Air tightness test method and system of MPCVD equipment, MPCVD equipment and medium

Abstract

The invention discloses an air tightness test method and system for MPCVD equipment, the MPCVD equipment and a medium, and the method comprises the steps: carrying out the vacuum pumping of the MPCVD equipment after the MPCVD equipment is baked, so as to enable the MPCVD equipment to be in a vacuum closed state; performing a pressure maintaining test on the MPCVD equipment to obtain pressure change data of the MPCVD equipment; according to the pressure change data, obtaining an air tightness test result of the MPCVD equipment; and if the air tightness test result is that the test is not passed, determining a fault part of the MPCVD equipment. According to the invention, the air tightness test difficulty of the MPCVD equipment can be reduced, and the air tightness test efficiency and test accuracy are improved.

Description

Technical Field

[0001] The present application relates to the technical field of air tightness detection, and in particular to an air tightness testing method and system for MPCVD equipment, MPCVD equipment and medium. Background Art

[0002] The mainstream method of growing diamonds is MPCVD (Microwave Plasma Chemical Vapor Deposition). The principle is to build a vacuum environment in the cavity and then introduce reaction gas. The reaction gas forms plasma under the ionization of microwaves. The C (carbon) element in the plasma is continuously deposited on the diamond surface to achieve the growth of diamond. If you want to get pure diamond crystals, the reaction gas must be pure and cannot contain air and water vapor other than the reaction gas. Therefore, the airtightness of MPCVD equipment is crucial.

[0003] However, the airtightness test of the MPCVD equipment in the prior art solution is relatively complicated.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] The main purpose of this application is to provide an MPCVD equipment airtightness testing method, system, MPCVD equipment and medium, aiming to solve the problems in the prior art that the MPCVD equipment airtightness testing is relatively complicated and the testing accuracy and efficiency are low.

[0006] A first aspect of an embodiment of the present application provides an airtightness test method for an MPCVD device, the airtightness test method for the MPCVD device comprising: after the MPCVD device is baked, vacuuming the MPCVD device to put the MPCVD device in a vacuum-sealed state; performing a pressure-maintaining test on the MPCVD device to obtain pressure change data of the MPCVD device; obtaining an airtightness test result of the MPCVD device based on the pressure change data; if the airtightness test result is that the test fails, determining the fault location of the MPCVD device.

[0007] Optionally, in one embodiment of the present application, the MPCVD device is vacuumed to place the MPCVD device in a vacuum-sealed state, and the process also includes: setting baking conditions for the MPCVD device; and performing a baking operation on the MPCVD device according to the baking conditions to complete the baking of the MPCVD device.

[0008] Optionally, in one embodiment of the present application, the MPCVD equipment includes a process air inlet pipeline system, a chamber system and an exhaust pipeline system; the process air inlet pipeline system includes a gas regulating component and a first valve group, the gas regulating component is connected to the first valve group, the first valve group is connected to the chamber system, the exhaust pipeline system includes a second valve group, and the chamber system is connected to the second valve group; the vacuuming of the MPCVD equipment to put the MPCVD equipment in a vacuum-sealed state specifically includes: adjusting the first valve group and the second valve group to vacuum the MPCVD equipment to a vacuum limit; after maintaining the vacuum limit for more than a preset time, adjusting the first valve group and the second valve group to put the MPCVD equipment in a vacuum-sealed state.

[0009] Optionally, in one embodiment of the present application, the pressure change data is a pressure holding rate; the pressure holding test on the MPCVD device to obtain the pressure change data of the MPCVD device specifically includes: obtaining an initial air pressure value of the MPCVD device; performing a first time pressure holding test on the MPCVD device, and if it is judged that the air pressure change of the MPCVD device exceeds a preset value based on the initial air pressure value, obtaining the air pressure change amount and change time of the MPCVD device; and calculating the pressure holding rate of the MPCVD device based on the air pressure change amount and the change time.

[0010] Optionally, in one embodiment of the present application, the airtightness test result of the MPCVD equipment is obtained based on the pressure change data, specifically: if the pressure holding rate is within a preset threshold range, it is determined that the airtightness of the MPCVD equipment has passed the test; if the pressure holding rate is outside the preset threshold range, it is determined that the airtightness of the MPCVD equipment has failed the test.

