Semiconductor packaging test device and method

Abstract

The invention relates to the technical field of semiconductor packaging testing, and discloses a semiconductor packaging testing device and method.The semiconductor packaging testing device comprises a laminating mechanism, the laminating mechanism further comprises a placing table, a pushing plate is arranged at the top of the placing table, and four fixing rods are fixedly connected to the top of the placing table; a worker places a chip in a groove of a placement table, then starts an electric telescopic rod to stretch out to drive a push plate and a probe table to descend, the push plate descends to drive an extrusion rod and an extrusion plate I to descend, and along with continuous descending of the push plate, the extrusion rod firstly makes contact with a spring reset rod I, extrudes the spring reset rod I and moves towards the direction of the chip; when a chip is detected, a current signal of the probe station can be transmitted to the chip through the copper block, so that the contact area of the probe station is increased, and the accuracy of chip detection is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging and testing equipment, and in particular to a semiconductor packaging and testing device and method. Background Art

[0002] Semiconductor packaging is an important part of the semiconductor production process. It mainly involves wrapping a protective layer on the outside of the semiconductor material. The protective layer can be ceramic material, insulating plastic material, metal material, etc. After packaging, a test device is required to perform inspection operations on the packaged product.

[0003] Among them, a probe station is often used to test the pins of the packaged chip, but the probe contact method of the probe station is mostly point contact. Due to the small contact area of ​​point contact, it may be difficult for the probe to fully contact the chip pin, resulting in reduced accuracy of signal transmission, which in turn affects the chip test results. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a semiconductor packaging test device, including a bonding mechanism, the bonding mechanism also includes a placement table, a push plate is arranged on the top of the placement table, four fixed rods are fixedly connected to the top of the placement table, and the inner wall of the push plate is slidably connected to the outer wall of the fixed rod; The pre-pressing mechanism comprises twenty rotating racks arranged on the inner wall of the placing table, the outer walls of the twenty rotating racks are rotatably connected to two arc-shaped plates, and the inner walls of the forty arc-shaped plates are slidably connected to two spring rods; The pressing mechanism comprises a spring sliding plate in contact with the bottom of the rotating frame, the bottoms of the twenty spring sliding plates are fixedly connected with two concave-convex plates, and the side walls of the forty concave-convex plates are slidably connected with spring push rods.

[0005] Preferably, the fitting mechanism further comprises an electric telescopic rod fixedly connected to the top of the fixed rod, the bottom output ends of the electric telescopic rod are fixedly connected to the top of the push plate, four sliding blocks are slidably connected to the inner wall of the placement table, and the bottom of the push plate is fixedly connected to the probe table; Among them, chips are placed on the inner wall of the placement table, twelve extrusion rods are fixedly connected to the bottom of the pushing plate, and four extrusion plates are fixedly connected to the bottom of the pushing plate. The staff places the chip in the groove of the placement table, and then starts the electric telescopic rod to extend, driving the pushing plate to descend, allowing the probe table to descend and contact the pins of the chip. During the descending process of the pushing plate, the extrusion rods and extrusion plates will also be driven to descend.

[0006] Preferably, the fitting mechanism further comprises twelve spring return rods 1 slidably connected to the inner wall of the placement table, the twelve spring return rods 1 form a group of three three, the side walls of the four groups of spring return rods 1 are all fixedly connected to the side walls of the sliding block, and the inner walls of the four sliding blocks are all slidably connected to five connection blocks; Among them, copper blocks are fixedly connected to the side walls of the twenty connecting blocks, and spring reset rods 2 are fixedly connected to the side walls of the twenty connecting blocks. As the push plate continues to descend, the extrusion rod will first contact the spring reset rod 1. Since the contact surfaces of the spring reset rod 1 and the extrusion rod are both inclined surfaces, the extrusion rod will squeeze the spring reset rod 1, so that the spring reset rod 1 moves toward the chip direction, driving the sliding block and the connecting block to move, and driving the copper block to move through the connecting block, so that the copper block contacts the outer wall of the probe on the descending probe table. At this time, the copper block will be squeezed, driving the connecting block to squeeze the spring reset rod 2, so that the spring reset rod 2 accumulates rebound force, and the copper block is fit to the outer wall of the chip through the rebound force of the spring reset rod 2.

