Manufacturing method of ultra-thick copper layer printed circuit board and ultra-thick copper layer printed circuit board

Abstract

The invention provides a manufacturing method of a printed circuit board with an ultra-thick copper layer and the printed circuit board with the ultra-thick copper layer, belongs to the technical field of printed circuit board manufacturing, and solves the problems that the printed circuit board with the ultra-thick copper layer is long in manufacturing period and large in line spacing. The method comprises the following steps: providing a substrate; the substrate is subjected to cutting and drilling treatment, and the substrate with positioning holes is obtained; carrying out electroplating etching treatment on the substrate with the positioning hole to obtain an electroplated and etched substrate; carrying out resin filling treatment on the electroplated and etched substrate to obtain a substrate filled with resin; performing copper deposition etching treatment on the substrate filled with the resin to obtain a printed circuit board after copper deposition etching; and performing resistance welding word processing on the printed circuit board after copper deposition etching to obtain the ultra-thick copper layer printed circuit board. According to the scheme, the production cycle of the ultra-thick copper layer printed circuit board is shortened, narrow-line-spacing circuit manufacturing of the ultra-thick copper layer printed circuit board is achieved, the product quality is controllable, and the production cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of an ultra-thick copper layer printed circuit board and an ultra-thick copper layer printed circuit board. Background Art

[0002] With the widespread application of electronic products in the field of new energy, printed circuit boards not only provide the necessary electrical connections and mechanical processes for electronic components, but are also given more additional functions; and ultra-thick copper layer printed circuit boards that can integrate power supplies, provide large currents, and have high reliability have gradually become popular products developed by the printed circuit board industry. Ultra-thick copper layer printed circuit boards can improve the current carrying capacity and heat dissipation performance of the circuit. At present, the copper layer of ultra-thick copper layer printed circuit boards is generally more than 10oz, and even reaches more than 18oz and 20oz. Such a thick copper layer brings challenges to the manufacturing process of the circuit board.

[0003] At present, the commonly used process for producing ultra-thick copper layer printed circuit boards is: starting with 4oz copper on the substrate, using silk screen solder mask ink, and then increasing 1~2oz each time, and using multiple copper plating stacking methods to achieve the production of ultra-thick copper foil. This process has a long production cycle and is difficult to control quality. Taking the increase from 4oz to 10oz as an example, each production needs to go through the following 7 processes: printing solder mask, post-solder mask curing, copper deposition, board electricity, graphic transfer, etching, and film stripping. Repeated production 3-4 times to achieve the 10oz thickness requirement; at the same time, in the repeated production process, the quality risks are also multiplied accordingly, and the market demand for rapid product iteration cannot be met. This process is also unable to achieve the production of printed circuit boards with a copper layer thickness of 20oz or even thicker. Summary of the invention

[0004] The invention provides a method for manufacturing an ultra-thick copper layer printed circuit board and an ultra-thick copper layer printed circuit board, which solve the problems of long manufacturing cycle and large line spacing of the ultra-thick copper layer printed circuit board.

[0005] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0006] An embodiment of the present invention provides a method for manufacturing an ultra-thick copper layer printed circuit board, comprising:

[0007] providing a substrate;

[0008] Performing a cutting and drilling process on the substrate to obtain a substrate with positioning holes;

[0009] Performing electroplating and etching treatment on the substrate with the positioning holes to obtain an electroplated and etched substrate;

[0010] Filling the electroplated and etched substrate with resin to obtain a substrate filled with resin;

[0011] Performing copper plating etching on the substrate filled with resin to obtain a printed circuit board after copper plating etching;

[0012] The printed circuit board after copper deposition and etching is subjected to solder mask text processing to obtain an ultra-thick copper layer printed circuit board.

[0013] Optionally, the substrate is subjected to a cutting and drilling process to obtain a substrate with positioning holes, including:

[0014] According to preset cutting parameters, the substrate is cut and processed to obtain a cut substrate;

[0015] According to preset drilling parameters, positioning holes are drilled in the cut substrate to obtain a substrate with positioning holes.

