Wafer film expanding and correcting mechanism

Abstract

The invention relates to the technical field of wafer processing, in particular to a wafer film expanding and correcting mechanism which comprises a base, an inner ring and an outer ring are arranged on the base, the outer ring is distributed on the outer side of the inner ring, a wafer is arranged on the outer ring, and the inner ring abuts against the lower end of a film area of the wafer; a driving module, a lifting module, a correcting module and a clutch module are arranged on the base; the driving gear and the driven gear which are in meshing transmission are arranged in the driving module for matched transmission, the constant power transmission ratio can be guaranteed, and therefore transmission is more stable, transmission efficiency is high, and work is reliable; a correction module is further arranged, the correction module can correct the distribution position of the crystal grains on the wafer in the film expansion state, the crystal grains can be conveniently taken out and mounted on the product, and the yield of the crystal mounting product is improved; the arrangement of the clutch module can separate the driving gear and the driven gear of the driving module when the crystal grain position needs to be corrected after the wafer film expansion, thereby improving the correction effect.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a wafer film expansion and correction mechanism. Background Art

[0002] The wafer production process involves processes such as film lamination, laser film cutting, film removal, mold inversion, and film expansion. In order to ensure that the grains of the wafer meet the inspection requirements, it is necessary to perform a grain removal operation. However, since there is no gap between adjacent core grains on the wafer, the adjacent core grains will have abnormal problems such as edge collapse and scratches during the grain removal process, which seriously affects the quality of the wafer and is not conducive to subsequent production needs. Therefore, it is necessary to perform a film expansion process on the wafer to increase the gap between the grains for easy grain removal.

[0003] The published Chinese patent, with publication number CN116190300A, discloses a wafer film expansion mechanism, including a support seat, an inner film expansion ring, an outer film expansion ring and a first transmission mechanism, wherein the inner film expansion ring, the outer film expansion ring and the first transmission mechanism are all arranged on the support seat, the outer film expansion ring is used to fix the wafer iron ring, the inner film expansion ring is used to support the wafer film, the first transmission mechanism drives the outer film expansion ring to move up and down, and the support seat is provided with a first limiting component that can form contact with the bottom of the outer film expansion ring.

[0004] However, on the actual production line, the grains on the wafer are not necessarily distributed in the positive direction. If the grains are skewed after the wafer is expanded, they will be skewed when the wafer is taken out and mounted on the product, resulting in defective products. The wafer expansion mechanism disclosed in the above patent does not have a grain correction function and cannot solve the problem of skewed grains after wafer expansion. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a wafer expansion and correction mechanism to solve the problem that the wafer expansion mechanism used in the prior art does not have a grain correction function.

[0006] To achieve the above-mentioned purpose and other related purposes, the present invention provides a wafer film expansion and correction mechanism, including a base, the base is provided with an inner ring and an outer ring, the outer ring is distributed outside the inner ring, the wafer is placed on the outer ring, and the inner ring contacts the lower end of the thin film area of ​​the wafer; The base is provided with a driving module, a lifting module, a correction module and a clutch module; The driving module comprises: a driving motor; a driving gear mounted on the output end of the driving motor; a driven gear meshing with the driving gear, the driven gear being rotatably mounted on the base through a bracket, and a synchronous rotating wheel being mounted on the lower end of the driven gear; a plurality of first driven rotating wheels driving in coordination with the synchronous rotating wheel, the plurality of first driven rotating wheels being distributed below the outer side of the outer ring; and a first transmission belt being sleeved on the synchronous rotating wheel and the plurality of first driven rotating wheels; The lifting module comprises: a nut seat, the nut seat is installed in the first driven rotating wheel; a stud threadedly connected to the nut seat; a pressure block connected to the upper end of the stud, the pressure block is embedded in the outer ring; The correction module includes: a correction motor; a driving wheel sleeved on the output end of the correction motor; a second driven wheel that cooperates with the driving wheel for transmission, and the second driven wheel is rotatably assembled on the base; a second transmission belt that is sleeved on the driving wheel and the second driven wheel at the same time; a support seat provided at the upper end of the second driven wheel, and the inner ring, outer ring, and driven gear are all installed on the support seat; a tensioning wheel and a centering wheel are provided on the base, the tensioning wheel is rotatably engaged with the inner end of the second transmission belt, and the centering wheel is rotatably engaged with the outer end of the second transmission belt; a plurality of pin holes are provided on the second driven wheel, and the support seat is detachably mounted on the second driven wheel through a pin shaft; The clutch module includes: a clutch cylinder; a slide rail; a slider slidably fitted on the slide rail; a motor base mounted on the upper end of the slider and connected to the output end of the clutch cylinder, and the drive motor is mounted on the motor base; the clutch cylinder drives the motor base to move, driving the drive motor and the driving gear mounted on the motor base to move so as to separate and aggregate relative to the driven gear.