[0007] Preferably, the fitting mechanism also includes five spring extrusion plates slidably connected to the inner wall of the sliding block, the tops of the twenty connecting blocks are slidably connected with spring return rods three, the outer walls of the twenty spring return rods three are slidably connected to the inner wall of the sliding block, and the outer walls of the twenty spring return rods two are slidably connected to the inner wall of the sliding block. At this time, the inclined surface of the spring return rod one will separate from the inclined surface of the extrusion rod, so that the sliding block stops moving, and at the same time, the extrusion plate one will contact the spring extrusion plate, pushing the spring extrusion plate down, squeezing the spring return rod three, and pushing the connecting block down through the spring return rod three, driving the copper block to descend and contact the pins of the chip, and at the same time, the probe of the probe station will also contact the pins of the chip. Figure 7 As shown, by fitting the copper block with the outer wall of the probe on the probe station and at the same time fitting the copper block with the pins of the chip, when the chip is tested, the current signal of the probe station can be transmitted to the chip through the copper block, thereby increasing the contact area of ​​the probe station, ensuring full contact between the probe station and the pins of the chip, and improving the accuracy of chip testing.

[0008] Preferably, the pre-pressing mechanism also includes five fixed frames one fixedly connected to the side wall of the sliding block, the outer walls of the twenty fixed frames one are rotatably connected to the inner wall of the rotating frame, eighty spring rods are grouped in twos, the bottoms of the forty groups of spring rods are fixedly connected to the extrusion plate two, and the side walls of the forty arc-shaped plates are fixedly connected to the arc springs, and the force of the movement of the connecting block is used to drive the rotating frame to move when the connecting block descends, so that the rotating frame rotates on the outer wall of the fixed frame one, driving the arc plate and the extrusion plate two to rotate around the center of the fixed frame one, and the fixed frame one is the center of rotation, and the position of the extrusion plate two The farther the distance from the center is, the greater the displacement amplitude of the second extrusion plate will be. Therefore, when the rotating frame rotates, the movement amplitude of the second extrusion plate will be greater, so that the end of the second extrusion plate close to the chip will contact the copper block. At this time, the second extrusion plate is in an inclined state, so that the spring rod is also in an inclined state. With the continuous rotation of the rotating frame, the spring rod will slide in the arc plate, so that the second extrusion plate will slowly become parallel to the copper block, pushing the arc plate to rotate and squeezing the arc spring. With the rotation of the arc plate, the spring rod will be squeezed, and the second extrusion plate will be squeezed through the spring rod, so that the second extrusion plate squeezes the copper block.

[0009] Preferably, the pressing mechanism also includes a sliding groove provided on the inner wall of the sliding block, the inner wall bottoms of the twenty sliding grooves are fixedly connected to two fixed blocks, the inner walls of the forty fixed blocks are slidably connected to the outer wall of the spring push rod, the inner wall bottoms of the twenty sliding grooves are fixedly connected to two fixed frames two, and the outer walls of the forty fixed frames two are rotatably connected with a spring arc block, and the force of the movement of the rotating frame is utilized, since the top of the spring sliding plate is also far away from the center of the rotating frame, when the rotating frame rotates, it will push the spring sliding plate down, driving the concave-convex plate to move down, and when the concave position of the concave-convex plate moves to the convex position, the concave-convex plate will push the spring push rod to move, so that the spring push rod and the spring arc block contact, push one end of the spring arc block to move, so that the spring arc block rotates, so that the side of the spring arc block close to the copper block contacts the bottom of the copper block, and supports the part of the copper block that is not in contact with the chip pin.

[0010] Preferably, the pressing mechanism also includes a fixed frame fixedly connected to the inner wall of the sliding groove, the inner walls of the twenty fixed frames are slidably connected with extrusion plates three, the side walls of the twenty extrusion plates three are fixedly connected with fixed plates, the inner walls of the twenty fixed plates are fixedly connected to the outer wall of the spring push rod, and the side walls of the twenty fixed frames are connected with three injection pipes through them. The force of the spring push rod moving, when the spring push rod pushes the spring arc block to rotate, it will also drive the fixed plate to move toward the chip direction. When the fixed plate moves, it will drive the extrusion plate three to move. By moving the extrusion plate three, the gas in the fixed frame can be pushed.

