Germanium wafer cylindrical grinding machine grinding mechanism capable of recycling powder

Abstract

The invention discloses a powder recoverable germanium wafer cylindrical grinding machine grinding mechanism which comprises a device base, a clamping device and a grinding device, the clamping device is arranged on the right side of the upper portion of the device base, and the grinding device is arranged on the left side of the upper portion of the device base; the clamping device further comprises a swing arm device and a chuck device. The polishing device further comprises a polishing base and a dust recovery device. The device has the functions that a vertical placement grinding mode is adopted, the dust generation and diffusion range is changed to the vertical direction, and the device can conveniently recycle the dust; dust is collected in a spraying mode, meanwhile, excessive dust is prevented from being diffused into the air environment, the dust brought out through spraying is separated and then recycled, the dust diffusion range is reduced, and meanwhile the dust recycling efficiency is improved; a polishing structure capable of automatically adapting to the surface size of the attached wafer is added, and the polishing effect of the device on the wafers with different size differences is guaranteed.

Description

Technical Field

[0001] The invention belongs to the technical field of germanium wafer processing equipment, and in particular relates to a grinding mechanism of a germanium wafer cylindrical grinder with recyclable powder. Background Art

[0002] In the production process of germanium wafers, after cutting, the edges of the germanium wafers need to be polished to be round and smooth, and the burrs and unevenness on the edges of the wafers need to be polished away to ensure that the edges of the germanium wafers will not be broken or damaged in subsequent processes.

[0003] The prior art is as follows: Comparative Document 1: Chinese Patent (CN219837550U) discloses a grinding mechanism for a germanium wafer cylindrical grinder with recoverable powder, comprising a base, a mounting seat, a center seat, a rotating motor and a pressure chamber, wherein the upper end of the base is fixedly connected to the mounting seat, and the inner surface of the mounting seat is rotatably connected to the center seat, a rotating motor is fixedly installed inside the base, a side plate is fixedly provided on the side surface of the base, a grinding hydraulic rod is fixedly installed on the upper end of the side plate, and a grinding plate is fixedly installed on one end of the grinding hydraulic rod.

[0004] With this solution, when the grinding plate is grinding the wafer, the dust generated by grinding the outer edge of the wafer will be diffused outward from both sides near the tangent of the rotating circle due to the rotation, and then the remaining kinetic energy on the dust will push the dust to a place farther away from the central seat for collecting dust on the horizontal plane, thereby increasing the dust diffusion range and making it more difficult for the device to recover the dust. Secondly, the central seat of the mechanism absorbs the dust generated by grinding through negative pressure absorption. When the dust diffusion range is large, most of the dust cannot be recovered, resulting in low dust recovery efficiency.

[0005] Comparative Document 2: Chinese Patent (CN113579891A) discloses a wafer stacking and polishing device and a stacking and polishing method thereof, which enables the punched wafers to automatically fall onto the upper part of the first turntable after being conveyed by a conveyor belt. When the stacking is completed, the upper connecting plate moves downward, so that the upper limit sleeve cooperates with the upper limit of the limit column, and the limit column is driven by the limit sleeve to rotate 90 degrees, so that the frosted layer of the limit column faces inward, so that the second turntable and the first turntable clamp the stacked wafers, and by driving the second turntable to rotate, all the stacked wafers can be driven to rotate together, so that the edge of the wafer and the frosted layer of the limit column produce sliding friction, thereby achieving the purpose of polishing the burrs on the edge of the wafer.

[0006] In this way, the edge of the wafer is polished by the limit column, but in the actual production process of germanium wafers, the edges of different germanium wafers will have a certain range of errors in the cutting size. The same polishing angle and polishing distance will cause uneven polishing effects on the wafers. The edges of larger wafers are prone to excessive wear and cause material waste, and the edges of smaller wafers are not polished properly. These situations will lead to a decrease in the yield of germanium wafers after processing.