[0016] Optionally, the substrate with the positioning holes is subjected to electroplating and etching to obtain the electroplated and etched substrate, comprising:

[0017] According to a preset circuit diagram, the substrate with positioning holes is subjected to pattern circuit processing to obtain a substrate with circuits;

[0018] Performing tin plating on the substrate with the circuit to obtain a tin-plated substrate;

[0019] The tin-plated substrate is etched to obtain an electroplated and etched substrate.

[0020] Optionally, the substrate after electroplating and etching is filled with resin to obtain a substrate filled with resin, including:

[0021] A vacuum resin filling machine is used to fill the substrate after electroplating and etching with resin under the condition of a vacuum degree of 8000±100 Pa to obtain a substrate filled with resin.

[0022] Optionally, the substrate filled with resin is subjected to copper plating etching to obtain a printed circuit board after copper plating etching, comprising:

[0023] Performing drilling processing on the substrate filled with resin to obtain a drilled substrate;

[0024] Performing a grinding process on the drilled substrate to obtain a ground substrate;

[0025] Performing copper deposition on the polished substrate to obtain a copper-deposited substrate;

[0026] The copper-plated substrate is subjected to electroplating and etching treatment to obtain a copper-plated and etched printed circuit board.

[0027] Optionally, the copper-plated substrate is subjected to electroplating etching to obtain a copper-plated and etched printed circuit board, comprising:

[0028] According to a preset circuit diagram, the copper-plated substrate is subjected to pattern circuit processing to obtain a printed circuit board with circuits;

[0029] Performing copper plating and tin plating on the printed circuit board with the circuit to obtain a copper and tin plated printed circuit board;

[0030] The copper-plated and tin-plated printed circuit board is etched to obtain a copper-plated and etched printed circuit board.

[0031] Optionally, the printed circuit board after copper deposition and etching is subjected to solder mask text processing to obtain an ultra-thick copper layer printed circuit board, comprising:

[0032] Performing solder resist treatment on the printed circuit board after copper deposition and etching to obtain a printed circuit board after solder resist treatment;

[0033] Performing text processing on the printed circuit board after the solder mask treatment to obtain a printed circuit board after the text processing;

[0034] Performing surface treatment on the text-processed printed circuit board to obtain a surface-treated printed circuit board;

[0035] The printed circuit board after the surface treatment is subjected to a molding process to obtain an ultra-thick copper layer printed circuit board.

[0036] Optionally, the surface-treated printed circuit board is subjected to a molding process to obtain an ultra-thick copper layer printed circuit board, comprising:

[0037] The surface-treated printed circuit board is laser cut according to preset cutting parameters to obtain an ultra-thick copper layer printed circuit board.

[0038] Optionally, the method for manufacturing the ultra-thick copper layer printed circuit board further includes:

[0039] The ultra-thick copper layer printed circuit board is tested and inspected according to preset test conditions to obtain a qualified ultra-thick copper layer printed circuit board; the preset test conditions include:

[0040] Thermal shock test conditions: the temperature of the thermal shock test is 288±5℃, the time of the thermal shock test is at least 10s, and the number of thermal shock tests is at least 3 times;

[0041] Thermal shock test conditions: thermal shock test is performed for at least 100 cycles, each cycle includes: the first temperature of thermal shock test is -40±1℃, the first shock time is at least 30min; the second temperature of thermal shock test is 25±3℃, the second shock time is at least 5min; the third temperature of thermal shock test is 125±1℃, the third shock time is at least 30min;

[0042] High temperature test conditions: the temperature of the high temperature test is 100~110℃, and the time of the high temperature test is at least 120h;

[0043] The moisture placement test conditions are as follows: the temperature of the moisture placement test is 60~65℃, the humidity of the moisture placement test is 90~95%, and the time of the moisture placement test is at least 120h.

[0044] The embodiment of the present invention further provides an ultra-thick copper layer printed circuit board, and the ultra-thick copper layer printed circuit board is prepared by the above method.

