Semiconductor vehicle-mounted cold and warm box with efficient heat exchange structure

Abstract

The invention relates to a semiconductor vehicle-mounted cold and warm box with an efficient heat exchange structure. The semiconductor cooling and heating box solves the technical problems that an existing semiconductor cooling and heating box in a single direct cooling or air cooling heat exchange mode cannot achieve rapid heating and cooling of loads in the box and the like. Comprising a cold-warm box inner shell with a containing cavity, the lower end of the cold-warm box inner shell is sealed through a cold-end heat preservation layer, a circulation cavity is formed in the lower end of the cold-warm box inner shell, the circulation cavity is communicated with the containing cavity through an air cooling circulation structure, cold-end fins are arranged at the lower end of the cold-warm box inner shell, and the upper ends of the cold-end fins are provided with containing faces. The lower ends of the cold-end fins are connected with the thermoelectric refrigeration assembly through the cold conduction block. The direct cooling and air cooling combined heat exchanger has the advantages that a direct cooling and air cooling combined heat exchange mode is adopted during working, meanwhile, the contact area of a load and a direct cooling area is increased, the heat exchange capacity of the load can be further improved through an air cooling circulation structure, and the load placed in the heat exchanger can be heated and cooled more quickly.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor electronic cooling and heating boxes, and in particular relates to a semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure. Background Art

[0002] At present, semiconductor vehicle-mounted cooling and heating boxes mainly have two heat exchange forms: direct cooling and air cooling. Direct cooling semiconductor cooling and heating boxes use semiconductors to cool or heat the aluminum liner, and then cool or heat the internal items. However, this structure has certain defects. The contact area between the load and the inner wall of the cooling and heating box is too small, and heat exchange cannot be fully carried out, and the heat exchange efficiency is weak. The air-cooled semiconductor cooling and heating box circulates cold air to the inside of the cooling and heating box through a fan, so that the temperature inside the entire cooling and heating box is uniform. By placing the load in the cooling and heating box and exchanging heat with the cold air in the cooling and heating box, the load can be fully in contact with the cold air in this cooling method. Compared with direct cooling cooling and heating boxes, the cooling efficiency will be relatively high. However, after all, heat conduction is carried out through air as a medium, so the cooling efficiency is not very high. Therefore, semiconductor cooling and heating boxes with a single direct cooling or air cooling heat exchange form cannot achieve rapid heating and cooling for the load in the box. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure in order to solve the above-mentioned problems.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solutions: a semiconductor vehicle-mounted cold and warm box with an efficient heat exchange structure, comprising a cold and warm box inner shell with a placement cavity, the lower end of the cold and warm box inner shell is closed by a cold end insulation layer, the lower end of the cold and warm box inner shell is provided with a circulation cavity independently provided with the placement cavity, the circulation cavity is connected with the placement cavity through an air-cooled circulation structure, a cold end fin is provided at the lower end of the cold and warm box inner shell passing through the circulation cavity and extending into the placement cavity, the upper end of the cold end fin has a placement surface located at the bottom of the placement cavity, and the lower end of the cold end fin is connected to a thermoelectric refrigeration component provided on the cold end insulation layer through a cold conduction block. The cooling and heating functions of the cold and warm box are realized by the thermoelectric refrigeration component, which provides the required cooling and heat for the placement cavity, the placement surface of the cold end fin is directly provided in the placement cavity, which increases the contact area of ​​the direct cooling area, and at the same time cooperates with the air-cooled circulation structure to further improve the heat exchange capacity of the cold and warm box.

[0005] In the above-mentioned semiconductor vehicle-mounted heating and cooling box with a high-efficiency heat exchange structure, a partition assembly is provided on the inner side of the inner shell of the heating and cooling box, the placement cavity is formed on one side of the partition assembly, and the circulation cavity is formed between the other side of the partition assembly and the cold end insulation layer. The structural design inside the heating and cooling box is such that when the heating and cooling box is in cooling operation, the temperature of the cold end fin is lower than the air temperature inside the heating and cooling box, so that the contact area between the load and the cold end fin can perform heat exchange with higher efficiency, and in the non-contact area, heat exchange is performed with the cold air in the heating and cooling box through the air cooling circulation structure in the heating and cooling box, and the same is true when the heating and cooling box is in heating operation.

[0006] In the above-mentioned semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure, the partition assembly includes a vertically arranged first side plate, the lower end of the first side plate is connected to the horizontally arranged bottom plate, the end of the bottom plate away from the first side plate is connected to the vertically arranged second side plate, and the opening is formed between the upper end of the first side plate and the upper end of the second side plate.

