Turnover device for chip frame cleaning

Abstract

The invention relates to the technical field of chip frame cleaning equipment, in particular to a turnover device for chip frame cleaning, which comprises a bearing frame, a turnover assembly is arranged at the top of the bearing frame, and the turnover assembly comprises a support frame fixedly connected to the top of the bearing frame. Firstly, a chip frame is placed on an overturning plate, an air cylinder pushes a positioning plate to move towards the chip frame and positions the two sides of the chip frame, in the moving process of the positioning plate, the positioning plate drives a sliding rod to move, a rotating shaft on the sliding rod moves towards the upper portion of the chip frame, meanwhile, a guide groove guides a guide rod, and therefore the chip frame can be accurately positioned. The guide rod moves along the inclined surface of the guide groove, the guide rod drives the sliding frame to descend, the sliding frame drives the rotating shaft and the sponge pressing roller to extrude the chip frame, the sponge pressing roller prevents the chip frame from being separated from the device in the overturning process, and the firmness of the chip frame in the overturning process is enhanced.

Description

Technical Field

[0001] The present application relates to the technical field of chip frame cleaning equipment, and in particular to a flipping device for cleaning a chip frame. Background Art

[0002] Related technology: In the semiconductor back-end packaging process, before chip products enter the cleaning machine, in order to protect the products, they need to find a sturdy backing. The chip frame plays the role of a backing. After cleaning and drying, the chip frame needs to be transferred. At present, the most common method is to use a vacuum suction cup to absorb the chip and then transfer and place it.

[0003] In the prior art (Announcement No. CN111554602B, Patent Name: A Flipping and Unloading Device for Loading Chips on a Tray), the whole tray is lifted by forks, flipped and poured, and compared with the vacuum suction cup row-by-row pick-and-place method used in the prior art, the production efficiency is greatly improved for small-sized chips (a standard-sized tray has a large number of rows and columns), and when it comes to switching product specifications, there is no need to frequently replace the suction cup fixture. In addition, since the lower frame is turned upward and closed with the upper frame before flipping, there is no risk of material falling. In the process of implementing this technical solution, it is found that there are at least the following problems in the prior art.

[0004] In the prior art, during the flipping operation, since the frame is not completely closed, its stability is insufficient, which can easily cause the chips in the chip frame to scatter and cause accidents. The placement direction of the product is wrong before flipping, and the product may often slip during flipping or be misaligned after flipping, which affects subsequent operations, prolongs the processing time, and reduces the processing efficiency. Summary of the invention

[0005] The present application aims to at least solve one of the technical problems in the prior art that the product may be placed in the wrong direction before flipping, and may slip when flipping or be misaligned after flipping. To this end, the present application proposes a flipping device for cleaning a chip frame.

[0006] According to an embodiment of the present application, a flipping device for cleaning a chip frame includes a carrier frame, a flipping assembly is arranged on the top of the carrier frame, the flipping assembly includes a support frame fixedly connected to the top of the carrier frame, the side wall of the support frame is fixedly connected to a servo motor, the output end of the servo motor is fixedly connected to a rotating rod, the outer wall of the rotating rod is fixedly connected to a flip plate, the side wall of the flip plate is fixedly connected to a support plate, the top of the support plate is fixedly connected to a cylinder, the output end of the cylinder is fixedly connected to a positioning plate, and the top of the flip plate is fixedly connected to a positioning piece.

[0007] Preferably, a clamping assembly is provided on the top of the positioning plate, and the clamping assembly includes a sliding rod fixedly connected to the top of the positioning plate, the outer wall of the sliding rod is slidably connected to a sliding frame, the inner wall of the sliding frame is rotatably connected to a rotating shaft, the outer wall of the rotating shaft is fixedly connected to a sponge clamping roller, the side wall of the sliding frame is fixedly connected to a guide rod, the top of the flip plate is fixedly connected to a guide plate, the side wall of the guide plate is provided with a guide groove, and the inner wall of the guide groove is slidably connected to the outer wall of the guide rod.

[0008] Preferably, the side wall of the positioning plate is provided with a positioning assembly, and the positioning assembly includes a hinge fixedly connected to the side wall of the positioning plate, the side wall of the hinge is rotatably connected to a push rod, and the end of the push rod away from the hinge is rotatably connected to a connecting rod, the top of the flip plate is fixedly connected to a fixing rod, the outer wall of the fixing rod is rotatably connected to a T-shaped plate, the top of the T-shaped plate is fixedly connected to the bottom end of the connecting rod, the side wall of the T-shaped plate is rotatably connected to a positioning column, the inner wall of the flip plate is fixedly connected to a limiting arc groove plate, and the inner wall of the limiting arc groove plate is slidably connected to the outer wall of the positioning column.

