Airborne air cooling heat dissipation module structure based on ASAAC standard

Abstract

The invention relates to the technical field of airborne air cooling equipment, and discloses an airborne air cooling heat dissipation module structure based on the ASAAC standard, which comprises an efficient air cooling heat dissipation module structure, the efficient air cooling heat dissipation module structure comprises a frame assembly, a cover plate assembly and a carrier plate, the cover plate assembly is connected with the frame assembly, a structural assembly and a cold plate assembly are arranged on the side, close to the cold plate assembly, of the frame assembly, the structural assembly is connected with the ore body assembly, and the cold plate assembly is connected with the ore body assembly. The cold plate assembly is arranged on the side, away from the frame assembly, of the structural assembly, the cold plate assembly is connected with the structural assembly, a conductive sealing strip is connected into the cold plate assembly, and a plurality of copper metal heat pipes are arranged between the conductive sealing strip and the cold plate assembly. The side, close to the frame body assembly, of the cover plate assembly is provided with a loose heat dissipation fin structure, and the side, away from the cover plate structure, of the loose heat dissipation fin structure is connected with the carrier plate.

Description

Technical Field

[0001] The present invention relates to the technical field of airborne air cooling equipment, and more specifically, to an airborne air cooling heat dissipation module structure based on the ASAAC standard. Background Art

[0002] The aircraft's core processing subsystem is an important subsystem in the aircraft's mission system. As the center of information transmission, processing and management of the mission system, it needs to realize general data processing, intelligent processing, signal processing, network exchange and other functions. The entire system is physically based on the interconnection of ASAAC standard modules, so higher requirements are placed on the software and hardware resources of each module, which means higher heat dissipation requirements. The power consumption of a single chip is up to 62W. If the heat source area of ​​the chip is analyzed separately from the shell area, the power density of the chip heat source will be as high as 5W / cm2 or more. In fact, in order to maximize the reliability and service life of electronic equipment, it is generally necessary to control the chip junction temperature below 100°C to meet the requirements of Class II derating design.

[0003] In the prior art, the ASAAC standard defines the dimensions and installation methods of avionics equipment modules. In traditional ASAAC air-cooled modules, the total power consumption of the module is often no more than 100W, and the maximum power consumption of a single chip is controlled within 30W. The reasonable selection of fans, thermal interface materials, structural heat dissipation bosses, and machined fins are sufficient to meet the heat dissipation requirements of the module. However, this type of conventional heat dissipation structure is inadequate for modules with a total power consumption of more than 160W and a maximum power consumption of 62W per chip, and cannot efficiently and timely dissipate the heat of the device into the air-cooled airflow. Summary of the invention

[0004] In order to overcome the deficiencies of the prior art, the present invention provides an airborne air-cooling heat dissipation module structure based on the ASAAC standard, which has the advantage of more precise operation.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an airborne air-cooled heat dissipation module structure based on the ASAAC standard, comprising: a high-efficiency air-cooled heat dissipation module structure; the high-efficiency air-cooled heat dissipation module structure comprises a frame assembly, a cover assembly and a carrier plate, the cover assembly is connected to the frame assembly, a structural assembly and a cold plate assembly are arranged on the side of the frame assembly close to the carrier plate assembly, the structural assembly is connected to the body assembly, the cold plate assembly is arranged on the side of the structural assembly away from the frame assembly, and the cold plate assembly is connected to the structural assembly, a conductive sealing strip is connected inside the cold plate assembly, and a plurality of copper metal heat pipes are arranged between the conductive sealing strip and the cold plate assembly; a loose heat dissipation fin structure is arranged on the side of the cover assembly close to the frame assembly, and the loose heat dissipation fin structure The side of the sheet structure away from the cover plate structure is connected to the carrier plate, and the first sub-card, the second sub-card and the third sub-card are connected between the carrier plate and the loose heat dissipation fin structure. A high-power consumption device is installed on the side of the carrier plate away from the loose heat dissipation fin structure, and thermal conductive silicone grease is arranged on the side of the high-power consumption device away from the carrier plate. A support plate structure is arranged on the side of the thermal conductive silicone grease away from the high-power consumption device, and both sides of the support plate structure are connected to the conductive sealing strip; an engraved panel structure is arranged between the structural component and the loose heat dissipation fin structure, and a high-density heat dissipation fin structure is arranged on the side of the structural component close to the engraved panel structure, and both sides of the engraved panel structure are respectively fitted with the loose heat dissipation fin structure and the high-density heat dissipation fin structure, and fixing brackets are installed on the first sub-card and the third sub-card.

