Fish tank thermostat based on semiconductor chilling plate

Abstract

The invention provides a fish tank constant temperature machine based on a semiconductor chilling plate, and relates to the technical field of constant temperature devices, the fish tank constant temperature machine comprises a cooling liquid circulation assembly, a semiconductor refrigeration assembly, a heat exchange assembly, a temperature sensor and a main control board, the cooling liquid circulation assembly comprises the semiconductor chilling plate, a liquid circulation box, a pipeline, a radiator and a water pump; the semiconductor refrigeration assembly is attached to the outer surface of the liquid circulation box, the heat exchange assembly is attached to the outer surface of the semiconductor refrigeration assembly, the liquid circulation box, the semiconductor refrigeration assembly, the heat exchange assembly and the temperature sensor are all put into the fish tank, and the cooling liquid circulation assembly, the semiconductor refrigeration assembly and the temperature sensor are all electrically connected with the main control panel. When the temperature sensor detects that the temperature in the fish tank is lower than or higher than the preset temperature, the main control board achieves heating or refrigeration by switching the current direction of the semiconductor refrigeration assembly, and then it is ensured that the temperature of water in the fish tank is constant.

Description

Technical Field

[0001] The invention relates to the technical field of thermostatic devices, and in particular to a fish tank thermostatic machine based on a semiconductor refrigeration sheet. Background Art

[0002] As people's quality of life improves, raising ornamental fish has become a popular lifestyle. Different types of ornamental fish have strict requirements for the water temperature in their living environment to ensure that they maintain the best physiological state, grow healthily, and reproduce smoothly. For example, tropical fish require a higher and constant water temperature (usually between 24℃ and 30℃), while some cold-water fish are more suitable for living in lower water temperature conditions. In order to meet the needs of ornamental fish for an ideal water temperature environment, fish tank chillers came into being. This equipment can effectively adjust the water temperature in the fish tank and create a suitable living space for fish. Traditional fish tank heating rods only have heating functions, not cooling functions. Therefore, an additional chiller is required. Common chillers include compressor chillers and semiconductor chillers.

[0003] Compressor-type chillers use compressor refrigeration to lower the water temperature. Its working principle is to first compress the refrigerant to a high-temperature and high-pressure state, then dissipate heat through the condenser to convert it into a high-pressure liquid, and then reduce the pressure through the throttle valve to become a low-temperature and low-pressure liquid, which absorbs heat in the evaporator to achieve a cooling effect. Although compressor-type chillers can provide effective cooling effects, the noise and vibration generated during their operation may interfere with users, and most of them cannot generate heat. In addition, some traditional refrigerants contain ingredients that are harmful to the environment, and long-term use may have an adverse effect on the ecology.

[0004] The semiconductor chiller is based on the Peltier effect principle of semiconductor refrigeration sheets, and pumps heat from the cold surface to the hot surface. Since the Peltier does not require refrigerant, has a simple structure, and can generate heat by changing the direction of current, the semiconductor chiller has the advantages of simple and compact structure, low noise, and the ability to heat and cool. It solves some pain points of compressor-type chillers and is very suitable for constant temperature scenarios in small fish tanks.

[0005] The existing semiconductor chiller achieves constant temperature in the fish tank by pumping the water in the fish tank through pipes and pumps to the cold surface of the semiconductor refrigeration plate inside the chiller for cooling and then returning it to the fish tank. The semiconductor refrigeration plate discharges the heat pumped to the hot surface into the air using heat sinks and fans.

[0006] However, the existing semiconductor chillers have the following disadvantages:

[0007] (1) Pollutants such as fish feces, fish food, and other impurities in the fish tank can easily enter the pumping pipeline and cause blockage;

[0008] (2) Since the residual water in the pipe is difficult to remove, it is easy for bacteria to grow when the chiller is not in operation, which can easily cause water pollution in the fish tank when it is used again;

[0009] (3) Semiconductor refrigeration uses air cooling to dissipate heat, which has low heat dissipation efficiency and affects the refrigeration efficiency.

