Film coating device for packaging high-end chip of integrated circuit

Abstract

The invention belongs to the technical field of chip processing, and particularly relates to a film coating device for packaging a high-end chip of an integrated circuit, which comprises a rack, a film feeding mechanism arranged at the top of the rack, a film coating mechanism arranged above the film feeding mechanism, and a lifting mechanism arranged below the film feeding mechanism and used for lifting a wafer, the film laminating mechanism comprises a first lifting assembly, a mounting plate and a film pressing and cutting assembly, the film pressing and cutting assembly is rotatably connected to the mounting plate, the film pressing and cutting assembly is connected with a power device for driving the film pressing and cutting assembly to rotate, and the first lifting assembly is connected with the mounting plate to drive the film pressing and cutting assembly to ascend and descend; the film pressing and cutting assembly comprises a cutting assembly, the film pressing and cutting assembly moves downwards to abut against the film material below the film pressing and cutting assembly to cover the wafer, the film pressing and cutting assembly rotates to drive the cutting assembly to move in the circumferential direction of the periphery of the wafer to cut the film material, the cut film material covers the surface of the wafer, automatic wafer film covering is achieved, and the wafer production and processing efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing, and in particular relates to a coating device for packaging high-end integrated circuit chips. Background Art

[0002] Electronic products are one of the common products in our lives. The main controller in electronic products is the integrated circuit. There are many ways to classify integrated circuits. According to whether the circuit is analog or digital, it can be divided into: analog integrated circuits, digital integrated circuits and mixed-signal integrated circuits. The processing procedures of integrated circuits include photolithography, etching, thin film (chemical vapor deposition or physical vapor deposition), doping (thermal diffusion or ion implantation), and chemical mechanical planarization CMP. After the chip is produced, it is often necessary to coat the back of the chip to protect the main structure of the chip.

[0003] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer; various circuit component structures can be processed on the silicon wafer to become an integrated circuit product with specific electrical functions. In the wafer production process, the finished product needs to be filmed for protection. The existing technology generally uses manual filming, which is not only slow, but also has high labor costs. In the filming process, it is easy to appear offset, damaged, uneven, and have bubbles, which affect the filming effect. In particular, in the existing filming technology, the film material is scraped flat after it contacts the wafer surface, and the film material is attached to the wafer. This is very easy to cause wafer damage for thinner wafers, and the degree of adhesion between the film material and the wafer is not good. For this reason, an improved film laminating device for high-end integrated circuit chip packaging has been designed. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the present invention provides a coating device for high-end integrated circuit chip packaging to solve the above-mentioned problems in the background technology.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: A film laminating device for high-end integrated circuit chip packaging, comprising a frame, a film feeding mechanism installed on the top of the frame, a film laminating mechanism arranged above the film feeding mechanism, and a lifting mechanism arranged below the film feeding mechanism for lifting a wafer; The film laminating mechanism comprises a first lifting assembly, a mounting plate and a film pressing and cutting assembly, wherein the film pressing and cutting assembly is rotatably connected to the mounting plate, the film pressing and cutting assembly is connected to a power device driving the film pressing and cutting assembly to rotate, and the first lifting assembly is connected to the mounting plate to drive the film pressing and cutting assembly to move up and down; The film pressing and cutting assembly comprises a cutting assembly, which moves downward to cover the film material below the wafer, and the film pressing and cutting assembly rotates to drive the cutting assembly to move circumferentially around the periphery of the wafer to cut the film material.

[0006] Furthermore, the film pressing and cutting assembly also includes a central rotating shaft, a spherical block is arranged at the bottom of the central rotating shaft, a hollow connecting rod is connected to the upper part of the central rotating shaft, the cutting assembly is connected to the hollow connecting rod, and the rotation of the central rotating shaft drives the cutting assembly to rotate through the hollow connecting rod.

[0007] Furthermore, a plurality of connecting shafts are connected to the outer periphery of the spherical block, a film pressing roller sleeve is arranged on the connecting shaft, a rubber wheel is connected to the end of the connecting shaft, and a first spring is arranged between the film pressing roller sleeve and the rubber wheel.

