Communication module heat dissipation device and heat dissipation method, electronic equipment and storage medium

Abstract

The invention provides a communication module heat dissipation device and heat dissipation method, electronic equipment and a storage medium. The communication module heat dissipation device comprises a heat conduction semiconductor, a heat absorption metal conductor and a heat dissipation metal conductor group, the heat conduction semiconductor is arranged on the surface of the communication module and used for absorbing surface heat of the communication module and dissipating the heat to the external environment. The heat absorption metal conductor is arranged between the heat conduction semiconductor and the communication module and is used for transmitting surface heat of the communication module to the heat conduction semiconductor; the heat dissipation metal conductor set is arranged between the heat conduction semiconductor and the external environment and used for transmitting heat dissipated by the heat conduction semiconductor to the external environment, the communication module heat dissipation device is arranged on the surface of the communication module, and through the heat pump effect of the heat conduction semiconductor, the heat conduction performance of the communication module is enhanced, and heat dissipation of the communication module is accelerated. Therefore, the purpose of cooling the vehicle-mounted system is achieved, and the working performance of the vehicle-mounted system is improved.

Description

Background Art

[0002] With the development of Internet of Things communication technology, in-vehicle wireless communications have evolved from early 2G / 3G cellular networks, Bluetooth 4.0, WIFI4 and other low-speed and narrow-bandwidth communications, to mature 4G LTE cellular networks, Bluetooth 4.1 low-power, WIFI5 communications, and now to the latest 5G NR communications, V2X communications, Bluetooth 5.0 and WIFI6 communications, UWB communications, etc.

[0003] With the improvement of in-vehicle wireless communication performance and technology, the power consumption of communication modules during operation will also increase. Especially with the introduction of the latest high-bandwidth technologies such as 5G NR and WiFi6, the overall heat generation of communication module parts has increased several times, especially in extremely hot working conditions. After the interior of the car is exposed to high heat environments such as the sun, the ambient temperature in some areas of the car can reach 95 degrees or above. Under ordinary heat dissipation technology, the heat generated by the components at work under the superposition of such ambient temperatures accumulates inside the car, causing the risk of the interior of the car parts exceeding 115 degrees or above. When the temperature inside the parts reaches this level, there is a risk of failure of the parts, which will bring huge functional, reliability and safety risks to the entire vehicle.

[0004] Therefore, as the communication rate and bandwidth of in-vehicle IoT are improved, how to effectively improve the heat dissipation of the system has become an urgent problem that needs to be solved in the development of in-vehicle communication components. Summary of the invention

[0005] In view of the above technical problems, the technical solution adopted by the present invention is: According to one aspect of the present application, a communication module heat dissipation device is provided, comprising: A heat-conducting semiconductor is disposed on the surface of the communication module and is used to absorb the surface heat of the communication module and dissipate it to the external environment; A heat-absorbing metal conductor is disposed between the heat-conducting semiconductor and the communication module, and is used to transfer the surface heat of the communication module to the heat-conducting semiconductor; The heat dissipation metal conductor group is arranged between the heat conduction semiconductor and the external environment, and is used to transfer the heat dissipated by the heat conduction semiconductor to the external environment.

[0006] In an exemplary embodiment of the present application, the thermally conductive semiconductor includes: An N-type semiconductor, one end of which is connected to a heat-absorbing metal conductor, and the other end of which is connected to a heat-dissipating metal conductor group; A P-type semiconductor has one end connected to a heat-absorbing metal conductor and the other end connected to a heat-dissipating metal conductor group.

[0007] In an exemplary embodiment of the present application, the heat dissipation metal conductor group includes: A first heat dissipation metal conductor is disposed between the N-type semiconductor and the external environment; The second heat dissipation metal conductor is arranged between the P-type semiconductor and the external environment.

[0008] In an exemplary embodiment of the present application, the first heat dissipation metal conductor is connected to the positive electrode of the power supply corresponding to the communication module, and the second heat dissipation metal conductor is connected to the negative electrode of the power supply corresponding to the communication module.

