Vapor chamber and temperature control method thereof

Abstract

The invention discloses a vapor chamber and a temperature control method thereof.The vapor chamber comprises a heat dissipation layer, a vapor chamber body, a liquid conveying pipe and a flow speed regulating valve, the heat dissipation layer is used for containing a panel, the vapor chamber body is arranged at the bottom of the heat dissipation layer, a mounting surface is arranged on the vapor chamber body, and the mounting surface comprises a center part, a transition part and an edge part which are sequentially arranged from inside to outside; the central part, the transition part and the edge part are respectively provided with at least one liquid conveying pipe, the liquid conveying pipe is provided with a liquid conveying opening and a liquid outlet which extend outwards, and the flow speed regulating valve is arranged on the liquid conveying opening. The requirement for temperature adjustment of different areas is met, heated circulating liquid can be introduced into the pipeline to heat the temperature-uniforming plate, cooled circulating liquid can also be introduced into the pipeline to cool the temperature-uniforming plate, and rapid heating and cooling can be switched.

Description

Technical Field

[0001] The present application belongs to the technical field of display panel manufacturing, and in particular, relates to a temperature homogenizing plate and a control method thereof. Background Art

[0002] In the inkjet printing process, the drying and film-forming process after the ink droplets enter the pixel slot is crucial. Each pixel slot on the substrate must be uniformly filmed. Uneven deposition of ink droplets will lead to the problem of short life of OLED (Organic Light-Emitting Diode). Thinner areas will generate higher current, resulting in rapid aging.

[0003] In the relevant technical solutions, a heating plate is often used to bury heat pipes to heat the substrate products. The heating pipes are resistive electric heating. During the drying process of the OLED display panel, the heating plate is in a heating state for a long time and works continuously for a long time. Therefore, the heating pipes are easily burned out due to long-term use of resistive electric heating. The life of the heating pipes is limited. If one of the heating pipes in the hot plate is broken, it will cause uneven heating, which will affect the film forming process of the substrate, and the entire hot plate needs to be replaced. Summary of the invention

[0004] The purpose of the present application is to provide a temperature vapor chamber and a temperature control method thereof, which can solve at least one of the above problems.

[0005] The first aspect of the present application provides a temperature equalizing plate, comprising: a heat dissipation layer for placing a panel; a temperature equalizing plate, which is arranged at the bottom of the heat dissipation layer, and a mounting surface is provided on the temperature equalizing plate, and the mounting surface includes a central portion, a transition portion and an edge portion arranged in sequence from the inside to the outside; an infusion tube, which is arranged on the mounting surface, and at least one infusion tube is respectively provided on the central portion, the transition portion and the edge portion, and the infusion tube is provided with an infusion port and an outlet extending outward; a flow control valve, which is provided on the infusion port.

[0006] Therefore, the present application has at least the following beneficial effects: the temperature equalizing plate can be both heated and cooled, which can meet the cooling process and heating process requirements in panel manufacturing. The temperature equalizing plate meets the needs of temperature regulation in different areas by setting pipes in multiple areas. The pipes can be passed with heated circulating fluid to heat the temperature equalizing plate, or with cooled circulating fluid to cool the temperature equalizing plate, and heating and cooling can be switched quickly.

[0007] According to some embodiments of the present application, a protrusion is provided on the outer side of the temperature homogenizing plate, and a fixing hole is provided on the protrusion, and the fixing hole is used to fix the temperature homogenizing plate using a fixing member.

[0008] According to some embodiments of the present application, the fixing hole is in an elongated strip shape, and one end of the fixing hole faces the center of the central portion.

[0009] According to some embodiments of the present application, a mounting groove is provided on the mounting surface, the infusion tube is embedded in the mounting groove, and a fixing layer is provided between the mounting groove and the infusion tube.

[0010] According to some embodiments of the present application, the distance between adjacent infusion tubes in the central portion, the transition portion, and the edge portion gradually increases from the outside to the inside.

[0011] According to some embodiments of the present application, a thermal insulation layer is further provided at the bottom of the temperature homogenizing plate.

[0012] According to some embodiments of the present application, a guide seat is further provided on the top surface of the temperature equalizing plate, and a guide hole which is cooperatively connected with the guide seat is provided on the temperature equalizing plate.

[0013] Furthermore, the guide seat is provided with an inclined surface.

[0014] According to some embodiments of the present application, a plurality of temperature sensors are further included, and the plurality of temperature sensors are respectively arranged on the central portion, the transition portion, and the edge portion.