[0008] Furthermore, the connecting shaft is inserted into the interior of the laminating roller sleeve, and the laminating roller sleeve is movable relative to the connecting shaft.

[0009] Furthermore, the plurality of connecting shafts are arranged in a ring array, and the axes of the connecting shafts do not intersect with the virtual vertical center line of the spherical block.

[0010] Furthermore, the central rotating shaft is a hollow structure, and a central pressure rod that can be raised and lowered is arranged inside the central rotating shaft. The bottom of the central pressure rod is connected to a hemispherical block, and the top of the central pressure rod is connected to a truncated cone-shaped top block. The inside of the spherical block is provided with a channel for the central pressure rod to pass through. In the initial state, the hemispherical block is exposed outside the spherical block.

[0011] Further, the cutting assembly includes a movable plate, a first connecting frame, and a cutter, the middle part of the movable plate is hinged on the first connecting frame, the first connecting frame is fixedly connected to the hollow connecting rod, the cutter is vertically fixedly connected to the middle part of the movable plate, the upper end of the movable plate is hinged to the second connecting frame, and the second connecting frame is connected to the hinge rod; A horizontal connecting rod is horizontally arranged inside the hollow connecting rod, one end of the horizontal connecting rod extends into the central rotating shaft and is connected to a wedge block, the hinge rod passes through the hollow connecting rod and is hinged to the other end of the horizontal connecting rod, the central pressure rod moves upward and moves upward through the cooperation of the top block and the wedge block against the horizontal connecting rod, the horizontal connecting rod drives the movable plate to rotate through the hinge rod and the second connecting frame, so that the cutter rotates to one side of the wafer close to the film material.

[0012] Furthermore, a second spring is arranged between the horizontal connecting rod and the inner wall of the hollow connecting rod.

[0013] Furthermore, the outer wall of the center pressure rod is connected to a second connecting piece, the inner wall of the center rotating shaft is provided with a first connecting piece, the second connecting piece is slidably connected to the first connecting piece, and the upward movement of the center pressure rod can drive the second connecting piece to slide out from the first connecting piece, so that the center pressure rod is disconnected from the center rotating shaft.