[0011] Optionally, in one embodiment of the present application, the MPCVD device is subjected to a pressure-maintaining test to obtain pressure change data of the MPCVD device, and then further includes: performing a second time pressure-maintaining test on the MPCVD device, and obtaining an interval air pressure value of the MPCVD device at each preset interval time, wherein the second time is longer than the first time; calculating an average pressure-maintaining rate of the MPCVD device based on the preset interval time and the interval air pressure value; if the average pressure-maintaining rate is within the preset threshold range, determining that the MPCVD device has passed the test.

[0012] Optionally, in one embodiment of the present application, if the result of the airtightness test is that the test fails, determining the fault location of the MPCVD device specifically includes: When the air tightness test result is that the test fails, a pressure test is performed on the cavity system. If the pressure test of the cavity system passes, a pressure test is performed on the process air inlet pipe system. If the pressure test of the process air inlet pipe system passes, a pressure test is performed on the exhaust pipe system. If the pressure test of the cavity system fails, it is determined that the faulty part is the cavity system. If the pressure test of the process air inlet pipe system fails, it is determined that the faulty part is the process air inlet pipe system. If the pressure test of the exhaust pipe system fails, it is determined that the faulty part is the exhaust pipe system.

[0013] The second aspect of the embodiment of the present application further provides a gas tightness test system for MPCVD equipment, wherein the gas tightness test system for MPCVD equipment comprises: A vacuum extraction module, used for vacuuming the MPCVD device after baking the MPCVD device, so that the MPCVD device is in a vacuum-sealed state; An equipment pressure-maintaining test module, used to perform a pressure-maintaining test on the MPCVD equipment to obtain pressure change data of the MPCVD equipment; A data processing module, used to obtain the air tightness test result of the MPCVD equipment according to the pressure change data; A fault determination module is used to determine the fault location of the MPCVD equipment if the airtightness test result is that the test fails.

[0014] The third aspect of an embodiment of the present application also provides an MPCVD device, wherein the MPCVD device includes: a memory, a processor, and an airtightness test program for the MPCVD device stored in the memory and executable on the processor, wherein the airtightness test program for the MPCVD device, when executed by the processor, implements the steps of the airtightness test method for the MPCVD device as described above.

[0015] The fourth aspect of an embodiment of the present application also provides a computer-readable storage medium, wherein the computer-readable storage medium stores an airtightness test program for MPCVD equipment, and when the airtightness test program for MPCVD equipment is executed by a processor, the steps of the airtightness test method for MPCVD equipment as described above are implemented.

[0016] Beneficial effects: The present application provides an MPCVD equipment airtightness testing method, system, MPCVD equipment and medium. The method enables the MPCVD equipment to reach the required vacuum state, and then performs a pressure holding calculation to determine the airtightness. If there is a problem with the airtightness, a further pressure holding test is performed to determine the specific location of the problem, thereby more accurately locating the problem and taking corresponding measures to repair it, thereby reducing the difficulty of MPCVD equipment airtightness testing and improving airtightness testing efficiency and test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 In the preferred embodiment of the air tightness testing method of the MPCVD device of the present application, please refer to the gas circuit diagram of the MPCVD device; Figure 2 It is a flow chart of a preferred embodiment of the airtightness testing method of the MPCVD equipment of the present application; Figure 3 It is a structural diagram of a preferred embodiment of the airtightness test system of the MPCVD equipment of the present application; Figure 4 This is a structural diagram of a preferred embodiment of the MPCVD equipment of the present application.

[0019] Description of reference numerals: V1, first valve; V2, second valve; V3, third valve; V4, fourth valve; V5, fifth valve; V6, sixth valve; 100, vacuum extraction module; 200, equipment pressure test module; 300, data processing module; 400, fault determination module. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and effect of the present application clearer and more specific, the technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. The described embodiments are only possible technical implementations of the present application, not all possible implementations. Based on the embodiments in the present application, those skilled in the art can completely combine the embodiments of the present application to obtain other embodiments without creative work, and these embodiments are also within the scope of protection of the present application.

[0021] First, the nouns involved in the embodiments of the present application are introduced: MPCVD: Microwave Plasma Chemical Vapor Deposition; H2: Hydrogen; O2: oxygen; sccm: Standard Cubic Centimeter per Minute, used to indicate gas flow; Torr: Torr, a unit of pressure, commonly used in vacuum technology, 1Torr = 1 / 760atm (atmospheric pressure); mTorr: Milli-Torr, one thousandth of a Torr.

