PCB element detection method and system, storage medium and computer equipment

Abstract

The invention relates to the technical field of PCBs, and particularly discloses a PCB element detection method and system, a storage medium and computer equipment. The method comprises the following steps: firstly, acquiring welding spot appearance feature information and welding spot internal feature information of a single pin of a PCB element and a PCB, and then respectively acquiring a corresponding appearance connection feature index and a corresponding internal connection feature index according to the welding spot appearance feature information and the welding spot internal feature information; and calculating a welding spot connection quality index of each pin according to the appearance connection characteristic index and the internal connection characteristic index, and judging whether the welding spot connection index corresponding to at least one pin exceeds a preset value, if so, judging that the detection result of the PCB element is unqualified, and if not, judging that the detection result of the PCB element is qualified. The clear quality division facilitates quality control and product screening in the production process, and meanwhile, the quality standard of the connection between the PCB element and the PCB can be accurately judged.

Description

Technical Field

[0001] The present invention relates to the field of PCB technology, and in particular to a PCB component detection method, system, storage medium and computer equipment. Background Art

[0002] PCB, the full name of Printed Circuit Board, is an important electronic component. PCB is an indispensable basic component in electronic equipment. It provides a platform for connecting electronic components through circuits to achieve various functions of the equipment. PCB components refer to various electronic components and devices installed on printed circuit boards (PCBs). These components play different functional roles in the circuit and together constitute a complete electronic system.

[0003] Usually, a single pin of a PCB component is fixed to the PCB by welding, wherein welding is to connect the single pin of the PCB component to the preset installation on the PCB by tin soldering after matching it with the PCB. After the single pin of the PCB component is connected to the PCB, it is necessary to perform welding detection on the connection between the single pin of the PCB component and the PCB. Usually, the detection needs to be compared and judged by taking pictures with a CCD camera. However, although the above judgment method can judge whether it is different from the standard requirements, it cannot standardize the welding quality of the PCB component. Therefore, a PCB component detection method, system, storage medium and computer equipment are needed to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a PCB component detection method, system, storage medium and computer equipment to solve the technical problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: A PCB component detection method, comprising: Obtaining welding characteristic information between each pin of the PCB component and the PCB, wherein the welding characteristic information includes appearance characteristic information of the welding point and internal characteristic information of the welding point; Acquire solder point surface connection information and PCB component installation position information according to the solder point appearance feature information, and acquire solder point wetting angle and solder point coverage information according to the solder point surface connection information; Obtaining a surface connection characteristic index according to the solder joint wetting angle, PCB component installation position information, and solder joint coverage information; Acquire the internal crack length of the weld spot according to the internal characteristic information of the weld spot, and acquire the internal connection characteristic index according to the internal crack length of the weld spot; Calculating the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index; Determine whether there is at least one pin whose corresponding solder joint connection index exceeds a preset value; If it exists, the test result of the PCB component is judged to be unqualified; If it does not exist, the inspection result of the PCB component is determined to be qualified.

[0006] Preferably, the step of obtaining solder joint surface connection information and PCB component installation position information according to the solder joint appearance feature information, and obtaining solder joint wetting angle and solder joint coverage information according to the solder joint surface connection information comprises: Acquire solder joint location image information according to the solder joint appearance feature information, wherein the solder joint location image information includes a solder joint area, a PCB component pin area, and a PCB mounting area; Obtain the solder joint contour area of ​​the solder joint area based on Canny edge detection; Obtain coverage area information of the solder joint contour area covering the PCB component pin area and the PCB mounting area, and use the coverage area information as solder joint surface connection information; Perform edge detection and analysis on the PCB component pin area and the PCB installation area based on an edge detection algorithm to obtain PCB component pin edge information and PCB installation edge information, and use the area corresponding to the PCB installation edge information as PCB component installation position information; Obtain the side edge contour of the solder joint area based on Canny edge detection; Acquire the lower surface position coordinates and the side tangent point coordinates of the welding point according to the side edge contour, and extend the lower surface position coordinates toward one end to obtain an extension line; Connecting the extension line and the side tangent point coordinates to obtain a tangent point connection line; According to the connection line and the tangent point connection line, an angle between the connection line and the tangent point connection line is obtained, and the angle between the connection line and the tangent point connection line is used as a solder point wetting angle; Obtaining a first area of ​​a solder joint region; A second area of ​​the PCB installation area is obtained, and a solder joint proportion value is obtained according to the ratio of the first area to the second area, and numerical information corresponding to the solder joint proportion value is used as solder joint coverage information.

[0007] Preferably, the step of obtaining the surface connection characteristic index according to the solder joint wetting angle, PCB component installation position information and solder joint coverage information comprises: Get the standard wetting angle of solder joints; The solder joint wetting angle index is calculated according to the solder joint standard wetting angle and the solder joint wetting angle, wherein the calculation formula is: ; Among them, R(Z) represents the solder joint wetting angle index, R(J) represents the solder joint wetting angle, and R(J) max represents the standard wetting angle of the solder joint, and σ represents the error coefficient of the wetting angle of the solder joint; Acquire a corresponding first solder joint ratio value according to the solder joint coverage information, and use the first solder joint ratio value as a solder joint coverage index; Acquire a PCB component installation position image according to the PCB component installation position information; Acquire a plurality of pixel points according to the PCB component installation position image, wherein the PCB installation image is a set consisting of the plurality of pixel points; Acquire multiple plane positioning coordinates of multiple pixel points in the PCB component installation position image; Acquire the total number of pixel points in the PCB component installation position image according to the plurality of pixel points; The central plane position coordinates of the PCB component installation position image are calculated according to the multiple pixel points, the multiple plane positioning coordinates and the total pixel points, wherein the calculation formula is: ; Wherein, Z(x, y) represents the coordinates of the center plane position, Xi represents the coordinate value of the i-th pixel point on the x-axis, yi represents the coordinate value of the i-th pixel point on the y-axis, and n represents the total pixel points in the PCB component installation position image, where i is the number of multiple pixel points, i=1, 2, 3...n; Acquire the first center coordinates of the PCB installation area, and use the first center coordinates as the origin coordinates, and calculate the offset distance according to the origin coordinates and the center plane position coordinates; The maximum allowable offset distance is obtained, and the offset index is calculated according to the maximum allowable offset distance and the offset distance. The calculation formula is: ; Where P(Y) represents the offset index, J(L) represents the solder joint wetting angle, and J(L) represents the solder joint wetting angle. max Indicates the maximum allowable offset distance; The solder joint wetting angle index, solder joint coverage index and offset index are weightedly calculated to obtain a solder joint comprehensive installation index, and the solder joint comprehensive installation index is used as an appearance connection characteristic index.

