Preparation process of copper-based composite material with efficient shielding performance
By adjusting the composition and processing technology of copper-based composite materials, the magnetic permeability and electrical conductivity of copper wires were improved, solving the problem of unsatisfactory electromagnetic shielding effect of copper alloys in the low-frequency band and achieving a high-efficiency improvement in electromagnetic shielding performance.
Patent Information
- Application Number
- CN202411204396.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-01-10
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing copper alloy materials are not ideal for electromagnetic shielding in the low-frequency band, and traditional shielding materials have a narrow frequency band, making it difficult to meet the high-efficiency shielding requirements of complex electromagnetic environments.
By adjusting the composition of copper-based composite materials, increasing the proportion of iron and nickel, and through specific processing steps such as smelting, drawing, and electroplating, the magnetic permeability and electrical conductivity of copper wires can be improved, thereby enhancing the electromagnetic shielding performance of both high-frequency and low-frequency electromagnetic fields.
This technology achieves effective electromagnetic shielding performance of copper wires in both high and low frequency bands, improves the overall shielding effectiveness of the material, and enhances the toughness and strength of the material.
Abstract
Description
Technical Field
[0001] The invention relates to the field of copper wire processing, and in particular to a preparation process of a copper-based composite material with high-efficiency shielding performance. Background Art
[0002] With the rapid development of science and technology, the updating of electronic and electrical equipment, the electromagnetic spectrum is not only limited to the radio wave range, but is rapidly expanding to low-end audio frequency, secondary frequency and high-end optical frequency, so that electromagnetic interference caused by electromagnetic radiation has become the fourth largest social hazard after water pollution, air pollution and noise pollution. Electromagnetic interference not only affects the stability, safety and reliability of communication equipment and electronic equipment, but also endangers human health. Especially in some harsh environments, the electromagnetic environment tends to be complicated. In addition to natural electromagnetic interference sources such as lightning and static electricity, there are also artificial interference sources with stronger interference effects, such as interference released by radio communication and navigation. Therefore, higher requirements are put forward for the electromagnetic shielding performance of the protective covering materials of wires and cables. At present, the widely used shielding materials are mainly traditional highly conductive metal materials and ferromagnetic materials. However, the above materials have the disadvantages of narrow electromagnetic shielding frequency band and unsatisfactory shielding effectiveness in the low frequency band. Therefore, improving the electromagnetic shielding effectiveness and broadening the frequency range are the most important research contents of electromagnetic shielding protection materials.
[0003] Copper and copper alloys have high strength, good toughness, wear resistance, good ductility, high electrical and thermal conductivity, excellent corrosion resistance and other performance characteristics, and are widely used in the fields of electronics, aerospace, and machinery manufacturing. Although copper and copper alloys have excellent electrical conductivity and can have good anti-electromagnetic shielding performance in high-frequency environments, the electromagnetic shielding effect is not ideal in low-frequency bands. Therefore, it is urgent to develop a copper alloy matrix composite material for shielding. Summary of the invention
[0004] 1. Technical issues to be resolved
[0005] In view of the deficiencies in the prior art, the present invention provides a process for preparing a copper-based composite material with high-efficiency shielding performance, which has the advantages of low-frequency electromagnetic shielding and solves the problems in the above-mentioned background technology.
[0006] (II) Technical solution
[0007] In order to achieve the purpose of the above-mentioned low-frequency electromagnetic shielding, the present invention provides the following technical solutions: a copper-based composite material with high-efficiency shielding performance, comprising the following preparation raw materials: copper-88.1%, iron-11.5%, and nickel-0.4%. By increasing the proportion of iron in the overall raw materials, the overall magnetic permeability of the copper wire can be effectively improved. At the same time, due to the improvement of the magnetic permeability and the electrical conductivity of copper itself, it can achieve high-frequency electromagnetic shielding while also having certain low-frequency electromagnetic shielding performance.
