Electronic device and heat pipe direct contact type heat dissipation module thereof

Abstract

The invention provides an electronic device and a heat pipe direct contact type heat dissipation module thereof, the electronic device comprises a device body and a heat pipe direct contact type heat dissipation module, and the heat pipe direct contact type heat dissipation module is arranged in the device body. The heat pipe direct contact type heat dissipation module comprises at least one heat dissipation plate and at least two heat pipes. The radiating plate is provided with two side plates and at least one bridge connected between the two side plates, and the two side plates and the at least one bridge jointly define an opening; each heat pipe is provided with a front face and a back face which are opposite to each other, the at least two heat pipes are arranged on the at least one bridge side by side between the two side plates of the heat dissipation plate, any two adjacent heat pipes are respectively provided with right-angle adjacent edges which are seamlessly adjacent to each other, and the front faces of the at least two heat pipes jointly form a seamless contact face. The seamless contact surfaces of the at least two heat pipes directly contact the electronic heating element through the opening. Therefore, the effect of improving the heat dissipation efficiency on the premise of avoiding the use of a uniform temperature plate can be achieved.

Description

Technical Field

[0001] The present application relates to a heat dissipation module, and more particularly to an electronic device and a heat pipe direct contact heat dissipation module thereof. Background Art

[0002] With regard to heat dissipation of electronic heating elements in electronic devices, as the performance requirements are getting higher and higher (such as electronic devices used in e-sports, etc.), the heat generated by the electronic heating elements is also getting higher and higher, and the existing heat dissipation modules are no longer able to bear the load.

[0003] For example, although the heat dissipation efficiency can be improved by placing two heat pipes side by side in principle, after the two heat pipes are placed side by side, a groove will inevitably be formed between the two heat pipes because they are adjacent to each other with rounded edges, which will cause gaps to appear between the two heat pipes and the electronic heating element, thereby poor heat dissipation efficiency.

[0004] Furthermore, the heat dissipation module in the prior art uses a large temperature averaging plate to improve the heat dissipation efficiency, but the use of the temperature averaging plate requires at least three heat dissipation fin groups and fans, which makes the structure too complicated and difficult to manufacture. Therefore, how to overcome the above shortcomings of the prior art is a major issue that this application is eager to solve. Summary of the invention

[0005] The purpose of the present application is to provide an electronic device and a heat pipe direct contact heat dissipation module thereof, wherein at least two heat pipes arranged side by side can jointly form a seamless contact surface and directly contact the electronic heating element through the seamless contact surface, thereby improving the heat dissipation efficiency.

[0006] In order to achieve the above-mentioned purpose, the present application provides a heat pipe direct-contact heat dissipation module, which is used to provide heat dissipation for an electronic heating element and includes: at least one heat dissipation plate, the heat dissipation plate having two side plates and at least one bridge bridging the two side plates, the two side plates and the at least one bridge jointly defining an opening; and at least two heat pipes, each of the heat pipes having a front face and a back face opposite to each other, the at least two heat pipes being arranged side by side on the at least one bridge between the two side plates of the heat dissipation plate, any two adjacent heat pipes respectively having right-angle adjacent edges seamlessly adjacent to each other, the front faces of the at least two heat pipes jointly forming a seamless contact surface, and the at least two heat pipes directly contact the electronic heating element via the opening with the seamless contact surface.

[0007] The present application further provides an electronic device, comprising: a device body having a heat dissipation airflow therein; and a heat pipe direct-contact heat dissipation module as described above, which is disposed in the device body, the heat dissipation plate having a first surface and a second surface opposite to each other, the at least one bridge of the heat dissipation plate protruding from the first surface, the back surfaces of the at least two heat pipes being exposed on the second surface, and the heat dissipation airflow blowing on the back surfaces of the at least two heat pipes.

