Display panel and manufacturing method thereof

Abstract

The invention provides a display panel and a manufacturing method thereof. The display panel comprises a carrier plate, the carrier plate is provided with a patterned area, and the patterned area is located on the surface of the carrier plate and corresponds to the multiple sub-pixel structures. The display panel also comprises a packaging material layer, and the packaging material layer is arranged on a part of the patterned area. The display panel further comprises a first color conversion layer which is arranged on a part of the packaging material layer and comprises a plurality of first color conversion packaging bodies. The first color conversion package is configured to convert a light emitting color of the sub-pixel structure into a first light emitting color. Part of the surface of some of the first color conversion packaging bodies is exposed from the packaging material layer.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a display panel, and more particularly to a display panel including a plurality of color conversion packages and a manufacturing method thereof. Background Art

[0002] With the advancement of optoelectronic technology, the size of many optoelectronic components has gradually become smaller. Compared with organic light-emitting diode (OLED) technology, micro LED (mLED / μLED) has the advantages of high efficiency, long life, and relatively stable materials that are not easily affected by the environment. Therefore, displays using micro LEDs arranged in arrays are gradually gaining attention in the market.

[0003] Quantum dots (QDs) are semiconductor particles composed of II-VI or III-V elements, and their size is generally between a few nanometers and tens of nanometers. The luminous color of quantum dot materials can be adjusted by their size, structure or composition, and they are widely used in display panels / devices to achieve high color purity color conversion performance when used with components such as filter films.

[0004] However, when using quantum dot materials as the color conversion layer of the display panel, it is necessary to mix the quantum dot materials with the photoresist liquid and seal the display panel with a cover plate, a plastic frame, etc. to prevent the mixed liquid from overflowing or the quantum dot materials from being affected by water and air and deteriorating, thereby increasing the process cost. As the pixel size decreases, the nozzle that sprays the quantum dot material and the photoresist liquid is miniaturized, and only a low concentration of the quantum dot material in the mixed liquid can be allowed, resulting in the inability to break through the light (color) conversion efficiency.

[0005] In addition, since the mixture of quantum dot material and photoresist is contained in the holes formed by the banks of the patterned array, increasing the height of the banks can accommodate more mixed liquid to improve conversion efficiency. However, due to the limitations of exposure and development technology, it is difficult to form a bank of sufficient height. Therefore, the use of quantum dot materials to achieve color conversion of micro-LED display panels / devices still faces various challenges. Summary of the invention

[0006] According to some embodiments of the present disclosure, a display panel and a manufacturing method thereof are provided. The display panel includes a color conversion layer disposed on a packaging material layer. Since the color conversion layer includes a plurality of color conversion encapsulation bodies, and the color conversion encapsulation bodies can be adhered to the packaging material layer, it is not necessary to mix the color conversion encapsulation bodies with a photoresist solution, thereby forming a color conversion layer with a high density / high concentration to improve the light (color) conversion efficiency of the display panel.

[0007] Thus, the required light (color) conversion efficiency can be achieved without increasing the height of the retaining wall, effectively reducing the difficulty of manufacturing the display panel. In addition, after the manufacturing is completed, the remaining unused color conversion package can be recycled, thereby avoiding waste and reducing the overall manufacturing cost and environmental protection cost.

[0008] The embodiment of the present disclosure includes a display panel. The display panel includes a carrier having a patterned area, the patterned area is located on the surface of the carrier and corresponds to a plurality of sub-pixel structures. The display panel also includes an encapsulation material layer, the encapsulation material layer is disposed on a portion of the patterned area. The display panel also includes a first color conversion layer, the first color conversion layer is disposed on a portion of the encapsulation material layer and includes a plurality of first color conversion encapsulation bodies. The first color conversion encapsulation body is configured to convert the luminous color of the sub-pixel structure into a first luminous color. Partial surfaces of some of the first color conversion encapsulation bodies are exposed from the encapsulation material layer.

