Power supply power optimization method, system and equipment of copper wire system and storage medium

Abstract

The invention discloses a power source power optimization method, system and device of a copper wire system and a storage medium, and relates to the technical field of bonding copper wire production, and the method comprises the following steps: building an intelligent bonding copper wire system simulation model, obtaining virtual parameters based on the intelligent bonding copper wire system simulation model, and optimizing the virtual parameters; the optimized virtual parameters are applied to actual bonding equipment, and the actual power and the bonding effect of the bonding equipment are collected. According to the intelligent bonding copper wire system, the energy efficiency can be remarkably improved through power optimization of a power source, in the field of semiconductor packaging and microelectronic manufacturing, a traditional bonding process often depends on fixed power setting, the setting cannot adapt to different working conditions and material characteristics, energy loss and unstable bonding quality are caused, and the energy efficiency is affected. By optimizing the power of the power supply in real time, the method reduces unnecessary power consumption, reduces the production cost, and improves the bonding quality at the same time.

Description

Technical Field

[0001] The invention relates to the technical field of copper bonding wire production, in particular to a method, system, equipment and storage medium for optimizing power supply of a copper wire system. Background Art

[0002] In the modern electronic manufacturing industry, bonding technology is one of the important processes for connecting semiconductor devices and other electronic components. Especially in the fields of integrated circuits, LEDs, MEMS, etc., the quality of bonding technology directly affects the performance, reliability and cost of the product. Therefore, improving the efficiency and quality of the bonding process has always been the focus of research and development in the industry.

[0003] Traditional bonding processes usually rely on experience to adjust process parameters, such as power supply, bonding temperature, bonding speed, and wire tension, etc. The selection and adjustment of these parameters largely rely on the experience and judgment of the operator, and are easily affected by human factors, resulting in instability and inconsistency in the production process, which may lead to unqualified bonding results, which not only affects production efficiency, but also increases production costs and reduces the market competitiveness of products. Summary of the invention

[0004] In view of the problems existing in the existing power optimization method, system, device and storage medium of the copper wire system, the present invention is proposed.

[0005] Therefore, the problem to be solved by the present invention is that the traditional bonding process usually relies on experience for adjustment, which results in a waste of power.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: In a first aspect, an embodiment of the present invention provides a method for optimizing power supply of a copper wire system, which comprises the following steps: Establish a simulation model of an intelligent copper bonding wire system, obtain virtual parameters based on the simulation model of the intelligent copper bonding wire system, and optimize the virtual parameters; Apply the optimized virtual parameters to the actual bonding equipment and collect the actual power and bonding effect of the bonding equipment; When the bonding effect is qualified, the actual power is optimized and a power adjustment plan is given; If the bonding effect is unsatisfactory, stop the operation and determine the cause of the abnormality.

[0007] As a preferred solution of the power optimization method of the copper wire system of the present invention, the step of establishing a simulation model of the intelligent bonding copper wire system includes: Collect historical data on bonding equipment power usage and process parameters; Analyze the correlation between power usage data and process parameters, and establish a simulation model for the intelligent copper bonding wire system based on the correlation; The power usage data includes power supply power and bonding temperature, and the process parameters include setting the speed of the bonding gold wire, the tension of the bonding gold wire and the diameter of the bonding gold wire.

[0008] As a preferred solution of the power optimization method of the copper wire system of the present invention, the step of optimizing the virtual parameters includes: Construct the objective function of power efficiency, which is specifically expressed as: ; In each iteration, the objective function is calculated At the current parameter point x k The gradient function , specifically expressed as: ; Update the parameters to the new position: ; In the formula, α represents the learning rate, k represents the current number of iterations, and each partial derivative Indicates that when other variables are fixed, the function For a single variable The rate of change of After each iteration, check whether the optimization has converged and set a convergence threshold. When the change in the objective function is less than the convergence threshold, the optimization process ends. The convergence condition is expressed as: ; In the formula, Denoted as the convergence threshold.

[0009] As a preferred solution of the power optimization method of the copper wire system of the present invention, the step of judging the bonding effect includes: Obtain the actual specification of the copper wire to be welded, find the copper wire with the same specification from the database, and load the historical information corresponding to the copper wire; Determine whether the result of the historical information is qualified. If the result is qualified, perform a secondary judgment. If the result is unqualified, find the copper wire of the same specification from the database again until a copper wire with a qualified result is found. When no qualified copper wire is found, the copper wire of the specification is registered and the remaining information is input into the database.

