Wafer cleaning device for chip production

Abstract

The invention belongs to the technical field of wafer cleaning equipment, particularly relates to a wafer cleaning device for chip production, and aims to solve the problem that tiny particle residues can cause scratching of the surface of a wafer under high-speed air flow, the wafer cleaning device for chip production comprises a cleaning machine box, a material carrying table is fixed to one side of the cleaning machine box, and the material carrying table is fixed to the other side of the cleaning machine box; an observation panel mounting groove is formed in one side of the cleaning machine box, a cleaning cavity is formed in the cleaning machine box, and a lifting mechanism is arranged in the cleaning cavity. The diffusion plate is close to the wafer but does not make contact with the wafer, so that horizontal airflow is formed on the surface of the wafer, the airflow is discharged from the top of the diffusion plate to the circumferential position, the outer side of the diffusion plate is slightly lifted upwards and sucked back by the air suction chamber, and the surface of the cleaned wafer is dried through the high-speed airflow. And moreover, particles on the surface can be taken away, and downward force cannot be generated in the flow direction of the air flow, so that the surface of the wafer cannot be damaged in the drying process.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning equipment, and in particular to a wafer cleaning device for chip production. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. Various circuit component structures can be processed on the silicon wafer to become an IC product with specific electrical functions. Before chip production, to ensure dust-free chip production, the wafer needs to be cleaned.

[0003] The existing wafer cleaning equipment has the following problems: the current wafer cleaning is carried out by direct flushing on the surface, and the water stains on the surface after cleaning are blown away by high-speed airflow. Therefore, the wind force on the wafer surface will cause damage to the surface of the wafer, especially tiny particle residues will cause scratches on the wafer surface under high-speed airflow, and the existing technology is not easy to solve such problems. Therefore, there is an urgent need for wafer cleaning equipment for chip production to solve the above problems. Summary of the invention

[0004] Based on the technical problem that tiny particle residues may cause scratches on the wafer surface under high-speed wind flow, the present invention proposes a wafer cleaning device for chip production.

[0005] The cleaning machine of claim 1, wherein the cleaning chamber is provided with a lifting mechanism, the lifting mechanism comprising a lifting screw rod installed through a bearing between the top and the bottom of the cleaning chamber, a supporting lifting frame is installed between two lifting screw rods located on the same side, a supporting fork frame is fixed between the two supporting lifting frames by bolts, a wafer clamping slot is provided on the top of the two supporting lifting frames, a material picking mechanism is provided inside the cleaning chamber, the material picking mechanism comprises two material picking chutes opened in the cleaning chamber, a feeding bottom sliding block is slidably installed inside the two material picking chutes, a top sliding sleeve of the feeding bottom sliding block is provided with a vertically sliding material picking base, a material picking turntable is installed on the top of the material picking base through a bearing, and a drying mechanism is installed on the top of the cleaning chamber.

[0006] Preferably, two sets of telescopic material picking claws are installed on the circumferential outer wall of the material picking turntable, and material picking rubber pads are installed inside the telescopic material picking claws. A sealed air bag is sleeved between the material picking base and the feeding bottom sliding block at the bottom.

[0007] Preferably, a first transverse screw rod is installed inside one of the material picking chutes through a bearing, and a limiting slide rod is fixed inside the other material picking chute, the first transverse screw rod is installed with a bottom threaded sleeve of the feed bottom sliding block, and the limiting slide rod is installed with a bottom sliding sleeve of the feed bottom sliding block.

[0008] Preferably, a circular groove is provided in the middle of the top of the supporting fork frame, and a rotating tray is installed at the bottom of the circular groove through a bearing, three wafer adsorption holes distributed in a circular array are provided on the top of the rotating tray, and rotating air inlet holes distributed in a circular array are provided on the top of the supporting fork frame. The rotating air inlet holes are opened in an inclined direction, and the air outlet of the rotating air inlet holes is toward the top, and the air intake of the wafer adsorption holes is toward the inside.

[0009] Preferably, the drying mechanism comprises a first electric push rod fixed by bolts at the top position of the cleaning cabinet, a drying fixed base is fixed by bolts at the bottom of the first electric push rod, and a rotating drying rotating top plate is installed at the bottom of the drying fixed base.

[0010] Preferably, a drying fixed base rotating groove is provided in the middle of the top of the drying rotating top plate, and the drying fixed base is sleeved inside the drying fixed base rotating groove and rotatably installed.

[0011] Preferably, a gear ring is fixed to the circumferential position of the rotating groove of the dry fixed base by bolts, a first drive motor is fixed to the circumferential inner wall of the dry fixed base, a drive gear is installed on the output shaft of the first drive motor, and the drive gear is meshed with the gear ring.

