Power device packaging method and equipment

Abstract

The invention discloses a power device packaging method and equipment. The power device packaging method comprises the following steps: providing a bearing film and a copper foil; wherein the bearing film and the copper foil are loaded in a roll form; the copper foil and the bearing film are compounded, the compounded copper foil is etched to form a copper sheet, and the copper sheet and the bearing film are collected to form a copper sheet material roll; wherein the copper sheet has a preset copper bridge plane shape; feeding the copper sheet material roll; and punching and bending the copper sheet to form a copper bridge, and attaching the copper bridge to the power device substrate to complete packaging of the power device. According to the technical scheme of the embodiment of the invention, the preparation cost of the copper bridge can be reduced, and the performance of the whole IGBT power device can be ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a power device packaging method and equipment. Background Art

[0002] Insulate-Gate Bipolar Transistor (IGBT) has the characteristics of large input impedance, low driving power, simple control circuit, small switching loss, fast speed and high operating frequency, making it one of the most promising power semiconductor devices.

[0003] With the continuous development of technologies in industries such as electric vehicles, high-speed rail, wind power generation, and energy storage, higher demands have been placed on the power and performance of IGBT modules. The traditional packaging process that uses metal wires for bonding connections can no longer meet the needs of high-power IGBT modules. The existing technology has proposed a strip bonding (Clip bond) process. The Clip bond process uses solid copper bridges instead of metal wires to achieve the connection between the chip and the pins. The IGBT module packaged using this process can withstand a large current. The copper bridges used in the Clip bond process, which is currently mature in the market, are all prepared using a die-cutting process, and die-cut copper foil affects the life of the die-cutting tool, resulting in an increase in the cost of copper bridge preparation. In addition, the copper bridges prepared by die-cutting generally have burrs, which affect the performance of IGBT power devices. Summary of the invention

[0004] The present invention provides a power device packaging method and equipment to solve the problem that the die-cutting process increases the copper bridge preparation cost and affects the performance of the IGBT power device.

[0005] According to one aspect of the present invention, there is provided a power device packaging method, comprising: Providing a carrier film and a copper foil; wherein the carrier film and the copper foil are both fed in a roll form; Compounding the copper foil with the carrier film, etching the compounded copper foil to form a copper sheet, and collecting the copper sheet and the carrier film to form a copper sheet roll; wherein the copper sheet has a preset copper bridge plane shape; Loading the copper sheet coil; The copper sheet is stamped and bent to form a copper bridge, and the copper bridge is bonded to a power device substrate to complete the power device packaging.

[0006] Optionally, compounding the copper foil and the carrier film comprises: Coating composite glue on the surface of the carrier film, and pre-curing the composite glue; Compounding the copper foil with the carrier film by means of the composite glue; The composite glue is cured again until the composite glue is completely cured and the copper foil is completely composited with the carrier film.

[0007] Optionally, etching the composite copper foil to form a copper sheet, and collecting the copper sheet and the carrier film to form a copper sheet roll, comprises: Coating a protective glue on the surface of the copper foil according to a specific pattern; wherein the specific pattern is the plane shape of the preset copper bridge; Immersing the copper foil in an etching solution to etch the position where the protective glue is not applied to form the copper sheet; The protective glue on the surface of the copper sheet is cleaned, and the copper sheet is collected in a roll to form the copper sheet material roll.

[0008] Optionally, the material of the carrier film includes polyethylene terephthalate.

[0009] Optionally, the preset copper bridge plane shape on the copper sheet roll includes a shape repeating unit, and the shape repeating unit includes a shape arrangement mode in which a single row or multiple rows are arranged in any combination with a single or multiple plane shapes.

[0010] Optionally, stamping and bending the copper sheet to form a copper bridge comprises: Debonding the composite glue to separate the copper sheet in the copper sheet roll from the carrier film; The copper sheet is positioned, and a stamping die is used to stamp and bend the preset copper bridge plane shape on the copper sheet to form the copper bridge.

[0011] Optionally, the debonding method of the composite glue includes UV debonding or thermal debonding.

[0012] Optionally, bonding the copper bridge to a power device substrate includes: Dispensing glue at a preset dispensing position on the power device substrate; The power device substrate after dispensing is transferred to the patch station and positioned; The copper bridge is sucked and moved to a corresponding patch position on the power device substrate, and the copper bridge is attached to the corresponding patch position to obtain a power device.

[0013] Optionally, after obtaining the power device, the method further includes: Performing quality inspection on the power device and generating quality inspection results; The power devices are classified according to the quality inspection results, and the power devices whose quality inspection results meet the requirements are cut.

[0014] According to another aspect of the present invention, there is provided a power device packaging device for executing the power device packaging method as described in any embodiment of the first aspect; The power device packaging equipment comprises: a base, a substrate feeding mechanism, a substrate conveying mechanism, a glue dispensing mechanism, at least one copper sheet feeding mechanism and at least one chip mounting mechanism; The substrate loading mechanism is located on the side of the base, and the substrate conveying mechanism, the glue dispensing mechanism, the copper sheet loading mechanism and the patch mechanism are all arranged above the base; The substrate feeding mechanism is arranged at one end of the substrate conveying mechanism; along the extension direction of the substrate conveying mechanism, the glue dispensing mechanism, the copper sheet feeding mechanism and the patch mechanism are arranged in sequence in a direction away from the substrate feeding mechanism; The substrate loading mechanism is used to load the power device substrate to the substrate conveying mechanism; the substrate conveying mechanism is used to convey the power device substrate to the corresponding work station; wherein the work station includes a glue dispensing station and a patch station; the glue dispensing mechanism is used to dispense glue at a preset glue dispensing position on the power device substrate; the copper sheet loading mechanism is used to load a copper sheet roll etched with a preset copper bridge plane shape; the patch mechanism is used to bond the copper bridge to the preset bonding position on the power device substrate to form a power device.

[0015] Optionally, the copper sheet roll comprises a copper sheet and a carrier film compounded by a composite glue, wherein the surface of the copper sheet is etched with the preset copper bridge plane shape; The copper sheet feeding mechanism comprises a feeding unit, a debonding unit, a punching unit, a demoulding unit and a receiving unit; The feeding unit is used to carry the copper sheet stock roll and rotate around the axis so as to feed the copper sheet stock roll to the degumming unit; the degumming unit is used to degumming the composite glue in the copper sheet stock roll; the stamping unit is provided with a stamping die, which is used to stamp the preset copper bridge plane shape on the copper sheet to form a copper bridge; the demoulding unit is used to separate the copper sheet from the carrying film before stamping; the receiving unit is used to receive the carrying film.