[0008] Preferably, the step of obtaining the internal crack length of the weld spot according to the internal characteristic information of the weld spot, and obtaining the internal connection characteristic index according to the internal crack length of the weld spot comprises: Acquiring the area of ​​the solder joint in a top-view state according to the internal characteristic information of the solder joint; Obtain the number and area of ​​bubbles inside the solder joint based on ultrasonic testing; The bubble influence coefficient of the solder joint is calculated according to the area of ​​the solder joint in a top view, the number of bubbles and the bubble area, wherein the calculation formula is: ; Among them, K(z) represents the solder joint bubble influence coefficient, G(D) o represents the bubble area, z(m) o represents the area of ​​the oth solder joint in top view, o represents the number of bubbles, where o=1, 2, 3...k; Acquire internal crack information of the weld within the area of ​​the weld in a top-down state based on ultrasonic testing, wherein the internal crack information of the weld includes the number of internal cracks of the weld and the lengths of multiple internal cracks of the weld; The internal crack influence coefficient of the weld is calculated according to the area of ​​the weld in the top view and the lengths of the internal cracks of the welds, wherein the calculation formula is: ; Where, N(B) represents the internal crack influence coefficient of the weld, L(W) h represents the internal crack length of the hth solder joint, z(m) h represents the area of ​​the hth solder joint in the top view, h represents the length of the internal crack of the solder joint and the number of the area of ​​the solder joint in the top view, where h=1, 2, 3...t; The weld bubble influence coefficient and the weld internal crack influence coefficient are weightedly calculated to obtain a weld comprehensive crack index, and the weld comprehensive crack index is used as an internal connection characteristic index.

[0009] Preferably, the step of calculating the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index comprises: Obtaining a first weight value of the outer connection feature index; The solder joint connection quality index of each pin is calculated according to the external connection characteristic index and the internal connection characteristic index, wherein the calculation formula is: ; Wherein, L(j) represents the solder joint connection quality index, W(B) represents the surface connection characteristic index, N(B) represents the internal connection characteristic index, and A represents the first weight value.

[0010] Preferably, after the step of determining that the detection result of the PCB component is qualified if it does not exist, the method further comprises: Calculating an average solder joint connection quality index according to a plurality of solder joint connection quality indexes; Determining whether the average solder joint connection quality index satisfies a preset threshold interval range; When the average solder joint connection quality index does not meet the preset threshold interval range and is less than the minimum value of the preset threshold interval range, it is determined that the connection quality between the single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a defective product; When the average solder joint connection quality index satisfies a preset threshold interval range, the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is determined to be a standard product; When the average solder joint connection quality index does not meet the preset threshold interval range and is greater than the maximum value of the preset threshold interval range, the connection quality between the single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is determined to be a high-quality product.

[0011] The present application also provides a PCB component detection system, comprising: A first acquisition module is used to acquire welding characteristic information between each pin of the PCB component and the PCB, wherein the welding characteristic information includes appearance characteristic information of the solder joint and internal characteristic information of the solder joint; A second acquisition module is used to acquire solder point surface connection information and PCB component installation position information according to the solder point appearance feature information, and acquire solder point wetting angle and solder point coverage information according to the solder point surface connection information; A third acquisition module is used to acquire an appearance connection characteristic index according to the solder joint wetting angle, PCB component installation position information and solder joint coverage information; A fourth acquisition module, used to acquire the internal crack length of the weld spot according to the internal characteristic information of the weld spot, and to acquire the internal connection characteristic index according to the internal crack length of the weld spot; A first calculation module, used for calculating the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index; A first judgment module is used to judge whether there is a solder joint connection index corresponding to at least one pin that exceeds a preset value; If it exists, the test result of the PCB component is judged to be unqualified; If it does not exist, the inspection result of the PCB component is determined to be qualified.

[0012] Preferably, the second acquisition module includes: A first acquisition unit is used to acquire solder joint location image information according to the solder joint appearance feature information, wherein the solder joint location image information includes a solder joint area, a PCB component pin area, and a PCB mounting area; A second acquisition unit is used to acquire the solder joint contour area of ​​the solder joint area based on Canny edge detection; A third acquisition unit is used to obtain coverage area information of the solder joint contour area covering the PCB component pin area and the PCB mounting area, and use the coverage area information as the solder joint surface connection information; A second parsing unit is used to perform edge detection and parsing on the PCB component pin area and the PCB installation area based on an edge detection algorithm to obtain PCB component pin edge information and PCB installation edge information, and use the area corresponding to the PCB installation edge information as PCB component installation position information; A fourth acquisition unit, configured to acquire a side edge contour of the solder joint area based on Canny edge detection; a fifth acquisition unit, configured to acquire the lower surface position coordinates and the side tangent point coordinates of the welding point according to the side edge contour, and extend the lower surface position coordinates toward one end to obtain an extension line; A second connection unit is used to connect the extension line and the side tangent point coordinates to obtain a tangent point connection line; a sixth acquisition unit, configured to acquire an angle between the connection line and the tangent point connection line according to the connection line and the tangent point connection line, and use the angle between the connection line and the tangent point connection line as a solder point wetting angle; A seventh acquisition unit, used to acquire a first area of ​​the solder joint region; An eighth acquisition unit is used to acquire a second area of ​​the PCB installation area, and acquire a solder joint proportion value according to a ratio of the first area to the second area, and use numerical information corresponding to the solder joint proportion value as solder joint coverage information.

[0013] The present application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program.

[0014] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above method are implemented.

[0015] The beneficial effects of the present application are as follows: the present invention first obtains solder joint surface connection information and PCB component installation position information according to the solder joint appearance feature information, and obtains solder joint wetting angle and solder joint coverage information according to the solder joint surface connection information, then obtains the appearance connection feature index according to the solder joint wetting angle, PCB component installation position information and solder joint coverage information, and then obtains the solder joint internal crack length according to the solder joint internal feature information, and obtains the internal connection feature index according to the solder joint internal crack length, and at the same time calculates the solder joint connection quality index of each pin according to the appearance connection feature index and the internal connection feature index, and determines whether there is at least one pin whose corresponding solder joint connection index exceeds a preset value. If so, it is determined that the inspection result of the PCB component is unqualified, and if not, it is determined that the inspection result of the PCB component is qualified, so that the PCB component and the PCB are checked according to the solder joint connection quality index. The welding quality of the products can be divided into defective products, standard products and high-quality products, and this clear quality division is convenient for quality control and product screening in the production process, ensuring that unqualified products are handled or improved in time, and qualified products are used normally. High-quality products can be used as representatives of high-quality products, which improves production efficiency and product quality stability. At the same time, it also helps to meet the diverse needs of different customers for product quality. Through the above division, the quality standard of the connection between PCB components and PCB can be accurately judged. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The figure is a schematic diagram of a method flow of an embodiment of the present application.