[0045] The technical solution of the present invention includes at least the following effects:

[0046] The above scheme of the present invention provides a substrate; performs cutting and drilling processing on the substrate to obtain a substrate with positioning holes; performs electroplating and etching processing on the substrate with positioning holes to obtain a substrate after electroplating and etching; performs resin filling processing on the substrate after electroplating and etching to obtain a substrate after resin filling; performs copper plating and etching processing on the substrate after resin filling to obtain a printed circuit board after copper plating and etching; performs solder mask text processing on the printed circuit board after copper plating and etching to obtain an ultra-thick copper layer printed circuit board, thereby shortening the production cycle of the ultra-thick copper layer printed circuit board, realizing the production of narrow line spacing circuits of the ultra-thick copper layer printed circuit board, controlling product quality, and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] FIG1 is a flow chart of a method for manufacturing an ultra-thick copper layer printed circuit board provided by an embodiment of the present invention;

[0048] FIG2 is a cross-sectional view of an ultra-thick copper layer printed circuit board before copper lamination provided by an embodiment of the present invention;

[0049] FIG3 is a cross-sectional view of an ultra-thick copper layer printed circuit board after copper lamination provided by an embodiment of the present invention;

[0050] Among them, 1. Front circuit; 2. Back circuit; 3. Substrate; 4. Circuit copper stack; 5. Resin filled between circuits. DETAILED DESCRIPTION

[0051] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0052] As shown in FIG1 , an embodiment of the present invention provides a method for manufacturing an ultra-thick copper layer printed circuit board, comprising:

[0053] Step 11, providing a substrate;

[0054] Step 12, performing a cutting and drilling process on the substrate to obtain a substrate with positioning holes;

[0055] Step 13, performing electroplating and etching treatment on the substrate with the positioning holes to obtain an electroplated and etched substrate;

[0056] Step 14, filling the substrate after electroplating and etching with resin to obtain a substrate filled with resin;

[0057] Step 15, performing copper etching on the substrate filled with resin to obtain a printed circuit board after copper etching;

[0058] Step 16, performing solder mask processing on the printed circuit board after copper deposition and etching to obtain an ultra-thick copper layer printed circuit board.

[0059] In this embodiment, firstly, according to the design requirements and purpose of the printed circuit board, a suitable substrate material is selected; common substrate materials include phenolic paper substrate, epoxy resin glass cloth board (FR-4), composite substrate and metal substrate, etc.; at the same time, the substrate needs to be pre-processed, such as degreasing, deoxidation layer, etc., to improve the adhesion and processing quality of subsequent processing; using cutting equipment, the substrate is cut according to a predetermined size and shape; using a CNC drilling machine, according to the wiring diagram and component layout diagram of the printed circuit board, positioning holes are drilled on the substrate, and the positioning holes are used for positioning in subsequent processing and assembly;

[0060] The wiring pattern of the printed circuit board is transferred to the front and back sides of the substrate on the substrate with positioning holes to form a photoresist layer, and a tin layer anti-corrosion layer is formed by electroplating; the substrate is placed in an etching solution by a chemical method to etch away the copper layer on the front and back sides of the substrate that is not protected by the tin anti-corrosion layer to form the wiring pattern of the printed circuit board, and then the tin anti-corrosion layer on the substrate is removed by an acidic solvent;

[0061] Use filling equipment to fill the resin material on both sides of the printed circuit board to reduce the height difference between the top and bottom of the circuit; deposit a layer of copper on the hole walls and surfaces on both sides of the printed circuit board. Transfer the wiring pattern of the printed circuit board to the front and back sides of the substrate again to form a new photoresist layer; then use electroplating to form an overlay of the copper layer of the circuit pattern and plate a layer of tin anti-corrosion layer; place the substrate in an etching solution to etch away the copper layer on both sides of the substrate that is not protected by the tin anti-corrosion layer to form a circuit pattern, and finally use an acidic solvent to remove the tin anti-corrosion layer on the substrate, so that the thickness of the circuit copper layer is increased; in order to make the copper layer reach the preset thickness, steps 13 to 15 can be repeated multiple times;

[0062] After the copper layer reaches the preset thickness, a layer of solder resist ink is coated on the surface of the printed circuit board to protect the circuits on the printed circuit board from being damaged by the high temperature during welding; the text, symbols and logos on the printed circuit board are printed on the solder resist ink for easy identification and maintenance.

