Half silicon wafer feeding method

Abstract

The invention relates to a half silicon wafer feeding method. The method comprises the steps that a wafer taking mechanism receives half silicon wafers in a first half wafer basket A stock bin one by one; a wafer taking mechanism receives half silicon wafers in a material bin of the second half wafer basket C one by one; the first half-piece flower basket is controlled to rise to a preset height at any time period before feeding of the material bin C of the second half-piece flower basket is finished; the wafer taking mechanism receives half silicon wafers in the stock bin B one by one in the descending process of the first half wafer basket; in the descending process of the first half-piece flower basket, the second half-piece flower basket is controlled to ascend to the preset height at any time period before feeding of the material bin B is finished; and the wafer taking mechanism receives half silicon wafers in the D stock bin one by one in the descending process of the second half wafer basket. According to the invention, the two half-wafer baskets are alternately butted with the wafer taking mechanism to take the wafers, and the preparation work before the other half-wafer basket is loaded after the wafer taking mechanism starts to take the wafers from one stock bin of one half-wafer basket and before all wafer bodies in the stock bin are taken out is carried out, so that the loading efficiency of the half silicon wafers is improved.

Description

Technical Field

[0001] The present application relates to the field of solar photovoltaic production, and specifically to a method for loading a half-cut silicon wafer. Background Art

[0002] In the manufacturing process of silicon wafers to battery cells, silicon wafers are usually stored in baskets for circulation. There are usually multiple sets of tooth grooves in the basket, and silicon wafers are inserted into each set of tooth grooves one by one. When the silicon wafers are taken out of the basket one by one using the conveyor belt, it is necessary to coordinate the control of the basket's descent. Initially, the bottom of the basket is above the conveyor belt. Every time the basket descends a section, the conveyor belt receives a silicon wafer and takes it out. When all the silicon wafers in the basket are taken out, the top of the basket has dropped to the same level as the conveyor belt or below the conveyor belt. In order to improve production efficiency, two baskets are usually prepared to feed the conveyor belt alternately.

[0003] Due to the high power generation efficiency of half-cells, the market demand for them is increasing. Half-cell silicon wafers, as the original sheets of half-cells, are currently mainly stored in half-cell baskets. The half-cell baskets have two parallel silos. The structure of each silo is the same as the original silo, and each silo is provided with multiple sets of tooth grooves. Half-cell silicon wafers are inserted into each set of tooth grooves of each silo one by one.

[0004] When taking out silicon wafers one by one from the half-wafer basket using the conveyor belt, since there is only one conveyor belt, only half-wafers in one bin of the half-wafer basket can be taken out first. However, after taking out half-wafers in one bin, the top of the half-wafer basket is already flush with the conveyor belt or below the conveyor belt. If you want to continue taking out half-wafers in another bin, you need to raise the half-wafer basket to a position where its bottom is above the conveyor belt. This process seriously affects the efficiency of taking out half-wafers from the half-wafer basket. Summary of the invention

[0005] The present application aims to solve the problem of low efficiency of taking out wafers by using a half-wafer basket in the prior art and provides an efficient half-wafer loading method.

[0006] The technical solution of the present application is as follows: A half-wafer loading method for taking out a half-wafer from a half-wafer basket, the half-wafer loading method comprising: Step a: synchronously move the first half flower basket and the second half flower basket horizontally so that the bottom of the A bin of the first half flower basket is located above the flower fetching mechanism; Step b: Control the first half-wafer basket to descend continuously or at preset intervals, and the wafer taking mechanism receives the half-wafers in the A bin one by one during the descent of the first half-wafer basket and conveys the half-wafers to the downstream conveyor line; Step c: synchronously moving the first half flower basket and the second half flower basket horizontally so that the bottom of the C bin of the second half flower basket is located above the flower fetching mechanism; Step d: Control the second half-wafer basket to descend continuously or at preset intervals, and the wafer taking mechanism receives the half-wafers in the C bin one by one during the descent of the second half-wafer basket and conveys the half-wafers to the downstream conveyor line; Step e: at any time after the start of step c and before the end of step d, controlling the first half of the flower basket to rise to a predetermined height; Step f: synchronously moving the first half flower basket and the second half flower basket horizontally so that the bottom of the B bin of the first half flower basket is located above the flower fetching mechanism; Step g: Control the first half-wafer basket to descend continuously or at preset intervals, and the wafer taking mechanism receives the half-wafers in the B silo piece by piece during the descent of the first half-wafer basket and conveys the half-wafers to the downstream conveyor line; Step h: at any time after the start of step f and before the end of step g, controlling the second half of the flower basket to rise to a predetermined height; Step i: synchronously move the first half flower basket and the second half flower basket horizontally so that the bottom of the D bin of the second half flower basket is located above the flower fetching mechanism; Step j: Control the second half-wafer basket to descend continuously or at preset intervals, and the wafer taking mechanism receives the half-wafers in the D bin piece by piece during the descent of the second half-wafer basket and conveys the half-wafers to the downstream conveyor line; The first half flower basket and the second half flower basket can be controlled to move horizontally synchronously, and the first half flower basket and the second half flower basket can be individually controlled to rise and fall to cooperate with the film taking mechanism to take the films, the first half flower basket at least includes A silo and B silo arranged in parallel, and the second half flower basket at least includes C silo and D silo arranged in parallel.

[0007] The present application utilizes the silos of two half-wafer baskets to alternately connect with a wafer taking mechanism to take wafers. After the wafer taking mechanism starts to take wafers from one silo of a half-wafer basket and before all wafers in the silo are taken out, the other half-wafer basket is controlled to rise to a predetermined height, and preparation work before loading the other half-wafer basket is performed in advance, thereby maximally compensating the time required for the half-wafer basket to rise again after loading the wafers of one silo, thereby improving the loading efficiency of the half-wafer silicon wafers in the half-wafer basket.

