Pumping source device for laser and preparation method

Abstract

The invention provides a pumping source device for a laser and a preparation method, and relates to the technical field of laser welding, the pumping source device comprises a core copper assembly and an aluminum shell assembly, the core copper assembly integrates a heat dissipation structure and a chip working structure into a whole, the overall structure guarantees the stability of the strength and the size in the high-heat and high-water-pressure state, and the stability of the heat dissipation structure is improved. The size deformation of the working surface is within 3 microns; no other materials are used for blocking, the heat conduction efficiency of a working area is improved, T2 red copper is used, the process stability of nickel plating and gold plating is facilitated, and therefore the high reliability of a core assembly is achieved; the upper and lower aluminum covers adopt a micro-arc oxidation treatment process to form an appearance surface of which the coloring reflectivity is lower than 2.5%, so that the interference on a laser light path can be reduced to the greatest extent; the core copper assembly and the aluminum shell part are fastened through screws to form a pumping source finished body for the laser, the heat conductivity is high, heat dissipation is uniform, and the structure can be used for preparing a single-chip 32-55W high-power high-performance high-reliability pumping source for the laser.

Description

Technical Field

[0001] The invention relates to the technical field of laser welding, and specifically provides a pump source device for a laser and a preparation method thereof. Background Art

[0002] There are two major types of existing laser pump source structures. The first type is a chip working structure made of pure copper parts and an aluminum-based water-cooling plate. The second type is a copper-aluminum composite integrated structure. However, these laser pump sources still have the following disadvantages: the first type, the chip working structure made of pure copper parts plus an aluminum-based water-cooling plate, from the cooling effect point of view, the heating element and the cooling water plate are two separate components, the thermal conductivity is poor, and it is only suitable for low-power pump sources; from the structural point of view, the overall design is relatively complex, consisting of multiple pump sources connected in series, especially for high-power lasers, it is impossible to solve the problem of simplification, resulting in high costs;

[0003] The second type, although the overall structure of copper-aluminum composite solves the problem of simplifying the design structure and greatly improves the cooling efficiency, the expansion coefficients of copper and aluminum are inconsistent in the working environment of the chip and during the preparation process, resulting in insufficient dimensional stability of the chip working surface and the possibility of variation, or better process control conditions are required to meet the above requirements, resulting in high costs; it is difficult to solve the process contradictions of nickel plating and gold plating on the surface of copper parts and anodizing of aluminum parts during the overall surface treatment, which either leads to low reliability yield of nickel plating and gold plating, or causes the anodizing of aluminum to fail reliability tests, such as 24h neutral salt spray, high temperature and high humidity, high temperature baking, hot and cold shock, alcohol resistance test, 3M coating stripping test and other performance requirements. The overall process yield is not high, resulting in high costs.

[0004] Accordingly, the art needs a new laser pump source device and a preparation method to solve the above technical problems. Summary of the invention

[0005] The present invention aims to solve the above technical problem, that is, to solve the problem that the existing pump source device has poor cooling effect and high cost.

[0006] In a first aspect, the present invention provides a pump source device for laser, the pump source device comprising a core copper component and an aluminum housing component, wherein;

[0007] The core copper component includes a chip workbench, a first connecting plug and a second connecting plug, and a plurality of working chip groups are arranged and distributed on the chip workbench; the vertical direction of the working chip groups is the first direction, and the horizontal direction of the working chip groups is the second direction; a cooling water channel is formed in the chip workbench, and two adjacent cooling water channel openings are provided with connected countersunk holes, and the cooling water channels are correspondingly arranged directly below the working chipset, and the cooling water channels penetrate the chip workbench along the first direction, and a plurality of cooling water channels are formed in a group along the second direction; the first connecting plug connects and seals the adjacent cooling water channels, and the second connecting plug connects and seals the adjacent cooling water channels, and the first connecting plug and the second connecting plug are staggered so that water flows in the plurality of plug cooling water channels in sequence;

[0008] The aluminum housing assembly is installed to wrap the chip workbench to provide protection support for the chip workbench and assembly of other structural parts.