[0017] Figure 2 A schematic diagram of the system structure of an embodiment of the present application.

[0018] Figure 3 A schematic diagram of the internal structure of a computer device according to an embodiment of the present application.

[0019] Figure 4 This is a schematic diagram of the PCB component offset distance structure according to an embodiment of the present application.

[0020] Figure 5 Schematic diagram of the internal structure of a solder joint according to an embodiment of the present application.

[0021] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0023] like Figure 1-3 As shown, the present application provides a PCB component detection method, comprising: S1. Obtaining welding characteristic information between each pin of a PCB component and the PCB, wherein the welding characteristic information includes appearance characteristic information of a solder joint and internal characteristic information of a solder joint; S2, obtaining solder point surface connection information and PCB component installation position information according to the solder point appearance feature information, and obtaining solder point wetting angle and solder point coverage information according to the solder point surface connection information; S3, obtaining an external connection characteristic index according to the solder joint wetting angle, PCB component installation position information and solder joint coverage information; S4, obtaining the internal crack length of the weld spot according to the internal characteristic information of the weld spot, and obtaining the internal connection characteristic index according to the internal crack length of the weld spot; S5, calculating the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index; S6, determining whether there is at least one pin whose corresponding solder joint connection index exceeds a preset value; If it exists, the test result of the PCB component is judged to be unqualified; If it does not exist, the inspection result of the PCB component is determined to be qualified.

[0024] As described in the above steps S1-S6, after a single pin of a PCB component is connected to the PCB, it is necessary to inspect the connection between the single pin of the PCB component and the PCB, and usually the inspection needs to be carried out by taking pictures with a CCD camera for comparison and judgment. However, although the above judgment method can judge whether it is different from the standard requirements, it cannot classify the welding quality of the PCB component by standards. Therefore, the present invention first obtains the welding feature information of each pin of the PCB component and the PCB, wherein the welding feature information includes the appearance feature information of the solder joint and the internal feature information of the solder joint. In this way, the connection state of the single pin of the PCB component and the PCB can be comprehensively judged through the appearance feature information of the solder joint and the internal feature information of the solder joint. Since the accurate installation position can ensure the normal layout and signal transmission of the circuit, the surface connection information of the solder joint and the installation position information of the PCB component are obtained according to the appearance feature information of the solder joint. In this way, the surface connection information of the solder joint and the installation position information of the PCB component can be used to judge whether the solder joint is on the PCB The soldering quality on the PCB is evaluated, and a basic basis is provided for obtaining the subsequent solder joint wetting angle and solder joint coverage information. The solder joint wetting angle and solder joint coverage information are obtained according to the solder joint surface connection information. The solder joint wetting angle refers to the contact angle between the solder joint formed on the PCB and the PCB surface. This angle can be used to evaluate the wettability of the solder, and then judge the quality of the solder joint. The solder joint coverage information refers to the proportion of the solder joint formed on the PCB at the preset installation position. Then, the appearance connection characteristic index is obtained according to the solder joint wetting angle, the PCB component installation position information and the solder joint coverage information. Since the appearance connection characteristic index combines multiple key appearance factors, it can comprehensively and objectively quantify the appearance connection quality of the solder joint, and can provide effective data support for subsequent quality judgment. Since the bubble area and crack length will reduce the mechanical strength of the solder joint and increase the resistance of the electrical connection, it is necessary to obtain the internal crack of the solder joint according to the internal characteristic information of the solder joint. length, wherein the acquisition method is based on ultrasonic detection, and the internal connection characteristic index is obtained according to the internal crack length of the solder joint. The internal connection characteristic index can quantify the quality of the internal connection of the solder joint, and can also effectively evaluate the degree of influence of internal defects on the overall quality of the solder joint. Then, the solder joint connection quality index of each pin is calculated according to the external connection characteristic index and the internal connection characteristic index. In this way, the connection quality of the solder joint can be comprehensively and comprehensively reflected through the collection of internal and external parameters, and a comprehensive and balanced quantitative index is provided for accurately judging the connection quality of the solder joint. Then, it is judged whether the solder joint connection index corresponding to at least one pin exceeds the preset value. If so, it is judged that the inspection result of the PCB component is unqualified. If not, it is judged that the inspection result of the PCB component is qualified. Therefore, the welding quality of the PCB component can be divided according to the average solder joint connection quality index. In this way, the welding quality of the PCB component and the PCB is divided according to the solder joint connection quality index.For example, they are divided into defective products, standard products and high-quality products. This clear quality division facilitates quality control and product screening during the production process, ensuring that unqualified products are handled or improved in a timely manner and qualified products are used normally. High-quality products can be used as representatives of high-quality products, which improves production efficiency and product quality stability. At the same time, it also helps to meet the diverse needs of different customers for product quality. Through the above division, the quality standards of PCB components and PCB connections can be accurately determined.

[0025] In one embodiment, the step S2 of acquiring solder joint surface connection information and PCB component installation position information according to the solder joint appearance feature information, and acquiring solder joint wetting angle and solder joint coverage information according to the solder joint surface connection information includes: S201, acquiring solder joint location image information according to the solder joint appearance feature information, wherein the solder joint location image information includes a solder joint area, a PCB component pin area, and a PCB mounting area, and the acquisition method is based on a camera, a magnifying glass, a microscope, etc.; S202, graying and binarizing the solder joint image information to obtain a black image and a white image, wherein the black image is the solder joint area, and the white image includes the PCB component pin area and the PCB mounting area; S203, obtaining the solder joint contour area of ​​the solder joint area based on Canny edge detection; S204, obtaining coverage area information of the solder joint contour area covering the PCB component pin area and the PCB mounting area, and using the coverage area information as solder joint surface connection information; S205, performing edge detection and analysis on the PCB component pin area and the PCB installation area based on an edge detection algorithm to obtain PCB component pin edge information and PCB installation edge information, and using the area corresponding to the PCB installation edge information as PCB component installation position information; S206, obtaining the side edge contour of the solder joint area based on Canny edge detection; S207, acquiring the lower surface position coordinates and the side tangent point coordinates of the welding point according to the side edge contour, and extending the lower surface position coordinates toward one end to obtain an extension line; S208, connecting the extension line and the side tangent point coordinates to obtain a tangent point connection line; S209, acquiring the angle between the connection line and the tangent point connection line according to the connection line and the tangent point connection line, and using the angle between the connection line and the tangent point connection line as the solder joint wetting angle; S2010, obtaining a first area of ​​a solder joint region; S2011. Obtain a second area of ​​the PCB installation area, and obtain a solder joint proportion value according to the ratio of the first area to the second area, and use numerical information corresponding to the solder joint proportion value as solder joint coverage information.

