Wafer heating device

Abstract

The present invention relates to the field of wafer heating, and specifically to a wafer heating device, including a sealed chamber body, wherein the sealed chamber body is composed of a lower shell body and an upper cover body, a tray is arranged in the sealed chamber body, a clamping mechanism is arranged on the outer side of the tray, the clamping mechanism includes a first clamping assembly and a second clamping assembly, the first clamping assembly and the second clamping assembly respectively have at least three first limit members and second limit members uniformly distributed in the circumferential direction of the tray, each of the first limit members and the second limit members is provided with a linkage structure that cooperates with the tray, the present invention creates a closed heating environment by introducing hot air into the sealed chamber body, and in the alternating working mode of the first clamping assembly and the second clamping assembly, each part of the wafer can be effectively and efficiently heated, and at the same time, the cooperation of the linkage structure with the first limit member or the second limit member keeps the tray away from the wafer, ensuring complete heating and guaranteeing the quality of the wafer.

Description

Technical Field

[0001] The invention relates to the field of wafer heating, and in particular to a wafer heating device. Background Art

[0002] The wafer heating device is used to carry and heat the wafer to remove the solvent in the photoresist on the wafer to improve adhesion. A sealing mechanism is usually provided above the heating component to seal the upper surface space of the heating plate to prevent heat loss. However, the heating of the wafer in the prior art is not uniform enough, and the heating effect on the part carrying the wafer is not good.

[0003] At present, Chinese patent CN114678296A discloses a wafer heating device, including a base, a heating component is arranged on the base, a sealing component is coaxially sleeved on the heating component, and at least one driving component, the lower edge of the bottom of the sealing component extends radially inward to form a connecting portion, the heating component extends circumferentially to form a protruding portion, the driving component drives the connecting portion to abut against the protruding portion to seal the heating area formed between the sealing component and the heating component, the sealing component includes a cover body, a sealing cover sleeved on the heating component, the cover body extends circumferentially to form a sealing cover on the sealing cover The sealing cover comprises a side wall, the bottom lower edge of the side wall extends radially inward to form a connection portion that is abutted against the protrusion, the heating assembly comprises a side frame, a heating disk and a shell are axially arranged in sequence inside the side frame, a heating zone for heating the heating disk is formed between the shell and the heating disk, a plurality of adsorption blocks are arranged on the heating disk, a hollow cavity is formed inside the shell, a heating wire longitudinally penetrates the shell and connects to the heating zone, a side frame connected to the bottom of the shell is arranged outside the shell, and the side frame extends circumferentially to form a protrusion that is abutted against the connection portion of the sealing cover.

[0004] The above-mentioned wafer heating device drives the connecting part of the sealing component to move upward in the longitudinal direction through the driving component, so that the connecting part and the protrusion of the heating component are abutted against each other, thereby being able to achieve sealing of the heating area formed between the sealing component and the heating component. However, although the heating device has the effect of sealing and heating, the wafer is adsorbed by a number of adsorption blocks, resulting in the heating effect of this area being not as effective as the area completely exposed to the outside, resulting in uneven heating of the entire wafer. Therefore, there is a need for a heating device that ensures that the wafer is uniformly heated in a closed space while ensuring closed heating. Summary of the invention

[0005] In view of the problems existing in the prior art, a wafer heating device is provided. The present invention creates a closed heating environment by introducing hot air into a sealed chamber, and the alternating working mode of the first clamping component and the second clamping component enables each part of the wafer to be effectively and efficiently heated. At the same time, the cooperation of the linkage structure and the first limit member or the second limit member keeps the tray away from the wafer, ensuring complete heating and guaranteeing the quality of the wafer.

[0006] To solve the problems of the prior art, the present invention provides a wafer heating device, comprising a sealed chamber, wherein the sealed chamber is composed of a lower shell body with an air inlet and an upper cover body with an air outlet, wherein a tray capable of supporting a wafer is provided in the sealed chamber, and a clamping mechanism for positioning the wafer is provided on the outer side of the tray; the clamping mechanism comprises a first clamping assembly and a second clamping assembly capable of positioning the wafer at different points, wherein the first clamping assembly and the second clamping assembly respectively comprise a first limiter and a second limiter uniformly distributed in a circumferential direction of the tray, and the first clamping assembly and the second clamping assembly The parts also have a first driver and a second driver for driving all the first limit members and all the second limit members to move synchronously; each of the first limit members and the second limit members is provided with a linkage structure that cooperates with the tray, and a reset structure is provided between the tray and the lower shell body. When the first limit member or the second limit member gradually approaches the tray to position the wafer, the tray gradually moves away from the wafer and moves downward under the action of the linkage structure. Conversely, after the first limit member and the second limit member are all away from the tray to release the positioning of the wafer, the tray returns to its original position under the action of the reset structure to continue to support the wafer.