[0022] Secondly, the following will be combined with the attached Figure 1 , the MPCVD equipment of the embodiment of the present application is introduced.

[0023] In the embodiment of the present application, the MPCVD device is a microwave plasma chemical vapor deposition device. The MPCVD device includes a process gas inlet pipeline system, a cavity system and an exhaust pipeline system; the process gas inlet pipeline system includes a gas regulating component and a first valve V1 group, the gas regulating component is connected to the first valve V1 group, the first valve V1 group is connected to the cavity system, the exhaust pipeline system includes a second valve V2 group, and the cavity system is connected to the second valve V2 group.

[0024] It can be understood that the gas circuit of the MPCVD equipment includes a process gas inlet pipeline system, an upper chamber, a lower chamber and a gas extraction pipeline system, wherein the process gas inlet pipeline system contains multiple gas mass flow controllers (MFC, Mass Flow Controller) and corresponding control valves for accurately controlling the flow of the reaction gas.

[0025] For details, see Figure 1 The chamber system includes an upper chamber and a lower chamber, the second valve V2 group includes a first valve V1, a second valve V2, a third valve V3 and a fourth valve V4, and the first valve V1 group includes a fifth valve V5 and a sixth valve V6. The fifth valve V5 and the sixth valve V6 are connected to the upper chamber respectively, the upper chamber is connected to the lower chamber, the lower chamber is connected to the third valve V3 and the second valve V2 respectively, the third valve V3 is connected to the fourth valve V4, the second valve V2 and the fourth valve V4 are connected to the first valve V1 respectively, and the first valve V1 is connected to the rotary vane vacuum pump so that the equipment can be vacuumed.

[0026] It should be noted that the process air inlet pipeline system is connected to the upper cavity through the MFC and corresponding control valves (such as manual ball valves, proportional control valves) to provide the required reaction gases (such as H2, CH4, O2, etc.) for the reaction; the upper cavity and the lower cavity are connected in some way to form a closed reaction chamber; the exhaust pipeline system is connected to the lower cavity, and the waste gas after the reaction is extracted through multiple valves and exhaust ports to maintain the vacuum environment of the reaction chamber; the cleaning gas circuit and the vacuum breaking gas circuit are used for cleaning and vacuum breaking operations of the equipment.

[0027] Furthermore, the first valve V1 , the second valve V2 , the third valve V3 , the fifth valve V5 and the sixth valve V6 are all pneumatic diaphragm valves, and the fourth valve V4 is a proportional control valve.

[0028] The working principle of the MPCVD equipment gas circuit is: by precisely controlling the flow rate and ratio of the reaction gas, the reaction gas is sent into the reaction chamber formed by the upper cavity and the lower cavity. Under the action of microwaves, the reaction gas is ionized to form plasma, and the C element in the plasma is continuously deposited on the diamond substrate to form a diamond film. At the same time, the exhaust pipeline system extracts the waste gas after the reaction to maintain the vacuum and cleanliness of the reaction chamber. Throughout the process, MFC and valves play a key role in precisely controlling and regulating the gas flow and flow direction, ensuring the stability and quality of diamond growth.

[0029] The following describes the air tightness testing method, system, MPCVD equipment and medium of the MPCVD equipment of the embodiment of the present application with reference to the accompanying drawings. In view of the problem that the air tightness testing of MPCVD equipment in the above-mentioned related art is relatively complicated, the present application provides an air tightness testing method for MPCVD equipment. In this method, the MPCVD equipment is brought to the required vacuum state, and then a pressure holding calculation is performed to determine the air tightness. If there is a problem with the air tightness, a further pressure holding test is performed to determine the specific location of the problem, so as to more accurately locate the problem and take corresponding measures to repair it, thereby reducing the difficulty of air tightness testing of MPCVD equipment and improving the efficiency and accuracy of air tightness testing. As a result, the technical problem that the air tightness testing of MPCVD equipment in the related art is relatively complicated is solved.