[0007] In summary, the above-mentioned prior art has the following defects: 1. When the grinding plate grinds the edge of the wafer, a dust diffusion area appears in the horizontal direction, and the dust is affected by the rotation of the wafer, which increases the diffusion range of the dust and increases the difficulty of dust recovery by the device; 2. Dust is recovered by negative pressure suction. When the dust diffusion range is large, it is difficult to recover the dust efficiently and quickly; 3. The edge sizes of different germanium wafers will be different, and they cannot automatically adapt to the surfaces of different wafers during grinding, which will lead to uneven grinding effects between different wafers, affecting the yield rate of the germanium wafers after processing.

[0008] To this end, this paper provides a grinding mechanism for a germanium wafer cylindrical grinder with recyclable powder. Summary of the invention

[0009] In order to solve the above technical problems, the present invention discloses a grinding mechanism for a germanium wafer cylindrical grinder with recoverable powder. The device adopts a vertical placement grinding method to transform the range of dust generation and diffusion to the vertical direction, which is convenient for the device to recover the dust; the dust is collected by spraying, while preventing excessive dust from diffusing into the air environment, and the dust brought out by the spraying is recovered after separation, which reduces the dust diffusion range and increases the efficiency of dust recovery; a grinding structure that automatically adapts to the surface size of the wafer is added to ensure the grinding effect of the device on wafers of different sizes.

[0010] In order to achieve the above-mentioned technical effect, the present invention provides a grinding mechanism for a germanium wafer cylindrical grinder with recoverable powder, comprising a device base, a clamping device, and a grinding device, wherein the clamping device is arranged on the right side above the device base, and the grinding device is arranged on the left side above the device base; the clamping device also includes a swing arm device and a chuck device, the swing arm devices are respectively arranged on the front and rear sides of the germanium wafer above the device base, and the chuck devices are respectively arranged on the front end of the left side of the swing arm device; the grinding device also includes a grinding base and a dust recovery device, the grinding base that automatically adapts to the size of the germanium wafer is arranged below the germanium wafer, and the dust recovery device is arranged on the left side of the grinding base.

[0011] Preferably, the swing arm device also includes a telescopic cylinder, a connecting rod, a mounting seat, and a sliding cylinder. The connecting rod is arranged above the device base and the right end of the connecting rod is hinged to the device base. The telescopic cylinder is arranged above the connecting rod and the left end of the telescopic cylinder is hinged to the middle part of the connecting rod. The right end of the connecting rod is hinged to the right end of the device base. The mounting seat is arranged at the left end of the connecting rod. The sliding cylinder is arranged above the mounting seat. The telescopic cylinder and the sliding cylinder are connected to the control bronchial pipe of the workshop through a hose.

[0012] Preferably, the chuck device also includes a suction cup base, a sponge suction cup, a rack, a drive motor, and a gear. The suction cup base is arranged above the slide cylinder, the sponge suction cup is arranged behind the suction cup base and the sponge suction cup and the suction cup base are sealed and slidably connected, the rack is arranged on the front end side of the sponge suction cup, the drive motor is arranged on the right side of the suction cup base, the gear is arranged at the rear output end of the drive motor and meshes with the rack, the suction cup base and the sponge suction cup are internally connected by a cavity, and the suction cup base and the control branch pipe of the workshop are connected by a hose.

[0013] Preferably, the polishing base also includes a polishing layer, a porous base, an air cavity, and an exhaust valve. The polishing layer is arranged above the porous base, the air cavity is arranged on the right side of the porous base, the exhaust valve is arranged on the right side of the air cavity and is connected to the air cavity through a hose, and the right side of the exhaust valve is connected to the workshop control bronchus through a hose.

[0014] Preferably, the porous base is provided with flexible pores distributed parallel to the germanium wafer.