[0007] Preferably, the first limit member and the second limit member have the same structure, the first limit member is specifically a block, and the first limit member is provided with a clamping opening facing the direction of the tray for the wafer to be embedded, and the position of each first limit member and the second limit member on the lower shell body corresponding to each first limit member and the second limit member has a slide rail extending along the axial direction of the tray, and the first limit member and the second limit member are respectively slidably arranged on the corresponding slide rails, and when all the first limit members clamp the wafer therein, all the second limit members are in a state away from the wafer, and when all the second limit members clamp the wafer therein, all the first limit members are in a state away from the wafer.

[0008] Preferably, a ball is provided on the upper and lower surfaces of the clamping openings of the first limiting member and the second limiting member, and a gap for inserting a wafer is left between the two corresponding balls, and the ball is used to prevent the surface of the wafer from being damaged by friction.

[0009] Preferably, a buffer pad is provided deep in the clamping openings of the first limiting member and the second limiting member to prevent the edge of the wafer from being damaged by hard pressure.

[0010] Preferably, the first limiting member and the second limiting member are both provided with pressure sensors in contact with the buffer pad for sensing the pressure on the wafer.

[0011] Preferably, the bottom center of the tray has a rod extending downward, and the interior of the lower shell has a step that can support the tray after the tray is away from the wafer, the step has a socket for inserting the rod, and the reset structure is specifically a spring. The reset structure is connected between the tray and the step. When the reset structure is in a state without external force, the tray is located in a position away from the step to support the wafer.

[0012] Preferably, the linkage structure is specifically a plate body, the linkage structure extends horizontally toward the center of the pallet, the linkage structure has a slide slope at the end toward the pallet, and the upper surface of the pallet has an inclined surface that matches the slide slope.

[0013] Preferably, a movable magnet is fixedly provided at the lower end of the insertion rod of the tray, and a fixed magnet mounted on the insertion rod is fixedly provided on the step and above the movable magnet. When the tray supports the wafer, the movable magnet and the fixed magnet are in a mutually attracted state, so that the tray maintains a stable supporting state.

[0014] Preferably, a plurality of the air inlets are evenly distributed around the edge of the lower shell, and the air inlets are opened at positions on the lower shell facing the edge of the wafer.

[0015] Preferably, a sealing ring is fixedly provided around the upper edge of the lower shell body to contact with the lower end of the upper cover body to achieve a sealing effect.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The present invention creates a sealed heating environment by introducing hot air into a sealed chamber. During the heating process of the wafer, the alternating working modes of the first clamping assembly and the second clamping assembly enable each part of the wafer to be effectively and efficiently heated, thereby ensuring the temperature consistency of the entire wafer surface and interior. At the same time, the linkage structure cooperates with the first limit member or the second limit member to keep the tray away from the wafer, thereby ensuring that the lower surface of the wafer is completely exposed, thereby ensuring complete heating, improving the efficiency of the heating process, and ensuring the quality of the wafer.

[0018] 2. The present invention uses the ball of the first limit piece or the second limit piece to allow the wafer to enter the clamp of the first limit piece or the second limit piece through rolling contact with the ball. Since the ball and the wafer are in point-to-surface contact, the contact area with the wafer surface is reduced, making heating more efficient. At the same time, it reduces surface scratches and damages that may be caused by traditional clamping methods, which helps to maintain the high quality of the wafer.

[0019] 3. The present invention protects the wafer by pressing the buffer pads on the first limit member and the second limit member, effectively avoiding cracks or damage to the wafer caused by hard contact. At the same time, a pressure sensor is used to sense the pressure state of the buffer pad pressing the wafer, ensuring that the force applied to the wafer is always kept within a safe range, which not only achieves fine protection for the wafer, but also ensures the stability of the wafer during heating. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of a wafer heating device.