[0011] A method for using a semiconductor packaging test device comprises the following steps: S1: Increase the contact area of ​​the probe; S2: pre-compressed copper block; S3: Support copper block.

[0012] The present invention has the following beneficial effects: (1) When the present invention is used, the staff places the chip in the groove of the placement table, and then starts the electric telescopic rod to extend, driving the push plate to descend, allowing the probe table to descend and contact the pins of the chip. During the descent of the push plate, the extrusion rod and the extrusion plate 1 will also be driven to descend. As the push plate continues to descend, the extrusion rod will first contact the spring reset rod 1. Since the contact surfaces of the spring reset rod 1 and the extrusion rod are both inclined surfaces, the extrusion rod will squeeze the spring reset rod 1, allowing the spring reset rod 1 to move toward the chip, driving the sliding block and the connecting block to move, and driving the copper block to move through the connecting block, allowing the copper block to contact the descending The outer wall of the probe on the probe station is in contact with the copper block. At this time, the copper block will be squeezed, driving the connecting block to squeeze the spring reset rod 2, allowing the spring reset rod 2 to accumulate rebound force, and the rebound force of the spring reset rod 2 makes the copper block fit with the outer wall of the chip. At this time, the inclined surface of the spring reset rod 1 will separate from the inclined surface of the squeezing rod, causing the sliding block to stop moving. At the same time, the squeezing plate 1 will contact the spring squeezing plate, pushing the spring squeezing plate down, squeezing the spring reset rod 3, and pushing the connecting block down through the spring reset rod 3, driving the copper block to drop and contact the pins of the chip. At the same time, the probe of the probe station will also contact the pins of the chip. Figure 7 As shown, by fitting the copper block with the outer wall of the probe on the probe station and at the same time fitting the copper block with the pins of the chip, when the chip is tested, the current signal of the probe station can be transmitted to the chip through the copper block, thereby increasing the contact area of ​​the probe station, ensuring full contact between the probe station and the pins of the chip, and improving the accuracy of chip testing.

[0013] (2) The present invention utilizes the force of the connection block moving. When the connection block descends, it also drives the rotating frame to move, so that the rotating frame rotates on the outer wall of the fixed frame 1, driving the arc plate and the extrusion plate 2 to rotate around the center of the fixed frame 1. The fixed frame 1 is the center of rotation. The farther the position of the extrusion plate 2 is from this center, the greater the displacement amplitude of the extrusion plate 2 will be. From the perspective of the rotation radius, when the extrusion plate 2 is farther away from the center of the fixed frame 1, the farthest point on the extrusion plate, that is, the point farthest from the center, moves along the circle. The arc length is greater, that is, the most The displacement amplitude or movement amplitude of the far point is larger, so when the rotating frame rotates, the movement amplitude of the second extrusion plate is also larger, so that the end of the second extrusion plate close to the chip contacts the copper block. At this time, the second extrusion plate is in an inclined state, so that the spring rod is also in an inclined state. As the rotating frame continues to rotate, the spring rod will slide in the arc plate, so that the second extrusion plate is slowly parallel to the copper block, pushing the arc plate to rotate and squeezing the arc spring. As the arc plate rotates, it will squeeze the spring rod, and squeeze the second extrusion plate through the spring rod, so that the second extrusion plate squeezes the copper block. Figure 7 As shown, the copper block is pre-pressed so that the contact surface between the copper block and the pin can maintain a good degree of tightness, effectively preventing the copper block from being in insufficient contact with the pin, which may cause attenuation or error in electrical signal transmission.

[0014] (3) The present invention utilizes the force of the rotating frame moving. Since the top of the spring sliding plate is also far away from the center of the rotating frame, when the rotating frame rotates, it will push the spring sliding plate down, driving the concave-convex plate to move down. When the concave position of the concave-convex plate moves to the convex position, the concave-convex plate will push the spring push rod to move, allowing the spring push rod to contact the spring arc block, pushing one end of the spring arc block to move, allowing the spring arc block to rotate, allowing the side of the spring arc block close to the copper block to contact the bottom of the copper block, supporting the part of the copper block that is not in contact with the chip pins, which can help disperse the pressure applied to the top of the copper block and effectively prevent the top of the copper block from being squeezed, which may cause some areas of the copper block to fit too closely with the chip pins, resulting in poor contact and affecting the transmission of electrical signals.