[0008] Compared with the prior art, this application has the following effects:

[0009] By allowing the front of the heat pipe to directly contact the electronic heating element, the heat of the electronic heating element can be directly transferred to the heat pipe; and the two bridges of the heat sink are both protruding toward the direction of the electronic heating element, so that the back of the heat pipe can be completely clear and conducive to direct blowing of external air, thereby improving the heat dissipation efficiency without using a temperature plate.

[0010] In order to further understand the technologies, means and effects adopted by the present application to achieve the intended purpose, please refer to the following detailed description and drawings of the present application. It is believed that the purpose, characteristics and features of the present application can be deeply and specifically understood thereby. However, the drawings are only provided for reference and illustration and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a three-dimensional exploded view of the first embodiment of the heat dissipation module of the present application;

[0012] Figure 2 This is a three-dimensional assembly diagram of the first embodiment of the heat dissipation module of the present application;

[0013] Figure 3 This is a top view schematic diagram of the first embodiment of the heat dissipation module of the present application;

[0014] Figure 4 This is a cross-sectional schematic diagram of Embodiment 1 of the heat dissipation module of the present application;

[0015] Figure 5 It is a partial cross-sectional schematic diagram of the first embodiment of the heat dissipation module of the present application;

[0016] Figure 6 This is a three-dimensional exploded view of the second embodiment of the heat dissipation module of the present application;

[0017] Figure 7 This is a three-dimensional assembly diagram of the second embodiment of the heat dissipation module of the present application;

[0018] Figure 8 This is a side view schematic diagram of two heat pipes in the second embodiment of the heat dissipation module of the present application (I);

[0019] Fig. 9 This is a side view schematic diagram of two heat pipes in the second embodiment of the heat dissipation module of the present application (II);

[0020] Fig.10 This is a side view schematic diagram of three heat pipes in the third embodiment of the heat dissipation module of the present application (I);

[0021] Fig.11This is a side view schematic diagram of three heat pipes in the third embodiment of the heat dissipation module of the present application (II);

[0022] Wherein, the reference numerals are:

[0023] 100: Cooling module

[0024] 1,1a,1b: heat sink

[0025] 11: Side panels

[0026] 12: Building bridges

[0027] 13: Opening

[0028] 17: Side 1

[0029] 18: Side 2

[0030] 2: Heat pipe

[0031] 21: Front

[0032] 22: Back

[0033] 23:End

[0034] 24: Right-angle adjacent edges

[0035] 25: Right angle outside

[0036] 26: Rounded outer edge

[0037] 3: Forced cooling components

[0038] 31: Frame

[0039] 311,312: Extension

[0040] 313: Breach

[0041] 32: Fin Group

[0042] 33: Fan

[0043] 900: Circuit board

[0044] 9: Electronic heating element

[0045] F: Seamless contact surface. DETAILED DESCRIPTION

[0046] In this specification, many specific details are provided to provide a thorough understanding of the specific embodiments of the present application; however, those skilled in the art should know that the present application can still be practiced without one or more of these specific details; in other cases, well-known details are not shown or described to avoid obscuring the main technical features of the present application. The technical content and detailed description of the present application are described as follows with the help of the drawings:

[0047] The present application provides an electronic device and a heat pipe direct contact heat dissipation module thereof. The electronic device (not shown in the figure, for example, a notebook computer or a tablet computer) comprises: a device body (not shown in the figure) and a heat pipe direct contact heat dissipation module (hereinafter referred to as heat dissipation module) 100. A circuit board 900 (see FIG. 1 ) is disposed in the device body. Figure 4 As shown) and at least one electronic heating element 9 (see Figure 4 The heat dissipation module 100 is disposed in the device body and contacts the electronic heating element 9 to dissipate heat for the electronic heating element 9.

[0048] like Figures 1 to 5 As shown, the first embodiment of the heat dissipation module 100 of the present application includes: a heat dissipation plate 1 and a heat pipe 2 , and in one embodiment, further includes at least one forced heat dissipation component 3 .