[0007] In the above-mentioned semiconductor vehicle-mounted cold and warm box with a high-efficiency heat exchange structure, the placement cavity is formed between the first side plate, the bottom plate and the second side plate, the first side plate is provided with a vertically arranged guide plate on the side away from the bottom plate, the end of the bottom plate away from the first side plate is provided with a vertically arranged sealing plate connected to the cold end insulation layer, and the circulation cavity is formed between the guide plate, the first side plate, the bottom plate, the cold end insulation layer and the sealing plate.

[0008] In the semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure, the bottom plate has a mounting hole in the middle for inserting the upper end of the cold end fin, and the upper end of the cold end fin is plugged into the mounting hole and the upper end surface of the cold end fin has a plurality of circular arc grooves arranged in sequence along the upper end surface of the cold end fin, and the two ends of the circular arc groove extend to the bottom plate respectively and the placement surface is formed in the circular arc groove. The design structure of the circular arc groove allows the load to fully contact the cold end fin when placed in the cooling and heating box.

[0009] In the above-mentioned semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure, the air-cooling circulation structure includes an arc-shaped guide portion arranged at the upper end of the guide plate and bent toward the first side plate to one side of the first side plate, and the upper end of the first side plate is provided with an air outlet corresponding to the arc-shaped guide portion and used to connect the placement chamber and the circulation chamber, and the end of the bottom plate close to the second side plate is provided with a return air port for connecting the placement chamber and the circulation chamber, and an air-cooling circulation component corresponding to the return air port and located on the side of the cold end fin away from the air outlet is provided in the circulation chamber, and the cold end fin has a plurality of guide channels for connecting the return air port and the air outlet. The air in the placement chamber is drawn into the circulation chamber from the return air port through the air-cooling circulation component, and then the temperature is changed through the guide channel of the cold end fin, and then discharged into the placement chamber from the air outlet, thereby realizing rapid adjustment of the internal temperature of the placement chamber.

[0010] In the semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure, the air-cooling circulation component is a centrifugal fan arranged between one side of the cold end fin and one side of the sealing plate. The centrifugal fan is used to circulate air between the placement chamber and the circulation chamber.

[0011] In the above-mentioned semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure, one end of the cold-end insulation layer has an arc-shaped portion extending upward to the lower end of the first side plate, and a cooling block mounting hole is provided on the cold-end insulation layer, and the cooling block is installed and fixed in the cooling block mounting hole and one side of the cooling block is arranged against the lower end of the cold-end fin.

[0012] In the above-mentioned semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure, the thermoelectric refrigeration component includes a plurality of thermoelectric cooling plates arranged at one end of the cooling block away from the cold end fins, and sealing insulation pads are provided between the thermoelectric cooling plates. The thermoelectric cooling plates are connected to the hot end fins with a heat dissipation fan.

[0013] In the above-mentioned semiconductor vehicle-mounted heating and cooling box with a high-efficiency heat exchange structure, an opening connected to the placement cavity is provided at the upper end of the heating and cooling box inner shell, and a heating and cooling box door panel is movably provided at the opening, a heating and cooling box outer shell is provided on the circumferential outer side of the heating and cooling box inner shell, the heating and cooling box outer shell extends to the circumferential outer side of the cold end insulation layer, and an insulation layer is provided between the heating and cooling box outer shell, the cold end insulation layer and the heating and cooling box inner shell.

[0014] Compared with the prior art, the advantages of the present invention are:

[0015] 1. The device adopts a heat exchange method that combines direct cooling and air cooling when working, while increasing the contact area between the load and the direct cooling area. The air cooling circulation structure can further improve the load heat exchange capacity. Therefore, compared with semiconductor refrigerators with a single heat exchange form, the load placed inside can be heated and cooled more quickly, thereby improving the user's driving comfort experience.

[0016] 2. The cold end fins of the device can directly contact the load placed inside. During cooling, the cold end fins will be lower than the air temperature in the cooling and heating box. The contact area between the load and the cold end fins will have a more efficient heat exchange than air cooling. Therefore, direct cooling and air cooling work together during operation, and compared with general semiconductor cooling and heating boxes, it has a more efficient heat exchange efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural cross-sectional view of the present invention.

[0018] Figure 2 It is a structural cross-sectional view from another perspective of the present invention.

[0019] Figure 3 It is the internal structure diagram of the present invention.