[0015] Preferably, the dust recovery device also includes a spray device, a water diverter, a water retaining bucket, a water storage tank, a recovery base, a waste water tank, and a cleaning plate. The spray device is respectively arranged on both sides above the grinding base, the water diverter is arranged on the left side of the grinding base, the water retaining bucket is arranged on the right side of the grinding base, the water storage tank is arranged on the left side of the water diverter, the recovery base is arranged on the left side of the water diverter, the waste water tank is arranged on the left side of the recovery base, and the cleaning plates are respectively arranged on the left and right sides of the germanium wafer, and the right end of the spray device is connected to the water branch pipe of the workshop.

[0016] Preferably, the right side of the water retaining bucket is lifted upward.

[0017] Preferably, the recovery base further comprises a mounting base, an adsorption plate and a grab plate. The adsorption plates are respectively arranged above the mounting base and are slidably connected to the mounting base via a slide groove, and the grab plates are respectively arranged on the front and rear sides of the adsorption plate.

[0018] Preferably, the surface of the adsorption plate is made of porous silica gel plate material.

[0019] Compared with the prior art, the present invention has the following beneficial effects: The device includes a device base, a clamping device, and a grinding device. The clamping device vertically clamps the wafer and then grinds the edge through the grinding device below. The vertical placement and grinding method is adopted to change the range of dust generation and diffusion to the vertical direction, so that the device can recover the dust. While grinding, the spray device sprays water mist above the grinding base to adsorb and degrade the dust generated by grinding onto the grinding device, and then separates and recovers it to the left along the recovery device to prevent excessive dust from diffusing into the air environment, reduce the dust diffusion range, and increase the efficiency of dust recovery. In the process of replacing the wafer that needs to be polished, the grinding base can repeatedly reset the fitting state and automatically adapt to the grinding structure that fits the surface size of the wafer to ensure the grinding effect of the device on wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a front view of the present invention; Figure 2 It is a left side view of the present invention; Figure 3 yes Figure 2 Sectional view of section a; Figure 4 yes Figure 3 Partial schematic diagram of middle b; Figure 5 is an isometric view of the present invention; Figure 6 yes Figure 5 Partial schematic diagram of middle c; Figure 7 yes Figure 5 Partial schematic diagram of middle d; Figure 8 It is a schematic diagram of the internal structure of the porous base in the present invention; In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Device base; 2. Swing arm device; 3. Chuck device; 4. Grinding base; 5. Dust recovery device; 6. Telescopic cylinder; 7. Connecting rod; 8. Mounting seat; 9. Slide cylinder; 10. Suction cup base; 11. Sponge suction cup; 12. Rack; 13. Drive motor; 14. Gear; 15. Grinding layer; 16. Porous base; 17. Air cavity; 18. Exhaust valve; 19. Air hole; 20. Spraying device; 21. Water diversion bucket; 22. Water retaining bucket; 23. Water storage tank; 24. Recovery base; 25. Wastewater tank; 26. Cleaning plate; 27. Mounting base; 28. Adsorption plate; 29. ​​Grasping plate; 30. Germanium wafer. DETAILED DESCRIPTION

[0021] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0022] Therefore, the inventor provides a powder-recoverable germanium wafer external cylindrical grinder grinding mechanism, comprising a device base 1, a clamping device, and a grinding device, wherein the clamping device is arranged on the upper right side of the device base 1, and the grinding device is arranged on the upper left side of the device base 1; the clamping device also includes a swing arm device 2 and a chuck device 3, the swing arm device 2 is respectively arranged on the front and rear sides of the germanium wafer 30 above the device base 1, and the chuck device 3 is respectively arranged on the left front end of the swing arm device 2; the grinding device also includes a grinding base 4 and a dust recovery device 5, the grinding base 4 which automatically adapts to the size of the germanium wafer 30 is arranged below the germanium wafer 30, and the dust recovery device 5 is arranged on the left side of the grinding base 4.

