Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof and a display device.The display panel comprises a substrate, a light-emitting unit located on one side of the substrate, an isolation structure and a first packaging layer, the isolation structure is located on the side, away from the substrate, of the light-emitting unit, and multiple first openings are defined by the isolation structure; the isolation structure comprises a first end part and a second end part located on the side, away from the substrate, of the first end part, the orthographic projection of the second end part on the substrate covers the orthographic projection of the first end part on the substrate, and a concave part is configured on the side part of the end face, abutting against the second end part, of the first end part; the first packaging layer is located on the side, away from the substrate, of the light-emitting unit, and the first packaging layer covers the light-emitting unit and part of the isolation structure. The packaging distance of the first packaging layer on the side edge is increased by configuring the concave part, and particularly the length of the first packaging layer at the lap joint of the first end part and the second end part is increased, so that the packaging performance of the display panel is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display devices, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin film electroluminescent device. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] However, current electronic display products are limited by their own structural designs, and packaging failures are very likely to occur during the packaging of the display panel, which seriously affects the packaging reliability of the display panel. Summary of the invention

[0004] In view of this, an object of the present disclosure is to provide a display panel and a manufacturing method thereof, and a display device, wherein the display panel has good packaging performance.

[0005] Based on the above purpose, the first aspect of the present disclosure provides a display panel, the display panel comprising:

[0006] substrate;

[0007] an isolation structure, located at one side of the substrate, the isolation structure defining a plurality of first openings, the isolation structure comprising a first end and a second end, the second end being located at a side of the first end away from the substrate, the orthographic projection of the first end on the substrate being located within the orthographic projection of the second end on the substrate, and a recessed portion being disposed at a side of an end surface where the first end abuts against the second end;

[0008] a light emitting unit, at least a portion of which is located in the first opening;

[0009] The first encapsulation layer is located at a side of the light emitting unit away from the substrate, and the first encapsulation layer covers the light emitting unit and a portion of the isolation structure.

[0010] In one embodiment, the first end portion includes at least three isolation layers, and along the direction away from the substrate, the at least three isolation layers include a first isolation layer, a second isolation layer and a third isolation layer stacked in sequence, the orthographic projection of the third isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate, the orthographic projection of the second isolation layer on the substrate is located within the orthographic projection of the first isolation layer on the substrate, and the first encapsulation layer is provided with a protrusion, which is located on the side of the end surface where the first end portion and the second end portion abut each other.

[0011] In one embodiment, the materials of the at least three isolation layers are all conductive materials;

[0012] The material of the second isolation layer is different from that of the first isolation layer and the third isolation layer, and the material of the first isolation layer is the same as or different from that of the third isolation layer;

[0013] Preferably, under the same etching conditions, the etching rate of the second isolation layer is lower than the etching rate of the third isolation layer;

[0014] Preferably, the material of the third isolation layer includes molybdenum, the material of the second isolation layer includes aluminum, and the material of the first isolation layer includes molybdenum.

[0015] In one embodiment, the first encapsulation layer includes a protruding portion, the protruding portion is located in the recessed portion, and a shape of the protruding portion matches a shape of the recessed portion.

[0016] A recessed portion is disposed on the side of the end surface where the first end portion abuts against the second end portion, the protruding portion is located in the recessed portion, and the shape of the recessed portion matches the shape of the protruding portion;

[0017] In one embodiment, the light emitting unit includes a first sub-pixel and a second sub-pixel, and the first sub-pixel and the second sub-pixel emit different light waves;

[0018] The recessed portion includes a first recessed portion corresponding to the first sub-pixel and a second recessed portion corresponding to the second sub-pixel, and along a direction parallel to the surface where the substrate is located, a length of the second recessed portion is greater than a length of the first recessed portion;

[0019] The protrusion includes a first protrusion corresponding to the first sub-pixel and a second protrusion corresponding to the second sub-pixel. In a direction parallel to the surface where the substrate is located, the length of the second protrusion is greater than the length of the first protrusion.

[0020] In one embodiment, the light emitting unit further includes a third sub-pixel disposed in the first opening, and the light wave emitted by the third sub-pixel is different from the light waves emitted by the first sub-pixel and the second sub-pixel; the recessed portion further includes a third recessed portion corresponding to the third sub-pixel; along a direction parallel to the surface where the substrate is located, the length of the third recessed portion is greater than the length of the second recessed portion and greater than the length of the first recessed portion;

[0021] The protrusions further include a third protrusion corresponding to the third sub-pixel; along a direction parallel to the surface where the substrate is located, the length of the third protrusion is greater than the length of the second protrusion and greater than the length of the first protrusion.