[0008] Optionally, the wafer taking mechanism includes a first retractable conveying portion, and the half-wafer loading method further includes: Before synchronously moving the first half flower basket and the second half flower basket laterally in step a, step c, step f, and step j, the first telescopic conveying part is controlled to retract until it does not overlap with the first half flower basket or the second half flower basket in longitudinal projection.

[0009] By configuring the wafer taking mechanism as a retractable first retractable conveying part, the first retractable conveying part is extended to the bottom of the half-wafer basket when taking materials, so as to facilitate more stable material taking. After taking out half of the silicon wafers in a material bin of the half-wafer basket, the first retractable conveying part is retracted, so as to avoid interference and collision between the first retractable conveying part and the half-wafer basket to be moved laterally.

[0010] Optionally, the wafer taking mechanism includes a second retractable conveying part and a third retractable conveying part, the second retractable conveying part is configured to be laterally moved and switched between the A bin and the B bin of the first half-wafer basket, and the third retractable conveying part is configured to be laterally moved and switched between the C bin and the D bin of the second half-wafer basket, and step b of the half-wafer loading method further includes: Step b1: In step b, the second retractable conveying unit receives the half silicon wafers in the A bin piece by piece during the descent of the first half-wafer basket and conveys the half silicon wafers to the subsequent conveying line; Step b2: before step b1 is finished, the third telescopic conveying part is moved horizontally to make the third telescopic conveying part dock with the C bin of the second half flower basket; Step d of the half-wafer loading method further comprises: Step d1: In step d, the third retractable conveying unit receives the half silicon wafers in the C bin piece by piece during the descent of the second half-wafer basket and conveys the half silicon wafers to the subsequent conveying line; Step d2: before step d1 is finished, the second telescopic conveying part is moved horizontally to dock with the B bin of the first half flower basket; Step g of the half-wafer loading method also includes: Step g1: In step g, the second retractable conveying unit receives the half silicon wafers in the B silo piece by piece during the descent of the first half-wafer basket and conveys the half silicon wafers to the subsequent conveying line; Step g2: before step g1 is finished, the third telescopic conveying part is moved horizontally to make the third telescopic conveying part dock with the D bin of the second half flower basket; The step j of the half-wafer loading method also includes: Step j1: In step j, the third retractable conveying unit receives the half silicon wafers in the D bin piece by piece during the descent of the second half-wafer basket and conveys the half silicon wafers to the subsequent conveying line.

[0011] By configuring the sheet taking mechanism into two retractable second retractable conveying parts and a third retractable conveying part, each retractable conveying part is respectively connected with the two silos of a half-sheet flower basket. When the second retractable conveying part takes materials from a silo of the half-sheet flower basket connected thereto, the third retractable conveying part can be connected to a silo of the half-sheet flower basket matched thereto. After the second retractable conveying part has taken all the materials, the third retractable conveying part can be directly used to take materials, thereby realizing seamless connection and further improving the loading efficiency.

[0012] Optionally, the wafer taking mechanism includes a fourth telescopic conveying part cooperating with the A silo, a fifth telescopic conveying part cooperating with the B silo, a sixth telescopic conveying part cooperating with the C silo, and a seventh telescopic conveying part cooperating with the D silo, and the half-wafer loading method further includes: Before step a, the fourth and fifth telescopic conveying parts are controlled to be retracted until they do not overlap with the first half of the flower basket in longitudinal projection, and the sixth and seventh telescopic conveying parts are controlled to be retracted until they do not overlap with the second half of the flower basket in longitudinal projection.

[0013] By configuring the sheet picking mechanism into four retractable fourth retractable conveying parts, a fifth retractable conveying part, a sixth retractable conveying part and a seventh retractable conveying part, each bin of each half-sheet flower basket is matched with a retractable conveying part, thereby improving the loading efficiency of each bin; before transversely moving the two half-sheet flower baskets, by retracting the corresponding retractable conveying parts, interference and collision between the retractable conveying parts and the moving half-sheet flower baskets can be avoided.

[0014] Optionally, between step a and step b, the half-wafer loading method further includes controlling the fourth retractable conveying portion to extend until the fourth retractable conveying portion can extend into the A silo to receive the half-wafer; Between step c and step d, the half-wafer loading method further includes controlling the sixth retractable conveying portion to extend until the sixth retractable conveying portion can extend into the C silo to receive the half-wafer; Between step f and step g, the half-wafer loading method further includes controlling the fifth retractable conveying portion to extend until the fifth retractable conveying portion can extend into the B silo to receive the half-wafer; Between step i and step j, the half-wafer loading method further includes controlling the seventh retractable conveying portion to extend until the seventh retractable conveying portion can extend into the D silo to receive the half-wafer.

[0015] Four retractable conveying parts correspond to the silos of the two half-wafer baskets respectively. When taking out the wafers, each retractable conveying part is controlled to extend into the corresponding silo to receive the half-wafer, thereby further improving the efficiency of taking out the wafers.

[0016] Optionally, the half-wafer loading method further comprises, after step g is completed, replacing the empty first half-wafer basket with a fully loaded first half-wafer basket.

[0017] After all the half wafers in the two silos of the first half wafer basket are taken out, during the loading process of the second half wafer basket, the empty first half wafer basket is replaced with the fully loaded first half wafer basket, so that the time of the loading process of the second half wafer basket can be fully utilized to prepare for the next loading of the first half wafer basket, thereby improving the loading efficiency.

[0018] Optionally, the half-wafer loading method further includes, after step j is completed, replacing the empty second half-wafer basket with a fully loaded second half-wafer basket.

[0019] After all the half wafers in the two silos of the second half wafer basket are taken out, the empty second half wafer basket is replaced with the fully loaded second half wafer basket during the loading process of the first half wafer basket, so that the time of the loading process of the first half wafer basket can be fully utilized to prepare for the next loading of the second half wafer basket, thereby improving the loading efficiency.