[0012] Preferably, a drying slider slot is provided at the bottom of the drying rotating top plate, a drying slider is slidably installed inside the drying slider slot, a drying bellows is fixed to the bottom of the drying slider by bolts, a second transverse screw rod is installed inside the drying slider slot, and a threaded sleeve is installed between the second transverse screw rod and the drying slider.

[0013] Preferably, a vertically arranged air blowing pipe is fixed to the middle position of the bottom of the drying bellows, three second electric push rods distributed in a circular array are fixed to the bottom of the drying bellows, an air suction bottom cylinder is fixed to the bottom of the three second electric push rods, the air suction bottom cylinder is sleeved on the outside of the air blowing pipe, and the air blowing pipe coincides with the axial center line of the air suction bottom cylinder, air suction pipes are fixed between the two side positions of the drying bellows and the air suction bottom cylinder, an air suction chamber is opened at the bottom of the air suction pipe, the air suction chamber is communicated with the interior of the air suction pipe, an air suction fan is installed inside the drying bellows, the air inlet end of the air suction fan is communicated with the interior of the air suction pipe, an air blower is installed inside the drying bellows, and the exhaust end of the air blower is communicated with the interior of the air blowing pipe.

[0014] Preferably, an internal fixing block is fixed at the bottom position inside the air blowing pipe, a third electric push rod is nested and fixed at the bottom of the internal fixing block, and a diffusion plate is fixed at the bottom of the third electric push rod.

[0015] The beneficial effects of the present invention are:

[0016] 1. The wafer cleaning device for chip production has an air blower that exhausts air through an air blow pipe, and an air suction fan that sucks the gas back through an air suction chamber. The diffusion plate is close to the wafer but does not contact the wafer, so a horizontal airflow is formed on the surface of the wafer. The airflow is discharged from the top of the diffusion plate to the circumference, and the outer side of the diffusion plate is slightly lifted upward and sucked back by the air suction chamber. The cleaned wafer surface is dried by a high-speed airflow, and the particles on the surface can be taken away. Since the flow direction of the airflow will not generate a downward force, the drying process will not damage the wafer surface.

[0017] 2. The wafer cleaning device for chip production can stabilize the wafer by adsorbing the wafer through the wafer adsorption holes to prevent the wafer from moving. The rotating air inlet holes in the circumferential position exhaust air outwards, and because they are opened in an oblique direction, the wafer can rotate in a circle.

[0018] 3. The wafer cleaning device for chip production has a material picking turntable that rotates 90 degrees toward the material support fork. The telescopic material picking claw moves the picked-up wafer to the wafer slot and places the wafer on the top of the material support fork at an angle, realizing convenient automatic material picking and placing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of a wafer cleaning device for chip production proposed by the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of a material taking mechanism of a wafer cleaning device for chip production proposed by the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of a material support mechanism of a wafer cleaning device for chip production proposed by the present invention;

[0022] Figure 4 This is a schematic diagram of the drying mechanism structure of a wafer cleaning device for chip production proposed by the present invention;

[0023] Figure 5 A wafer cleaning device for chip production proposed by the present invention Figure 4 A schematic diagram of the enlarged structure of part A;

[0024] Figure 6 This is a partial structural schematic diagram of a drying mechanism of a wafer cleaning device for chip production proposed by the present invention;

[0025] Figure 7 This is a schematic diagram of the internal structure of a drying air box of a wafer cleaning device for chip production proposed by the present invention;

[0026] Figure 8 A wafer cleaning device for chip production proposed by the present invention Figure 7 Schematic diagram of the enlarged structure of part B.

[0027] In the figure: 1. Cleaning chassis; 2. Loading platform; 3. Retrieving chute; 4. Feeding bottom slider; 5. Retrieving base; 6. Retrieving turntable; 7. Observation panel mounting slot; 8. Telescopic retrieving claw; 9. Retrieving rubber pad; 10. Lifting screw rod; 11. First electric push rod; 12. Drying fixed base; 13. Drying rotating top plate; 14. Supporting lifting frame; 15. Supporting fork frame; 16. Limiting slide rod; 17. First traverse screw rod; 18. Air bag; 19. Rotating air inlet hole; 2 0. Wafer card slot; 21. Wafer adsorption air hole; 22. Rotating tray; 23. Drying bellows; 24. Blowing pipe; 25. Suction pipe; 26. Second electric push rod; 27. Suction bottom cylinder; 28. Drying fixed base rotating groove; 29. ​​Gear ring; 30. Drying slider card slot; 31. Second transverse screw rod; 32. Drying slider; 33. Blower fan; 34. Suction fan; 35. Suction chamber; 36. Internal fixed block; 37. Third electric push rod; 38. Diffuser plate. DETAILED DESCRIPTION