[0009] Preferably, the top of the flip plate is fixedly connected to an air box, the inner wall of the air box is fixedly connected to a return spring, the end of the return spring away from the air box is fixedly connected to an extrusion plate, the side wall of the extrusion plate is fixedly connected to a push column, and the push column passes through the inner wall of the air box and extends to the outside.

[0010] Preferably, the left end of the push column is fixedly connected with an extrusion push plate, the side wall of the air box is connected with a delivery pipe, one end of the delivery pipe is fixedly connected with an inflatable airbag ball, and the outer wall of the inflatable airbag ball is fixedly connected to the top of the positioning column.

[0011] Preferably, an adsorption assembly is provided on the top of the supporting frame, and the adsorption assembly includes a vacuum pump fixedly connected to the top of the supporting frame, the suction end of the vacuum pump is fixedly connected to a suction pipe, the end of the suction pipe away from the vacuum pump is fixedly connected to an adsorption box, the side wall of the adsorption box is fixedly connected to a support seat, and the bottom of the support seat is fixedly connected to the top of the supporting frame.

[0012] Preferably, a hose is connected to the side wall of the adsorption box, one end of the hose is fixedly connected to a suction cup, the outer wall of the suction cup is fixedly connected to a suction cup bracket, and the side wall of the suction cup bracket is fixedly connected to the bottom of the flip plate.

[0013] Preferably, a gravity plate is provided through the bottom of the adsorption box, the outer wall of the gravity plate is slidably connected to the inner wall of the adsorption box, a groove is provided on the side wall of the gravity plate, a push rod is fixedly connected to the bottom of the gravity plate, and an L-shaped push rod is fixedly connected to the outer surface of the rotating rod.

[0014] Preferably, a cleaning assembly is provided at the bottom of the flip plate, and the cleaning assembly includes a connecting seat fixedly connected to the bottom of the flip plate, the inner wall of the connecting seat is rotatably connected to a movable column, the outer surface of the movable column is slidably connected to a limiting slot plate, the side wall of the limiting slot plate is fixedly connected to an arc-shaped cylinder, the outer wall of the arc-shaped cylinder is fixedly connected to the side wall of the supporting frame, the outer surface of the movable column is fixedly connected to an arc-shaped rod, and the arc-shaped rod penetrates the side wall of the arc-shaped cylinder and extends to the inner side.

[0015] Preferably, one end of the arc rod away from the movable column is fixedly connected to an air-pushing circular plate, the outer wall of the air-pushing circular plate is slidably connected to the inner wall of the arc cylinder, the side wall of the arc cylinder is fixedly connected to an air supply pipeline, one end of the air supply pipeline is connected through the side wall of the positioning plate, and the side wall of the positioning plate is provided with an air injection hole.

[0016] The beneficial effects of this application are: 1. The flipping device for cleaning the chip frame, when the chip frame needs to be flipped 90°, first place the chip frame on the flipping plate, the cylinder pushes the positioning plate to move toward the chip frame, and positions the chip frame on both sides. At the same time, during the movement of the positioning plate, the positioning plate drives the slide bar to move, and the rotating shaft on the slide bar moves above the chip frame. At the same time, the guide groove guides the guide rod, so that the guide rod moves along the inclined surface of the guide groove, so that the guide rod drives the slide frame to descend, and the slide frame drives the rotating shaft and the sponge pressing roller to squeeze the chip frame. The sponge pressing roller prevents the chip frame from detaching from the device during the flipping process, thereby enhancing the firmness of the chip frame when flipping. At the same time, the setting of the sponge pressing roller prevents the chip frame from being damaged during clamping.

[0017] 2. The flipping device for cleaning the chip frame, when clamping the chip frame, the positioning plate pushes the push rod and the connecting rod to move, the connecting rod will push the T-shaped plate to move with the fixed rod as the axis, and at the same time the limiting arc groove plate limits the positioning column, so that the positioning column can move toward the chip frame along the limiting arc groove plate, so that the positioning column chip frame is positioned, when the T-shaped plate is moving, the T-shaped plate pushes the extrusion push plate to move, the extrusion push plate drives the push column and the extrusion plate to squeeze the gas inside the air box, and the extruded gas is transported to the expansion airbag ball through the delivery pipeline, so that the expansion airbag ball can be expanded, and the expanded expansion airbag ball limits the chip frame, thereby realizing multi-directional fixation of the chip frame, avoiding the problem of the chip frame falling, further improving the stability during flipping, and being able to reduce the chip frame straightening process, thereby improving production efficiency.