[0006] As a preferred technical solution of the present invention, a flap is provided on one side of the frame assembly, and a latch is connected to the end of the flap away from the frame assembly. A connecting groove is provided on one side of the cover assembly, and the flap corresponds to the connecting groove; this facilitates people to disassemble and assemble the high-efficiency air-cooled heat dissipation module structure.

[0007] As a preferred technical solution of the present invention, a plurality of standard screws are provided on the high-efficiency air-cooled heat dissipation module structure, the standard screws are distributed on the side of the ore body assembly, and the standard screws fix the cold plate assembly; it is convenient to fix the cold plate assembly in the frame assembly.

[0008] As a preferred technical solution of the present invention, the surface of the copper metal heat pipe is nickel-plated, an aluminum alloy frame is arranged inside the cold plate assembly, the copper metal heat pipe is welded on the aluminum alloy frame, and the cross-section of the aluminum alloy frame is a "concave" shape.

[0009] As a preferred technical solution of the present invention, a plurality of grooves are provided on the support plate structure, and the conductive sealing strips are adhered in the grooves on the support plate structure by conductive glue.

[0010] As a preferred technical solution of the present invention, the second daughter card and the third daughter card are fixed on a fixed bracket through an inter-board connector, the fixed bracket is fixed to the carrier board, and the gaps between the components on the first daughter card, the second daughter card and the third daughter card and the cover assembly are filled with a thermal pad, and the thickness of the thermal pad is 0.9 to 1 mm.

[0011] As a preferred technical solution of the present invention, the gap between the high power consumption device and the cold plate assembly is filled with the thermal conductive silicone grease, and the filling gap of the thermal conductive silicone grease is 0.1 mm.

[0012] As a preferred technical solution of the present invention, the thickness of the support plate structure is 1-1.2 mm, the thickness of the loose heat dissipation fin structure and the high-density heat dissipation fin structure is 2.5-3 mm, and the thickness of the copper metal heat pipe is 2 mm.

[0013] As a preferred technical solution of the present invention, the high power consumption device is a rectangle with a side length of 40 mm, and a heat source is arranged at the center of the high power consumption device, wherein the power consumption of the heat source is 62W.

[0014] As a preferred technical solution of the present invention, the thermal conductivity of the thermal pad is 12W / (m·K), the thermal resistance of the thermal grease is 0.5K·cm2 / W, and the thermal conductivity of the copper metal heat pipe is not less than 1500W / (m·K).

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: by optimizing the heat dissipation module, arranging multiple daughter cards, and arranging inter-board connectors and fixing brackets between the daughter cards, the daughter cards can be stabilized inside the heat dissipation module structure, and the loose heat dissipation fin structure and the high-density heat dissipation fin structure cooperate with each other, so that the heat can be dissipated and discharged in time. Thermal simulation analysis and calculation are performed according to actual data, and the heat dissipation effect of the left and right air ducts of the air duct is improved, so that the surface shell temperature of the components does not exceed 95°C, and the heat dissipation performance of high-power consumption and high-heat flux density module products that the traditional ASAAC module structure does not have is met. In addition, a unique debugging flip cover design, light guide structure design and daughter card fixing design are adopted to ensure the disassembly and maintenance of the module product. It is a new air-cooled heat dissipation structure type based on the ASAAC standard module, and has great application prospects in the new generation of airborne core processing subsystems. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is an isometric view of the present invention;

[0017] Figure 2 It is a structural schematic diagram of the present invention;

[0018] Figure 3 It is a structural schematic diagram of the frame assembly of the present invention;

[0019] Figure 4 It is a schematic diagram of the principle of the heat dissipation solution of the present invention.