[0015] The second aspect of the present application also provides a temperature control method for a temperature vapor chamber, comprising: A temperature control system applied to a temperature homogenizing plate, the temperature control system comprising a thermostat, a control device, a thermocouple, a flow controller and the temperature homogenizing plate as described above; the thermostat is electrically connected to the controller and the thermocouple; the flow controller is electrically connected to the controller and the flow speed regulating valve respectively; The control method comprises the steps of: Read the preset temperature and obtain the actual temperature of different areas through the temperature sensor, calculate the difference between the preset temperature and the actual temperature, and determine whether the temperature of a certain area needs to be adjusted based on the difference result; If the difference result is that the temperature of a certain area is different from the preset temperature, a voltage control signal is sent to the thermocouple; When the thermocouple receives the voltage control signal, the voltage of the thermocouple is adjusted, and a control signal is generated according to the adjusted voltage of the thermocouple; When the flow controller receives the control signal, the real-time flow rate and real-time flow velocity of the flow controller are adjusted according to the control signal to control the temperature of the temperature homogenizing plate.

[0016] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of a temperature homogenizing plate provided in an embodiment of the present application; Figure 2 An exploded structural diagram of a temperature homogenizing plate provided in an embodiment of the present application; Figure 3 A schematic diagram of the internal structure of a temperature homogenizing plate provided in an embodiment of the present application; Figure 4 A schematic diagram of the structure of the protrusion provided in the embodiment of the present application; Figure 5 A schematic diagram of the structure of the installation slot provided in the embodiment of the present application; Figure 6 A schematic diagram of a temperature vapor chamber control system provided in an embodiment of the present application; Figure 7 A schematic flow chart of a method for controlling a temperature homogenizing plate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0018] The following description provides specific application scenarios and requirements of this specification, with the purpose of enabling those skilled in the art to make and use the contents of this specification. Various local modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but to the widest scope consistent with the claims.

[0019] In view of the following description, these and other features of the present specification, as well as the operation and function of the related elements of the structure, and the economy of the combination and manufacture of the parts can be significantly improved. Reference is made to the accompanying drawings, all of which form a part of this specification. However, it should be clearly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this specification. It should also be understood that the drawings are not drawn to scale.

[0020] In the relevant technical solution, the heating of the temperature-averaging plate is carried out by burying electric heating rods in the temperature-averaging plate. The heating is controlled by controlling the current size. The heating is prone to overshoot, which is not conducive to the temperature control of the temperature-averaging plate. The cooling relies on natural cooling. For example, when producing the first product, the temperature-averaging plate is first processed at 20°C and then at 60°C. After the processing is completed, the sheet is produced. When the second product comes in, the temperature-averaging plate needs to be lowered to 20°C. If it is cooled naturally, it takes a long time to wait, which is not conducive to improving the production rhythm, and the process efficiency is very low. Secondly, during the drying process of the OLED display panel, the temperature-averaging plate is in a heating state for a long time. After long-term use, the electric heating rods have a limited service life. Some electric heating rods will burn out, resulting in poor temperature uniformity of the temperature-averaging plate, which needs to be dismantled and repaired, which is not conducive to improving the utilization rate of the equipment.

[0021] Based on the above problems, refer to Figure 1 to Figure 7 The present application provides a temperature equalizing plate 100, comprising: a heat dissipation layer 160, the temperature equalizing plate 100, an infusion tube 400 and a flow control valve 200, wherein the heat dissipation layer 160 is used to place a substrate or panel to be processed, and the heat dissipation layer 160 is installed on the upper surface of the temperature equalizing plate 100 body. The heat dissipation layer 160 can be replaced by heat dissipation powder or heat dissipation film. For example, the heat dissipation powder can be coated on the upper surface of the temperature equalizing plate 100 body by coating, or a heat dissipation film can be attached to the upper surface of the temperature equalizing plate 100 body to form the heat dissipation layer 160.

[0022] The temperature equalizing plate 100 is arranged at the bottom of the heat dissipation layer 160. The temperature equalizing plate 100 is provided with a mounting surface 130. The mounting surface 130 includes a central portion 134, a transition portion 135 and an edge portion 136 arranged in sequence from the inside to the outside. At least one infusion tube 400 is respectively provided on the central portion 134, the transition portion 135 and the edge portion 136. The infusion tube 400 is provided with an infusion port 401 and an outlet port 402 extending outward; circulating fluid can be introduced into or discharged from each infusion tube 400 through the infusion port 401 and the outlet port 402.

