Liquid cooling heat dissipation system of switch
By employing a liquid cooling system in the switch, utilizing fluid connectors and piping for heat dissipation, the problem that traditional air cooling cannot meet the heat dissipation and noise requirements of modern communication equipment is solved, achieving more efficient heat dissipation and noise reduction, while also facilitating convenient assembly and disassembly.
Patent Information
- Application Number
- CN202411321860.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-20
- Publication Date
- 2025-01-07
AI Technical Summary
Traditional air-cooling methods cannot meet the heat dissipation, energy efficiency and noise requirements of modern communication equipment, and the fixed fan structure makes assembly and disassembly inconvenient.
A liquid cooling system is adopted, in which heat dissipation components and components to be cooled are stacked in the switch chassis. Liquid cooling fluid is introduced into the switch chassis for heat dissipation using fluid connectors and pipelines. Modular design is combined to accommodate the layout of different heat-generating devices.
It improves heat dissipation capacity, significantly reduces data center PUE value, eliminates fan noise, and makes structural assembly and disassembly more convenient, enabling targeted heat dissipation.
Smart Images
Figure CN119277721A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of switches, and in particular, relates to a liquid cooling system for switches. Background Art
[0002] As the speed and bandwidth of switches continue to grow, the power consumption of switches is also showing a sharp increase. At present, switches mostly use air cooling inside the box. This cooling method not only generates a lot of noise, but also has limited heat dissipation capacity and cannot meet the current heat dissipation needs of switches. For this reason, more fans with higher performance and power consumption need to be installed inside the switch to meet the growing heat dissipation needs of the switch. However, this will further increase the power consumption and noise of the switch. In addition, the fan installed inside the switch has a fixed structure and is difficult to assemble and disassemble to a certain extent, so it is impossible to perform targeted heat dissipation, which affects the heat dissipation efficiency.
[0003] It can be seen that the traditional air-cooling method cannot meet the requirements of modern communication equipment for heat dissipation, energy efficiency and noise. Summary of the invention
[0004] The present application provides a liquid cooling heat dissipation system for a switch, which is used to solve the technical problem that the prior art lacks a technology that can meet the heat dissipation, energy efficiency and noise requirements of modern communication equipment.
[0005] In a first aspect, the present application provides a liquid cooling system for a switch, the system comprising a stacked cooling component and a component to be cooled; the stacked cooling component and the component to be cooled are stacked in a switch case; the stacked cooling component comprises a fluid connector; the fluid connector is arranged on the outside of the switch case, and a liquid cooling medium flows into the switch case through the fluid connector to cool the component to be cooled.
[0006] In an implementation of the first aspect, the stacked heat dissipation assembly includes at least two heat dissipation modules; the component to be cooled includes at least one mainboard and at least two heating units; at least two of the heating units are arranged on the front or back of at least one mainboard; at least two of the heat dissipation modules and at least one mainboard are stacked to dissipate heat for at least two of the heating units.
[0007] In an implementation of the first aspect, the stacked heat dissipation assembly includes a first heat dissipation module, a cold plate module and a second heat dissipation module; the first heat dissipation module, the cold plate module, the assembly to be cooled and the second heat dissipation module are stacked in sequence from top to bottom.
[0008] In an implementation of the first aspect, the cold plate module includes a first cold plate, a second cold plate, an adapter block, a pipeline and the fluid connector; the adapter block connects the fluid connector and the pipeline; the liquid cooling medium flows through the first cold plate and the second cold plate through the fluid connector and the pipeline, so that the first cold plate and the second cold plate dissipate heat for at least two of the heat generating units.
[0009] In an implementation of the first aspect, the component to be cooled includes a first mainboard, a first heating unit, a second heating unit and a third heating unit; the first heating unit and the second heating unit are arranged on the front side of the first mainboard, and the third heating unit is arranged on the back side of the first mainboard.
[0010] In an implementation of the first aspect, the first cold plate dissipates heat for the first heating unit; the second cold plate dissipates heat for the second heating unit through the first heat dissipation module; and the second cold plate dissipates heat for the third heating unit through the second heat dissipation module.