[0020] Optionally, the back-end conveyor line is used to convey half silicon wafers in a single row.

[0021] The half silicon wafers taken out by the wafer taking mechanism are transported in a single row on the back-end conveyor line, which is convenient for individual processing of each half silicon wafer to prevent affecting the remaining half silicon wafers.

[0022] Optionally, the half-silicon wafer loading method further includes: in steps b, d, g, and j, during the process of conveying the half-silicon wafer to the back-end conveyor line, the half-silicon wafer is regularized at least once.

[0023] By regularizing the half silicon wafer, the position state of the half silicon wafer meets the predetermined requirements, which facilitates the subsequent processing of the half silicon wafer.

[0024] Optionally, the half-silicon wafer loading method further includes: in steps b, d, g, and j, during the process of conveying the half-silicon wafer to the back-end conveyor line, rotating the half-silicon wafer at least once by a predetermined angle.

[0025] By rotating the half silicon wafer, the position state of the half silicon wafer meets the predetermined requirements, which is convenient for subsequent processing of the half silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the process of loading a half silicon wafer of the present application; Figure 2a , Figure 2b , Figure 2c , Figure 2d This is a schematic diagram of the half-silicon wafer loading process of the first embodiment of the present application; Figure 3a , Figure 3b , Figure 3c , Figure 3d This is a schematic diagram of a half-silicon wafer loading process according to the second embodiment of the present application; Figure 4a , Figure 4b , Figure 4c , Figure 4d This is a schematic diagram of a half-silicon wafer loading process according to a third embodiment of the present application; Figure 5 This is a schematic diagram of the back-end conveyor line of the present application conveying half a silicon wafer in a single row.

[0027] Figure 1 to Figure 5 Including: Half flower basket 10, first half flower basket 11, second half flower basket 12; The film taking mechanism 20, the first telescopic conveying part 21, the second telescopic conveying part 22, the third telescopic conveying part 23, the fourth telescopic conveying part 24, the fifth telescopic conveying part 25, the sixth telescopic conveying part 26, and the seventh telescopic conveying part 27; Back conveyor line 30; Half a silicon wafer 100. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0029] like Figure 1 As shown, the present application provides a half-silicon wafer loading method for efficiently taking out the half-silicon wafer 100 in the half-wafer basket 10 .

[0030] like Figure 2a to Figure 4d As shown, the half-wafer basket 10, the wafer taking mechanism 20 and the back-end conveyor line 30 are all docking schematic diagrams in a top view. The half-wafer basket 10 includes a first half-wafer basket 11 and a second half-wafer basket 12, wherein the first half-wafer basket 11 includes at least a silo A and a silo B arranged in parallel, and the second half-wafer basket 12 includes at least a silo C and a silo D arranged in parallel, each silo is used to store a half-wafer 100. The first half-wafer basket 11 and the second half-wafer basket 12 can be controlled to move horizontally synchronously, and the first half-wafer basket 11 and the second half-wafer basket 12 can be individually controlled to rise and fall to cooperate with the wafer taking mechanism 20 to take the wafers.

[0031] See also Figure 1 The half-wafer loading method comprises: Step a: synchronously move the first half flower basket 11 and the second half flower basket 12 horizontally, so that the bottom of the A bin of the first half flower basket 11 is located above the flower picking mechanism 20; Figure 2a , Figure 3a , Figure 4a As shown; Step b: Control the first half-wafer basket 11 to descend continuously or at preset intervals, and the wafer taking mechanism 20 receives the half-wafers 100 in the A bin one by one during the descent of the first half-wafer basket 11 and conveys the half-wafers 100 to the downstream conveyor line 30; Step c: synchronously move the first half flower basket 11 and the second half flower basket 12 horizontally, so that the bottom of the C bin of the second half flower basket 12 is located above the film taking mechanism 20; Figure 2b , Figure 3b , Figure 4b As shown; Step d: Control the second half-wafer basket 12 to descend continuously or at preset intervals, and the wafer taking mechanism 20 receives the half silicon wafers 100 in the C bin one by one during the descent of the second half-wafer basket 12 and conveys the half silicon wafers 100 to the downstream conveyor line 30; Step e: at any time after the start of step c and before the end of step d, control the first half flower basket 11 to rise to a predetermined height; Step f: synchronously move the first half flower basket 11 and the second half flower basket 12 horizontally, so that the bottom of the B bin of the first half flower basket 11 is located above the flower picking mechanism 20; Figure 2c , Figure 3c , Figure 4c As shown; Step g: Control the first half-wafer basket 11 to descend continuously or at preset intervals, and the wafer taking mechanism 20 receives the half-wafers 100 in the B bin one by one during the descent of the first half-wafer basket 11 and conveys the half-wafers 100 to the downstream conveyor line 30; Step h: at any time after the start of step f and before the end of step g, control the second half flower basket 12 to rise to a predetermined height; Step i: synchronously move the first half flower basket 11 and the second half flower basket 12 horizontally, so that the bottom of the D bin of the second half flower basket 12 is located above the flower picking mechanism 20; Figure 2d , Figure 3d , Figure 4d As shown; Step j: Control the second half-wafer basket 12 to descend continuously or at preset intervals, and the wafer taking mechanism 20 receives the half silicon wafers 100 in the D bin one by one during the descent of the second half-wafer basket 12 and conveys the half silicon wafers 100 to the downstream conveyor line 30 .

[0032] It should be noted that the control of the half-flower basket to descend continuously or at preset intervals in the above steps b, d, g, and j is two different descending modes. "Continuous descent" means that the flower basket descends continuously, and the flower basket will not stop at any position during the entire descent stroke. It can be either a constant descent at a certain speed or a variable descent at a certain acceleration. "Descending at preset intervals" means that during the entire descent stroke of the flower basket, the flower basket descends once at a preset interval (which can be 1 second, 2 seconds, etc., depending on the actual working conditions), and the distance of each descent can be adaptively adjusted according to the different spacings between adjacent tooth grooves of different flower baskets.