[0007] In one embodiment of the present invention, the upper end of the outer ring is also equipped with a cover plate, and there is a feed port between the outer ring and the cover plate; an anti-mistake column is provided at the upper end of the outer ring on the side opposite to the feed port for positioning the introduction direction of the wafer.

[0008] In one embodiment of the present invention, a wafer detector and a pair of positioning bars that match each other are further provided at the upper end of the outer ring. The wafer detector is used to determine whether the wafer is introduced, and the pair of positioning bars are used to locate the outer edges of both sides of the wafer.

[0009] In one embodiment of the present invention, an origin angle detector is disposed on the base for detecting the initial origin position of the outer ring.

[0010] In one embodiment of the present invention, the number of the first driven wheels is greater than the number of the lifting modules, and at least four groups of lifting modules are provided, and the plurality of groups of lifting modules are arranged at the lower end of the outer side of the outer ring.

[0011] In one embodiment of the present invention, a buffer column is provided at the upper end of the support seat, and the buffer column corresponds to the lower end of the cover plate, and is used to buffer the lifting and lowering collision impact of the outer ring.

[0012] In one embodiment of the present invention, a film expansion positioning block is provided on the motor seat, and the film expansion positioning block meshes with the upper end of the bracket assembled with the driven gear to fix the meshing cooperation between the driving gear and the driven gear during the film expansion process.

[0013] In one embodiment of the present invention, a protective cover is provided at the upper end of the base, and the protective cover protects the upper ends of the driving gear and the driven gear.

[0014] As described above, the wafer expansion and correction mechanism of the present invention has the following beneficial effects: Compared with the prior art, the present invention sets an active gear and a driven gear of meshing transmission in the driving module to cooperate with the transmission, which can ensure a constant power transmission ratio, so the transmission is smoother, the transmission efficiency is high, and the operation is reliable; the present invention also sets a correction module, the correction module provides driving force through the correction motor, and the active rotor, the second driven rotor, and the second transmission belt cooperate to drive the support seat to rotate, so as to adjust the angular position of the inner ring and the outer ring located at the upper end of the support seat, and then correct the distribution position of the grains on the wafer in the film expansion state, which is convenient for taking the grains and mounting them on the products, and improves the yield rate of the mounted products; by setting a clutch module, the clutch module can separate the active gear and the driven gear of the driving module when the grain position needs to be corrected after the wafer film expansion, and there is no need to drive the driving motor to act synchronously during the correction process, thereby avoiding misoperation of the film expansion action during the correction process and reducing the correction load, thereby improving the correction effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Shown is a schematic diagram of the overall structure of the wafer expansion and correction mechanism disclosed in the present invention.

[0016] Figure 2 Shown is a schematic diagram of the exploded structure of the wafer expansion and correction mechanism disclosed in the present invention.

[0017] Figure 3 It shows an enlarged schematic diagram of the local structure of the cooperation between the driving gear and the driven gear in the wafer expansion and correction mechanism disclosed in the present invention.