[0020] In the figure: the inner shell of the heating and cooling box 1, the placement cavity 11, the heating and cooling box door panel 12, the cold end insulation layer 13, the circulation cavity 14, the arc portion 15, the cold conduction block mounting hole 16, the heating and cooling box outer shell 17, the insulation layer 18, the air cooling circulation structure 2, the arc guide portion 21, the air outlet 22, the return air outlet 23, the cold end fin 3, the placement surface 31, the arc groove 32, the guide channel 33, the cold conduction block 4, the thermoelectric cooling component 5, the thermoelectric cooling sheet 51, the sealing insulation pad 52, the hot end fin 53, the heat dissipation fan 54, the partition assembly 6, the first side plate 61, the bottom plate 62, the second side plate 63, the guide plate 64, the sealing plate 65, the mounting hole 66, the air cooling circulation component 7, and the centrifugal fan 71. DETAILED DESCRIPTION

[0021] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] like Figure 1-3 As shown, a semiconductor vehicle-mounted cold and warm box with a high-efficiency heat exchange structure includes a cold and warm box inner shell 1 with a placement cavity 11, the lower end of the cold and warm box inner shell 1 is closed by a cold end insulation layer 13, the lower end of the cold and warm box inner shell 1 is provided with a circulation cavity 14 independently provided with the placement cavity 11, the circulation cavity 14 is connected with the placement cavity 11 through an air-cooled circulation structure 2, and a cold end fin 3 is provided at the lower end of the cold and warm box inner shell 1, which passes through the circulation cavity 14 and extends into the placement cavity 11, and the upper end of the cold end fin 3 has a placement surface 31 located at the bottom of the placement cavity 11, and the lower end of the cold end fin 3 is connected to a thermoelectric refrigeration component 5 provided on the cold end insulation layer 13 through a cold conduction block 4. The cooling and heating functions of the cold and warm box are realized by the thermoelectric refrigeration component 5, which provides the required cooling and heat for the placement cavity 11, and the placement surface 31 of the cold end fin 3 is directly provided in the placement cavity 11, which increases the contact area of ​​the direct cooling area, and cooperates with the air-cooled circulation structure 2 to further improve the heat exchange capacity of the cold and warm box.

[0023] Combination Figure 2 and Figure 3 As shown, a partition assembly 6 is provided inside the inner shell 1 of the cold and warm box, a placement cavity 11 is formed on one side of the partition assembly 6, and a circulation cavity 14 is formed between the other side of the partition assembly 6 and the cold end insulation layer 13. The structural design inside the cold and warm box is that when the cold and warm box is in cooling operation, the temperature of the cold end fin 3 is lower than the air temperature inside the cold and warm box, so the contact area between the load and the cold end fin 3 can perform heat exchange with higher efficiency, and in the non-contact area, the air-cooled circulation structure 2 in the cold and warm box is used to perform heat exchange with the cold air in the cold and warm box, and the same is true when the cold and warm box is in heating operation.

[0024] Among them, the partition assembly 6 includes a vertically arranged first side plate 61, the lower end of the first side plate 61 is connected to the horizontally arranged bottom plate 62, the end of the bottom plate 62 away from the first side plate 61 is connected to the vertically arranged second side plate 63, and an opening is formed between the upper end of the first side plate 61 and the upper end of the second side plate 63.

[0025] Specifically, the placement cavity 11 is formed between the first side plate 61, the bottom plate 62 and the second side plate 63, a vertically arranged guide plate 64 is provided on the side of the first side plate 61 away from the bottom plate 62, an end of the bottom plate 62 away from the first side plate 61 is provided with a vertically arranged sealing plate 65 connected to the cold end insulation layer 13, and a circulation cavity 14 is formed between the guide plate 64, the first side plate 61, the bottom plate 62, the cold end insulation layer 13 and the sealing plate 65.

[0026] Furthermore, the bottom plate 62 has a mounting hole 66 in the middle for inserting the upper end of the cold end fin 3, and the upper end of the cold end fin 3 is inserted into the mounting hole 66, and the upper end surface of the cold end fin 3 has a plurality of arc grooves 32 arranged in sequence along the upper end surface of the cold end fin 3, and both ends of the arc groove 32 extend to the bottom plate 62 respectively, and the placement surface 31 is formed in the arc groove 32. The design structure of the arc groove 32 allows the load to fully contact the cold end fin 3 when the load is placed in the cold and warm box.