[0009] In an exemplary embodiment of the present application, a first insulating heat-conducting substrate is provided between the heat-absorbing metal conductor and the communication module, and a second insulating heat-conducting substrate is provided between the heat-dissipating metal conductor group and the external environment.

[0010] In an exemplary embodiment of the present application, the first heat dissipation metal conductor and the second heat dissipation metal conductor are both connected to the power supply corresponding to the communication module by means of a wiring harness or a pin.

[0011] In an exemplary embodiment of the present application, the first insulating thermally conductive substrate and the communication module, as well as the second insulating thermally conductive substrate and the heat dissipating metal conductor group are connected via thermally conductive silicone.

[0012] According to one aspect of the present application, a heat dissipation method of the above-mentioned communication module heat dissipation device is also provided, including: When the power supply corresponding to the communication module is turned on, the communication module is powered on; When electrons from the power supply corresponding to the communication module flow into the heat-absorbing metal conductor through the P-type semiconductor, the heat-absorbing metal conductor absorbs the heat emitted by the communication module; When electrons in the heat-absorbing metal conductor flow into the N-type semiconductor, the heat in the heat-absorbing metal conductor is transferred to the N-type semiconductor; When electrons in the N-type semiconductor flow into the first heat dissipation metal conductor, heat in the N-type semiconductor is transferred to the first heat dissipation metal conductor, and the heat in the first heat dissipation metal conductor is output to the external environment through the second insulating thermally conductive substrate.

[0013] According to one aspect of the present application, a non-transitory computer-readable storage medium is provided, in which at least one instruction or at least one program is stored. The at least one instruction or the at least one program is loaded and executed by a processor to implement the heat dissipation method of the aforementioned communication module heat dissipation device.

[0014] According to one aspect of the present application, an electronic device is provided, including a processor and the aforementioned non-transitory computer-readable storage medium.

[0015] The present invention has at least the following beneficial effects: The communication module heat dissipation device of the present invention comprises a heat-conducting semiconductor, a heat-absorbing metal conductor and a heat-dissipating metal conductor group; the heat-conducting semiconductor is arranged on the surface of the communication module, and is used to absorb the surface heat of the communication module and dissipate it to the external environment; the heat-absorbing metal conductor is arranged between the heat-conducting semiconductor and the communication module, and is used to transfer the surface heat of the communication module to the heat-conducting semiconductor; the heat-dissipating metal conductor group is arranged between the heat-conducting semiconductor and the external environment, and is used to transfer the heat dissipated by the heat-conducting semiconductor to the external environment. The communication module heat dissipation device is arranged on the surface of the communication module, and the heat pump effect of the heat-conducting semiconductor is used to enhance the heat conduction performance of the communication module, accelerate the heat dissipation of the communication module, thereby achieving the purpose of cooling the vehicle-mounted system, and improving the working performance of the vehicle-mounted system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A structural diagram of a heat dissipation device for a communication module provided in an embodiment of the present invention; Figure 2 A schematic diagram of the arrangement of a communication module heat dissipation device and a communication module provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0019] The current heat dissipation and cooling methods for vehicle-mounted high-bandwidth and high-speed communication modules use methods such as reducing system performance and shutting down some system functions to cool down, or using traditional heat sinks and air or water cooling to cool down.

[0020] The existing cooling method uses the strategy of reducing system performance and shutting down some system functions to reduce system power consumption and heat generation. The vehicle-mounted system detects the ambient temperature in real time. Under normal temperature conditions, the vehicle-mounted system works at full efficiency. When the environment reaches a higher temperature (such as above 80°C), the vehicle-mounted system reduces the operating frequency of some computing chips or shuts down some system functions carried by high-heat devices to reduce the system's workload, reduce the operating current, and reduce the system's power consumption, thereby reducing the system's heat generation and achieving the purpose of high-temperature protection of the system. In this heat dissipation and cooling method, the vehicle-mounted system does have a certain degree of inhibitory effect on system heat generation by means of software frequency reduction and shutting down some functions at high temperatures, but it also causes the car to lose some functions and performance at high temperatures.