[0018] 3. The flipping device for cleaning the chip frame, when flipping, the vacuum pump sucks out the gas in the adsorption box through the suction pipe, so that a vacuum state is formed in the adsorption box. When the flipping plate is in the initial state, the gravity plate blocks the hole of the hose to prevent the suction cup from adsorbing the chip frame, thereby affecting the clamping and positioning of the chip frame by the clamping assembly and the positioning assembly. During the flipping process, the rotating rod drives the L-shaped push rod to rotate, and the L-shaped push rod drives the oblique push rod to rise, and the oblique push rod drives the gravity plate to rise, thereby releasing the blockage of the hole of the hose, so that the hose is connected to the inside of the adsorption box, so that the suction cup can adsorb the chip frame being flipped. After flipping to 80°, the gravity plate continues to block the hole of the hose, so that the chip frame can be separated from the flipping plate, thereby improving the practicability of the device. The automatic flipping operation of the chip can be realized through the cooperation of the clamping assembly and the adsorption assembly, which effectively improves the working efficiency of the chip frame flipping and the accuracy of the chip flipping.

[0019] 4. The flipping device for cleaning the chip frame, when the second chip frame needs to be flipped after the flipping is completed, during the process of the flipping plate moving to the initial position, the flipping plate drives the connecting seat and the moving column to move, and the moving column drives the arc rod and the air-pushing circular plate to squeeze the gas in the arc cylinder, and the squeezed gas is output to the positioning plate through the gas pipeline, and the flipping plate is cleaned through the air jet hole. Since the air jet hole is set as a small hole, the flow rate of the outgoing gas can be made faster, thereby cleaning the moisture on the surface of the flipping plate, ensuring the stability and flatness of the chip frame fixation.

[0020] 5. The flipping device for cleaning the chip frame, when flipped to 85°, the cylinder releases the clamping assembly and the positioning assembly from clamping the chip frame, and the push column contacts the fixed inclined plate, so that the push column moves along the slope surface of the fixed inclined plate, and the push column pushes the sliding guide rod to move on the fixed protrusion. During the movement, the sliding guide rod pulls the connecting rod through the inclined groove, and the connecting rod drives the push seat to move, and the push seat drives the push block to push the chip frame, so that the chip frame is separated from the flipping plate, preventing the viscosity of the water itself, the surface tension and the adhesion provided by the atmospheric pressure from adsorbing the chip frame and affecting the discharge, thereby improving the stability of the discharge after the device is flipped.

[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 is a schematic diagram of the overall three-dimensional structure according to an embodiment of the present application; Figure 2 is a schematic diagram of the top structure of the carrier according to an embodiment of the present application; Figure 3 is a schematic diagram of the overall structure of a flipping device according to an embodiment of the present application; Figure 4 is a schematic structural diagram of a flipping device according to an embodiment of the present application; Figure 5 is a schematic diagram of the overall structure of a flip assembly according to an embodiment of the present application; Figure 6 is an enlarged view of the structure of the clamping assembly according to an embodiment of the present application; Figure 7 is a schematic diagram of the overall structure of a positioning component according to an embodiment of the present application; Figure 8 is a schematic diagram of the structure of a positioning component according to an embodiment of the present application; Fig. 9 is a cross-sectional view of the adsorption component structure according to an embodiment of the present application; Fig.10 is a cross-sectional view of the cleaning component structure according to an embodiment of the present application; Fig.11 is a schematic structural diagram of a feeding mechanism according to an embodiment of the present application; Fig.12 is a schematic structural diagram of a discharging assembly during a flipping process according to an embodiment of the present application; Fig.13 It is a schematic cross-sectional view of the discharge assembly structure according to an embodiment of the present application.