[0009] Based on the above structural setting, the heat dissipation efficiency of the laser pump source device is effectively improved by adopting the combined design of the core copper component and the aluminum shell component. The cooling water channel is set directly below the working chipset, and the structural design that runs through the chip workbench enables the cooling water to quickly take away the heat generated by the chipset when it is working, keeping the chip working at a stable temperature, and improving the working stability of the device.

[0010] In the preferred technical solution of the above-mentioned laser pump source device, the cooling water channel can be set to correspond to multiple water supply pipes directly below the working chip group, and the multiple water supply pipes are connected by a U-shaped connecting pipe to form an M-shaped curved folding structure, or, the cooling water channel can also be set to occupy an independent cooling space inside the entire chip workbench, and the two sides of the cooling space are respectively sealed by the first connecting plug and the second connecting plug, and the first connecting plug and the second connecting plug are small copper parts with a circular arc contour design.

[0011] Based on the above structural setting, if the cooling water channel is an M-shaped structure composed of multiple water supply pipes, the circulation of water in multiple curved water supply pipes improves the fluidity of the cooling water, thereby improving the heat dissipation efficiency. If the cooling water channel is arranged as a whole in the chip workbench, the structural complexity is reduced and the production efficiency is improved. In summary, the present application uses a variety of structures flexibly, which greatly improves the scope of application of the overall device.

[0012] In the preferred technical solution of the above-mentioned laser pump source device, the aluminum shell assembly includes an upper shell and a lower shell, the upper shell is wrapped and arranged on the upper side of the chip workbench where the working chipset is arranged, and the area of ​​the upper shell corresponding to the working chipset is arranged to be an open structure so that the working chipset can contact the outside world; the lower shell is wrapped and arranged on the lower side of the chip workbench, and the upper shell and the lower shell are fixed and installed by bolts.

[0013] Based on the above structural setting, the upper and lower shells are used to wrap the chip workbench, wherein the upper shell opening structure enables the working chip set to be directly connected to other devices. The upper and lower shells are fixed by bolts, which increases the structural stability of the device and ensures the safety of the pump source device in different working environments.

[0014] In the preferred technical solution of the above-mentioned laser pump source device, the cross-section of the cooling water channel is a circular, sawtooth or special-shaped hole structure, and the first connecting plug and the second connecting plug are set to a circular, sawtooth or special-shaped structure corresponding to the cooling water channel.

[0015] Based on the above structural setting, the cross-section of the cooling water channel is designed as a circular or serrated or special-shaped hole structure, which increases the contact area between water and the cooling water channel, that is, the effective heat dissipation area of ​​the cooling water channel is increased, thereby improving the heat dissipation efficiency.

[0016] In the preferred technical solution of the above-mentioned laser pump source device, the core copper component also includes a water inlet and a water outlet, the water inlet is arranged on one side of the chip workbench, and the water inlet is connected to the first end of the cooling water channel on one edge side; the water outlet is arranged on the other side of the chip workbench, and the water outlet is connected to the first end of the cooling water channel on the other edge side.

[0017] Based on the above structural setting, by setting the water inlet and outlet on both sides of the chip workbench, the design of cooling water entering from one side and flowing out from the other side is realized, so that the water flow can run through the entire working chipset area, ensuring the uniform distribution and timely dissipation of heat, and improving the overall cooling efficiency of the device.

[0018] In the preferred technical solution of the above-mentioned laser pump source device, the water inlet end, the cooling water channel, the first connecting plug channel, the second connecting plug channel and the water outlet end are combined to form an M-type flow channel structure.

[0019] Based on the above structural settings, the M-shaped flow channel structure design of the water inlet, cooling water channel, first connecting plug channel, second connecting plug channel and water outlet optimizes the water flow path, so that the cooling water can be fully circulated in the chip workbench, further improving the heat dissipation effect and ensuring the long-term stable operation of the device.