[0011] In an implementation of the first aspect, the first heat dissipation module includes a first heat conduction unit, a heat transfer unit, and a second heat conduction unit; the first heat conduction unit is in contact with the second heat generating unit; the second heat conduction unit is in contact with the second cold plate; the first heat conduction unit is connected to the second heat conduction unit through the heat transfer unit, so that the heat of the second heat generating unit is transferred to the second cold plate through the first heat conduction unit, the heat transfer unit, and the second heat conduction unit for heat dissipation.
[0012] In an implementation of the first aspect, the second heat dissipation module includes a third heat conduction unit; the third heat conduction unit is in contact with the third heat generating unit and the second cold plate respectively, and the third heat conduction unit transfers the heat of the third heat generating unit to the second cold plate for heat dissipation.
[0013] In an implementation of the first aspect, the component to be cooled includes a second main board, a third main board, a connector, a fourth heating unit, a fifth heating unit, a sixth heating unit and a seventh heating unit; the second main board and the third main board are connected via the connector; the fourth heating unit is arranged on the front side of the second main board, the fifth heating unit is arranged on the back side of the second main board, the sixth heating unit is arranged on the front side of the third main board, and the seventh heating unit is arranged on the back side of the third main board.
[0014] In an implementation of the first aspect, the first cold plate dissipates heat for the fourth heat generating unit; the second cold plate dissipates heat for the sixth heat generating unit through the first heat dissipation module; and the second cold plate dissipates heat for the fifth and seventh heat generating units through the second heat dissipation module.
[0015] The liquid cooling system of a switch described in the present application has the following beneficial effects: liquid cooling medium is used to remove all heat loss of the system. Compared with the traditional air-cooled cooling method, the liquid cooling system provided by the present application has a higher heat dissipation capacity, which can significantly reduce the PUE value of the data center, while completely eliminating fan noise. In addition, the present application adopts the design of "modularization + multi-layer stacking", which makes the structural assembly and disassembly more convenient, and can also adapt to the layout of different heating devices for targeted heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 Shown is a structural schematic diagram of a liquid cooling system for a switch according to an embodiment of the present application.
[0017] Figure 2 Shown is a schematic diagram of the appearance of a switch according to an embodiment of the present application.
[0018] Figure 3 Shown is an exploded schematic diagram of a liquid cooling system for a switch according to an embodiment of the present application.
[0019] Figure 4 Shown is a structural schematic diagram of a cold plate module described in an embodiment of the present application.
[0020] Figure 5 Shown is a schematic structural diagram of a heat dissipation component according to an embodiment of the present application.
[0021] Figure 6 Shown is a structural schematic diagram of a first heat dissipation module described in an embodiment of the present application.
[0022] Figure 7 Shown is a structural schematic diagram of a second heat dissipation module described in an embodiment of the present application.
[0023] Figure 8 Shown is a schematic structural diagram of a heat dissipation component according to another embodiment of the present application.
[0024] Fig. 9 Shown is an exploded schematic diagram of a liquid cooling system for a switch according to another embodiment of the present application. DETAILED DESCRIPTION
[0025] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.
[0026] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application, and thus the drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.
[0027] The embodiment of the present application provides a liquid cooling system for a switch, which has a higher heat dissipation capacity, can significantly reduce the PUE value of the data center, and completely eliminate the fan noise caused by traditional air cooling. In addition, through the "modular + multi-layer stacking" design, the structure assembly and disassembly are more convenient, and can also adapt to the layout of different heating devices for targeted heat dissipation.
[0028] See also Figure 1 and Figure 2 As shown, a liquid cooling system for a switch provided by an embodiment of the present application includes a stacked heat dissipation component X and a component to be cooled Y. The stacked heat dissipation component X and the component to be cooled Y are stacked in a switch case; the stacked heat dissipation component X includes fluid connectors 37-38; the fluid connectors 37-38 are arranged outside the switch case, and liquid cooling medium flows into the switch case through the fluid connectors 37-38 to dissipate heat for the component to be cooled Y.