[0024] Icons: 1. Carrying frame; 11. Three-axis motion mechanism; 12. Clamping mechanism; 13. Pre-cleaning mechanism; 14. Drying mechanism; 15. Turning device; 16. Feeding mechanism; 17. Cleaning mechanism; 2. Turning assembly; 201. Support frame; 202. Servo motor; 203. Rotating rod; 204. Turning plate; 205. Support plate; 206. Cylinder; 207. Positioning plate; 208. Positioning piece; 3. Clamping assembly; 301, slide bar; 302, slide frame; 303, rotating shaft; 304, sponge clamping roller; 305, guide rod; 306, guide plate; 307, guide groove; 4, positioning assembly; 401, hinge; 402, push rod; 403, connecting rod; 404, fixing rod; 405, T-shaped plate; 406, positioning column; 407, limiting arc groove plate; 41, air box; 42, return spring; 4 3. Extrusion plate; 44. Push column; 45. Extrusion push plate; 46. Delivery pipeline; 47. Inflatable airbag ball; 5. Adsorption assembly; 501. Vacuum pump; 502. Suction pipeline; 503. Adsorption box; 504. Support seat; 505. Hose; 506. Suction cup; 507. Suction cup bracket; 51. Gravity plate; 52. Notch; 53. Push diagonal rod; 54. L-shaped push rod; 6. Cleaning assembly; 601. Connector Connecting seat; 602, moving column; 603, limiting slot plate; 604, arc tube; 605, arc rod; 606, air-pushing circular plate; 607, air pipeline; 608, air jet hole; 7, discharging assembly; 701, connecting spring; 702, pushing seat; 703, connecting rod; 704, fixed protrusion; 705, sliding guide rod; 706, inclined notch; 707, pushing column; 708, fixed inclined plate; 71, pushing block. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0026] In order to make the purpose, technical solutions and advantages of the implementation methods of this application clearer, the technical solutions in the implementation methods of this application will be clearly and completely described below in conjunction with the drawings in the implementation methods of this application. Obviously, the described implementation methods are part of the implementation methods of this application, not all of the implementation methods. Based on the implementation methods in this application, all other implementation methods obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] A chip frame cleaning flipping device according to an embodiment of the present application will be described below with reference to the accompanying drawings.

[0034] like Figure 1 to Figure 2As shown, a flipping device for cleaning a chip frame according to an embodiment of the present application includes a carrier 1, a three-axis motion mechanism 11 is arranged on the top of the carrier 1, a clamping mechanism 12 is arranged on the side wall of the three-axis motion mechanism 11, a pre-cleaning mechanism 13 is arranged on the top of the carrier 1, a drying mechanism 14 is arranged on the top of the carrier 1, a flipping device 15 is arranged on the top of the carrier 1, a feeding mechanism 16 is arranged on one side of the flipping device 15, and a cleaning mechanism 17 is arranged on the side wall of the carrier 1. First, the three-axis motion mechanism 11 drives the clamping mechanism 12 to move the chip frame into the pre-cleaning mechanism 13, and the pre-cleaning mechanism 13 can perform the first cleaning on the chip frame. After the first cleaning, the chip frame is transported to the drying mechanism 14 for drying through the three-axis motion mechanism 11 and the clamping mechanism 12, and then the chip frame is placed on the flipping device 15 to flip it, and after flipping, the chip frame is transported to the cleaning mechanism 17 for secondary cleaning through the feeding mechanism 16, and also includes: like Figures 3 to 6 As shown, a flip assembly 2 is provided on the top of the carrier frame 1, and the flip assembly 2 includes a support frame 201 fixedly connected to the top of the carrier frame 1, a servo motor 202 is fixedly connected to the side wall of the support frame 201, a rotating rod 203 is fixedly connected to the output end of the servo motor 202, and a flip plate 204 is fixedly connected to the outer wall of the rotating rod 203. The servo motor 202 and the rotating rod 203 drive the flip plate 204 to move, the side wall of the flip plate 204 is fixedly connected to a support plate 205, the top of the support plate 205 is fixedly connected to a cylinder 206, and the output end of the cylinder 206 is fixedly connected to a positioning plate 207. The purpose of this arrangement is to enable the cylinder 206 to push the positioning plate 207 to position the chip frame, and the top of the flip plate 204 is fixedly connected to a positioning member 208. The purpose of this arrangement is to enable the positioning member 208 to support the chip frame during the flipping process.

[0035] A clamping assembly 3 is provided on the top of the positioning plate 207. The clamping assembly 3 includes a slide bar 301 fixedly connected to the top of the positioning plate 207. The outer wall of the slide bar 301 is slidably connected to a slide frame 302. The inner wall of the slide frame 302 is rotatably connected to a rotating shaft 303. The outer wall of the rotating shaft 303 is fixedly connected to a sponge clamping roller 304. The sponge clamping roller 304 is provided to prevent the chip frame from being separated from the device during the flipping process and to prevent the chip frame from being damaged during the clamping process. The side wall of the slide frame 302 is fixedly connected to a guide rod 305. The top of the flip plate 204 is fixedly connected to a guide plate 306. The side wall of the guide plate 306 is provided with a guide groove 307. The inner wall of the guide groove 307 is slidably connected to the outer wall of the guide rod 305. This is set up so that the positioning plate 207 drives the slide rod 301 to move. While the rotating shaft 303 on the slide rod 301 moves toward the top of the chip frame, the guide groove 307 guides the guide rod 305, so that the guide rod 305 moves along the inclined surface of the guide groove 307, so that the guide rod 305 drives the slide frame 302 to descend, and the slide frame 302 drives the rotating shaft 303 and the sponge pressing roller 304 to squeeze the chip frame, thereby enhancing the firmness of the chip frame when it is flipped. At the same time, the setting of the sponge pressing roller 304 prevents the chip frame from being damaged during clamping.