[0020] In a second aspect, the present invention provides a preparation method for a laser pump source device as described in any one of the above items, the preparation method comprising the steps of:

[0021] S1: The copper block made of red copper is mechanically added to the chip workbench shape, and the flow channel through-hole is processed by deep hole drilling;

[0022] S2: welding the processed copper block and the copper plug to form a chip workbench with a cooling water channel;

[0023] S3: The welded chip workbench is machined and milled to form a high-precision working chip set installation position;

[0024] S4: sandblasting the working chip group installation position of the core copper component after structural processing, then nickel-plating the core copper component as a whole, and then partially gold-plating the chip working surface;

[0025] S5: forming a high-precision assembly dimension structure by machining the aluminum upper shell and the aluminum lower shell;

[0026] S6: After the aluminum upper shell and the aluminum lower shell that have been structurally processed are degreased and cleaned, the entire surface is subjected to micro-arc oxidation treatment;

[0027] S7: Assemble the surface-treated core copper component, the aluminum upper shell and the aluminum lower shell together to form a complete laser pump source.

[0028] Based on the above structural setting, the preparation method has rigorous steps, so that the processing, welding, assembly and other processes of the copper material can be accurately controlled, thereby improving the overall manufacturing accuracy of the device and ensuring the cooling performance and working stability of the pump source device.

[0029] In the preferred technical solution of the above preparation method, in step S1, the deep hole drill uses an internally cooled drill bit.

[0030] Based on the above structural setting, the use of an internally cooled drill bit for deep hole drilling improves processing efficiency and channel smoothness, can effectively reduce the heat and debris generated during the drilling process, improves processing efficiency and accuracy, ensures the smoothness and consistency of the cooling water channel, and provides a reliable channel for the subsequent cooling system.

[0031] In the preferred technical scheme of the above preparation method, in step S4, the roughness of the chip workbench is maintained at Ra0.4-0.8 by sandblasting surface treatment, and then the entire product is nickel-plated to prevent oxidation of the product and serve as a connecting layer for subsequent local gold plating. Then, local gold plating is performed at the working chipset installation position for welding and assembly of subsequent working chipsets.

[0032] Based on the above structural setting, the surface roughness of the chip workbench is maintained at Ra0.4-0.8 through sandblasting, and then the whole is nickel-plated and the local gold-plated. This not only improves the reliability of the installation position of the working chipset, but also effectively prevents the oxidation corrosion of the copper material, and improves the durability and performance stability of the pump source device.

[0033] In the preferred technical solution of the above preparation method, in step S2, the chip workbench and the cooling water channel are both made of T2 copper.

[0034] Based on the above structural settings, T2 copper material is used to manufacture the chip workbench and cooling water channels, which ensures the high thermal conductivity and corrosion resistance of the components, significantly improves the heat dissipation efficiency of the device, and extends the service life of the pump source device.

[0035] In summary, the present invention forms a cooling water channel by drilling holes below the working chip group, and the cooling water pipeline is connected with the first connecting plug and the second connecting plug of the same material to form an "M"-shaped coolant circulation flow channel in the chip working area; after the core copper component and the aluminum upper shell and lower shell are assembled, the coolant inlet and outlet of the pump source are connected to the external coolant supply system through threads to form a single T2 copper heat dissipation and heat exchange fully enclosed cooling circulation system, which solves the problems of water electrolysis, microbial generation, and flow channel oxidation or corrosion when the coolant is in use;

[0036] The core copper components are made of T2 copper, a high heat dissipation material. The water supply pipes are made into round hole / sawtooth shapes to further improve the heat dissipation efficiency while meeting the flow resistance requirements.

[0037] The heat dissipation structure is integrated with the chip workbench structure. The overall structure ensures the stability of strength and size under heat and pressure conditions. Without other materials blocking it, the heat conduction and evacuation efficiency of the working area is increased.

[0038] The cooling circulation channel and the chip workbench are connected by the same material, which avoids electrolytic corrosion in the circulation system and increases the service life;

[0039] The core copper components are designed in an integrated manner and use T2 copper, which is conducive to the process stability of surface nickel plating and gold plating, thereby achieving high reliability of the core components;

[0040] The aluminum upper and lower shells are treated with micro-arc oxidation to form a colored surface with a reflectivity of less than 2.5%, which can minimize the interference of the cover plate on the laser light path, and the excellent performance greatly improves the service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings, in which:

[0043] Figure 1 The overall structural schematic diagram of the present invention is shown;

[0044] Figure 2 A schematic diagram of the combined structure of the chip workbench, the first connecting plug and the second connecting plug of the present invention is shown;

[0045] Figure 3 The preparation method flow chart of the present invention is shown;

[0046] Figure 4 A schematic diagram of the specific structure of embodiment 2 of the present invention is shown.