[0021] Figure 2 The present invention is a schematic diagram of the three-dimensional structure decomposition of a wafer heating device.

[0022] Figure 3 The present invention is a plan cross-sectional view of a wafer heating device.

[0023] Figure 4 The present invention is a partial three-dimensional structural cross-sectional view of a wafer heating device.

[0024] Figure 5 The present invention is a partial three-dimensional structural cross-sectional view of a wafer heating device with the upper cover removed.

[0025] Figure 6 The present invention is a schematic diagram of the three-dimensional structure of a first clamping component of a wafer heating device.

[0026] Figure 7 The present invention is a schematic diagram of the three-dimensional structure of a second clamping assembly of a wafer heating device.

[0027] Figure 8 yes Figure 3 An enlarged schematic diagram of point A.

[0028] Fig. 9 yes Figure 3 An enlarged schematic diagram of point B.

[0029] Fig.10 yes Figure 3 Enlarged schematic diagram of point C.

[0030] The numbers in the figure are: 1-sealed chamber; 11-lower shell; 111-air inlet; 112-guide rod; 113-step; 114-sealing ring; 12-upper cover; 121-air outlet; 122-guide sleeve; 2-tray; 21-insertion rod; 211-movable magnet; 212-fixed magnet; 22-inclined surface; 3-first clamping assembly; 31-first limiter; 311-clamp; 3111-ball; 3112-buffer pad; 3113-pressure sensor; 312-slide rail; 32-first drive; 321-rotating ring; 322-connecting rod; 4-second clamping assembly; 41-second limiter; 42-second drive; 5-linkage structure; 51-slope; 6-reset structure; 7-wafer; 81-gear ring; 82-driving gear; 83-motor. DETAILED DESCRIPTION

[0031] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0032] See also Figure 1-Figure 7 As shown, it is a structural schematic diagram of the wafer heating device in this embodiment, the wafer heating device includes a sealed chamber body 1, the sealed chamber body 1 is composed of a lower shell body 11 with an air inlet 111 and an upper cover body 12 with an air outlet 121, the sealed chamber body 1 is provided with a tray 2 capable of supporting a wafer 7, the tray 2 is a frustum structure, the outer side of the tray 2 is provided with a clamping mechanism for positioning the wafer 7, the clamping mechanism includes a first clamping component 3 and a second clamping component 4 capable of positioning the wafer 7 at different points, the first clamping component 3 and the second clamping component 4 respectively have at least three, and the first clamping component 3 and the second clamping component 4 are respectively provided with a first limiter 31 and a second limiter 41 uniformly distributed in the circumferential direction of the tray 2, the first clamping component 3 and the first clamping component 4 are respectively provided with a first limiter 31 and a second limiter 41 uniformly distributed in the circumferential direction of the tray 2, The two clamping assemblies 4 also respectively have a first driver 32 and a second driver 42 for driving all the first limiting members 31 and all the second limiting members 41 to move synchronously. The first driver 32 and the second driver 42 are annular structures with the same structure. Each of the first limiting members 31 and the second limiting members 41 is provided with a linkage structure 5 that cooperates with the tray 2. A reset structure 6 is provided between the tray 2 and the lower shell 11. When the first limiting member 31 or the second limiting member 41 gradually approaches the tray 2 to position the wafer 7, the tray 2 gradually moves away from the wafer 7 and moves downward under the action of the linkage structure 5. On the contrary, after the first limiting members 31 and the second limiting members 41 are all away from the tray 2 to release the positioning of the wafer 7, the tray 2 returns to its original position under the action of the reset structure 6 to continue to support the wafer 7.

[0033] The upper cover body 12 can move up and down in the direction of the lower shell body 11. The side of the lower shell body 11 has a lifting drive that can drive the upper cover body 12 to move. The side of the lower shell body 11 has a guide rod 112 extending upward. The side of the upper cover body 12 has a guide sleeve 122 slidably mounted on the guide rod 112. The lifting drive is not shown in the figure. The upper cover body 12 can be driven to move up and down along the direction of the guide rod 112 through the lifting drive.