[0063] The technical solution provided by the above-mentioned embodiment of the present invention shortens the production cycle of ultra-thick copper layer printed circuit boards, realizes the production of ultra-thick copper layer printed circuit boards with narrow line spacing, makes product quality controllable, and reduces production costs.

[0064] In an optional embodiment of the present invention, step 12 may include:

[0065] Step 121, cutting and cutting the substrate according to preset cutting parameters to obtain a cut substrate;

[0066] Step 122 , according to preset drilling parameters, positioning holes are drilled in the cut substrate to obtain a substrate with positioning holes.

[0067] In this embodiment, cutting parameters including cutting speed, cutting depth and cutting path are set according to the material, thickness and required cutting shape and size of the substrate; a cutting machine is used to cut the substrate according to the preset cutting parameters to obtain a cut substrate;

[0068] Use a CNC drill to drill positioning holes on the cut substrate according to the material, thickness, size and position requirements of the positioning holes of the substrate and the preset drilling parameters, including drilling speed, feed rate, drilling depth, diameter and type of the drill bit, etc. The positioning holes are used to provide precise positioning references to help automated equipment (such as placement machines, reflow ovens, etc.) quickly and accurately identify and fix printed circuit boards (PCBs); after drilling, check the substrate with the positioning holes to ensure that the size, position and shape of the positioning holes meet the requirements, and obtain a substrate with positioning holes.

[0069] In an optional embodiment of the present invention, step 13 may include:

[0070] Step 131, according to a preset circuit diagram, the substrate with positioning holes is subjected to pattern circuit processing to obtain a substrate with circuits;

[0071] Step 132, tinning the substrate with the circuit to obtain a tinned substrate;

[0072] Step 133, etching the tinned substrate to obtain an electroplated and etched substrate.

[0073] In this embodiment, firstly, a photolithography technique or laser printing technique is used on a substrate with positioning holes to transfer the pattern of a preset circuit diagram to the front and back sides of the substrate; a photoresist layer (such as photoresist) is coated on the front and back sides of the substrate, and then ultraviolet light exposure or laser irradiation is used to cause the photoresist layer to chemically react in the area where the circuit pattern is located; after completion, an alkaline developer is used to remove the unreacted photoresist layer to expose the circuit pattern in the copper area on the substrate;

[0074] The substrate is cleaned and activated to ensure that the subsequent tin-plated anti-corrosion layer can be firmly attached to the copper surface; a uniform tin-corrosion-resistant layer is plated on the circuit pattern surface of the copper area on both sides of the substrate by electroplating to protect the circuit pattern from being corroded by alkaline etching solution in subsequent production;

[0075] Using an alkaline stripping solution, the reacted resist layer on the bare substrate is removed to expose the copper area on the substrate that needs to be removed;

[0076] The exposed copper area is etched with an alkaline etching solution, and then the anti-corrosion tin layer on the substrate is removed with an acidic solvent to obtain a substrate after electroplating etching; at this time, only the copper conductive areas required for the precise circuit pattern are left on both sides of the substrate, thus obtaining a substrate after electroplating etching.

[0077] In an optional embodiment of the present invention, step 14 may include:

[0078] Step 141, using a vacuum resin filling machine, under the condition of a vacuum degree of 8000±100Pa, the substrate after electroplating and etching is filled with resin to obtain a substrate filled with resin.

[0079] In this embodiment, according to the material, size and required performance requirements of the substrate after electroplating etching, a suitable resin type, such as epoxy resin, polyimide resin, etc., is selected; the resin, curing agent, catalyst, etc. are mixed evenly in a certain proportion, and preheated to an appropriate temperature to ensure the fluidity and curing effect of the resin; the substrate after electroplating etching is cleaned to remove impurities such as oil and dust on the surface, and ensure that the surface of the substrate is dry and clean, so that the resin can be evenly and tightly attached to the front and back surfaces of the substrate and filled in the gaps between the circuits; the vacuum degree of the vacuum resin filling machine is set to about 8000Pa to ensure that the air and bubbles in the resin can be fully removed during the resin filling process; the pretreated substrate is fixed on the workbench of the vacuum resin filling machine to ensure the sealing between the substrate and the resin tank; the resin supply system is opened, and the preheated resin mixture is slowly injected into the resin tank until the resin completely covers the front and back surfaces of the substrate; the vacuum pump is started to start vacuuming the resin tank. As the vacuum degree gradually increases, the air and bubbles in the resin will be gradually eliminated; after the vacuum degree reaches 8000Pa, keep it for a period of time (depending on the type of resin) to ensure that all bubbles are completely eliminated; when the bubbles are completely eliminated, gradually reduce the vacuum degree until the vacuum state is completely released; put the substrate filled with resin on both sides into the heating furnace, and heat and cure it according to the curing temperature and time requirements of the resin; during the curing process, the resin will gradually harden and form a solid layer; after curing, take the substrate out of the heating furnace and cool it naturally to room temperature; then check the surface quality of the substrate, the uniformity and adhesion of the resin layer and other indicators to obtain the substrate filled with resin.