[0047] Reference numerals:

[0048] 1. Working chipset; 2. Chip workbench; 3. Water outlet; 4. Cooling water channel; 5. First connecting plug; 6. Water inlet; 7. Second connecting plug; 8. Upper shell; 9. Lower shell; 10. U-shaped tube. DETAILED DESCRIPTION

[0049] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art can make adjustments to them as needed to adapt to specific application scenarios.

[0050] It should be noted that in the description of the present invention, the terms "middle", "upper", "lower", "left", "right", "inner", "outer" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the structure must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0051] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "interconnected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] The present invention provides a pump source device for laser, the pump source device comprises a core copper component and an aluminum shell component, wherein;

[0053] like Figure 2 As shown, the core copper component includes a chip workbench 2, a first connecting plug 5 and a second connecting plug 7. It should be noted that the present invention does not impose any limitation on the specific structure of the chip workbench 2, and those skilled in the art can set it according to their needs. For example, the chip workbench 2 can be a round table, or for another example, the chip workbench 2 can also be a square table, as long as the chip workbench 2 is large enough to accommodate the structure required by the overall device. A plurality of working chip groups 1 are arranged and distributed on the chip workbench 2; the vertical direction of the working chip groups 1 is the first direction, and the horizontal direction of the working chip groups 1 is the second direction; a cooling water channel 4 is formed in the chip workbench 2, and two adjacent openings of the cooling water channel 4 are provided with connected countersunk holes, and the cooling water channel 4 is correspondingly arranged directly below the working chip group 1, and the cooling water channel 4 penetrates the chip workbench 2 along the first direction, and a plurality of cooling water channels 4 are formed in groups along the second direction; the first connecting plug 5 connects and seals the adjacent cooling water channels 4, and the second connecting plug 7 connects and seals the adjacent cooling water channels 4, and the first connecting plug 5 and the second connecting plug 7 are staggered so that water flows in the plurality of cooling water channels 4 in sequence; an aluminum housing assembly is arranged and installed on the outside of the chip workbench 2 to provide protective support for the chip workbench 2.

[0054] It should be noted that the present invention does not impose any restrictions on the specific structure of the cooling water channel 4, and those skilled in the art can set it according to their needs. For example, the cooling water channel 4 can be a curved structure, or a linear structure, as long as the water flow in the cooling water channel 4 can flow directly under each working chip group 1. In this preferred embodiment, the cooling water channel 4 can also be set to occupy an independent cooling space inside the entire chip workbench 2, and the first connecting plug 5 and the second connecting plug 7 are small copper parts with arc contour design. The cooling water channel 4 is set as a whole in the chip workbench 2, which reduces the structural complexity and improves production efficiency.

[0055] Of course, it should also be noted that the present invention does not impose any restrictions on the specific structure of the first connection plug 5 and the second connection plug 7. Those skilled in the art can set it according to their needs. For example, the first connection plug 5 and the second connection plug 7 can be circular plugs. For another example, the first connection plug 5 and the second connection plug 7 can also be square plugs, as long as the first connection plug 5 and the second connection plug 7 maintain good sealing of the cooling water channel 4. In this preferred embodiment, the first connection plug 5 and the second connection plug 7 are small copper parts with a circular arc contour design. Designing the first connection plug 5 and the second connection plug 7 as small copper parts with a circular arc contour design allows the water to circulate more smoothly in multiple cooling water channels 4, reduces the resistance of water flow turning, effectively improves the cooling efficiency, and further ensures the uniform heat dissipation of the chip workbench 2.

[0056] The heat dissipation efficiency of the laser pump source device is effectively improved by adopting a combination design of a core copper component and an aluminum shell component. The cooling water channel 4 is arranged directly below the working chipset 1, and the structural design that runs through the chip workbench 2 enables the cooling water to quickly take away the heat generated by the chipset when it is working, keeps the chip working at a stable temperature, and improves the working stability of the device.