[0033] The half-flower basket in the above steps e and h rises to a predetermined height, and the "predetermined height" is any desired height that satisfies the requirement that the bottom of the bin of the half-flower basket is located above the flower picking mechanism.

[0034] The present application utilizes the silos of two half-wafer baskets 10 to alternately connect with the wafer taking mechanism 20 to take wafers. After the wafer taking mechanism 20 starts to take wafers from one silo of a half-wafer basket and before all wafers in the silo are taken out, the other half-wafer basket is controlled to rise to a predetermined height, and preparation work before loading the other half-wafer basket is performed in advance, thereby maximally compensating the time required for the half-wafer basket 10 to rise again after loading the wafers of one silo, thereby improving the loading efficiency of the half-wafer 100 in the half-wafer basket 10.

[0035] Optionally, in order to achieve synchronous transverse movement of the first half flower basket 11 and the second half flower basket 12, the first half flower basket 11 and the second half flower basket 12 can be installed on the slider of the linear module at a certain interval according to the docking requirements with the film taking mechanism 20, and the driving component of the linear module transmits power to its transmission component, and the transmission component drives the slider to transversely move along the guide rail, thereby achieving synchronous transverse movement of the first half flower basket 11 and the second half flower basket 12. The specific structure of the driving component and the transmission component of the linear module can be selected in different combinations according to the requirements, and this application does not make specific limitations.

[0036] In order to better cooperate with the half-wafer loading method proposed in the present application, the wafer taking mechanism 20 in the present application has multiple implementation modes, for example: Method 1: The wafer picking mechanism 20 is a fixed conveying part with a fixed length. Before the wafer picking mechanism 20 receives the half silicon wafer in the process of the flower basket descending, the flower basket to be taken is controlled to move toward the wafer picking mechanism 20, so that the material bin of the flower basket to be taken is located directly above the wafer picking mechanism 20, so that the wafer picking mechanism 20 can more stably receive the half silicon wafers one by one in the process of the flower basket descending.

[0037] Method 2: The wafer picking mechanism 20 is a movable conveying part with a fixed length. Before the wafer picking mechanism 20 receives the half silicon wafer during the descending process of the flower basket, the wafer picking mechanism 20 is controlled to move toward the material bin of the flower basket to be taken, so that the wafer picking end of the wafer picking mechanism 20 is located directly below the material bin of the flower basket to be taken, so that the wafer picking mechanism 20 can more stably receive the half silicon wafers one by one during the descending process of the flower basket.

[0038] Method three: the wafer taking mechanism 20 is a retractable conveying part. Before the wafer taking mechanism 20 receives the half silicon wafer in the process of the flower basket being lowered, the wafer taking mechanism 20 extends to the bottom of the silo of the flower basket to be taken, so that the wafer taking mechanism 20 can receive the half silicon wafer one by one in the process of the flower basket being lowered more stably.

[0039] The retractable conveying part may adopt a retractable conveying belt, such as the structure disclosed in Chinese patent CN215363183U.

[0040] When the film taking mechanism 20 in the present application adopts a retractable conveying part, the retractable conveying part may be one, two or four, which are respectively described below.

[0041] like Figure 2a to Figure 2d As shown, the first embodiment of the film taking mechanism 20 includes a telescopic conveying portion, namely, a first telescopic conveying portion 21 .

[0042] At this time, the half-wafer loading method also includes: Before synchronously moving the first half flower basket 11 and the second half flower basket 12 laterally in step a, step c, step f, and step j, the first telescopic conveying part 21 is controlled to retract until it does not overlap with the first half flower basket 11 or the second half flower basket 12 in the longitudinal projection.

[0043] By configuring the wafer taking mechanism 20 as a retractable first retractable conveying part 21, the first retractable conveying part 21 is extended to the bottom of the half-wafer basket 10 when taking materials. When receiving the half silicon wafer 100, the first retractable conveying part 21 extended to the bottom of the half-wafer basket 10 has a larger contact area with the half silicon wafer 100, which is convenient for more stable material taking. After taking the half silicon wafers 100 of a material bin of the half-wafer basket 10, by retracting the first retractable conveying part 21, it can be avoided that the first retractable conveying part 21 interferes with the half-wafer basket 10 to be moved laterally and forms a collision.

[0044] In this embodiment, there is only one retractable conveying part, namely, the first retractable conveying part 21. The output end of the first retractable conveying part 21 is always connected to the subsequent conveying line 30. Specifically: like Figure 2a, synchronously move the first half-piece flower basket 11 and the second half-piece flower basket 12 horizontally, so that the bottom of the A bin of the first half-piece flower basket 11 is located above the first telescopic conveying part 21, and after the first telescopic conveying part 21 is controlled to extend into the A bin along the direction of the arrow 41, the first half-piece flower basket 11 is controlled to descend continuously or at preset intervals, and the first telescopic conveying part 21 receives the taken pieces and conveys them to the subsequent conveying line 30.