[0034] In this embodiment, the first driver 32 and the second driver 42 are both composed of a rotating ring 321 and a connecting rod 322. A connecting rod 322 is hingedly provided between the first limit member 31 and the second limit member 41 and the corresponding rotating ring 321. When the rotating ring 321 rotates, the connecting rod 322 acts to synchronously drive all the first limit members 31 or the second limit members 41 to approach or move away from the tray 2, effectively switching the fixation of different points of the wafer 7, thereby ensuring that the wafer 7 is fully heated. Specifically, Figure 3 As shown, the rotating ring 321 is driven to rotate by a gear driving structure, and the gear driving structure has a ring gear 81 and a driving gear 82. The ring gear 81 is coaxial with the rotating ring 321 and is fixedly connected. The driving gear 82 is meshed with the ring gear 81. The driving gear 82 is driven by a motor 83. The motor 83 is fixed on the outside of the sealed chamber body 1. The shaft of the motor 83 passes through the sealed chamber body 1 and is fixedly connected to the driving gear 82. The rotating ring 321 is driven to rotate by the cooperation of the driving gear 82 and the ring gear 81. The driving gear 82 and the ring gear 81 are both located in the sealed chamber body 1.

[0035] When heating the wafer 7, the operator first places the wafer 7 on the tray 2, and then the upper cover 12 of the sealed chamber 1 slowly falls down and is locked to form a closed heating environment, and clean air that has been filtered and temperature-controlled is introduced through the air inlet 111 to create a dust-free and controllable atmosphere for heating. Before the heating process, the first clamping assembly 3 and the second clamping assembly 4 first control all the first limit members 31 to gradually approach the edge of the wafer 7 through the precise control of their respective first drivers 32 and second drivers 42 to ensure that the wafer 7 is clamped between all the first limit members 31. The linkage structure 5 comes into play at this time. As the first limit members 31 approach, the linkage structure 5 drives the tray 2 to move downward away from the wafer 7, so that Except for the part clamped by the first limit piece 31, the wafer 7 is exposed for heating, and then all the second limit pieces 41 of the second clamping assembly 4 are switched with the first limit piece 31, so that the wafer 7 is clamped between all the second limit pieces 41, and the first limit piece 31 is away from the wafer 7, so that the part of the wafer clamped by the first limit piece 31 is exposed for heating. At this time, the tray 2 is in a state away from the wafer 7, so that every part of the wafer 7 can be heated. After the heating is completed, it enters the cooling stage. At the same time, the first clamping assembly 3 and the second clamping assembly 4 release the positioning of the wafer 7, and the reset structure 6 is immediately started to smoothly reset the tray 2 back to the origin, and the wafer 7 is lifted up by the tray 2 again, waiting to be taken out.

[0036] See also Figure 3-Figure 8 As shown, the first limit member 31 and the second limit member 41 have the same structure. The first limit member 31 is specifically a block. The first limit member 31 is provided with a clamping opening 311 facing the direction of the tray 2 for the wafer 7 to be embedded. The position of each first limit member 31 and the second limit member 41 on the lower shell 11 is provided with a slide rail 312 extending along the axial direction of the tray 2. The first limit member 31 and the second limit member 41 are respectively slidably arranged on the corresponding slide rail 312. When all the first limit members 31 clamp the wafer 7 therein, all the second limit members 41 are in a state of being away from the wafer 7. When all the second limit members 41 clamp the wafer 7 therein, all the first limit members 31 are in a state of being away from the wafer 7. When all the second limit members 41 clamp the wafer 7 therein, all the first limit members 31 are in a state of being away from the wafer 7.

[0037] When all the first limiting members 31 are controlled by the first driver 32 to start sliding synchronously along the slide rail 312 toward the tray 2, the side of the wafer 7 is embedded in the clamping opening 311 on the first limiting member 31. At this time, all the second limiting members 41 remain in place, away from the wafer 7. As the first limiting members 31 are fully in place, the tray 2 moves downward through the operation of the linkage structure 5, so that the wafer 7 is exposed for heating except for the part clamped by the first limiting members 31. As the first limiting members 31 and the second limiting members 41 operate alternately, the first limiting member 31 returns to its original position along the slide rail 312 under the instruction of the first driver 32, and is separated from the wafer 7. Wafer 7 is held in the wafer 7 by the first limit member 31 and the second limit member 41 is moved away from the wafer 7. When the heating is completed, the first limit member 31 and the second limit member 41 are moved away from the wafer 7. The tray 2 rises to its original position under the action of the reset structure 6. The wafer 7 is supported again and waits for cooling. The entire heating and cooling process is completed in a closed and controlled environment, ensuring the temperature uniformity of the wafer 7.