[0023] By adopting the above scheme, the clamping device vertically clamps the germanium wafer 30 to be polished from both sides of the germanium wafer 30, and squeezes the germanium wafer 30 downward and fixes it above the polishing device. The germanium wafer 30 presses the polishing base 4 downward, and the air cavity 17 in the polishing base 4 is squeezed by the germanium wafer 30 to discharge gas, so that the polishing layer 15 above the air cavity 17 can automatically adapt to fit the germanium wafer 30, and then the chuck device 3 set on the clamping device drives the germanium wafer 30 to rotate, so that the edge of the germanium wafer 30 is polished on the polishing device below. This vertical placement and polishing method transforms the range of dust generation and diffusion to the vertical direction. The dust generated by the polishing is deposited downward in the vertical direction under the action of initial power and gravity, reducing the dust diffusion range and facilitating the device to recover the dust; while the polishing device drives the germanium wafer 30 to polish, the dust recovery device 5 sprays water mist at the position where the germanium wafer 30 contacts the polishing base 4 to generate dust, and the dust to be diffused is settled down, and the dust carried by the water mist moves downward along the germanium wafer 30 The wastewater is collected and flows into the water storage tank 23 to the left. After the kinetic energy is weakened, it slowly flows out and flows through the recovery base 24 to the right. The wastewater is separated into dust and wastewater under the separation of the recovery base 24. The dust remains on the recovery base 24, and the wastewater flows into the wastewater tank 25. The dust accumulated on the recovery base 24 can be replaced and cleaned after a period of time. This dust recovery method collects dust by spraying, and prevents excessive dust from diffusing into the air environment. The dust brought out by the spraying is recovered after separation, which reduces the dust diffusion range and increases the efficiency of dust recovery. After the polishing of the germanium wafer 30 is completed, the clamping device is lifted up, and the operator opens and replaces the new germanium wafer 30 to be polished. At the same time, the air cavity 17 in the polishing base 4 is automatically inflated to restore the polishing base 4 to its initial state. Then, according to the same steps, the new germanium wafer 30 is bonded and polished here. In this way, in each polishing process, the polishing base 4 bucket can automatically adapt to the bonding wafer surface size to ensure the polishing effect of the device on wafers of different sizes.

[0024] Further, the swing arm device 2 also includes a telescopic cylinder 6, a connecting rod 7, a mounting seat 8, and a slide cylinder 9. The connecting rod 7 is arranged above the device base 1 and the right end of the connecting rod 7 is hinged to the device base 1. The telescopic cylinder 6 is arranged above the connecting rod 7 and the left end of the telescopic cylinder 6 is hinged to the middle of the connecting rod 7. The right end of the connecting rod 7 is hinged to the right end of the device base 1. The mounting seat 8 is arranged at the left end of the connecting rod 7. The slide cylinder 9 is arranged above the mounting seat 8. The telescopic cylinder 6 and the slide cylinder 9 are connected to the control bronchial pipe (not shown in the figure) of the workshop through a hose (not shown in the figure); Among them, the telescopic cylinder 6 is lifted up and down in the axial direction by the telescopic control connecting rod 7 with the connection between the connecting rod 7 and the device base 1 as the axis, and the connecting rod 7 drives the telescopic cylinder 6 on the mounting seat 8 to perform lifting and lowering movements. The telescopic cylinder 6 is used to telescopically control the front end clamping device 3 to clamp and release the germanium wafer 30.