[0045] like Figure 2b When all the sheets in the A bin are taken out, the first telescopic conveyor 21 is controlled to retract from the A bin (i.e., in the opposite direction of the arrow 41), and the first half-sheet basket 11 and the second half-sheet basket 12 are synchronously moved transversely in the direction of the arrow 42, so that the bottom of the C bin of the second half-sheet basket 12 is located above the first telescopic conveyor 21, and after the first telescopic conveyor 21 is controlled to extend into the C bin in the direction of the arrow 41, the second half-sheet basket 12 is controlled to descend continuously or at preset intervals, and the first telescopic conveyor 21 receives the taken sheets and conveys them to the downstream conveyor line 30; After the first half-piece flower basket 11 and the second half-piece flower basket 12 are synchronously moved transversely in the direction of arrow 42 and before the sheets in the C silo are taken out by the first telescopic conveying part 21, the first half-piece flower basket 11 is controlled to rise to a predetermined height (i.e., the bottom of the silo of the first half-piece flower basket 11 is located above the first telescopic conveying part 21), so as to prepare for loading into the B silo; like Figure 2c When all the sheets in the C bin are taken out, the first telescopic conveyor 21 is controlled to retract from the C bin, and the first half-sheet basket 11 and the second half-sheet basket 12 are synchronously moved transversely in the direction of the arrow 43, so that the bottom of the B bin of the first half-sheet basket 11 is located above the first telescopic conveyor 21, and after the first telescopic conveyor 21 is controlled to extend into the B bin in the direction of the arrow 41, the first half-sheet basket 11 is controlled to descend continuously or at preset intervals, and the first telescopic conveyor 21 receives the taken sheets and conveys them to the downstream conveyor line 30; After the first half-sheet flower basket 11 and the second half-sheet flower basket 12 are synchronously moved transversely in the direction of arrow 43 and before the sheets in the B silo are taken out by the first telescopic conveying part 21, the second half-sheet flower basket 12 is controlled to rise to a predetermined height (i.e., the bottom of the silo of the second half-sheet flower basket 12 is located above the first telescopic conveying part 21) to prepare for loading into the D silo.

[0046] like Figure 2dWhen all the sheets in the B silo are taken out, the first telescopic conveying part 21 is controlled to retract from the B silo, and the first half-sheet basket 11 and the second half-sheet basket 12 are synchronously moved transversely in the direction of the arrow 42, so that the bottom of the D silo of the second half-sheet basket 12 is located above the first telescopic conveying part 21. After the first telescopic conveying part 21 is controlled to extend into the D silo in the direction of the arrow 41, the first half-sheet basket 12 is controlled to descend continuously or at preset intervals, and the first telescopic conveying part 21 receives the taken sheets and conveys them to the subsequent conveying line 30.

[0047] That is, the material picking order of the sheet picking mechanism 20 (in the present embodiment, the first retractable conveying part 21) is A bin, C bin, B bin and D bin, and during the time period when C bin supplies material after A bin switches to C bin, B bin is prepared to rise into place for loading. During the time period when B bin supplies material after C bin switches to B bin, D bin is prepared to rise into place for loading. This can effectively save the time for raising and lowering the bins and greatly improve the loading efficiency.

[0048] like Figure 3a to Figure 3d As shown, the second embodiment of the sheet picking mechanism 20 includes two telescopic conveying parts, namely, a second telescopic conveying part 22 and a third telescopic conveying part 23. The second telescopic conveying part 22 is configured to be horizontally moved and switched between the A bin and the B bin of the first half sheet flower basket 11, and the third telescopic conveying part 23 is configured to be horizontally moved and switched between the C bin and the D bin of the second half sheet flower basket 12.

[0049] At this time, step b of the half-wafer loading method further includes: Step b1: In step b, the second retractable conveying unit 22 receives the half silicon wafers 100 in the A bin one by one during the descent of the first half flower basket 11 and conveys the half silicon wafers 100 to the subsequent conveying line 30; Step b2: before step b1 is finished, the third telescopic conveying part 23 is moved transversely to make the third telescopic conveying part 23 dock with the C bin of the second half flower basket 12; Step d of the half-wafer loading method further comprises: Step d1: In step d, the third retractable conveying unit 23 receives the half silicon wafers 100 in the C bin one by one during the descent of the second half-wafer basket 12 and conveys the half silicon wafers 100 to the subsequent conveying line 30; Step d2: before step d1 is finished, the second telescopic conveying part 22 is moved horizontally to dock with the B bin of the first half flower basket 11; Step g of the half-wafer loading method also includes: Step g1: In step g, the second retractable conveying unit 22 receives the half silicon wafers 100 in the B bin one by one during the descent of the first half flower basket 11 and conveys the half silicon wafers 100 to the subsequent conveying line 30; Step g2: before step g1 is finished, the third telescopic conveying part 23 is moved transversely to make the third telescopic conveying part 23 dock with the D bin of the second half flower basket 12; The step j of the half-wafer loading method also includes: Step j1: In step j, the third retractable conveying unit 23 receives the half silicon wafers 100 in the D bin one by one during the descent of the second half-wafer basket 12 and conveys the half silicon wafers 100 to the subsequent conveying line 30 .

[0050] By configuring the sheet taking mechanism 20 into two retractable second retractable conveying parts 22 and a third retractable conveying part 23, each retractable conveying part is respectively docked with two silos of a half-sheet flower basket 10. When the second retractable conveying part 22 takes materials from a silo of the half-sheet flower basket 10 docked with it, the third retractable conveying part 23 can be docked to a silo of the half-sheet flower basket 10 matched with it. After the second retractable conveying part 22 takes all the materials, the third retractable conveying part 23 can be directly used to take materials, thereby realizing seamless docking and further improving the loading efficiency.

[0051] In this embodiment, specifically: like Figure 3a , synchronously move the first half-piece flower basket 11 and the second half-piece flower basket 12 horizontally, so that the bottom of the A bin of the first half-piece flower basket 11 is located above the second telescopic conveying part 22, and after the second telescopic conveying part 22 is controlled to extend into the A bin along the direction of the arrow 41, the first half-piece flower basket 11 is controlled to descend continuously or at preset intervals, and the second telescopic conveying part 22 receives the flowers and conveys them to the subsequent conveying line 30; Before all the sheets in the A silo are taken out, the third telescopic conveying part 23 is moved horizontally to dock with the C silo of the second half-sheet flower basket 12, so that the bottom of the C silo of the second half-sheet flower basket 12 is located above the third telescopic conveying part 23. It should be noted that during the docking here, the third telescopic conveying part 23 is in a retracted state and will not interfere with the horizontal movement of the second half-sheet flower basket 12.