[0038] See also Figure 3-Figure 8 As shown, a ball 3111 is provided on the upper and lower sides of the clamping opening 311 of the first limiting member 31 and the second limiting member 41, and a gap is left between the two corresponding balls 3111 for the wafer 7 to be inserted. The ball 3111 is used to prevent the surface of the wafer 7 from being damaged by friction.

[0039] When the first limiting member 31 or the second limiting member 41 moves toward the wafer 7, the ball 3111 on the clamp 311 guides the wafer 7 into the clamp 311. Due to the presence of the ball 3111, the direct friction between the wafer 7 and the first limiting member 31 or the second limiting member 41 is greatly reduced, and is replaced by the rolling contact of the ball 3111, thereby reducing the risk of scratches or damage to the surface of the wafer 7, and helping to maintain the high quality of the wafer 7.

[0040] See also Figure 3-Figure 8 As shown, a buffer pad 3112 is provided deep in the clamping opening 311 of the first limiting member 31 and the second limiting member 41 to prevent the edge of the wafer 7 from being damaged by hard pressure.

[0041] The buffer pad 3112 built deep into the clamp 311 of each first limit member 31 and second limit member 41 is intended to provide a soft contact surface for the edge of the wafer 7 when the wafer 7 is fully clamped. When the first limit member 31 or the second limit member 41 is closed to clamp the wafer 7, the buffer pad 3112 first contacts the edge of the wafer 7, effectively absorbing and dispersing any pressure that may be applied to the edge of the wafer 7, preventing damage caused by hard squeezing, and ensuring that the wafer 7 will not be damaged due to excessive mechanical stress even in the locked state. During the entire heating and subsequent cooling process, the buffer pad 3112 continues to function to protect the wafer 7 from edge impacts or stress concentration that may be caused by slight displacements caused by temperature changes, thereby maintaining the integrity of the wafer 7.

[0042] See also Figure 3-Figure 8 As shown, the first limiting member 31 and the second limiting member 41 are both provided with a pressure sensor 3113 in contact with the buffer pad 3112 for sensing the pressure against the wafer 7 .

[0043] The pressure sensor 3113 installed behind the buffer pad 3112 of each first limit member 31 and the second limit member 41 closely monitors the pressure changes on the buffer pad 3112 when it contacts the edge of the wafer 7. When the wafer 7 is clamped by the first limit member 31 or the second limit member 41, the pressure sensor 3113 senses the pressure on the buffer pad 3112, ensuring that the force applied to the wafer 7 is always kept within a safe range, avoiding damage to the wafer 7 due to overpressure, and avoiding instability of the wafer 7 due to insufficient pressure.

[0044] See also Figure 3-Figure 5 and Fig.10 As shown, the tray 2 has an insertion rod 21 extending downward at the bottom center, and the lower shell 11 has a step 113 inside that can support the tray 2 after the tray 2 is away from the wafer 7. The step 113 has a socket for inserting the insertion rod 21. The reset structure 6 is specifically a spring, and the reset structure 6 is connected between the tray 2 and the step 113. When the reset structure 6 is in a state of not being acted upon by external force, the tray 2 is located at a position away from the step 113 that supports the wafer 7.

[0045] When the wafer 7 needs to be heated, the linkage structure 5 on the first limit member 31 or the second limit member 41 acts on the tray 2, which will overcome the elastic force of the spring and force the tray 2 to move downward. The insertion rod 21 moves downward along the socket of the step 113 until the tray 2 reaches a position in contact with the step 113. At this time, the first limit member 31 or the second limit member 41 also completes the fixation of the wafer 7. Once the heating is completed, the first limit member 31 and the second limit member 41 are both away from the wafer 7, so that the force of the linkage structure 5 on the tray 2 is removed. The spring drives the tray 2 and the insertion rod 21 to rebound upward due to the elastic force, thereby re-supporting the wafer 7 to facilitate the subsequent removal of the wafer 7.

[0046] See also Figure 3-Figure 7 and Fig. 9 As shown, the linkage structure 5 is specifically a plate body, and the linkage structure 5 extends horizontally toward the center of the tray 2 . The end of the linkage structure 5 facing the tray 2 has a slide 51 , and the upper surface of the tray 2 has an inclined surface 22 that matches the slide 51 .