[0030] The technical solution of the present application is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0031] The air tightness testing method of the MPCVD equipment described in the preferred embodiment of the present application is as follows: Figure 2 As shown, the air tightness testing method of the MPCVD equipment comprises the following steps: In step S101, after the MPCVD device is baked, the MPCVD device is evacuated to put the MPCVD device in a vacuum-sealed state.

[0032] In a possible implementation, during baking of the MPCVD device before vacuuming the device, baking conditions of the MPCVD device are set; and the MPCVD device is baked according to the baking conditions to complete baking of the MPCVD device.

[0033] Specifically, select the appropriate baking conditions: select the appropriate molybdenum sheet combination; set the gas flow rate: H2 is 200sccm, O2 is 2sccm; set the power: above 5500W; set the gas pressure range: 145Torr-160Torr; set the temperature range: 800℃-1000℃ (try to take the highest value); set the baking time: 2-4 hours. Perform the baking operation: start the baking program according to the set conditions; monitor the temperature, gas pressure and other parameters during the baking process to ensure stability. The purpose of this step is to remove moisture, impurities, etc. inside the equipment through baking, so as to improve the cleanliness and stability of the equipment.

[0034] In a possible implementation, the first valve group and the second valve group are adjusted to evacuate the MPCVD device to a vacuum limit; after maintaining the vacuum limit for more than a preset time, the first valve group and the second valve group are adjusted to place the MPCVD device in a vacuum-sealed state.

[0035] Specifically, after baking, the equipment is evacuated to the vacuum limit (also called vacuum background), and this background is maintained for more than 30 minutes. It should be noted that the vacuum cannot be broken. The valves that need to be opened for vacuuming include the first valve, the second valve, the third valve, the fourth valve, and the fifth valve, as well as the mechanical pump. The purpose of this step is to further clean the inside of the equipment, remove residual gas, and prepare for the pressure holding test.

[0036] After pumping to the background, close the fifth valve, the first valve and the mechanical pump in turn. Keep the second valve, the third valve and the fourth valve open. The purpose of this step is to adjust the equipment state and create a closed environment for the pressure test.

[0037] In step S102, a pressure holding test is performed on the MPCVD equipment to obtain pressure change data of the MPCVD equipment.

[0038] In a possible implementation, the pressure change data is a pressure holding rate. The initial air pressure value of the MPCVD device is obtained; the MPCVD device is subjected to a first time pressure holding test, and if it is determined that the air pressure change of the MPCVD device exceeds a preset value according to the initial air pressure value, the air pressure change amount and change time of the MPCVD device are obtained; and the pressure holding rate of the MPCVD device is calculated according to the air pressure change amount and the change time.

[0039] Specifically, record the background pressure value, accurately record the time and value of the pressure change, and then calculate the pressure holding rate based on the pressure change and time. The purpose of this step is to evaluate the air tightness of the equipment in a short period of time. Short-term pressure holding is a method for preliminary evaluation of the air tightness of the equipment, providing a reference for subsequent long-term pressure holding and troubleshooting.

[0040] Furthermore, during the preparation stage, ensure that the MPCVD equipment has been baked and the internal environment meets the test requirements, close unnecessary valves and interfaces in the equipment, and ensure the closedness of the test environment. Turn on the process timer, prepare to record data, record the pressure holding background value, and before starting the pressure holding test, record the initial air pressure value (background value) inside the equipment, such as 5mTorr.

[0041] For a short-time pressure-holding test, click the "Start" button of the process timer to start recording the time; observe the pressure change: accurately record the time point when the pressure value starts to change (for example, the time from 5mTorr to 6mTorr); record the end time: when the pressure change reaches or exceeds 1mTorr, record the end time (for example, the time from 6mTorr to 11mTorr); calculate the pressure holding rate: calculate the result of the short-time pressure holding based on the recorded time and pressure change value (for example, 25min / mTorr, i.e. 2.4mTorr / h, 57.6mTorr / 24h).

[0042] In step S103, the airtightness test result of the MPCVD equipment is obtained according to the pressure change data.

[0043] In a possible implementation, the airtightness test result also includes a test pass. If the pressure holding rate is within a preset threshold range, it is determined that the airtightness of the MPCVD device has passed the test; if the pressure holding rate is outside the preset threshold range, it is determined that the airtightness of the MPCVD device has failed the test.

[0044] Specifically, the pressure holding data is processed and analyzed. Based on the recorded pressure holding data, the pressure holding rate is calculated and whether the pressure holding data is stable is analyzed. If the pressure holding value deviates significantly from the average value, it is considered abnormal.