[0016] Optionally, the patch mechanism includes a first motion unit, a second motion unit, a third motion unit, a rotation unit, a patch camera, an upward-looking camera, and at least one suction nozzle and a patch head; Among them, the patch head moves along the first direction on the first moving unit, the patch head moves along the second direction in the second moving unit through the first moving unit, and the patch head moves along the third direction in the third moving unit through the first moving unit and the second moving unit, and the first direction, the second direction and the third direction are perpendicular to each other; the suction nozzle is set at the bottom of the patch head through the rotating unit, and is used to suck the copper bridge and stick it to the preset bonding position of the power device substrate; the patch camera is set on the side of the patch head, and is used to measure the error between the actual bonding position moved to by the suction nozzle and the preset bonding position; the upward-looking camera is set below the suction nozzle, and is used to measure the error between the position where the suction nozzle sucks the copper bridge and the center position of the copper bridge.

[0017] At least one of the copper sheet feeding mechanisms feeds the copper sheet stock rolls having the same preset copper bridge plane shape; Alternatively, at least one of the copper sheet feeding mechanisms feeds the copper sheet rolls having different kinds of the preset copper bridge plane shapes respectively.

[0018] Optionally, the power device packaging equipment includes at least two of the copper sheet feeding mechanisms and at least two of the patch mechanisms; The number of the copper sheet feeding mechanisms is equal to the number of the patch mechanisms, and each of the copper sheet feeding mechanisms is arranged in a one-to-one correspondence with each of the patch mechanisms.

[0019] Optionally, the movement range of the patch head along the first direction includes 0 to 80 mm, the movement range along the second direction includes 0 to 350 mm, and the movement range along the third direction includes 0 to 150 mm; The rotation angle range of the suction nozzle driven by the rotating unit includes 0 to 360 degrees.

[0020] Optionally, the dispensing mechanism includes a motion unit, a dispensing unit and a dispensing camera; The dispensing unit is arranged on the moving unit, and the moving unit carries the dispensing unit to move along the first direction, the second direction and / or the third direction; the dispensing camera is used to identify the preset dispensing position; the dispensing unit is used to dispense glue at the preset dispensing position on the power device substrate; The first direction, the second direction and the third direction are perpendicular to each other.

[0021] Optionally, the substrate loading mechanism comprises a robot and a carrying plate, and the power device substrate is placed in the carrying plate; The robot is used to grab the power device substrate in the carrier tray to the loading station, and grab the empty carrier tray to the unloading position of the substrate loading mechanism.

[0022] Optionally, the substrate conveying mechanism is provided with at least five working stations, and the working stations include a loading station, a glue dispensing station, a patch station and a unloading station; wherein the glue dispensing station includes at least one, and the patch station includes at least one; Each of the working stations works synchronously on the corresponding power device substrate.

[0023] Optionally, the power device packaging equipment further includes: a quality inspection mechanism and a material unloading mechanism; Along the extension direction of the substrate conveying mechanism, the quality inspection mechanism and the unloading mechanism are arranged on a side of the patch mechanism away from the substrate loading mechanism; The quality inspection mechanism is used to perform quality inspection on the power devices that have completed the patching; the unloading mechanism is used to classify and unload the power devices that have completed the quality inspection according to the quality inspection results.

[0024] The power device packaging method provided by the embodiment of the present invention is to compound the provided copper foil with the carrier film, etch a preset copper bridge plane shape on the surface of the compounded copper foil by an etching method, and collect the copper sheet and the carrier film in a roll form to form a copper sheet material roll. The copper sheet material roll obtained by etching is loaded in a roll form, and the preset copper bridge plane shape on the copper sheet is stamped and bent to form a copper bridge. The copper bridge is bonded to the corresponding bonding position of the power device substrate, thereby completing the packaging of the power device. Compared with the prior art that forms the copper bridge by die cutting and stamping, the embodiment of the present invention first forms the preset copper bridge plane shape by etching, and then forms the copper bridge according to the preset copper bridge plane shape by stamping, so that the edge of the formed copper bridge can be smooth and burr-free, which can effectively avoid the copper bridge applied to the IGBT power device from forming a tip discharge when the current is turned on, and ensure the performance of the entire IGBT power device. And the use of die cutting tools is omitted, thereby eliminating the damage of the die cutting tools, which is conducive to reducing the preparation cost of the copper bridge.

[0025] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 is a schematic flow chart of a power device packaging method provided according to an embodiment of the present invention; Figure 2 yes Figure 1 Specific flow diagram of step S120; Figure 3 yes Figure 1 Specific flow diagram of step S120; Figures 4 to 9 is a schematic diagram of a copper sheet roll having different preset copper bridge plane shapes provided according to an embodiment of the present invention; Fig.10 yes Figure 1 Specific flow diagram of step S140; Fig.11 yes Figure 1 Specific flow diagram of step S140; Fig.12 is a schematic structural diagram of a power device packaging device provided according to an embodiment of the present invention; Fig.13 is a schematic diagram of a specific structure of a copper sheet feeding mechanism provided according to an embodiment of the present invention; Fig.14 is a schematic diagram of a specific structure of a patch mechanism provided according to an embodiment of the present invention; Fig.15 It is a schematic diagram of the coordination structure of a copper sheet feeding mechanism and a patch mechanism provided according to an embodiment of the present invention; Fig.16 is a schematic diagram of a specific structure of a dispensing mechanism provided according to an embodiment of the present invention; Fig.17 is a schematic diagram of a specific structure of a substrate loading mechanism provided according to an embodiment of the present invention; Fig.18 is a schematic diagram of a specific structure of a substrate conveying mechanism provided according to an embodiment of the present invention; Fig.19 It is a specific structural schematic diagram of a quality inspection mechanism and a material unloading mechanism provided according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0029] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0030] As mentioned in the background technology, in the emerging industries such as rail transportation, aerospace, new energy, smart grid, and smart home appliances, IGBT, as a key core component of automatic control and power conversion, is an indispensable power "core". Using IGBT for power conversion can improve power efficiency, improve power quality, and achieve energy-saving effects, playing an irreplaceable role in the green economy.

[0031] IGBT is a three-terminal device with two electrodes on the front, namely the emitter and the gate, and the collector on the back. IGBT is essentially a switch. Its switching function is to form a channel by adding a positive gate voltage, provide base current to the PNP transistor, and turn on the IGBT; conversely, adding a reverse gate voltage eliminates the channel, and reverse base current flows, turning off the IGBT.

[0032] Traditional IGBTs are packaged by bonding, that is, two or more IGBT chips and other chips are mounted on the DBC board and connected by metal wire bonding, and then potted or plastic-sealed to meet the insulation, moisture-proof, and anti-interference requirements between chips and circuits. Finally, the circuit is sealed in an insulating shell and insulated from the heat dissipation base. In order to improve current conduction, multiple metal wires may be used at the same place.