[0009] The disclosed embodiment also includes a method for manufacturing a display panel. The method for manufacturing a display panel includes the following steps. A carrier is provided, wherein the carrier has a patterned area, the patterned area is located on the surface of the carrier and corresponds to a plurality of sub-pixel structures. A viscous encapsulation material layer is formed on a portion of the patterned area. A plurality of first color conversion packages are provided on the surface of the carrier, wherein the first color conversion packages are configured to convert the luminous color of the sub-pixel structure into a first luminous color. Some of the first color conversion packages are adhered to a portion of the encapsulation material layer, wherein a portion of the surface of some of the first color conversion packages adhered to the encapsulation material layer is exposed from the encapsulation material layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The following will be described in detail with the accompanying drawings. It should be noted that, according to standard practice in the industry, various feature components are not drawn to scale. In fact, the sizes of various feature components may be enlarged or reduced to clearly show the technical features of the embodiments of the present disclosure.

[0011] Figures 1 to 7 is a partial top view showing various stages of manufacturing a display panel according to some embodiments of the present disclosure;

[0012] FIG. 8A to FIG. 8H is a partial cross-sectional view showing various stages of adhering a color conversion package to a packaging material layer according to some embodiments of the present disclosure;

[0013] Fig. 9 is a partial cross-sectional view showing a display panel according to some embodiments of the present disclosure.

[0014] Description of Figure Numbers

[0015] 100: Display panel

[0016] 10: Carrier board

[0017] 12: Luminescent chip

[0018] 18: Cover

[0019] 20: Packaging material layer

[0020] 20-1: Third side

[0021] 20-2: Fourth side

[0022] 11B, 11G, 11R: Sub-pixel structure

[0023] 30G, 30R: Color conversion layer

[0024] 30GS, 30RS: Color conversion package

[0025] 30G1,30R1: First side

[0026] 30G2,30R2: Second side

[0027] 40: light absorbing layer

[0028] 52: Clamp

[0029] 54,56: Cavity

[0030] A-A',B-B': line

[0031] d1,d2: diameter

[0032] H30R,H30G,H40:Height

[0033] P: Patterned area

[0034] X, Y, Z: coordinate axes DETAILED DESCRIPTION

[0035] The following disclosure provides many different embodiments or examples to implement different features of the present invention. The specific examples of the various components and their arrangement described below are to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, if it is described that a first feature component is formed on or above a second feature component, it may include an embodiment in which the first feature component and the second feature component are in direct contact, and it may also include an embodiment in which other feature components are formed between the first feature component and the second feature component, so that the first feature component and the second feature component may not be in direct contact.

[0036] It should be understood that other operating steps may be implemented before, during or after the method, and in other embodiments of the method, some operating steps may be replaced or omitted.

[0037] Additionally, spatially relative terms such as "under," "beneath," "below," "over," "above," "upper," and the like may be used herein to facilitate describing the relationship of one component or feature to other components or features in the drawings. These spatially relative terms encompass various orientations of the device in use or operation, as well as the orientations depicted in the drawings. The device may be oriented in various orientations (rotated 90 degrees or at other orientations), and the spatially relative adjectives used herein will be interpreted accordingly.

[0038] In the present disclosure, the terms "about", "approximately", and "substantially" generally mean within 20% of a given value, or within 10% of a given value, or within 5% of a given value, or within 3% of a given value, or within 2% of a given value, or within 1% of a given value, or even within 0.5% of a given value. The given values ​​of the present disclosure are approximate values. That is, in the absence of a specific description of "about", "approximately", and "substantially", a given value may still include the meaning of "about", "approximately", and "substantially".

[0039] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as those commonly understood by those skilled in the art to which this disclosure belongs. It should be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the context of the relevant technology and will not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

[0040] The present disclosure may repeatedly use the same reference symbols and / or marks in the following embodiments. These repetitions are for the purpose of simplicity and clarity, and are not intended to limit the specific relationship between the various embodiments and / or structures discussed.

[0041] Figures 1 to 7 1 is a partial top view showing various stages of manufacturing a display panel 100 according to some embodiments of the present disclosure. It should be noted that for the purpose of simplicity, Figures 1 to 7 Some components of the display panel 100 have been omitted.