[0022] In one embodiment, each of the sub-pixels includes a first electrode, a light-emitting functional layer, and a second electrode which are sequentially stacked on the substrate, and the second electrode is electrically connected to the first end.

[0023] In one embodiment, the light-emitting unit further includes a pixel defining layer, which is located on a side of the isolation structure where the pixel defining layer is located close to the substrate, and the pixel defining layer has a plurality of pixel openings corresponding to and connected to the first opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the first opening on the substrate.

[0024] A second aspect of the present disclosure provides a method for preparing a display panel, the method comprising the following steps:

[0025] providing a substrate;

[0026] An isolation structure is formed on one side of the substrate, comprising:

[0027] A first end and a second end are formed on one side of the substrate, the isolation structure defines a plurality of first openings, the second end is located on a side of the first end away from the substrate, the orthographic projection of the first end on the substrate is located within the orthographic projection of the second end on the substrate, and a recess is configured at a side of an end surface where the first end and the second end abut against each other;

[0028] forming a light emitting unit on one side of the substrate, wherein at least a portion of the light emitting unit is located in the first opening;

[0029] A first encapsulation layer is formed on a side of the light emitting unit away from the substrate, and the first encapsulation layer covers the light emitting unit and a part of the isolation structure.

[0030] In one embodiment, the step of forming the first end and the second end on one side of the substrate specifically includes:

[0031] forming a first isolation material layer on one side of the substrate;

[0032] forming a second isolation material layer on a side of the first isolation material layer facing away from the substrate;

[0033] The first isolation material layer and the second isolation material layer are patterned to form the first end portion and the second end portion.

[0034] In one embodiment, the step of forming a first isolation material layer on one side of the substrate specifically includes:

[0035] forming a first sub-isolation material layer, a second sub-isolation material layer and a third sub-isolation material layer in sequence on one side of the substrate;

[0036] The step of patterning the first isolation material layer and the second isolation material layer comprises:

[0037] The first sub-isolation material layer, the second sub-isolation material layer, the third sub-isolation material layer and the second isolation material layer are patterned to form a first isolation layer, a second isolation layer, a third isolation layer and the second end, which includes:

[0038] coating an organic layer on a side of the second isolation material layer facing away from the third sub-isolation material layer;

[0039] Patterning the organic layer to form an organic layer pattern, wherein the organic layer pattern covers a portion of the first isolation material layer;

[0040] Using a first etching process to etch the second isolation material layer, the third sub-isolation material layer, and a portion of the second sub-isolation material layer that are not covered by the organic layer pattern, so as to form the second end portion;

[0041] Using a second etching process, etching the third sub-isolation material layer, the second sub-isolation material layer and the first sub-isolation material layer covered by the organic layer pattern, and the second sub-isolation material layer and the first sub-isolation material layer not covered by the organic layer, to form the first end portion, wherein the etching rate of the second sub-isolation material layer is lower than the etching rate of the third sub-isolation material layer;

[0042] Preferably, the first etching process includes a dry etching process, and the second etching process includes a wet etching process.

[0043] In one embodiment, the step of forming a light emitting unit on one side of the substrate includes:

[0044] A first sub-pixel, a second sub-pixel and a third sub-pixel are formed on one side of the substrate, wherein the first sub-pixel, the second sub-pixel and the third sub-pixel have different emitted light waves;

[0045] Preferably, the step of forming a first encapsulation layer on a side of the light-emitting unit away from the substrate specifically includes:

[0046] forming the first encapsulation layer corresponding to the first sub-pixel on a side of the first sub-pixel facing away from the substrate;

[0047] forming the first encapsulation layer corresponding to the second sub-pixel on a side of the second sub-pixel away from the substrate;

[0048] The first encapsulation layer corresponding to the third sub-pixel is formed on a side of the third sub-pixel facing away from the substrate.

[0049] A third aspect of the present disclosure provides a display device, comprising any one of the display panels described above.

[0050] Compared with the prior art, the display panel provided by the present invention has a recessed portion on the side of the end surface where the first end portion abuts the second end portion, thereby increasing the packaging distance of the first packaging layer on the side, and especially increasing the length of the first packaging layer at the overlap between the first end portion and the second end portion, thereby improving the packaging performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the technical solutions in the present disclosure or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0052] Figure 1 is a cross-sectional schematic diagram of a display panel in the prior art;

[0053] Figure 2 Bit Figure 1 A magnified schematic diagram of part A;

[0054] Figure 3 A schematic cross-sectional view of a display panel provided in the first aspect of the present disclosure;

[0055] Figure 4 for Figure 3 A magnified schematic diagram of part C;