[0010] Therefore, it is necessary to propose a fish tank thermostat based on semiconductor refrigeration chips to avoid the above problems and effectively conduct heat to the fish tank to ensure the constant temperature effect of the fish tank for a long time. Summary of the invention

[0011] In order to solve the above problems, the present invention proposes a fish tank thermostat based on a semiconductor refrigeration sheet to avoid the above problems and effectively conduct heat to the fish tank to ensure the constant temperature effect of the fish tank for a long time.

[0012] The present invention is achieved through the following technical solutions:

[0013] The present invention proposes a fish tank thermostat based on a semiconductor refrigeration sheet, comprising a coolant circulation component, a semiconductor refrigeration component, a temperature sensor, and a main control board. The coolant circulation component comprises a semiconductor refrigeration sheet, a liquid circulation box, a pipeline, a water pump, and a radiator; the liquid circulation box is respectively connected to the water pump and the radiator through the pipeline, and can circulate the liquid. The semiconductor refrigeration component is arranged on the outer surface of the liquid circulation box. The semiconductor refrigeration component, the liquid circulation box, and the temperature sensor are all put into the fish tank. The semiconductor refrigeration component and the temperature sensor are both electrically connected to the main control board. When the temperature in the fish tank detected by the temperature sensor is lower than or higher than the preset temperature, the main control board switches the current direction of the semiconductor refrigeration component to achieve heating or cooling, thereby ensuring that the water temperature in the fish tank is constant.

[0014] Furthermore, the surface of the liquid circulation box not attached to the semiconductor refrigeration component and the water are insulated by air or a low thermal conductivity insulation member.

[0015] Furthermore, the fish tank thermostat based on the semiconductor refrigeration plate also includes a heat exchange component, and the heat exchange component is arranged on a side of the semiconductor refrigeration plate away from the liquid circulation box.

[0016] Furthermore, the semiconductor refrigeration component includes at least two groups, which are respectively arranged on the sides of the liquid circulation box to increase the heat exchange area between the semiconductor refrigeration component and water and reduce the heat exchange area between the coolant circulation component and water.

[0017] Furthermore, the semiconductor refrigeration component includes at least two groups of semiconductor refrigeration plates, each group of the semiconductor refrigeration plates includes multiple semiconductor refrigeration plates, and the multiple semiconductor refrigeration plates are arranged in sequence. Each group of the semiconductor refrigeration plates is electrically connected to the main control board, and each group of the semiconductor refrigeration plates is respectively attached to the two side surfaces of the liquid circulation box, and the heat exchange component is respectively arranged on the outside of each group of the semiconductor refrigeration plates.

[0018] Furthermore, it also includes a seal, one side of which is sleeved on one side of the liquid circulation box to form a sealed and fixed connection, and the seal is simultaneously arranged around the periphery of multiple semiconductor refrigeration plates. The heat exchange component includes the same number of heat exchange plates as the number of semiconductor refrigeration plates, one heat exchange plate corresponds to a group of semiconductor refrigeration plates, and the other side of the seal is sleeved on one side of the heat exchange plate to form a sealed and fixed connection.

[0019] Furthermore, the sealing member is provided with a plurality of embedding grooves, the plurality of embedding grooves are arranged in sequence, the plurality of semiconductor cooling sheets correspond one by one to the plurality of embedding grooves respectively, the semiconductor cooling sheets are accommodated in the embedding grooves and are tightly attached to the groove walls of the embedding grooves.

[0020] Furthermore, it also includes at least two clamping and locking assemblies, which are in an X-shaped structure, and one of the clamping and locking assemblies clamps one side of at least two of the heat exchange plates to increase the fitting force between the heat exchange plate and the semiconductor refrigeration plate.

