key parts of the quantum computer. This high-precision monitoring helps to detect temperature anomalies in a timely manner and prevent potential problems. By properly arranging sensors, the temperature monitoring module 400 can achieve comprehensive coverage of the entire system of the quantum computer. This ensures that temperature anomalies in any part of the system can be discovered and handled in a timely manner. Based on accurate temperature data and intelligent judgment mechanisms, the temperature monitoring module 400 can achieve precise control of the temperature of the quantum computer. This helps to ensure that the quantum computer operates at the optimal temperature and improves system performance and stability.

[0059] The present application provides a thermal management system for a quantum computer, including: a flexible thermal conductive module, a thermal diode module and a heat balance module. The flexible thermal conductive module can seal the heat inside the module, and the heat is not easy to diffuse outward, thereby reducing the impact on the environment. The thermal diode module is connected to the flexible thermal conductive module at one end, which can reduce the heat transfer path and reduce the heat diffusion inside the transmission link. The thermal diode module can realize the unidirectional conduction of heat and reduce unnecessary heat loss. The heat balance module is the part for heat transfer to the outside. The middle layer has a closed multi-channel for storing coolant to achieve the cooling function, and the top layer has a multi-fin heat dissipation structure for dissipating heat to the outside. The thermal management system of the present application can perform all-round environmental monitoring and heat management on the quantum computer. The micro-heating module changes the situation that the traditional thermal management system can only dissipate heat but cannot replenish heat. When the ambient temperature is too high, the heat can be automatically taken away to reduce the temperature of the quantum computer. When the ambient temperature is too low, the heat can be automatically replenished so that the temperature meets the operating requirements.

[0060] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the disclosure of the specification and the examples. This application is intended to cover any modifications, uses or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure.

Claims

1. A thermal management system for a quantum computer, characterized in that: include: A flexible heat-conducting module (100), a thermal diode module (200) and a heat balancing module (300); One end of the flexible heat-conducting module (100) is provided with an interface matching the heat source of the quantum computer, and the other end is provided with a standard buckle, and the flexible heat-conducting module (100) is buckled with one end of the thermal diode module (200) via the buckle; The material of the thermal diode module (200) is a phonon thermal conductivity material with an asymmetric structure; The heat balancing module (300) comprises a connecting layer (310), a heat absorbing layer (320) and a heat dissipating layer (330), wherein the heat absorbing layer (320) is arranged between the connecting layer (310) and the heat dissipating layer (330); The connection layer (310) is provided with a groove, and the other end of the thermal diode module (200) is embedded in the groove; The heat absorption layer (320) is filled with cooling liquid.

2. A thermal management system for a quantum computer according to claim 1, characterized in that: The flexible heat-conducting module (100) is provided with a heat shielding layer (110), and the heat shielding layer (110) is a double-layer structure with aerogel filled inside.

3. A thermal management system for a quantum computer according to claim 2, characterized in that: The flexible heat-conducting module (100) further comprises an inner layer (120), wherein the inner layer (120) is attached to the inner surface of the heat shielding layer (110), and the material of the inner layer (120) is graphene powder and an adhesive.

4. A thermal management system for a quantum computer according to claim 2, characterized in that: The outer layer of the heat shielding layer (110) is made of metal.

5. A thermal management system for a quantum computer according to claim 1, characterized in that: A curved channel is provided inside the heat absorption layer (320), both ends of the curved channel are closed, and the coolant is stored in the curved channel.

6. A thermal management system for a quantum computer according to claim 1, characterized in that: The coolant is a fluorinated liquid, and the specific heat capacity of the fluorinated liquid is: 1.0~1.5KJ / Kg℃.

7. A thermal management system for a quantum computer according to claim 1, characterized in that: The heat dissipation layer (330) is provided with a plurality of heat dissipation columns (331), the heat dissipation columns (331) are fixed on the upper surface of the heat absorption layer (320), and a plurality of fins (332) are fixed on the heat dissipation columns (331).

8. A thermal management system for a quantum computer according to claim 1, characterized in that: It also comprises a micro heating module (500), the micro heating module (500) being fixed on the flexible heat-conducting module (100) and arranged between the interface and the buckle; The micro heat generating module (500) is configured to heat the quantum computer row.

9. A thermal management system for a quantum computer according to claim 8, characterized in that: It also includes a temperature monitoring module (400), the temperature monitoring module (400) being electrically connected to the micro heating module (500); The temperature monitoring module (400) is configured to detect the ambient temperature of the quantum computer, obtain ambient temperature data, and send the ambient temperature data to the micro heating module (500); The micro heating module (500) is further configured to receive the ambient temperature data, compare the ambient temperature data with a preset temperature, and start heating when the ambient temperature data is lower than the preset temperature; When the ambient temperature data is higher than or equal to the preset temperature, heating is stopped.

10. A thermal management system for a quantum computer according to claim 9, characterized in that: The temperature monitoring module (400) is composed of a plurality of miniature high-resolution sensors.

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