Package structure and manufacturing method thereof

Abstract

A packaging structure comprises a unit substrate, a measuring piece, a chip and a packaging layer. The measuring piece is arranged on the unit substrate, and the section width of the measuring piece changes along with the height of the measuring piece. The chip comprises an upper surface and a lower surface, and the lower surface is connected to the unit substrate. The packaging layer is arranged on the unit substrate and wraps the chip and the measuring piece. The top surface of the measuring piece is exposed out of the packaging layer, the upper surface and the surface of the packaging layer are spaced by a distance, and the distance corresponds to the section width of the top surface of the measuring piece. In addition, a manufacturing method of the packaging structure is also provided. The invention provides a packaging structure and a manufacturing method of the packaging structure. Product characteristics (such as a specific size) of the packaging structure can be quickly and intuitively judged without damaging the packaging structure.

Description

Technical Field

[0001] The present invention relates to a packaging structure and a method for manufacturing the packaging structure, and in particular to a packaging structure capable of quickly and intuitively judging a spacing dimension and a method for manufacturing the packaging structure. Background Art

[0002] In a specific package structure, such as a fingerprint reader, the product characteristics are related to the distance between the chip of the package structure and the surface of the package layer. The current method of confirming the distance of the package structure is, for example, to cut the package structure to obtain a cross section of the package structure to measure the distance. This measurement method will damage the package structure, resulting in increased detection costs and time-consuming. Summary of the invention

[0003] The present invention is directed to a packaging structure and a method for manufacturing the packaging structure, which can quickly and intuitively determine the product characteristics (such as a specific size) of the packaging structure without destroying the packaging structure.

[0004] According to an embodiment of the present invention, a packaging structure includes a unit substrate, a measuring piece, a chip and a packaging layer. The measuring piece is arranged on the unit substrate, and the cross-sectional width of the measuring piece changes with the height of the measuring piece. The chip includes an upper surface and a lower surface, and the lower surface is connected to the unit substrate. The packaging layer is arranged on the unit substrate and covers the chip and the measuring piece. The top surface of the measuring piece is exposed to the packaging layer, and the upper surface is spaced from the surface of the packaging layer by a distance, and the distance corresponds to the cross-sectional width of the top surface of the measuring piece.

[0005] In the packaging structure according to the embodiment of the present invention, the unit substrate includes a solder resist layer, and the solder resist layer is integrated with the measuring element.

[0006] In the packaging structure according to the embodiment of the present invention, the total height of the measuring member is equal to the thickness of the packaging layer.

[0007] According to an embodiment of the present invention, a method for manufacturing a packaging structure includes the following steps. A substrate is provided. At least one protrusion is provided, and the at least one protrusion is provided on the substrate, and the cross-sectional width of each at least one protrusion changes with the height of each at least one protrusion. At least one chip is provided, and each at least one chip includes an upper surface and a lower surface, and the lower surface is connected to the substrate. A packaging layer is provided, and the packaging layer covers at least one chip and at least one protrusion. The packaging layer and the at least one protrusion are ground, and the upper surface of each at least one chip is spaced from the surface of the ground packaging layer by a distance, and the at least one protrusion is ground to form at least one measuring piece, and the top surface of each at least one measuring piece is exposed to the ground packaging layer, and the distance corresponds to the cross-sectional width of the top surface of each at least one measuring piece. The substrate and the packaging layer are cut to form a packaging structure, and the substrate is cut to form at least one unit substrate.

[0008] In a method for manufacturing a packaging structure according to an embodiment of the present invention, the packaging structure includes a unit substrate, a chip, a measurement piece, and a packaging layer.

[0009] In the method for manufacturing a packaging structure according to an embodiment of the present invention, the packaging layer after grinding has a thickness, and the total height of at least one protrusion is greater than the thickness.

[0010] In the method for manufacturing the package structure according to the embodiment of the present invention, after grinding the package layer and at least one protruding member and before forming the package structure, the following steps are further included: cutting off the measuring member, wherein the cutting line is located between the at least one chip and the measuring member.