[0056] Figures 5 to 11 for Figure 3 A process diagram of a method for preparing a display panel;

[0057] Fig.12 The present invention is a flow chart of a method for preparing a display panel. DETAILED DESCRIPTION

[0058] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0059] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the embodiments of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0060] refer to Figure 1-Figure 2 In the display panel, an encapsulation layer 10, a light-emitting device 20 and an isolation structure 30 are provided. The encapsulation layer 10 covers the light-emitting device 20 to encapsulate the light-emitting device 20. However, due to the limitation of the structure of the isolation structure 30 itself, the side wall of the first end 31 and the top wall of the second end 32 of the encapsulation layer and the isolation structure 30 are not effectively encapsulated. Encapsulation failure is prone to occur in the overlap area B of the first end 31 and the second end 32, thereby generating dark spots. Therefore, how to improve the encapsulation of the encapsulation layer has become a problem to be solved urgently. Patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A record relevant contents of the isolation structure 30 for reference.

[0061] Based on the above reasons, the present disclosure provides a first aspect to provide a display panel, which increases the encapsulation distance of the first encapsulation layer at the side, thereby improving the encapsulation performance of the display panel.

[0062] Next join Figure 3-Figure 4 The display panel provided by the first aspect of the present disclosure is described, and the display panel includes a substrate 100, a light-emitting unit 200, an isolation structure 300 and a first encapsulation layer 400. The isolation structure 300 is located on a side of the light-emitting unit 200 away from the substrate 100. The isolation structure 300 defines a plurality of first openings. The isolation structure 300 includes a first end 310 and a second end 320. The second end 320 is located on a side of the first end 310 away from the substrate 100. The orthographic projection of the second end 320 on the substrate 100 covers the orthographic projection of the first end 310 on the substrate 100. A recessed portion 330 is configured on the side of the end surface where the first end 310 and the second end 320 abut against each other. At least a portion of the light-emitting unit 200 includes a first end 310 and a second end 320. 00 is located in the first opening, the first encapsulation layer 400 is located on the side of the light-emitting unit 200 away from the substrate 100, the first encapsulation layer 400 covers the light-emitting unit 200 and a portion of the isolation structure 300, the first encapsulation layer 400 includes a protrusion 410, the protrusion 410 is located in the recessed portion 330, and the shape of the protrusion 410 is adapted to the shape of the recessed portion 330. In this embodiment, by configuring the recessed portion 330 on the side of the end surface where the first end 310 and the second end 320 abut, the encapsulation distance of the first encapsulation layer 400 on the side is increased, especially the length of the first encapsulation layer 400 at the overlap of the first end 310 and the second end 320 is increased, thereby improving the encapsulation performance of the display panel.

[0063] Continue to refer Figure 3-Figure 4 In a specific embodiment, the orthographic projection of the first end on the substrate is located within the orthographic projection of the second end on the substrate, the first end 310 includes at least three isolation layers, and along the direction away from the substrate 10, the at least three isolation layers include a first isolation layer 311, a second isolation layer 312 and a third isolation layer 313 stacked in sequence, the orthographic projection of the third isolation layer 313 on the substrate 100 is located within the orthographic projection of the second isolation layer 312 on the substrate 100, and the orthographic projection of the second isolation layer 312 on the substrate 100 is located within the orthographic projection of the first isolation layer 311 on the substrate 100, so that the third isolation layer 313 forms an inwardly contracted structure, and then the subsequent first encapsulation layer 400 will extend to the recessed portion formed by the second isolation layer 312 and the third isolation layer 313 during the manufacturing process, thereby improving the encapsulation of the display panel, and further, the edge of the first isolation layer 311 protrudes outward from the edge of the second isolation layer 312, such a design is conducive to the subsequent overlap of the first end 310 with the cathode in the light-emitting unit 200, and improves the overlap yield of the cathode and the second end.

[0064] Continue to refer Figure 3-Figure 4In a specific embodiment, the material of the second end portion 320 can be a conductive structure with conductive material, or a non-conductive structure with non-conductive material. The first end portion 310 has a conductive structure, and the materials of at least three isolation layers are all conductive materials. Further, the second isolation layer 312 is different from the materials of the first isolation layer 311 and the third isolation layer 313, and the materials of the first isolation layer 311 and the third isolation layer 313 are the same or different. Further, the material activity of the third isolation layer 313 is less than the material activity of the second isolation layer 312, which is beneficial to avoid the subsequent light-emitting functional layer and the first end portion 310 from generating a point reaction, which affects the display effect of the display panel. The recessed portion 330 in the present disclosure is an etched groove, which is formed by etching the second end portion 320, the third isolation layer 313 and the second isolation layer 312. , so that the third isolation layer 313 forms a groove between the second end 320 and the second isolation layer 312, that is, the second isolation layer 312 is inwardly shrunk in the entire isolation structure 300. The etching in this embodiment is mainly divided into dry etching and wet etching. The formation of the recessed portion in this application mainly relies on wet etching. Therefore, based on the same etching conditions (during wet etching), when the etching speed of the second isolation layer 312 is less than the etching speed of the third isolation layer 313, a step structure can be formed between the third isolation layer 313 and the second isolation layer 312. The step structure can extend the packaging length of the first packaging layer, thereby improving the packaging performance of the first packaging layer.