[0015] (4) The present invention utilizes the force of the spring push rod to move. When the spring push rod pushes the spring arc block to rotate, it also drives the fixed plate to move toward the chip. When the fixed plate moves, it drives the extrusion plate three to move. By moving the extrusion plate three, the gas in the fixed frame can be pushed. The pushed gas will be ejected toward the bottom of the copper block through the jet pipe. The ejected airflow can help blow away impurities on the surface of the copper block, thereby keeping the contact surface between the copper block and the chip pin clean, which helps to improve the contact quality between the copper block and the chip pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0017] Figure 1 It is a schematic cross-sectional view of the overall structure of the present invention; Figure 2 It is a schematic diagram of the overall structure of the present invention; Figure 3 It is a cross-sectional schematic diagram of a placement table of the present invention; Figure 4 For the present invention Figure 3 A is an enlarged schematic diagram; Figure 5 It is a cross-sectional schematic diagram of the sliding block of the present invention; Figure 6 For the present invention Figure 5 A magnified schematic diagram of B; Figure 7 This is a schematic diagram of the working process of the extruded plate 2 of the present invention; Figure 8 It is a cross-sectional schematic diagram of the connection block of the present invention; Fig. 9 For the present invention Figure 8 A magnified schematic diagram of middle C; Fig.10 It is a schematic diagram of the working process of the present invention.

[0018] In the accompanying drawings, the components represented by the reference numerals are listed as follows: In the figure: 1. Laminating mechanism; 101. Placing table; 102. Pushing plate; 103. Fixing rod; 104. Electric telescopic rod; 105. Sliding block; 106. Probe station; 107. Chip; 108. Extrusion rod; 109. Extrusion plate 1; 110. Spring return rod 1; 111. Connecting block; 112. Copper block; 113. Spring return rod 2; 114. Spring extrusion plate; 115. Spring return rod 3; 2. Pre-pressing mechanism; 20 1. Rotating frame; 202. Arc plate; 203. Spring rod; 204. Fixed frame one; 205. Extrusion plate two; 206. Arc spring; 207. Sliding groove; 3. Pressing mechanism; 301. Spring sliding plate; 302. Concave-convex plate; 303. Spring push rod; 304. Fixed block; 305. Fixed frame two; 306. Spring arc block; 307. Fixed frame; 308. Fixed plate; 309. Extrusion plate three; 310. Jet pipe. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] For example, see Figure 1 - Figure 4 The present invention is a semiconductor packaging test device, comprising a bonding mechanism 1, the bonding mechanism 1 also comprises a placement table 101, a push plate 102 is arranged on the top of the placement table 101, four fixed rods 103 are fixedly connected to the top of the placement table 101, and the inner wall of the push plate 102 is slidably connected to the outer wall of the fixed rod 103; The pre-pressing mechanism 2 includes twenty rotating racks 201 arranged on the inner wall of the placing table 101, the outer walls of the twenty rotating racks 201 are rotatably connected to two arc-shaped plates 202, and the inner walls of the forty arc-shaped plates 202 are slidably connected to two spring rods 203; The pressing mechanism 3 includes a spring sliding plate 301 in contact with the bottom of the rotating frame 201, the bottoms of the twenty spring sliding plates 301 are fixedly connected with two concave-convex plates 302, and the side walls of the forty concave-convex plates 302 are slidably connected with spring push rods 303.

[0021] The laminating mechanism 1 also includes an electric telescopic rod 104 fixedly connected to the top of the fixed rod 103, the bottom output end of the electric telescopic rod 104 is fixedly connected to the top of the push plate 102, four sliding blocks 105 are slidably connected to the inner wall of the placement table 101, and a probe table 106 is fixedly connected to the bottom of the push plate 102; Among them, a chip 107 is placed on the inner wall of the placement table 101, twelve squeezing rods 108 are fixedly connected to the bottom of the pushing plate 102, and four squeezing plates 109 are fixedly connected to the bottom of the pushing plate 102. The staff places the chip 107 in the groove of the placement table 101, and then starts the electric telescopic rod 104 to extend, driving the pushing plate 102 to descend, allowing the probe station 106 to descend and contact the pins of the chip 107. During the descending process of the pushing plate 102, the squeezing rods 108 and the squeezing plate 109 will also be driven to descend.