[0036] like Figures 7 to 9 As shown, the side wall of the positioning plate 207 is provided with a positioning assembly 4, and the positioning assembly 4 includes a hinge 401 fixedly connected to the side wall of the positioning plate 207, and the side wall of the hinge 401 is rotatably connected to a push rod 402, and the end of the push rod 402 away from the hinge 401 is rotatably connected to a connecting rod 403. This arrangement is for the positioning plate 207 to push the push rod 402 and the connecting rod 403 to move, and the top of the flip plate 204 is fixedly connected to a fixed rod 404, and the outer wall of the fixed rod 404 is rotatably connected to A T-shaped plate 405 is connected, the top of the T-shaped plate 405 is fixedly connected to the bottom end of the connecting rod 403, the side wall of the T-shaped plate 405 is rotatably connected to a positioning column 406, the inner wall of the flip plate 204 is fixedly connected to a limiting arc groove plate 407, the inner wall of the limiting arc groove plate 407 is slidably connected to the outer wall of the positioning column 406, and this arrangement is to limit the arc groove plate 407 to limit the positioning column 406, so that the positioning column 406 can move toward the chip frame along the limiting arc groove plate 407; The top of the flip plate 204 is fixedly connected to the air box 41, the inner wall of the air box 41 is fixedly connected to the return spring 42, and the end of the return spring 42 away from the air box 41 is fixedly connected to the extrusion plate 43, so that the return spring 42 drives the extrusion plate 43 to reset, and the side wall of the extrusion plate 43 is fixedly connected to the push column 44, the push column 44 passes through the inner wall of the air box 41 and extends to the outside, and the left end of the push column 44 is fixedly connected to the extrusion push plate 45, and the side wall of the air box 41 is connected to the delivery pipe 46, and one end of the delivery pipe 46 is fixedly connected to the expansion airbag ball 47, and the outer wall of the expansion airbag ball 47 is fixedly connected to the top of the positioning column 406, so that the expansion airbag ball 47 after expansion can limit the chip frame, thereby realizing multi-directional fixation of the chip frame.

[0037] The top of the carrier 1 is provided with an adsorption assembly 5, which includes a vacuum pump 501 fixedly connected to the top of the carrier 1, a suction end of the vacuum pump 501 is fixedly connected to a suction pipe 502, and an end of the suction pipe 502 away from the vacuum pump 501 is fixedly connected to an adsorption box 503, so that the vacuum pump 501 can suck out the gas in the adsorption box 503 through the suction pipe 502, and the side wall of the adsorption box 503 is fixedly connected to a support seat 504, and the bottom of the support seat 504 is fixedly connected to the top of the carrier 1, and the side wall of the adsorption box 503 is connected to a hose 505 One end of the hose 505 is fixedly connected to a suction cup 506, the outer wall of the suction cup 506 is fixedly connected to a suction cup bracket 507, the side wall of the suction cup bracket 507 is fixedly connected to the bottom of the flip plate 204, a gravity plate 51 is arranged through the bottom of the adsorption box 503, the outer wall of the gravity plate 51 is slidably connected to the inner wall of the adsorption box 503, a slot 52 is provided on the side wall of the gravity plate 51, a push rod 53 is fixedly connected to the bottom of the gravity plate 51, and an L-shaped push rod 54 is fixedly connected to the outer surface of the rotating rod 203, so that the L-shaped push rod 54 pushes the push rod 53 to rise during the flipping.

[0038] A cleaning assembly 6 is provided at the bottom of the flip plate 204, and the cleaning assembly 6 includes a connecting seat 601 fixedly connected to the bottom of the flip plate 204, the inner wall of the connecting seat 601 is rotatably connected to a moving column 602, the outer surface of the moving column 602 is slidably connected to a limiting slot plate 603, the side wall of the limiting slot plate 603 is fixedly connected to an arc tube 604, the outer wall of the arc tube 604 is fixedly connected to the side wall of the supporting frame 1, the outer surface of the moving column 602 is fixedly connected to an arc rod 605, the arc rod 605 penetrates the side wall of the arc tube 604 and extends to the inside, the end of the arc rod 605 away from the moving column 602 is fixedly connected to an air-pushing circular plate 606, the outer wall of the air-pushing circular plate 606 is slidably connected to the inner wall of the arc tube 604, and the side wall of the arc tube 604 is fixedly connected to the gas pipeline 60 7. One end of the gas pipeline 607 is connected to the side wall of the positioning plate 207. The side wall of the positioning plate 207 is provided with an air jet hole 608. When the second chip frame needs to be flipped after the flipping is completed, the flip plate 204 moves to the initial position. The flip plate 204 drives the connecting seat 601 and the moving column 602 to move. The moving column 602 drives the arc rod 605 and the air pushing circular plate 606 to squeeze the gas in the arc cylinder 604. The squeezed gas is output to the positioning plate 207 through the gas pipeline 607, and the flip plate 204 is cleaned through the air jet hole 608. Since the air jet hole 608 is set as a small hole, the flow rate of the gas passing through can be increased, thereby cleaning the moisture on the surface of the flip plate 204 to ensure the stability and flatness of the chip frame fixation.