[0021] Furthermore, the clamping and locking assembly includes a first clamping member, a second clamping member, and a locking member. The first clamping member and the second clamping member are both D-shaped structures and have elastic force. One side of the first clamping member is hooked and connected to one side of one of the heat exchange plates, and one side of the second clamping member is hooked and connected to one side of another heat exchange plate. The first clamping member and the second clamping member are symmetrically arranged, and the locking member passes through the middle part of the second clamping member and the middle part of the first clamping member in sequence. The locking member is threadedly connected to the middle part of the first clamping member, and the locking member can be turned to bring the middle part of the first clamping member and the middle part of the second clamping member closer together, so that the two sides of the two heat exchange plates are clamped by the elastic force of the first clamping member and the second clamping member themselves.

[0022] Beneficial effects of the present invention:

[0023] The present invention adopts the liquid internal circulation of the coolant circulation component to conduct temperature, avoiding the problem of impurity blockage or bacteria breeding in the circulating water body, by attaching the semiconductor refrigeration component to the liquid circulation box, using the temperature sensor to detect the temperature of the water in the fish tank, and using the heat exchange component to perform heat exchange on the water in the fish tank. When the temperature in the fish tank detected by the temperature sensor is higher or lower than the preset temperature, the main control board switches the current direction of the semiconductor refrigeration component to achieve heating or cooling, thereby ensuring the constant temperature of the water in the fish tank; in summary, the fish tank thermostat based on the semiconductor refrigeration sheet adopts the technology of internal circulation heat conduction to effectively conduct heat to the fish tank, so as to ensure the constant temperature effect of the fish tank for a long time. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural block diagram of the fish tank thermostat based on the semiconductor refrigeration sheet of the present invention;

[0025] Figure 2 It is a partial structural exploded diagram of the fish tank thermostat based on the semiconductor refrigeration sheet of the present invention;

[0026] Figure 3 The exploded view of the fish tank thermostat based on the semiconductor refrigeration sheet of the present invention;

[0027] Figure 4 It is a partial structural schematic diagram of the fish tank thermostat based on the semiconductor refrigeration sheet of the present invention;

[0028] Figure 5 It is a schematic diagram of the sealing member of the fish tank thermostat based on the semiconductor refrigeration sheet of the present invention;

[0029] Figure 6 It is a schematic diagram of the clamping and locking assembly of the fish tank thermostat based on the semiconductor refrigeration sheet of the present invention;

[0030] Figure 7 It is a schematic diagram of the heat exchange plate of the fish tank thermostat based on the semiconductor refrigeration plate of the present invention;

[0031] Figure 8 This is a statistical diagram of the relationship between the cooling time of water bodies according to the present invention.

[0032] The reference numerals are as follows:

[0033] Coolant circulation assembly 1, liquid circulation box 11, liquid outlet 111, liquid inlet 112, water pump 12, radiator 13;

[0034] Semiconductor refrigeration component 2, semiconductor refrigeration sheet 21;

[0035] Heat exchange component 3, heat exchange plate 31, hook groove 311;

[0036] Temperature sensor 4;

[0037] Main control board 5;

[0038] Sealing member 6, embedded in groove 61;

[0039] The clamping and locking assembly 7 comprises a first clamping member 71 , a first hook rod 711 , a first maintaining rod 712 , a second clamping member 72 , a second hook rod 721 , a second maintaining rod 722 , and a locking member 73 . DETAILED DESCRIPTION

[0040] In order to more clearly and completely illustrate the technical solution of the present invention, the present invention is further described below in conjunction with the accompanying drawings.