[0025] Furthermore, the chuck device 3 also includes a suction cup base 10, a sponge suction cup 11, a rack 12, a drive motor 13, and a gear 14. The suction cup base 10 is arranged above the slide cylinder 9, the sponge suction cup 11 is arranged behind the suction cup base 10, and the sponge suction cup 11 and the suction cup base 10 are sealed and slidably connected, the rack 12 is arranged on the front side of the sponge suction cup 11, the drive motor 13 is arranged on the right side of the suction cup base 10, the gear 14 is arranged at the output end of the rear side of the drive motor 13 and meshes with the rack 12, the suction cup base 10 and the sponge suction cup 11 are connected internally by a cavity, and the suction cup base 10 is connected to the control branch pipe (not shown in the figure) of the workshop through a hose (not shown in the figure); Among them, the suction cup base 10 receives a gas control signal, and a vacuum is drawn by a vacuum generator (not shown in the figure) in the device control system, and is connected to the internal cavity of the suction cup base 10 to draw a vacuum inside the contact surface between the sponge suction cup 11 and the germanium wafer 30, so that the sponge suction cups 11 on both sides of the germanium wafer 30 can suck the germanium wafer 30, and then the driving motor 13 drives the gear 14 at the output end to rotate, so that the rack 12 can drive the sponge suction cup 11 to rotate on the suction cup base 10, thereby providing power for grinding the germanium wafer 30.

[0026] Furthermore, the polishing base 4 further includes a polishing layer 15, a porous base 16, an air cavity 17, and an exhaust valve 18. The polishing layer 15 is arranged above the porous base 16, the air cavity 17 is arranged on the right side of the porous base 16, the exhaust valve 18 is arranged on the right side of the air cavity 17 and is connected to the air cavity 17 through a hose, and the right side of the exhaust valve 18 is connected to the workshop control bronchus through a hose; Among them, the polishing layer 15 can change its shape by inflating the porous base 16 with gas injected into the air cavity 17 by the exhaust valve 18. When the polishing layer 15 is subjected to the pressure of the germanium wafer 30, the exhaust valve 18 stops intake of air, and the gas squeezed out of the porous base 16 is discharged to the side of the exhaust valve 18 through the air cavity 17, so that the polishing layer 15 is deformed and fits the edge surface of the germanium wafer 30; after the polishing is completed and the polishing layer 15 is no longer subjected to the pressure of the germanium wafer 30, the exhaust valve 18 is opened and the cavity is inflated again, so that the porous base 16 drives the polishing layer 15 to restore to its initial state without pressure, and then a new germanium wafer 30 is replaced and the above steps are repeated to achieve a polishing structure that automatically adapts to the size of the wafer surface, thereby ensuring the polishing effect of the device on wafers of different sizes.

[0027] Further, the porous base 16 is provided with flexible pores 19 distributed parallel to the germanium wafer 30; Among them, the flexible pores 19 will shrink and deflate when under pressure, and the gas will be discharged into the air cavity 17 and then discharged through the exhaust valve 18. During the process of replacing the germanium wafer 30, the air cavity 17 will re-inflate the flexible pores 19, and the flexible pores 19 will inflate and rebound to restore their initial state.

[0028] Further, the dust recovery device 5 also includes a spray device 20, a water diversion bucket 21, a water retaining bucket 22, a water storage tank 23, a recovery base 24, a waste water tank 25, and a cleaning plate 26. The spray device 20 is respectively arranged on both sides above the grinding base 4, the water diversion bucket 21 is arranged on the left side of the grinding base 4, the water retaining bucket 22 is arranged on the right side of the grinding base 4, the water storage tank 23 is arranged on the left side of the water diversion bucket 21, the recovery base 24 is arranged on the left side of the water diversion bucket 21, the waste water tank 25 is arranged on the left side of the recovery base 24, and the cleaning plate 26 is respectively arranged on the left and right sides of the germanium wafer 30, and the right end of the spray device 20 is connected to the water branch pipe of the workshop; Among them, the spray device 20 sprays water mist toward the polishing part when the germanium wafer 30 is rotated and polished. The water mist absorbs and settles the dust generated by the rotation and polishing of the germanium wafer 30, and produces a water mist barrier on the dust diffusion path to prevent the dust from continuing to spread. The sewage generated by the water mist dust removal is blocked and collected by the polishing layer 15 and the water retaining bucket 22, and is introduced into the water storage tank 23 through the water diversion bucket 21. The sewage is collected in the water storage tank 23 and then slowly flows out from the outlet on the left side of the water storage tank 23. After separation and treatment by the recovery base 24, the dust in the sewage remains above the recovery base 24, and the wastewater flows into the wastewater tank 25. In the process of dust recovery, the cleaning plate 26 cleans the residual water on the wetted germanium wafer 30. In this way, the dust is collected by spraying, and at the same time, too much dust is prevented from diffusing into the air environment. The dust brought out by the spraying is recovered after separation, which reduces the dust diffusion range and increases the efficiency of dust recovery.