[0023] The flow rate regulating valve 200 is arranged on the infusion port 401 of the infusion tube 400. After the circulating liquid is introduced into the infusion tube 400, the flow rate and flow rate of the circulating liquid in the circulating liquid pipeline can be controlled. For example, the flow rate regulating valve 200 is respectively arranged on the central part 134, the transition part 135 and the edge part 136. For the central part 134, the heat is not easy to be dissipated in the middle, and the flow rate of the circulating liquid in the circulating liquid pipeline can be adjusted to be smaller to slow down the flow rate. For the edge part 136, the heat is easy to be dissipated at the edge, and the flow rate of the circulating liquid in the circulating liquid pipeline can be adjusted to be larger to speed up the flow rate, so that heat can be quickly supplied or absorbed.

[0024] When in use, the liquid infusion tube 400 on the temperature plate 100 can be filled with heated liquid or cooled circulating liquid. When the temperature plate 100 needs to be heated, the circulating liquid of the specified temperature is filled, and when the temperature plate 100 needs to be cooled, the cooling liquid of the specified temperature is filled, and the temperature plate 100 can be cooled quickly. The heating and cooling of the circulating liquid can be completed by an external temperature controller, and the external temperature controller is very convenient to replace.

[0025] Specifically, Figure 3 As shown, the liquid delivery tube 400 is embedded in the plate body and is installed in a ring shape on the mounting surface 130 in the plate body. The circulating liquid pipeline is installed in the central portion 134, the transition portion 135 and the edge portion 136 respectively. Specifically, the central portion 134 is located within the central heating zone boundary line 133; the transition portion 135 is located between the central heating zone boundary line 133 and the transition zone boundary line 132; and the edge portion 136 is located between the transition zone boundary line 132 and the edge zone boundary line 131.

[0026] According to some embodiments of the present application, a protrusion 140 is provided on the outside of the temperature equalizing plate 100, and a fixing hole 141 is provided on the protrusion 140, and the fixing hole 141 is used to fix the temperature equalizing plate 100 using a fixing member such as a fixing screw. Further, the fixing hole 141 is in an elongated strip shape, and one end of the fixing hole 141 faces the center of the central portion 134, wherein a plurality of protrusions 140 are provided, distributed along the periphery of the temperature equalizing plate 100, and a plurality of protrusions 140 are provided with fixing holes 141, that is, one end of the plurality of elongated holes all point to the center position of the temperature equalizing plate, so that the temperature equalizing plate 100 can expand and contract freely, and the flatness of the temperature equalizing plate 100 will not be affected, thereby improving the temperature uniformity of the surface of the temperature equalizing plate 100.

[0027] In particular, when the temperature equalizer 100 is heated or cooled, it will expand or contract to a certain extent. By designing such a long strip of fixing holes toward the center of the hot plate, the temperature equalizer 100 can shrink or expand in the plane direction without warping due to thermal expansion and contraction. The fixing holes on the temperature equalizer 100 can move relative to the fixing screws when expanding or contracting. In other words, if the protrusion 140 and the fixing holes 141 are not provided separately, and the fixing screws are used to fix directly on the mounting surface of the temperature equalizer 100, then the temperature equalizer 100 cannot be moved at the position where the fixing screws are located. When heated or cooled, the temperature equalizer 100 will expand or contract, but the temperature equalizer 100 is fixed all around and cannot move. Then, when it expands due to heat, the middle plane will warp up, affecting the flatness of the temperature equalizer 100, and further affecting the temperature uniformity of the temperature equalizer 100.

[0028] According to some embodiments of the present application, a mounting groove 150 is provided on the mounting surface 130, and the infusion tube 400 is embedded in the mounting groove 150, and a fixing layer 120 is provided between the mounting groove 150 and the infusion tube 400. The fixing layer 120 can be filled with thermal conductive silicone grease, which can not only fix the circulating infusion tube to ensure that the circulating liquid pipeline cannot move when the temperature plate 100 is in use, but also eliminate the gap between the infusion tube 400 and the main body of the temperature plate 100, improve the thermal conductivity between the circulating liquid pipeline and the main body, and prevent uneven heat transfer between the circulating infusion tube and the temperature plate 100, thereby improving the temperature heat transfer efficiency and ensuring the temperature uniformity of the temperature plate 100.