[0041] Please refer to Figure 1-Figure 7 The present invention proposes a fish tank thermostat based on a semiconductor refrigeration sheet, comprising a cooling liquid circulation component 1, a semiconductor refrigeration component 2, a heat exchange component 3, a temperature sensor 4, and a main control board 5. The cooling liquid circulation component 1 comprises a semiconductor refrigeration sheet 21, a liquid circulation box 11, a pipeline, a water pump 12 and a radiator 13. The liquid circulation box 11 is respectively connected with the water pump 12 and the radiator 13 through pipelines, and can circulate the liquid. The liquid circulation box 11 can be made of all metal, or only the surface to which the semiconductor refrigeration component 2 is attached is made of metal material. The semiconductor refrigeration component 2 is attached to the outer surface of the liquid circulation box 11, and the heat exchange component 3 is attached to the outer surface of the semiconductor refrigeration component 2. The heat exchange component 3 is arranged on the side of the semiconductor refrigeration sheet 21 away from the liquid circulation box 11 to increase the heat exchange rate with water. The semiconductor refrigeration component 2, the heat exchange component 3, and the temperature sensor 4 are all put into the fish tank. The heat exchange component 3 is made of metal material and has good thermal conductivity. The other end of the fish tank 1, the semiconductor refrigeration component 2, and the temperature sensor 4 are all electrically connected to the main control board 5. The main control board 5 is connected to the main power supply or the battery power through the conductive wire to work. When the temperature in the fish tank detected by the temperature sensor 4 is higher or lower than the preset temperature, the main control board 5 switches the current direction of the semiconductor refrigeration component 2 to achieve heating or cooling, thereby ensuring that the water temperature in the fish tank is constant. The main control board 5 is provided with a current conversion module, which is connected to the semiconductor refrigeration component 2 through the conductive wire. The current conversion module is used to switch the current direction of the semiconductor refrigeration component 2, so that the conductive surface of the semiconductor refrigeration component 2 is cooled or heated; the surface of the liquid circulation box 11 not attached to the semiconductor refrigeration component 2 is insulated from the water by air or other low thermal conductivity insulation components; at least two surfaces of the liquid circulation box 11 are attached with the semiconductor refrigeration component 2, thereby increasing the heat exchange surface between the semiconductor refrigeration component 2 and the water, while reducing the heat exchange area between the liquid circulation box 11 and the water.

[0042] In this embodiment, the temperature is conducted by circulating the liquid in the cooling liquid circulation component 1. The cooling liquid circulation component 1 has the function of circulating the liquid in the liquid, which avoids the problem of impurity blockage or bacterial growth caused by using the water in the fish tank as the circulating water body. By attaching the semiconductor refrigeration component 2 to the liquid circulation box 11, the heating or cooling of the semiconductor refrigeration component 2 can be transmitted to the liquid circulation box 11. The temperature of one side of the semiconductor refrigeration component 2 is taken away by the liquid circulating in the liquid circulation box 11, so that the semiconductor refrigeration component 2 can work normally. The temperature of the water in the fish tank is detected by the temperature sensor 4, and the water in the fish tank is heat exchanged by the heat exchange component 3. When the temperature in the fish tank detected by the temperature sensor 4 is higher or lower than the preset temperature, the main control board 5 switches the current direction of the semiconductor refrigeration component 2 to achieve heating or cooling. When heating, the heat exchange component 3 is heated, that is, the water in the fish tank is heated. When cooling, the heat exchange component 3 is also cooled to cool the water in the fish tank, thereby ensuring that the water temperature in the fish tank is constant.

[0043] In summary, the fish tank thermostat based on semiconductor refrigeration chips adopts the technology of internal circulation heat conduction to effectively conduct heat to the fish tank to ensure the constant temperature effect of the fish tank for a long time.