[0039] like Figures 10 to 13It is shown that after pre-cleaning and drying, there will be a small amount of water in the chip frame. When the water in the frame falls onto the flip plate 204, the viscosity of the water itself, the surface tension and the adhesion provided by the atmospheric pressure make it difficult for the chip frame to separate from the flip plate 204, thereby affecting the flipping effect of the chip frame. A discharge assembly 7 is provided at the bottom of the flip plate 204. The discharge assembly 7 includes a connecting spring 701 fixedly connected to the bottom of the flip plate 204, and the end of the connecting spring 701 away from the flip plate 204 is fixedly connected to a push seat 702, and the side wall of the push seat 702 is fixedly connected to a push block 71, and the side wall of the push seat 702 is fixedly connected to a connecting rod 703, and the side wall of the suction cup bracket 507 is fixedly connected to a fixed protrusion 704, and the side wall of the fixed protrusion 704 is slidably connected to a sliding guide rod 705, and the side wall of the sliding guide rod 705 is provided with an oblique notch 706, and the inner wall of the oblique notch 706 is connected to the connecting rod 703. The outer wall of the feeding mechanism 16 is slidably connected, one end of the sliding guide rod 705 is fixedly connected with a push column 707, and the outer wall of the feeding mechanism 16 is fixedly connected with a fixed inclined plate 708. When flipped to 85°, the cylinder 206 releases the clamping assembly 3 and the positioning assembly 4 from clamping the chip frame, and the push column 707 contacts the fixed inclined plate 708, so that the push column 707 moves along the slope surface of the fixed inclined plate 708, so that the push column 707 pushes the sliding guide rod 705 to move on the fixed protrusion 704. During the movement, the sliding guide rod 705 pulls the connecting rod 703 through the inclined notch 706, and the connecting rod 703 drives the push seat 702 to move, and the push seat 702 drives the push block 71 to push the chip frame, so that the chip frame is separated from the flip plate 204, preventing the viscosity of the water itself, the surface tension and the adhesion provided by the atmospheric pressure from adsorbing the chip frame to affect the discharge, thereby improving the stability of the discharge after the device is flipped.