[0020] In the figure: 1. High-efficiency air-cooled heat dissipation module structure; 2. Frame assembly; 3. Cover assembly; 4. Carrier board; 5. First daughter card; 6. Second daughter card; 7. Third daughter card; 8. Standard screws; 9. Structural assembly; 10. Cold plate assembly; 11. Loose heat dissipation fin structure; 12. Thermal pad; 13. Fixed bracket; 14. Engraved panel structure; 15. Support plate structure; 16. High-power consumption device; 17. Thermal grease; 18. High-density heat dissipation fin structure; 19. Copper metal heat pipe; 20. Conductive sealing strip. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] like Figures 1 to 4As shown, the present invention provides an airborne air-cooled heat dissipation module structure based on the ASAAC standard, including: an efficient air-cooled heat dissipation module structure 1; the efficient air-cooled heat dissipation module structure 1 includes a frame assembly 2, a cover assembly 3 and a carrier plate 4, the cover assembly 3 is connected to the frame assembly 2, and the frame assembly 2 is provided with a structural assembly 9 and a cold plate assembly 10 on the side close to the carrier assembly, the structural assembly 9 is connected to the body assembly, the cold plate assembly 10 is arranged on the side of the structural assembly 9 away from the frame assembly 2, and the cold plate assembly 10 is connected to the structural assembly 9, a conductive sealing strip 20 is connected inside the cold plate assembly 10, and a plurality of copper metal heat pipes 19 are arranged between the conductive sealing strip 20 and the cold plate assembly 10; a loose heat dissipation fin structure 11 is provided on the side of the cover assembly 3 close to the frame assembly 2, and the loose heat dissipation fin structure 11 is away from the cover structure One side is connected to the carrier board 4, and the first daughter card 5, the second daughter card 6 and the third daughter card 7 are connected between the carrier board 4 and the loose heat dissipation fin structure 11; a high power consumption device 16 is installed on the side of the carrier board 4 away from the loose heat dissipation fin structure 11; a thermal conductive silicone grease 17 is arranged on the side of the high power consumption device 16 away from the carrier board 4; a support plate structure 15 is arranged on the side of the thermal conductive silicone grease 17 away from the high power consumption device 16, and both sides of the support plate structure 15 are connected to the conductive sealing strip 20; an engraved panel structure 14 is arranged between the structural component 9 and the loose heat dissipation fin structure 11, and a high-density heat dissipation fin structure 18 is arranged on the side of the structural component 9 close to the engraved panel structure 14, and both sides of the engraved panel structure 14 are respectively fitted with the loose heat dissipation fin structure 11 and the high-density heat dissipation fin structure 18, and a fixing bracket 13 is installed on the first daughter card 5 and the third daughter card 7.

[0023] Among them, a flip cover is provided on one side of the frame assembly 2, and a latch is connected to the end of the flip cover away from the frame assembly 2. A connecting groove is opened on one side of the cover assembly 3, and the flip cover corresponds to the connecting groove; it is convenient for people to disassemble and assemble the high-efficiency air-cooled heat dissipation module structure 1.

[0024] Among them, a number of standard screws 8 are arranged on the high-efficiency air-cooled heat dissipation module structure 1, and the standard screws 8 are distributed on the side of the ore body component, and the standard screws 8 fix the cold plate component 10; it is convenient to fix the cold plate component 10 in the frame component 2.

[0025] The surfaces of the copper metal heat pipes 19 are all nickel-plated, an aluminum alloy frame is provided inside the cold plate assembly 10, the copper metal heat pipes 19 are welded on the aluminum alloy frame, and the cross section of the aluminum alloy frame is a "concave" shape.

[0026] The support plate structure 15 is provided with a plurality of grooves, and the conductive sealing strips 20 are glued in the grooves on the support plate structure 15 by conductive glue.