[0045] Further, judge the short-time pressure holding result. If the tested pressure holding rate is within the qualified range, the short-time pressure holding test passes. If the tested pressure holding rate is unqualified, it is necessary to readjust the test conditions and re-test the short-time pressure holding test. When retesting, the pressure change time of the first 3mTorr-5mTorr can be used as the new start time, and the 1-N (N≥2) mTorr change after the accurate test can be used as the end time to calculate the pressure holding.

[0046] In the embodiment of the present application, the calculation of short-time (i.e., the first time) pressure holding is as follows: click "Start" on the process timer, record the background value of the pressure holding (for example, the background is 5mTorr), take a photo or record it in a notebook. For short-time pressure holding, it is necessary to accurately record the time when the value jumps and changes (for example, the time from 5 to 6mTorr is 15min30s), and the end time recorded when the test pressure just jumps (pressure change ≥1mTorr) (for example, from 6mTorr to 11mTorr, the time is 2h20min30s). At this time, the result of short-time pressure holding can be calculated (for example: (2h20min30s-15min30s) / (11mTorr-6mTorr)=25min / mTorr, i.e., 2.4mTorr / h, 57.6 mTorr / 24h). Generally speaking, taking the above example, if the pressure holding test fails, the time after the first 3mTorr-5mTorr change needs to be used as the start time, and the 1-N (N≥2) mTorr change after the precise test needs to be used as the end time to calculate the pressure holding.

[0047] In one possible implementation, a second time pressure holding test is performed on the MPCVD device, and an interval gas pressure value of the MPCVD device at each preset interval time is obtained, wherein the second time is longer than the first time; based on the preset interval time and the interval gas pressure value, an average pressure holding rate of the MPCVD device is calculated; if the average pressure holding rate is within the preset threshold range, it is determined that the MPCVD device has passed the test.

[0048] It is understood that the pressure holding data is recorded every hour and the average pressure holding rate is calculated. The purpose is to evaluate the airtightness stability of the equipment over a long period of time.

[0049] Specifically, start long-term pressure holding: after the short-term pressure holding test is passed, perform a long-term pressure holding test; record data: record the air pressure value at regular intervals (for example, every hour); calculate the average pressure holding rate: based on the recorded data, calculate the average rate of long-term pressure holding; judge the result of long-term pressure holding: if the average pressure holding rate is within the qualified range and the air pressure change per hour is not much different, the long-term pressure holding test is passed; if the pressure holding situation deviates significantly from the average value, it is regarded as abnormal and the air tightness of the equipment needs to be further checked.

[0050] In the embodiment of the present application, the pressure is maintained for a long time (i.e., the second time), and the method is the same as above, but there is no need to clearly and accurately determine the air pressure jump time (for example, the conditions for starting timing are: 5mTorr, time is 0, and the panel display after more than 18 hours is: 20h45min20s, 45mTorr, which can be directly calculated as (45mTorr-5mTorr) / (20h45min20s-0)=1.93mTorr / h), and a test for long-time pressure maintenance calculation is performed. That is, long-term pressure holding calculation: the processing method is the same as above, the data of the first hour (for example, 10mTorr) after the process timer starts, and then the pressure holding data of the 2nd / 3rd / 4th... hours are recorded respectively (for example: 15 / 19 / 24...), and a relatively accurate pressure holding data can be roughly calculated: (24-10) / 3=4.67mTorr / h. At the same time, it is also necessary to ensure that the difference between each hour is not too large. If there is a pressure holding value that deviates significantly from the average value, it is regarded as an abnormality. Under the condition of not breaking the vacuum, the specific pressure holding data per minute should be calculated according to the short-time pressure holding calculation test method.

[0051] In step S104, if the result of the airtightness test is that the test fails, the fault location of the MPCVD equipment is determined.

[0052] In one possible implementation, when the air tightness test result is that the test fails, a pressure test is performed on the cavity system; if the pressure test of the cavity system passes, a pressure test is performed on the process air inlet pipe system; if the pressure test of the process air inlet pipe system passes, a pressure test is performed on the exhaust pipe system; if the pressure test of the cavity system fails, it is determined that the faulty part is the cavity system; if the pressure test of the process air inlet pipe system fails, it is determined that the faulty part is the process air inlet pipe system; if the pressure test of the exhaust pipe system fails, it is determined that the faulty part is the exhaust pipe system.