[0029] Specifically, the stacked heat dissipation component X includes at least two heat dissipation modules; the heat dissipation component Y includes at least one mainboard and at least two heating units; at least two heating units are arranged on the front or back of at least one mainboard; at least two heat dissipation modules and at least one mainboard are stacked to dissipate heat for at least two heating units.
[0030] The liquid cooling system of the switch provided in the present application can adjust the specific design and stacking order of the heat dissipation module according to the layout of the heat generating units of the components to be cooled, so as to achieve a better targeted heat dissipation effect. In addition, several heat dissipation modules can be merged, the number of heat dissipation modules can be reduced, and a stack of a smaller number of heat dissipation modules can be formed, or the heat dissipation modules can be further split, the number of heat dissipation modules can be increased, and a stack of a larger number of heat dissipation modules can be formed.
[0031] The liquid cooling system of the switch provided in the present application will be further described below through different embodiments.
[0032] like Figure 3 As shown, in some embodiments, the stacked heat dissipation assembly X includes a first heat dissipation module 2, a cold plate module 3 and a second heat dissipation module 5; the first heat dissipation module 2, the cold plate module 3, the component to be cooled Y and the second heat dissipation module 5 are stacked in sequence from top to bottom.
[0033] like Figure 4 As shown, in one embodiment, the cold plate module 3 includes a first cold plate 31, a second cold plate 32, a transfer block 33, pipelines 34-36 and the fluid connectors 37-38. The transfer block 33 connects the fluid connectors 37-38 and the pipelines 34 and 36; the liquid cooling medium flows through the first cold plate 31 and the second cold plate 32 through the fluid connectors 37-38 and the pipelines 34-36, so that the first cold plate 31 and the second cold plate 32 dissipate heat for at least two of the heat generating units.
[0034] Specifically, the adapter block 33 connects the fluid connector 37 and the pipeline 34, and connects the fluid connector 38 and the pipeline 36. The liquid cooling medium enters the cold plate module 3 from the fluid connector 37, passes through the adapter block 33, the pipeline 34, the first cold plate 31, the pipeline 35, the second cold plate 32, the pipeline 36, the adapter block 33 in sequence, and finally leaves the cold plate module from the fluid connector 38, so that the first cold plate and the second cold plate dissipate heat for at least two of the heat generating units.
[0035] In some embodiments, the cold plate module 3 may further include a thermally conductive interface material.
[0036] like Figure 5 As shown, in some embodiments, the heat dissipation component Y includes a first main board 41, a first heating unit, a second heating unit 44 and a third heating unit 45. The first heating unit and the second heating unit 44 are arranged on the front side of the first main board 41, and the third heating unit 45 is arranged on the back side of the first main board 41.
[0037] Specifically, the first heating unit includes a main chip 42 and small chips 43a-p.
[0038] It should be noted that the small chips 43a-p are distributed around the main chip 42. The small chips 43a-p include but are not limited to light engines.
[0039] Specifically, the second heating unit 44 and the third heating unit 45 include but are not limited to a CPU, a memory, a storage device, a power device, a management chip, and the like.
[0040] Specifically, in some embodiments, the first cold plate 31 dissipates heat for the first heating unit, the second cold plate 32 dissipates heat for the second heating unit 34 through the first heat dissipation module 2, and the second cold plate 32 dissipates heat for the third heating unit 45 through the second heat dissipation module 2.
[0041] like Figure 6 As shown, the first heat dissipation module 2 includes a first heat conduction unit 21 , heat transfer units 23 - 25 , and a second heat conduction unit 22 .
[0042] Specifically, Figure 1 As shown, the first heat conducting unit 21 is in contact with the second heat generating unit 44; the second heat conducting unit 22 is in contact with the second cold plate 32; the first heat conducting unit 21 is connected to the second heat conducting unit 22 through the heat transfer units 23 to 25, so that the heat of the second heat generating unit 44 is transferred to the second cold plate 32 through the first heat conducting unit 21, the heat transfer units 23 to 25, and the second heat conducting unit 22 for heat dissipation.