[0026] As described in the above steps S201-S2011, the present invention first obtains the image information of the solder joint part according to the solder joint appearance feature information, wherein the image information of the solder joint part includes the solder joint area, the PCB component pin area and the PCB installation area, and the acquisition method is based on the acquisition of the camera, the magnifying glass and the microscope. By acquiring the image information of the solder joint part based on the camera acquisition, it can provide data support for the subsequent analysis of the solder joint connection status and the PCB component installation position, so that the image information of the solder joint part can be quickly parsed, and the contours and boundaries of these areas are easier to identify and analyze, which provides convenient conditions for subsequent operations based on algorithms such as edge detection, and then the solder joint contour area of ​​the solder joint area is obtained based on Canny edge detection. The solder joint contour area can provide a basis for obtaining subsequent solder joint surface connection information. On this basis, the coverage area information of the solder joint contour area on the PCB component pin area and the PCB mounting area can be obtained, and the coverage area information can be used as the solder joint surface connection information. In this way, the connection degree between the solder joint and the pin and the mounting area can be intuitively displayed through the solder joint surface connection information. A good coverage area means that the distribution of solder on the pin and the mounting area is more reasonable, which helps to ensure the reliability and mechanical stability of the electrical connection, and also provides a key basis for further analyzing the integrity of the solder joint connection. Then, the edge detection analysis of the PCB component pin area and the PCB mounting area is performed based on the edge detection algorithm to obtain the PCB element The component pin edge information and PCB installation edge information are obtained, and the area corresponding to the PCB installation edge information is used as the PCB component installation position information. Accurate installation position information is crucial to ensure the correct installation of PCB components on the PCB. It is related to the rationality of the overall layout of the circuit, the signal transmission path and the mutual coordination between components. At the same time, it can also determine whether there are problems such as offset or misalignment in the component installation. Then, the side edge contour of the solder joint area is obtained based on Canny edge detection, where the side edge contour refers to the viewing angle contour of the solder joint viewed from the side. The side edge contour of the solder joint area can provide the necessary geometric shape information for the subsequent calculation of the solder joint wetting angle, and then the solder joint is obtained according to the side edge contour. The lower surface position coordinates and the side tangent point coordinates are obtained, and the lower surface position coordinates are extended to one end to obtain an extension line, and then the extension line is connected with the side tangent point coordinates to obtain a tangent point connection line, and then the angle between the connection line and the tangent point connection line is obtained according to the connection line and the tangent point connection line, and the angle between the connection line and the tangent point connection line is used as the solder joint wetting angle. The solder joint wetting angle calculated in this way is an important indicator to measure the degree of solder spreading on the solder joint surface and the wettability with the soldered surface, and a suitable wetting angle indicates that the solder can be well attached to the solder joint surface to form a reliable intermetallic compound, thereby ensuring the electrical connection performance and mechanical strength of the solder joint, and an abnormal wetting angle may indicate problems in the welding process.For example, improper welding temperature, solder quality problems or poor surface treatment, etc., which affect the quality of solder joints. Therefore, this step is of key significance for evaluating the quality of solder joints. Since appropriate solder joint coverage can ensure the stability of solder joints in electrical connections and prevent the risk of circuit breakage caused by insufficient coverage or the hidden danger of short circuit caused by excessive coverage, etc., the first area of ​​the solder joint area is obtained, and then the second area of ​​the PCB installation area is obtained, and the solder joint proportion value is obtained according to the ratio of the first area to the second area. The numerical information corresponding to the solder joint proportion value is used as the solder joint coverage information. In this way, the solder joint proportion value can quantify the coverage of the installation area by the solder, and it can also evaluate one of the important appearance indicators of the solder joint connection quality. ,

[0027] In one embodiment, the step S3 of acquiring the surface connection characteristic index according to the solder joint wetting angle, the PCB component installation position information and the solder joint coverage information comprises: S301, obtaining a standard wetting angle of a solder joint; S302, calculating a solder point wetting angle index according to the solder point standard wetting angle and the solder point wetting angle, wherein the calculation formula is: ; Among them, R(Z) represents the solder joint wetting angle index, R(J) represents the solder joint wetting angle, and R(J) max represents the standard wetting angle of the solder joint, and σ represents the error coefficient of the wetting angle of the solder joint; S303, acquiring a corresponding first solder joint proportion value according to the solder joint coverage information, and using the first solder joint proportion value as a solder joint coverage index; S304, acquiring a PCB component installation position image according to the PCB component installation position information; S305, acquiring a plurality of pixel points according to the PCB component installation position image, wherein the PCB installation image is a set consisting of a plurality of pixel points; S306, obtaining a plurality of plane positioning coordinates of a plurality of pixel points in the PCB component installation position image; S307, acquiring the total number of pixel points in the PCB component installation position image according to the plurality of pixel points; S308, calculating the center plane position coordinates of the PCB component installation position image according to the multiple pixel points, the multiple plane positioning coordinates and the total pixel points, wherein the calculation formula is: ; Wherein, Z(x, y) represents the coordinates of the center plane position, Xi represents the coordinate value of the i-th pixel point on the x-axis, yi represents the coordinate value of the i-th pixel point on the y-axis, and n represents the total pixel points in the PCB component installation position image, where i is the number of multiple pixel points, i=1, 2, 3...n; S309, obtaining the first center coordinates of the PCB installation area, and taking the first center coordinates as the origin coordinates, and calculating the offset distance according to the origin coordinates and the center plane position coordinates; S3010, obtaining a maximum allowable offset distance, and calculating an offset index according to the maximum allowable offset distance and the offset distance, the calculation formula is: ; Where P(Y) represents the offset index, J(L) represents the solder joint wetting angle, and J(L) represents the solder joint wetting angle. max Indicates the maximum allowable offset distance; S3011. Perform weighted calculation on the solder joint wetting angle index, solder joint coverage index and offset index to obtain a comprehensive solder joint installation index, and use the comprehensive solder joint installation index as an appearance connection feature index.