[0018] Component number description Base 1; inner ring 2; wafer a; Outer ring 3; feeding port 31; foolproof column 32; wafer detector 33; positioning bar 34; Driving module 4; driving motor 41; driving gear 42; driven gear 43; synchronous rotating wheel 44; first driven rotating wheel 45; first transmission belt 46; Lifting module 5; nut seat 51; stud 52; pressing block 53; Correction module 6; correction motor 61; driving wheel 62; second driven wheel 63; second transmission belt 64; support seat 65; buffer column 66; Clutch module 7; clutch cylinder 71; slide rail 72; slider 73; motor seat 74; Cover plate 8; origin angle detector 9; tension wheel 10; centering wheel 11; film expansion positioning block 12; protective cover shell 13. DETAILED DESCRIPTION

[0019] The following is a description of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0020] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0021] See also Figure 1-Figure 3 The present invention provides a wafer film expansion and correction mechanism, including a base 1, on which an inner ring 2 and an outer ring 3 are arranged, the outer ring 3 is distributed on the outside of the inner ring 2, the wafer a is placed on the outer ring 3, and the inner ring 2 is in contact with the lower end of the film area of ​​the wafer a; the base 1 is provided with a driving module 4, a lifting module 5, a correction module 6, and a clutch module 7. The base 1 is provided with an origin angle detector 9 for detecting the initial origin position of the outer ring 3 so that the outer ring 3 can be reset after correction and adjustment; the base 1 is provided with a tensioning wheel 10 and a centering wheel 11, and the upper end of the base 1 is provided with a protective cover shell 13.

[0022] The upper end of the outer ring 3 is also equipped with a cover plate 8, and there is a feed port 31 between the outer ring 3 and the cover plate 8; an anti-fool column 32 is provided at the upper end of the outer ring 3 on the side opposite to the feed port 31, which is used to locate the introduction direction of wafer a; the upper end of the outer ring 3 is also provided with a wafer a detector 33 and a pair of relatively matched positioning bars 34, the wafer a detector 33 is used to determine whether wafer a is introduced, and the pair of positioning bars 34 are used to locate the outer edges on both sides of wafer a; the anti-fool column 32 and the positioning bar 34 can locate the introduction position of wafer a.

[0023] The driving module 4 includes a driving motor 41, a driving gear 42 installed at the output end of the driving motor 41, a driven gear 43 meshingly connected to the driving gear 42, a synchronous wheel 44 installed at the lower end of the driven gear 43, a plurality of first driven wheels 45 that cooperate with the synchronous wheel 44 for transmission, and a first transmission belt 46 that is simultaneously sleeved on the synchronous wheel 44 and the plurality of first driven wheels 45. The driven gear 43 is rotatably mounted on the base 1 through a bracket, and the plurality of first driven wheels 45 are distributed below the outer side of the outer ring 3; the protective cover shell 13 protects the upper ends of the driving gear 42 and the driven gear 43. The lifting module 5 includes a nut seat 51, a stud 52 threadedly connected to the nut seat 51, and a pressure block 53 connected to the upper end of the stud 52. The nut seat 51 is installed in the first driven wheel 45, and the pressure block 53 is embedded in the outer ring 3. The number of the first driven wheels 45 is greater than the number of lifting modules 5. The lifting modules 5 are at least four groups, and the multiple lifting modules 5 are arranged at the lower end of the outer side of the outer ring 3. The driving module 4 provides driving force through the driving motor 41, and the driving gear 42 is meshed with the driven gear 3 to drive the synchronous wheel 44, a plurality of first driven wheels 45, and the first transmission belt 46 to transmit driving force, driving the nut seat 51 installed on the first driven wheel 45 to rotate, so that the stud 52 threadedly matched with the nut seat 51 moves up and down, driving the outer ring 3 to lift and expand the film. Compared with the prior art, the present invention sets the driving gear 42 and the driven gear 43 of meshing transmission in the driving module 4 to cooperate with each other, which can ensure a constant power transmission ratio, so the transmission is more stable, the transmission efficiency is high, and the work is reliable.