[0027] Combination Figure 1 and Figure 3As shown, the air-cooling circulation structure 2 includes an arc-shaped guide portion 21 arranged at the upper end of the guide plate 64 and bent toward the first side plate 61 to the side of the first side plate 61, and the upper end of the first side plate 61 is provided with an air outlet 22 corresponding to the arc-shaped guide portion 21 and used to connect the placement chamber 11 and the circulation chamber 14, and the end of the bottom plate 62 close to the second side plate 63 is provided with a return air port 23 for connecting the placement chamber 11 and the circulation chamber 14, and an air-cooling circulation component 7 corresponding to the return air port 23 and located on the side of the cold end fin 3 away from the air outlet 22 is provided in the circulation chamber 14, and the cold end fin 3 is provided with a plurality of guide channels 33 for connecting the return air port 23 and the air outlet 22. The air in the placement chamber 11 is drawn into the circulation chamber 14 from the return air port 23 through the air cooling circulation component 7, and then the temperature is changed through the guide channel 33 of the cold end fin 3, and then discharged into the placement chamber 11 from the air outlet 22, thereby realizing rapid adjustment of the internal temperature of the placement chamber 11.

[0028] The air-cooling circulation component 7 is a centrifugal fan 71 disposed between one side of the cold end fin 3 and one side of the sealing plate 65. The centrifugal fan 71 is used to circulate air between the placement chamber 11 and the circulation chamber 14.

[0029] Specifically, one end of the cold end insulation layer 13 has an arc portion 15 extending upward to the lower end of the first side plate 61, and a cooling block mounting hole 16 is provided on the cold end insulation layer 13. The cooling block 4 is installed and fixed in the cooling block mounting hole 16, and one side of the cooling block 4 is arranged against the lower end of the cold end fin 3.

[0030] like Figure 2 As shown, the thermoelectric cooling assembly 5 includes a plurality of thermoelectric cooling sheets 51 arranged at one end of the cooling block 4 away from the cold end fin 3, and sealing insulation pads 52 are provided between the thermoelectric cooling sheets 51. The thermoelectric cooling sheets 51 are connected to the hot end fin 53 with a heat dissipation fan 54.

[0031] like Figure 3 As shown, an opening communicating with the placement cavity 11 is provided at the upper end of the cold and warm box inner shell 1, and a cold and warm box door panel 12 is movably provided at the opening, a cold and warm box outer shell 17 is provided on the circumferential outer side of the cold and warm box inner shell 1, the cold and warm box outer shell 17 extends to the circumferential outer side of the cold end insulation layer 13, and an insulation layer 18 is provided between the cold and warm box outer shell 17, the cold end insulation layer 13 and the cold and warm box inner shell 1.

[0032] The principle of this embodiment is:

[0033] The upper end of the cold end fin 3 is directly exposed in the placement cavity 11, and can be in direct contact with the load placed in the inner shell 1 of the cold and warm box, so as to transfer the cold or heat of the cold end fin 3 to the placement cavity 11 to achieve the purpose of direct cooling or direct heating. At the same time, the centrifugal fan 71 is running, and the air in the placement cavity 11 is drawn into the circulation cavity 14 from the return air port 23, and then the cold air or hot air is discharged into the placement cavity 11 from the air outlet 22. The cycle is repeated to reduce or increase the temperature in the placement cavity 11, thereby having a more efficient heat exchange efficiency.

[0034] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

[0035] Although the present invention uses more terms such as the inner shell of the cold and warm box 1, the placement cavity 11, the cold and warm box door panel 12, the cold end insulation layer 13, the circulation cavity 14, the arc portion 15, the cold guide block mounting hole 16, the cold and warm box outer shell 17, the insulation layer 18, the air cooling circulation structure 2, the arc guide portion 21, the air outlet 22, the return air outlet 23, the cold end fin 3, the placement surface 31, the arc groove 32, the guide channel 33, the cold guide block 4, the thermoelectric cooling component 5, the thermoelectric cooling sheet 51, the sealing insulation pad 52, the hot end fin 53, the heat dissipation fan 54, the partition assembly 6, the first side plate 61, the bottom plate 62, the second side plate 63, the guide plate 64, the sealing plate 65, the mounting hole 66, the air cooling circulation component 7, the centrifugal fan 71, etc., the possibility of using other terms is not excluded. The use of these terms is only for the purpose of more conveniently describing and explaining the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention.

Claims

1. A semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure, comprising a cooling and heating box inner shell (1) having a placement cavity (11), wherein the lower end of the cooling and heating box inner shell (1) is sealed by a cold end insulation layer (13), characterized in that: The lower end of the cold and warm box inner shell (1) is provided with a circulation chamber (14) which is independently arranged with the placement chamber (11); the circulation chamber (14) is connected with the placement chamber (11) through an air cooling circulation structure (2); a cold end fin (3) is provided at the lower end of the cold and warm box inner shell (1) which passes through the circulation chamber (14) and extends into the placement chamber (11); the upper end of the cold end fin (3) has a placement surface (31) located at the bottom of the placement chamber (11); and the lower end of the cold end fin (3) is connected with a thermoelectric refrigeration component (5) arranged on the cold end insulation layer (13) through a cooling block (4).