[0042] Reference Figure 1 In some embodiments, a carrier 10 is provided, and the carrier 10 has a patterned region P, and the patterned region P is located on the surface of the carrier 10 and corresponds to a plurality of sub-pixel structures 11R, sub-pixel structures 11G, and sub-pixel structures 11B. Figure 1As shown, the plurality of sub-pixel structures 11R, the sub-pixel structures 11G, and the sub-pixel structures 11B may be arranged in an array, but the embodiment of the present disclosure is not limited thereto.

[0043] In some embodiments, the carrier 10 is a display substrate, a light-emitting substrate, a substrate having functional components such as a thin-film transistor (TFT) or an integrated circuit (IC), or other types of circuit substrates, and the sub-pixel structure 11R, the sub-pixel structure 11G, and the sub-pixel structure 11B are disposed on the carrier 10 and are electrically connected to the carrier 10. The carrier 10 may be, for example, a rigid circuit substrate, which may include an element semiconductor (e.g., silicon or germanium), a compound semiconductor (e.g., silicon carbide (SiC), gallium arsenide (GaAs), indium arsenide (InAs), or indium phosphide (InP)), an alloy semiconductor (e.g., SiGe, SiGeC, GaAsP, or GaInP), other appropriate semiconductors, or a combination thereof. Alternatively, the carrier 10 may also be a flexible circuit substrate, a semiconductor-on-insulator (SOI) substrate, or other similar substrates.

[0044] In addition, the carrier 10 may include various conductive components (e.g., conductive lines or vias). For example, the conductive components may include aluminum (Al), copper (Cu), tungsten (W), their respective alloys, other appropriate conductive materials, or combinations thereof. In the example where the carrier 10 is a display substrate, the carrier 10 may be further connected to an external circuit (not shown) to drive and operate the sub-pixel structure 11R, the sub-pixel structure 11G, and the sub-pixel structure 11B.

[0045] In some other embodiments, the carrier 10 is a temporary substrate (template). For example, the carrier 10 may include a plastic substrate, a ceramic substrate, a glass substrate, a sapphire substrate or other substrates without circuits. In these examples, light-emitting components may be manufactured on the carrier 10 in the regions corresponding to the sub-pixel structures 11R, 11G and 11B (for example, by an epitaxial growth process), but the embodiments of the present disclosure are not limited thereto.

[0046] Reference Figure 2 In some embodiments, an viscous encapsulation material layer 20 is formed on a portion of the patterned region P. More specifically, the encapsulation material layer 20 is formed on a region of the patterned region P corresponding to the sub-pixel structure 11R. For example, the encapsulation material layer 20 may be an viscous transparent photoresist, which may include silicon oxide (SiOx ) or titanium oxide (TiO2), but the present disclosure is not limited thereto. The packaging material layer 20 can be formed by a coating process and a patterning process.

[0047] Specifically, the aforementioned viscous transparent photoresist can be coated on the surface of the carrier 10. Then, a pre-curing process is performed on the transparent photoresist located on the local area (i.e., the area corresponding to the subsequently formed patterned structure 11R). For example, the composition of the transparent photoresist can be adjusted (e.g., controlling the content of the photoinitiator), the heating time or temperature can be controlled (e.g., pre-exposure baking or post-exposure baking (PEB)), the curing time can be controlled (e.g., exposure time) and / or the UV dose can be controlled (e.g., exposure intensity) to achieve pre-curing of the local area. After pre-curing, the transparent photoresist can be patterned so that the transparent photoresist located on the local area (i.e., the area corresponding to the subsequently formed patterned structure 11R) will not be removed by washing, but will not be completely cured (i.e., it remains viscous), thereby forming a packaging material layer 20 on the area of ​​the patterned area P corresponding to the sub-pixel structure 11R.

[0048] Reference Figure 3 A plurality of color conversion packages 30RS are provided on the surface of the carrier 10, and the color conversion packages 30RS are configured to convert the emission color of the sub-pixel structure 11R into red. The color conversion package 30RS includes red quantum dots, and the color conversion package 30RS also includes polystyrene (PS), polyethylene (PE), acrylic resin, silicone (e.g., glass), polycarbonate (PC), similar materials, mixtures or copolymers thereof.