[0044] In this embodiment, one end of the liquid circulation box 11 is connected and conducted with one end of the water pump 12 through a pipe, the other end of the water pump 12 is connected and conducted with one end of the radiator 13 through a pipe, the other end of the radiator 13 is connected and conducted with the other end of the liquid circulation box 11 through a pipe, and the water pump 12 and the radiator 13 are electrically connected to the main control board 5; before the coolant circulation component 1 is started, the liquid circulation box 11 needs to be filled with liquid, which can be filled with water or other coolant. Water can be selected for low cost. When the coolant circulation component 1 is started, if the heat exchange component 3 needs to be cooled, the semiconductor refrigeration The side of component 2 that is in contact with the liquid circulation box 11 generates heat, and the water pump 12 draws hot water from the liquid circulation box 11 and transports it to the radiator 13 for cooling, and then flows back to the liquid circulation box 11 to achieve internal circulation heat conduction. If the heat exchange component 3 needs to heat, the side of the semiconductor refrigeration component 2 that is in contact with the liquid circulation box 11 is cooled, and the water pump 12 draws cold water from the liquid circulation box 11 and transports it to the radiator 13 for heating. At this time, the radiator 13 does not need to start dissipating heat, and the temperature is increased by room temperature. The radiator 13 is not limited to a radiator radiator, but can also be a cold water radiator, etc.

[0045] Different accessory size conditions will affect the cooling efficiency of the fish tank. The present invention does not limit the size data of each component. When making it, the data of the semiconductor refrigeration component 2 will be adjusted according to the actual situation, such as the number of cooling plates, the thickness of the pipe, the area size of the heat sink, etc. For example, a fish tank with a height of 30*30*30cm uses 3 4*4cm cooling plates, 8mm diameter pipes, and 12*12cm heat sinks. In this embodiment, the heat sink is the above-mentioned radiator 13. For details, please refer to Figure 8 , which is a comparison table of the relationship between the temperature and time of the refrigerator of the present invention and the prior art in some time periods, and the comparison data tested every 10 minutes within 7.5 hours, the data of the present invention is the test data, and the data of the refrigerator of the prior art is the comparison reference data, Figure 8 It can be seen that at the beginning of the test, when the present invention was put into the water, the temperature of the water was about 28 degrees, and the temperature of the refrigerator of the prior art was about 26.4 degrees. After 20 minutes, the temperatures of the two were basically the same. It can be found that the cooling effect of the present invention is remarkable, while the cooling of the refrigerator of the prior art is relatively slow. For example, when the present invention was put into the water for 161 minutes, the temperature of the water after the present invention was put into the water was about 20 degrees, and the temperature of the water after the refrigerator of the prior art was 23.5 degrees. When the present invention was put into the water for 231 minutes, the temperature of the water was about 18 degrees, and the temperature of the refrigerator of the prior art was 22.1 degrees when the refrigerator of the prior art was put into the water for 231 minutes. When the present invention was put into the water for 341 minutes, the temperature of the water was about 16 degrees, and the temperature of the water when the refrigerator of the prior art was put into the water for 341 minutes was 20.9 degrees. Compared with the refrigerator of the prior art, the present invention has higher efficiency in cooling the water in the fish tank.

[0046] In this embodiment, a liquid outlet 111 is provided on the liquid circulation box 11, and the liquid outlet 111 is connected and conducted with one end of the water pump 12 through a pipe. The liquid outlet 111 is convenient for the pipe to be connected to the liquid circulation box 11, so that the liquid can be extracted from the liquid circulation box 11; a liquid inlet 112 is provided on the liquid circulation box 11, and the liquid inlet 112 is connected and conducted with one end of the radiator 13 through a pipe. The liquid inlet 112 is convenient for the pipe to be connected to the liquid circulation box 11, so that the liquid after temperature conduction can enter the liquid circulation box 11.

[0047] In this embodiment, the semiconductor refrigeration component 2 includes at least two groups of semiconductor refrigeration plates 21, each group of semiconductor refrigeration plates 21 is multiple, and the multiple semiconductor refrigeration plates 21 are arranged in sequence. Each group of semiconductor refrigeration plates 21 is electrically connected to the main control board 5, and each group of semiconductor refrigeration plates 21 is respectively attached to the two side surfaces of the liquid circulation box 11, and the heat exchange component 3 is respectively attached to the surface of each group of semiconductor refrigeration plates 21; if the liquid circulation box 11 is a rectangular structure, then the semiconductor refrigeration plates 21 are two groups, respectively attached to the opposite side surfaces of the liquid circulation box 11; if the liquid circulation box 11 is a polygonal prism structure, such as a hexagonal prism structure, then the semiconductor refrigeration plates 21 are three groups, respectively attached to the interval side surfaces of the liquid circulation box 11, and the arrangement of multiple semiconductor refrigeration plates 21 increases the heating or cooling efficiency of the heat exchange component 3.