[0033] With the continuous development of technologies in industries such as electric vehicles, high-speed rail, wind power generation, and energy storage, higher demands have been placed on the power and performance of IGBT modules. The traditional packaging process using metal wires for bonding connection can no longer meet the needs of high-power IGBT modules, which has led to the emergence of a new packaging process, namely the Clip bond process. The copper bridges used in the mature Clip bond process in the current market are all prepared by die-cutting and forming processes, that is, the copper foil is first cut into a copper sheet with a shape using a die-cutting tool, and then the copper sheet is stamped and formed using a forming mold. The three-dimensional copper sheet finally obtained is the copper bridge. Since copper foil is a relatively thick material for die-cutting processing, die-cutting copper bridges is prone to cause large tool wear, thereby affecting the life of the die-cutting tool. The tool price of the die-cutting equipment itself is relatively expensive, which is easy to increase the cost of die-cutting copper bridges. In addition, the copper bridges after die-cutting generally have burrs, which will cause the copper bridge to form a tip discharge when the current is turned on, thereby affecting the performance of the entire IGBT power device.

[0034] Based on the above technical problems, the embodiments of the present invention propose the following technical solutions.

[0035] An embodiment of the present invention provides a power device packaging method. Figure 1 A schematic diagram of a power device packaging method provided by an embodiment of the present invention. Figure 1 As shown, the power device packaging method specifically includes the following steps: S110, providing a carrier film and a copper foil; wherein the carrier film and the copper foil are both loaded in a roll form.

[0036] Specifically, according to the actual application requirements of the power device, the user can design the copper bridge by himself. According to the copper bridge design drawing, the carrier film collected in the form of a roll is cut and processed to obtain a carrier film with a suitable width, and the roll is loaded. Similarly, according to the copper bridge design drawing, the copper foil collected in the form of a roll is cut and processed to obtain a copper foil with a suitable width, and the roll is loaded.

[0037] S120, compounding the copper foil and the carrier film, etching the compounded copper foil to form a copper sheet, and collecting the copper sheet and the carrier film to form a copper sheet roll; wherein the copper sheet has a preset copper bridge plane shape.

[0038] Exemplarily, the material of the carrier film includes polyethylene terephthalate (PET). PET is a packaging film with good corrosion resistance. The copper foil is composited with the carrier film, and a preset copper bridge plane shape to be etched is formed on the surface of the copper foil. The composite copper foil and the carrier film are immersed in an etching solution, and the surface of the copper foil is etched according to the preset copper bridge plane shape to be etched, so that the copper sheet carried by the carrier film has a preset copper bridge plane shape, and the etched copper sheet is collected in a roll form to form a copper sheet roll. Compared with the die-cutting method used in the related art to prepare the contour shape of the copper bridge, the copper foil is etched to form a preset copper bridge plane shape on the surface of the copper foil, so that the edge contour of the preset copper bridge plane shape is smooth and burr-free, thereby effectively avoiding the copper bridge used in the IGBT power device from forming a tip discharge when the current is turned on, which is beneficial to ensure the performance of the entire IGBT power device. In addition, the etching method is used instead of the die-cutting method, which saves the damage of the die-cutting tool, thereby helping to reduce the preparation cost of the copper bridge.

[0039] S130, loading the copper sheet coil.

[0040] Specifically, the prepared copper sheet material roll having a preset copper bridge plane shape is loaded, so that the copper sheets in the copper sheet material roll are unfolded layer by layer, so as to perform subsequent patch operations.

[0041] S140, stamping and bending the copper sheet to form a copper bridge, and bonding the copper bridge to the power device substrate to complete the power device packaging.

[0042] Specifically, a stamping die is used to stamp and bend a copper sheet etched with a preset copper bridge plane shape, so that the flat copper sheet forms a three-dimensional shape like an arch bridge separated from the carrier film, thereby forming a copper bridge. The prepared copper bridge is bonded to a corresponding bonding position on a power device substrate to achieve connection with a control circuit in the power device, form a finished power device, and complete the power device packaging.

[0043] The power device packaging method provided by the embodiment of the present invention is to compound the provided copper foil with the carrier film, etch a preset copper bridge plane shape on the surface of the compounded copper foil by an etching method, and collect the copper sheet and the carrier film in a roll form to form a copper sheet material roll. The copper sheet material roll obtained by etching is loaded in a roll form, and the preset copper bridge plane shape on the copper sheet is stamped and bent to form a copper bridge. The copper bridge is bonded to the corresponding bonding position of the power device substrate, thereby completing the packaging of the power device. Compared with the prior art that forms the copper bridge by die cutting and stamping, the embodiment of the present invention first forms the preset copper bridge plane shape by etching, and then forms the copper bridge according to the preset copper bridge plane shape by stamping, so that the edge of the formed copper bridge can be smooth and burr-free, which can effectively avoid the copper bridge applied to the IGBT power device from forming a tip discharge when the current is turned on, and ensure the performance of the entire IGBT power device. And the use of die cutting tools is omitted, thereby eliminating the damage of the die cutting tools, which is conducive to reducing the preparation cost of the copper bridge.

[0044] Optionally, Figure 2 yes Figure 1 Detailed flow chart of step S120 in FIG. Figure 2 As shown, the step S120 of compounding the copper foil and the carrier film specifically includes the following steps: S121. Coating composite glue on the surface of the carrier film and pre-curing the composite glue.

[0045] For example, the composite glue used in this embodiment is a composite glue that can release stickiness. The composite glue is evenly coated on the surface of the carrier film, and the composite glue is pre-cured to reduce the fluidity of the composite glue, so that the composite glue is initially shaped.

[0046] S122, compounding the copper foil with the carrier film by using compound glue.

[0047] Specifically, the unfolded copper foil is compounded with the composite glue on the carrier film, so that the copper foil and the carrier film form an integrated structure. In the subsequent etching process of the copper foil, the carrier film can play a role in supporting the copper sheet.

[0048] S123, curing the composite glue again until the composite glue is completely cured and the copper foil and the carrier film are completely composited.

[0049] Specifically, after the copper foil is laminated to the carrier film, the composite glue is further cured so that the composite glue is completely cured and the copper foil and the carrier film are firmly laminated into one body.

[0050] Optionally, Figure 3 yes Figure 1 Detailed flow chart of step S120 in FIG. Figure 3As shown, step S120 of etching the composite copper foil to form a copper sheet, and collecting the copper sheet and the carrier film to form a copper sheet roll specifically includes the following steps: S124. Coating a protective adhesive on the surface of the copper foil according to a specific pattern; wherein the specific pattern is a preset copper bridge plane shape.

[0051] Specifically, the protective glue is a glue that will not be corroded. Therefore, the protective glue is evenly coated on the surface of the copper foil according to the specific pattern of the designed copper bridge shape to protect the preset copper bridge plane shape that needs to be retained.

[0052] S125, immersing the copper foil in an etching solution, and etching the position where the protective glue is not applied to form a copper sheet.