[0022] The laminating mechanism 1 further includes twelve spring return rods 110 slidably connected to the inner wall of the placement table 101, the twelve spring return rods 110 are arranged in groups of three, the side walls of the four groups of spring return rods 110 are fixedly connected to the side walls of the sliding block 105, and the inner walls of the four sliding blocks 105 are slidably connected to five connection blocks 111; Among them, the side walls of the twenty connecting blocks 111 are fixedly connected with copper blocks 112, and the side walls of the twenty connecting blocks 111 are fixedly connected with spring return rods 113. As the pushing plate 102 continues to descend, the squeezing rod 108 will first contact the spring return rod 110. Since the contact surfaces of the spring return rod 110 and the squeezing rod 108 are both inclined surfaces, the squeezing rod 108 will squeeze the spring return rod 110, so that the spring return rod 110 moves toward the chip 107, driving the sliding block 105 and the connecting block 111 to move, and driving the copper block 112 to move through the connecting block 111, so that the copper block 112 contacts the outer wall of the probe on the descending probe station 106. At this time, the copper block 112 will be squeezed, driving the connecting block 111 to squeeze the spring return rod 113, so that the spring return rod 113 accumulates rebound force, and the copper block 112 is fitted with the outer wall of the chip 107 through the rebound force of the spring return rod 113.

[0023] The fitting mechanism 1 also includes five spring extrusion plates 114 slidably connected to the inner wall of the sliding block 105, and the tops of the twenty connecting blocks 111 are all slidably connected with spring return rods 3 115. The outer walls of the twenty spring return rods 3 115 are all slidably connected to the inner wall of the sliding block 105, and the outer walls of the twenty spring return rods 2 113 are all slidably connected to the inner wall of the sliding block 105. At this time, the inclined surface of the spring return rod 110 will separate from the inclined surface of the extrusion rod 108, so that the sliding block 105 stops moving. At the same time, the extrusion plate 109 will contact the spring extrusion plate 114, push the spring extrusion plate 114 down, squeeze the spring return rod 3 115, and push the connecting block 111 down through the spring return rod 3 115, drive the copper block 112 to descend and contact the pins of the chip 107, and at the same time, the probe of the probe station 106 will also contact the pins of the chip. Figure 7 As shown, by fitting the copper block 112 with the outer wall of the probe on the probe station 106 and at the same time fitting the copper block 112 with the pins of the chip 107, when the chip 107 is detected, the current signal of the probe station 106 can be transmitted to the chip 107 through the copper block 112, thereby increasing the contact area of ​​the probe station 106, ensuring that the probe station 106 is in full contact with the pins of the chip 107, and improving the accuracy of the detection of the chip 107.

[0024] For example 2, please refer to Figure 5 - Fig.10The present invention is a semiconductor packaging test device. On the basis of the first embodiment, the pre-pressing mechanism 2 also includes five fixed frames 204 fixedly connected to the side walls of the sliding block 105. The outer walls of the twenty fixed frames 204 are rotatably connected to the inner wall of the rotating frame 201. Eighty spring rods 203 are arranged in groups of two. The bottoms of the forty groups of spring rods 203 are fixedly connected to the second extrusion plate 205. The side walls of the forty arc-shaped plates 202 are fixedly connected to the arc springs 206. The force of the connection block 111 moving will drive the rotating frame 201 to move when the connection block 111 descends, so that the rotating frame 201 rotates on the outer wall of the fixed frame 204, driving the arc plate 202 and the second extrusion plate 205 to rotate around the center of the fixed frame 204. The fixed frame 204 is the center of rotation. The farther the position of the second pressing plate 205 is from the center, the greater the displacement amplitude of the second extrusion plate 205 will be. Therefore, when the rotating frame 201 rotates, the movement amplitude of the second extrusion plate 205 will be greater, so that the end of the second extrusion plate 205 close to the chip 107 is in contact with the copper block 112. At this time, the second extrusion plate 205 is in an inclined state, so that the spring rod 203 is also in an inclined state. As the rotating frame 201 continues to rotate, the spring rod 203 will slide in the arc plate 202, allowing the second extrusion plate 205 to slowly become parallel to the copper block 112, pushing the arc plate 202 to rotate and squeezing the arc spring 206. As the arc plate 202 rotates, the spring rod 203 will be squeezed, and the extrusion plate 205 will be squeezed through the spring rod 203, so that the extrusion plate 205 squeezes the copper block 112.