[0057] Furthermore, if Figure 1 As shown, the aluminum housing assembly includes an upper shell 8 and a lower shell 9. The upper shell 8 is wrapped and arranged on one side of the chip workbench 2 where the working chipset 1 is arranged. The area of ​​the upper shell 8 corresponding to the working chipset 1 is arranged to be an open structure so that the working chipset 1 can be connected to other devices; the lower shell 9 is wrapped and arranged on the other side of the chip workbench 2, and the upper shell 8 and the lower shell 9 are fixed and installed by bolts. The structure of the upper and lower shells 9 wrapping the chip workbench 2 is adopted, wherein the opening structure of the upper shell 8 enables the working chipset 1 to be directly connected to other devices. The upper and lower shells 9 are fixed by bolts, which increases the structural stability of the device and ensures the safety of the pump source device under different working environments. It should be noted that the present invention does not impose any restrictions on the specific structure of the upper shell 8 and the lower shell 9, and those skilled in the art can set it according to their needs. For example, the upper shell 8 and the lower shell 9 can be an integrated structure, and for another example, the upper shell 8 and the lower shell 9 can also be a disassembly structure, as long as the upper shell 8 and the lower shell 9 can provide good protection and support for the chip workbench 2.

[0058] Furthermore, the core copper component also includes a water inlet 6 and a water outlet 3. The water inlet 6 is arranged on one side of the chip workbench 2, and the water inlet 6 is connected to the first end of the cooling water channel 4 on one side of the edge; the water outlet 3 is arranged on the other side of the chip workbench 2, and the water outlet 3 is connected to the first end of the cooling water channel 4 on the edge of the other side. By arranging the water inlet 6 and the water outlet 3 on both sides of the chip workbench 2, a design in which cooling water enters from one side and flows out from the other side is realized, so that the water flow can run through the entire working chip group 1 area, ensuring the uniform distribution and timely dissipation of heat, and improving the overall cooling efficiency of the device. It should be noted that the present invention does not impose any restrictions on the connection structure of the water inlet 6 and the water outlet 3, and those skilled in the art can set it according to their needs. For example, the water inlet 6 and the water outlet 3 can be connected to the external circulating water source through threads, and for another example, the water inlet 6 and the water outlet 3 can also be connected to the external circulating water source through a flange, as long as the connection sealing between the water inlet 6 and the water outlet 3 and the outside world is ensured to be good enough.

[0059] As a preferred embodiment, the water inlet 6, the cooling water channel 4, the first connecting plug channel, the second connecting plug channel and the water outlet 3 are combined to form an M-type flow channel structure. The M-type flow channel structure design of the water inlet 6, the cooling water channel 4, the first connecting plug channel, the second connecting plug channel and the water outlet 3 optimizes the water flow path, so that the cooling water can be fully circulated in the chip workbench 2, further improving the heat dissipation effect and ensuring the long-term stable operation of the device. Of course, the present invention does not impose any restrictions on the structure of the overall water flow channel. Those skilled in the art can set it according to their needs, as long as it is ensured that there is a cooling water channel 4 for circulating cooling water directly below each group of working chips 1.

[0060] The present invention also provides a preparation method, such as Figure 3 As shown, the preparation method of the laser pump source device used in the above-mentioned method includes the following steps:

[0061] S1: The copper block made of red copper is mechanically added to the shape of the chip workbench 2, and the flow channel through-hole is processed by deep hole drilling;

[0062] S2: welding the processed copper block and the copper plug to form a chip workbench 2 with a cooling water channel 4;

[0063] S3: The welded chip workbench 2 is machined and milled to form a high-precision working chip set 1 installation position;

[0064] S4: sandblasting the chip workbench 2 of the structurally processed core copper component, then nickel-plating the core copper component as a whole, and partially gold-plating the chip working surface;

[0065] S5: forming a high-precision assembly dimension structure by machining the aluminum upper shell 8 and the aluminum lower shell 9;

[0066] S6: After the aluminum upper shell 8 and the aluminum lower shell 9 that have been structurally processed are degreased and cleaned, the entire surface is subjected to micro-arc oxidation treatment;

[0067] S7: Assemble the surface-treated core copper component, the aluminum upper shell 8 and the aluminum lower shell 9 together to form a complete pump source for the laser.

[0068] The preparation method has rigorous steps, which enables precise control of the processing, welding, and assembly of the copper material, thereby improving the overall manufacturing accuracy of the device and ensuring the cooling performance and working stability of the pump source device.