[0052] like Figure 3bWhen all the sheets in the A bin are taken out, the second telescopic conveying part 22 is controlled to retract from the A bin (i.e., the opposite direction of the arrow 41), and the first half-sheet basket 11, the second half-sheet basket 12, the second telescopic conveying part 22 and the third telescopic conveying part 23 are synchronously moved transversely in the direction of the arrow 42, so that the C bin of the second half-sheet basket 12, the third telescopic conveying part 23 and the downstream conveying line 30 are located on the same vertical projection, and after the third telescopic conveying part 23 is controlled to extend into the C bin in the direction of the arrow 41, the second half-sheet basket 12 is controlled to descend continuously or at preset intervals, and the third telescopic conveying part 23 receives the taken sheets and conveys them to the downstream conveying line 30; After the first half-sheet flower basket 11, the second half-sheet flower basket 12, the second telescopic conveying part 22 and the third telescopic conveying part 23 are synchronously moved transversely in the direction of the arrow 42 and before the sheets in the C bin are completely taken out by the third telescopic conveying part 23, the first half-sheet flower basket 11 is controlled to rise to a predetermined height (i.e., the bottom of the bin of the first half-sheet flower basket 11 is located above the second telescopic conveying part 22), and the second telescopic conveying part 22 is transversely moved in the direction of the arrow 44, so that the second telescopic conveying part 22 is docked with the B bin of the first half-sheet flower basket 11, so as to prepare for loading the B bin; like Figure 3c When all the sheets in the C bin are taken out, the third telescopic conveying part 23 is controlled to retract from the C bin, and the first half-sheet basket 11, the second half-sheet basket 12, the second telescopic conveying part 22 and the third telescopic conveying part 23 are synchronously moved transversely in the direction of the arrow 43, so that the B bin of the first half-sheet basket 11, the second telescopic conveying part 22 and the downstream conveying line 30 are located on the same vertical projection, and after the second telescopic conveying part 22 is controlled to extend into the B bin in the direction of the arrow 41, the first half-sheet basket 11 is controlled to descend continuously or at preset intervals, and the second telescopic conveying part 22 receives the taken sheets and conveys them to the downstream conveying line 30; After the first half-sheet flower basket 11, the second half-sheet flower basket 12, the second telescopic conveying part 22 and the third telescopic conveying part 23 are synchronously moved transversely in the direction of the arrow 43 and before the sheets in the B silo are completely taken out by the second telescopic conveying part 22, the second half-sheet flower basket 12 is controlled to rise to a predetermined height (i.e., the bottom of the silo of the second half-sheet flower basket 12 is located above the third telescopic conveying part 23), and the third telescopic conveying part 23 is transversely moved in the direction of the arrow 44, so that the third telescopic conveying part 23 is docked with the D silo of the second half-sheet flower basket 12, so as to prepare for loading the D silo.

[0053] like Figure 3dWhen all the sheets in the B silo are taken out, the second telescopic conveying part 22 is controlled to retract from the B silo, and the first half-sheet basket 11, the second half-sheet basket 12, the second telescopic conveying part 22 and the third telescopic conveying part 23 are synchronously moved transversely in the direction of the arrow 42, so that the D silo of the second half-sheet basket 12, the third telescopic conveying part 23 and the downstream conveying line 30 are located on the same vertical projection. After the third telescopic conveying part 23 is controlled to extend into the D silo in the direction of the arrow 41, the first half-sheet basket 12 is controlled to descend continuously or at preset intervals, and the third telescopic conveying part 23 receives the taken sheets and conveys them to the downstream conveying line 30.

[0054] After the first half-sheet flower basket 11, the second half-sheet flower basket 12, the second telescopic conveying part 22 and the third telescopic conveying part 23 are synchronously moved transversely in the direction of the arrow 42 and before the sheets in the D bin are taken out by the second telescopic conveying part 22, the empty first half-sheet flower basket 11 is replaced with the full first half-sheet flower basket 11, and the full first half-sheet flower basket 11 is controlled to rise to a predetermined height (that is, the bottom of the bin of the first half-sheet flower basket 11 is located above the second telescopic conveying part 22), and the second telescopic conveying part 22 is transversely moved in the direction of the arrow 45, so that the second telescopic conveying part 22 is docked with the A bin of the full first half-sheet flower basket 11, so as to prepare for the loading of the A bin. It should be noted that the second telescopic conveying part 22 can also be transversely moved to the corresponding position (i.e., the position corresponding to the A bin of the full first half-sheet flower basket 11 after replacement) along the arrow 45 before replacing the full first half-sheet flower basket 11.

[0055] Compared with using one retractable conveying part (ie, the first retractable part 21 ), using two retractable conveying parts each docking a half-piece flower basket can further improve the efficiency of taking pieces.

[0056] like Figure 4a to Figure 4d As shown, the third embodiment of the wafer taking mechanism 20 includes four retractable conveying parts, namely: a fourth retractable conveying part 24 working in cooperation with the A silo, a fifth retractable conveying part 25 working in cooperation with the B silo, a sixth retractable conveying part 26 working in cooperation with the C silo, and a seventh retractable conveying part 27 working in cooperation with the D silo. At this time, the half-wafer loading method also includes: Before step a, the fourth telescopic conveying part 24 and the fifth telescopic conveying part 25 are controlled to be retracted until they do not overlap with the first half flower basket 11 in the longitudinal projection, and the sixth telescopic conveying part 26 and the seventh telescopic conveying part 27 are controlled to be retracted until they do not overlap with the second half flower basket 12 in the longitudinal projection.