[0028] As described in the above steps S301-S3011, the present invention first obtains the standard wetting angle of the solder joint, and then calculates the solder joint wetting angle index according to the standard wetting angle of the solder joint and the solder joint wetting angle. The solder joint wetting angle index can quantify the degree of deviation between the solder joint wetting angle and the standard wetting angle. The error coefficient in the formula can be adjusted according to actual production requirements and process characteristics to more accurately reflect the influence of the wetting angle deviation on the solder joint quality under different conditions. Through the solder joint wetting angle index, the quality of the solder joint wetting can be intuitively understood. For example, the closer the index is to 1, the closer the wetting angle is to the standard, and the more reliable the solder joint quality is in this factor. The smaller the index is, the greater the deviation of the wetting angle from the standard is, and there may be welding problems. Because the solder joint covers the PCB installation area (solder hole ) area can be used to judge the welding quality, which needs to reach a preset coverage area, for example: solder joint coverage: the solder of general electronic products should cover at least 75% of the pad, and the solder joint coverage of high-performance electronic products: the solder should cover at least 95% of the pad. Therefore, it is necessary to obtain the corresponding first solder joint ratio value according to the solder joint coverage information, and use the first solder joint ratio value as the solder joint coverage index. The solder joint coverage index clarifies the relative size of the solder joint coverage area in numerical form, and clearly reflects the coverage degree of the solder on the solder joint. Among them, the closer the first solder joint ratio value is to 1, the better the solder joint coverage is, and it can effectively reduce the risk of poor electrical connection caused by insufficient coverage. It is also one of the criteria for evaluating quality. On the contrary, a smaller coverage index indicates that There may be a problem of insufficient coverage, which affects the reliability of the solder joints. Since the sum of the coordinate values ​​of all pixel points can be obtained by summing the X-axis and Y-axis coordinates of all pixel points respectively, the average value of these coordinate values ​​is obtained by dividing the sum by the total number of pixels. The average value is the coordinate of the centroid, and the centroid represents the geometric center of these pixel points (the center position on the plane), that is, the average position of the coordinates of all pixel points. On this basis, the PCB component installation position image can be obtained according to the PCB component installation position information, and then a plurality of pixel points can be obtained according to the PCB component installation position image, wherein the PCB installation image is a set composed of a plurality of pixel points, and then a plurality of pixel points in the PCB component installation position image are obtained. plane positioning coordinates, and then the total number of pixel points in the PCB component installation position image is obtained according to the multiple pixel points, and then the central plane position coordinates of the PCB component installation position image are calculated according to the multiple pixel points, the multiple plane positioning coordinates and the total pixel points. In this way, the PCB component installation position image is obtained according to the PCB component installation position information, and then the multiple pixel points in the image, their plane positioning coordinates and the total number of pixel points are obtained, and a data basis is provided for the subsequent calculation of the central plane position coordinates. The central plane position coordinates can accurately represent the center position of the component installation position on the plane. Since the component is composed of a component body and pins, after determining the center position of the component body on the plane, its body position is located.The pin only needs to rotate with the PCB installation area. Therefore, the center position on the plane is very important for judging whether the component is installed accurately. Then, the first center coordinate of the PCB installation area is obtained, and the first center coordinate is used as the origin coordinate. The offset distance is calculated according to the origin coordinate and the center plane position coordinate (for example, Figure 4 As shown), the offset distance intuitively reflects the degree of deviation of the actual installation position of the PCB component relative to the ideal position (origin coordinates). The larger the offset distance, the greater the installation error, which may mean a greater impact on the solder joint connection quality and circuit performance. Since the maximum allowable offset distance of electronic components is a key parameter to ensure welding quality and electrical connection reliability, for example: general resistors and capacitors: maximum allowable offset distance: 10% to 20% of the pad width, if the pad width is 1mm, the maximum allowable offset distance is 0.1mm to 0.2mm, small IC chips (such as SOP, SOIC): maximum allowable offset distance: 10% of the pad width, if the pad width is 0.5mm, the maximum allowable offset distance is 0.05mm, large IC chips (such as QFP, BGA): maximum allowable offset distance: 5% to 10% of the pad width, if the pad width is 1mm, the maximum allowable offset distance is 0.05mm to 0.1mm, so Therefore, it is necessary to obtain the maximum allowable offset distance, and calculate the offset index based on the maximum allowable offset distance and the offset distance. The offset index compares the offset distance with the maximum allowable offset range, and expresses the severity of the offset in numerical form. The closer the offset index is to 1, the smaller the offset is and the higher the installation quality is. The smaller the offset index is, the greater the degree to which the offset exceeds the allowable range may lead to problems such as uneven force on the solder joints and unstable electrical connections, thereby affecting the performance and reliability of the entire PCB assembly. Finally, the solder joint wetting angle index, solder joint coverage index and offset index are weightedly calculated to obtain the solder joint comprehensive installation index, and the solder joint comprehensive installation index is used as the appearance connection feature index. In this way, the appearance connection quality of the solder joint can be comprehensively and objectively quantified through the appearance connection feature index, which provides an important component for the subsequent calculation of the solder joint connection quality index in combination with the internal connection feature index, thereby achieving a more comprehensive and accurate evaluation of the solder joint connection quality.

[0029] In one embodiment, the step S4 of obtaining the internal crack length of the weld spot according to the internal characteristic information of the weld spot, and obtaining the internal connection characteristic index according to the internal crack length of the weld spot, comprises: S401, obtaining the area of ​​the solder joint in a top view according to the internal characteristic information of the solder joint; S402, obtaining the number and area of ​​bubbles inside the solder joint based on ultrasonic detection; S403, calculating the bubble influence coefficient of the solder joint according to the area of ​​the solder joint in a top view, the number of bubbles and the bubble area, wherein the calculation formula is: ; Among them, K(z) represents the solder joint bubble influence coefficient, G(D) o represents the bubble area, z(m) o represents the area of ​​the oth solder joint in top view, o represents the number of bubbles, where o=1, 2, 3...k; S404, obtaining internal crack information of the weld within the area of ​​the weld in a top-down state based on ultrasonic testing, wherein the internal crack information of the weld includes the number of internal cracks of the weld and the lengths of multiple internal cracks of the weld; S405, calculating the influence coefficient of the internal crack of the weld according to the area of ​​the weld in the top view and the lengths of the internal cracks of the welds, wherein the calculation formula is: ; Where, N(B) represents the internal crack influence coefficient of the weld, L(W) h represents the internal crack length of the hth solder joint, z(m) h represents the area of ​​the hth solder joint in the top view, h represents the length of the internal crack of the solder joint and the number of the area of ​​the solder joint in the top view, where h=1, 2, 3...t; The weld bubble influence coefficient and the weld internal crack influence coefficient are weightedly calculated to obtain a weld comprehensive crack index, and the weld comprehensive crack index is used as an internal connection characteristic index.