[0014] Further, the lifting mechanism includes a processing table assembly and a second lifting assembly connected to the processing table assembly; The processing table assembly includes an outer ring seat and a processing table, an annular cavity is formed between the outer ring seat and the processing table, a suction hood is connected to the bottom of the outer ring seat, a suction pump is connected to the suction hood, the suction pump sucks the working annular cavity to generate negative pressure to move the film material downward close to the wafer on the processing table.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. By designing the above-mentioned film feeding mechanism, film coating mechanism and lifting mechanism, the main body of the chip packaging film coating device is formed. The film feeding roller and the film receiving roller of the film coating mechanism horizontally transmit the film material. The lifting mechanism lifts the wafer close to the film material. The film coating mechanism above the film material drives the film pressing and cutting assembly on the mounting plate to move downward through the first lifting assembly and moves downward against the film material so that the film material is attached to the wafer. At the same time, the power device drives the film pressing and cutting assembly to rotate. The film pressing and cutting assembly drives the cutting assembly to move circumferentially around the wafer to cut the film material, so that the cut film material covers the surface of the wafer, thereby realizing automatic wafer coating and improving the efficiency of wafer production and processing. 2. When the center pressure rod in the center shaft starts to contact the film material and moves downward against the film material, the center pressure rod starts to rise due to the interaction of extrusion. When the film material is pressed against the wafer, the bottom of the hemispherical block and the film material are in point contact to reduce the contact friction with the film material and prevent the film material from shrinking toward the center. At this time, the second connecting piece on the center pressure rod is also out of contact with the first connecting piece on the center shaft. The rotation of the center shaft will not drive the center pressure rod to rotate, avoiding the rotation of the center pressure rod to cause the film material to shrink toward the center. In the process of the center pressure rod rising in the center shaft, the center The top block on the top of the pressure rod pushes the wedge-shaped block at the end of the horizontal connecting rod and moves to the upper right in the hollow connecting rod. While the horizontal connecting rod moves, it moves upward through the hinge rod, driving the movable plate to rotate, so that the cutter on the movable plate rotates to one side of the wafer close to the film material below. The central shaft rotates through the hollow connecting rod and the first connecting frame to drive the cutter to make a circumferential rotation to cut the film material. After cutting is completed, the first lifting assembly drives the film pressing and cutting assembly to move upward, and returns to the initial state due to factors such as its own weight. The structural design is ingenious to prevent the film material from shrinking toward the center and wrinkling. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1A schematic diagram of the three-dimensional structure of an embodiment of a film coating device for high-end integrated circuit chip packaging according to the present invention (viewing angle 1); Figure 2 A schematic diagram of the three-dimensional structure of an embodiment of a film coating device for high-end integrated circuit chip packaging according to the present invention (viewing angle 2); Figure 3 This is a schematic diagram of a three-dimensional structure of an embodiment of a laminating device for high-end integrated circuit chip packaging of the present invention without a frame; Figure 4 for Figure 3 Schematic diagram of the three-dimensional structure without the film feeding mechanism; Figure 5 It is a schematic diagram of the three-dimensional structure of the first lifting component in an embodiment of a laminating device for packaging high-end integrated circuit chips of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of a lifting mechanism in an embodiment of a laminating device for packaging high-end integrated circuit chips of the present invention; Figure 7 It is a three-dimensional structural schematic diagram of a processing table component and a film pressing and cutting component in an embodiment of a film laminating device for high-end integrated circuit chip packaging of the present invention; Figure 8 It is a top view of a processing table assembly and a film pressing and cutting assembly in an embodiment of a film laminating device for high-end integrated circuit chip packaging of the present invention; Fig. 9 A schematic diagram of the three-dimensional structure of a laminating and cutting assembly in an embodiment of a laminating device for high-end integrated circuit chip packaging according to the present invention (viewing angle 1); Fig.10 A schematic diagram of the three-dimensional structure of a laminating and cutting assembly in an embodiment of a laminating device for high-end integrated circuit chip packaging according to the present invention (viewing angle 2); Fig.11 A schematic diagram of the three-dimensional structure of a laminating and cutting assembly in an embodiment of a laminating device for high-end integrated circuit chip packaging according to the present invention (viewing angle 3); Fig.12 for Fig.11 Sectional view of AA in the middle; Fig.13 This is a disassembly diagram of a laminating and cutting assembly in an embodiment of a laminating device for high-end integrated circuit chip packaging of the present invention; Fig.14 It is a structural schematic diagram of two connecting parts in an embodiment of a film laminating device for high-end integrated circuit chip packaging of the present invention; The reference numerals in the drawings of the specification include: Frame 100, long beam 101, mounting frame 102; Film feeding mechanism 200, film feeding roller 201, film material 202, film collecting roller 203; The laminating mechanism 300, the first lifting assembly 301, the slide rail 3011, the slider 3012, the first driving motor 3013, the mounting seat 3014, the screw rod 3015, the mounting plate 302, the second driving motor 303, the laminating and cutting assembly 304, the central rotating shaft 3021, the first connecting piece 30211, the spherical block 3022, the connecting shaft 3023, the laminating roller sleeve 3024, the first spring 3025, the rubber wheel 3026, the hollow connecting piece Rod 3027, wedge block 30271, horizontal connecting rod 30272, guide rod 30273, second spring 30274, cutting assembly 3028, movable plate 30281, cutter 30282, first connecting frame 30283, second connecting frame 30284, hinge rod 30285, central pressure rod 3029, hemispherical block 30291, second connecting member 30292, third spring 30293, top block 30294; Lifting mechanism 400, lifting plate 401, second lifting assembly 402, track 4021, outer shell plate 4022, walking wheel 4023, support plate 4024, cylinder 4025, processing table assembly 403, outer ring seat 4031, processing table 4032, annular cavity 4033, suction hood 404, suction pump 405, feeding mechanism 500. DETAILED DESCRIPTION