[0053] Specifically, the copper foil coated with protective glue is immersed in etching solution, the preset copper bridge plane shape covered by the protective glue is retained during the etching process, and the part of the copper foil not covered by the protective glue is etched away, thereby forming a copper sheet with a preset copper bridge plane shape after etching is completed.

[0054] S126, cleaning the protective glue on the surface of the copper sheet, and collecting the copper sheet in a roll to form a copper sheet material roll.

[0055] Specifically, after etching is completed, the protective glue is etched away, and the surface of the copper sheet is cleaned. The copper sheet is collected in a roll form to obtain a copper sheet material roll.

[0056] Exemplarily, a preset copper bridge plane shape on a copper sheet roll includes a shape repeating unit, and the shape repeating unit includes a shape arrangement mode in which a single row or multiple rows of arrangement forms are arbitrarily combined with a single or multiple plane shapes. Specifically, the shape repeating unit in the preset copper bridge plane shape may include a single-row arrangement of a single plane shape, a single-row arrangement of multiple plane shapes, a multiple-row arrangement of a single plane shape, and / or a multiple-row arrangement of multiple plane shapes. According to the actual needs of the IGBT power device, a variety of different preset copper bridge plane shapes can be designed, and the arrangement mode of the preset copper bridge plane shapes set on the same copper foil can be adjusted, thereby adjusting the number of copper bridges set on the same copper foil, which is conducive to improving the production efficiency of copper bridge bonding.

[0057] For example, taking the diameter of a single copper sheet roll as 300 mm, Figures 4 to 9 Schematic diagram of a copper sheet roll with different preset copper bridge plane shapes provided by an embodiment of the present invention. Figure 4 , which shows the situation of single-row etching on copper foil and etching the same preset copper bridge plane shape. 24,000 copper bridges can be etched on a single roll of copper sheet material. Figure 5 , which shows the situation where multiple rows of etching are performed on the copper foil and the same preset copper bridge plane shape is etched, Figure 5Specifically shown is the case of double-row etching, where nearly 100,000 copper bridges can be etched on a single roll of copper sheet material. Figure 6 , which shows the situation of single-row etching on copper foil and etching a variety of preset copper bridge plane shapes, Figure 6 Specifically, two different preset copper bridge plane shapes are etched in a single row, and 39,000 copper bridges can be etched on a single roll of copper sheet material. Figure 7 , which shows the situation of etching multiple rows on the copper foil and etching a variety of preset copper bridge plane shapes, Figure 7 Specifically, double-row etching and etching of two different preset copper bridge plane shapes are shown, and nearly 120,000 copper bridges can be etched on a single roll of copper sheet material. Figure 8 , which shows the situation of single-row etching of a large area of ​​preset copper bridge plane shape on copper foil. 16,000 copper bridges can be etched on a single roll of copper sheet material. Fig. 9 , which shows the situation of single-row etching on copper foil and etching different preset copper bridge plane shapes in a large area. 16,000 copper bridges can be etched on a single roll of copper sheet material. It should be noted that Figures 4 to 9 Below the copper sheet shown in the figure is the carrier film compounded by the composite glue, but the carrier film is not shown in the figure.

[0058] Optionally, Fig.10 yes Figure 1 Detailed flow chart of step S140 in FIG. Fig.10 As shown, the step S140 of stamping and bending the copper sheet to form a copper bridge specifically includes the following steps: S141, debonding the composite glue, and separating the copper sheet in the copper sheet roll from the carrier film.

[0059] Exemplarily, the debonding method of the composite glue includes UV debonding or thermal debonding. In actual operation, an appropriate debonding method is used to partially debond the composite glue, so that the viscosity of the composite glue between the copper sheet and the carrier film is reduced or the viscosity of the composite glue is completely eliminated, so that the copper sheet of the copper sheet roll and the carrier film are separated from each other.

[0060] S142, positioning the copper sheet, and using a stamping die to stamp and bend the preset copper bridge plane shape on the copper sheet to form a copper bridge.

[0061] Specifically, each planar copper sheet in the copper sheet roll is positioned in sequence, and a stamping die is used to stamp the preset copper bridge plane shape of the copper sheet in sequence, so as to achieve bending to form a copper bridge, and the bent plane is used to fit with the patch position on the power device substrate to complete the power device package. Among them, the shape of the stamping die can be the same as the preset copper bridge plane shape of the copper sheet to be stamped, or it can be a simple shape, which is not limited here. In order to simplify the production difficulty and reduce the production cost, a stamping die with a simple shape is selected in this embodiment. In addition, the area of ​​the stamping die needs to be greater than or equal to the area of ​​the preset copper bridge plane shape of the copper sheet. If the area of ​​the stamping die is smaller than the area of ​​the preset copper bridge plane shape, the copper sheet will be cut during the stamping process, thereby affecting the size of the copper bridge, resulting in a reduction in the preparation accuracy of the copper bridge.

[0062] Optionally, Fig.11 yes Figure 1 Detailed flow chart of step S140 in FIG. Fig.11 As shown, step S140 of bonding the copper bridge to the power device substrate specifically includes the following steps: S143, dispensing glue at a preset dispensing position on the power device substrate.

[0063] Specifically, a preset dispensing position on the power device substrate is identified, and dispensing or scribing is performed at the preset dispensing position, wherein dispensing includes forming a dot-shaped colloid, and scribing includes forming a line-shaped colloid.

[0064] S144, the power device substrate after glue dispensing is transferred to the patch station and positioned.

[0065] Specifically, the power device substrate after dispensing is transferred to the patch station, and the patch position on the power device substrate is identified and located.

[0066] S145, sucking the copper bridge and moving it to a corresponding patch position on the power device substrate, attaching the copper bridge to the corresponding patch position, and obtaining a power device.

[0067] Specifically, the robot absorbs the three-dimensional copper bridges of different shapes formed by stamping and moves them to the corresponding patch positions on the power device substrate, and fits the bonding surface of the copper bridge with the colloid at the patch position, thereby completing the packaging of the power device.

[0068] Optionally, based on the above embodiments, after step S145, the following steps are further included: Perform quality inspection on power devices and generate quality inspection results.

[0069] Specifically, to ensure that the quality of the packaged power devices meets the standards, the power devices need to be quality tested before cutting, and quality test results are generated after the test is completed. Exemplarily, the quality test may include copper sheet missing test and patch quality test, which are not limited here.

[0070] The power devices are classified according to the quality inspection results, and the power devices whose quality inspection results meet the requirements are cut.

[0071] Exemplarily, if the quality inspection result indicates that the packaging quality of the power device does not meet the requirements, the robot arm will unload the power device to the unqualified product station; if the quality inspection result indicates that the packaging quality of the power device meets the requirements, the robot arm will unload the power device to the qualified product station.