[0065] Optionally, the material of the first isolation layer 311 is titanium (Ti) or molybdenum (Mo), the material of the second isolation layer 312 is aluminum (Al), silver (Ag) or copper (Cu), the material of the third isolation layer 313 is molybdenum (Mo), and the material of the second end 320 can be titanium (Ti). As a preferred embodiment, the material of the first isolation layer 311 is molybdenum, the material of the second isolation layer 312 is aluminum, the material of the third isolation layer 313 is molybdenum, and the material of the second end 320 can be titanium, that is, the isolation structure is a four-layer metal composite material of Mo / Al / Mo / Ti (molybdenum / aluminum / molybdenum / titanium).

[0066] Continue to refer Figure 2-Figure 3In a specific embodiment, the light-emitting unit includes a first sub-pixel, a second sub-pixel and a third pixel, and each sub-pixel 210 includes a first electrode 211, a light-emitting functional layer 212 and a second electrode 213 stacked in sequence in a direction away from the substrate, wherein the second electrode 213 is electrically connected to the first end 310. At least three sub-pixels 210 emit different light waves. At least three sub-pixels 210 include a first sub-pixel, a second sub-pixel and a third sub-pixel. The recessed portion 330 includes a first recessed portion corresponding to the first sub-pixel, a second recessed portion corresponding to the second sub-pixel, a third recessed portion corresponding to the third sub-pixel, and; it can also be understood that the protruding portion includes a first protruding portion corresponding to the first sub-pixel, a second protruding portion corresponding to the second sub-pixel and a third protruding portion corresponding to the third sub-pixel. Exemplarily, the first sub-pixel is a red light sub-pixel R, which is used to generate red light, the second sub-pixel is a green light sub-pixel G, which is used to generate green light, and the third sub-pixel is a blue light sub-pixel B, which is used to generate blue light. In the sub-pixel manufacturing process disclosed in the present invention, each sub-pixel 210 and its corresponding first encapsulation layer 400 are independently manufactured, but the film layer (evaporated film layer such as a light-emitting functional layer, etc.) in the sub-pixel 210 is evaporated on the entire surface of the display panel during evaporation. For example, taking the order of preparing the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B in sequence as an example, when preparing the first sub-pixel R, a first sub-pixel is formed in each first opening 301, and a first encapsulation layer 500 is prepared on the display panel to cover the first sub-pixel R, and then the encapsulation layer in part of the first opening 301 (used to form the second sub-pixel G and the third sub-pixel B in the final product) and the second electrode 213 and the light-emitting functional layer 212 of the first sub-pixel R are removed. In this process, the protective layer 400 is used to protect the light-emitting devices in other first openings 301. Based on this method, the second sub-pixel G and the third sub-pixel B are prepared in sequence, and finally the following is formed. Figure 4The first encapsulation layer 400 is shown. Further, during the manufacturing process, the first encapsulation layer 400 in the first opening 301 (used to form the second sub-pixel G and the third sub-pixel B in the final product) and the second electrode 213 and the light-emitting functional layer 212 of the first sub-pixel R are generally removed by wet etching. The wet etching will inevitably lead to further etching of the third isolation layer 313, so that the side etching amount of the third isolation layer 313 gradually increases, so the side etching amount of the first sub-pixel R is less than the side etching amount of the second sub-pixel G and the side etching amount of the third sub-pixel B. Further, the side etching amount of the third isolation layer 313 corresponding to each sub-pixel 210 can be expressed as the length of each recessed portion 330, and the length of the recessed portion 330 L includes the vertical distance between the edge of the third isolation layer 313 and the edge of the second end 320. Since the protrusion 410 is located in the recessed portion 330, the length L of the protrusion 410 is equal to the length L' of the recessed portion 330. The length of the first recessed portion corresponding to the first sub-pixel R is less than the length of the second recessed portion corresponding to the second sub-pixel G and the length of the third recessed portion corresponding to the third sub-pixel B, so that the packaging distance of the third sub-pixel is maximized. Correspondingly, the length of the first protrusion corresponding to the first sub-pixel R is less than the length of the second protrusion corresponding to the second sub-pixel G and the length of the third protrusion corresponding to the third sub-pixel B, so that the packaging distance of the third sub-pixel is maximized, which is the length L of the protrusion.