[0080] In an optional embodiment of the present invention, step 15 may include:

[0081] Step 151, drilling the substrate filled with resin to obtain a drilled substrate;

[0082] Step 152, grinding the drilled substrate to obtain a ground substrate;

[0083] Step 153, performing copper deposition treatment on the polished substrate to obtain a copper-deposited substrate;

[0084] Step 154, performing electroplating and etching treatment on the copper-plated substrate to obtain a copper-plated and etched printed circuit board.

[0085] In this embodiment, according to the design requirements of the printed circuit board, the substrate is fixed on a drilling machine, and the plug-in holes are drilled according to the preset program and parameters. The plug-in holes are used to provide welding positions for plug-in electronic components (such as resistors, capacitors, diodes, integrated circuits, etc.); the drilled substrate is placed in a grinding machine for grinding; the burrs and uneven surfaces generated during the drilling process are removed by grinding; the ground substrate is placed in a copper plating solution and kept for a certain period of time so that copper ions are deposited on the surface of the substrate to form a uniform copper layer; after the copper plating is completed, the substrate is taken out of the solution and cleaned with a cleaning agent to remove the residual solution on the surface; according to the preset circuit diagram, the required circuit pattern is formed on the copper layer of the substrate, first a layer of photosensitive material (such as photoresist) is coated on the copper layer, and then exposed to light. , developing step, transferring the circuit pattern to the substrate, and exposing the copper layer portion to be retained after development; after the pattern circuit processing, a circuit pattern corresponding to the preset circuit pattern is formed on the substrate, and the printed circuit board with the circuit is immersed in a plating solution containing copper or tin ions using an electroplating tank, and the copper or tin ions are reduced and deposited on the circuit surface of the printed circuit board through the action of the electric current to form a uniform plating layer; the printed circuit board after copper or tin plating is immersed in an alkaline etching solution, and the etching solution is evenly sprayed on the surface of the printed circuit board by spraying, so that the unnecessary copper layer portion reacts chemically with the etching solution and is removed; at the same time, due to the resistance of the tin plating layer to the etching solution, the copper layer of the circuit pattern portion is retained, thereby obtaining a printed circuit board after copper deposition etching.

[0086] In an optional embodiment of the present invention, step 16 may include:

[0087] Step 161, performing solder resist treatment on the printed circuit board after copper plating and etching to obtain a printed circuit board after solder resist treatment;

[0088] Step 162, performing text processing on the printed circuit board after the solder mask processing to obtain a printed circuit board after the text processing;

[0089] Step 163, performing surface treatment on the text-processed printed circuit board to obtain a surface-treated printed circuit board;

[0090] Step 164, performing molding treatment on the surface treated printed circuit board to obtain an ultra-thick copper layer printed circuit board.

[0091] In this embodiment, the purpose of solder resist treatment is to coat a layer of solder resist ink on the non-conductive area (i.e., the area not requiring soldering) of the printed circuit board, so as to protect these areas from being covered by soldering materials or short-circuited during the subsequent soldering process; the solder resist ink has the characteristics of high temperature resistance and chemical corrosion resistance; firstly, the printed circuit board is placed on the conveyor belt of the solder resist machine, and the solder resist ink is evenly coated on the non-conductive area of ​​the printed circuit board by screen printing or automatic spraying; then, the printed circuit board coated with the solder resist ink is sent to an oven for baking, so that the solder resist ink is solidified to form a firm protective layer; after the solder resist treatment, the non-conductive area of ​​the printed circuit board is covered by a protective layer of solder resist ink, which provides protection for subsequent soldering and assembly;

[0092] Text processing refers to printing component identification, polarity identification, production date and other text information on the surface of the printed circuit board to facilitate subsequent assembly, testing and maintenance; using screen printing or laser printing to print the required text information at the specified position of the printed circuit board.