[0025] The pressing mechanism 3 also includes a sliding groove 207 opened on the inner wall of the sliding block 105, the inner wall bottoms of the twenty sliding grooves 207 are fixedly connected to two fixed blocks 304, the inner walls of the forty fixed blocks 304 are slidably connected to the outer wall of the spring push rod 303, the inner wall bottoms of the twenty sliding grooves 207 are fixedly connected to two fixed frames 305, the outer walls of the forty fixed frames 305 are rotatably connected to the spring arc blocks 306, and the force of the rotating frame 201 is used to move the spring sliding plate 301. Since the top of the spring sliding plate 301 is at a distance from the center of the rotating frame 201, the spring arc blocks 306 are rotatably connected to the outer wall of the forty fixed frames 305. When the rotating frame 201 rotates, it will push the spring sliding plate 301 down, driving the concave-convex plate 302 to move down. When the concave position of the concave-convex plate 302 moves to the convex position, the concave-convex plate 302 will push the spring push rod 303 to move, allowing the spring push rod 303 to contact the spring arc block 306, pushing one end of the spring arc block 306 to move, allowing the spring arc block 306 to rotate, allowing the side of the spring arc block 306 close to the copper block 112 to contact the bottom of the copper block 112, and supporting the part of the copper block 112 that is not in contact with the pins of the chip 107.

[0026] The pressing mechanism 3 also includes a fixed frame 307 fixedly connected to the inner wall of the sliding groove 207, and the inner walls of the twenty fixed frames 307 are slidably connected with the extrusion plates 309, and the side walls of the twenty extrusion plates 309 are fixedly connected with the fixed plates 308. The inner walls of the twenty fixed plates 308 are fixedly connected to the outer wall of the spring push rod 303, and the side walls of the twenty fixed frames 307 are connected with three injection pipes 310. By utilizing the force of the spring push rod 303, when the spring push rod 303 pushes the spring arc block 306 to rotate, it will also drive the fixed plate 308 to move toward the chip 107. When the fixed plate 308 moves, it will drive the extrusion plate 309 to move. By moving the extrusion plate 309, the gas in the fixed frame 307 can be pushed.

[0027] There is no limitation on the number of the above components, and relevant technicians in the field can freely set them according to actual needs, as long as the above components are installed at the connection positions of the corresponding components.

[0028] The method for using the semiconductor packaging test device comprises the following steps: S1: Increase the contact area of ​​the probe; S2: pre-pressing the copper block 112; S3: Supporting copper block 112 .