[0010] As a preferred solution of the power optimization method of the copper wire system of the present invention, the second-level judgment step includes: Obtain all classified data in the historical information, and compare all classified data in turn; Among them, an error threshold is set for a single classification data. When the difference between the classification data of the historical information and the classification data of the actual information is greater than the error threshold, the bonding effect is judged to be unqualified, otherwise, the bonding effect is judged to be qualified; When the bonding effect is judged to be qualified, all the classification data of this time are uploaded to the database and merged with the classification data in the historical information. The specific fusion method is expressed as follows: ; In the formula, Represents a certain classification data after fusion, Represents a certain classification data in the historical data. It represents a certain classification data of this time. and are all expressed as weight values, and , .

[0011] As a preferred solution of the power optimization method of the copper wire system of the present invention, the step of optimizing the actual power includes: Set the optimal bonding temperature D and establish a temperature range around the optimal value D , and divide the interval into three parts; Among them, the three intervals are: excellent temperature interval, medium temperature interval and poor temperature interval; When the actual value W of the bonding temperature is within the optimal temperature range, the power supply power is not adjusted; When the actual value W of the bonding temperature is in the intermediate temperature range, the power supply is adjusted at the primary level; When the actual value W of the bonding temperature is in the differential temperature range, the power supply is adjusted in an advanced manner; The optimal temperature range is ; The intermediate temperature range is and ; The differential temperature range is and .

[0012] As a preferred solution of the power optimization method of the copper wire system of the present invention, the primary adjustment step includes: When the actual value of the bonding temperature W is in the intermediate temperature range When , the adjustment formula for the power supply is expressed as: ; In the formula, Expressed as the adjusted power supply power, It represents the power before adjustment, D represents the optimal value of bonding temperature, and W represents the actual value of bonding temperature. It is expressed as the correlation coefficient; When the actual value of the bonding temperature W is in the intermediate temperature range When , the adjustment formula for the power supply is expressed as: ; The steps of the advanced adjustment include: An optimal value D of the bonding temperature is obtained, and a power supply power corresponding to the optimal value D of the bonding temperature is obtained based on a database, and the corresponding power supply power in the database is used as the adjusted power supply power.

[0013] In a second aspect, an embodiment of the present invention provides a power optimization system for a copper wire system, which includes a model building module, a power optimization module, and a power output module; The model building module is used to build a simulation model of the intelligent copper bonding wire system and optimize virtual parameters; The power optimization module is used to calculate the adjusted power supply power; The power output module is used to output the adjusted power to the bonding equipment.

[0014] In a third aspect, an embodiment of the present invention provides a computer device, including a memory and a processor, wherein the memory stores a computer program, wherein: when the processor executes the computer program, any step of the above-mentioned copper wire system power optimization method is implemented.

[0015] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein: when the computer program is executed by a processor, any step of the above-mentioned method for optimizing power supply of a copper wire system is implemented.

[0016] The beneficial effects of the present invention are as follows: the intelligent copper bonding wire system can significantly improve energy efficiency by optimizing power supply. In the field of semiconductor packaging and microelectronics manufacturing, traditional bonding processes often rely on fixed power settings, which cannot adapt to different working conditions and material properties, resulting in energy loss and unstable bonding quality. By optimizing power supply in real time, this method reduces unnecessary energy consumption, reduces production costs, and improves bonding quality, which is of great significance for improving the energy efficiency and economic benefits of semiconductor packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them: Figure 1 Flowchart of a power optimization method for a power supply to a copper wire system.

[0018] Figure 2 Temperature range diagram for the power optimization method for the copper wire system. DETAILED DESCRIPTION

[0019] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the drawings of the specification. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary persons in the art without creative work should fall within the scope of protection of the present invention.

[0020] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0021] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0022] The present invention is described in detail with reference to schematic diagrams. When describing the embodiments of the present invention, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0023] At the same time, in the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper, lower, inner and outer" are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first, second or third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0024] In the present invention, unless otherwise clearly specified and limited, the terms "install, connect, connect" should be understood in a broad sense, for example: it can be a fixed connection, a detachable connection or an integral connection; it can also be a mechanical connection, an electrical connection or a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] Example 1 Reference Figure 1 and Figure 2 , which is the first embodiment of the present invention, and provides a method for optimizing power supply of a copper wire system, comprising the following steps: S1. Establish a simulation model of an intelligent copper bonding wire system, obtain virtual parameters based on the simulation model of the intelligent copper bonding wire system, and optimize the virtual parameters.