[0048] In this embodiment, the heat exchange assembly 3 includes heat exchange plates 31, the same number as the semiconductor refrigeration plates 2, and one heat exchange plate 31 is attached to the surface of a group of semiconductor refrigeration plates 21; the heat exchange plates 31 are made of metal material and are used to conduct heat to the water in the fish tank. If the liquid circulation box 11 is a rectangular structure, there are two heat exchange plates 31; if the liquid circulation box 11 is a polygonal prism structure, such as a hexagonal prism structure, there are three heat exchange plates 31.

[0049] In this embodiment, the fish tank thermostat based on semiconductor refrigeration film also includes a seal 6, one side of the seal 6 is sleeved on one side of the liquid circulation box 11 to form a sealed and fixed connection, and the seal 6 is arranged around the periphery of multiple semiconductor refrigeration films 21 at the same time, and the other side of the seal 6 is sleeved on one side of the heat exchange film 31 to form a sealed and fixed connection; the seal 6 is used to seal the periphery of the semiconductor refrigeration film 21 to prevent water from seeping into the internal conductive wire and avoiding affecting the operation of the semiconductor refrigeration film 21. Since the semiconductor refrigeration film 21 generates heat on one side and cools on the other side when working, the setting of the seal 6 can also ensure that the working temperature of the semiconductor refrigeration film 21 is not directly transmitted from its side to the fish tank water, that is, the sides of multiple semiconductor refrigeration films 21 are kept warm, so that the temperature can only be transmitted from the heat exchange film 31 to the water, thereby improving the heat conduction efficiency of the heat exchange film 31.

[0050] In this embodiment, a plurality of embedding grooves 61 are provided in the sealing member 6, and the plurality of embedding grooves 61 are arranged in sequence, and the plurality of semiconductor cooling sheets 21 correspond to the plurality of embedding grooves 61 one by one, respectively. The semiconductor cooling sheets 21 are accommodated in the embedding grooves 61 and are tightly attached to the groove walls of the embedding grooves 61; the setting of the embedding grooves 61 is to facilitate the alignment and attachment of the semiconductor cooling sheets 21. When installing the semiconductor cooling sheets 21, it is necessary to first sleeve one side of the sealing member 6 on the side to be attached of the liquid circulation box 11, and then embed the semiconductor cooling sheet 21 into the embedding groove 61 after applying a thermal conductive agent and attach it to the side of the liquid circulation box 11. After the plurality of semiconductor cooling sheets 21 are respectively embedded in the embedding grooves 61 and attached, the thermal conductive agent is applied to the surface of the semiconductor cooling sheet 21 and the heat exchange sheet 31 is pressed and attached. At this time, the other side of the sealing member 6 will be sleeved on the heat exchange sheet 31 to seal the edge of the heat exchange sheet 31 and also fix the heat exchange sheet 31.

[0051] In this embodiment, the fish tank thermostat based on semiconductor refrigeration plate also includes at least two clamping and locking components 7, and the clamping and locking components 7 are in an X-shaped structure. One clamping and locking component 7 clamps one side of at least two heat exchange plates 31 to increase the fitting force between the heat exchange plate 31 and the semiconductor refrigeration plate 21; the clamping and locking components 7 clamp and fix two heat exchange plates 31 that are arranged in opposite positions or adjacent to each other, and the clamping force can be adjusted to the clamping and locking components 7 to increase the fitting force to the semiconductor refrigeration plate 21, so as to improve the heat transfer efficiency of the semiconductor refrigeration plate 21 to the heat exchange plate 31, and the X-shaped structure is convenient for workers to quickly pick up and clamp during assembly.