[0053] It is understandable that the air tightness test of each system of the equipment is carried out according to the results of short-time pressure holding and long-time pressure holding. The purpose is to locate and solve the air tightness problem of the equipment.

[0054] Specifically, analyze the results of the short-time pressure test: If the short-time pressure test fails, it means that there is a problem with the airtightness of the equipment. At this time, it is necessary to observe and record the specific value and time of the air pressure change for subsequent analysis. Preliminary judgment of the scope of the fault: According to the results of the short-time pressure test, it is preliminarily judged that the fault may be located in the process air intake pipe system, cavity system or exhaust pipe system. Usually, if the air pressure rises rapidly in a short period of time, there may be a leak in the cavity system or the process air intake pipe system; if the air pressure rises slowly, it may be that the exhaust pipe system is inefficient or leaking.

[0055] Perform a pressure test on the cavity system: close the second valve, the third valve, and the fifth valve to ensure that the cavity system is in a closed state, perform a pressure test, observe and record the changes in air pressure. If the cavity system pressure test passes, it means that the cavity itself has good air tightness and the fault may be in other systems. If the cavity system pressure test fails, it means that there is a leak in the cavity system and further inspection and repair are required.

[0056] Perform a pressure test on the process air inlet pipeline system. After the chamber system pressure test passes, close the sixth valve, the second valve and the third valve, open the fifth valve, ensure that the process air inlet pipeline system is in a closed state, perform a pressure test, observe and record the air pressure changes. If the process air inlet pipeline system pressure test passes, it means that the air tightness of the process air inlet pipeline system is good; if the process air inlet pipeline system pressure test fails, it means that there is a leak in the process air inlet pipeline system, and each process gas inlet pipeline needs to be further inspected and repaired.

[0057] Perform a pressure test on the exhaust pipe system. After the process air inlet pipe system passes the pressure test, close the fifth valve and the sixth valve to ensure that the exhaust pipe system is in a closed state. Perform a pressure test and observe and record the air pressure changes. If the exhaust pipe system passes the pressure test, it means that the air tightness of the exhaust pipe system is good. If the exhaust pipe system fails the pressure test, it means that there is a leak in the exhaust pipe system or the efficiency is reduced, and further inspection and repair are required.

[0058] Comprehensive analysis and determination of fault location: Based on the above test results, comprehensive analysis and determination of the fault location. If multiple system tests fail, further investigation and determination of the specific location of the fault may be required. Finally, a repair plan is developed based on the determined fault location. After the repair is implemented, the repaired equipment is tested again to ensure that the air tightness of the equipment meets the requirements.

[0059] In the embodiment of the present application, if there is no problem with short-term pressure maintenance, it means that there is no problem with the air tightness of the equipment, and then growth can be carried out. If there is a problem with short-term pressure maintenance, it means that there is a problem with the air tightness of the equipment. At this time, it is necessary to maintain the pressure of the process air inlet pipeline system, the cavity system and the exhaust pipeline system respectively. To maintain the pressure of the cavity, it is necessary to close V2, V3 and V5. If there is no problem with the pressure maintenance, then perform a pressure maintenance test on the process air inlet pipeline system. The pressure maintenance method of the process air inlet pipeline system is: close V6, V2, V3, and open V5. If there is no problem with the pressure maintenance, it means that the air tightness of the exhaust pipeline system is not good. If there is a problem with the pressure maintenance, it means that there is a problem with the process air inlet pipeline system. In this case, it is necessary to perform a pressure maintenance test on each process gas intake pipeline. To maintain the pressure of the exhaust pipeline system, it is necessary to close V5 and V6 and perform a pressure maintenance test.

[0060] It is understandable that drying before pressure holding is to remove moisture in the system caused by cleaning. The pressure sensor is in the lower cavity, so the above method is used for pressure holding test.

[0061] Next, the airtightness testing system of the MPCVD equipment proposed in accordance with the embodiment of the present application is described with reference to the accompanying drawings.

[0062] Figure 3 It is a structural diagram of the airtightness testing system of the MPCVD equipment in an embodiment of the present application.