[0024] The correction module 6 includes a correction motor 61, a driving wheel 62 sleeved on the output end of the correction motor 61, a second driven wheel 63 that cooperates with the driving wheel 62 for transmission, a second transmission belt 64 sleeved on the driving wheel 62 and the second driven wheel 63 at the same time, and a support seat 65 arranged at the upper end of the second driven wheel 63. The second driven wheel 63 is rotatably assembled on the base 1, and the inner ring 2, the outer ring 3, and the driven gear 43 are all installed on the support seat 65; a buffer column 66 is provided at the upper end of the support seat 65, and the buffer column 66 corresponds to the lower end of the cover plate 8, which is used to buffer the lifting and lowering collision impact of the outer ring 3. The tensioning wheel 10 is rotatably engaged with the inner end of the second transmission belt 64, and the centering wheel 11 is rotatably engaged with the outer end of the second transmission belt 64, so as to improve the transmission reliability of the second transmission belt 64; in actual use, a CCD camera is provided above the mechanism, and the distribution angle of the grains on the wafer a is detected by photographing with the CCD camera. If the distribution of the grains is skewed, the correction module 6 provides driving force through the correction motor 61, and the active rotating wheel 62, the second driven rotating wheel 63, and the second transmission belt 64 cooperate to drive the support seat 65 to rotate, so as to adjust the angular position of the inner ring 2 and the outer ring 3 located at the upper end of the support seat 65, and then correct the distribution position of the grains on the wafer a in the expanded film state, so as to facilitate the removal of the grains and install them on the products, thereby improving the yield rate of the installed grain products.

[0025] The second driven rotating wheel 63 is provided with a plurality of pin holes, and the support seat 65 is detachably mounted on the second driven rotating wheel 63 via a pin shaft, so that the support seat 65 is easily replaced, and the sizes of the inner ring and the outer ring are easily replaced.

[0026] The clutch module 7 includes a clutch cylinder 71, a slide rail 72, a slider 73 slidingly fitted on the slide rail 72, and a motor seat 74 mounted on the upper end of the slider 73 and connected to the output end of the clutch cylinder 71, and the drive motor 41 is mounted on the motor seat 74; the motor seat 74 is driven by the clutch cylinder 71 to move, driving the drive motor 41 and the active gear 42 mounted on the motor seat 74 to move so as to separate and aggregate relative to the driven gear 43; a film expansion positioning block 12 is provided on the motor seat 74, and the film expansion positioning block 12 is engaged with the upper end of the bracket on which the driven gear 43 is assembled, and the engagement of the active gear 42 and the driven gear 43 is fixed during the film expansion process to prevent the outer ring 3 from rotating; the setting of the clutch module 7 can separate the active gear 42 and the driven gear 43 of the drive module 4 when the grain position needs to be corrected after the wafer a is expanded, and there is no need to drive the drive motor 41 to move synchronously during the correction process, thereby avoiding erroneous operation of the film expansion action during the correction process and reducing the correction load, thereby improving the correction effect.

[0027] The steps of wafer a expansion and correction are as follows: 1) Introducing wafer a into between the outer ring 3 and the cover plate 8 through the feed port 31; 2) The driving module 4 is in motion, and the driving motor 41 provides driving force. The driving gear 42 is meshed with the driven gear 3 to drive the synchronous rotating wheel 44, a plurality of first driven rotating wheels 45, and the first driving belt 46 to transmit driving force, and the nut seat 51 installed on the first driven rotating wheel 45 is driven to rotate, so that the stud 52 whose thread matches the nut seat 51 moves up and down, and drives the outer ring 3 to rise and fall and expand the film; 3) After the film expansion is completed, the clutch module 7 is activated to separate the driving gear 42 and the driven gear 43 of the driving module 4 to maintain the film expansion action; 4) The CCD camera on the production line detects the distribution angle of the grains on the wafer a. If the distribution of the grains is skewed, the correction module 6 is activated, and the driving force is provided by the correction motor 61. The active rotating wheel 62, the second driven rotating wheel 63, and the second transmission belt 64 cooperate to drive the support seat 65 to rotate, so as to adjust the angle position of the inner ring 2 and the outer ring 3 located at the upper end of the support seat 65, and then correct the distribution position of the grains on the wafer a in the expanded film state, so as to facilitate the removal of the grains and install them on the product.

[0028] In summary, the present invention sets a meshing driving gear 42 and a driven gear 43 in the driving module 4 for coordinated transmission, which can ensure a constant power transmission ratio, so the transmission is more stable, the transmission efficiency is high, and the operation is reliable; the present invention also sets a correction module 6, which can correct the distribution position of the grains on the wafer a in the film expansion state, facilitate crystal retrieval and installation on the product, and improve the yield rate of the installed crystal products; the setting of the clutch module 7 can separate the driving gear 42 and the driven gear 43 of the driving module 4 when the grain position needs to be corrected after the wafer a is expanded, thereby improving the correction effect.