[0072] The embodiment of the present invention also provides a power device packaging device. Fig.12 1 is a schematic diagram of the structure of a power device packaging device provided by an embodiment of the present invention. The power device packaging device is used to perform the power device packaging method provided by any of the above embodiments, and is specifically used to perform the process of stamping and bending to form a copper bridge and bonding the copper bridge to the power device substrate in the power device packaging method. Fig.12 As shown, the power device packaging equipment includes: a base 10, a substrate loading mechanism 20, a substrate conveying mechanism 30, a glue dispensing mechanism 40, at least one copper sheet loading mechanism 50 and at least one patch mechanism 60.

[0073] The substrate loading mechanism 20 is located on the side of the base 10, and the substrate conveying mechanism 30, the glue dispensing mechanism 40, the copper sheet loading mechanism 50 and the patch mechanism 60 are all arranged above the base 10; the substrate loading mechanism 20 is arranged at one end of the substrate conveying mechanism 30; along the extension direction of the substrate conveying mechanism 30, the glue dispensing mechanism 40, the copper sheet loading mechanism 50 and the patch mechanism 60 are arranged in sequence in the direction away from the substrate loading mechanism 20.

[0074] The substrate loading mechanism 20 is used to load the power device substrate to the substrate conveying mechanism 30; the substrate conveying mechanism 30 is used to convey the power device substrate to the corresponding work station; wherein the work station includes a glue dispensing station and a patch station; the glue dispensing mechanism 40 is used to dispense glue at a preset glue dispensing position on the power device substrate; the copper sheet loading mechanism 50 is used to load a copper sheet roll etched with a preset copper bridge plane shape; the patch mechanism 60 is used to bond the copper bridge to the preset bonding position on the power device substrate to form a power device.

[0075] Specifically, the feeding element of the substrate feeding mechanism 20 is the IGBT power device substrate that has completed the die bonding, and the feeding element of the copper sheet feeding mechanism 50 is a copper sheet material roll that is formed on the copper foil by etching in a preset copper bridge plane shape and collected in a roll form. Compared with the die-cutting method used in the related art to form the copper bridge, the embodiment of the present invention uses etching to form the edge profile of the copper bridge to be smooth and burr-free, which can ensure the performance of the entire IGBT power device and avoid damage to the die-cutting tool, which is conducive to reducing the preparation cost of the copper bridge.

[0076] The substrate loading mechanism 20 can sequentially load multiple power device substrates to the loading station of the substrate conveying mechanism 30, and the substrate conveying mechanism 30 sequentially conveys each power device substrate to the corresponding work station to perform corresponding operations. Along the extension direction or conveying direction of the substrate conveying mechanism 30, the dispensing mechanism 40, the copper sheet loading mechanism 50 and the patch mechanism 60 are sequentially arranged, and the copper sheet loading mechanism 50 and the patch mechanism 60 can be located on both sides of the substrate conveying mechanism 30, or the copper sheet loading mechanism 50 and the patch mechanism 60 can be located on the same side of the substrate conveying mechanism 30, which is not limited here. After the substrate loading mechanism 20 loads the power device substrate to the loading station of the substrate conveying mechanism 30, it is sequentially transferred to the glue dispensing mechanism 40 for glue dispensing operation, and the copper sheet loading mechanism 50 loads the copper sheet roll etched with a preset copper bridge plane shape, until the substrate conveying mechanism 30 transfers the power device substrate to the patch mechanism 60 for the patch operation of the copper bridge, thereby forming a closed-loop link of the control circuit in the power device and completing the packaging to form the power device.

[0077] The power device packaging equipment provided by the embodiment of the present invention is used to perform the process of forming a copper bridge on a copper sheet etched to form a preset copper bridge plane shape and completing the copper bridge bonding in the packaging method provided by the embodiment of the present invention. The substrate feeding mechanism feeds the power device substrate to the feeding station of the substrate conveying mechanism. The substrate conveying mechanism sequentially conveys the power device substrate to the glue dispensing mechanism and the patch mechanism, thereby performing a glue dispensing operation on the power device substrate. At the same time, the copper sheet feeding mechanism feeds the copper sheet material roll etched with a preset copper bridge plane shape, so that the patch mechanism completes the operation of bonding the copper bridge to the power device substrate. The power device packaging equipment provided by the embodiment of the present invention can realize the bonding of copper bridges of different shapes on the power device substrate, which is conducive to improving the diversity of production and improving production efficiency.

[0078] Optionally, Fig.13 : is a schematic diagram of a specific structure of a copper sheet feeding mechanism provided by an embodiment of the present invention. Based on the above embodiments, the copper sheet stock roll includes a copper sheet and a carrier film compounded by a composite glue, wherein a preset copper bridge plane shape is etched on the surface of the copper sheet. Fig.12 and Fig.13The copper sheet feeding mechanism 50 includes a feeding unit 511 , a debonding unit 512 , a punching unit 513 , a demoulding unit 514 and a receiving unit 515 .

[0079] The loading unit 511 is used to carry the copper sheet stock roll and rotate around the axis to load the copper sheet stock roll to the degumming unit 512; the degumming unit 512 is used to degumming the composite glue in the copper sheet stock roll; the stamping unit 513 is provided with a stamping die, which is used to stamp the preset copper bridge plane shape on the copper sheet to form a copper bridge; the demoulding unit 514 is used to separate the copper sheet from the carrier film before stamping; the receiving unit 515 is used to receive the carrier film.

[0080] Exemplarily, the copper sheet feeding mechanism 50 in the power device packaging equipment may include at least one, and each copper sheet feeding mechanism 50 is arranged in sequence along the extension direction of the substrate conveying mechanism 30. For example: Fig.12 The figure shows that the power device packaging equipment includes 6 copper sheet feeding mechanisms 50. The number of copper sheet feeding mechanisms 50 can be set according to actual needs and is not limited here. The copper sheet feeding mechanism 50 is provided with a circular feeding unit 511, which can be adapted to the copper sheet material roll collected in a roll form. The feeding unit 511 can unfold the copper sheet material roll layer by layer by rotating around the axis to realize the feeding of the copper sheet material roll. Each copper sheet feeding mechanism 50 can feed the copper sheet material roll at the same time. One copper sheet feeding mechanism 50 can feed the copper sheet material roll with one preset copper bridge plane shape, and can also feed the copper sheet material roll with multiple preset copper bridge plane shapes.