[0049] The heat sink 1 is a thin plate or a sheet with a thickness ranging from 0.5 mm to 4.0 mm. The heat sink 1 has two side plates 11 and at least one bridge 12. The present application does not limit the number of bridges 12. In this embodiment, two bridges 12 are used as an example for explanation. The two bridges 12 are bridged between the two side plates 11 at intervals to enclose an opening 13 between the two side plates 11 and the two bridges 12.

[0050] In one embodiment, the heat sink 1 has a first surface 17 and a second surface 18 opposite to each other. The two bridges 12 can be Figure 4 and Figure 5 And with Figure 1 As shown, both are protruding from the first surface 17 ; relatively speaking, both bridges 12 are recessed relative to the second surface 18 of the heat sink 1 . In other words, the second surface 18 of the heat sink 1 forms a recessed channel (not labeled) between the two side plates 11 .

[0051] The heat pipe 2 has a front face 21 and a back face 22 which are opposite to each other and are both planar. The heat pipe 2 is embedded in the heat sink 1 corresponding to the aforementioned concave channel, so that the heat pipe 2 is positioned between the two side plates 11 and on the two bridges 12 .

[0052] like Figure 2 and Figures 4 to 5As shown, after the heat pipe 2 is embedded and fixed, its front side 21 is exposed on the first side 17 of the heat sink 1 through the opening 13 , and its back side 22 is also exposed on the second side 18 of the heat sink 1 through the opening 13 .

[0053] By this, Figures 1 to 5 As shown, when the heat dissipation module 100 of the present application is arranged in the interspersed body of the aforementioned electronic device, the heat dissipation module 100 is located on the circuit board 900, so that the front 21 of the heat pipe 2 can directly contact (can be referred to as direct contact) the electronic heating element 9 through the opening 13, so that the heat generated by the electronic heating element 9 can be directly transferred to the heat pipe 2, so that the heat dissipation efficiency can be improved without using a temperature plate. In one embodiment, since the two bridges 12 of the heat dissipation plate 1 are both protruding from its first surface 17, that is, they are both protruding in the direction of the electronic heating element 9, the back 22 of the heat pipe 2 will be completely clear without any obstacles. In this way, if cold air can be further blown to the back 22 of the heat pipe 2, the heat dissipation efficiency can be further improved. To this end, a heat dissipation airflow can be generated in any feasible way in the body of the aforementioned device (for example, generated by a system heat dissipation fan), so that the heat dissipation airflow can be directly blown on the back 22 of the heat pipe 2 that is already in a clear state without any obstacles, so that the heat dissipation efficiency can be further improved.

[0054] like Figures 6 to 9 The second embodiment of the heat dissipation module 100 of the present application is shown. Figure 10 to Figure 11 The third embodiment of the heat dissipation module 100 of the present application is shown. The second and third embodiments are substantially the same as the first embodiment, and the difference only lies in the number of heat pipes 2 and the number of heat dissipation plates 1 .

[0055] In the second embodiment, the number of heat pipes 2 can be at least two. In this embodiment, two heat pipes 2 are arranged side by side (with the long sides of the heat pipes 2 arranged side by side) as an example for description. Figure 8As shown in the side view from any end 23 of the heat pipe 2, any two adjacent heat pipes 2 are adjacent to each other at right angles 24, so that the adjacent parts between any two adjacent heat pipes 2 form seamless adjacencies, that is, seamless side by side. The right angle adjacent edges 24 refer to the upper corners and lower corners of any long side of the heat pipe 2 being right angles. In this way, the front sides 21 (the back sides 22 as well) of the two heat pipes 2 can form a seamless contact surface F for directly contacting the electronic heating element 9, so that the two heat pipes 2 can be seamlessly attached to the electronic heating element 9 with the seamless contact surface F (because if the two heat pipes 2 are not arranged side by side with the right-angle adjacent edges 24 but with the rounded edges, a groove will be formed between the rounded edges of the two heat pipes 2, thereby causing a gap to appear between the two heat pipes 2 and the electronic heating element 9), thereby further improving the heat dissipation efficiency without using a temperature equalizer, and the heat dissipation efficiency of the present application can be better than the heat dissipation efficiency of using a temperature equalizer.