[0030] As described in the above steps S401-S405, ultrasonic flaw detection is a non-destructive detection method that uses the sound wave propagation characteristics of ultrasonic waves to detect internal defects of materials. The basic principle of ultrasonic flaw detection is to use the ultrasonic waves generated by the transmitter. When they encounter the interface of materials with different densities and sound velocities, reflection and refraction will occur, and the detector can receive these reflection and refraction signals. By analyzing the waveform and sound velocity of these signals, the location and size of the internal defects of the material can be known. As a common welding defect, bubbles in the weld will have a significant impact on the mechanical properties and sealing properties of the weld. When detecting the weld, the ultrasonic detector will emit a series of ultrasonic signals. When the signal encounters bubbles in the weld, reflection or refraction will occur, and the probe can receive these signals. By analyzing the parameters such as the amplitude, frequency, phase and time delay of the reflected and refracted signals, the position, size and distribution of the bubbles inside the weld can be determined. Therefore, the present invention first obtains the area of ​​the weld in a top-down state with the assistance of ultrasound based on the internal characteristic information of the weld, wherein the area of ​​the weld in a top-down state is the cross-sectional contour area in a top-down view, and then obtains the number of bubbles and the area of ​​the bubbles inside the weld based on ultrasonic detection, and calculates the weld bubble influence coefficient based on the area of ​​the weld in a top-down state, the number of bubbles and the area of ​​the bubbles, wherein the bubble area refers to the space area inside the weld that is not filled with solder, and these bubbles are usually formed because the gas fails to escape completely during the welding process, and usually exist in the weld in a series (such as Figure 5 As shown in the figure, the overall influence of bubbles in the weld can be intuitively reflected in numerical form through the weld bubble influence coefficient. The larger the weld bubble influence coefficient, the greater the proportion of bubbles in the weld, and the more serious the negative impact on the weld quality. At the same time, the weld bubble influence coefficient can evaluate the overall structural integrity and performance of the weld. Then, the internal crack information of the weld within the area of ​​the weld in a top-down state is obtained based on ultrasonic testing, wherein the internal crack information of the weld includes the number of internal cracks in the weld and the lengths of multiple internal cracks in the weld. Then, according to the area of ​​the weld in a top-down state and the lengths of multiple internal cracks in the weld, the weld bubble influence coefficient can be used to evaluate the overall structural integrity and performance of the weld. The internal crack length of the solder joint is used to calculate the internal crack influence coefficient of the solder joint. In this way, the influence of the internal crack on the quality of the solder joint can be quantified through the internal crack influence coefficient of the solder joint, and the severity of the crack inside the solder joint can be intuitively understood. Finally, the solder joint bubble influence coefficient and the internal crack influence coefficient of the solder joint are weighted to obtain the solder joint comprehensive crack index, and the solder joint comprehensive crack index is used as the internal connection characteristic index. The internal connection characteristic index can comprehensively reflect the connection status between the PCB component and the inside of the PCB, providing an effective basis for the subsequent quality judgment of the connection between the PCB component and the PCB.

[0031] In one embodiment, the step S5 of calculating the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index comprises: S501, obtaining a first weight value of the outer connection feature index; S502: Calculate the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index, wherein the calculation formula is: ; Wherein, L(j) represents the solder joint connection quality index, W(B) represents the surface connection characteristic index, N(B) represents the internal connection characteristic index, and A represents the first weight value.

[0032] As described in the above steps S501-S502, the present invention first obtains the first weight value of the external connection feature index, and then calculates the solder joint connection quality index of each pin according to the external connection feature index and the internal connection feature index, so that the solder joint connection quality index can fully and comprehensively reflect the overall quality status of the solder joint connection, avoiding the one-sidedness of evaluating the solder joint quality by relying on a single feature or partial features. The solder joint connection quality index can intuitively compare and sort the qualities of different solder joints, and provides accurate data support for the subsequent classification of the welding quality of PCB components and PCBs according to the quality index, thereby realizing effective hierarchical management of the solder joint connection quality, helping to screen out products of different quality grades in the production process, ensuring the consistency and stability of product quality, and improving production efficiency and product reliability.

[0033] In one embodiment, after the step S6 of determining that the detection result of the PCB component is qualified if it does not exist, the following steps are included: S7, calculating an average solder joint connection quality index according to the plurality of solder joint connection quality indexes; S8, determining whether the average solder joint connection quality index satisfies a preset threshold range; When the average solder joint connection quality index does not meet the preset threshold interval range and is less than the minimum value of the preset threshold interval range, it is determined that the connection quality between the single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a defective product; When the average solder joint connection quality index satisfies a preset threshold interval range, the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is determined to be a standard product; When the average solder joint connection quality index does not meet the preset threshold interval range and is greater than the maximum value of the preset threshold interval range, the connection quality between the single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is determined to be a high-quality product.

[0034] As described in the above steps S7-S8, the present invention first calculates an average solder joint connection quality index based on a plurality of the solder joint connection quality indexes, and determines whether the average solder joint connection quality index satisfies a preset threshold interval range. When the average solder joint connection quality index does not satisfy the preset threshold interval range and is less than the minimum value of the preset threshold interval range, it is determined that the connection quality between a single pin of a PCB component corresponding to the solder joint connection quality index and the PCB is a defective product. When the average solder joint connection quality index satisfies the preset threshold interval range, it is determined that the connection quality between a single pin of a PCB component corresponding to the solder joint connection quality index and the PCB is a standard product. When the average solder joint connection quality index satisfies the preset threshold interval range, it is determined that the connection quality between a single pin of a PCB component corresponding to the solder joint connection quality index and the PCB is a standard product. When the connection quality index does not meet the preset threshold interval range and is greater than the maximum value of the preset threshold interval range, the connection quality between the single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is determined to be a high-quality product. Such a clear quality division facilitates quality control and product screening during the production process, ensuring that unqualified products are handled or improved in a timely manner and qualified products are used normally. High-quality products can be used as representatives of high-quality products, which improves production efficiency and the stability of product quality. At the same time, it also helps to meet the diverse needs of different customers for product quality. Through the above division, it is possible to accurately determine what the quality standard is for the connection between a single pin of a PCB component and the PCB.