[0067] Continue to refer Figure 2-Figure 3 In a specific embodiment, the light-emitting unit 200 further includes a pixel defining layer 220, which is located on a side of the isolation structure 300 close to the substrate 100. The pixel defining layer 220 has a plurality of pixel openings corresponding to and connected to the first opening, and the orthographic projection of the pixel opening on the substrate 100 covers the orthographic projection of the first opening on the substrate 100. By designing the pixel defining layer 220, the risk of the first electrode 211 overlapping the adjacent isolation structure 300 (for example, the conductive first end portion thereof) can be eliminated, so that the first electrode 211 has a larger design size to ensure the design area of ​​the effective functional area.

[0068] Based on the same inventive concept, the second aspect of the present disclosure provides a method for manufacturing a display panel. Figure 3-Figure 12 The manufacturing method of the display panel is described below. The manufacturing method mainly includes the following steps:

[0069] S100: providing a substrate 100; S200: forming an isolation structure 300 on one side of the substrate 100; this step specifically includes:

[0070] A first end portion 310 and a second end portion 320 are formed on one side of the substrate 100, including:

[0071] forming a first isolation material layer 310a on one side of the substrate;

[0072] Forming a second isolation material layer 320a on a side of the first isolation material layer 310a facing away from the substrate;

[0073] Patterning the first isolation material layer 310 a and the second isolation material layer 320 a to form a first end portion 310 and a second end portion 320 ;

[0074] The isolation structure 300 defines a plurality of first openings, the second end 320 is located on a side of the first end 310 away from the substrate 100, the orthographic projection of the first end 310 on the substrate 100 is located within the orthographic projection of the second end 320 on the substrate 100, and a recess 310 is disposed on the side of the end surface where the first end 310 and the second end 320 abut against each other;

[0075] S300: forming a light-emitting unit 200 and a first encapsulation layer 400 on one side of the substrate, wherein at least a portion of the light-emitting unit 200 is located in the first opening, and the first encapsulation layer 400 covers the light-emitting unit 200 and a portion of the isolation structure 300.

[0076] Next, combine Figures 5 to 11 right Figure 3 The preparation process of the display panel shown is described in detail;

[0077] S110: Obtaining substrate 100

[0078] S120: providing a substrate 100 and forming a first electrode 211 on the substrate, wherein two adjacent first electrodes 211 are arranged at intervals, and the structure of the first electrode 211 after formation is as follows Figure 5 shown.

[0079] S130: Depositing an insulating material film layer 220a (eg, an inorganic material film layer) on the substrate 100 having the first electrode 211 formed thereon. The structure of the insulating material film layer 220a after formation is as follows: Figure 6 shown.

[0080] S210: forming a first isolation material layer 310a on one side of the substrate 100 (specifically on the insulating material film layer 220a), which includes sequentially forming a first sub-isolation material layer 311a, a second sub-isolation material layer 312a, and a third sub-isolation material layer 313a on one side of the substrate;

[0081] A second isolation material layer 320a is formed on the side of the first isolation material layer 310a (third sub-isolation material layer 313a) away from the substrate 100; the structure after the first isolation material layer 310a and the second isolation material layer 320a are formed is as follows Figure 7 shown.

[0082] S220: Coating an organic layer on the side of the second isolation material layer 320a away from the first isolation material layer 310a, and using a patterning process to form an organic layer pattern 500. The structure of the organic layer pattern 500 is as follows: Figure 8 As shown, the organic layer pattern 500 covers a portion of the first isolation material layer 310a and a portion of the second isolation material layer 320a; this step specifically includes:

[0083] S221: coating an organic layer on a side of the second isolation material layer 320a facing away from the substrate 100;

[0084] S222: a corresponding mask is arranged on the side of the organic layer facing away from the substrate 100, and the mask can shield the portion of the organic layer that needs to be patterned and expose the portion of the organic layer that does not need to be patterned.

[0085] S223: Expose and develop the organic layer, obtain an organic layer pattern 500 after exposure and development, and remove the mask. Here, the second isolation material layer 320a can be protected during the subsequent etching process by coating the organic layer. Optionally, the organic layer can be a photoresist, specifically a PR glue.