[0027] Among them, the second daughter card 6 and the third daughter card 7 are fixed on the fixing bracket 13 through the inter-board connector, the fixing bracket 13 is fixed to the carrier board 4, and the gaps between the components on the first daughter card 5, the second daughter card 6 and the third daughter card 7 and the cover assembly 3 are filled with a thermal pad 12, and the thickness of the thermal pad 12 is 0.9 to 1 mm.

[0028] The gap between the high power consumption device 16 and the cold plate assembly 10 is filled with the thermal conductive silicone grease 17 , and the filling gap of the thermal conductive silicone grease 17 is 0.1 mm.

[0029] The thickness of the support plate structure 15 is 1-1.2 mm, the thickness of the loose heat dissipation fin structure 11 and the high-density heat dissipation fin structure 18 is 2.5-3 mm, and the thickness of the copper metal heat pipe 19 is 2 mm.

[0030] The high power consumption device 16 is a rectangle with a side length of 40 mm. A heat source is arranged at the center of the high power consumption device 16 , wherein the power consumption of the heat source is 62W.

[0031] Among them, the thermal conductivity of the thermal pad 12 is 12W / (m·K), the thermal resistance of the thermal grease 17 is 0.5K·cm2 / W, and the thermal conductivity of the copper metal heat pipe 19 is not less than 1500W / (m·K).

[0032] The working principle and use process of the present invention are as follows: the gaps between the components and the cover plate assembly 3 on the first daughter card 5, the second daughter card 6 and the third daughter card 7 are filled with a thermal pad 12 with a reference thickness of 1mm, and the gap is controlled to be 0.7mm; the gaps between the high-power consumption device 16 on the carrier board 4 and the cold plate assembly 10 are filled with thermal grease 17, and the gap is controlled to be 0.1mm. The structural wall thickness of the carrier board 4 on the aluminum alloy frame in the cold plate assembly 10 is 1.2mm, the thickness of the loose heat dissipation fin structure 11 and the high-density heat dissipation fin structure 18 are both 3mm, the thickness of the copper metal heat pipe 19 is 2mm, and the high-power consumption device 16 is set to a square with a side length of 40mm, and the heat source is a square with a side length of 15mm located in the center of the device, and the power consumption of the heat source is 62W; the thermal conductivity of the thermal pad 12 is 12W / (m·K), and the thermal resistance of the thermal grease 17 is 0.5K·cm2 / W, The equivalent thermal conductivity of the copper metal heat pipe 19 should be no less than 1500W / (m·K), and the aluminum alloy frame material is aluminum alloy 6063; the power consumption of other components and sub-card components on the carrier board 4 is about 100W in total, and then thermal simulation analysis and calculation are performed. During the simulation analysis, module models of the same structure are placed on the left and right sides of the module, the air duct gap between the modules is 1.5mm, the air volume of the left and right air ducts is 6m3 / s, and a 100W heat source surface is set in each module on both sides. The outside is a standard atmospheric pressure environment with an ambient temperature of 70℃. Finally, the simulation results show that the surface shell temperature of the components does not exceed 95℃, meeting the II-level derating requirements for the thermal design of airborne equipment.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An airborne air-cooling heat dissipation module structure based on the ASAAC standard, characterized in that: The invention comprises: a high-efficiency air-cooling heat dissipation module structure (1); the high-efficiency air-cooling heat dissipation module structure (1) comprises a frame assembly (2), a cover assembly (3) and a carrier plate (4); the cover assembly (3) is connected to the frame assembly (2); a structural assembly (9) and a cold plate assembly (10) are arranged on a side of the frame assembly (2) close to the plate assembly; the structural assembly (9) is connected to the ore body assembly; the cold plate assembly (10) is arranged on the side of the structural assembly (9) away from the frame assembly (2). The cold plate assembly (10) is connected to the structural assembly (9), a conductive sealing strip (20) is connected inside the cold plate assembly (10), and a plurality of copper metal heat pipes (19) are arranged between the conductive sealing strip (20) and the cold plate assembly (10); a loose heat dissipation fin structure (11) is arranged on a side of the cover plate assembly (3) close to the frame assembly (2), and a side of the loose heat dissipation fin structure (11) away from the cover plate structure is connected to the carrier plate (4), and the carrier plate (4) is connected to the cover plate assembly (3). The loose heat dissipation fin structure (11) is connected to a first daughter card (5), a second daughter card (6) and a third daughter card (7); a high power consumption device (16) is installed on a side of the carrier board (4) away from the loose heat dissipation fin structure (11); a thermal conductive silicone grease (17) is arranged on a side of the high power consumption device (16) away from the carrier board (4); a support plate structure (15) is arranged on a side of the thermal conductive silicone grease (17) away from the high power consumption device (16); both sides of the support plate structure (15) are in contact with the conductive silicone grease (17). An electric sealing strip (20); a lettering panel structure (14) is arranged between the structural component (9) and the loose heat dissipation fin structure (11); a high-density heat dissipation fin structure (18) is arranged on a side of the structural component (9) close to the lettering panel structure (14); two sides of the lettering panel structure (14) are respectively attached to the loose heat dissipation fin structure (11) and the high-density heat dissipation fin structure (18); and a fixing bracket (13) is installed on the first sub-card (5) and the third sub-card (7).