[0069] In step S1, the deep hole drill uses an internally cooled drill bit. Of course, it should be noted that the present invention does not impose any restrictions on the specific working mode of the deep hole drill, and those skilled in the art can set it according to their needs. For example, the deep hole drill can be processed by a gun drill, and for another example, the deep hole drill can also be processed by a twist drill, as long as the accuracy of the processed cooling water channel 4 can meet the cooling requirements. Using an internally cooled drill bit for deep hole drilling can effectively reduce the heat and debris generated during the drilling process, improve processing efficiency and accuracy, ensure the smoothness and consistency of the cooling water channel 4, and provide a reliable channel for the subsequent cooling system.

[0070] In step S2, the chip workbench 2 and the cooling water channel 4 are both made of T2 copper. The use of T2 copper material to manufacture the chip workbench 2 and the cooling water channel 4 ensures the high thermal conductivity and corrosion resistance of the components, significantly improves the heat dissipation efficiency of the device, extends the service life of the pump source device, and ensures that the same material of the circulation circuit solves the problem of electrolytic corrosion of the flow channel, while having the characteristics of high temperature resistance.

[0071] In step S3, the relative height of the chip working surface and the chip gasket surface in the chip working group can be guaranteed to be within + / -0.01mm; the chip workbench 2 has a dimensional deformation of less than 3um under normal power-on and long-term operation at a water pressure of 0.35Mpa. At the same time, the structural design of the circular hole and the serrated cooling water channel 4 ensures the uniformity of the overall temperature of the working area, ensuring the stability and consistency of the laser chip during operation.

[0072] In step S4, the roughness of the chip workbench 2 is maintained at Ra0.4-0.8 by sandblasting surface treatment, and then the overall nickel plating is used to prevent the product from being oxidized and as a connection layer for subsequent local gold plating, and then the working chip group 1 installation position is locally gold plated for welding and assembling the subsequent working chip group 1. The surface roughness of the chip workbench 2 is maintained at Ra0.4-0.8 by sandblasting, and then the overall nickel plating and local gold plating are performed, which not only improves the reliability of the installation position of the working chip group 1, but also effectively prevents the oxidation corrosion of the copper material, and improves the durability and performance stability of the pump source device. Of course, it should be noted that the present invention does not impose any restrictions on the specific method of sandblasting, and those skilled in the art can set it according to their needs. For example, the sandblasting can be dry sandblasting, and for another example, the sandblasting can also be wet sandblasting, and it is also necessary to ensure that the roughness after sandblasting meets the requirements.

[0073] In step S5, the upper shell 8 and the lower shell 9 are the supporting and protective components of the chip workbench 2. Reasonable structural design and high-precision processing ensure its assembly with the copper heat dissipation component. The high-hardness appearance makes it not easy to deform and anti-bump, and the upper shell 8 and the lower shell 9 are made of 6013 aluminum.

[0074] In step S6, the upper shell 8 and the upper shell 8 after structural processing are degreased and cleaned, and then the entire surface is treated with micro-arc oxidation to form a dense oxide film on the surface to prevent corrosion. The oxide film can meet the performance requirements of salt spray, high temperature and high humidity, high temperature baking, hot and cold shock, alcohol resistance test, 3M coating peeling test, etc.

[0075] Embodiment 1:

[0076] Fabrication of core copper components:

[0077] The core copper components are made of T2 copper material to ensure high thermal conductivity. The implementation steps are as follows:

[0078] Select high-purity T2 copper and process it into a block structure that meets the design size;

[0079] Using deep hole drilling technology, a cooling water channel 4 is made 3-5 mm below the working surface of the chip; the cooling water channel 4 is designed as a circular hole structure with a diameter of 9 mm, and a serrated shape can also be selected to increase the heat dissipation contact area and improve the heat dissipation efficiency;

[0080] Through welding technology, the processed copper block is welded with T2 purple plugs (first connecting plug and second connecting plug) of the same material to form an integrated cooling circulation channel; the channel structure is designed into an "M" shape to ensure the circulation efficiency of the coolant.

[0081] After processing, the two chip workbenches are sandblasted to ensure that the surface roughness is within the range of Ra0.4-0.8, which is convenient for subsequent nickel plating and gold plating surface treatment to improve corrosion resistance and reliability.