[0093] In order to enhance the soldering performance and anti-corrosion performance of the printed circuit board, the printed circuit board after text processing needs to be surface treated, including tin spraying, gold plating, etc. Among them, tin spraying is to immerse the printed circuit board in a molten tin bath to make the tin adhere to the copper layer of the printed circuit board; gold plating is to plate a layer of gold on the copper layer of the printed circuit board by electroplating; after surface treatment, the soldering performance and anti-corrosion performance of the printed circuit board are significantly improved;

[0094] Use forming equipment, such as laser cutting machines, to cut and trim the printed circuit board to obtain the desired shape and size; at the same time, for areas with extra-thick copper layers, parameters such as temperature, pressure and speed during processing need to be controlled to avoid damage to the copper layer.

[0095] A specific embodiment of the method for manufacturing an ultra-thick copper layer printed circuit board provided by an embodiment of the present invention is:

[0096] Step 1: providing a substrate.

[0097] First, according to the design requirements and uses of the printed circuit board, select the appropriate substrate material; common substrate materials include phenolic paper substrate, epoxy resin glass cloth board (FR-4), composite substrate and metal substrate, etc.; at the same time, the substrate also needs to be pre-treated, such as degreasing and removing the oxide layer.

[0098] Step 2: performing cutting and drilling processing on the substrate to obtain a substrate with positioning holes.

[0099] The substrate is cut into predetermined sizes and shapes using cutting equipment; positioning holes are drilled on the substrate according to the wiring diagram and component layout diagram of the printed circuit board using a CNC drilling machine.

[0100] Step 3, performing electroplating and etching treatment on the substrate with the positioning holes to obtain an electroplated and etched substrate.

[0101] The wiring pattern of the printed circuit board is transferred to the front and back sides of the substrate with positioning holes to form an anti-corrosion layer; the copper layer not protected by the anti-corrosion layer is removed by chemical methods to form the wiring pattern of the printed circuit board, and then the anti-corrosion layer on the substrate is removed by an acidic solvent.

[0102] Step 4, filling the substrate after electroplating and etching with resin to obtain a substrate filled with resin.

[0103] Use filling equipment to fill resin material onto both sides of the printed circuit board to reduce the height difference between the top and bottom of the circuit; deposit a layer of copper again on the hole wall and surface of the printed circuit board to form a superposition of the copper layer.

[0104] Step 5, performing copper plating etching on the substrate filled with resin to obtain a printed circuit board after copper plating etching.

[0105] The wiring pattern of the printed circuit board is transferred to the front and back sides of the substrate again to form a new anti-etching layer; the copper layer not protected by the anti-etching layer is removed to form a circuit pattern, and finally an acidic solvent is used to remove the anti-etching layer on the front and back sides of the substrate, so that the thickness of the circuit copper layer is increased; in order to make the copper layer reach a preset thickness, steps 3 to 5 can be repeated multiple times.

[0106] Step 6, performing solder mask processing on the printed circuit board after copper deposition and etching to obtain an ultra-thick copper layer printed circuit board.

[0107] After the copper layer reaches the preset thickness, a layer of solder resist ink is coated on the surface of the printed circuit board to protect the circuits on the printed circuit board from being damaged by the high temperature during welding; the text, symbols and logos on the printed circuit board are printed on the solder resist ink for easy identification and maintenance.

[0108] The process parameters of each step are shown in Table 1.

[0109] Table 1 Process parameters for manufacturing ultra-thick copper layer printed circuit boards

[0110]

[0111] The above technical solution of the present invention solves the problems that fine circuits cannot be produced, the time is long, and the product quality is low during the production process of ultra-thick copper layer printed circuit boards, shortens the production cycle of ultra-thick copper layer printed circuit boards, realizes the production of fine circuits, the product quality is controllable, and the production cost is reduced.