[0028] Reference Figure 1-Figure 8 , a wafer cleaning device for chip production comprises a cleaning chassis 1, a loading platform 2 is fixed on one side of the cleaning chassis 1, an observation panel mounting groove 7 is provided on one side of the cleaning chassis 1, a cleaning chamber is provided inside the cleaning chassis 1, a lifting mechanism is arranged inside the cleaning chamber, the lifting mechanism comprises a lifting screw 10 installed through a bearing between the top and the bottom of the cleaning chassis 1, a supporting lifting frame 14 is installed between two lifting screws 10 located on the same side, a supporting fork frame 15 is fixed between the two supporting lifting frames 14 by bolts, a wafer card slot 20 is provided on the top of the two supporting lifting frames 14, a material picking mechanism is arranged inside the cleaning chassis 1, the material picking mechanism comprises two material picking chutes 3 opened in the cleaning chassis 1, a feeding bottom slider 4 is slidably installed inside the two material picking chutes 3, a vertically sliding material picking base 5 is provided on the top sliding sleeve of the feeding bottom slider 4, a material picking turntable 6 is installed on the top of the material picking base 5 through a bearing, and a drying mechanism is installed on the top of the cleaning chassis 1.

[0029] Furthermore, two sets of telescopic material picking jaws 8 are installed on the circumferential outer wall of the material picking turntable 6, and material picking rubber pads 9 are installed inside the telescopic material picking jaws 8. A sealed airbag 18 is sleeved between the material picking base 5 and the bottom feeding bottom slider 4; the inflation and deflation of the airbag 18 can make the material picking base 5 rise, so that the telescopic material picking jaws 8 can easily take out and put down the wafer.

[0030] Furthermore, a first transverse screw rod 17 is installed inside one of the material feeding chutes 3 through a bearing, and a limiting slide rod 16 is fixed inside the other material feeding chute 3. The first transverse screw rod 17 is installed with a bottom threaded sleeve of the feed bottom slider 4, and the limiting slide rod 16 is installed with a bottom sliding sleeve of the feed bottom slider 4.

[0031] Furthermore, a circular groove is provided in the middle of the top of the supporting fork frame 15, and a rotating tray 22 is installed at the bottom of the circular groove through a bearing, and three wafer adsorption holes 21 distributed in a circular array are provided on the top of the rotating tray 22, and a rotating air inlet hole 19 distributed in a circular array is provided on the top of the supporting fork frame 15. The rotating air inlet holes 19 are opened in an inclined direction, and the air outlet of the rotating air inlet holes 19 is toward the top, and the air intake of the wafer adsorption holes 21 is toward the inside; the wafer is adsorbed and stabilized by the wafer adsorption holes 21 to prevent the wafer from moving, and the rotating air inlet holes 19 in the circumferential position are exhausted outward, and because they are opened in an oblique direction, the wafer can rotate in a circle.

[0032] Furthermore, the drying mechanism includes a first electric push rod 11 bolted to the top of the cleaning chassis 1, a drying fixed base 12 is bolted to the bottom of the first electric push rod 11, and a rotating drying rotating top plate 13 is installed at the bottom of the drying fixed base 12.

[0033] Furthermore, a drying fixed base rotating groove 28 is provided at the middle position of the top of the drying rotating top plate 13 , and the drying fixed base 12 is sleeved inside the drying fixed base rotating groove 28 for rotational installation.

[0034] Furthermore, a gear ring 29 is fixed to the circumferential position of the rotating groove 28 of the drying fixed base by bolts, a first driving motor is fixed to the circumferential inner wall of the drying fixed base 12 , a driving gear is installed on the output shaft of the first driving motor, and the driving gear is meshed with the gear ring 29 .

[0035] Furthermore, a drying slider slot 30 is provided at the bottom of the drying rotating top plate 13, a drying slider 32 is slidably installed inside the drying slider slot 30, a drying bellows 23 is fixed to the bottom of the drying slider 32 by bolts, a second transverse screw rod 31 is installed inside the drying slider slot 30, and a threaded sleeve is installed between the second transverse screw rod 31 and the drying slider 32.