[0029] Further, the right side of the water retaining bucket 22 is lifted upward; The raised water retaining bucket 22 can effectively block and collect the sewage ejected due to the rotation of the germanium wafer 30 .

[0030] Furthermore, the recovery base 24 further includes a mounting base 27, a suction plate 28, and a grab plate 29. The suction plates 28 are respectively arranged above the mounting base 27 and are slidably connected to the mounting base 27 through a slide groove. The grab plates 29 are respectively arranged on the front and rear sides of the suction plate 28. Among them, the sewage slowly flows from the water storage tank 23 to the top of the adsorption plate 28, and the dust in the sewage remains on the upper surface of the adsorption plate 28 under the adsorption of the surface material of the adsorption plate 28. After being adsorbed and separated by multiple adsorption plates 28, the wastewater is discharged into the wastewater tank 25. When the adsorption plate 28 is used for a period of time, when the germanium wafer 30 is replaced in the device, the adsorption plate 28 can be taken out and replaced from the mounting base 27 through the grab plate 29. The adsorption plate 28 with adsorbed dust can be recycled after drying and recovering the dust.

[0031] Furthermore, the surface of the adsorption plate 28 is composed of a porous silica gel plate material; Among them, porous silica gel material can effectively absorb dust particles in sewage.

[0032] To summarize, the device includes a device base 1, a clamping device, and a polishing device. The clamping device vertically clamps the wafer and then polishes the edge through the polishing device below. The vertical placement and polishing method is adopted to transform the range of dust generation and diffusion to the vertical direction, so that the device can recover the dust. While polishing, the spray device 20 sprays water mist above the polishing base 4 to adsorb and degrade the dust generated by the polishing onto the polishing device, and then separates and recovers it to the left along the recovery device to prevent excessive dust from diffusing into the air environment, thereby reducing the dust diffusion range and increasing the efficiency of dust recovery. In the process of replacing the wafer to be polished, the polishing base 4 can repeatedly reset the bonding state and automatically adapt to the polishing structure that fits the surface size of the wafer to ensure the polishing effect of the device on wafers of different sizes.