[0017] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0018] Among them, the drawings are only used for illustrative explanations, and they only represent schematic diagrams rather than actual pictures, and should not be understood as limitations on this patent; in order to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0019] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0020] In the description of the present invention, unless otherwise clearly specified and limited, if the term "connection" or the like appears to indicate the connection relationship between components, the term should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] Embodiment 1: like Figure 1-14 As shown, the present invention. Specifically, a film coating device for high-end chip packaging of integrated circuits includes a frame 100, a film feeding mechanism 200 installed on the top of the frame 100, a film coating mechanism 300 arranged above the film feeding mechanism 200, and a lifting mechanism 400 arranged below the film feeding mechanism 200 for lifting the wafer; the film coating mechanism 300 includes a first lifting assembly 301, a mounting plate 302, and a film pressing and cutting assembly 304, the film pressing and cutting assembly 304 is rotatably connected to the mounting plate 302, the film pressing and cutting assembly 304 is connected to a power device driving it to rotate, the first lifting assembly 301 is connected to the mounting plate 302 to drive the film pressing and cutting assembly 304 to move up and down; the film pressing and cutting assembly 304 includes a cutting assembly 3028, the film pressing and cutting assembly 304 moves downward to cover the film material 202 below on the wafer, and the film pressing and cutting assembly 304 rotates to drive the cutting assembly 3028 to move circumferentially around the periphery of the wafer to cut the film material 202.

[0022] By designing the above-mentioned film feeding mechanism 200, film coating mechanism 300 and lifting mechanism 400, the main body of the chip packaging coating device is formed, the film feeding roller 201 and the film receiving roller 203 of the coating mechanism 300 horizontally transmit the film material 202, the lifting mechanism 400 lifts the wafer close to the film material 202, and the coating mechanism 300 above the film material 202 drives the film pressing and cutting assembly 304 on the mounting plate 302 to move downward through the first lifting assembly 301 and moves downward against the film material 202 to make the film material 202 stick to the wafer, and at the same time, the power device drives the film pressing and cutting assembly 304 to rotate, and the film pressing and cutting assembly 304 drives the cutting assembly 3028 to move circumferentially around the periphery of the wafer to cut the film material 202, so that the cut film material 202 covers the surface of the wafer, thereby realizing automatic wafer coating and improving the efficiency of wafer production and processing.

[0023] The specific first lifting component 301 includes a slide rail 3011 vertically installed on the mounting frame 102, a slider 3012 is arranged on the slide rail 3011, and also includes a power mechanism for driving the slider 3012 to slide, the power mechanism is configured as a screw module, specifically including a first driving motor 3013, a mounting seat 3014 and a screw rod 3015, wherein the mounting seat 3014 is fixedly mounted on the mounting frame 102, the screw rod 3015 is rotatably mounted on the mounting seat 3014 and is transmission-connected to the first driving motor 3013, the screw nut arranged on the screw rod 3015 is fixedly connected to the slider 3012, the rotation of the screw rod 3015 causes the screw nut to reciprocate and drive the slider 3012 to slide, the mounting plate 302 is fixedly connected to the slider 3012, and the sliding of the slider 3012 drives the film pressing and cutting component 304 on the mounting plate 302 to move up and down, wherein the power device that drives the film pressing and cutting component 304 to rotate is configured as the second driving motor 303.

[0024] The film pressing and cutting assembly 304 also includes a central rotating shaft 3021, a spherical block 3022 is arranged at the bottom of the central rotating shaft 3021, a hollow connecting rod 3027 is connected to the upper part of the central rotating shaft 3021, and the cutting assembly 3028 is connected to the hollow connecting rod 3027. The rotation of the central rotating shaft 3021 drives the cutting assembly 3028 to rotate through the hollow connecting rod 3027.