[0029] According to some embodiments of the present application, the distance between adjacent infusion tubes 400 in the center portion 134, the transition portion 135 and the edge portion 136 gradually increases from the outside to the inside. In other words, from the center portion 134, the transition portion 135 to the edge portion 136, the distance between the infusion tubes 400 decreases from large to small, and the closer to the edge, the faster the heat dissipation, and the smaller the distance between the circulating liquid pipes. Temperature sensors 500 can be installed in the three heating zones of the center portion 134, the transition portion 135, and the edge portion 136, and the temperatures of the three zones can be measured in real time. In the present application, there is one each in the center portion 134, the transition portion 135, and the edge portion 136. As the size of the temperature equalizing plate 100 increases, the area of ​​the heating zone can be further increased, and the number is not limited.

[0030] In some embodiments, a heat preservation layer 600 is further provided at the bottom of the temperature homogenizing plate 100. Specifically, the heat preservation layer 600 is designed at the bottom, and the heat preservation layer 600 can be provided with a heat-insulating material, which is not limited here. The heat preservation layer 600 is provided for fixing and heat insulation, so that heat can only be conducted upward to the top, and the heat dissipation layer 160 is provided at the top, thereby ensuring the heat dissipation direction of the temperature homogenizing plate 100, and the heat is dissipated from the heat dissipation layer 160.

[0031] According to some embodiments of the present application, Figure 1 and Figure 2 As shown, the top surface of the temperature equalizing plate 100 is also provided with a guide seat 300, and the temperature equalizing plate 100 is provided with a guide hole 110 that is connected to the guide seat 300. When in use, the guide seat 300 can be installed in the guide hole 110 so that the top of the guide seat 300 extends out, which is used for positioning and guiding when the product is placed. Furthermore, an inclined surface is provided on the guide seat 300. Thus, the product is placed on the heat dissipation layer 160. The substrate guide structure presents a slope shape through the inclined surface, and the substrate guide is made of a low-friction material, such as a smooth material such as Teflon or PEEK material. This slope structure and smooth surface are conducive to the automatic correction of the product when it is placed at an angle.

[0032] The second aspect of the present application also provides a temperature control method for a temperature vapor chamber, which is applied to a temperature control system of the temperature vapor chamber, wherein the temperature control system comprises a thermostat, a control device, a thermocouple, a flow controller and the temperature vapor chamber as described above; the thermostat is electrically connected to the controller, the thermocouple and a plurality of temperature sensors, wherein the plurality of temperature sensors are respectively arranged on a central portion, a transition portion and an edge portion; the flow controller is electrically connected to the controller and a flow speed regulating valve respectively; See also Figure 7 , the control method comprises the steps of: S100, reading the preset temperature and obtaining the actual temperature of different areas through the temperature sensor, calculating the difference between the preset temperature and the actual temperature, and judging whether the temperature of a certain area needs to be adjusted according to the difference result; S200, if the difference result is that the temperature of a certain area is different from the preset temperature, a voltage control signal is sent to the thermocouple; S300, when the thermocouple receives the voltage control signal, the voltage of the thermocouple is adjusted, and a control signal is generated according to the adjusted voltage of the thermocouple; S400, when the flow controller receives the control signal, the real-time flow rate and real-time flow velocity of the flow controller are adjusted according to the control signal to control the temperature of the temperature homogenizing plate.

[0033] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application.

[0034] In a specific embodiment, the controller is a PID controller, the temperature sensor tests the temperature on the temperature equalizing plate in real time, and feeds back the tested temperature to the thermostat, the thermostat controls the voltage of the thermocouple according to the difference between the actual temperature measured by the temperature sensor and the pre-set temperature of the thermostat, the PID controller controls the flow controller according to the voltage fluctuation of the thermocouple, the flow controller controls the flow size and speed flowing into the temperature equalizing plate, and thus can control the temperature of each area in the temperature equalizing plate.

[0035] In summary, the temperature equalizer can be heated or cooled, which can meet the requirements of cooling process and heating process. The temperature equalizer is manufactured by embedding pipes. The pipes can be used to pass heated circulating fluid to heat the temperature equalizer, or cooled circulating fluid to cool the temperature equalizer. The temperature equalizer can be quickly switched between heating and cooling, and can also be quickly cooled without waiting for natural cooling, which can improve the production rhythm of the product. Secondly, the flow rate and flow velocity of the circulating fluid in the temperature equalizer can be controlled. For the central heating area, the temperature loss is small, and the flow rate and flow velocity of the circulating fluid can be adjusted to a small value. For the edge heating area, the flow rate and flow velocity of the circulating fluid can be increased to absorb or conduct more heat, thereby controlling the temperature of each area in the temperature equalizer, so that the surface temperature of the temperature equalizer is uniform. Compared with the heating by electric heating rods in the prior art, it is necessary to control the current size to control the heating, and the temperature equalizer using circulating liquid temperature control is easier to control the temperature, and the temperature will not overshoot.