[0043] It should be noted that, in some embodiments, the position and shape of the first heat conducting unit 21 may be adjusted according to the layout of the second heat generating unit 44 , or the first heat conducting unit 21 and the second heat conducting unit 22 may be combined into one whole.
[0044] It should be noted that, in some embodiments, the heat transfer units 23 to 25 include heat pipes. The number and arrangement of the heat pipes can also be adjusted according to actual conditions. In other embodiments, other enhanced heat transfer materials can be used instead of heat pipes.
[0045] It should be noted that, in some embodiments, the first heat conducting unit 21 is in contact with the second heat generating unit 44 through a thermal interface material; and the second heat conducting unit 22 is in contact with the second cold plate 32 through a thermal interface material.
[0046] like Figure 7 As shown, the second heat dissipation module 5 includes a third heat conduction unit 51. The third heat conduction unit 51 is in contact with the third heating unit 45 and the second cold plate 32 respectively, and the third heat conduction unit 51 transfers the heat of the third heating unit 45 to the second cold plate 32 for heat dissipation.
[0047] Specifically, the second heat dissipation module 5 further includes thermal interface materials 52 - 58 . The thermal interface materials 52 - 58 are arranged on the third heat conduction unit 51 .
[0048] It should be noted that, in some embodiments, the position and shape of the third heat conducting unit 51 may be adjusted according to the layout of the third heat generating unit 45 .
[0049] It should be noted that the third heat transfer unit 51 includes a metal block, and may also be a metal block with a heat pipe / VC or other enhanced heat transfer material embedded inside, or may also be a heat pipe / VC or other enhanced heat transfer material.
[0050] It should be noted that the second heat dissipation module 5 is in contact with the bottom of the switch chassis. In some embodiments, the contact surface between the third heat conduction unit 51 and the bottom of the switch chassis can be dry contact, or can be filled with a thermal interface material to reduce the contact thermal resistance. In other embodiments, the third heat conduction unit 51 can also fully serve as the bottom of the switch chassis, and in this case, the bottom of the switch chassis is no longer repeatedly provided with a bottom shell.
[0051] like Figure 8 As shown, in other embodiments, the heat dissipation component Y includes a second main board 61, a third main board 62, a connector 63, a fourth heating unit, a fifth heating unit 66, a sixth heating unit 67 and a seventh heating unit 68; the second main board 61 and the third main board 62 are connected via the connector 63; the fourth heating unit is arranged on the front side of the second main board 61, the fifth heating unit 66 is arranged on the back side of the second main board 61, the sixth heating unit 67 is arranged on the front side of the third main board 62, and the seventh heating unit 68 is arranged on the back side of the third main board 62.
[0052] Specifically, the fourth heating unit includes a second main chip 64 and second small chips 65a-p.
[0053] It should be noted that the second small chips 43a-p are distributed around the second main chip 42. The second small chips 43a-p include but are not limited to light engines.
[0054] Specifically, the connector 63 provides signal and electrical connections for the second main board 61 and the third main board 62 .
[0055] Specifically, in these embodiments, the first cold plate 31 dissipates heat for the fourth heating unit. The second cold plate 32 dissipates heat for the sixth heating unit 67 through the first heat dissipation module 2; and the second cold plate 32 dissipates heat for the fifth heating unit 66 and the seventh heating unit 68 through the second heat dissipation module 5.
[0056] It should be noted that in these embodiments, the structures of the first heat dissipation module 2, the cold plate module 3 and the second heat dissipation module 5 need to be adjusted accordingly according to the structure of the component to be cooled Y. In these embodiments, the structure diagram of the liquid cooling system provided by the present application is as follows: Fig. 9 shown.
[0057] As described above, the liquid cooling system of the switch provided by the present application has a higher heat dissipation capacity, which can significantly reduce the PUE value of the data center, and completely eliminate the fan noise caused by traditional air cooling. In addition, through the "modular + multi-layer stacking" design, the structure assembly and disassembly are more convenient, and it can also adapt to the layout of different heating devices for targeted heat dissipation.