[0056] As for the relative outer sides of the two heat pipes 2, they can be as follows Figure 8 The right angle outer edge 25 shown, or it can also be as shown Fig. 9 The rounded outer edge 26 is shown, but the present application is not limited thereto.

[0057] like Fig.10 and Fig.11 The third embodiment shown is respectively a state where three heat pipes 2 with right-angled outer edges 25 are arranged side by side and a state where three heat pipes 2 with rounded outer edges 26 are arranged side by side. Fig.10 or Fig.11 Any two adjacent heat pipes 2 are still adjacent to each other by two right-angle adjacent edges 24 to form a seamless side-by-side state, and two right-angle outer edges 25 or two rounded outer edges 26 are respectively formed on the opposite outer edges of the two outermost heat pipes 2.

[0058] Still Figure 6 and Figure 7 As shown, the heat dissipation module 100 of the second embodiment and the third embodiment of the present application may further include two heat dissipation plates 1a and 1b.

[0059] The structures of the two heat sinks 1a and 1b are the same as the aforementioned heat sink 1, and the only difference is that the shape is adapted to the curved shape of the heat pipe 2. The two heat pipes 2 arranged side by side are embedded in the two heat sinks 1a and 1b corresponding to the aforementioned concave channels, so that the two heat pipes 2 are positioned between the two side plates 11 of each heat sink 1a and 1b and on the two bridges 12.

[0060] In this way, two heat sinks 1a and 1b can be provided to directly contact two electronic heating elements 9, such as a CPU (central processing unit) and a GPU (graphics processing unit), respectively, but the present application does not limit this.

[0061] like Figure 6 , Figure 7 And with Figure 1 , Figure 2 and Figure 4 As shown, the heat dissipation module 100 of the present application may further include at least one forced heat dissipation component 3. The present application does not limit the number of forced heat dissipation components 3. In this embodiment, two forced heat dissipation components 3 are taken as an example for description.

[0062] The forced heat dissipation component 3 includes a frame 31, a fin group 32 and a fan 33. The fin group 32 is fixed on the frame 31, and the fan 33 is fixed on the frame 31 and forcedly supplies air to the fin group 32. Each heat pipe 2 has two ends 23 opposite to each other, one of the ends 23 of the two heat pipes 2 is commonly attached to the fin group 32 of one of the forced heat dissipation components 3, and the other end 23 of the two heat pipes 2 is commonly attached to the fin group 32 of the other forced heat dissipation component 3. In this way, the heat dissipation efficiency can be further improved.

[0063] Among them, Figure 1 As shown, the frame 31 also has at least one extension portion and a break 313. The present application does not limit the number of extension portions. In this embodiment, two extension portions 311 and 312 are used as an example for explanation. One end portion 23 of the two heat pipes is simultaneously fixed on the two extension portions 311 and 312 of one of the forced heat dissipation components 3, and the other end portion 23 of the two heat pipes is simultaneously fixed on the two extension portions 311 and 312 of the other forced heat dissipation component 3. Each fan 33 is arranged corresponding to the break 313 of each frame 31. It should be noted that, as Figure 2 and Figure 4 As shown, the frame 31 has a frame surface (no element symbol is marked), the frame surface of the frame 31 and the first surface 17 of the heat sink 1 face the same direction, and each fan 33 is fixed to the frame surface of each frame 31 and blows each fin group 32 sideways, so that the back side 22 of the entire heat pipe 2 is in a clear state.

[0064] However, the above is only a preferred embodiment of the present application, and should not limit the scope of implementation of the present application, that is, all equivalent changes and modifications made according to the present application should still fall within the scope of the patent coverage of the present application. The present application may also have other embodiments, and those skilled in the art may make various corresponding changes and deformations according to the present application without departing from the spirit and essence of the present application, but these corresponding changes and deformations should fall within the scope of protection of the claims attached to the present application.