[0036] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the above-described system, device, or unit can refer to the corresponding process in the aforementioned method embodiment and will not be repeated here.

[0037] The above is a description of a specific embodiment of the present specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require a specific order or a continuous order to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0038] In addition, certain terms in this specification have been used to describe embodiments of this specification. For example, "one embodiment", "an embodiment" and / or "some embodiments" mean that a particular feature, structure or characteristic described in conjunction with the embodiment may be included in at least one embodiment of this specification. Therefore, it can be emphasized and should be understood that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various parts of this specification do not necessarily refer to the same embodiment. In addition, specific features, structures or characteristics may be appropriately combined in one or more embodiments of this specification.

[0039] Finally, it should be understood that the embodiments of the application disclosed herein are explanations of the principles of the embodiments of this specification. Other modified embodiments are also within the scope of this specification. Therefore, the embodiments disclosed in this specification are only used as examples and not as limitations. Those skilled in the art can adopt alternative configurations according to the embodiments in this specification to implement the application in this specification. The embodiments of this specification are not limited to the embodiments accurately described in the application.

Claims

1. A temperature equalizing plate, characterized in that: include: A heat dissipation layer for placing panels; A temperature averaging plate, which is arranged at the bottom of the heat dissipation layer, and the temperature averaging plate is provided with a mounting surface, and the mounting surface includes a central portion, a transition portion and an edge portion which are arranged in sequence from the inside to the outside; An infusion tube, which is arranged on the mounting surface, and at least one of the infusion tubes is respectively arranged on the central portion, the transition portion and the edge portion, and the infusion tube is provided with an infusion port and an outlet extending outward; A flow rate regulating valve is arranged on the infusion port.

2. A temperature homogenizing plate according to claim 1, characterized in that: A protrusion is provided on the outer side of the temperature homogenizing plate, and a fixing hole is provided on the protrusion. The fixing hole is used to fix the temperature homogenizing plate using a fixing piece.

3. A temperature homogenizing plate according to claim 2, characterized in that: The fixing hole is in an elongated strip shape, and one end of the fixing hole faces the center of the central portion.

4. The temperature homogenizing plate according to claim 1, characterized in that: The mounting surface is provided with a mounting groove, the infusion tube is embedded in the mounting groove, and a fixing layer is provided between the mounting groove and the infusion tube.

5. A temperature homogenizing plate according to claim 4, characterized in that: The distance between adjacent infusion tubes in the central portion, the transition portion and the edge portion gradually increases from the outside to the inside.

6. The temperature homogenizing plate according to claim 1, characterized in that: A heat preservation layer is also arranged at the bottom of the temperature equalizing plate.

7. The temperature homogenizing plate according to claim 1, characterized in that: A guide seat is also provided on the top surface of the temperature averaging plate, and a guide hole which is matched and connected with the guide seat is provided on the temperature averaging plate.

8. A temperature homogenizing plate according to claim 7, characterized in that: The guide seat is provided with an inclined surface.

9. The temperature homogenizing plate according to claim 1, characterized in that: It also includes a plurality of temperature sensors, which are respectively arranged on the central portion, the transition portion and the edge portion.

10. A temperature control method for a temperature homogenizing plate, characterized in that: include: A temperature control system applied to a temperature vapor chamber, the temperature control system comprising a thermostat, a control device, a thermocouple, a flow controller and the temperature vapor chamber according to any one of claims 1 to 9; the thermostat is electrically connected to the controller and the thermocouple; the flow controller is electrically connected to the controller and the flow speed regulating valve respectively; The control method comprises the steps of: Read the preset temperature and obtain the actual temperature of different areas through the temperature sensor, calculate the difference between the preset temperature and the actual temperature, and determine whether the temperature of a certain area needs to be adjusted based on the difference result; If the difference result is that the temperature of a certain area is different from the preset temperature, a voltage control signal is sent to the thermocouple; When the thermocouple receives the voltage control signal, the voltage of the thermocouple is adjusted, and a control signal is generated according to the adjusted voltage of the thermocouple; When the flow controller receives the control signal, the real-time flow rate and real-time flow velocity of the flow controller are adjusted according to the control signal to control the temperature of the temperature homogenizing plate.

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