[0057] By configuring the sheet taking mechanism 20 into four retractable fourth retractable conveying parts 24, fifth retractable conveying parts 25, sixth retractable conveying parts 26 and seventh retractable conveying parts 27, each bin of each half-sheet flower basket 10 is matched with a retractable conveying part, which can improve the loading efficiency of each bin; before the two half-sheet flower baskets 10 are transversely moved, the corresponding retractable conveying parts are retracted to avoid interference and collision between the retractable conveying parts and the moving half-sheet flower baskets 10.

[0058] In one embodiment, optionally, between step a and step b, the half-wafer loading method further includes controlling the fourth retractable conveying portion 24 to extend until the fourth retractable conveying portion 24 can extend into the A silo to receive the half-wafer 100; Between step c and step d, the half-wafer loading method further includes controlling the sixth telescopic conveying portion 26 to extend until the sixth telescopic conveying portion 26 can extend into the C bin to receive the half-wafer 100; Between step f and step g, the half-wafer loading method further includes controlling the fifth retractable conveying portion 25 to extend until the fifth retractable conveying portion 25 can extend into the B silo to receive the half-wafer 100; Between step i and step j, the half-silicon wafer loading method further includes controlling the seventh telescopic conveying portion 27 to extend until the seventh telescopic conveying portion 27 can extend into the D silo to receive the half-silicon wafer 100 .

[0059] It should be noted that in this embodiment, the silos A, B, C, and D all have corresponding retractable conveying parts. In steps c, f, and i, the half-piece flower basket and the corresponding retractable conveying parts can be synchronously moved horizontally so that the retractable conveying part to be taken out corresponds to the subsequent conveying line 30.

[0060] See also Figure 1 to Figure 4d Optionally, the half-wafer loading method further includes, after step g is completed, replacing the empty first half-wafer basket 11 with a fully loaded first half-wafer basket 11 .

[0061] After all the half silicon wafers 100 in the two silos of the first half wafer basket 11 are taken out, during the loading process of the second half wafer basket 12, the empty first half wafer basket 11 is replaced with the fully loaded first half wafer basket 11, so that the loading time of the second half wafer basket 12 can be fully utilized to prepare for the next loading of the first half wafer basket 11, thereby improving the loading efficiency.

[0062] In one of the embodiments, optionally, the half-wafer loading method further includes, after step j is completed, replacing the empty second half-wafer basket 12 with a fully loaded second half-wafer basket 12 .

[0063] After all the half silicon wafers 100 in the two silos of the second half wafer basket 12 are taken out, during the loading process of the first half wafer basket 11, the empty second half wafer basket 12 is replaced with the fully loaded second half wafer basket 12, so that the loading time of the first half wafer basket 11 can be fully utilized to prepare for the next loading of the second half wafer basket 12, thereby improving the loading efficiency.

[0064] In one embodiment, Figure 5 As shown, optionally, the back-end conveyor line 30 is used to convey half silicon wafers 100 in a single row. That is, the half silicon wafers 100 are conveyed one by one along the conveying direction of the back-end conveyor line 30.

[0065] The half silicon wafers 100 taken out by the wafer taking mechanism 20 are conveyed in a single row on the back-end conveying line 30 , so as to facilitate individual processing (such as straightening or rotating) of each half silicon wafer 100 to prevent affecting the remaining half silicon wafers 100 .

[0066] In one of the embodiments, optionally, the half-silicon wafer loading method further includes: in steps b, d, g, and j, during the process of conveying the half-silicon wafer 100 to the back-end conveyor line 30, the half-silicon wafer 100 is regularized at least once.

[0067] By performing regular processing on the half silicon wafer 100 , the position state of the half silicon wafer 100 meets the predetermined requirements, which facilitates the subsequent processing of the half silicon wafer 100 .

[0068] In one of the embodiments, optionally, the half-silicon wafer loading method further includes: in steps b, d, g, and j, during the process of conveying the half-silicon wafer 100 to the back-end conveyor line 30, rotating the half-silicon wafer 100 at least once by a predetermined angle.

[0069] Because the half silicon wafer 100 has two adjacent chamfers, and when producing a battery string, there are specific requirements for the chamfer position of the half silicon wafer 100. For example, the chamfers of the half silicon wafers 100 in a battery string must be located on the same side, so it is necessary to adjust the position of the half silicon wafer 100 by rotation. For example, the half silicon wafer 100 is rotated 90° once, so that the half silicon wafer 100 switches horizontally and vertically and is then transported on the conveyor belt of the back-end conveyor line 30; it is rotated 90° twice, so that the chamfer position of the half silicon wafer 100 is switched and then transported on the conveyor belt of the back-end conveyor line 30; of course, a single rotation of 180° can also be performed directly, and the number of rotations and the angle of each rotation can be flexibly selected according to different process requirements.

[0070] By rotating the half silicon wafer 100 , the position state of the half silicon wafer 100 meets the predetermined requirement, which facilitates the subsequent processing of the half silicon wafer 100 .