[0049] Reference Figure 4 , some color conversion packages 30RS are adhered on the packaging material layer 20 corresponding to the area of ​​the sub-pixel structure 11R. Afterwards, the color conversion packages 30RS not adhered on the packaging material layer 20 are removed from the carrier 10. For example, the color conversion packages 30RS not adhered on the packaging material layer 20 can be removed from the carrier 10 by shaking, inverting, blowing, fluid suspension or other similar procedures, but the embodiments of the present disclosure are not limited thereto.

[0050] After removing the unattached color conversion package 30RS, the packaging material layer 20 on the patterned area P corresponding to the sub-pixel structure 11R is cured so that the packaging material layer 20 in this area is not sticky after curing. For example, a thermal curing process, a photo curing process, an ultraviolet curing process, or other similar processes may be performed to cure the packaging material layer 20, but the embodiments of the present disclosure are not limited thereto.

[0051] Since the encapsulation material layer 20 on the sub-pixel structure 11R is completely cured, the color conversion package 30RS is fixed in the region of the sub-pixel structure 11R. Figure 5 , repeat the above steps to form an adhesive packaging material layer 20 again on the area of ​​the patterned area P corresponding to the sub-pixel structure 11G. The packaging material layer 20 can be formed on the area corresponding to the sub-pixel structure 11G in the above manner, but the embodiment of the disclosure is not limited thereto.

[0052] Reference Figure 6 A plurality of color conversion packages 30GS are provided on the surface of the carrier 10. The color conversion packages 30GS are configured to convert the luminous color of the sub-pixel structure 11G into green. Figures 3 to 6 The formation order, the color of the sub-pixel structure or the color and quantity of the color conversion can be adjusted freely. In addition, in some embodiments, the light color converted by the color conversion package may not be the wavelength of the standard red or green light, such as yellow.

[0053] In this embodiment, the color conversion package 30GS and the color conversion package 30RS convert the sub-pixel structure 11G and the sub-pixel structure 11R into green and red respectively. The color conversion package 30GS comprises the same or similar materials as the color conversion package 30RS, which will not be repeated here.

[0054] Reference Figure 7 , some color conversion packages 30GS are adhered to the packaging material layer 20 in the area corresponding to the sub-pixel structure 11G, and the color conversion packages 30GS not adhered to the packaging material layer 20 are removed from the carrier 10. Similarly, the color conversion packages 30GS not adhered to the packaging material layer 20 can be removed from the carrier 10 by shaking, inverting, blowing, fluid suspension or other similar procedures.

[0055] In addition, in some embodiments, the encapsulation material layer 20 on the patterned region P corresponding to the sub-pixel structure 11G is cured so that the encapsulation material layer 20 in this region is not sticky after curing. The example of the process of curing the encapsulation material layer 20 is described above and will not be repeated here.

[0056] FIG. 8A to FIG. 8H 3 is a partial cross-sectional view showing various stages of attaching the color conversion package 30RS and the color conversion package 30GS to the packaging material layer 20 according to some embodiments of the present disclosure. For example, FIG. 8A to FIG. 8H The partial cross-sectional view shown may correspond to Figure 7 Similarly, for the purpose of simplicity, FIG. 8A to FIG. 8H Some parts have been omitted.

[0057] Reference Fig. 8A , the carrier 10 including the packaging material layer 20 is inverted and adsorbed on the fixture 52. For example, the carrier 10 can be adsorbed on the fixture 52 by vacuum adsorption. In this embodiment, the packaging material layer 20 is disposed in the patterned area P of the carrier 10, corresponding to the area of ​​the patterned structure 11R formed subsequently. The packaging material layer 20 can be formed by the aforementioned coating process and patterning process.

[0058] Next, the fixture 52 adsorbing the carrier 10 is moved to the cavity 54 containing a plurality of color conversion packages 30RS. In the present embodiment, the color conversion package 30RS is a sphere and has a diameter d1. For example, the diameter d1 may be between 20nm and 150nm, such as between 50nm and 100nm, but the present embodiment is not limited thereto.

[0059] Next, refer to Figure 8B , move the fixture 52 (for example, move the fixture to Figure 8B The carrier 10 and the packaging material layer 20 are moved in the +Z direction in the cavity 54, and the carrier 10 and the packaging material layer 20 are brought into contact with the plurality of color conversion packages 30RS.