[0011] In the method for manufacturing a packaging structure according to an embodiment of the present invention, the packaging structure formed after cutting off the measuring piece includes a unit substrate, a chip and a packaging layer.

[0012] In the method for manufacturing a packaging structure according to an embodiment of the present invention, the substrate includes a solder resist layer, and the solder resist layer is integrated with at least one protrusion.

[0013] In the method for manufacturing a package structure according to an embodiment of the present invention, at least one protrusion is located at an edge of the substrate.

[0014] Based on the above, the top of the measuring piece of the packaging structure of the present invention is exposed on the packaging layer, and the cross-sectional width of the top corresponds to the distance between the upper surface of the chip and the surface of the packaging layer. The user can directly measure the cross-sectional width of the exposed top and know the distance between the upper surface of the chip and the surface of the packaging layer. In this way, the user can intuitively and quickly judge the product characteristics of the packaging structure, so as to improve the convenience of use of the packaging structure and reduce the detection cost and detection time. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figures 1 to 6 is a partial cross-sectional schematic diagram of a method for manufacturing a packaging structure according to an embodiment of the present invention;

[0016] Figure 7 yes Figure 6 A top view of a substrate;

[0017] Figure 8 yes Figure 6 A cross-sectional schematic diagram of a packaging structure;

[0018] Fig. 9 yes Figure 6 A partial cross-sectional schematic diagram of a method for manufacturing a packaging structure;

[0019] Fig.10 It is a schematic diagram of the package structure formed after cutting the measured piece;

[0020] Fig.11is a schematic diagram of a protruding member and a substrate according to another embodiment of the present invention;

[0021] Fig.12 yes Fig.11 Schematic diagram of the measured object and substrate. DETAILED DESCRIPTION

[0022] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0023] Figures 1 to 6 FIG. 4 is a partial cross-sectional schematic diagram of a method for manufacturing a packaging structure according to an embodiment of the present invention. Figure 7 yes Figure 6 Top view of the substrate. Figure 8 yes Figure 6 Please also refer to the cross-sectional diagram of the package structure. Figures 1 to 8 Regarding the manufacturing method of the packaging structure of this embodiment, first, Figure 1 As shown, a temporary support carrier S and a substrate 110a are provided. The temporary support carrier S is used to support the substrate 110a. The substrate 110a can be provided on the temporary support carrier S. The temporary support carrier S can be a plate, a film, or a fixture or a clamp dedicated to a machine device. However, it is not limited thereto. In an embodiment not shown, the substrate 110a can be directly provided on the machine device without using a temporary support carrier S.

[0024] Then, if Figure 2 As shown, at least one protrusion 120a is disposed on the substrate 110a. The material of the protrusion 120a in this embodiment is the same as the insulating material of the solder mask 112 of the substrate 110a, but is not limited thereto. Specifically, the solder mask 112 and the protrusion 120a can be integrated. The method of disposing the protrusion 120a is, for example, to form the protrusion 120a at the same time as disposing the solder mask 112 on the substrate 110a.

[0025] The cross-sectional width W1 of the protrusion 120a changes with the height H of the protrusion 120a. That is, the height of any point on the protrusion 120a corresponds to a specific cross-sectional width. The height H of the protrusion 120a is inversely proportional to the cross-sectional width W1, but is not limited thereto. The inclined surface S1 of the protrusion 120a and the bottom surface S2 have an angle β1, and the angle β1 corresponds to the total height H1 of the protrusion 120a.

[0026] The cross-sectional shape of the protrusion 120a is, for example, a triangle. The cross-sectional shape of the protrusion 120a of the present embodiment is a right triangle, but is not limited thereto. The cross-sectional shape of the protrusion 120a can be any triangle, such as an isosceles triangle, an equilateral triangle, etc. The angle β1 is, for example, 30 degrees, but is not limited thereto. In an embodiment not shown, the angle β1 is, for example, 45 degrees, 60 degrees, etc., which are easy to process. In another embodiment not shown, the angle β1 can be any angle.