Claims

1. A heat pipe direct contact heat dissipation module, used to provide heat dissipation for electronic heating elements, characterized in that: And include: At least one heat dissipation plate, the heat dissipation plate having two side plates and at least one bridge bridging between the two side plates, the two side plates and the at least one bridge jointly defining an opening; as well as At least two heat pipes, each of which has a front side and a back side facing each other, and the at least two heat pipes are arranged side by side on the at least one bridge between the two side plates of the heat dissipation plate, and any two adjacent heat pipes respectively have right-angle adjacent edges that are seamlessly adjacent to each other, and the front sides of the at least two heat pipes jointly form a seamless contact surface, and the at least two heat pipes directly contact the electronic heating element through the opening with the seamless contact surface.

2. The heat pipe direct contact heat dissipation module according to claim 1, characterized in that: The heat dissipation plate is a thin plate.

3. The heat pipe direct contact heat dissipation module according to claim 1, characterized in that: The heat sink is provided with two bridges, the two bridges are bridged between the two side plates at intervals, the two side plates and the two bridges jointly enclose the opening, and the at least two heat pipes are provided on the two bridges between the two side plates of the heat sink.

4. The heat pipe direct contact heat dissipation module according to claim 1, characterized in that: It also includes a forced heat dissipation component, each heat pipe has an end, and the ends of at least two heat pipes are jointly arranged on the forced heat dissipation component; the forced heat dissipation component includes a frame, a fin group and a fan, the fin group is arranged on the frame, the ends of at least two heat pipes are jointly arranged on the fin group, and the fan is arranged on the frame and forces air to be supplied to the fin group.

5. The heat pipe direct contact heat dissipation module according to claim 1, characterized in that: It also includes two forced heat dissipation components, each heat pipe has two ends opposite to each other, one of the ends of the at least two heat pipes is jointly arranged in one of the forced heat dissipation components, and the other end of the at least two heat pipes is jointly arranged in the other of the forced heat dissipation components.

6. The heat pipe direct contact heat dissipation module according to claim 5, characterized in that: Each of the forced heat dissipation components includes a frame, a fin group and a fan. The fin group of each of the forced heat dissipation components is arranged on the frame, one of the ends of the at least two heat pipes is commonly arranged on one of the fin groups, and the other of the ends of the at least two heat pipes is commonly arranged on the other of the fin groups. Each of the fans is arranged on each of the frames and forces air to be supplied to each of the fin groups.

7. The heat pipe direct contact heat dissipation module according to claim 1, characterized in that: The heat dissipation plates are provided in pairs, and the at least two heat pipes are provided on the at least one bridge of each heat dissipation plate. The at least two heat pipes are exposed through the opening of each heat dissipation plate with the seamless contact surface, and the back surfaces of the at least two heat pipes are exposed in the same direction.

8. The heat pipe direct contact heat dissipation module according to claim 1, characterized in that: The heat dissipation plate has a first surface and a second surface opposite to each other, the at least one bridge protrudes from the first surface, and the back surfaces of the at least two heat pipes are exposed on the second surface.

9. The heat pipe direct contact heat dissipation module according to claim 8, characterized in that: The number of the bridges is two, and the two bridges are spaced apart from each other and bridged between the two side plates of the heat sink. The two side plates of the heat sink and the two bridges together enclose the opening. The at least two heat pipes are arranged on the two bridges between the two side plates of the heat sink, and the two bridges both protrude from the first surface.

10. An electronic device, characterized in that: include: a device body having a heat dissipation airflow therein; as well as A heat pipe direct contact heat dissipation module as described in any one of claims 1 to 7, arranged in the device body, the heat dissipation plate has a first surface and a second surface opposite to each other, the at least one bridge of the heat dissipation plate protrudes from the first surface, the back surface of the at least two heat pipes is exposed on the second surface, and the heat dissipation airflow is blown on the back surface of the at least two heat pipes.

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