[0029] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer film expansion and correction mechanism, comprising a base, the base is provided with an inner ring and an outer ring, the outer ring is distributed outside the inner ring, the wafer is placed on the outer ring, and the inner ring abuts against the lower end of the film area of ​​the wafer; Features: The base is provided with a driving module, a lifting module, a correction module and a clutch module; The driving module comprises: a driving motor; a driving gear mounted on the output end of the driving motor; a driven gear meshing with the driving gear, the driven gear being rotatably mounted on the base through a bracket, and a synchronous rotating wheel being mounted on the lower end of the driven gear; a plurality of first driven rotating wheels driving in coordination with the synchronous rotating wheel, the plurality of first driven rotating wheels being distributed below the outer side of the outer ring; and a first transmission belt being sleeved on the synchronous rotating wheel and the plurality of first driven rotating wheels; The lifting module comprises: a nut seat, the nut seat is installed in the first driven rotating wheel; a stud threadedly connected to the nut seat; a pressure block connected to the upper end of the stud, the pressure block is embedded in the outer ring; The correction module includes: a correction motor; a driving wheel sleeved on the output end of the correction motor; a second driven wheel that cooperates with the driving wheel for transmission, and the second driven wheel is rotatably assembled on the base; a second transmission belt that is sleeved on the driving wheel and the second driven wheel at the same time; a support seat provided at the upper end of the second driven wheel, and the inner ring, outer ring, and driven gear are all installed on the support seat; a tensioning wheel and a centering wheel are provided on the base, the tensioning wheel is rotatably engaged with the inner end of the second transmission belt, and the centering wheel is rotatably engaged with the outer end of the second transmission belt; a plurality of pin holes are provided on the second driven wheel, and the support seat is detachably mounted on the second driven wheel through a pin shaft; The clutch module includes: a clutch cylinder; a slide rail; a slider slidably fitted on the slide rail; a motor base mounted on the upper end of the slider and connected to the output end of the clutch cylinder, and the drive motor is mounted on the motor base; the clutch cylinder drives the motor base to move, driving the drive motor and the driving gear mounted on the motor base to move so as to separate and aggregate relative to the driven gear.

2. The wafer expansion and correction mechanism according to claim 1, characterized in that: The upper end of the outer ring is also matched with a cover plate, and there is a feed port between the outer ring and the cover plate; an anti-mistake column is provided at the upper end of the outer ring on the side opposite to the feed port, which is used to locate the introduction direction of the wafer.

3. The wafer expansion and correction mechanism according to claim 2, characterized in that: The upper end of the outer ring is also provided with a wafer detector and a pair of positioning bars that match each other. The wafer detector is used to determine whether the wafer is introduced, and the pair of positioning bars are used to locate the outer edges of both sides of the wafer.

4. The wafer expansion and correction mechanism according to claim 1, characterized in that: An origin angle detector is arranged on the base to detect the initial origin position of the outer ring.

5. The wafer expansion and correction mechanism according to claim 1, characterized in that: The number of the first driven wheels is greater than the number of the lifting modules. The lifting modules are provided with at least four groups, and the multiple groups of lifting modules are arranged in a ring at the lower end of the outer side of the outer ring.

6. The wafer expansion and correction mechanism according to claim 2, characterized in that: A buffer column is provided at the upper end of the support seat, and the buffer column corresponds to the lower end of the cover plate and is used to buffer the lifting and lowering collision impact of the outer ring.

7. The wafer expansion and correction mechanism according to claim 1, characterized in that: The motor seat is provided with a film expansion positioning block, which engages with the upper end of the bracket on which the driven gear is assembled, and fixes the meshing cooperation between the driving gear and the driven gear during the film expansion process.

8. The wafer expansion and correction mechanism according to claim 1, characterized in that: A protective cover shell is provided at the upper end of the base, and the protective cover shell protects the upper ends of the driving gear and the driven gear.

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