[0021] The existing method of cooling by using traditional heat sinks and air cooling or water cooling auxiliary means improves heat dissipation by strengthening heat conduction and heat convection. It adds heat sinks on the surface of high-bandwidth and high-speed communication working units (such as 5G NR, WIFI6 and other communication modules) to improve conduction and export the heat generated by the communication working unit. There is also a small fan air cooling system added to the surface of the heat sink to improve the heat export of the communication working unit by improving convection, so as to reduce the internal system temperature of the working unit and ensure the stability of system performance. This method of heat dissipation and cooling by using traditional heat sinks in combination with air cooling or water cooling can indeed improve the heat dissipation capacity of the system, but it has certain requirements on the material, surface area and volume of the heat sink, and the power of the fan or water cooling. If the selection is not appropriate, the heat dissipation effect of the system is limited. In addition, the heat sink and air cooling or water cooling device have relatively large volume requirements for system components, while automotive products are limited by space constraints, and have very high requirements for the size of components, and there is a trend of miniaturization. Therefore, this heat dissipation method will make the position, installation design and layout of vehicle-mounted communication components in the whole vehicle impossible to achieve.

[0022] Based on the above defects in the prior art, a communication module heat dissipation device described in this application is proposed, such as Figure 1 As shown, it includes a heat-conducting semiconductor, a heat-absorbing metal conductor, a heat-dissipating metal conductor group, a first insulating heat-conducting substrate and a second insulating heat-conducting substrate.

[0023] The heat conducting semiconductor is arranged in the communication module (such as Figure 2 The surface of the heat generating honeycomb module shown in the figure is used to absorb the surface heat of the communication module and dissipate it into the external environment.

[0024] Further, heat conducting semiconductors include N-type semiconductors and P-type semiconductors. N-type semiconductors (such as Figure 1 N-type semiconductors (such as Figure 1 One end of the P type) is connected to the heat absorbing metal conductor (such as the attached Figure 1The other ends of the N-type semiconductor and the P-type semiconductor are connected to the heat dissipation metal conductor group (such as the attached Figure 1 The metal sheet connecting the lower ends of the N-type semiconductor and the P-type semiconductor.

[0025] The heat-absorbing metal conductor is disposed between the heat-conducting semiconductor and the first insulating heat-conducting substrate (such as the attached Figure 1 The insulating heat-conducting substrate is arranged on the upper end of the heat-absorbing metal conductor. Figure 1 The upper surface of the first insulating heat-conductive substrate is the heat-absorbing surface of the communication module heat dissipation device), the first insulating heat-conductive substrate is connected to the communication module at a side away from the heat-absorbing metal conductor, and the heat-absorbing metal conductor is used to transfer the surface heat of the communication module to the heat-conducting semiconductor through the first insulating heat-conductive substrate when electrons are transferred and moved.

[0026] The heat dissipation metal conductor group is arranged on the heat conductive semiconductor and the second insulating heat conductive substrate (such as the attached Figure 1 The insulating heat-conducting substrate is provided at the lower ends of the first heat-dissipating metal conductor and the second heat-dissipating metal conductor, Figure 1 The lower surface of the second insulating heat-conducting substrate is the heat dissipation surface of the communication module heat dissipation device, which is used to transfer the heat absorbed by the heat-conducting semiconductor to the external environment through the second insulating heat-conducting substrate.

[0027] Further, the heat dissipation metal conductor group includes a first heat dissipation metal conductor and a second heat dissipation metal conductor, the first heat dissipation metal conductor (such as the attached Figure 1 The metal sheet connected to the lower end of the N-type semiconductor in the middle) is arranged between the N-type semiconductor and the second insulating heat-conducting substrate, and the second heat dissipation metal conductor is arranged (such as the attached Figure 1 A metal sheet connected to the lower end of the P-type semiconductor in the middle) is between the P-type semiconductor and the second insulating thermally conductive substrate, the first heat dissipation metal conductor and the second heat dissipation metal conductor together constitute a heat dissipation metal conductor group, the first heat dissipation metal conductor and the second heat dissipation metal conductor and the external environment are both connected to the second insulating thermally conductive substrate, and the second insulating thermally conductive substrate is used to transfer heat in the first heat dissipation metal conductor and the second heat dissipation metal conductor to the external environment.