[0026] The steps to establish the intelligent copper bonding wire system simulation model include: Collect historical data on bonding equipment power usage and process parameters; Analyze the correlation between power usage data and process parameters, and establish a simulation model for the intelligent copper bonding wire system based on the correlation; The power usage data includes power supply power and bonding temperature, and the process parameters include setting the speed of the bonding gold wire, the tension of the bonding gold wire and the diameter of the bonding gold wire.

[0027] Collect historical data from different batches of bonding processes, especially data on power supply power and bonding temperature, from production run records, including: Power supply power (P): recorded in watts (W); Bonding temperature (T): recorded in degrees Celsius (°C); Bonding wire speed (V): in millimeters per second (mm / s); Bonding wire tension (Tension): in grams (g); Bonding wire diameter (D): in millimeters (mm).

[0028] The steps for optimizing virtual parameters include: Construct the objective function of power efficiency, which is specifically expressed as: ; In each iteration, the objective function is calculated At the current parameter point x k The gradient function , specifically expressed as: ; Update the parameters to the new position: ; In the formula, α represents the learning rate, k represents the current number of iterations, and each partial derivative Indicates that when other variables are fixed, the function For a single variable The rate of change of After each iteration, check whether the optimization has converged and set a convergence threshold. When the change in the objective function is less than the convergence threshold, the optimization process ends. The convergence condition is expressed as: ; In the formula, Denoted as the convergence threshold.

[0029] S2. Apply the optimized virtual parameters to the actual bonding device, and collect the actual power and bonding effect of the bonding device.

[0030] The steps for judging the bonding effect include: Obtain the actual specification of the copper wire to be welded, find the copper wire with the same specification from the database, and load the historical information corresponding to the copper wire; Determine whether the result of the historical information is qualified. If the result is qualified, perform a secondary judgment. If the result is unqualified, find the copper wire of the same specification from the database again until a copper wire with a qualified result is found. When no qualified copper wire is found, the copper wire of the specification is registered and the remaining information is input into the database.

[0031] In this embodiment, the actual welding copper wire specifications are: Copper wire diameter: 0.025 mm; Bonding temperature: 150°C; Bonding speed: 2.8 mm / s; Tension: 53 g; Use database query statements to retrieve records that match the current actual welding copper wire specifications from the historical data table, and the following historical information records are obtained in the database: Table 1: Historical information of the database Record diameter Soldering temperature Welding speed tension result 1 0.025 150 3.0 50 qualified 2 0.025 155 3.2 55 Failure 3 0.025 150 2.8 50 qualified First, check that the first record is 1, and the welding result is "qualified", so a secondary judgment is performed. When checking that the first record is 2, the welding result is "unqualified", so it is necessary to search again until a record with a welding result of "qualified" is found.

[0032] The steps of secondary judgment include: Obtain all classified data in the historical information, and compare all classified data in turn; Among them, an error threshold is set for a single classification data. When the difference between the classification data of the historical information and the classification data of the actual information is greater than the error threshold, the bonding effect is judged to be unqualified, otherwise, the bonding effect is judged to be qualified; In this embodiment, the classified data for comparison include copper wire diameter, bonding temperature, bonding speed and tension, and an error threshold is set for all classified data, such as the error threshold of copper wire diameter is 0.005 mm, the threshold error of bonding temperature is 5°C, the threshold error of bonding speed is 0.3 mm / s, and the threshold error of tension is 5. The classifications are compared to determine whether the actual welding parameters and the parameters of the historical data are within the error threshold. When the bonding effect is judged to be qualified, all the classification data of this time are uploaded to the database and merged with the classification data in the historical information. The specific fusion method is expressed as follows: ; In the formula, Represents a certain classification data after fusion, Represents a certain classification data in the historical data. It represents a certain classification data of this time. and are all expressed as weight values, and , ; Take tension as an example. When merging, the tension in the historical data is 50g, the actual tension is 53g, and the weight value of this time is is 0.4, the weight value is 0.6, so it is loaded into the calculation formula and the tension after fusion is obtained to be 51.8g.

[0033] S3. When the bonding effect is qualified, the actual power is optimized and a power adjustment plan is given.