[0058] The descriptions of the processes or structures corresponding to the above-mentioned figures have different emphases. For parts that are not described in detail in a certain process or structure, please refer to the relevant descriptions of other processes or structures.
[0059] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.
Claims
1. A liquid cooling system for a switch, characterized in that: The system includes a stacked heat dissipation component and a component to be dissipated; the stacked heat dissipation component and the component to be dissipated are stacked in a switch case; the stacked heat dissipation component includes a fluid connector; the fluid connector is arranged outside the switch case, and liquid cooling medium flows into the switch case through the fluid connector to dissipate heat for the component to be dissipated.
2. The liquid cooling system of the switch according to claim 1, characterized in that: The stacked heat dissipation component includes at least two heat dissipation modules; the component to be cooled includes at least one mainboard and at least two heating units; at least two of the heating units are arranged on the front or back of at least one mainboard; at least two of the heat dissipation modules and at least one mainboard are stacked to dissipate heat for at least two of the heating units.
3. The liquid cooling system of the switch according to claim 2, characterized in that: The stacked heat dissipation component comprises a first heat dissipation module, a cold plate module and a second heat dissipation module; the first heat dissipation module, the cold plate module, the component to be cooled and the second heat dissipation module are stacked in sequence from top to bottom.
4. The liquid cooling system of the switch according to claim 3, characterized in that: The cold plate module includes a first cold plate, a second cold plate, an adapter block, a pipeline and the fluid connector; the adapter block connects the fluid connector and the pipeline; the liquid cooling medium flows through the first cold plate and the second cold plate through the fluid connector and the pipeline, so that the first cold plate and the second cold plate dissipate heat for at least two of the heat generating units.
5. The liquid cooling system for a switch according to claim 4, characterized in that: The heat dissipation component includes a first mainboard, a first heating unit, a second heating unit and a third heating unit; the first heating unit and the second heating unit are arranged on the front side of the first mainboard, and the third heating unit is arranged on the back side of the first mainboard.
6. The liquid cooling system for a switch according to claim 5, characterized in that: The first cold plate dissipates heat for the first heat generating unit; the second cold plate dissipates heat for the second heat generating unit through the first heat dissipation module; and the second cold plate dissipates heat for the third heat generating unit through the second heat dissipation module.
7. The liquid cooling system for a switch according to claim 6, characterized in that: The first heat dissipation module includes a first heat conduction unit, a heat transfer unit, and a second heat conduction unit; the first heat conduction unit is in contact with the second heat generating unit; The second heat conducting unit is in contact with the second cold plate; The first heat conduction unit is connected to the second heat conduction unit through the heat transfer unit, so that the heat of the second heat generating unit is transferred to the second cold plate through the first heat conduction unit, the heat transfer unit and the second heat conduction unit for heat dissipation.
8. The liquid cooling system of a switch according to claim 6, characterized in that: The second heat dissipation module includes a third heat conduction unit; the third heat conduction unit is in contact with the third heat generating unit and the second cold plate respectively, and the third heat conduction unit transfers the heat of the third heat generating unit to the second cold plate for heat dissipation.
9. The liquid cooling system for a switch according to claim 4, characterized in that: The component to be cooled includes a second main board, a third main board, a connector, a fourth heating unit, a fifth heating unit, a sixth heating unit and a seventh heating unit; the second main board and the third main board are connected via the connector; the fourth heating unit is arranged on the front side of the second main board, the fifth heating unit is arranged on the back side of the second main board, the sixth heating unit is arranged on the front side of the third main board, and the seventh heating unit is arranged on the back side of the third main board.
10. The liquid cooling system of a switch according to claim 9, characterized in that: The first cold plate dissipates heat to the fourth heat generating unit; the second cold plate dissipates heat to the sixth heat generating unit through the first heat dissipation module; and the second cold plate dissipates heat to the fifth heat generating unit and the seventh heat generating unit through the second heat dissipation module.