[0063] like Figure 3 As shown, the airtightness testing system of the MPCVD equipment includes: a vacuum extraction module 100 , an equipment pressure holding test module 200 , a data processing module 300 and a fault determination module 400 .

[0064] Specifically, the vacuum extraction module 100 is used to perform vacuum treatment on the MPCVD device after the MPCVD device is baked, so that the MPCVD device is in a vacuum-sealed state; The equipment pressure-maintaining test module 200 is used to perform a pressure-maintaining test on the MPCVD equipment to obtain pressure change data of the MPCVD equipment; A data processing module 300 is used to obtain the airtightness test result of the MPCVD device according to the pressure change data; The fault determination module 400 is used to determine the fault location of the MPCVD device if the airtightness test result is that the test fails.

[0065] Figure 4 This is a structural diagram of the MPCVD device provided in the embodiment of the present application. The MPCVD device may include: A memory 501 , a processor 502 , and a computer program stored in the memory 501 and executable on the processor 502 .

[0066] When the processor 502 executes the program, the airtightness testing method of the MPCVD equipment provided in the above embodiment is implemented.

[0067] Furthermore, the MPCVD device further comprises: The communication interface 503 is used for communication between the memory 501 and the processor 502 .

[0068] The memory 501 is used to store computer programs that can be executed on the processor 502 .

[0069] The memory 501 may include a high-speed RAM memory, and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

[0070] If the memory 501, the processor 502 and the communication interface 503 are implemented independently, the communication interface 503, the memory 501 and the processor 502 can be connected to each other through a bus and communicate with each other. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component (PCI) bus or an Extended Industry Standard Architecture (EIS) bus. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 4 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0071] Optionally, in a specific implementation, if the memory 501, the processor 502 and the communication interface 503 are integrated on a chip, the memory 501, the processor 502 and the communication interface 503 can communicate with each other through an internal interface.

[0072] The processor 502 may be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application.

[0073] This embodiment also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the above-mentioned method for testing the airtightness of the MPCVD equipment.

[0074] One embodiment of the present application provides a computer program product, including a computer program, which, when executed by a processor, implements the present application Figure 1 The airtightness testing method of the MPCVD equipment provided in any embodiment of the corresponding embodiment.

[0075] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or N embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0076] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "N" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0077] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code comprising one or N executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present application belong.

[0078] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as an ordered list of executable instructions for implementing logical functions, and can be embodied in any computer-readable storage medium for use by an instruction execution system, device or apparatus (such as a computer-based system, a system including a processor, or other system that can fetch instructions from an instruction execution system, device or apparatus and execute instructions), or in combination with these instruction execution systems, devices or apparatuses. For the purposes of this specification, a "computer-readable storage medium" can be any device that can contain, store, communicate, propagate or transmit a program for use by an instruction execution system, device or apparatus, or in combination with these instruction execution systems, devices or apparatuses. More specific examples (non-exhaustive list) of computer-readable storage media include the following: an electrical connection with one or N wirings (electronic device), a portable computer disk box (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disk read-only memory (CDROM). In addition, the computer-readable storage medium may even be paper or other suitable medium on which the program is printed, since the program can be obtained electronically by optically scanning the paper or other medium and then editing, interpreting or processing in other suitable ways as necessary, and then storing it in a computer memory.

[0079] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above embodiment, N steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0080] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

[0081] In addition, each functional unit in each embodiment of the present application may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0082] The storage medium mentioned above may be a read-only memory, a magnetic disk or an optical disk, etc. Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application. A person of ordinary skill in the art may change, modify, replace and modify the above embodiments within the scope of the present application.

[0083] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for testing the air tightness of an MPCVD device, characterized in that: The air tightness testing method of the MPCVD equipment comprises: After the MPCVD device is baked, the MPCVD device is evacuated to place the MPCVD device in a vacuum-sealed state; Performing a pressure holding test on the MPCVD device to obtain pressure change data of the MPCVD device; Obtaining an airtightness test result of the MPCVD device according to the pressure change data; If the result of the airtightness test is that the test fails, the fault location of the MPCVD equipment is determined.

2. The airtightness testing method of MPCVD equipment according to claim 1, characterized in that: The MPCVD device is subjected to vacuum treatment so as to be in a vacuum-sealed state, and the process also includes: Setting the baking conditions of the MPCVD equipment; The MPCVD device is baked according to the baking conditions to complete the baking of the MPCVD device.