[0060] Next, refer to Figure 8C and Fig.8D , move the fixture 52 (for example, move the fixture to Figure 8B The carrier 10 and the packaging material layer 20 are moved away from the cavity 54. Figure 8C As shown, some of the color conversion packages 30RS are adhered to the packaging material layer 20, while the color conversion packages 30RS that are not adhered to the packaging material layer 20 fall back into the cavity 54 (ie, are recovered).

[0061] After the color conversion package 30RS is adhered to the packaging material layer 20, a curing process may be performed to completely cure the packaging material layer 20. At this stage, the curing process may include a hard baking process, and the hard baking process may be performed at a temperature of 120° C. to 200° C., but the present disclosure is not limited thereto. Figure 8C and Fig.8D As shown, a plurality of color conversion packages 30RS are stacked on the packaging material layer 20 to form a color conversion layer 30R.

[0062] Next, refer to Fig. 8E In this embodiment, the packaging material layer 20 is disposed in the patterned area P of the carrier 10 and corresponds to the area of ​​the patterned structure 11G formed subsequently. For example, the packaging material layer 20 can be formed by a coating process and a patterning process. Examples of the relevant processes are described above and will not be repeated here.

[0063] Next, the fixture 52 adsorbing the carrier 10 is moved to another cavity 56 containing a plurality of color conversion packages 30GS. In some embodiments, the volume of each color conversion package 30GS is greater than the volume of each color conversion package 30RS. In this embodiment, the color conversion package 30GS is a sphere and has a diameter d2. For example, the diameter d2 may be between 20nm and 150nm, or between 50nm and 100nm. In addition, in this embodiment, the diameter d2 of the color conversion package 30GS is greater than the diameter d1 of the color conversion package 30RS, but the disclosed embodiment is not limited thereto.

[0064] Next, refer to Figure 8F , move the fixture 52 (for example, move the fixture to Figure 8F The carrier 10 and the packaging material layer 20 are moved in the +Z direction in the cavity 56, and the carrier 10 and the packaging material layer 20 are brought into contact with the plurality of color conversion packages 30GS.

[0065] Next, refer to Figure 8G and Figure 8H , move the fixture 52 (for example, move the fixture to Figure 8G The carrier 10 and the packaging material layer 20 are moved away from the cavity 56. Figure 8H As shown, some color conversion packages 30GS are adhered to the packaging material layer 20, while the color conversion packages 30GS that are not adhered to the packaging material layer 20 fall back into the cavity 56 (ie, are recovered).

[0066] In addition, since the diameter d2 of the color conversion package 30GS is larger than the diameter d1 of the color conversion package 30RS, during the process of adhering the color conversion package 30GS to the packaging material layer 20, the color conversion package 30GS can be prevented from being stuck in (or adhering to) the gaps between the plurality of color conversion packages 30RS already adhered to the packaging material layer 20. As can be understood from the above description, the size difference between the diameter d2 and the diameter d1 can prevent different color conversion packages from being mixed in the same patterned structure. Therefore, as long as the color conversion package with a smaller diameter is adhered before the one with a larger diameter, their conversion colors do not affect the order in which they are adhered.

[0067] Similarly, after the color conversion package 30GS is adhered to the packaging material layer 20, a curing process may be performed to completely cure the packaging material layer 20. Figure 8G and Figure 8H As shown, a plurality of color conversion packages 30GS are stacked on the packaging material layer 20 to form a color conversion layer 30G.

[0068] Fig. 9 is a partial cross-sectional view of a display panel 100 according to some embodiments of the present disclosure. For example, Fig. 9 The partial cross-sectional view shown may correspond to Figure 7 The cross section is cut by the line BB' in FIG. 1 , but the embodiments of the present disclosure are not limited thereto. Similarly, for the purpose of simplicity, Fig. 9 Some components of the display panel 100 have been omitted.