[0025] The outer periphery of the spherical block 3022 is connected to a plurality of connecting shafts 3023 , on which a laminating roller sleeve 3024 is disposed, and at the end of the connecting shaft 3023 a rubber wheel 3026 is connected, and between which a first spring 3025 is disposed.

[0026] The connecting shaft 3023 is inserted into the interior of the laminating roller cover 3024 , and the laminating roller cover 3024 can move relative to the connecting shaft 3023 .

[0027] Specifically, the second driving motor 303 is fixedly connected to the central rotating shaft 3021, and the central rotating shaft 3021 is driven to rotate by the second driving motor 303. Since the bottom of the central rotating shaft 3021 is connected to a plurality of connecting shafts 3023 through a spherical block 3022, a film pressing roller sleeve 3024 is sleeved on the connecting shaft 3023, and a rubber wheel 3026 is arranged at the end of the connecting shaft 3023. When the central rotating shaft 3021 rotates, the connecting shaft 3023 is driven to rotate. Since the film pressing roller sleeve 3024 is movably arranged, when the connecting shaft 3023 rotates with the central rotating shaft 3021 as the center, it can rotate by means of friction with the film material 202. When the film pressing roller sleeve 3024 rotates, it rotates to cover the film material 202 on the wafer more smoothly, so as to prevent the film material 202 from generating wrinkles when cutting. At the same time, the rubber wheel 3026 at the edge rolls to compact the edge of the film material 202.

[0028] The plurality of connecting shafts 3023 are arranged in a circular array, and the axis of the connecting shaft 3023 does not intersect with the virtual vertical center line of the spherical block 3022. By arranging the connecting shaft 3023 in this way, the length of the connecting shaft 3023 can be increased. Furthermore, the connecting shaft 3023 is designed to be tangent to the virtual circle of the spherical block 3022, so that a single film pressing roller cover 3024 can sweep a larger area. During the rotation process, due to the existence of centrifugal force, the film pressing roller cover 3024 moves toward the edge of the processing table 4032, so that the film material 202 stretches outward, and avoids the film material shrinking toward the center during the cutting process of the film material 202, resulting in incomplete coverage of the wafer. After the cutting is completed and the rotation stops, due to the existence of the first spring 3025, the film pressing roller cover 3024 is reset to the side close to the central rotating shaft 3021.

[0029] The central rotating shaft 3021 is a hollow structure, and a central pressure rod 3029 that can be raised and lowered is arranged inside the central rotating shaft 3021. The bottom of the central pressure rod 3029 is connected to a hemispherical block 30291, and the top of the central pressure rod 3029 is connected to a truncated cone-shaped top block 30294. The inside of the spherical block 3022 is provided with a channel for the central pressure rod 3029 to pass through. In the initial state, the hemispherical block 30291 is exposed outside the spherical block 3022.

[0030] The cutting assembly 3028 includes a movable plate 30281, a first connecting frame 30283, and a cutter 30282. The middle part of the movable plate 30281 is hinged on the first connecting frame 30283, the first connecting frame 30283 and the hollow connecting rod 3027 are fixedly connected, the cutter 30282 is vertically fixedly connected to the middle part of the movable plate 30281, the upper end of the movable plate 30281 is hinged with a second connecting frame 30284, and the second connecting frame 30284 is connected with a hinge rod 30285; A horizontal connecting rod 30272 is horizontally arranged inside the hollow connecting rod 3027, one end of the horizontal connecting rod 30272 extends into the central rotating shaft 3021 and is connected to the wedge block 30271, the hinge rod 30285 passes through the hollow connecting rod 3027 and is hinged to the other end of the horizontal connecting rod 30272, the central pressure rod 3029 moves upward and moves upward through the cooperation of the top block 30294 and the wedge block 30271 against the horizontal connecting rod 30272, the horizontal connecting rod 30272 drives the movable plate 30281 to rotate through the hinge rod 30285 and the second connecting frame 30284, so that the cutter 30282 rotates to one side of the wafer close to the film material 202, and the top block 30294 and the first connecting piece 30211 are provided with a third spring 30293.