[0082] Surface treatment process:

[0083] After the initial processing, the chip workbench 2 needs to be surface treated to improve its durability:

[0084] First, the chip workbench 2 is entirely nickel-plated to ensure that the copper surface is not corroded and to improve the durability of the component.

[0085] Partial gold plating is applied to the chip mounting area to improve welding stability and meet high conductivity requirements to adapt to long-term high-power working environments.

[0086] Production and surface treatment of upper shell 8 and lower shell 9:

[0087] The upper shell 8 and the lower shell 9 of the pump source are made by micro-arc oxidation surface treatment to enhance their mechanical strength and corrosion resistance. The implementation steps are as follows:

[0088] 6013 aluminum alloy material is selected and formed through mechanical processing to form a support structure that meets the size of the pump source.

[0089] After processing, the aluminum upper shell 8 and the aluminum lower shell 9 are pre-treated by cleaning and degreasing, and then subjected to micro-arc oxidation treatment to form a dense oxide film on the surface. The reflectivity of the film layer is less than 2.5%, thereby reducing the interference of the laser light path.

[0090] The aluminum cover after micro-arc oxidation has high hardness and corrosion resistance. Its salt spray resistance time can reach 1000 hours, and it can withstand UV light above 500°C. Its hardness reaches 1000HV, which greatly extends the service life of the component.

[0091] Assembly of core copper components and shell components:

[0092] The surface treated core copper component and the aluminum upper shell 8 and the aluminum lower shell 9 are assembled by screw fastening;

[0093] Place the core copper assembly on the aluminum lower shell 9 and fix it with screws to ensure the stability of the structure;

[0094] The aluminum upper shell 8 is assembled on the core copper component and fits tightly with the lower shell 9, and is assembled by screws to form a complete structure;

[0095] The final laser pump source structure has a heat dissipation capacity of 2.6KW to 5.2KW, is compact and can adapt to a variety of working environments;

[0096] The coolant inlet 6 and outlet 3 are designed outside the pump source and connected to the coolant supply system through threads. The coolant circulates in the flow channel of the core copper component, thereby achieving efficient heat dissipation;

[0097] The flow channel structure design ensures that the pressure drop of the coolant when flowing through is less than 62kPa, and the inlet and outlet water temperature difference is controlled at about 2°C. When the cooling water channel 4 adopts a flow channel structure with a circular saw-shaped cross-section, compared with the circular hole design, the contact area is increased, the heat dissipation capacity is improved by about 1°C, and the thermal expansion effect of the chip working surface is reduced.

[0098] Performance Test:

[0099] In order to verify the durability and heat dissipation effect of the pump source component, the present invention adopts a series of rigorous tests:

[0100] After 24-hour salt spray test, high temperature and high humidity, cold and hot shock and alcohol resistance test;

[0101] In the long-term working test with water and power on at a water pressure of 0.35MPa, the size variation of the core components was less than 3um, ensuring the welding accuracy and optical path stability of the laser chip.

[0102] Embodiment 2:

[0103] like Figure 4 As shown, on the basis of Example 1, the cooling water channel 4 in the present invention can be set as a plurality of water supply pipes directly below the corresponding working chipset group 1, the first connecting plug and the second connecting plug are removed, and a U-shaped tube 10 is installed at the notch, so that the plurality of water supply pipes are directly connected through the U-shaped tube 10 to form an M-shaped curved cooling water channel 4 folding structure. If the cooling water channel 4 is an M-shaped structure composed of a plurality of water supply pipes, the water flows in the plurality of curved water supply pipes to improve the fluidity of the cooling water, thereby improving the heat dissipation efficiency. Of course, it should be noted that the present invention does not impose any restrictions on the cooling water channel structure formed by the connection of the water supply pipe and the U-shaped tube 10, and those skilled in the art can set it according to their needs. For example, the cooling water channel 4 can be a combination of a plurality of M-shaped structures, and for another example, the cooling water channel 4 can also be a combination of N-shaped structures, as long as the cooling water channel can be set one by one directly below each chip working group.