[0069] Refer to Figure 7 and Fig. 9 The display panel 100 includes a carrier 10, and the carrier 10 has a patterned area P. The patterned area P is located on the surface of the carrier 10 and corresponds to a plurality of sub-pixel structures 11R, a sub-pixel structure 11G, and a sub-pixel structure 11B. The display panel 100 also includes a packaging material layer 20, and the packaging material layer 20 is disposed on a first portion of the patterned area P (for example, corresponding to the sub-pixel structure 11R). The display panel 100 also includes a color conversion layer 30R, and the color conversion layer 30R is disposed on the first portion of the packaging material layer 20 and includes a plurality of color conversion packages 30RS, and the color conversion package 30RS is configured to convert the luminous color of the sub-pixel structure 11R into a first luminous color (for example, red). Fig. 9 As shown, in this embodiment, parts of the surfaces of some color conversion packages 30RS are exposed from the packaging material layer 20 .

[0070] like Fig. 9As shown, the color conversion package 30RS is stacked on the packaging material layer 20, and the color conversion layer 30R has a first side 30R1 connected to the packaging material layer 20 and a second side 30R2 away from the packaging material layer 20, and some of the color conversion packages 30RS with a portion of the surface exposed from the packaging material layer 20 are located on the second side 30R2. In addition, in some embodiments, the color conversion packages 30RS are closely adjacent to each other.

[0071] like Fig. 9 As shown, the second portion of the patterned area P (e.g., corresponding to the sub-pixel structure 11G) also has an encapsulation material layer 20, and the display panel 10 further includes a color conversion layer 30G, which is disposed on the second portion of the encapsulation material layer 20 and includes a plurality of color conversion encapsulation bodies 30GS, and the color conversion encapsulation bodies 30GS are configured to convert the luminous color of the sub-pixel structure 11G into a second luminous color (e.g., green). Fig. 9 As shown, in this embodiment, parts of the surfaces of some color conversion packages 30GS are exposed from the packaging material layer 20 .

[0072] Similarly, if Fig. 9 As shown, the color conversion package 30GS is stacked on the packaging material layer 20, and the color conversion layer 30G has a first side 30G1 connected to the packaging material layer 20 and a second side 30G2 away from the packaging material layer 20, and some of the color conversion packages 30GS with a portion of the surface exposed from the packaging material layer 20 are located on the second side 30G2. In addition, in some embodiments, the color conversion packages 30GS are closely adjacent to each other.

[0073] In some embodiments, the packaging material layer 20 includes a cured viscous photoresist material, the packaging material layer 20 has a third side 20-1 close to the carrier 10 and a fourth side 20-2 away from the carrier 10, and the color conversion package 30RS (and color conversion package 30GS) is adhered and fixed to the fourth side 20-2.

[0074] like Fig. 9As shown, in some embodiments, the display panel 100 further includes a light absorbing layer 40, which is disposed on the carrier 10 and may be an array structure of each sub-pixel structure (11R, 11G, and 11B) surrounding the patterned area P, so as to separate the sub-pixel structures (11R, 11G, and 11B) from each other on the surface of the carrier 40. For example, the light absorbing layer 40 may be a photoresist (e.g., a black photoresist or other suitable non-transparent photoresist), ink (e.g., a black ink or other suitable non-transparent ink), a molding compound (e.g., a black molding compound or other suitable non-transparent molding compound), a solder mask (e.g., a black solder mask or other suitable non-transparent solder mask), an epoxy resin, other suitable materials, or a combination of the foregoing materials. In some embodiments, the light absorbing layer 40 may include a photocurable material, a thermally curable material, or a combination of the foregoing materials. In addition, the light absorbing layer 40 may be formed by a coating process and a patterning process, but the embodiments of the present disclosure are not limited thereto.

[0075] It is important to note that in the aforementioned Figures 1 to 7 The process of manufacturing the display panel 100 is shown as follows FIG. 8A to FIG. 8H In the illustrated process, the light absorption layer 40 is omitted. In some embodiments, the light absorption layer 40 is first formed on the carrier 10 to define different sub-pixel structures 11R, sub-pixel structures 11G and sub-pixel structures 11B. FIG. 8A to FIG. 8H In the process shown, when the operating fixture 52 approaches the cavity 54 or 56 , the color conversion package will enter the array structure formed by the light absorbing layer 40 and adhere to the packaging material layer 20 between the light absorbing layers 40 .