[0027] like Figure 3 As shown in FIG. 1 , after the protrusion 120a is set, at least one chip 140 is set on the substrate 110a. The chip 140 includes an upper surface 142 and a lower surface 144. The lower surface 144 can be fixed to the substrate 110a by, for example, a die bonding adhesive. The upper surface 142 is opposite to the lower surface 144. The total height H1 of the protrusion 120a is greater than the distance D3 from the upper surface 142 of the chip 140 to the surface of the substrate 110a. After the chip 140 is set, as shown in FIG. Figure 4 As shown, bonding wires 160 and electronic components 170 are provided. The upper surface 142 of the chip 140 is electrically connected to the substrate 110a through the bonding wires 160. The electronic components 170 are provided beside the chip 140. The electronic components 170 are, for example, passive components, but are not limited thereto.

[0028] After the chip 140, the bonding wire 160 and the electronic component 170 are arranged, Figure 5 As shown, a packaging layer 150a is provided. The packaging layer 150a completely covers the chip 140, the bonding wire 160, the electronic component 170 and the protrusion 120a. After the packaging layer 150a is provided, the packaging layer 150a and the protrusion 120a are ground. Figure 5 The surface 152 ( Figure 6 ) and shows the thickness D2 of the polished encapsulation layer 150b (ie, the distance from the dotted line A to the surface of the substrate 110a). The protrusion 120a protrudes from the dotted line A, and the total height H1 of the protrusion 120a is greater than the thickness D2.

[0029] like Figure 6 As shown, after the packaging layer 150a and the protruding member 120a are ground, the upper surface 142 of the chip 140 is spaced apart from the surface 152 of the ground packaging layer 150b by a distance D1, and the protruding member 120a is ground to form the measuring member 130a. A cross-sectional width W2 of the measuring member 130a changes with the height H of the measuring member 130a. The shape of the measuring member 130a after grinding is a trapezoid. Since the protruding member 120a protrudes beyond the dotted line A and the packaging layer 150a completely covers the protruding member 120a ( Figure 5), after grinding, the top surface 132 of the measuring piece 130a is exposed on the surface 152 of the packaging layer 150b after grinding, and the top surface 132 of the measuring piece 130a can be directly seen from the outside. The total height H2 of the measuring piece 130a is equal to the thickness D2 of the packaging layer 150b after grinding, and the total height H2 is equal to the thickness D2 of the packaging layer 150b after grinding.

[0030] like Figure 7 As shown, the number of chips 140 disposed on the substrate 110a of this embodiment is, for example, 25, but is not limited thereto. The measuring piece 130a (protruding piece 120a) is located at the edge of the substrate 110a, and the number of the measuring pieces 130a (protruding pieces 120a) is, for example, two, but is not limited thereto. Without affecting the process of the packaging structure, the number of the measuring pieces 130a (protruding pieces 120a) may be any number, and may be disposed at any position of the substrate 110a. For example, in an embodiment not shown, the number of the measuring pieces 130a (protruding pieces 120a) may be four, and may be disposed on the four sides of the substrate 110a. In another embodiment not shown, the measuring piece 130a (protruding piece 120a) may be located between two adjacent chips 140. The shape of the substrate 110a is not limited to this embodiment.

[0031] After the encapsulation layer 150a and the protrusion 120a are ground, the temporary support carrier S is removed, and a film is plated on the surface 152 of the ground encapsulation layer 150b. The film layer 180 is formed on the surface 152 of the encapsulation layer 150b ( Figure 8 After the coating is completed, the packaging layer 150b and the substrate 110a are cut to form Figure 8 The package structure 100a is shown. The substrate 110a is cut to form unit substrates 110b.

[0032] The package structure 100a includes a unit substrate 110b, a chip 140, a measuring piece 130a, a bonding wire 160, an electronic component 170, a film layer 180, and a package layer 150b. The lower surface 144 of the chip 140 is connected to the unit substrate 110b, and the measuring piece 130a and the package layer 150b are disposed on the unit substrate 110b. The number of the chip 140 is one, but not limited thereto. The package structure 100a of this embodiment can be used for a fingerprint identification product, but not limited thereto.