[0028] The first heat dissipation metal conductor is connected to a power supply corresponding to the communication module (i.e., the power supply connected to the communication module, which may be an attached Figure 2 The power supply and accessories of the PCB circuit board of the communication module are set in Figure 1 The positive electrode of the BT1 DC power supply in the communication module is connected, the second heat dissipation metal conductor is connected to the negative electrode of the power supply corresponding to the communication module, and the first heat dissipation metal conductor and the second heat dissipation metal conductor are used to dissipate heat when there is electron transmission and movement.

[0029] In addition, the first heat dissipation metal conductor and the second heat dissipation metal conductor are connected to the power supply corresponding to the communication module by means of a wiring harness or a pin to achieve normal power supply to the heat conduction semiconductor; the first insulating thermally conductive substrate and the communication module, as well as the second insulating thermally conductive substrate and the heat dissipation metal conductor group are connected by thermally conductive silicone.

[0030] In specific implementation, Figure 2 As shown, the heat absorbing surface of the communication module heat dissipation device of the present application (the side of the first insulating heat conductive substrate away from the heat absorbing metal conductor) is attached to the surface of the communication module or other heat source module, and the second insulating heat conductive substrate (such as Figure 2 The heat sink shown in the figure is embedded in the shell of the communication module heat dissipation device, a part of the metal of the second insulating heat-conductive substrate is exposed to the external environment, and the other part is in contact with the heat dissipation surface of the heat-conductive semiconductor (the side of the heat-dissipating metal conductor group away from the heat-conductive semiconductor) through the heat-conductive silicone inside the shell of the communication module heat dissipation device. The larger the contact area, the better the heat dissipation effect.

[0031] The communication module heat dissipation device of the present invention comprises a heat-conducting semiconductor, a heat-absorbing metal conductor and a heat-dissipating metal conductor group; the heat-conducting semiconductor is arranged on the surface of the communication module, and is used to absorb the surface heat of the communication module and dissipate it to the external environment; the heat-absorbing metal conductor is arranged between the heat-conducting semiconductor and the communication module, and is used to transfer the surface heat of the communication module to the heat-conducting semiconductor; the heat-dissipating metal conductor group is arranged between the heat-conducting semiconductor and the external environment, and is used to transfer the heat dissipated by the heat-conducting semiconductor to the external environment. The semiconductor material of the heat-conducting semiconductor is small and thin, and the communication module heat dissipation device is attached to the surface of the communication module without increasing the occupied volume of the communication module. Through the heat pump effect of the heat-conducting semiconductor, the heat conduction performance of the communication module is enhanced, and the heat dissipation of the communication module is accelerated, thereby achieving the purpose of cooling the vehicle-mounted system and improving the working performance of the vehicle-mounted system.

[0032] In addition, the heat dissipation method of the above-mentioned communication module heat dissipation device includes: Step S100: When the power supply corresponding to the communication module is turned on, the communication module is powered on and the electrons of the power supply flow from the negative electrode to the P-type semiconductor; P-type semiconductors are also called hole semiconductors. They have lower energy and can easily capture electrons. When electrons flow into P-type semiconductors, the energy of the electrons enters the valence band of the semiconductor from the Fermi level. The energy of electrons in the valence band is lower than the Fermi level, so the energy needs to be released, so heat is released on the heat dissipation surface.

[0033] Step S200: When electrons of the power supply corresponding to the communication module flow into the heat-absorbing metal conductor through the P-type semiconductor, the heat-absorbing metal conductor absorbs the heat emitted by the communication module; The electrons continue to move. When they enter the heat-absorbing metal conductor on the heat-absorbing surface from the P-type semiconductor, it is equivalent to the electrons moving from the valence band to the Fermi level. The energy is insufficient and needs to absorb energy from the outside, so heat is absorbed at this end.