[0076] like Fig. 9 As shown, in some embodiments, in the thickness direction of the carrier 10 (ie, Fig. 9 In the Z direction (in the horizontal direction), the heights H30R and H30G of the color conversion layers 30R and 30G are less than or equal to the height H40 of the light absorption layer 40. Here, the heights H30R and H30G are defined as the maximum heights of the color conversion layers 30R and 30G, respectively.

[0077] In addition, if Fig. 9As shown, in some embodiments, the display panel 100 includes a plurality of light-emitting chips 12, wherein the color conversion layer 30R and the color conversion layer 30G are correspondingly disposed on the light-emitting chip 12. For example, the light-emitting chip 12 can emit blue light, and the sub-pixel structure 11R uses the color conversion package 30RS of the color conversion layer 30R to convert the blue light into red light; the sub-pixel structure 11G uses the color conversion package 30GS of the color conversion layer 30G to convert the blue light into green light; the light-emitting chip 12 that does not correspond to the color conversion layer 30R or the color conversion layer 30G still maintains blue light, but the embodiments of the present disclosure are not limited thereto. Different color conversion layers can be disposed on the light-emitting chip 12 according to actual needs.

[0078] In some embodiments, the display panel 100 includes a cover plate 18, which is disposed above the light emitting chip 12 (the color conversion layer 30R and the color conversion layer 30G). For example, the cover plate 18 may include transparent glass, but the embodiments of the present disclosure are not limited thereto. In addition, a filling material (not shown) may be disposed in other gaps between the cover plate 18 and the carrier 10.

[0079] In summary, in the embodiments of the present disclosure, quantum dots have been encapsulated into a color conversion package. Therefore, the display panel of the present embodiment does not need to be additionally provided with a quantum dot protective layer (e.g., a plastic frame). In addition, the material ratio in the color conversion package can be customized, and the concentration of quantum dots is not limited by the equipment, and there is no need to make a very high retaining wall to accommodate the mixed liquid containing quantum dots. Furthermore, unused quantum dots (color conversion package) can be recycled. Since the color conversion package is closely arranged due to adhesion to the packaging material layer, the light / color conversion efficiency will be greatly improved compared to the traditional quantum dots that are loosely distributed in the mixed liquid.

[0080] The features of several embodiments are summarized above so that technicians in the technical field to which the present disclosure belongs can better understand the viewpoints of the embodiments of the present disclosure. It should be understood by technicians in the technical field to which the present disclosure belongs that they can design or modify other processes and structures based on the embodiments of the present disclosure to achieve the same purposes and / or advantages as the embodiments introduced herein. It should also be understood by technicians in the technical field to which the present disclosure belongs that such equivalent structures do not deviate from the spirit and scope of the present disclosure, and they can make various changes, substitutions and replacements without violating the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be defined by the attached claims. In addition, although the present disclosure has been disclosed as above with several embodiments, it is not intended to limit the present disclosure.

[0081] References throughout this specification to features, advantages, or similar language do not imply that all features and advantages that may be realized using the present disclosure should or may be realized in any single embodiment of the present disclosure. Conversely, language referring to features and advantages is understood to mean that a particular feature, advantage, or characteristic described in conjunction with an embodiment is included in at least one embodiment of the present disclosure. Thus, discussions of features and advantages and similar language throughout this specification may, but do not necessarily, represent the same embodiment.

[0082] Furthermore, in one or more embodiments, the features, advantages, and characteristics described in the present disclosure may be combined in any suitable manner. Based on the description herein, those skilled in the relevant art will appreciate that the present disclosure may be implemented without one or more specific features or advantages of a particular embodiment. In other cases, other features and advantages may be identified in certain embodiments, which may not be present in all embodiments of the present disclosure.

Claims

1. A display panel, comprising: A carrier having a patterned area, wherein the patterned area is located on a surface of the carrier and corresponds to a plurality of sub-pixel structures; a packaging material layer disposed on a portion of the patterned area; as well as A first color conversion layer, disposed on the portion of the packaging material layer and comprising a plurality of first color conversion packages, wherein the plurality of first color conversion packages are configured to convert the emission colors of the plurality of sub-pixel structures into a first emission color; Partial surfaces of a plurality of the plurality of first color conversion packages are exposed from the packaging material layer.