[0033] Working principle of the present invention: When the device starts to polish the germanium wafer 30, the clamping device vertically clamps the germanium wafer 30 to be polished from both sides of the germanium wafer 30, and the telescopic cylinder 6 is lifted up and down in the axial direction by the telescopic control connecting rod 7 with the connection between the connecting rod 7 and the device base 1 as the axis, and the connecting rod 7 drives the telescopic cylinder 6 on the mounting seat 8 to do lifting and lowering movements. The telescopic cylinder 6 is used to telescopically control the chuck device 3 at the front end to clamp the germanium wafer 30. The suction cup base 10 receives the gas control signal, and the vacuum generator in the device control system draws a vacuum, and is connected to the internal cavity of the suction cup base 10 to connect the sponge suction cup 11 to the germanium wafer. The contact surface of the germanium wafer 30 is vacuumed, so that the sponge suction cups 11 on both sides of the germanium wafer 30 can suck the germanium wafer 30, and then the driving motor 13 drives the gear 14 at the output end to rotate, so that the rack 12 can drive the sponge suction cup 11 to rotate on the suction cup base 10, thereby providing power for grinding the germanium wafer 30. This vertical placement grinding method changes the range of dust generation and diffusion to the vertical direction. The dust generated by grinding is deposited downward in the vertical direction under the action of initial power and gravity, reducing the diffusion range of the dust, which is convenient for the dust recovery device 5 to recover the dust; The lower edge of the germanium wafer 30 is attached to the polishing base 4, and the polishing layer 15 can be changed in shape by inflating the porous base 16 with gas injected into the air cavity 17 through the exhaust valve 18. When the polishing layer 15 is subjected to the pressure of the germanium wafer 30, the exhaust valve 18 stops the intake of gas, and the flexible pores 19 in the porous base 16 contract and release gas when subjected to pressure. The gas is discharged into the air cavity 17 and then discharged through the exhaust valve 18, so that the polishing layer 15 is deformed and adheres to the edge surface of the germanium wafer 30; While the grinding device drives the germanium wafer 30 to grind, the dust recovery device 5 sprays water mist at the position where the germanium wafer 30 contacts the grinding base 4 and generates dust. The water mist absorbs and settles the dust generated by the rotation and grinding of the germanium wafer 30, and produces a water mist barrier on the dust diffusion path to prevent the dust from continuing to spread. The sewage generated by the water mist dust removal is blocked and collected by the grinding layer 15 and the water retaining bucket 22. The water retaining bucket 22 can effectively block and collect the sewage ejected due to the rotation of the germanium wafer 30, and introduce it into the water storage tank 23 through the water diversion bucket 21. The sewage is collected in the water storage tank 23 and then slowly flows out from the outlet on the left side of the water storage tank 23. The dust in the sewage is retained on the upper surface of the adsorption plate 28 under the adsorption of the surface material of the porous silica gel material. After passing through multiple sheets After the adsorption and separation of the adsorption plate 28, the waste water is discharged into the waste water tank 25. When the adsorption plate 28 is used for a period of time, when the germanium wafer 30 is replaced in the device, the adsorption plate 28 can be taken out from the mounting base 27 and replaced by the grab plate 29. The adsorption plate 28 adsorbed with dust can be further recycled after drying and recovering the dust. The dust in the sewage remains above the recovery base 24, and the waste water flows into the waste water tank 25. In the process of dust recovery, the cleaning plate 26 cleans the residual water on the wetted germanium wafer 30. In this way, the dust is collected by spraying, and at the same time, too much dust is prevented from spreading into the air environment. The dust brought out by the spraying is recovered after separation, which reduces the dust diffusion range and increases the efficiency of dust recovery. After the grinding is completed, the telescopic cylinder 6 drives the connecting rod 7 to lift the germanium wafer 30. After the grinding is completed, when the grinding layer 15 is no longer subjected to the pressure of the germanium wafer 30, the air cavity 17 re-inflates the flexible air hole 19, and the flexible air hole 19 rebounds after inflation to restore the initial state. After that, a new germanium wafer 30 is replaced and the above steps are repeated to achieve a grinding structure that automatically adapts to the size of the wafer surface, thereby ensuring the grinding effect of the device on wafers of different sizes. At this point, the working principle of the device has been described.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A grinding mechanism for a germanium wafer cylindrical grinder with recyclable powder, comprising a device base (1), a clamping device, and a grinding device, wherein the clamping device is arranged on the right side above the device base (1), and the grinding device is arranged on the left side above the device base (1), characterized in that: The clamping device further comprises a swing arm device (2) and a chuck device (3), wherein the swing arm device (2) is respectively arranged on the front and rear sides of the germanium wafer (30) above the device base (1), and the chuck device (3) is respectively arranged at the front end of the left side of the swing arm device (2); the polishing device further comprises a polishing base (4) and a dust recovery device (5), wherein the polishing base (4) which automatically adapts to the size of the germanium wafer (30) is arranged below the germanium wafer (30), and the dust recovery device (5) is arranged on the left side of the polishing base (4).