[0034] Step S300, when electrons in the heat-absorbing metal conductor flow into the N-type semiconductor, heat in the heat-absorbing metal conductor is transferred to the N-type semiconductor; N-type semiconductors are electronic semiconductors with higher energy. When electrons enter an N-type semiconductor from a heat-absorbing metal conductor, it is equivalent to electrons entering the conduction band of the semiconductor from the Fermi level. The energy of electrons in the conduction band is higher, and this process requires heat absorption.

[0035] Step S400: When electrons in the N-type semiconductor flow into the first heat dissipation metal conductor, heat in the N-type semiconductor is transferred to the first heat dissipation metal conductor, and the heat in the first heat dissipation metal conductor is output to the external environment through the second insulating thermally conductive substrate.

[0036] The electrons continue to move in the N-type semiconductor. When the electrons enter the first heat dissipation metal conductor from the N-type semiconductor, the required energy is reduced and they begin to dissipate heat and output the heat to the external environment to achieve the purpose of heat dissipation and cooling. The electrons return to the positive pole of the power supply through the first heat dissipation metal conductor.

[0037] An embodiment of the present invention further provides a computer program product, which includes program code. When the program product is run on an electronic device, the program code is used to enable the electronic device to execute the steps of the method according to various exemplary embodiments of the present invention described above in this specification.

[0038] Through the description of the above implementation, it is easy for those skilled in the art to understand that the example implementation described here can be implemented by software, or by combining software with necessary hardware. Therefore, the technical solution according to the implementation of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, and includes several instructions to enable a computing device (which can be a personal computer, a server, a mobile terminal, or a network device, etc.) to execute the method according to the implementation of the present disclosure.

[0039] In an exemplary embodiment of the present disclosure, an electronic device capable of implementing the above method is also provided.

[0040] It will be appreciated by those skilled in the art that various aspects of the present invention may be implemented as a system, method or program product. Therefore, various aspects of the present invention may be specifically implemented in the following forms, namely: a complete hardware implementation, a complete software implementation (including firmware, microcode, etc.), or a combination of hardware and software, which may be collectively referred to herein as a "circuit", "module" or "system".

[0041] The electronic device according to this embodiment of the present invention is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0042] The electronic device is presented in the form of a general-purpose computing device. The components of the electronic device may include, but are not limited to: the at least one processor mentioned above, the at least one storage device mentioned above, and a bus connecting different system components (including storage devices and processors).

[0043] The storage stores program codes, which can be executed by the processor, so that the processor executes the steps according to various exemplary embodiments of the present invention described in the above “Exemplary Method” section of this specification.

[0044] The memory may include readable media in the form of volatile memory, such as random access memory (RAM) and / or cache memory, and may further include read only memory (ROM).

[0045] The storage may also include a program / utility having a set (at least one) of program modules, such program modules including but not limited to: an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment.

[0046] The bus may represent one or more of several types of bus structures including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processor, or a local bus using any of a variety of bus architectures.

[0047] The electronic device may also communicate with one or more external devices (e.g., keyboards, pointing devices, Bluetooth devices, etc.), one or more devices that enable a user to interact with the electronic device, and / or any device that enables the electronic device to communicate with one or more other computing devices (e.g., routers, modems, etc.). Such communication may be performed via an input / output (I / O) interface. Furthermore, the electronic device may also communicate with one or more networks (e.g., local area networks (LANs), wide area networks (WANs), and / or public networks, such as the Internet) via a network adapter.

[0048] Through the description of the above implementation, it is easy for those skilled in the art to understand that the example implementation described here can be implemented by software, or by software combined with necessary hardware. Therefore, the technical solution according to the implementation of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, and includes a number of instructions to enable a computing device (which can be a personal computer, a server, a terminal device, or a network device, etc.) to execute the method according to the implementation of the present disclosure.

[0049] In an exemplary embodiment of the present disclosure, a computer-readable storage medium is also provided, on which a program product capable of implementing the above method of the present specification is stored. In some possible implementations, various aspects of the present invention can also be implemented in the form of a program product, which includes a program code, and when the program product is run on a terminal device, the program code is used to enable the terminal device to execute the steps according to various exemplary embodiments of the present invention described in the above "Exemplary Method" section of the present specification.