[0035] The present application also provides a PCB component detection system, comprising: The first acquisition module 1 is used to acquire the welding characteristic information between each pin of the PCB component and the PCB, wherein the welding characteristic information includes the appearance characteristic information of the solder joint and the internal characteristic information of the solder joint; A second acquisition module 2 is used to acquire solder point surface connection information and PCB component installation position information according to the solder point appearance feature information, and to acquire solder point wetting angle and solder point coverage information according to the solder point surface connection information; A third acquisition module 3 is used to acquire an external connection characteristic index according to the solder joint wetting angle, PCB component installation position information and solder joint coverage information; A fourth acquisition module 4 is used to acquire the internal crack length of the weld spot according to the internal characteristic information of the weld spot, and acquire the internal connection characteristic index according to the internal crack length of the weld spot; A first calculation module 5, used for calculating the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index; A first judging module 6 is used to judge whether there is a solder joint connection index corresponding to at least one pin that exceeds a preset value; If it exists, the test result of the PCB component is judged to be unqualified; If it does not exist, the inspection result of the PCB component is determined to be qualified.

[0036] In one embodiment, the second acquisition module includes: A first acquisition unit is used to acquire solder joint location image information according to the solder joint appearance feature information, wherein the solder joint location image information includes a solder joint area, a PCB component pin area, and a PCB mounting area; A second acquisition unit is used to acquire the solder joint contour area of ​​the solder joint area based on Canny edge detection; A third acquisition unit is used to obtain coverage area information of the solder joint contour area covering the PCB component pin area and the PCB mounting area, and use the coverage area information as the solder joint surface connection information; A second parsing unit is used to perform edge detection and parsing on the PCB component pin area and the PCB installation area based on an edge detection algorithm to obtain PCB component pin edge information and PCB installation edge information, and use the area corresponding to the PCB installation edge information as PCB component installation position information; A fourth acquisition unit, configured to acquire a side edge contour of the solder joint area based on Canny edge detection; a fifth acquisition unit, configured to acquire the lower surface position coordinates and the side tangent point coordinates of the welding point according to the side edge contour, and extend the lower surface position coordinates toward one end to obtain an extension line; A second connection unit is used to connect the extension line and the side tangent point coordinates to obtain a tangent point connection line; a sixth acquisition unit, configured to acquire an angle between the connection line and the tangent point connection line according to the connection line and the tangent point connection line, and use the angle between the connection line and the tangent point connection line as a solder point wetting angle; A seventh acquisition unit, used to acquire a first area of ​​the solder joint region; An eighth acquisition unit is used to acquire a second area of ​​the PCB installation area, and acquire a solder joint proportion value according to a ratio of the first area to the second area, and use numerical information corresponding to the solder joint proportion value as solder joint coverage information.

[0037] The present invention also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above-mentioned method for detecting PCB components are implemented.

[0038] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided in this application and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0039] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0040] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A PCB component detection method, characterized in that: include: Obtaining welding characteristic information between each pin of the PCB component and the PCB, wherein the welding characteristic information includes appearance characteristic information of the welding point and internal characteristic information of the welding point; Acquire solder point surface connection information and PCB component installation position information according to the solder point appearance feature information, and acquire solder point wetting angle and solder point coverage information according to the solder point surface connection information; Obtaining a surface connection characteristic index according to the solder joint wetting angle, PCB component installation position information, and solder joint coverage information; Acquire the internal crack length of the weld spot according to the internal characteristic information of the weld spot, and acquire the internal connection characteristic index according to the internal crack length of the weld spot; Calculating the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index; Determine whether there is at least one pin whose corresponding solder joint connection index exceeds a preset value; If it exists, the test result of the PCB component is judged to be unqualified; If it does not exist, the inspection result of the PCB component is determined to be qualified.

2. The PCB component detection method according to claim 1, characterized in that: The step of obtaining solder point surface connection information and PCB component installation position information according to the solder point appearance feature information, and obtaining solder point wetting angle and solder point coverage information according to the solder point surface connection information includes: Acquire solder joint location image information according to the solder joint appearance feature information, wherein the solder joint location image information includes a solder joint area, a PCB component pin area, and a PCB mounting area; Obtain the solder joint contour area of ​​the solder joint area based on Canny edge detection; Obtain coverage area information of the solder joint contour area covering the PCB component pin area and the PCB mounting area, and use the coverage area information as solder joint surface connection information; Perform edge detection and analysis on the PCB component pin area and the PCB installation area based on an edge detection algorithm to obtain PCB component pin edge information and PCB installation edge information, and use the area corresponding to the PCB installation edge information as PCB component installation position information; Obtain the side edge contour of the solder joint area based on Canny edge detection; Acquire the lower surface position coordinates and the side tangent point coordinates of the welding point according to the side edge contour, and extend the lower surface position coordinates toward one end to obtain an extension line; Connecting the extension line and the side tangent point coordinates to obtain a tangent point connection line; According to the connection line and the tangent point connection line, an angle between the connection line and the tangent point connection line is obtained, and the angle between the connection line and the tangent point connection line is used as a solder point wetting angle; Obtaining a first area of ​​a solder joint region; A second area of ​​the PCB installation area is obtained, and a solder joint proportion value is obtained according to the ratio of the first area to the second area, and numerical information corresponding to the solder joint proportion value is used as solder joint coverage information.

3. The PCB component detection method according to claim 1, characterized in that: The step of obtaining the surface connection characteristic index according to the solder joint wetting angle, PCB component installation position information and solder joint coverage information comprises: Get the standard wetting angle of solder joints; The solder joint wetting angle index is calculated according to the solder joint standard wetting angle and the solder joint wetting angle, wherein the calculation formula is: ； Among them, R(Z) represents the solder joint wetting angle index, R(J) represents the solder joint wetting angle, and R(J) max represents the standard wetting angle of the solder joint, and σ represents the error coefficient of the wetting angle of the solder joint; Acquire a corresponding first solder joint ratio value according to the solder joint coverage information, and use the first solder joint ratio value as a solder joint coverage index; Acquire a PCB component installation position image according to the PCB component installation position information; Acquire a plurality of pixel points according to the PCB component installation position image, wherein the PCB installation image is a set consisting of the plurality of pixel points; Acquire multiple plane positioning coordinates of multiple pixel points in the PCB component installation position image; Acquire the total number of pixel points in the PCB component installation position image according to the plurality of pixel points; The central plane position coordinates of the PCB component installation position image are calculated according to the multiple pixel points, the multiple plane positioning coordinates and the total pixel points, wherein the calculation formula is: ； Wherein, Z(x, y) represents the coordinates of the center plane position, Xi represents the coordinate value of the i-th pixel point on the x-axis, yi represents the coordinate value of the i-th pixel point on the y-axis, and n represents the total pixel points in the PCB component installation position image, where i is the number of multiple pixel points, i=1, 2, 3...n; Acquire the first center coordinates of the PCB installation area, and use the first center coordinates as the origin coordinates, and calculate the offset distance according to the origin coordinates and the center plane position coordinates; The maximum allowable offset distance is obtained, and the offset index is calculated according to the maximum allowable offset distance and the offset distance. The calculation formula is: ； Where P(Y) represents the offset index, J(L) represents the solder joint wetting angle, and J(L) represents the solder joint wetting angle. max Indicates the maximum allowable offset distance; The solder joint wetting angle index, solder joint coverage index and offset index are weightedly calculated to obtain a solder joint comprehensive installation index, and the solder joint comprehensive installation index is used as an appearance connection characteristic index.