[0034] The steps to optimize the actual power include: Set the optimal bonding temperature D and establish a temperature range around the optimal value D , and divide the interval into three parts; Among them, the three intervals are: excellent temperature interval, medium temperature interval and poor temperature interval; When the actual value W of the bonding temperature is within the optimal temperature range, the power supply power is not adjusted; When the actual value W of the bonding temperature is in the intermediate temperature range, the power supply is adjusted at the primary level; When the actual value W of the bonding temperature is in the differential temperature range, the power supply is adjusted in an advanced manner; The optimal temperature range is ; The intermediate temperature range is and ; The differential temperature range is and .

[0035] like Figure 2 As shown, by setting different interval values ​​q, p and S, different temperature intervals are set, and the power supply power is adjusted according to different intervals.

[0036] The steps of primary adjustment include: When the actual value of the bonding temperature W is in the intermediate temperature range When , the adjustment formula for the power supply is expressed as: ; In the formula, Expressed as the adjusted power supply power, It represents the power before adjustment, D represents the optimal value of bonding temperature, and W represents the actual value of bonding temperature. It is expressed as the correlation coefficient; For example, in this embodiment, the optimal value D of the bonding temperature is 145°C, wherein the intermediate temperature range for , and the actual value W of the bonding temperature is 138°C, so the power supply needs to be adjusted, and the new power supply is obtained by adjusting the formula, thereby realizing the adjustment of the power supply; This method can adjust the actual value of the bonding temperature to an optimal temperature range by slightly adjusting the power supply according to the change of the actual value of the bonding temperature, thereby ensuring the stability of subsequent operations.

[0037] When the actual value of the bonding temperature W is in the intermediate temperature range When , the adjustment formula for the power supply is expressed as: ; The steps of the advanced adjustment include: An optimal value D of the bonding temperature is obtained, and a power supply power corresponding to the optimal value D of the bonding temperature is obtained based on a database, and the corresponding power supply power in the database is used as the adjusted power supply power.

[0038] S4. If the bonding effect is unqualified, stop the operation and determine the cause of the abnormality.

[0039] In summary, the intelligent copper bonding wire system can significantly improve energy efficiency through power optimization. In the field of semiconductor packaging and microelectronics manufacturing, traditional bonding processes often rely on fixed power settings, which cannot adapt to different working conditions and material properties, resulting in energy loss and unstable bonding quality. By optimizing power in real time, this method reduces unnecessary energy consumption, reduces production costs, and improves bonding quality, which is of great significance for improving the energy efficiency and economic benefits of semiconductor packaging.

[0040] Example 2 Based on the first embodiment, this embodiment further provides a power optimization system for a copper wire system, including a model building module, a power optimization module, and a power output module; The model building module is used to build a simulation model of the intelligent copper bonding wire system and optimize virtual parameters; The power optimization module is used to calculate the adjusted power supply power; The power output module is used to output the adjusted power to the bonding equipment.

[0041] This embodiment also provides a computer device, which is suitable for the power supply optimization method of the copper wire system, including a memory and a processor; the memory is used to store computer executable instructions, and the processor is used to execute the computer executable instructions to implement the power supply optimization method of the copper wire system proposed in the above embodiment.

[0042] The computer device may be a terminal, and the computer device includes a processor, a memory, a communication interface, a display screen and an input device connected via a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be achieved through WIFI, an operator network, NFC (near field communication) or other technologies. The display screen of the computer device may be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device may be a touch layer covering the display screen, or a key, trackball or touchpad provided on the housing of the computer device, or an external keyboard, touchpad or mouse, etc.

[0043] This embodiment further provides a storage medium on which a computer program is stored. When the program is executed by a processor, the method for optimizing the power supply of a copper wire system as proposed in the above embodiment is implemented.

[0044] The storage medium proposed in this embodiment and the data storage method proposed in the above embodiment belong to the same inventive concept. The technical details not fully described in this embodiment can be found in the above embodiment, and this embodiment has the same beneficial effects as the above embodiment.

[0045] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A method for optimizing power supply of a copper wire system, characterized in that: The following steps are included: Establish a simulation model of an intelligent copper bonding wire system, obtain virtual parameters based on the simulation model of the intelligent copper bonding wire system, and optimize the virtual parameters; Apply the optimized virtual parameters to the actual bonding equipment and collect the actual power and bonding effect of the bonding equipment; When the bonding effect is qualified, the actual power is optimized and a power adjustment plan is given; If the bonding effect is unsatisfactory, stop the operation and determine the cause of the abnormality.