[0050] The program product may be any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination thereof. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof.

[0051] Computer readable signal media may include data signals propagated in baseband or as part of a carrier wave, in which readable program code is carried. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Readable signal media may also be any readable medium other than a readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0052] The program code embodied on the readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wired, optical cable, RF, etc., or any suitable combination of the foregoing.

[0053] It should be noted that, although several modules or units of the device for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present disclosure, the features and functions of two or more modules or units described above can be embodied in one module or unit. On the contrary, the features and functions of one module or unit described above can be further divided into multiple modules or units to be embodied.

[0054] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A communication module heat dissipation device, characterized in that: include: A heat-conducting semiconductor, disposed on the surface of the communication module, for absorbing the surface heat of the communication module and dissipating it to the external environment; a heat-absorbing metal conductor, disposed between the heat-conducting semiconductor and the communication module, and used for transferring the surface heat of the communication module to the heat-conducting semiconductor; The heat dissipation metal conductor group is arranged between the heat conduction semiconductor and the external environment, and is used for transferring the heat dissipated by the heat conduction semiconductor to the external environment.

2. The communication module heat dissipation device according to claim 1, characterized in that: The heat conducting semiconductor comprises: An N-type semiconductor, one end of which is connected to the heat-absorbing metal conductor and the other end of which is connected to the heat-dissipating metal conductor group; A P-type semiconductor has one end connected to the heat-absorbing metal conductor and the other end connected to the heat-dissipating metal conductor group.

3. The communication module heat dissipation device according to claim 2, characterized in that: The heat dissipation metal conductor group includes: A first heat dissipation metal conductor is disposed between the N-type semiconductor and the external environment; The second heat dissipation metal conductor is arranged between the P-type semiconductor and the external environment.

4. The communication module heat dissipation device according to claim 3, characterized in that: The first heat dissipation metal conductor is connected to the positive electrode of the power supply corresponding to the communication module, and the second heat dissipation metal conductor is connected to the negative electrode of the power supply corresponding to the communication module.

5. The communication module heat dissipation device according to claim 4, characterized in that: A first insulating heat-conducting substrate is arranged between the heat-absorbing metal conductor and the communication module, and a second insulating heat-conducting substrate is arranged between the heat-dissipating metal conductor group and the external environment.

6. The communication module heat dissipation device according to claim 5, characterized in that: The first heat dissipation metal conductor and the second heat dissipation metal conductor are both connected to the power supply corresponding to the communication module by means of a wiring harness or a pin.

7. The communication module heat dissipation device according to claim 6, characterized in that: The first insulating heat-conductive substrate and the communication module, as well as the second insulating heat-conductive substrate and the heat-dissipating metal conductor group are connected via heat-conductive silica gel.

8. A heat dissipation method for a communication module heat dissipation device, applied to the communication module heat dissipation device according to any one of claims 1 to 7, characterized in that: The method comprises: When the power supply corresponding to the communication module is turned on, the communication module is powered on; When electrons of the power supply corresponding to the communication module flow into the heat-absorbing metal conductor through the P-type semiconductor, the heat-absorbing metal conductor absorbs the heat emitted by the communication module; When electrons in the heat-absorbing metal conductor flow into the N-type semiconductor, heat in the heat-absorbing metal conductor is transferred to the N-type semiconductor; When electrons in the N-type semiconductor flow into the first heat dissipation metal conductor, heat in the N-type semiconductor is transferred to the first heat dissipation metal conductor, and the heat in the first heat dissipation metal conductor is output to the external environment through the second insulating thermally conductive substrate.

9. A non-transitory computer-readable storage medium, wherein at least one instruction or at least one program is stored in the storage medium, characterized in that: The at least one instruction or the at least one program is loaded and executed by the processor to implement the method as claimed in claim 8.

10. An electronic device, characterized in that: The invention comprises a processor and the non-transitory computer-readable storage medium as claimed in claim 9.

Images