[0112] In an optional embodiment of the present invention, the method further comprises the following steps:

[0113] Step 171, testing and inspecting the ultra-thick copper layer printed circuit board according to preset test conditions to obtain a qualified ultra-thick copper layer printed circuit board; the preset test conditions include:

[0114] Step 172, thermal shock test conditions: the temperature of the thermal shock test is 288±5°C, the time of the thermal shock test is at least 10 seconds, and the number of thermal shock tests is at least 3 times;

[0115] Step 173, hot and cold shock test conditions, the hot and cold shock test is performed at least 100 cycles, each cycle includes: the first temperature of the hot and cold shock test is -40±1°C, the first shock time is at least 30 minutes; the second temperature of the hot and cold shock test is 25±3°C, the second shock time is at least 5 minutes; the third temperature of the hot and cold shock test is 125±1°C, the third shock time is at least 30 minutes;

[0116] Step 174, high temperature test conditions, the temperature of the high temperature test is 100-110°C, and the time of the high temperature test is at least 120 hours;

[0117] Step 175, moisture placement test conditions, the moisture placement test temperature is 60-65°C, the moisture placement test humidity is 90-95%, and the moisture placement test time is at least 120 hours.

[0118] In this embodiment, in order to improve the qualification rate and user satisfaction of printed circuit boards, it is necessary to inspect the ultra-thick copper layer printed circuit boards. Only printed circuit boards that pass the preset inspection conditions are qualified ultra-thick copper layer printed circuit boards and can be used for subsequent production or shipment. In the thermal shock test conditions, the temperature of the thermal shock test is 288±5°C, the time of the thermal shock test is at least 10s, and the number of thermal shock tests is at least 3 times; in the hot and cold shock experimental conditions, the test product is placed in a cold temperature tank at -40°C, shock for 30 minutes, then at room temperature for 5 minutes, then at a high temperature of 125°C for 30 minutes, then at room temperature for 5 minutes, in sequence as one cycle, for a total of 100 cycles. After the experiment, check for blistering, delamination, oxidation, and mottled spots; place the test bar at high temperature In the test, the test product is placed in an oven at a temperature of 100-110℃ for 120 hours to check for blistering, delamination, oxidation, and mottled spots. In the test condition of placing in moisture, the test product is placed in a constant temperature wet oven at a temperature of 60-65℃ and a humidity of 90-95% for 120 hours to check for blistering, delamination, oxidation, and mottled spots. After the ultra-thick copper layer printed circuit boards are inspected according to the above inspection methods, the qualified rate of printed circuit board products is high, which fully meets the market demand.

[0119] As shown in FIG2 , an embodiment of the present invention provides an ultra-thick copper layer printed circuit board, which is prepared by the ultra-thick copper layer printed circuit board manufacturing method described in any one of the above embodiments. The ultra-thick copper layer printed circuit board includes: a front circuit 1, a back circuit 2, a substrate 3, a circuit copper stack 4, and a resin 5 filled between the circuits. Through process improvements, the production efficiency and product performance of the ultra-thick copper layer printed circuit board have been effectively improved.

[0120] The above are preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A method for manufacturing an ultra-thick copper layer printed circuit board, characterized in that: include: providing a substrate; Performing a cutting and drilling process on the substrate to obtain a substrate with positioning holes; Performing electroplating and etching treatment on the substrate with the positioning holes to obtain an electroplated and etched substrate; Filling the electroplated and etched substrate with resin to obtain a substrate filled with resin; Performing copper plating etching on the substrate filled with resin to obtain a printed circuit board after copper plating etching; The printed circuit board after copper deposition and etching is subjected to solder mask text processing to obtain an ultra-thick copper layer printed circuit board.

2. The method for manufacturing an ultra-thick copper layer printed circuit board according to claim 1, characterized in that: The substrate is subjected to a cutting and drilling process to obtain a substrate with positioning holes, comprising: According to preset cutting parameters, the substrate is cut and processed to obtain a cut substrate; According to preset drilling parameters, positioning holes are drilled in the cut substrate to obtain a substrate with positioning holes.