2. The airborne air-cooling heat dissipation module structure based on the ASAAC standard according to claim 1 is characterized in that: The high-efficiency air-cooling heat dissipation module structure (1) is provided with a plurality of standard screws (8), the standard screws (8) are distributed on the side of the ore body component, and the standard screws (8) fix the cold plate component (10).

3. The airborne air-cooling heat dissipation module structure based on the ASAAC standard according to claim 1 is characterized in that: The high-efficiency air-cooling heat dissipation module structure (1) is provided with a plurality of standard screws (8), the standard screws (8) are distributed on the side of the ore body component, and the standard screws (8) fix the cold plate component (10).

4. The airborne air-cooling heat dissipation module structure based on the ASAAC standard according to claim 1 is characterized in that: The surfaces of the copper metal heat pipes (19) are all nickel-plated, an aluminum alloy frame is provided inside the cold plate assembly (10), the copper metal heat pipes (19) are welded to the aluminum alloy frame, and the cross section of the aluminum alloy frame is in a "concave" shape.

5. The airborne air cooling module structure based on the ASAAC standard according to claim 1 is characterized in that: The support plate structure (15) is provided with a plurality of grooves, and the conductive sealing strip (20) is glued in the grooves on the support plate structure (15) by conductive glue.

6. The airborne air cooling module structure based on the ASAAC standard according to claim 1 is characterized in that: The second daughter card (6) and the third daughter card (7) are both fixed on a fixing bracket (13) via an inter-board connector, the fixing bracket (13) is fixed to the carrier board (4), and the gaps between the components on the first daughter card (5), the second daughter card (6) and the third daughter card (7) and the cover board assembly (3) are filled with a thermal pad (12), and the thickness of the thermal pad (12) is 0.9 to 1 mm.

7. The airborne air cooling module structure based on the ASAAC standard according to claim 1 is characterized in that: The gap between the high power consumption device (16) and the cold plate assembly (10) is filled with the thermal conductive silicone grease (17), and the filling gap of the thermal conductive silicone grease (17) is 0.1 mm.

8. The airborne air cooling module structure based on the ASAAC standard according to claim 1 is characterized in that: The thickness of the support plate structure (15) is 1 to 1.2 mm, the thickness of the loose heat dissipation fin structure (11) and the high-density heat dissipation fin structure (18) is 2.5 to 3 mm, and the thickness of the copper metal heat pipe (19) is 2 mm.

9. The airborne air cooling module structure based on the ASAAC standard according to claim 1 is characterized in that: The high power consumption device (16) is a rectangle with a side length of 40 mm, and a heat source is arranged at the center of the high power consumption device (16), wherein the power consumption of the heat source is 62 W.

10. The airborne air cooling module structure based on the ASAAC standard according to claim 1, characterized in that: The thermal conductivity of the thermal pad (12) is 12 W / (m·K), the thermal resistance of the thermal grease (17) is 0.5 K·cm2 / W, and the thermal conductivity of the copper metal heat pipe (19) is not less than 1500 W / (m·K).

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