4. The PCB component detection method according to claim 1, characterized in that: The step of obtaining the internal crack length of the weld spot according to the internal characteristic information of the weld spot, and obtaining the internal connection characteristic index according to the internal crack length of the weld spot, comprises: Acquiring the area of ​​the solder joint in a top-view state according to the internal characteristic information of the solder joint; Obtain the number and area of ​​bubbles inside the solder joint based on ultrasonic testing; The bubble influence coefficient of the solder joint is calculated according to the area of ​​the solder joint in a top view, the number of bubbles and the bubble area, wherein the calculation formula is: ； Among them, K(z) represents the solder joint bubble influence coefficient, G(D) o represents the bubble area, z(m) o represents the area of ​​the oth solder joint in top view, o represents the number of bubbles, where o=1, 2, 3...k; Acquire internal crack information of the weld within the area of ​​the weld in a top-down state based on ultrasonic testing, wherein the internal crack information of the weld includes the number of internal cracks of the weld and the lengths of multiple internal cracks of the weld; The internal crack influence coefficient of the weld is calculated according to the area of ​​the weld in the top view and the lengths of the internal cracks of the welds, wherein the calculation formula is: ； Where, N(B) represents the internal crack influence coefficient of the weld, L(W) h represents the internal crack length of the hth solder joint, z(m) h represents the area of ​​the hth solder joint in the top view, h represents the length of the internal crack of the solder joint and the number of the area of ​​the solder joint in the top view, where h=1, 2, 3...t; The weld bubble influence coefficient and the weld internal crack influence coefficient are weightedly calculated to obtain a weld comprehensive crack index, and the weld comprehensive crack index is used as an internal connection characteristic index.

5. The PCB component detection method according to claim 1, characterized in that: The step of calculating the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index comprises: Obtaining a first weight value of the outer connection feature index; The solder joint connection quality index of each pin is calculated according to the external connection characteristic index and the internal connection characteristic index, wherein the calculation formula is: ； Wherein, L(j) represents the solder joint connection quality index, W(B) represents the surface connection characteristic index, N(B) represents the internal connection characteristic index, and A represents the first weight value.

6. The PCB component detection method according to claim 1, characterized in that: After the step of determining that the inspection result of the PCB component is qualified if it does not exist, the method further comprises: Calculating an average solder joint connection quality index according to a plurality of solder joint connection quality indexes; Determining whether the average solder joint connection quality index satisfies a preset threshold interval range; When the average solder joint connection quality index does not meet the preset threshold interval range and is less than the minimum value of the preset threshold interval range, it is determined that the connection quality between the single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a defective product; When the average solder joint connection quality index satisfies a preset threshold interval range, the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is determined to be a standard product; When the average solder joint connection quality index does not meet the preset threshold interval range and is greater than the maximum value of the preset threshold interval range, the connection quality between the single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is determined to be a high-quality product.

7. A PCB component detection system, characterized in that: include: A first acquisition module is used to acquire welding characteristic information between each pin of the PCB component and the PCB, wherein the welding characteristic information includes appearance characteristic information of the solder joint and internal characteristic information of the solder joint; A second acquisition module is used to acquire solder point surface connection information and PCB component installation position information according to the solder point appearance feature information, and acquire solder point wetting angle and solder point coverage information according to the solder point surface connection information; A third acquisition module is used to acquire an appearance connection characteristic index according to the solder joint wetting angle, PCB component installation position information and solder joint coverage information; A fourth acquisition module, used to acquire the internal crack length of the weld spot according to the internal characteristic information of the weld spot, and to acquire the internal connection characteristic index according to the internal crack length of the weld spot; A first calculation module, used for calculating the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index; A first judgment module is used to judge whether there is a solder joint connection index corresponding to at least one pin that exceeds a preset value; If it exists, the test result of the PCB component is judged to be unqualified; If it does not exist, the inspection result of the PCB component is determined to be qualified.

8. The PCB component detection system according to claim 7, characterized in that: The second acquisition module includes: A first acquisition unit is used to acquire solder joint location image information according to the solder joint appearance feature information, wherein the solder joint location image information includes a solder joint area, a PCB component pin area, and a PCB mounting area; A second acquisition unit is used to acquire the solder joint contour area of ​​the solder joint area based on Canny edge detection; A third acquisition unit is used to obtain coverage area information of the solder joint contour area covering the PCB component pin area and the PCB mounting area, and use the coverage area information as the solder joint surface connection information; A second parsing unit is used to perform edge detection and parsing on the PCB component pin area and the PCB installation area based on an edge detection algorithm to obtain PCB component pin edge information and PCB installation edge information, and use the area corresponding to the PCB installation edge information as PCB component installation position information; A fourth acquisition unit, configured to acquire a side edge contour of the solder joint area based on Canny edge detection; a fifth acquisition unit, configured to acquire the lower surface position coordinates and the side tangent point coordinates of the welding point according to the side edge contour, and extend the lower surface position coordinates toward one end to obtain an extension line; A second connection unit is used to connect the extension line and the side tangent point coordinates to obtain a tangent point connection line; a sixth acquisition unit, configured to acquire an angle between the connection line and the tangent point connection line according to the connection line and the tangent point connection line, and use the angle between the connection line and the tangent point connection line as a solder point wetting angle; A seventh acquisition unit, used to acquire a first area of ​​the solder joint region; An eighth acquisition unit is used to acquire a second area of ​​the PCB installation area, and acquire a solder joint proportion value according to a ratio of the first area to the second area, and use numerical information corresponding to the solder joint proportion value as solder joint coverage information.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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