[0040] Specifically, the working principle of the flipping device for cleaning the chip frame is as follows: when the chip frame needs to be flipped 90°, the chip frame is first placed on the flipping plate 204, and the cylinder 206 pushes the positioning plate 207 to move toward the chip frame to position the chip frame on both sides. At the same time, during the movement of the positioning plate 207, the positioning plate 207 drives the slide bar 301 to move, and the rotating shaft 303 on the slide bar 301 moves toward the top of the chip frame. Since the guide groove 307 guides the guide rod 305, the guide rod 305 moves along the inclined surface of the guide groove 307, so that the guide rod 305 drives the sliding frame 302 to descend, and the sliding frame 302 drives the rotating shaft 303 and the sponge pressing roller 304 to squeeze the chip frame. The sponge pressing roller 304 prevents the chip frame from detaching from the device during the flipping process, thereby enhancing the firmness of the chip frame when flipping. At the same time, the setting of the sponge pressing roller 304 prevents the chip frame from being damaged during clamping. During clamping, the positioning plate 207 pushes the push rod 402 and the connecting rod 403 to move, and the connecting rod 403 will push the T-shaped plate 405 to move with the fixed rod 404 as the axis, and at the same time, the limiting arc groove plate 407 limits the positioning column 406, so that the positioning column 406 can move toward the chip frame along the limiting arc groove plate 407, so that the positioning column 406 chip frame is positioned, and when the T-shaped plate 405 is moving, the T-shaped plate 405 pushes the extrusion push plate 45 to move, and the extrusion push plate 45 drives the push column 44 and the extrusion plate 43 to squeeze the gas inside the air box 41, and the extruded gas is transported to the expansion balloon ball 47 through the delivery pipe 46, so that the expansion balloon ball 47 can be expanded, and the expanded expansion balloon ball 47 after expansion limits the chip frame, thereby realizing multi-directional fixation of the chip frame, avoiding the problem of the chip frame falling, further improving the stability during flipping, and being able to reduce the chip frame straightening process, thereby improving production efficiency; When flipping, the vacuum pump 501 sucks out the gas in the adsorption box 503 through the suction pipe 502, so that a vacuum state is formed in the adsorption box 503. When the flip plate 204 is in the initial state, the gravity plate 51 blocks the hole of the hose 505 to prevent the suction cup 506 from adsorbing the chip frame, thereby affecting the clamping and positioning of the chip frame by the clamping component 3 and the positioning component 4. During the flipping process, the rotating rod 203 drives the L-shaped push rod 54 to rotate, and the L-shaped push rod 54 pushes the push rod 53 to rise, and the push rod 53 drives the gravity plate 51 is raised, thereby releasing the blocking of the hole of the hose 505, so that the hose 505 is connected with the inside of the adsorption box 503, so that the suction cup 506 can adsorb the chip frame being flipped. After flipping to 80°, the gravity plate 51 continues to block the hole of the hose 505, so that the chip frame can be separated from the flip plate 204, thereby improving the practicality of the device. The automatic flipping operation of the chip can be realized through the cooperation of the pressing component 3 and the adsorption component 5, which effectively improves the working efficiency of the chip frame flipping and improves the accuracy of the chip flipping. When the flipping is completed and the second chip frame needs to be flipped, the flip plate 204 moves to the initial position. The flip plate 204 drives the connecting seat 601 and the moving column 602 to move. The moving column 602 drives the arc rod 605 and the air-pushing circular plate 606 to squeeze the gas in the arc cylinder 604. The squeezed gas is output to the positioning plate 207 through the gas pipeline 607, and the flip plate 204 is cleaned through the air jet hole 608. Since the air jet hole 608 is set as a small hole, the flow rate of the gas passing through can be increased, thereby cleaning the moisture on the surface of the flip plate 204 to ensure the stability and flatness of the chip frame. When flipped to 85°, the cylinder 206 presses the Component 3 and positioning component 4 release the clamping of the chip frame, and the push column 707 contacts the fixed inclined plate 708, so that the push column 707 moves along the slope surface of the fixed inclined plate 708, and the push column 707 pushes the sliding guide rod 705 to move on the fixed protrusion 704. During the movement, the sliding guide rod 705 pulls the connecting rod 703 through the inclined groove 706, and the connecting rod 703 drives the push seat 702 to move, and the push seat 702 drives the push block 71 to push the chip frame, so that the chip frame is separated from the flip plate 204, preventing the viscosity of the water itself, the surface tension and the adhesion provided by the atmospheric pressure from adsorbing the chip frame and affecting the discharge, thereby improving the stability of the discharge after the device is flipped.

[0041] It should be noted that the specific models and specifications of the servo motor 202, cylinder 206 and vacuum pump 501 need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be repeated in detail.

[0042] The principles of the servo motor 202, the cylinder 206 and the vacuum pump 501 are clear to those skilled in the art and will not be described in detail herein.

[0043] The above are only embodiments of the present application and are not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0044] The above are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be covered by the protection scope of the present application.

Claims

1. A chip frame cleaning flipping device, comprising a carrier frame (1), characterized in that: A flip assembly (2) is arranged on the top of the carrier frame (1), and the flip assembly (2) comprises a support frame (201) fixedly connected to the top of the carrier frame (1); a servo motor (202) is fixedly connected to the side wall of the support frame (201); a rotating rod (203) is fixedly connected to the output end of the servo motor (202); a flip plate (204) is fixedly connected to the outer wall of the rotating rod (203); a support plate (205) is fixedly connected to the side wall of the flip plate (204); a cylinder (206) is fixedly connected to the top of the support plate (205); a positioning plate (207) is fixedly connected to the output end of the cylinder (206); and a positioning member (208) is fixedly connected to the top of the flip plate (204).

2. The chip frame cleaning flipping device according to claim 1, characterized in that: A clamping assembly (3) is provided at the top of the positioning plate (207), and the clamping assembly (3) comprises a sliding rod (301) fixedly connected to the top of the positioning plate (207); the outer wall of the sliding rod (301) is slidably connected to a sliding frame (302); the inner wall of the sliding frame (302) is rotatably connected to a rotating shaft (303); the outer wall of the rotating shaft (303) is fixedly connected to a sponge clamping roller (304); the side wall of the sliding frame (302) is fixedly connected to a guide rod (305); the top of the flip plate (204) is fixedly connected to a guide plate (306); the side wall of the guide plate (306) is provided with a guide groove (307); the inner wall of the guide groove (307) is slidably connected to the outer wall of the guide rod (305).