[0081] After the feeding unit 511 feeds the copper sheet roll, the composite structure of the copper sheet and the carrier film enters the degumming unit 512. The degumming unit 512 can remove the viscosity of the composite glue solidified between the copper sheet and the carrier film by UV degumming method or thermal degumming method, reduce the compositeness between the copper sheet and the carrier film, and make the copper sheet and the carrier film easy to separate. After reducing the viscosity of the composite glue, the copper sheet and the carrier film enter the stamping unit 513, and the preset copper bridge plane shape on the copper sheet is matched with the stamping die to stamp the copper sheet, so that the planar copper sheet forms a bent copper bridge with a preset copper bridge plane shape. The demolding unit 514 demolds the copper sheet to separate it from the carrier film so as to perform stamping to form a copper bridge. The separated carrier film is collected by the collecting unit 515. Optionally, Fig.14 FIG. 1 is a schematic diagram of a specific structure of a patch mechanism provided by an embodiment of the present invention. Fig.14 The patch mechanism 60 includes a first motion unit 611, a second motion unit 612, a third motion unit 618, a rotating unit 613, a patch camera 614, an upward-looking camera 615, at least one suction nozzle 616 and a patch head 617.

[0082] Among them, the patch head 617 moves along the first direction on the first moving unit 611, the patch head 617 moves along the second direction in the second moving unit 612 through the first moving unit 611, and the patch head moves along the third direction in the third moving unit 618 through the first moving unit 611 and the second moving unit 612, and the first direction, the second direction and the third direction are perpendicular to each other; the suction nozzle 616 is set at the bottom of the patch head 617 through the rotating unit 613, and is used to suck the copper bridge and stick it to the preset bonding position of the power device substrate; the patch camera 614 is set on the side of the patch head 617, and is used to measure the error between the actual bonding position moved to by the suction nozzle 616 and the preset bonding position; the upward-looking camera 615 is set below the suction nozzle 616, and is used to measure the error between the position where the suction nozzle 616 sucks the copper bridge and the center position of the copper bridge.

[0083] Specifically, the chip placement mechanism 60 in the power device packaging equipment may include at least one, and each chip placement mechanism 60 is arranged in sequence along the extension direction of the substrate conveying mechanism 30. For example: Fig.12 2 shows a case where the power device packaging equipment includes six patch mechanisms 60 . The number of the patch mechanisms 60 can be set according to actual needs and is not limited here. Fig.15 Schematic diagram of the coordination structure of a copper sheet feeding mechanism and a patch mechanism provided by an embodiment of the present invention. Fig.15 , one patch mechanism 60 needs to work with one copper sheet feeding mechanism 50. Among them, the upward-looking camera 615 in the patch mechanism 60 is arranged on the copper sheet feeding mechanism 50. Exemplarily, the copper sheet feeding mechanism 50 includes at least two copper sheet feeding mechanisms 50, and the patch mechanism 60 includes at least two patch mechanisms 60; the number of copper sheet feeding mechanisms 50 is equal to the number of patch mechanisms 60, and each copper sheet feeding mechanism 50 is arranged in a one-to-one correspondence with each patch mechanism 60. Among them, each copper sheet feeding mechanism 50 feeds copper sheet material rolls with the same preset copper bridge plane shape; or, each copper sheet feeding mechanism 50 respectively feeds copper sheet material rolls with different preset copper bridge plane shapes, which is conducive to improving production efficiency and is not limited here. The number of copper sheet feeding mechanisms 50 can be designed according to actual needs and is not limited here. However, the specific number of patch mechanisms 60 and copper sheet feeding mechanisms 50 is not limited here, and can be designed according to the actual needs of the packaging process. Fig.12 exemplarily shows a situation where the copper sheet feeding mechanism 50 includes 6 copper sheet feeding mechanisms 50 and the patch mechanism 60 includes 6 patch mechanisms 60 .

[0084] The patch head 617 in the patch mechanism 60 can be moved in the first direction, in the second direction and in the third direction through the first motion unit 611, the second motion unit 612 and the third motion unit 618 respectively. Among them, the first direction, the second direction and the third direction are perpendicular to each other. For example, the first direction can be the X direction, the second direction can be the Y direction, and the third direction can be the Z direction, which is not limited here. The patch head 617 is equipped with a rotating unit 613, and at least one suction nozzle 616 is arranged below the rotating unit 613, so that at least one suction nozzle 616 points to the vertical downward direction. The rotating unit 613 can control at least one suction nozzle 616 to revolve around the rotation axis in the vertical direction, and the suction nozzle 616 can suck up the stamped copper bridge, and move the copper bridge to the preset bonding position of the power device substrate by rotation and movement, so as to perform subsequent bonding operations. Among them, the number of suction nozzles 616 can be set according to the packaging requirements of the power device substrate, which is not limited here. When multiple suction nozzles 616 are included, multiple suction nozzles 616 can simultaneously suck copper bridges and synchronously perform multi-copper bridge patch operations, which is beneficial to improving production efficiency. The patch head 617 carries the suction nozzle 616 to move within a certain range along the first direction, the second direction and the third direction, and controls the suction nozzle 616 to revolve within a certain range through the rotation unit 613, so that the suction nozzle 616 can cover the complete power device substrate area, which is beneficial to realize the copper bridge bonding operation at different positions on the power device substrate. Exemplarily, the movement range of the patch head 617 along the first direction includes 0 to 80 mm, the movement range along the second direction includes 0 to 350 mm, and the movement range along the third direction includes 0 to 150 mm; the rotation angle range driven by the rotation unit 613 to the suction nozzle 616 includes 0 to 360°. The movement stroke of the patch head 617 has been set according to actual conditions and is not limited here.

[0085] The patch mechanism 60 is also provided with a patch camera 614, which is mounted on the patch head 617 and can move with the patch head 617. The patch camera 614 has a visual positioning function, which is used to measure the error distance between the actual bonding position of the suction nozzle 616 and the preset preset bonding position after the patch head 617 drives the suction nozzle 616 to move to the actual bonding position, and record the measured error distance. Fig.14, an upward camera 615 is also provided on the copper sheet feeding mechanism 50, and the upward camera 615 also has a visual positioning function, and the positioning angle of the upward camera 615 is an upward angle from bottom to top. The upward camera 615 is used to measure the error distance between the suction position of the suction nozzle 616 on the copper bridge and the center position of the copper bridge when the suction nozzle 616 sucks the copper bridge, and record the error distance. According to the error distance measured by the patch camera 614 and the upward camera 615, the relative position between the copper bridge and the power device substrate is adjusted before the patch is performed, so as to ensure that the copper bridge is completely corresponding to the corresponding preset bonding position on the power device substrate, thereby ensuring the performance of the packaged power device.

[0086] Optionally, Fig.16 FIG. 1 is a schematic diagram of a specific structure of a dispensing mechanism provided by an embodiment of the present invention. Fig.16 As shown, the glue dispensing mechanism 40 includes a motion unit 41 , a glue dispensing unit 42 and a glue dispensing camera 43 .

[0087] The dispensing unit 42 is arranged on the moving unit 41, and the moving unit 41 carries the dispensing unit 42 to move along the first direction, the second direction and / or the third direction; the dispensing camera 43 is used to identify the preset dispensing position; the dispensing unit 42 is used to dispense glue at the preset dispensing position on the power device substrate; wherein the first direction, the second direction and the third direction are perpendicular to each other.