2. The power optimization method for a copper wire system according to claim 1, characterized in that: The steps to establish the intelligent copper bonding wire system simulation model include: Collect historical data on bonding equipment power usage and process parameters; Analyze the correlation between power usage data and process parameters, and establish a simulation model for the intelligent copper bonding wire system based on the correlation; The power usage data includes power supply power and bonding temperature, and the process parameters include setting the speed of the bonding gold wire, the tension of the bonding gold wire and the diameter of the bonding gold wire.

3. The power optimization method for a copper wire system according to claim 2, characterized in that: The steps for optimizing virtual parameters include: Construct the objective function of power efficiency, which is specifically expressed as: ； In each iteration, the objective function is calculated At the current parameter point x k The gradient function , specifically expressed as: ； Update the parameters to the new position: ； In the formula, α represents the learning rate, k represents the current number of iterations, and each partial derivative Indicates that when other variables are fixed, the function For a single variable The rate of change of After each iteration, check whether the optimization has converged and set a convergence threshold. When the change in the objective function is less than the convergence threshold, the optimization process ends. The convergence condition is expressed as: ； In the formula, Denoted as the convergence threshold.

4. The power optimization method for a copper wire system according to claim 3, characterized in that: The steps for judging the bonding effect include: Obtain the actual specification of the copper wire to be welded, find the copper wire with the same specification from the database, and load the historical information corresponding to the copper wire; Determine whether the result of the historical information is qualified. If the result is qualified, perform a secondary judgment. If the result is unqualified, find the copper wire of the same specification from the database again until a copper wire with a qualified result is found. When no qualified copper wire is found, the copper wire of the specification is registered and the remaining information is input into the database.

5. The power optimization method for a copper wire system according to claim 4, characterized in that: The steps of the secondary judgment include: Obtain all classified data in the historical information, and compare all classified data in turn; Among them, an error threshold is set for a single classification data. When the difference between the classification data of the historical information and the classification data of the actual information is greater than the error threshold, the bonding effect is judged to be unqualified, otherwise, the bonding effect is judged to be qualified; When the bonding effect is judged to be qualified, all the classification data of this time are uploaded to the database and merged with the classification data in the historical information. The specific fusion method is expressed as follows: ； In the formula, Represents a certain classification data after fusion, Represents a certain classification data in the historical data. It represents a certain classification data of this time. and are all expressed as weight values, and , .

6. The power optimization method for a copper wire system according to claim 5, characterized in that: The steps to optimize the actual power include: Set the optimal bonding temperature D and establish a temperature range around the optimal value D , and divide the interval into three parts; Among them, the three intervals are: excellent temperature interval, medium temperature interval and poor temperature interval; When the actual value W of the bonding temperature is within the optimal temperature range, the power supply power is not adjusted; When the actual value W of the bonding temperature is in the intermediate temperature range, the power supply is adjusted at the primary level; When the actual value W of the bonding temperature is in the differential temperature range, the power supply is adjusted in an advanced manner; The optimal temperature range is ; The intermediate temperature range is and ; The differential temperature range is and .

7. The power optimization method of the copper wire system according to claim 6, characterized in that: The steps of the primary adjustment include: When the actual value of the bonding temperature W is in the intermediate temperature range When , the adjustment formula for the power supply is expressed as: ； In the formula, Expressed as the adjusted power supply power, It represents the power before adjustment, D represents the optimal value of bonding temperature, and W represents the actual value of bonding temperature. It is expressed as the correlation coefficient; When the actual value of the bonding temperature W is in the intermediate temperature range When , the adjustment formula for the power supply is expressed as: ； The steps of the advanced adjustment include: An optimal value D of the bonding temperature is obtained, and a power supply power corresponding to the optimal value D of the bonding temperature is obtained based on a database, and the corresponding power supply power in the database is used as the adjusted power supply power.

8. A power supply optimization system for a copper wire system, based on the power supply optimization method for a copper wire system according to any one of claims 1 to 7, characterized in that: Includes a model building module, a power optimization module, and a power output module; The model building module is used to build a simulation model of the intelligent copper bonding wire system and optimize virtual parameters; The power optimization module is used to calculate the adjusted power supply power; The power output module is used to output the adjusted power to the bonding equipment.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the power optimization method for the copper wire system described in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the power optimization method for a copper wire system according to any one of claims 1 to 7 are implemented.

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