[0086] S230: Etching the first isolation material layer and the second isolation material layer using different etching processes respectively to form an isolation structure. The specific steps are as follows:

[0087] S231: The second isolation material layer 320a, the third sub-isolation material layer 313a and a portion of the second sub-isolation material layer 312a not covered by the organic layer pattern 500 are etched by a first etching process to form a second end portion 320. The structure formed in this step is as follows: Fig. 9 As shown, further, in the direction perpendicular to the plane of the substrate 100 (Z direction), the first etching process etches the second sub-isolation material layer 312a to a height that is half of the height of the entire second sub-isolation material layer 312a. It should be noted that the first etching process in this step is a dry etching process.

[0088] S232: The third sub-isolation material layer 313a, the second sub-isolation material layer 312a and the first sub-isolation material layer 311a covered by the organic layer pattern 500, and the second sub-isolation material layer 312a and the first sub-isolation material layer 311a not covered by the organic layer pattern 500 are etched by a second etching process to form a first end portion 310. The second etching process in this step is a wet etching process, and the third sub-isolation material layer 313a, the second sub-isolation material layer 312a and the first sub-isolation material layer 311a covered by the organic layer pattern 500 are side-etched by an etching liquid. Since the etching speed of the third sub-isolation material layer 313a is greater than the etching speed of the second sub-isolation material layer 312a, the side etching amount of the third sub-isolation material layer 313a is greater than the side etching amount of the second sub-isolation material layer 312a, thereby finally forming a step structure, which can extend the encapsulation length of the subsequent first encapsulation layer, thereby improving the encapsulation performance of the first encapsulation layer.

[0089] S233: Peeling off the organic layer pattern 500. The structure after peeling off the organic layer pattern is as follows: Fig.10 shown.

[0090] S310: Fig.11 As shown, the insulating material film layer 220 a is patterned to form a pixel defining layer 220 , and the pixel defining layer 220 covers the gap between adjacent first electrodes 211 .

[0091] S320: forming a light-emitting unit 200 and a first encapsulation layer 500 on the patterned display functional film layer, wherein the first encapsulation layer 500 covers the light-emitting unit 200 and a portion of the isolation structure 300, and a portion of the first encapsulation layer 500 extends into the recessed portion 330. This step includes forming a first sub-pixel and a first encapsulation layer corresponding to the first sub-pixel in the first opening; forming a second sub-pixel and a first encapsulation layer corresponding to the second sub-pixel in the first opening; and forming a third sub-pixel and a first encapsulation layer corresponding to the third sub-pixel in the first opening. The specific manufacturing steps are as follows:

[0092] S321: evaporating a light-emitting functional layer 212 on the first electrode 211 corresponding to the first opening;

[0093] S322: evaporating a second electrode 213 on the light-emitting functional layer 212 to form a sub-pixel 210 (also referred to as a light-emitting device) in each first opening of the isolation structure 300, wherein the evaporation angles of the evaporation source when evaporating the light-emitting functional layer 212 and the second electrode 213 are different;

[0094] S323: Evaporate the first encapsulation layer 500 on the second electrode 213. No mask plate is used in the evaporation process, so the evaporated material is also deposited on the second end 320; then deposit to form the first encapsulation layer 500 to cover the sub-pixel 210 (also called a light-emitting device). For example, the light-emitting layer in the evaporated light-emitting functional layer 212 can emit red light, that is, at this stage, a sub-pixel emitting red light is formed in each first opening of the isolation structure.

[0095] S324: forming (e.g., coating) a photoresist on the substrate on which the first encapsulation layer 500 is formed, and then patterning the photoresist to form a photoresist pattern. Using the photoresist pattern as a mask, etching the surface of the display panel to remove the first encapsulation layer 500, the second electrode 213, and the light-emitting functional layer 212 that are not covered by the photoresist pattern; and then removing the remaining photoresist pattern.

[0096] S325: Repeat the above steps S321 to S324 to form a second sub-pixel G emitting green light and a third sub-pixel B emitting blue light in other first openings, and form Fig. 9 The display panel shown.

[0097] Based on the same inventive concept, the third aspect of the present disclosure provides a display device, which includes the above-mentioned display panel provided by the embodiment of the present disclosure. Since the principle of solving the problem by the display device is similar to the principle of solving the problem by the above-mentioned display panel, the implementation of the display device provided by the embodiment of the present disclosure can refer to the implementation of the above-mentioned display panel provided by the embodiment of the present disclosure, and the repeated parts will not be repeated.

[0098] The display device provided in the embodiment of the present invention can be applied to a mobile phone, or any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiment of the present invention does not make any special limitations on this.

[0099] It should be noted that the above describes some embodiments of the present disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0100] The embodiments of the present disclosure are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present disclosure should be included in the scope of protection of the present disclosure.