3. The chip frame cleaning flipping device according to claim 2, characterized in that: The side wall of the positioning plate (207) is provided with a positioning assembly (4), and the positioning assembly (4) comprises a hinge (401) fixedly connected to the side wall of the positioning plate (207); the side wall of the hinge (401) is rotatably connected to a push rod (402); one end of the push rod (402) away from the hinge (401) is rotatably connected to a connecting rod (403); the top of the flip plate (204) is fixedly connected to a fixing rod (404); the outer wall of the fixing rod (404) is rotatably connected to a T-shaped plate (405); the top of the T-shaped plate (405) is fixedly connected to the bottom end of the connecting rod (403); the side wall of the T-shaped plate (405) is rotatably connected to a positioning column (406); the inner wall of the flip plate (204) is fixedly connected to a limiting arc groove plate (407); the inner wall of the limiting arc groove plate (407) is slidably connected to the outer wall of the positioning column (406).

4. The chip frame cleaning flipping device according to claim 3, characterized in that: The top of the flip plate (204) is fixedly connected to an air box (41), the inner wall of the air box (41) is fixedly connected to a return spring (42), one end of the return spring (42) away from the air box (41) is fixedly connected to an extrusion plate (43), the side wall of the extrusion plate (43) is fixedly connected to a push column (44), and the push column (44) penetrates the inner wall of the air box (41) and extends to the outside.

5. The chip frame cleaning flipping device according to claim 4, characterized in that: The left end of the push column (44) is fixedly connected to an extrusion push plate (45), the side wall of the air box (41) is connected to a delivery pipe (46), one end of the delivery pipe (46) is fixedly connected to an inflatable airbag ball (47), and the outer wall of the inflatable airbag ball (47) is fixedly connected to the top end of the positioning column (406).

6. The chip frame cleaning flipping device according to claim 5, characterized in that: An adsorption assembly (5) is arranged on the top of the support frame (1), and the adsorption assembly (5) comprises a vacuum pump (501) fixedly connected to the top of the support frame (1); a suction end of the vacuum pump (501) is fixedly connected to a suction pipe (502); an end of the suction pipe (502) away from the vacuum pump (501) is fixedly connected to an adsorption box (503); a side wall of the adsorption box (503) is fixedly connected to a support seat (504); and a bottom of the support seat (504) is fixedly connected to the top of the support frame (1).

7. The chip frame cleaning flipping device according to claim 6, characterized in that: A hose (505) is provided in communication with the side wall of the adsorption box (503); one end of the hose (505) is fixedly connected to a suction cup (506); an outer wall of the suction cup (506) is fixedly connected to a suction cup bracket (507); and a side wall of the suction cup bracket (507) is fixedly connected to the bottom of the flip plate (204).

8. The chip frame cleaning flipping device according to claim 7, characterized in that: A gravity plate (51) is provided through the bottom of the adsorption box (503); the outer wall of the gravity plate (51) is slidably connected to the inner wall of the adsorption box (503); a notch (52) is provided on the side wall of the gravity plate (51); a push rod (53) is fixedly connected to the bottom of the gravity plate (51); and an L-shaped push rod (54) is fixedly connected to the outer surface of the rotating rod (203).

9. The chip frame cleaning flipping device according to claim 8, characterized in that: A cleaning assembly (6) is provided at the bottom of the flip plate (204), and the cleaning assembly (6) comprises a connecting seat (601) fixedly connected to the bottom of the flip plate (204); the inner wall of the connecting seat (601) is rotatably connected to a moving column (602); the outer surface of the moving column (602) is slidably connected to a limiting slot plate (603); the side wall of the limiting slot plate (603) is fixedly connected to an arc-shaped cylinder (604); the outer wall of the arc-shaped cylinder (604) is fixedly connected to the side wall of the support frame (1); the outer surface of the moving column (602) is fixedly connected to an arc-shaped rod (605); the arc-shaped rod (605) penetrates the side wall of the arc-shaped cylinder (604) and extends to the inner side.

10. The chip frame cleaning flipping device according to claim 9, characterized in that: One end of the arc rod (605) away from the movable column (602) is fixedly connected to an air-pushing circular plate (606), the outer wall of the air-pushing circular plate (606) is slidably connected to the inner wall of the arc cylinder (604), the side wall of the arc cylinder (604) is fixedly connected to an air supply pipeline (607), one end of the air supply pipeline (607) is connected through the side wall of the positioning plate (207), and the side wall of the positioning plate (207) is provided with an air injection hole (608).

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