[0052] In this embodiment, the clamping and locking assembly 7 includes a first clamping member 71, a second clamping member 72, and a locking member 73. The first clamping member 71 and the second clamping member 72 are both D-shaped structures and have elastic force. One side of the first clamping member 71 is connected to one side of a heat exchange plate 31 by a hook claw, and one side of the second clamping member 72 is connected to one side of another heat exchange plate 31 by a hook claw. Both corners of one side of the first clamping member 71 are provided with a first hook rod 711, and the first hook rod 711 is arranged at a right angle to the first clamping member 71 and extends outward. Both corners of one side of the second clamping member 72 are provided with a second hook rod 721, and the second hook rod 721 is arranged at a right angle to the second clamping member 72 and extends outward. , two hook grooves 311 are provided on the left and right sides of the heat exchange plate 31, that is, one heat exchange plate 31 has a total of four hook grooves 311, the two first hook rods 711 are respectively connected with the two hook grooves 311 on the left side of one heat exchange plate 31 to form a hook claw connection, the two second hook rods 721 are respectively connected with the two hook grooves 311 on the right side of another heat exchange plate 31 to form a hook claw connection, the first clamping member 71 and the second clamping member 72 are symmetrically arranged, the locking member 73 passes through the middle part of the second clamping member 72 and the middle part of the first clamping member 71 in sequence, the locking member 73 is threadedly connected with the middle part of the first clamping member 71, and the knob locking member 73 can lock the middle part of the first clamping member 71 with the second clamping member 72. 2 are brought together, the locking member 73 is a screw, and the first clamping member 71 and the second clamping member 72 use their own elastic force to clamp the two sides of the two heat exchange plates 31; a first maintaining rod 712 is provided between the two first hook rods 711, and the first maintaining rod 712 is used to maintain the distance between the two first hook rods 711 to avoid deformation during the clamping process; a second maintaining rod 722 is provided between the two second hook rods 721, and the second maintaining rod 722 is used to maintain the distance between the two second hook rods 721 to avoid deformation during the clamping process; when clamping and fixing the adjacent or aligned heat exchange plates 31, the first hook rod 711 of the first clamping member 71 is first hooked into a heat exchange plate 31, and the heat exchange plate 31 is clamped and fixed. The heat exchange plate 31 is hooked into the hook groove 311 on the left side of the heat exchange plate 31, and then the second hook rod 721 of the second clamping member 72 is hooked into the hook groove 311 on the right side of the other heat exchange plate 31, and then the middle part of the first clamping member 71 and the middle part of the second clamping member 72 are tightened by the locking member 73 to bring them closer together. In the process of moving closer together, the first clamping member 71 and the second clamping member 72 will both produce elastic deformation, and the elastic deformation will cause the first hook rod 711 and the second hook rod 721 to simultaneously apply a force to move closer together to the two heat exchange plates 31, so as to increase the fitting force of the two heat exchange plates 31 to the semiconductor refrigeration plate 21, thereby improving the heat transfer efficiency of the semiconductor refrigeration plate 21 to the heat exchange plate 31.

[0053] Of course, the present invention may have many other implementations. Based on this implementation, other implementations obtained by ordinary technicians in this field without any creative work are all within the scope of protection of the present invention.