Claims

1. A display panel, characterized in that: include: substrate; an isolation structure, located at one side of the substrate, the isolation structure defining a plurality of first openings, the isolation structure comprising a first end and a second end, the second end being located at a side of the first end away from the substrate, the orthographic projection of the first end on the substrate being located within the orthographic projection of the second end on the substrate, and a recessed portion being disposed at a side of an end surface where the first end abuts against the second end; a light emitting unit, at least a portion of which is located in the first opening; The first encapsulation layer is located at a side of the light emitting unit away from the substrate, and the first encapsulation layer covers the light emitting unit and a portion of the isolation structure.

2. The display panel according to claim 1, characterized in that: The first end portion includes at least three isolation layers. Along the direction away from the substrate, the at least three isolation layers include a first isolation layer, a second isolation layer and a third isolation layer stacked in sequence. The orthographic projection of the third isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate, and the orthographic projection of the second isolation layer on the substrate is located within the orthographic projection of the first isolation layer on the substrate.

3. The display panel according to claim 2, characterized in that: The materials of the at least three isolation layers are all conductive materials; The material of the second isolation layer is different from that of the first isolation layer and the third isolation layer, and the material of the first isolation layer is the same as or different from that of the third isolation layer; Preferably, under the same etching conditions, the etching rate of the second isolation layer is lower than the etching rate of the third isolation layer; Preferably, the material of the third isolation layer includes molybdenum, the material of the second isolation layer includes aluminum, and the material of the first isolation layer includes molybdenum.

4. The display panel according to claim 1, characterized in that: The first encapsulation layer includes a protruding portion, the protruding portion is located in the concave portion, and a shape of the protruding portion is matched with a shape of the concave portion.

5. The display panel according to claim 1, characterized in that: The light-emitting unit includes a first sub-pixel and a second sub-pixel, and the first sub-pixel and the second sub-pixel emit different light waves; The recessed portion includes a first recessed portion corresponding to the first sub-pixel and a second recessed portion corresponding to the second sub-pixel, and along a direction parallel to the surface where the substrate is located, a length of the second recessed portion is greater than a length of the first recessed portion.

6. The display panel according to claim 5, characterized in that: The light-emitting unit also includes a third sub-pixel arranged in the first opening, and the light wave emitted by the third sub-pixel is different from the light waves emitted by the first sub-pixel and the second sub-pixel; the recessed portion also includes a third recessed portion corresponding to the third sub-pixel; along the direction parallel to the surface where the substrate is located, the length of the third recessed portion is greater than the length of the second recessed portion and greater than the length of the first recessed portion.

7. The display panel according to any one of claims 5 or 6, characterized in that: Each of the sub-pixels includes a first electrode, a light-emitting functional layer, and a second electrode which are sequentially stacked on the substrate, and the second electrode is electrically connected to the first end.

8. The display panel according to claim 1, characterized in that: The light-emitting unit also includes a pixel defining layer, which is located on a side of the isolation structure close to the substrate, and has a plurality of pixel openings corresponding to and connected to the first opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the first opening on the substrate.

9. A display panel, characterized in that: include: substrate; an isolation structure, located at one side of the substrate, the isolation structure defining a plurality of first openings, the isolation structure comprising a first end and a second end, the second end being located at a side of the first end facing away from the substrate, and an orthographic projection of the first end on the substrate being located within an orthographic projection of the second end on the substrate; a light emitting unit, at least a portion of which is located in the first opening; The first packaging layer is located on a side of the light emitting unit away from the substrate, covers the light emitting unit and part of the isolation structure, and is provided with a protrusion located on a side of abutting end faces of the first end and the second end.

10. The display panel according to claim 9, characterized in that: A recessed portion is disposed on the side of the end surface where the first end portion abuts against the second end portion, the protruding portion is located in the recessed portion, and the shape of the recessed portion matches the shape of the protruding portion; Preferably, the first end portion includes at least three isolation layers, and the at least three isolation layers include a first isolation layer, a second isolation layer and a third isolation layer stacked in sequence, the orthographic projection of the third isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate, and the orthographic projection of the second isolation layer on the substrate is located within the orthographic projection of the first isolation layer on the substrate.

11. The display panel according to claim 10, characterized in that: The materials of the at least three isolation layers are all conductive materials; The material of the second isolation layer is different from that of the first isolation layer and the third isolation layer, and the material of the first isolation layer is the same as or different from that of the third isolation layer; Preferably, under the same etching conditions, the etching rate of the second isolation layer is lower than the etching rate of the third isolation layer; Preferably, the material of the third isolation layer includes molybdenum, the material of the second isolation layer includes aluminum, and the material of the first isolation layer includes molybdenum.