2. The grinding mechanism of a germanium wafer cylindrical grinder with recoverable powder according to claim 1, characterized in that: The swing arm device (2) further comprises a telescopic cylinder (6), a connecting rod (7), a mounting seat (8), and a slide cylinder (9); the connecting rod (7) is arranged above the device base (1) and the right end of the connecting rod (7) is hingedly connected to the device base (1); the telescopic cylinder (6) is arranged above the connecting rod (7) and the left end of the telescopic cylinder (6) is hingedly connected to the middle part of the connecting rod (7); the right end of the connecting rod (7) is hingedly connected to the right end of the device base (1); the mounting seat (8) is arranged at the left end of the connecting rod (7); the slide cylinder (9) is arranged above the mounting seat (8); and the telescopic cylinder (6) and the slide cylinder (9) are connected to the control bronchial pipe of the workshop via a hose.

3. The grinding mechanism of a germanium wafer cylindrical grinder with recoverable powder according to claim 1, characterized in that: The chuck device (3) further comprises a suction cup base (10), a sponge suction cup (11), a rack (12), a drive motor (13), and a gear (14); the suction cup base (10) is arranged above the slide cylinder (9); the sponge suction cup (11) is arranged behind the suction cup base (10) and the sponge suction cup (11) and the suction cup base (10) are sealed and slidably connected; the rack (12) is arranged on the front side of the sponge suction cup (11); the drive motor (13) is arranged on the right side of the suction cup base (10); the gear (14) is arranged at the output end of the rear side of the drive motor (13) and meshes with the rack (12); the suction cup base (10) and the sponge suction cup (11) are connected internally by a cavity and the suction cup base (10) and the control branch pipe of the workshop are connected by a hose.

4. The grinding mechanism of a germanium wafer cylindrical grinder with recoverable powder according to claim 1, characterized in that: The polishing base (4) further comprises a polishing layer (15), a porous base (16), an air cavity (17), and an exhaust valve (18), wherein the polishing layer (15) is arranged above the porous base (16), the air cavity (17) is arranged on the right side of the porous base (16), the exhaust valve (18) is arranged on the right side of the air cavity (17) and is connected to the air cavity (17) via a hose, and the right side of the exhaust valve (18) is connected to a workshop control bronchial pipe via a hose.

5. The grinding mechanism of a germanium wafer cylindrical grinder with recoverable powder according to claim 4, characterized in that: The porous base (16) is provided with flexible pores (19) distributed parallel to the germanium wafer (30).

6. The grinding mechanism of a germanium wafer cylindrical grinder with recoverable powder according to claim 1, characterized in that: The dust recovery device (5) further comprises a spray device (20), a water diversion bucket (21), a water retaining bucket (22), a water storage tank (23), a recovery base (24), a waste water tank (25), and a cleaning plate (26). The spray device (20) is respectively arranged on both sides above the grinding base (4), the water diversion bucket (21) is arranged on the left side of the grinding base (4), the water retaining bucket (22) is arranged on the right side of the grinding base (4), the water storage tank (23) is arranged on the left side of the water diversion bucket (21), the recovery base (24) is arranged on the left side of the water diversion bucket (21), the waste water tank (25) is arranged on the left side of the recovery base (24), and the cleaning plate (26) is respectively arranged on the left and right sides of the germanium wafer (30). The right end of the spray device (20) is connected to the water branch pipe of the workshop.

7. The grinding mechanism of a germanium wafer cylindrical grinder with recoverable powder according to claim 6, characterized in that: The right side of the water retaining bucket (22) is lifted upward.

8. The grinding mechanism of a germanium wafer cylindrical grinder with recoverable powder according to claim 6, characterized in that: The recovery base (24) further comprises a mounting base (27), an adsorption plate (28), and a grab plate (29); the adsorption plates (28) are respectively arranged above the mounting base (27) and are slidably connected to the mounting base (27) via a slide groove; and the grab plates (29) are respectively arranged on the front and rear sides of the adsorption plate (28).

9. The grinding mechanism for a germanium wafer cylindrical grinder with recoverable powder according to claim 8, characterized in that: The surface of the adsorption plate (28) is composed of a porous silica gel plate material.

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