[0036] Furthermore, a vertically arranged air blowing pipe 24 is fixed at the middle position of the bottom of the drying bellows 23, and three second electric push rods 26 distributed in a circular array are fixed at the bottom of the drying bellows 23. An air suction bottom cylinder 27 is fixed to the bottom of the three second electric push rods 26. The air suction bottom cylinder 27 is sleeved on the outside of the air blowing pipe 24, and the air blowing pipe 24 coincides with the axial center line of the air suction bottom cylinder 27. Air suction pipes 25 are fixed between the two side positions of the drying bellows 23 and the air suction bottom cylinder 27. An air suction chamber 35 is opened at the bottom of the air suction pipe 25, and the air suction chamber 35 is connected to the interior of the air suction pipe 25. An air suction fan 34 is installed inside the drying bellows 23, and the air inlet end of the air suction fan 34 is connected to the interior of the air suction pipe 25. An air blower 33 is installed inside the drying bellows 23, and the exhaust end of the air blower 33 is connected to the interior of the air blowing pipe 24.

[0037] Furthermore, an internal fixed block 36 is fixed at the bottom position inside the air blowing tube 24, a third electric push rod 37 is nested and fixed at the bottom of the internal fixed block 36, and a diffusion plate 38 is fixed at the bottom of the third electric push rod 37; the diffusion plate 38 is close to the wafer but does not contact the wafer, so a horizontal airflow is formed on the surface of the wafer, and the airflow is discharged from the top of the diffusion plate 38 to the circumferential position, and the outer position of the diffusion plate 38 is slightly lifted upward and is sucked back by the suction chamber 35. The high-speed airflow can dry the cleaned wafer surface and take away the particles on the surface. Since the flow direction of the airflow will not generate a downward force, the drying process will not cause damage to the wafer surface.

[0038] When the present invention is used: During the use of the cleaning device, the main cleaning steps are: taking the wafer - placing the wafer - wafer cleaning - surface drying;

[0039] Wafer removal: The operator places the material rack with the wafers on the top of the loading platform 2, and places the opening position toward the telescopic material removal clamp 8, and moves the telescopic material removal clamp 8 by rotating the first transverse screw 17, aligning the middle position with the wafer, and lifts the wafer with the four material removal rubber pads 9 and moves it to the inside of the cleaning box 1;

[0040] Placing wafers: The material pick-up turntable 6 rotates 90 degrees toward the material support fork 15, and the retractable material pick-up claw 8 moves the picked-up wafer to the wafer slot, and tilts the wafer to place it on the top of the material support fork 15;

[0041] Wafer cleaning: The wafer is on the top of the support fork 15, and the wafer is adsorbed and stabilized by the wafer adsorption air hole 21 to prevent the wafer from moving. The rotating air inlet 19 at the circumferential position exhausts outward, and because it is opened in an oblique direction, the wafer can rotate in a circle. The lifting screw 10 moves the wafer down to the inside of the cleaning chamber, and is cleaned by the ultrasonic cleaning machine and cleaning liquid installed inside. The cleaned wafer is lifted up by the lifting screw 10;

[0042] Surface drying: During the drying process, drying is carried out through the bottom of the drying bellows 23, the drying rotating top plate 13 can rotate, and through the movement of the drying slider 32, any position on the top of the wafer can be dried, and drying starts from the center position. During the drying process, the third electric push rod 37 extends to extend the diffuser plate 38 at the bottom, and the air blower 33 exhausts air through the air blowing pipe 24, and the air suction fan 34 sucks the gas back through the air suction chamber 35, and the diffuser plate 38 is close to the wafer but does not contact the wafer, so a horizontal airflow is formed on the surface of the wafer, and the airflow is discharged from the top of the diffuser plate 38 to the circumferential position, and the outer position of the diffuser plate 38 is slightly lifted upward and sucked back by the air suction chamber 35. The cleaned wafer surface is dried by the high-speed airflow, and the particles on the surface can be taken away. Since the flow direction of the airflow does not generate a downward force, the drying process will not cause damage to the wafer surface.

[0043] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer cleaning device for chip production, comprising a cleaning chassis (1), a loading platform (2) is fixed on one side of the cleaning chassis (1), and an observation panel mounting groove (7) is opened on one side of the cleaning chassis (1), characterized in that: A cleaning chamber is provided inside the cleaning machine case (1), and a lifting mechanism is arranged inside the cleaning chamber. The lifting mechanism comprises a lifting screw (10) installed between the top and the bottom of the cleaning machine case (1) through a bearing, a material support lifting frame (14) is installed between two lifting screws (10) located on the same side, a material support fork frame (15) is fixed between the two material support lifting frames (14) through bolts, and a wafer clamping slot (20) is provided on the top of the two material support lifting frames (14). A material picking mechanism is arranged inside the cleaning machine case (1), and the material picking mechanism comprises two material picking chutes (3) provided in the cleaning machine case (1), and a feeding bottom slider (4) is slidably installed inside the two material picking chutes (3), and a vertically sliding material picking base (5) is provided on the top sliding sleeve of the feeding bottom slider (4), and a material picking turntable (6) is installed on the top of the material picking base (5) through a bearing. A drying mechanism is installed on the top of the cleaning machine case (1).