12. The display panel according to claim 9, characterized in that: The light-emitting unit includes a first sub-pixel and a second sub-pixel, and the first sub-pixel and the second sub-pixel emit different light waves; The protrusion includes a first protrusion corresponding to the first sub-pixel and a second protrusion corresponding to the second sub-pixel. In a direction parallel to the surface where the substrate is located, the length of the second protrusion is greater than the length of the first protrusion.

13. The display panel according to claim 12, characterized in that: The light emitting unit further includes a third sub-pixel disposed in the first opening, and the light waves emitted by the third sub-pixel are different from the light waves emitted by the first sub-pixel and the second sub-pixel; The protrusions further include a third protrusion corresponding to the third sub-pixel; along a direction parallel to the surface where the substrate is located, the length of the third protrusion is greater than the length of the second protrusion and greater than the length of the first protrusion.

14. The display panel according to claim 12 or 13, characterized in that: Preferably, each of the sub-pixels comprises a first electrode, a light-emitting functional layer and a second electrode which are sequentially stacked on the substrate, and the second electrode is electrically connected to the first end.

15. The display panel according to claim 9, characterized in that: The light-emitting unit also includes a pixel defining layer, which is located on a side of the isolation structure close to the substrate, and has a plurality of pixel openings corresponding to and connected to the first opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the first opening on the substrate.

16. A method for preparing a display panel, characterized in that: The steps include: providing a substrate; An isolation structure is formed on one side of the substrate, comprising: A first end and a second end are formed on one side of the substrate, the isolation structure defines a plurality of first openings, the second end is located on a side of the first end away from the substrate, the orthographic projection of the first end on the substrate is located within the orthographic projection of the second end on the substrate, and a recess is configured at a side of an end surface where the first end and the second end abut against each other; forming a light emitting unit on one side of the substrate, wherein at least a portion of the light emitting unit is located in the first opening; A first encapsulation layer is formed on a side of the light emitting unit away from the substrate, and the first encapsulation layer covers the light emitting unit and a part of the isolation structure.

17. The method for manufacturing a display panel according to claim 16, characterized in that: The step of forming a first end portion and a second end portion on one side of the substrate specifically comprises: forming a first isolation material layer on one side of the substrate; forming a second isolation material layer on a side of the first isolation material layer facing away from the substrate; The first isolation material layer and the second isolation material layer are patterned to form the first end portion and the second end portion.

18. The method for preparing a display panel according to claim 17, characterized in that: The step of forming a first isolation material layer on one side of the substrate specifically includes: forming a first sub-isolation material layer, a second sub-isolation material layer and a third sub-isolation material layer in sequence on one side of the substrate; The step of patterning the first isolation material layer and the second isolation material layer comprises: The first sub-isolation material layer, the second sub-isolation material layer, the third sub-isolation material layer and the second isolation material layer are patterned to form a first isolation layer, a second isolation layer, a third isolation layer and the second end, which includes: coating an organic layer on a side of the second isolation material layer facing away from the third sub-isolation material layer; Patterning the organic layer to form an organic layer pattern, wherein the organic layer pattern covers a portion of the first isolation material layer; Etching the second isolation material layer, the third sub-isolation material layer, and a portion of the second sub-isolation material layer that are not covered by the organic layer pattern using a first etching process to form the second end portion; Using a second etching process, etching the third sub-isolation material layer, the second sub-isolation material layer and the first sub-isolation material layer covered by the organic layer pattern, and the second sub-isolation material layer and the first sub-isolation material layer not covered by the organic layer, to form the first end portion, wherein the etching rate of the second sub-isolation material layer is lower than the etching rate of the third sub-isolation material layer; Preferably, the first etching process includes a dry etching process, and the second etching process includes a wet etching process.

19. The method for preparing a display panel according to claim 17, wherein: The step of forming a light emitting unit on one side of the substrate comprises: A first sub-pixel, a second sub-pixel and a third sub-pixel are formed on one side of the substrate, wherein the first sub-pixel, the second sub-pixel and the third sub-pixel have different outgoing light waves; Preferably, the step of forming a first encapsulation layer on a side of the light-emitting unit away from the substrate specifically includes: forming the first encapsulation layer corresponding to the first sub-pixel on a side of the first sub-pixel facing away from the substrate; forming the first encapsulation layer corresponding to the second sub-pixel on a side of the second sub-pixel facing away from the substrate; The first encapsulation layer corresponding to the third sub-pixel is formed on a side of the third sub-pixel facing away from the substrate.

20. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-15.

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