[0047] When all the first limit members 31 and the second limit members 41 are away from the tray 2, the slope 51 on each linkage structure 5 is located at the edge of the tray 2. At this time, the tray 2 maintains a supporting state for the wafer 7. When the first limit member 31 or the second limit member 41 moves toward the tray 2, the slope 51 on the linkage structure 5 gradually moves toward the center of the tray 2 until the tray 2 contacts the step 113 under the action of the downward pressure of the linkage structure 5, so that the tray 2 is away from the wafer 7. At this time, the reset structure 6 is in a pressurized state, which is beneficial for the hot air to act comprehensively on the surface of the wafer 7.

[0048] See also Figure 3-Figure 5 and Fig.10 As shown, a movable magnet 211 is fixedly provided at the lower end of the insertion rod 21 of the tray 2, and a fixed magnet 212 is fixedly provided on the step 113 and above the movable magnet 211 and is sleeved on the insertion rod 21. When the tray 2 supports the wafer 7, the movable magnet 211 and the fixed magnet 212 are in a mutually attracted state, so that the tray 2 maintains a stable supporting state.

[0049] When the tray 2 is in the working state of supporting the wafer 7, the movable magnet 211 and the fixed magnet 212 are attracted to each other due to magnetism, forming a stable attraction state, which assists in fixing the tray 2. Even under slight vibration or external force, the tray 2 can be kept stable and not shifted, ensuring that the wafer 7 is firmly supported. When the tray 2 needs to be adjusted, the linkage structure 5 acts on the tray 2, so that the movable magnet 211 on the tray 2 overcomes the magnetic attraction of the fixed magnet 212, so that the tray 2 moves downward and away from the wafer 7. When the first limit member 31 and the second limit member 41 both release the clamping state of the wafer 7, the tray 2 is reset under the action of the reset structure 6, and the natural attraction between the movable magnet 211 and the fixed magnet 212 will come into play again, and the stable support state can be quickly restored without additional fixing measures.

[0050] See also Figure 1-Figure 5 As shown, a plurality of air inlets 111 are evenly distributed around the edge of the lower shell 11 , and the air inlets 111 are opened at positions on the lower shell 11 facing the edge of the wafer 7 .

[0051] The position layout of the air inlet 111 facing the edge of the wafer 7 ensures that the hot air flow can quickly diffuse over the upper and lower surfaces of the wafer 7, thereby achieving uniformity of the surface temperature of the wafer 7, maximizing the contact area between the air flow and the surface of the wafer 7, accelerating the heat transfer process, shortening the heat treatment cycle, and thus improving the overall processing efficiency.

[0052] See also Figure 2-Figure 5 As shown, a sealing ring 114 is fixedly provided around the upper edge of the lower shell 11 to contact with the lower end of the upper cover 12 to achieve a sealing effect.

[0053] The setting of the sealing ring 114 effectively prevents the mutual penetration of external air and internal gas in the heat treatment environment, isolates external dust and other pollutants, protects the wafer 7 undergoing internal heat treatment from contamination, and improves the heat treatment effect of the wafer 7.

[0054] The present invention creates a closed heating environment by introducing hot air into the sealed chamber body 1. During the heating process of the wafer 7, the alternating working modes of the first clamping assembly 3 and the second clamping assembly 4 enable each part of the wafer 7 to be effectively and efficiently heated, thereby ensuring the temperature consistency of the entire surface and interior of the wafer 7. At the same time, the linkage structure 5 cooperates with the first limit member 31 or the second limit member 41 to keep the tray 2 away from the wafer 7, thereby ensuring that the lower surface of the wafer 7 is completely exposed, thereby ensuring complete heating, improving the efficiency of the heating process, and ensuring the quality of the wafer 7.