2. A wafer cleaning device for chip production according to claim 1, characterized in that: Two sets of telescopic material-retrieving jaws (8) are installed on the circumferential outer wall of the material-retrieving turntable (6), and material-retrieving rubber pads (9) are installed inside the telescopic material-retrieving jaws (8). A sealed air bag (18) is sleeved between the material-retrieving base (5) and the feeding bottom slider (4) at the bottom.

3. A wafer cleaning device for chip production according to claim 2, characterized in that: A first transverse screw rod (17) is installed inside one of the material taking chutes (3) via a bearing, and a limiting slide rod (16) is fixed inside the other material taking chute (3). The first transverse screw rod (17) is installed with a bottom thread sleeve of the feed bottom slider (4), and the limiting slide rod (16) is installed with a bottom sliding sleeve of the feed bottom slider (4).

4. The wafer cleaning device for chip production according to claim 1, characterized in that: A circular groove is provided in the middle of the top of the material support fork frame (15), and a rotating tray (22) is installed at the bottom of the circular groove through a bearing. Three wafer adsorption holes (21) distributed in a circumferential array are provided on the top of the rotating tray (22). A rotating air inlet hole (19) distributed in a circumferential array is provided on the top of the material support fork frame (15). The rotating air inlet hole (19) is opened in an inclined direction, and the air outlet of the rotating air inlet hole (19) is directed toward the top, while the air intake of the wafer adsorption hole (21) is directed toward the inside.

5. The wafer cleaning device for chip production according to claim 1, characterized in that: The drying mechanism comprises a first electric push rod (11) fixed by bolts at the top position of the cleaning cabinet (1); a drying fixed base (12) is fixed by bolts at the bottom of the first electric push rod (11); and a rotating drying rotating top plate (13) is installed at the bottom of the drying fixed base (12).

6. A wafer cleaning device for chip production according to claim 5, characterized in that: A drying fixed base rotating groove (28) is provided at the middle position of the top of the drying rotating top plate (13), and the drying fixed base (12) is sleeved inside the drying fixed base rotating groove (28) and is rotatably installed.

7. A wafer cleaning device for chip production according to claim 6, characterized in that: A gear ring (29) is fixed to the circumferential position of the rotating groove (28) of the drying fixed base by bolts, a first driving motor is fixed to the circumferential inner wall of the drying fixed base (12), a driving gear is installed on the output shaft of the first driving motor, and the driving gear is meshed with the gear ring (29).

8. The wafer cleaning device for chip production according to claim 5, characterized in that: A drying slider groove (30) is provided at the bottom of the drying rotating top plate (13), a drying slider (32) is slidably mounted inside the drying slider groove (30), a drying bellows (23) is fixed to the bottom of the drying slider (32) by bolts, a second transverse screw rod (31) is mounted inside the drying slider groove (30), and the second transverse screw rod (31) and the drying slider (32) are threadedly sleeved.

9. A wafer cleaning device for chip production according to claim 8, characterized in that: A vertically arranged air blowing pipe (24) is fixed at the middle position of the bottom of the drying wind box (23); three second electric push rods (26) distributed in a circumferential array are fixed at the bottom of the drying wind box (23); an air suction bottom cylinder (27) is fixed at the bottom of the three second electric push rods (26); the air suction bottom cylinder (27) is sleeved on the outside of the air blowing pipe (24), and the axial center lines of the air blowing pipe (24) and the air suction bottom cylinder (27) coincide with each other; the positions on both sides of the drying wind box (23) coincide with the air suction bottom cylinder (27); An air intake pipe (25) is fixed between the drying air box (23) and the drying air box (27), an air intake chamber (35) is provided at the bottom of the air intake pipe (25), the air intake chamber (35) is communicated with the interior of the air intake pipe (25), an air intake fan (34) is installed inside the drying air box (23), the air inlet end of the air intake fan (34) is communicated with the interior of the air intake pipe (25), an air blower (33) is installed inside the drying air box (23), the air outlet end of the air blower (33) is communicated with the interior of the air blowing pipe (24).

10. The wafer cleaning device for chip production according to claim 9, characterized in that: An internal fixing block (36) is fixed at the bottom position inside the air blowing pipe (24), a third electric push rod (37) is nested and fixed at the bottom of the internal fixing block (36), and a diffusion plate (38) is fixed at the bottom of the third electric push rod (37).

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