[0029] A specific application of this embodiment is as follows: when the present invention is used, the staff places the chip 107 in the groove of the placement table 101, and then starts the electric telescopic rod 104 to extend, driving the push plate 102 to descend, allowing the probe table 106 to descend and contact the pins of the chip 107. During the descent of the push plate 102, the squeezing rod 108 and the squeezing plate 109 are also driven to descend. As the push plate 102 continues to descend, the squeezing rod 108 will first contact the spring reset rod 110. Since the contact surfaces of the spring reset rod 110 and the squeezing rod 108 are both inclined surfaces, the squeezing rod 108 will squeeze the spring reset rod 110, allowing the spring reset rod 110 to move toward the chip 107, driving the sliding block 105 and the connecting block 111 to move, and driving the copper block 112 to move through the connecting block 111. , so that the copper block 112 contacts the outer wall of the probe on the descending probe station 106. At this time, the copper block 112 will be squeezed, driving the connecting block 111 to squeeze the spring reset rod 2 113, allowing the spring reset rod 2 113 to accumulate resilience, and the resilience of the spring reset rod 2 113 makes the copper block 112 fit with the outer wall of the chip 107. At this time, the inclined surface of the spring reset rod 110 will separate from the inclined surface of the squeezing rod 108, so that the sliding block 105 stops moving, and at the same time, the squeezing plate 109 will contact the spring squeezing plate 114, pushing the spring squeezing plate 114 down, squeezing the spring reset rod 3 115, and pushing the connecting block 111 down through the spring reset rod 3 115, driving the copper block 112 to descend and contact the pins of the chip 107. At the same time, the probe of the probe station 106 will also contact the pins of the chip. Figure 7 As shown, by fitting the copper block 112 to the outer wall of the probe on the probe station 106, and at the same time, fitting the copper block 112 to the pins of the chip 107, when the chip 107 is detected, the current signal of the probe station 106 can be transmitted to the chip 107 through the copper block 112, thereby increasing the contact area of ​​the probe station 106, ensuring that the probe station 106 is in full contact with the pins of the chip 107, and improving the accuracy of the detection of the chip 107; Secondly, when the connecting block 111 descends, it will also drive the rotating frame 201 to move, so that the rotating frame 201 rotates on the outer wall of the fixed frame 1 204, and drives the arc plate 202 and the second extrusion plate 205 to rotate around the center of the fixed frame 1 204. The fixed frame 1 204 is the center of rotation. The farther the position of the second extrusion plate 205 is relative to this center, the greater the displacement amplitude of the second extrusion plate 205 will be. From the perspective of the rotation radius: when the extrusion plate 205 is farther away from the center of the fixed frame 1 204, the farthest point on the extrusion plate, that is, the point farthest from the center, moves along the circle. The arc length is greater, that is, the displacement amplitude or the movement amplitude of the farthest point is greater, so When the rotating frame 201 rotates, the movement amplitude of the second extrusion plate 205 is larger, so that the end of the second extrusion plate 205 close to the chip 107 contacts the copper block 112. At this time, the second extrusion plate 205 is in an inclined state, so that the spring rod 203 is also in an inclined state. As the rotating frame 201 continues to rotate, the spring rod 203 will slide in the arc plate 202, so that the second extrusion plate 205 is slowly parallel to the copper block 112, pushing the arc plate 202 to rotate and squeezing the arc spring 206. As the arc plate 202 rotates, the spring rod 203 will be squeezed, and the extrusion plate 205 will be squeezed by the spring rod 203, so that the extrusion plate 205 squeezes the copper block 112. Figure 7 As shown, the copper block 112 is pre-pressed, so that the contact surface between the copper block 112 and the pin can maintain a good tightness, effectively preventing the copper block 112 from being not in close contact with the pin, which may cause attenuation or error in the transmission of electrical signals; Secondly, since the top of the spring sliding plate 301 is also far away from the center of the rotating frame 201, when the rotating frame 201 rotates, it will push the spring sliding plate 301 to move down, driving the concave-convex plate 302 to move down. When the concave position of the concave-convex plate 302 moves to the convex position, the concave-convex plate 302 will push the spring push rod 303 to move, allowing the spring push rod 303 to contact the spring arc block 306, pushing one end of the spring arc block 306 to move, allowing the spring arc block 306 to rotate, allowing the side of the spring arc block 306 close to the copper block 112 to contact the bottom of the copper block 112, supporting the part of the copper block 112 that is not in contact with the pins of the chip 107, which can help disperse the pressure applied to the top of the copper block 112, and effectively prevent the top of the copper block 112 from being squeezed by the squeezing plate 205, which may cause a part of the copper block 112 to fit too closely with the pins of the chip 107; Secondly, when the spring push rod 303 pushes the spring arc block 306 to rotate, it will also drive the fixed plate 308 to move toward the chip 107. When the fixed plate 308 moves, it will drive the extrusion plate three 309 to move. By moving the extrusion plate three 309, the gas in the fixed frame 307 can be pushed. The pushed gas will be sprayed toward the bottom of the copper block 112 through the jet pipe 310. The ejected airflow can help blow away impurities on the surface of the copper block 112, thereby keeping the contact surface between the copper block 112 and the chip 107 pins clean, which helps to improve the contact quality between the copper block 112 and the chip 107 pins.