[0071] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A method for loading a half-wafer of silicon, characterized in that: The half-silicon wafer loading method is used to take out the half-silicon wafer in the half-wafer basket, and the half-silicon wafer loading method includes: Step a: synchronously moving the first half flower basket and the second half flower basket horizontally so that the bottom of the A bin of the first half flower basket is located above the flower fetching mechanism; Step b: Control the first half-wafer basket to descend continuously or at preset intervals, and the wafer taking mechanism receives the half-wafers in the A bin one by one during the descent of the first half-wafer basket and conveys the half-wafers to the downstream conveyor line; Step c: synchronously moving the first half flower basket and the second half flower basket horizontally so that the bottom of the C bin of the second half flower basket is located above the sheet taking mechanism; Step d: Control the second half-wafer basket to descend continuously or at preset intervals, and the wafer taking mechanism receives the half-wafers in the C bin piece by piece during the descent of the second half-wafer basket and conveys the half-wafers to the downstream conveyor line; Step e: at any time after the start of step c and before the end of step d, controlling the first half of the flower basket to rise to a predetermined height; Step f: synchronously moving the first half flower basket and the second half flower basket horizontally so that the bottom of the B bin of the first half flower basket is located above the flower fetching mechanism; Step g: Control the first half-wafer basket to descend continuously or at preset intervals, and the wafer taking mechanism receives the half-wafers in the B silo piece by piece during the descent of the first half-wafer basket and conveys the half-wafers to the downstream conveyor line; Step h: at any time after the start of step f and before the end of step g, controlling the second half of the flower basket to rise to a predetermined height; Step i: synchronously moving the first half flower basket and the second half flower basket horizontally so that the bottom of the D bin of the second half flower basket is located above the flower fetching mechanism; Step j: Control the second half-wafer basket to descend continuously or at preset intervals, and the wafer taking mechanism receives the half-wafers in the D bin piece by piece during the descent of the second half-wafer basket and conveys the half-wafers to the downstream conveyor line; The first half flower basket and the second half flower basket can be controlled to move laterally synchronously, the first half flower basket and the second half flower basket can be individually controlled to rise and fall to cooperate with the sheet taking mechanism to take sheets, the first half flower basket at least includes A silo and B silo arranged in parallel, and the second half flower basket at least includes C silo and D silo arranged in parallel.

2. The half-silicon wafer loading method according to claim 1, characterized in that: The wafer taking mechanism includes a first retractable conveying portion, and the half-wafer loading method also includes: Before synchronously moving the first half flower basket and the second half flower basket laterally in step a, step c, step f and step j, the first telescopic conveying part is controlled to retract until it does not overlap with the first half flower basket or the second half flower basket in longitudinal projection.

3. The half-silicon wafer loading method according to claim 1, characterized in that: The wafer taking mechanism comprises a second telescopic conveying part and a third telescopic conveying part, wherein the second telescopic conveying part is configured to be laterally moved and switched between the A bin and the B bin of the first half-wafer basket, and the third telescopic conveying part is configured to be laterally moved and switched between the C bin and the D bin of the second half-wafer basket. Step b of the half-wafer loading method further comprises: Step b1: In step b, the second retractable conveying unit receives the half silicon wafers in the A bin piece by piece during the descent of the first half-wafer basket and conveys the half silicon wafers to the subsequent conveying line; Step b2: before the step b1 is finished, the third telescopic conveying part is moved transversely to make the third telescopic conveying part dock with the C bin of the second half flower basket; Step d of the half-wafer loading method further comprises: Step d1: In step d, the third retractable conveying unit receives the half silicon wafers in the C bin piece by piece during the descent of the second half-wafer basket and conveys the half silicon wafers to the subsequent conveying line; Step d2: before the step d1 is finished, the second telescopic conveying part is moved horizontally to make the second telescopic conveying part dock with the B bin of the first half flower basket; Step g of the half-wafer loading method further comprises: Step g1: In step g, the second retractable conveying unit receives the half silicon wafers in the B silo piece by piece during the descent of the first half-wafer basket and conveys the half silicon wafers to the subsequent conveying line; Step g2: before step g1 is finished, the third telescopic conveying part is moved transversely to make the third telescopic conveying part dock with the D bin of the second half flower basket; Step j of the half-wafer loading method also includes: Step j1: In step j, the third retractable conveying unit receives the half silicon wafers in the D bin piece by piece during the descent of the second half-wafer basket and conveys the half silicon wafers to the downstream conveying line.

4. The half-silicon wafer loading method according to claim 1, characterized in that: The wafer taking mechanism includes a fourth telescopic conveying part cooperating with the A silo, a fifth telescopic conveying part cooperating with the B silo, a sixth telescopic conveying part cooperating with the C silo, and a seventh telescopic conveying part cooperating with the D silo. The half-wafer loading method also includes: Before step a, the fourth and fifth telescopic conveying parts are controlled to be retracted until they do not overlap with the first half of the flower basket in longitudinal projection, and the sixth and seventh telescopic conveying parts are controlled to be retracted until they do not overlap with the second half of the flower basket in longitudinal projection.

5. The half-silicon wafer loading method according to claim 4, characterized in that: Between step a and step b, the half-wafer loading method further includes controlling the fourth retractable conveying portion to extend until the fourth retractable conveying portion can extend into the A silo to receive the half-wafer; Between step c and step d, the half-wafer loading method further includes controlling the sixth retractable conveying portion to extend until the sixth retractable conveying portion can extend into the C silo to receive the half-wafer; Between step f and step g, the half-wafer loading method further includes controlling the fifth retractable conveying portion to extend until the fifth retractable conveying portion can extend into the B silo to receive the half-wafer; Between step i and step j, the half-wafer loading method further includes controlling the seventh retractable conveying portion to extend until the seventh retractable conveying portion can extend into the D silo to receive the half-wafer.

6. The half-silicon wafer loading method according to claim 1, characterized in that: The half-wafer loading method further comprises, after the step g is completed, replacing the empty first half-wafer basket with a fully loaded first half-wafer basket.

7. The half-silicon wafer loading method according to claim 1, characterized in that: The half-wafer loading method further comprises, after the step j is completed, replacing the empty second half-wafer basket with a fully loaded second half-wafer basket.

8. The half-silicon wafer loading method according to claim 1, characterized in that: The back-end conveyor line is used to convey half silicon wafers in a single row.

9. The half-silicon wafer loading method according to claim 1, characterized in that: The half-silicon wafer loading method further includes: in the steps b, d, g, and j, the half-silicon wafer is regularized at least once during the process of conveying the half-silicon wafer to the back-end conveyor line.

10. The half-silicon wafer loading method according to claim 1, characterized in that: The half-silicon wafer loading method further includes: in the steps b, d, g, and j, during the process of conveying the half-silicon wafer to the back-end conveyor line, rotating the half-silicon wafer at least once at a predetermined angle.

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