[0033] The product characteristics of the package structure 100a, such as a fingerprint identifier, are related to the distance between the chip 140 and the film layer 180 (package layer 150b). The distance is the distance D1 between the upper surface 142 of the chip 140 and the surface 152 of the package layer 150b. If the distance (distance D1) is too large or too small, the sensitivity of the chip 140 will be affected.

[0034] The existing measurement method also includes cutting the package structure to obtain a cross section of the package structure to measure the spacing (distance D1). This measurement method will damage the package structure, resulting in increased testing costs and time consumption.

[0035] like Figure 5 and Figure 6 As shown, the thickness D2 of the package layer 150b after grinding is equal to the sum of the distance D3 and the spacing (distance D1). The thickness D2 is equal to the total height H2 of the measuring piece 130a. The total height H1 and the angle β1 of the protruding piece 120a are known values. The cross-sectional width W3 of the top surface 132 of the measuring piece 130a can be obtained by measurement and is a known value. According to the trigonometric function formula, the total height H2 of the measuring piece 130a (i.e., the thickness D2 of the package layer 150b) can be obtained by equation (1).

[0036] H2=H1-W3*tan(β1) (1)

[0037] The total height H2 of the measuring member 130a corresponds to the cross-sectional width W3. Figure 4 ), the distance D3 can be measured, so the distance D3 is a known value. According to equation (1) and the relationship between the total height H2 and the distances D1 and D3, the distance D1 can be obtained by equation (2).

[0038] D1=H1-(W3*(tanβ1))-D3 (2)

[0039] It can be seen that the distance D1 corresponds to the cross-sectional width W3 of the top surface 132 of the measuring piece 130a. The user can directly and intuitively obtain the value of the distance D1 by measuring the cross-sectional width W3 of the top surface 132 of the protruding piece 120a (measuring piece 130a). In this way, the user can quickly determine the product characteristics of the package structure 100a, thereby improving the convenience of use of the package structure 100a and reducing the detection cost and time.

[0040] Fig. 9 yes Figure 6 A partial cross-sectional schematic diagram of a method for manufacturing a packaging structure. Fig.10 is a schematic diagram of the package structure formed after cutting the measured piece. Please also refer to Fig. 9 and Fig.10, after grinding the packaging layer 150a and the protruding piece 120a and before forming the packaging structure, a step of cutting off the measuring piece 130a may also be included. Before cutting off the measuring piece 130a, the user may measure the cross-sectional width W3 of the top surface 132 of the measuring piece 130a to obtain the value of the distance D1, and then cut off the measuring piece 130a. The cutting line C is located between the chip 140 and the measuring piece 130a. The packaging structure 100b formed after cutting off the measuring piece 130a includes the unit substrate 110b, the chip 140, the bonding wire 160, the electronic component 170, the film layer 180 and the packaging layer 150b.

[0041] Fig.11 is a schematic diagram of a protrusion and a substrate according to another embodiment of the present invention. Fig.12 yes Fig.11 Schematic diagram of the measuring piece and substrate. Please also refer to Figure 5 , Fig.11 and Fig.12 The protrusion 120b of this embodiment is similar to the aforementioned embodiment, and the difference between the two is that the cross-sectional shape of the protrusion 120b of this embodiment is a trapezoid, and the material of the protrusion 120b is different from the material of the solder mask 112. Specifically, the cross-sectional shape of the protrusion 120b is an isosceles trapezoid, but is not limited thereto. The protrusion 120b is an independent component. The protrusion 120b is, for example, an independent insulating strip, and the material of the protrusion 120b is, for example, an insulating material such as FR4, but is not limited thereto. The protrusion 120b can be pre-set on the substrate 110a by adhesive.

[0042] like Fig.12 As shown, the angle β2 and the cross-sectional width W5 of the bottom surface of the measuring member 130b are known values, and the cross-sectional width W4 of the top surface 132 of the measuring member 130b can be measured and is a known value. According to the trapezoidal formula and the relationship between the total height H3 of the measuring member 130b (the thickness D2 of the encapsulation layer 150b) and the distances D1 and D3, the distance D1 can be obtained by equation (3).