[0104] So far, the technical solutions of the present invention have been described in conjunction with the optional implementation modes shown in the accompanying drawings, but it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific implementation modes. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A laser pump source device, characterized in that: The pump source device comprises a core copper component and an aluminum shell component, wherein; The core copper component includes a chip workbench, a first connecting plug and a second connecting plug, and a plurality of working chip groups are arranged and distributed on the chip workbench; the vertical direction of the working chip groups is the first direction, and the horizontal direction of the working chip groups is the second direction; a cooling water channel is formed in the chip workbench, and two adjacent cooling water channel openings are provided with communicating countersunk holes, and the cooling water channels are correspondingly arranged directly below the working chipset, and the cooling water channels penetrate the chip workbench along the first direction, and the first connecting plug and the second connecting plug are respectively sealed and arranged at both ends of the cooling water channel, and the first connecting plug and the second connecting plug are staggered so that water flows in the plurality of cooling water channels in sequence; The aluminum housing assembly is installed to wrap the chip workbench to provide protection support for the chip workbench and assembly of other structural parts.

2. The laser pump source device according to claim 1, characterized in that: The cooling water channel is configured to correspond to multiple water supply pipes directly below the working chipset, and the multiple water supply pipes are connected by a U-shaped connecting pipe to form an M-shaped bent and folded structure, or the cooling water channel is configured to occupy an independent cooling space inside the entire chip workbench, and the two sides of the cooling space are respectively sealed by the first connecting plug and the second connecting plug, and the first connecting plug and the second connecting plug are small copper parts with a circular arc contour design.

3. The laser pump source device according to claim 1, characterized in that: The aluminum shell assembly includes an upper shell and a lower shell. The upper shell is wrapped around the upper side of the chip workbench where the working chipset is set. The area of ​​the upper shell corresponding to the working chipset is set to an open structure so that the working chipset can be connected to other devices; the lower shell is wrapped around the lower side of the chip workbench, and the upper shell and the lower shell are fixed and installed by bolts.

4. The laser pump source device according to claim 2, characterized in that: The cross section of the cooling water channel is a circular, sawtooth or special-shaped hole structure, and the first connecting plug and the second connecting plug are arranged to be a circular, sawtooth or special-shaped structure corresponding to the cooling water channel.

5. The laser pump source device according to claim 1, characterized in that: The core copper component also includes a water inlet and a water outlet. The water inlet is arranged on one side of the chip workbench, and the water inlet is connected to the first end of the cooling water channel on one edge side; the water outlet is arranged on the other side of the chip workbench, and the water outlet is connected to the first end of the cooling water channel on the other edge side.

6. The laser pump source device according to claim 5, characterized in that: The water inlet end, the cooling water channel, the first connecting plug, the second connecting plug and the water outlet end form an M-shaped flow channel structure.

7. A preparation method for the laser pump source device as claimed in any one of claims 1 to 6, characterized in that: The preparation method comprises the following steps: S1: machining a copper block into the shape of a chip workbench by mechanical processing, and processing cooling water channel holes by deep hole drilling; S2: welding the processed copper block and the copper plug to form a chip workbench with a cooling water channel; S3: The welded chip workbench is machined and milled to form a core copper component of a high-precision working chip set installation position; S4: sandblasting the working chip group installation position of the core copper component after structural processing, then nickel-plating the core copper component as a whole, and then partially gold-plating the chip working surface; S5: forming a high-precision assembly dimension structure by machining the aluminum upper shell and the aluminum lower shell; S6: After the aluminum upper shell and the aluminum lower shell that have been structurally processed are degreased and cleaned, the entire surface is subjected to micro-arc oxidation treatment; S7: Assemble the surface-treated core copper component, the aluminum upper shell and the aluminum lower shell together to form a complete pump source for the laser.

8. The preparation method according to claim 7, characterized in that: In step S1, the deep hole drilling uses an internally cooled drill bit.

9. The preparation method according to claim 7, characterized in that: In step S4, the chip workbench is maintained at a roughness of Ra0.4-0.8 by sandblasting surface treatment, and then the entire product is nickel-plated to prevent oxidation of the product and serve as a connection layer for subsequent local gold plating. Then, local gold plating is performed at the working chip group installation position for welding and assembly of the subsequent working chipset.

10. The preparation method according to claim 7, characterized in that: In step S2, the chip workbench and the plug are both made of T2 copper.

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