[0055] The above embodiments only express one or several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A wafer heating device, characterized in that: The sealed chamber (1) comprises a sealed chamber body (1), the sealed chamber body (1) comprising a lower shell body (11) having an air inlet (111) and an upper cover body (12) having an air outlet (121), a tray (2) capable of supporting a wafer (7) being provided in the sealed chamber body (1), and a clamping mechanism for positioning the wafer (7) being provided on the outer side of the tray (2); The clamping mechanism comprises a first clamping assembly (3) and a second clamping assembly (4) capable of positioning the wafer (7) at different points, the first clamping assembly (3) and the second clamping assembly (4) respectively comprising a first limiter (31) and a second limiter (41) uniformly distributed in a circumferential direction around the tray (2), the first clamping assembly (3) and the second clamping assembly (4) further respectively comprising a first driver (32) and a second driver (42) for driving all the first limiters (31) and all the second limiters (41) to move synchronously; Each of the first limiting member (31) and the second limiting member (41) is provided with a linkage structure (5) cooperating with the tray (2), and a reset structure (6) is provided between the tray (2) and the lower shell (11). When the first limiting member (31) or the second limiting member (41) gradually approaches the tray (2) to position the wafer (7), the tray (2) gradually moves away from the wafer (7) and moves downward under the action of the linkage structure (5). Conversely, when the first limiting member (31) and the second limiting member (41) are completely away from the tray (2) to release the positioning of the wafer (7), the tray (2) returns to its original position under the action of the reset structure (6) to continue to support the wafer (7).

2. A wafer heating device according to claim 1, characterized in that: The first limiting member (31) and the second limiting member (41) have the same structure. The first limiting member (31) is specifically a block. The first limiting member (31) is provided with a clamping opening (311) facing the direction of the tray (2) for the wafer (7) to be embedded. The lower shell (11) has a slide rail (312) extending along the axial center line direction of the tray (2) at the position corresponding to each first limiting member (31) and the second limiting member (41). The first limiting member (31) and the second limiting member (41) are respectively slidably arranged on the corresponding slide rail (312). When all the first limiting members (31) clamp the wafer (7) therein, all the second limiting members (41) are in a state of being away from the wafer (7), and when all the second limiting members (41) clamp the wafer (7) therein, all the first limiting members (31) are in a state of being away from the wafer (7).

3. The wafer heating device according to claim 2, characterized in that: A ball (3111) is provided on the upper and lower sides of the clamping openings (311) of the first limiting member (31) and the second limiting member (41), and a gap for inserting a wafer (7) is left between the two corresponding balls (3111). The balls (3111) are used to prevent the surface of the wafer (7) from being damaged by friction.

4. The wafer heating device according to claim 3, characterized in that: A buffer pad (3112) is provided deep in the clamping openings (311) of the first limiting member (31) and the second limiting member (41) to prevent the edge of the wafer (7) from being damaged by hard pressure.

5. The wafer heating device according to claim 4, characterized in that: The first limiting member (31) and the second limiting member (41) are both provided with pressure sensors (3113) that are in contact with the buffer pad (3112) and are used to sense the pressure applied to the wafer (7).

6. The wafer heating device according to claim 1, characterized in that: The tray (2) has a rod (21) extending downward at the bottom center thereof, and the lower shell (11) has a step (113) inside thereof that can support the tray (2) when the tray (2) is away from the wafer (7). The step (113) has a socket for inserting the rod (21). The reset structure (6) is specifically a spring. The reset structure (6) is connected between the tray (2) and the step (113). When the reset structure (6) is in a state where no external force is applied, the tray (2) is located at a position away from the step (113) that supports the wafer (7).

7. The wafer heating device according to claim 1, characterized in that: The linkage structure (5) is specifically a plate body, the linkage structure (5) extends horizontally toward the center of the tray (2), the end of the linkage structure (5) facing the tray (2) has a slide (51), and the upper surface of the tray (2) has an inclined surface (22) that matches the slide (51).

8. The wafer heating device according to claim 6, characterized in that: A movable magnet (211) is fixedly provided at the lower end of the insertion rod (21) of the tray (2), and a fixed magnet (212) sleeved on the insertion rod (21) is fixedly provided on the step (113) and located above the movable magnet (211); when the tray (2) supports the wafer (7), the movable magnet (211) and the fixed magnet (212) are in a mutually attracted state, so that the tray (2) maintains a stable supporting state.

9. The wafer heating device according to claim 1, characterized in that: The edge of the lower shell (11) is evenly distributed with a plurality of the air inlets (111) around the periphery thereof, and the air inlets (111) are opened at positions on the lower shell (11) facing the edge of the wafer (7).

10. The wafer heating device according to claim 9, characterized in that: A sealing ring (114) is fixedly provided around the upper edge of the lower shell body (11) for contacting the lower end of the upper cover body (12) to achieve a sealing effect.

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