3. The airtightness testing method of MPCVD equipment according to claim 1, characterized in that: The MPCVD equipment includes a process gas inlet pipeline system, a chamber system and a gas extraction pipeline system; the process gas inlet pipeline system includes a gas regulating component and a first valve group, the gas regulating component is connected to the first valve group, the first valve group is connected to the chamber system, the gas extraction pipeline system includes a second valve group, and the chamber system is connected to the second valve group; The vacuuming of the MPCVD device to place the MPCVD device in a vacuum-sealed state specifically includes: adjusting the first valve group and the second valve group to evacuate the MPCVD device to a vacuum limit; After the vacuum limit is maintained for more than a preset time, the first valve group and the second valve group are adjusted so that the MPCVD equipment is in a vacuum-sealed state.

4. The airtightness testing method of MPCVD equipment according to claim 3, characterized in that: The pressure change data is the pressure holding rate; The pressure-maintaining test of the MPCVD device to obtain the pressure change data of the MPCVD device specifically includes: Obtaining an initial gas pressure value of the MPCVD device; Performing a first time pressure holding test on the MPCVD device, and if it is determined according to the initial pressure value that the pressure change of the MPCVD device exceeds a preset value, obtaining the pressure change amount and change time of the MPCVD device; The pressure holding rate of the MPCVD device is calculated according to the gas pressure change and the change time.

5. The airtightness testing method of MPCVD equipment according to claim 4, characterized in that: The air tightness test result of the MPCVD device is obtained according to the pressure change data, specifically: If the pressure holding rate is within a preset threshold range, it is determined that the airtightness of the MPCVD device has passed the test; If the pressure holding rate is outside the preset threshold range, it is determined that the airtightness of the MPCVD equipment has failed the test.

6. The airtightness testing method of MPCVD equipment according to claim 5, characterized in that: The MPCVD device is subjected to a pressure-maintaining test to obtain pressure change data of the MPCVD device, and further comprises: Performing a second time pressure holding test on the MPCVD device, and obtaining an interval gas pressure value of the MPCVD device at each preset interval time, wherein the second time is longer than the first time; Calculate the average pressure holding rate of the MPCVD device according to the preset interval time and the interval gas pressure value; If the average pressure holding rate is within the preset threshold range, it is determined that the MPCVD equipment has passed the test.

7. The airtightness testing method of MPCVD equipment according to claim 5, characterized in that: If the result of the airtightness test is that the test fails, determining the fault location of the MPCVD device specifically includes: When the result of the air tightness test is that the test fails, a pressure holding test is performed on the chamber system; if the pressure holding test of the chamber system passes, a pressure holding test is performed on the process air intake pipeline system; if the pressure holding test of the process air intake pipeline system passes, a pressure holding test is performed on the exhaust pipeline system; If the pressure-maintaining test of the cavity system fails, it is determined that the faulty part is the cavity system; if the pressure-maintaining test of the process air intake pipe system fails, it is determined that the faulty part is the process air intake pipe system; if the pressure-maintaining test of the exhaust pipe system fails, it is determined that the faulty part is the exhaust pipe system.

8. A gas tightness test system for MPCVD equipment, characterized in that: The airtightness test system of the MPCVD equipment includes: A vacuum extraction module, used for vacuuming the MPCVD device after baking the MPCVD device, so that the MPCVD device is in a vacuum-sealed state; An equipment pressure-maintaining test module, used to perform a pressure-maintaining test on the MPCVD equipment to obtain pressure change data of the MPCVD equipment; A data processing module, used to obtain the air tightness test result of the MPCVD equipment according to the pressure change data; A fault determination module is used to determine the fault location of the MPCVD equipment if the airtightness test result is that the test fails.

9. An MPCVD device, characterized in that: The MPCVD device includes: a memory, a processor, and an airtightness test program for the MPCVD device stored in the memory and executable on the processor. When the airtightness test program for the MPCVD device is executed by the processor, the steps of the airtightness test method for the MPCVD device as described in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores an airtightness test program for an MPCVD device, and when the airtightness test program for an MPCVD device is executed by a processor, the steps of the airtightness test method for an MPCVD device as described in any one of claims 1 to 7 are implemented.

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