[0030] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor packaging test device, comprising a bonding mechanism (1), the bonding mechanism (1) further comprising a placement platform (101), a push plate (102) being arranged on the top of the placement platform (101), four fixed rods (103) being fixedly connected to the top of the placement platform (101), the inner wall of the push plate (102) being slidably connected to the outer wall of the fixed rod (103), characterized in that: Also includes: A pre-pressing mechanism (2), the pre-pressing mechanism (2) comprising twenty rotating frames (201) arranged on the inner wall of the placement table (101), the outer walls of the twenty rotating frames (201) being rotatably connected to two arc-shaped plates (202), and the inner walls of the forty arc-shaped plates (202) being slidably connected to two spring rods (203); A pressing mechanism (3), the pressing mechanism (3) comprising a spring sliding plate (301) in contact with the bottom of the rotating frame (201), the bottoms of twenty of the spring sliding plates (301) being fixedly connected to two concave-convex plates (302), and the side walls of forty of the concave-convex plates (302) being slidably connected to spring push rods (303).

2. A semiconductor packaging test device according to claim 1, characterized in that: The laminating mechanism (1) further comprises an electric telescopic rod (104) fixedly connected to the top of the fixed rod (103), the bottom output ends of the electric telescopic rod (104) are fixedly connected to the top of the pushing plate (102), four sliding blocks (105) are slidably connected to the inner wall of the placement table (101), and the bottom of the pushing plate (102) is fixedly connected to a probe table (106); A chip (107) is placed on the inner wall of the placement platform (101), twelve extrusion rods (108) are fixedly connected to the bottom of the push plate (102), and four extrusion plates (109) are fixedly connected to the bottom of the push plate (102).

3. A semiconductor packaging test device according to claim 2, characterized in that: The laminating mechanism (1) further comprises twelve spring return rods (110) slidably connected to the inner wall of the placement platform (101), the twelve spring return rods (110) being arranged in groups of three, the side walls of the four groups of spring return rods (110) being fixedly connected to the side walls of the sliding block (105), and the inner walls of the four sliding blocks (105) being slidably connected to five connection blocks (111); The side walls of the twenty connection blocks (111) are all fixedly connected with a copper block (112), and the side walls of the twenty connection blocks (111) are fixedly connected with a second spring return rod (113).

4. The semiconductor packaging test device according to claim 3, characterized in that: The fitting mechanism (1) further comprises five spring extrusion plates (114) slidably connected to the inner wall of the sliding block (105); the tops of the twenty connecting blocks (111) are slidably connected to spring return rods three (115); the outer walls of the twenty spring return rods three (115) are slidably connected to the inner wall of the sliding block (105); and the outer walls of the twenty spring return rods two (113) are slidably connected to the inner wall of the sliding block (105).

5. The semiconductor packaging test device according to claim 4, characterized in that: The pre-pressing mechanism (2) further comprises five fixed frames (204) fixedly connected to the side wall of the sliding block (105), the outer walls of twenty of the fixed frames (204) being rotatably connected to the inner wall of the rotating frame (201), eighty of the spring rods (203) being arranged in groups of two, the bottoms of forty groups of the spring rods (203) being fixedly connected to the extrusion plate (205), and the side walls of forty of the arc plates (202) being fixedly connected to the arc springs (206).

6. The semiconductor packaging test device according to claim 5, characterized in that: The pressing mechanism (3) further comprises a sliding groove (207) formed on the inner wall of the sliding block (105); the bottom of the inner wall of twenty of the sliding grooves (207) are fixedly connected to two fixed blocks (304); the inner walls of forty of the fixed blocks (304) are slidably connected to the outer wall of the spring push rod (303); the bottom of the inner wall of twenty of the sliding grooves (207) are fixedly connected to two fixed frames (305); the outer walls of forty of the fixed frames (305) are rotatably connected to spring arc blocks (306).

7. The semiconductor packaging test device according to claim 6, characterized in that: The pressing mechanism (3) further comprises a fixing frame (307) fixedly connected to the inner wall of the sliding groove (207), the inner walls of twenty fixing frames (307) being slidably connected to a squeezing plate three (309), the side walls of twenty squeezing plates three (309) being fixedly connected to a fixing plate (308), the inner walls of twenty fixing plates (308) being fixedly connected to the outer wall of the spring push rod (303), and the side walls of twenty fixing frames (307) being through-connected to three jet pipes (310).

8. A method for using a semiconductor packaging test device, using the semiconductor packaging test device as claimed in claim 7, characterized in that: The following steps are included: S1: Increase the contact area of ​​the probe; S2: pre-compressed copper block (112); S3: Supporting copper block (112).

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