3. The method for manufacturing an ultra-thick copper layer printed circuit board according to claim 1, characterized in that: The substrate with the positioning holes is subjected to electroplating and etching to obtain the electroplated and etched substrate, comprising: According to a preset circuit diagram, the substrate with positioning holes is subjected to pattern circuit processing to obtain a substrate with circuits; Performing tin plating on the substrate with the circuit to obtain a tin-plated substrate; The tin-plated substrate is etched to obtain an electroplated and etched substrate.

4. The method for manufacturing an ultra-thick copper layer printed circuit board according to claim 1, characterized in that: Filling the electroplated and etched substrate with resin to obtain a substrate filled with resin, comprising: A vacuum resin filling machine is used to fill the substrate after electroplating and etching with resin under the condition of a vacuum degree of 8000±100 Pa to obtain a substrate filled with resin.

5. The method for manufacturing an ultra-thick copper layer printed circuit board according to claim 1, characterized in that: The substrate filled with resin is subjected to copper plating etching to obtain a printed circuit board after copper plating etching, comprising: Performing drilling processing on the substrate filled with resin to obtain a drilled substrate; Performing a grinding process on the drilled substrate to obtain a ground substrate; Performing copper deposition on the polished substrate to obtain a copper-deposited substrate; The copper-plated substrate is subjected to electroplating and etching treatment to obtain a copper-plated and etched printed circuit board.

6. The method for manufacturing an ultra-thick copper layer printed circuit board according to claim 5, characterized in that: The copper-plated substrate is subjected to electroplating and etching treatment to obtain a copper-plated and etched printed circuit board, comprising: According to a preset circuit diagram, the copper-plated substrate is subjected to pattern circuit processing to obtain a printed circuit board with circuits; Performing copper plating and tin plating on the printed circuit board with the circuit to obtain a copper and tin plated printed circuit board; The copper-plated and tin-plated printed circuit board is etched to obtain a copper-plated and etched printed circuit board.

7. The method for manufacturing an ultra-thick copper layer printed circuit board according to claim 1, characterized in that: The printed circuit board after copper deposition and etching is subjected to solder mask text processing to obtain an ultra-thick copper layer printed circuit board, comprising: Performing solder resist treatment on the printed circuit board after copper deposition and etching to obtain a printed circuit board after solder resist treatment; Performing text processing on the printed circuit board after the solder mask treatment to obtain a printed circuit board after the text processing; Performing surface treatment on the text-processed printed circuit board to obtain a surface-treated printed circuit board; The printed circuit board after the surface treatment is subjected to a molding process to obtain an ultra-thick copper layer printed circuit board.

8. The method for manufacturing an ultra-thick copper layer printed circuit board according to claim 7, characterized in that: The surface-treated printed circuit board is subjected to molding treatment to obtain an ultra-thick copper layer printed circuit board, comprising: The surface-treated printed circuit board is laser cut according to preset cutting parameters to obtain an ultra-thick copper layer printed circuit board.

9. The method for manufacturing an ultra-thick copper layer printed circuit board according to claim 1, characterized in that: Also includes: Testing and inspecting the ultra-thick copper layer printed circuit board according to preset test conditions to obtain a qualified ultra-thick copper layer printed circuit board; The preset test conditions include: Thermal shock test conditions: the temperature of the thermal shock test is 288±5℃, the time of the thermal shock test is at least 10s, and the number of thermal shock tests is at least 3 times; Thermal shock test conditions: thermal shock test is performed for at least 100 cycles, each cycle includes: the first temperature of thermal shock test is -40±1℃, the first shock time is at least 30min; the second temperature of thermal shock test is 25±3℃, the second shock time is at least 5min; the third temperature of thermal shock test is 125±1℃, the third shock time is at least 30min; High temperature test conditions: the temperature of the high temperature test is 100~110℃, and the time of the high temperature test is at least 120h; The moisture placement test conditions are as follows: the temperature of the moisture placement test is 60~65℃, the humidity of the moisture placement test is 90~95%, and the time of the moisture placement test is at least 120h.

10. An ultra-thick copper layer printed circuit board, characterized in that: The ultra-thick copper layer printed circuit board is prepared by the method according to any one of claims 1 to 9.

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