[0043] D1=((W5-W4) / 2)*tan(β2)-D3 (3)

[0044] Thus, the user can directly and intuitively obtain the value of the distance D1 by measuring the cross-sectional width W4 of the top surface 132 of the measuring member 130b without destroying the original packaging structure, for example, by using a tool microscope or other measuring instruments with similar measuring functions. The protruding member 120b and the measuring member 130b of this embodiment have the same functions as the aforementioned embodiment. The user can set the protruding members 120a and 120b according to their needs.

[0045] In summary, the top of the measuring piece of the packaging structure of the present invention is exposed on the packaging layer, and the cross-sectional width of the top corresponds to the distance between the upper surface of the chip and the surface of the packaging layer. The user can directly measure the cross-sectional width of the exposed top and know the distance between the upper surface of the chip and the surface of the packaging layer. In this way, the user can intuitively and quickly judge the product characteristics of the packaging structure without destroying the original packaging structure, saving measurement procedures, thus effectively improving the convenience of use of the packaging structure and reducing detection costs and time.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A packaging structure, characterized in that: include: Unit substrate; A measuring piece, disposed on the unit substrate, wherein the cross-sectional width of the measuring piece changes with the height of the measuring piece; A chip, comprising an upper surface and a lower surface, wherein the lower surface is connected to the unit substrate; as well as The packaging layer is arranged on the unit substrate and covers the chip and the measuring piece. The top surface of the measuring piece is exposed from the packaging layer. The upper surface is spaced apart from the surface of the packaging layer by a distance corresponding to the cross-sectional width of the top surface of the measuring piece.

2. The packaging structure according to claim 1, characterized in that: The unit substrate comprises a solder resist layer, and the solder resist layer is integrated with the measuring element.

3. The packaging structure according to claim 1, characterized in that: The total height of the measuring member is equal to the thickness of the packaging layer.

4. A method for manufacturing a packaging structure, comprising the following steps: Setting a substrate; Disposing at least one protrusion, wherein the at least one protrusion is disposed on the substrate, and the cross-sectional width of each of the at least one protrusion changes with the height of each of the at least one protrusion; Disposing at least one chip, each of the at least one chip comprises an upper surface and a lower surface, and the lower surface is connected to the substrate; Disposing a packaging layer, wherein the packaging layer covers the at least one chip and the at least one protruding member; Grinding the packaging layer and the at least one protruding member, the upper surface of each of the at least one chip is spaced a distance from the surface of the ground packaging layer, the at least one protruding member is ground to form at least one measuring member, the top surface of each of the at least one measuring member is exposed from the ground packaging layer, and the distance corresponds to the cross-sectional width of the top surface of each of the at least one measuring member; as well as The substrate and the packaging layer are cut to form a packaging structure, and the substrate is cut to form at least one unit substrate.

5. The method for manufacturing a packaging structure according to claim 4, characterized in that: The packaging structure includes the unit substrate, the chip, the measuring piece and the packaging layer.

6. The method for manufacturing a packaging structure according to claim 4, characterized in that: The packaging layer after grinding has a thickness, and the total height of the at least one protrusion is greater than the thickness.

7. The method for manufacturing a packaging structure according to claim 4, characterized in that: After grinding the packaging layer and the at least one protruding member and before forming the packaging structure, the following steps are also included: The measuring piece is cut off, and a cutting line is located between the at least one chip and the measuring piece.

8. The method for manufacturing a packaging structure according to claim 7, characterized in that: The packaging structure formed after the measuring piece is cut away includes the unit substrate, the chip and the packaging layer.

9. The method for manufacturing a packaging structure according to claim 4, characterized in that: The substrate comprises a solder resist layer, and the solder resist layer is integrated with the at least one protruding member.

10. The method for manufacturing a packaging structure according to claim 4, characterized in that: The at least one protruding piece is located at the edge of the substrate.

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