[0088] Exemplarily, the motion unit 41 may include an X-axis motion mechanism, a Y-axis motion mechanism, and a Z-axis motion mechanism, the first direction may be the X-direction, the second direction may be the Y-direction, and the third direction may be the Z-direction. When the substrate conveying mechanism 30 conveys the power device substrate to the location of the dispensing mechanism 40, the motion unit 41 may move along the first direction, the second direction, and / or the third direction. Exemplarily, the motion stroke of the motion unit 41 along the X-direction may be 0 to 100 mm, the motion stroke along the Y-direction may be 0 to 100 mm, and the motion stroke along the Z-direction may be 0 to 30 mm, so that the motion range of the motion unit 41 may cover the complete power device substrate area. The dispensing camera 43 may visually locate the power device substrate and identify the preset dispensing position on the power device substrate, thereby controlling the dispensing unit 42 to perform point dispensing or line dispensing at the preset dispensing position. In addition, the dispensing mechanism 40 is provided with a height measuring device for measuring the vertical height between the dispensing unit 42 and the power device substrate before dispensing, and adjusting the position of the dispensing unit 42 according to the measured vertical height so that the vertical height between the dispensing unit 42 and the power device substrate remains consistent, thereby ensuring the consistent dispensing quality of the dispensing unit 42.

[0089] Optionally, Fig.17FIG. 1 is a schematic diagram of a specific structure of a substrate loading mechanism provided by an embodiment of the present invention. Fig.17 As shown, the substrate loading mechanism 20 includes a robot and a carrier tray 21, in which a power device substrate is placed; the robot is used to grab the power device substrate in the carrier tray 21 to the loading station, and grab the empty carrier tray 21 to the unloading position of the substrate loading mechanism 20.

[0090] Exemplarily, the carrier tray 21 may also be referred to as a check tray. When loading begins, after the carrier tray 21 loaded with power device substrates is manually placed at the loading position, the substrate loading mechanism 20 controls the robot to grab the power device substrates in the carrier tray 21 and place them at the loading station of the substrate conveying mechanism 30. After that, the robot is controlled to grab the empty carrier tray 21 at the loading position to the unloading position, so that the next carrier tray 21 loaded with power device substrates can be manually placed at the loading position. It should be noted that the robot is Fig.17 Not shown.

[0091] Optionally, Fig.18 FIG. 1 is a schematic diagram of a specific structure of a substrate conveying mechanism provided by an embodiment of the present invention. Fig.18 As shown, the substrate conveying mechanism 30 is provided with at least five working stations, including a loading station, a glue dispensing station, a mounting station and an unloading station; wherein, there is at least one glue dispensing station and at least one mounting station; each working station works synchronously on the corresponding power device substrate.

[0092] Exemplarily, the substrate conveying mechanism 30 includes a plurality of conveying modules 31, each of which includes a conveying robot 32 and a substrate placement position 33. On the conveying track of the complete substrate conveying mechanism 30, at least five workstations are arranged, including a loading station, a dispensing station, a patch station and a unloading station, wherein the number of some workstations can be set to more than one, which is not limited here. The plurality of conveying modules 31 can be moved in a local section of the conveying track, that is, each conveying module 31 is only responsible for conveying the power device substrate to the corresponding workstation in a specific section to complete the operation. For example: the conveying robot 32 of the first conveying module 31 only conveys the power device substrate to the dispensing station to complete the dispensing operation, and then the power device substrate that has completed the dispensing operation is grabbed by the conveying robot 32 to other conveying modules 31, and then conveyed to other workstations on the conveying track until the power device substrate completes the entire packaging operation. It should be noted that after the transmission module 31 transmits the power device substrate to the corresponding work station, the power device substrate can be repositioned to ensure the accurate position of the power device substrate. The transmission track can simultaneously operate multiple power device substrates at different work stations, thereby improving production efficiency.

[0093] Optionally, Fig.19 Schematic diagram of the specific structure of a quality inspection mechanism and a material unloading mechanism provided by an embodiment of the present invention. Fig.12 and Fig.19 The power device packaging equipment also includes: a quality inspection mechanism 70 and a material unloading mechanism 80.

[0094] Along the extension direction of the substrate conveying mechanism 30, the quality inspection mechanism 70 and the unloading mechanism 80 are arranged on the side of the mounting mechanism 60 away from the substrate loading mechanism 20; the quality inspection mechanism 70 is used to perform quality inspection on the power devices that have completed the mounting; the unloading mechanism 80 is used to classify and unload the power devices that have completed the quality inspection according to the quality inspection results.

[0095] Exemplarily, after the power device substrate completes the patch operation at the patch mechanism 60 to form a power device, it continues to move along the conveying direction through the substrate conveying mechanism 30 to the position of the quality inspection mechanism 70. The quality inspection mechanism 70 includes a detection camera 71, and the detection camera 71 visually inspects the power device in terms of copper sheet missing and patch quality, thereby obtaining the quality inspection result of the power device. The unloading mechanism 80 includes a unloading module 81 and an unloading clamp 82. According to the quality inspection results, the power devices can be divided into two categories: qualified quality inspection and unqualified quality inspection, and the unloading clamp 82 can automatically unload the two types of power devices separately, so that the finished power device with qualified packaging quality can be quickly obtained.

[0096] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A power device packaging method, characterized in that: include: Providing a carrier film and a copper foil; wherein the carrier film and the copper foil are both fed in a roll form; Compounding the copper foil with the carrier film, etching the compounded copper foil to form a copper sheet, and collecting the copper sheet and the carrier film to form a copper sheet roll; wherein the copper sheet has a preset copper bridge plane shape; Loading the copper sheet coil; The copper sheet is stamped and bent to form a copper bridge, and the copper bridge is bonded to a power device substrate to complete the power device packaging.

2. The power device packaging method according to claim 1, characterized in that: The step of compounding the copper foil and the carrier film comprises: Coating composite glue on the surface of the carrier film, and pre-curing the composite glue; Compounding the copper foil with the carrier film by means of the composite glue; The composite glue is cured again until the composite glue is completely cured and the copper foil is completely composited with the carrier film.

3. The power device packaging method according to claim 1, characterized in that: The step of etching the composite copper foil to form a copper sheet, and collecting the copper sheet and the carrier film to form a copper sheet roll comprises: Coating a protective glue on the surface of the copper foil according to a specific pattern; wherein the specific pattern is the plane shape of the preset copper bridge; Immersing the copper foil in an etching solution to etch the position where the protective glue is not applied to form the copper sheet; The protective glue on the surface of the copper sheet is cleaned, and the copper sheet is collected in a roll to form the copper sheet material roll.

4. The power device packaging method according to claim 3, characterized in that: The material of the carrier film includes polyethylene terephthalate.