[0008] Preferably, the method comprises the following preparation steps:
[0009] S1: Pre-processing of copper-based, iron-based and nickel-based materials, mainly filtering out impurities and
[0010] Mix well;
[0011] S2: The mixed copper-based alloy is placed in a furnace for smelting;
[0012] S3: After smelting, the copper-based molten metal is cooled and moved to a casting machine for casting;
[0013] S4: After forming, the copper-based alloy rod is obtained and transferred to a giant wire drawing machine for drawing the copper wire;
[0014] S5: heat treating the copper-based alloy wire with a larger wire diameter obtained after the first drawing;
[0015] S6: Keep the temperature at 600℃±30℃ for 2h, then take it out and cool it down.
[0016] Move to Dalian drawing and annealing machine for wire drawing;
[0017] S7: After the large drawing machine is finished, it moves to the medium drawing machine;
[0018] S8: After drawing through a medium-drawing continuous annealing machine with a smaller wire diameter hole, a copper-based alloy wire is obtained;
[0019] S9: placing the finished alloy wire into an electroplating solution for electroplating;
[0020] S10: After the electroplating is completed, the finished product is obtained.
[0021] Preferably, the raw materials need to be stirred during the smelting process in step S2, and the stirring and mixing time after all the raw materials are melted is not less than 30 minutes. Sufficient mixing of the raw materials can evenly distribute the iron in the copper wire, making the overall magnetic permeability more uniform and improving the stability of the low-frequency electromagnetic shielding.
[0022] Preferably, the diameter of the wire drawn by the large drawing and annealing machine in step S7 is 20 mm, and the annealing temperature after drawing is 500±30°C.
[0023] Preferably, the final wire diameter of the copper alloy wire obtained by intermediate drawing and continuous undrawing in step S8 is 3 mm, and the annealing temperature is controlled at 430±30°C. The three wire drawing annealings can make the broken crystals inside the copper after wire drawing grow again, further increasing the toughness and strength of the copper wire.
[0024] Preferably, the anode current density during the electroplating process in step S10 should be controlled at 2.5-2.7 A / dm 2 The plating solution temperature is controlled between 25℃-28℃, the plating time is not less than 2h, and the medium current density can make the coating produced by the copper wire after electroplating more uniform, and the coating thickness can also achieve the ideal effect, ensuring the shielding performance of the overall coating.
[0025] (III) Beneficial effects
[0026] Compared with the prior art, the present invention provides a process for preparing a copper-based composite material with high efficiency shielding performance, which has the following beneficial effects:
[0027] The preparation process of this high-efficiency shielding copper-based composite material can effectively improve the overall magnetic permeability of the copper wire by increasing the proportion of iron in the overall raw materials. At the same time, due to the increase in magnetic permeability and the electrical conductivity of copper itself, it can achieve high-frequency electromagnetic shielding while also having certain low-frequency electromagnetic shielding performance. At the same time, by controlling the temperature of the plating solution, the plating time and the anode current density, the shielding performance of the overall coating is greatly improved. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0029] Example 1
[0030] A preferred embodiment of a preparation process of a high-efficiency shielding copper-based composite material provided by the present invention is as follows: A high-efficiency shielding copper-based composite material, comprising the following preparation raw materials: copper-88.1%, iron-11.5%, nickel-0.4%. By increasing the proportion of iron in the overall raw materials, the overall magnetic permeability of the copper wire can be effectively improved. At the same time, due to the improvement in magnetic permeability and the electrical conductivity of copper itself, it can achieve high-frequency electromagnetic shielding while also having certain low-frequency electromagnetic shielding performance.
[0031] In this embodiment, .
[0032] Example 2
[0033] Based on Example 1, the present invention provides a copper-based composite material with high shielding performance.
[0034] The preferred embodiment of the preparation process is as follows: comprising the following preparation steps:
[0035] S1: Pre-processing of copper-based, iron-based and nickel-based materials, mainly filtering out impurities and
[0036] Mix well;
[0037] S2: The mixed copper-based alloy is placed in a furnace for smelting;
[0038] S3: After smelting, the copper-based molten metal is cooled and moved to a casting machine for casting;
[0039] S4: After forming, the copper-based alloy rod is obtained and transferred to a giant wire drawing machine for drawing the copper wire;
[0040] S5: heat treating the copper-based alloy wire with a larger wire diameter obtained after the first drawing;
[0041] S6: Keep the temperature at 600℃±30℃ for 2h, then take it out and cool it down.