Claims

1. A fish tank thermostat based on semiconductor refrigeration sheet, characterized in that: It includes a coolant circulation component, a semiconductor refrigeration component, a temperature sensor, and a main control board. The coolant circulation component includes a semiconductor refrigeration sheet, a liquid circulation box, a pipeline, a water pump, and a radiator. The liquid circulation box is respectively connected to the water pump and the radiator through the pipeline, and can circulate the liquid. The semiconductor refrigeration component is arranged on the outer surface of the liquid circulation box. The semiconductor refrigeration component, the liquid circulation box, and the temperature sensor are all put into a fish tank. The semiconductor refrigeration component and the temperature sensor are electrically connected to the main control board. When the temperature in the fish tank detected by the temperature sensor is lower than or higher than the preset temperature, the main control board switches the current direction of the semiconductor refrigeration component to achieve heating or cooling, thereby ensuring that the water temperature in the fish tank is constant.

2. The fish tank thermostat based on semiconductor refrigeration sheet according to claim 1, characterized in that: The surface of the liquid circulation box not attached to the semiconductor refrigeration component and the water are insulated by air or a low thermal conductivity insulation member.

3. The fish tank thermostat based on semiconductor refrigeration sheet according to claim 1, characterized in that: It also includes a heat exchange component, which is arranged on a side of the semiconductor refrigeration plate away from the liquid circulation box.

4. The fish tank thermostat based on semiconductor refrigeration sheet according to claim 2, characterized in that: The semiconductor refrigeration components include at least two groups, which are respectively arranged on the sides of the liquid circulation box to increase the heat exchange area between the semiconductor refrigeration components and water.

5. The fish tank thermostat based on semiconductor refrigeration sheet according to claim 1, characterized in that: The semiconductor refrigeration component includes at least two groups of semiconductor refrigeration plates, each group of the semiconductor refrigeration plates includes multiple semiconductor refrigeration plates, and the multiple semiconductor refrigeration plates are arranged in sequence. Each group of the semiconductor refrigeration plates is electrically connected to the main control board, and each group of the semiconductor refrigeration plates is respectively attached to the two side surfaces of the liquid circulation box, and the heat exchange component is respectively arranged on the outside of each group of the semiconductor refrigeration plates.

6. The fish tank thermostat based on semiconductor refrigeration sheet according to claim 5, characterized in that: It also includes a seal, one side of which is sleeved on one side of the liquid circulation box to form a sealed and fixed connection. The seal is simultaneously arranged around the periphery of multiple semiconductor refrigeration plates. The heat exchange component includes the same number of heat exchange plates as the number of semiconductor refrigeration plates. One heat exchange plate corresponds to a group of semiconductor refrigeration plates. The other side of the seal is sleeved on one side of the heat exchange plate to form a sealed and fixed connection.

7. The fish tank thermostat based on semiconductor refrigeration sheet according to claim 6, characterized in that: The sealing component is provided with a plurality of embedding grooves, the plurality of embedding grooves are arranged in sequence, the plurality of semiconductor cooling sheets correspond to the plurality of embedding grooves one by one, respectively, the semiconductor cooling sheets are accommodated in the embedding grooves and are tightly attached to the groove walls of the embedding grooves.

8. The fish tank thermostat based on semiconductor refrigeration sheet according to claim 6, characterized in that: It also includes at least two clamping and locking assemblies, which are in an X-shaped structure. One of the clamping and locking assemblies clamps one side of at least two of the heat exchange plates to increase the fitting force between the heat exchange plate and the semiconductor refrigeration plate.

9. The fish tank thermostat based on semiconductor refrigeration sheet according to claim 8, characterized in that: The clamping and locking assembly includes a first clamping member, a second clamping member, and a locking member. The first clamping member and the second clamping member are both D-shaped and have elastic force. One side of the first clamping member is hooked to one side of one of the heat exchange plates, and one side of the second clamping member is hooked to one side of another heat exchange plate. The first clamping member and the second clamping member are symmetrically arranged. The locking member passes through the middle part of the second clamping member and the middle part of the first clamping member in sequence. The locking member is threadedly connected to the middle part of the first clamping member. The locking member can be turned to bring the middle part of the first clamping member and the middle part of the second clamping member closer together, so that the two sides of the two heat exchange plates are clamped by the elastic force of the first clamping member and the second clamping member themselves.

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