2. The display panel according to claim 1, wherein the encapsulation material layer is also disposed on another portion of the patterned area, and the display panel further comprises: A second color conversion layer, disposed on the packaging material layer of the other portion and comprising a plurality of second color conversion packaging bodies, wherein the plurality of second color conversion packaging bodies are configured to convert the emission colors of the plurality of sub-pixel structures into a second emission color; Partial surfaces of a plurality of the plurality of second color conversion packages are exposed from the packaging material layer. 3 . The display panel according to claim 2 , wherein the first luminescent color is different from the second luminescent color, and a volume of each of the second color conversion packages is greater than a volume of each of the first color conversion packages.

4. A display panel according to claim 1, wherein the plurality of first color conversion packages are stacked on the packaging material layer, the first color conversion layer has a first side connected to the packaging material layer and a second side away from the packaging material layer, and a plurality of the plurality of first color conversion packages having partial surfaces exposed from the packaging material layer are located on the second side. 5 . The display panel according to claim 1 , wherein the packaging material layer comprises a cured viscous photoresist material, and the plurality of first color conversion packages are adhered and fixed to a side of the packaging material layer away from the carrier.

6. The display panel of claim 5, wherein the plurality of first color conversion packages are closely adjacent to each other.

7. The display panel according to claim 1, further comprising: The light absorption layer is disposed on the carrier and surrounds the patterned area, wherein the light absorption layer separates the plurality of sub-pixel structures on the surface of the carrier. 8 . The display panel according to claim 7 , wherein in a thickness direction of the carrier board, a height of the first color conversion layer is less than or equal to a height of the light absorption layer.

9. The display panel of claim 1, wherein the plurality of first color conversion encapsulants comprise polystyrene, vinyl polymer, acrylic resin, silicone resin, carbonate, a mixture thereof or a copolymer thereof.

10. A method for manufacturing a display panel, comprising: Providing a carrier, wherein the carrier has a patterned area, the patterned area is located on a surface of the carrier and corresponds to a plurality of sub-pixel structures; forming a viscous packaging material layer on a portion of the patterned area; Providing a plurality of first color conversion packages on the surface of the carrier, wherein the plurality of first color conversion packages are configured to convert the emission colors of the plurality of sub-pixel structures into a first emission color; as well as Adhere a plurality of the plurality of first color conversion packages onto the portion of the packaging material layer, wherein a portion of the surface of the plurality of first color conversion packages adhered onto the packaging material layer is exposed from the packaging material layer.

11. The method for manufacturing a display panel according to claim 10, further comprising: removing the plurality of first color conversion packages that are not adhered to the packaging material layer from the carrier; forming the encapsulation material layer over another portion of the patterned area; Providing a plurality of second color conversion packages on the surface of the carrier, wherein the plurality of second color conversion packages are configured to convert the emission colors of the plurality of sub-pixel structures into a second emission color; and Adhere a plurality of the plurality of second color conversion packages onto the packaging material layer of the other portion, wherein partial surfaces of the plurality of second color conversion packages adhered onto the packaging material layer are exposed from the packaging material layer. 12 . The method for manufacturing a display panel according to claim 11 , wherein the first luminescent color is different from the second luminescent color, and a volume of each of the second color conversion packages is greater than a volume of each of the first color conversion packages.

13. The method for manufacturing a display panel according to claim 11, wherein before forming the encapsulation material layer on the other part of the patterned area, the method further comprises: The encapsulation material layer on the portion of the patterned area is cured so that the encapsulation material layer on the portion of the patterned area is not sticky after curing.

14. The manufacturing method of a display panel according to claim 10, wherein the plurality of first color conversion packages are stacked on the packaging material layer to form a first color conversion layer, the first color conversion layer has a first side connected to the packaging material layer and a second side away from the packaging material layer, and a plurality of the plurality of first color conversion packages with partial surfaces exposed from the packaging material layer are located on the second side. 15 . The method for manufacturing a display panel according to claim 10 , wherein the plurality of first color conversion packages are adhered and fixed to a side of the packaging material layer away from the carrier.

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