[0042] Move to Dalian drawing and annealing machine for wire drawing;
[0043] S7: After the large drawing machine is finished, it moves to the medium drawing machine;
[0044] S8: After drawing through a medium-drawing continuous annealing machine with a smaller wire diameter hole, a copper-based alloy wire is obtained;
[0045] S9: placing the finished alloy wire into an electroplating solution for electroplating;
[0046] S10: After the electroplating is completed, the finished product is obtained.
[0047] In this embodiment, the raw materials need to be stirred during the smelting process in step S2, and the stirring and mixing time after all the raw materials are melted is not less than 30 minutes. Sufficient mixing of the raw materials can evenly distribute the iron in the copper wire, making the overall magnetic permeability more uniform and improving the stability of the low-frequency electromagnetic shielding.
[0048] Furthermore, in step S7, the diameter of the wire drawn by the large drawing and annealing machine is 20 mm, and the annealing temperature after drawing is 500±30°C.
[0049] Furthermore, the final wire diameter of the copper alloy wire obtained by intermediate drawing and continuous drawing in step S8 is 3 mm, and the annealing temperature is controlled at 430±30°C. The three wire drawing annealings can make the broken crystals inside the copper after wire drawing grow again, further increasing the toughness and strength of the copper wire.
[0050] In addition, the anode current density during the electroplating process in step S10 should be controlled at 2.5-2.7 A / dm 2The plating solution temperature is controlled between 25℃-28℃, the plating time is not less than 2h, and the medium current density can make the coating produced by the copper wire after electroplating more uniform, and the coating thickness can also achieve the ideal effect, ensuring the shielding performance of the overall coating.
[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A copper-based composite material with high shielding performance, characterized in that: The preparation comprises the following raw materials: copper-88.1%, iron-11.5%, and nickel-0.4%.
2. The process for preparing a copper-based composite material with high efficiency shielding performance according to claim 1, characterized in that: The method comprises the following preparation steps: S1: Pre-processing of copper-based, iron-based and nickel-based materials, mainly filtering out impurities and mixing them evenly; S2: The mixed copper-based alloy is placed in a furnace for smelting; S3: After smelting, the copper-based molten metal is cooled and moved to a casting machine for casting; S4: After forming, the copper-based alloy rod is obtained and transferred to a giant wire drawing machine for drawing the copper wire; S5: heat treating the copper-based alloy wire with a larger wire diameter obtained after the first drawing; S6: Keep the heat treatment at 600℃±30℃ for 2h, then take it out for cooling and move it to Dalian drawing and annealing machine for wire drawing; S7: After the large drawing machine is finished, it moves to the medium drawing machine; S8: After drawing through a medium-drawing continuous annealing machine with a smaller wire diameter hole, a copper-based alloy wire is obtained; S9: placing the finished alloy wire into an electroplating solution for electroplating; S10: After the electroplating is completed, the finished product is obtained.
3. The process for preparing a copper-based composite material with high efficiency shielding performance according to claim 1, characterized in that: The raw materials need to be stirred during the smelting process in step S2, and the stirring and mixing time after all the raw materials are melted is not less than 30 minutes.
4. The process for preparing a copper-based composite material with high efficiency shielding performance according to claim 1, characterized in that: The diameter of the wire drawn by the large drawing and annealing machine in step S7 is 20 mm, and the annealing temperature after drawing is 500±30°C.
5. The process for preparing a copper-based composite material with high efficiency shielding performance according to claim 1, characterized in that: The final wire diameter of the copper alloy wire obtained by intermediate drawing and continuous undrawing in step S8 is 3 mm, and the annealing temperature is controlled at 430±30°C.
6. The process for preparing a copper-based composite material with high efficiency shielding performance according to claim 1, characterized in that: The anode current density during the electroplating process in step S10 should be controlled at 2.5-2.7 A / dm 2 The temperature of the plating solution is controlled between 25℃-28℃, and the plating time is not less than 2h.