5. The power device packaging method according to claim 1, characterized in that: The preset copper bridge plane shape on the copper sheet roll includes a shape repeating unit, and the shape repeating unit includes a shape arrangement mode of any combination of a single row or multiple rows and a single or multiple plane shapes.

6. The power device packaging method according to claim 2, characterized in that: The step of stamping and bending the copper sheet to form a copper bridge comprises: Debonding the composite glue to separate the copper sheet in the copper sheet roll from the carrier film; The copper sheet is positioned, and a stamping die is used to stamp and bend the preset copper bridge plane shape on the copper sheet to form the copper bridge.

7. The power device packaging method according to claim 6, characterized in that: The debonding method of the composite glue includes UV debonding or thermal debonding.

8. The power device packaging method according to claim 1, characterized in that: The step of laminating the copper bridge to the power device substrate comprises: Dispensing glue at a preset dispensing position on the power device substrate; The power device substrate after dispensing is transferred to the patch station and positioned; The copper bridge is sucked and moved to a corresponding patch position on the power device substrate, and the copper bridge is attached to the corresponding patch position to obtain a power device.

9. The power device packaging method according to claim 8, characterized in that: After obtaining the power device, the method further includes: Performing quality inspection on the power device and generating quality inspection results; The power devices are classified according to the quality inspection results, and the power devices whose quality inspection results meet the requirements are cut.

10. A power device packaging device, characterized in that: Used to perform the power device packaging method according to any one of claims 1 to 9; The power device packaging equipment comprises: a base, a substrate feeding mechanism, a substrate conveying mechanism, a glue dispensing mechanism, at least one copper sheet feeding mechanism and at least one chip mounting mechanism; The substrate loading mechanism is located on the side of the base, and the substrate conveying mechanism, the glue dispensing mechanism, the copper sheet loading mechanism and the patch mechanism are all arranged above the base; The substrate feeding mechanism is arranged at one end of the substrate conveying mechanism; along the extension direction of the substrate conveying mechanism, the glue dispensing mechanism, the copper sheet feeding mechanism and the patch mechanism are arranged in sequence in a direction away from the substrate feeding mechanism; The substrate loading mechanism is used to load the power device substrate to the substrate conveying mechanism; the substrate conveying mechanism is used to convey the power device substrate to the corresponding work station; wherein the work station includes a glue dispensing station and a patch station; the glue dispensing mechanism is used to dispense glue at a preset glue dispensing position on the power device substrate; the copper sheet loading mechanism is used to load a copper sheet roll etched with a preset copper bridge plane shape; the patch mechanism is used to bond the copper bridge to the preset bonding position on the power device substrate to form a power device.

11. The power device packaging equipment according to claim 10, characterized in that: The copper sheet roll comprises a copper sheet and a carrier film compounded by a composite glue, wherein the surface of the copper sheet is etched with the preset copper bridge plane shape; The copper sheet feeding mechanism comprises a feeding unit, a debonding unit, a punching unit, a demoulding unit and a receiving unit; The feeding unit is used to carry the copper sheet stock roll and rotate around the axis so as to feed the copper sheet stock roll to the degumming unit; the degumming unit is used to degumming the composite glue in the copper sheet stock roll; the stamping unit is provided with a stamping die, which is used to stamp the preset copper bridge plane shape on the copper sheet to form a copper bridge; the demoulding unit is used to separate the copper sheet from the carrying film before stamping; the receiving unit is used to receive the carrying film.

12. The power device packaging equipment according to claim 11, characterized in that: The patch mechanism includes a first motion unit, a second motion unit, a third motion unit, a rotating unit, a patch camera, an upward-looking camera, and at least one suction nozzle and a patch head; Among them, the patch head moves along the first direction on the first moving unit, the patch head moves along the second direction in the second moving unit through the first moving unit, and the patch head moves along the third direction in the third moving unit through the first moving unit and the second moving unit, and the first direction, the second direction and the third direction are perpendicular to each other; the suction nozzle is set at the bottom of the patch head through the rotating unit, and is used to suck the copper bridge and stick it to the preset bonding position of the power device substrate; the patch camera is set on the side of the patch head, and is used to measure the error between the actual bonding position moved to by the suction nozzle and the preset bonding position; the upward-looking camera is set below the suction nozzle, and is used to measure the error between the position where the suction nozzle sucks the copper bridge and the center position of the copper bridge.

13. The power device packaging equipment according to claim 11, characterized in that: At least one of the copper sheet feeding mechanisms feeds the copper sheet stock rolls having the same preset copper bridge plane shape; Alternatively, at least one of the copper sheet feeding mechanisms feeds the copper sheet rolls having different kinds of the preset copper bridge plane shapes respectively.

14. The power device packaging equipment according to claim 12, characterized in that: The power device packaging equipment comprises at least two copper sheet feeding mechanisms and at least two patch mechanisms; The number of the copper sheet feeding mechanisms is equal to the number of the patch mechanisms, and each of the copper sheet feeding mechanisms is arranged in a one-to-one correspondence with each of the patch mechanisms.

15. The power device packaging equipment according to claim 12, characterized in that: The moving range of the patch head along the first direction includes 0 to 80 mm, the moving range along the second direction includes 0 to 350 mm, and the moving range along the third direction includes 0 to 150 mm; The rotation angle range of the suction nozzle driven by the rotating unit includes 0 to 360 degrees.

16. The power device packaging equipment according to claim 10, characterized in that: The dispensing mechanism comprises a motion unit, a dispensing unit and a dispensing camera; The dispensing unit is arranged on the moving unit, and the moving unit carries the dispensing unit to move along the first direction, the second direction and / or the third direction; the dispensing camera is used to identify the preset dispensing position; the dispensing unit is used to dispense glue at the preset dispensing position on the power device substrate; The first direction, the second direction and the third direction are perpendicular to each other.

17. The power device packaging equipment according to claim 10, characterized in that: The substrate loading mechanism comprises a robot and a carrier plate, and the power device substrate is placed in the carrier plate; The robot is used to grab the power device substrate in the carrier tray to the loading station, and grab the empty carrier tray to the unloading position of the substrate loading mechanism.

18. The power device packaging equipment according to claim 10, characterized in that: The substrate conveying mechanism is provided with at least five working stations, including a loading station, a glue dispensing station, a patch station and a unloading station; wherein the glue dispensing station includes at least one, and the patch station includes at least one; Each of the working stations works synchronously on the corresponding power device substrate.

19. The power device packaging equipment according to claim 10, characterized in that: Also includes: Quality inspection agencies and material unloading agencies; Along the extension direction of the substrate conveying mechanism, the quality inspection mechanism and the unloading mechanism are arranged on a side of the patch mechanism away from the substrate loading mechanism; The quality inspection mechanism is used to perform quality inspection on the power devices that have completed the patching; the unloading mechanism is used to classify and unload the power devices that have completed the quality inspection according to the quality inspection results.

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