2. The semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure according to claim 1 is characterized in that: A partition assembly (6) is provided inside the inner shell (1) of the cold and warm box, the placement cavity (11) is formed on one side of the partition assembly (6), and the circulation cavity (14) is formed between the other side of the partition assembly (6) and the cold end insulation layer (13).

3. The semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure according to claim 2 is characterized in that: The partition assembly (6) includes a first side plate (61) arranged vertically, the lower end of the first side plate (61) is connected to a horizontally arranged bottom plate (62), the end of the bottom plate (62) away from the first side plate (61) is connected to a vertically arranged second side plate (63), and the opening is formed between the upper end of the first side plate (61) and the upper end of the second side plate (63).

4. The semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure according to claim 3 is characterized in that: The placement cavity (11) is formed between the first side plate (61), the bottom plate (62) and the second side plate (63); a vertically arranged guide plate (64) is provided on the side of the first side plate (61) away from the bottom plate (62); a vertically arranged sealing plate (65) connected to the cold end insulation layer (13) is provided on the end of the bottom plate (62) away from the first side plate (61); and the circulation cavity (14) is formed between the guide plate (64), the first side plate (61), the bottom plate (62), the cold end insulation layer (13) and the sealing plate (65).

5. A semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure according to claim 3 or 4, characterized in that: The middle part of the base plate (62) has a mounting hole (66) for inserting the upper end of the cold end fin (3), and the upper end of the cold end fin (3) is inserted into the mounting hole (66). The upper end surface of the cold end fin (3) has a plurality of arc grooves (32) arranged in sequence along the upper end surface of the cold end fin (3), and the two ends of the arc groove (32) extend to the base plate (62) respectively, and the placement surface (31) is formed in the arc groove (32).

6. The semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure according to claim 4, characterized in that: The air-cooling circulation structure (2) comprises an arc-shaped guide portion (21) arranged at the upper end of the guide plate (64) and bent toward the first side plate (61) to one side of the first side plate (61), and the upper end of the first side plate (61) is provided with an air outlet (22) corresponding to the arc-shaped guide portion (21) and used to connect the placement chamber (11) and the circulation chamber (14), and the end of the bottom plate (62) close to the second side plate (63) is provided with a return air port (23) used to connect the placement chamber (11) and the circulation chamber (14), and an air-cooling circulation component (7) corresponding to the return air port (23) and located on the side of the cold end fin (3) away from the air outlet (22) is provided in the circulation chamber (14), and the cold end fin (3) has a plurality of guide channels (33) for connecting the return air port (23) and the air outlet (22).

7. The semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure according to claim 6, characterized in that: The air-cooling circulation component (7) is a centrifugal fan (71) arranged between one side of the cold end fin (3) and one side of the sealing plate (65).

8. The semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure according to claim 4, characterized in that: One end of the cold end insulation layer (13) has an arc-shaped portion (15) extending upward to the lower end of the first side plate (61), and a cooling block mounting hole (16) is provided on the cold end insulation layer (13); the cooling block (4) is installed and fixed in the cooling block mounting hole (16), and one side of the cooling block (4) is arranged to abut against the lower end of the cold end fin (3).

9. The semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure according to claim 8, characterized in that: The thermoelectric cooling assembly (5) comprises a plurality of thermoelectric cooling sheets (51) arranged at one end of the cooling block (4) away from the cold end fin (3), a sealing heat insulation pad (52) is arranged between the thermoelectric cooling sheets (51), and the thermoelectric cooling sheets (51) are connected to the hot end fin (53) having a heat dissipation fan (54).

10. The semiconductor vehicle-mounted cooling and heating box with a high-efficiency heat exchange structure according to claim 1, characterized in that: The upper end of the heating and cooling box inner shell (1) is provided with an opening connected to the placement cavity (11), and a heating and cooling box door panel (12) is movably provided at the opening; the outer circumferential side of the heating and cooling box inner shell (1) is provided with an outer circumferential side of the heating and cooling box, the outer circumferential side of the heating and cooling box (17) extends to the outer circumferential side of the cold end insulation layer (13), and an insulation layer (18) is provided between the outer circumferential side of the heating and cooling box (17), the cold end insulation layer (13) and the inner circumferential side of the heating and cooling box (1).

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