[0031] When the coating mechanism 300 does not contact the film material 202, the movable plate 30281 and the cutter 30282 are drooping or away from the center due to their own weight. At that time, when the central pressure rod 3029 in the central rotating shaft 3021 begins to contact the film material 202 and moves downward against the film material 202, the central pressure rod 3029 begins to rise due to the interaction of extrusion. When the film material 202 is pressed against the wafer, the bottom of the hemispherical block 30291 and the film material 202 are in point contact, reducing the contact friction with the film material 202 to prevent the film material from shrinking toward the center. At this time, the second connecting piece 30292 on the central pressure rod 3029 is also out of contact with the first connecting piece 30211 on the central rotating shaft 3021, and the rotation of the central rotating shaft 3021 will not drive the central The central pressure rod 3029 rotates to prevent the central pressure rod 3029 from rotating and causing the film material to shrink toward the center. During the process of the central pressure rod 3029 rising up in the central rotating shaft 3021, the top block 30294 at the top of the central pressure rod 3029 pushes the wedge block 30271 at the end of the horizontal connecting rod 30272 and moves to the upper right in the hollow connecting rod 3027. While the horizontal connecting rod 30272 moves, it moves upward through the hinge rod 30285, driving the movable plate 30281 to rotate, so that the cutter 30282 on the movable plate 30281 rotates toward the side of the wafer to be close to the film material below. The central rotating shaft 3021 rotates through the hollow connecting rod 3027 and the first connecting frame 30283 to drive the cutter 30282 to perform circumferential rotation to cut the film material. A second spring 30274 is arranged between the inner wall of the horizontal connecting rod 30272 and the hollow connecting rod 3027.

[0032] In this embodiment, the outer wall of the central pressure rod 3029 is connected to the second connecting member 30292, and the inner wall of the central rotating shaft 3021 is provided with the first connecting member 30211. The second connecting member 30292 is slidably connected to the first connecting member 30211. The upward movement of the central pressure rod 3029 can drive the second connecting member 30292 to slide out of the first connecting member 30211, so that the central pressure rod 3029 is disconnected from the central rotating shaft 3021. Fig.14 The first connecting member 30211 has a rectangular slot with a notch, and the second connecting member 30292 is in a T-shape. After the second connecting member 30292 slides out of the first connecting member 30211, the central rotating shaft 3021 cannot drive the central pressing rod 3029 to rotate.

[0033] In this embodiment, the lifting mechanism 400 includes a processing table assembly 403 and a second lifting assembly 402 connected to the processing table assembly 403; the processing table assembly 403 includes an outer ring seat 4031 and a processing table 4032, an annular cavity 4033 is formed between the outer ring seat 4031 and the processing table 4032, a suction hood 404 is connected to the bottom of the outer ring seat 4031, and a suction pump 405 is connected to the suction hood 404, and the suction pump 405 sucks the working annular cavity 4033 to generate negative pressure to move the film material 202 downward close to the wafer on the processing table 4032. The second lifting assembly 402 includes a track 4021 installed on the frame 100, a walking wheel 4023, an outer shell plate 4022, a support plate 4024 and a cylinder 4025, wherein the walking wheel 4023 is arranged in a slide groove of the track 4021, the outer shell plate 4022 is arranged on the outside of the track 4021, the walking wheel 4023 is installed on the outer shell plate 4022, the support plate 4024 is fixedly connected to the connecting transverse axis between the two outer shell plates 4022, the cylinder 4025 and the connecting transverse axis between the two outer shell plates 4022 are hinged, and the driving force provided by the cylinder 4025 drives the walking wheel 4023 to move and drive the lifting plate 401 fixedly connected to the support plate 4024 to move up and down, so that the processing table 4032 on the lifting plate 401 is close to or away from the film material 202.

[0034] The above are only embodiments of the present invention, and the circuits, electronic components and modules involved are all prior art, which can be fully implemented by those skilled in the art. It is needless to say that the content protected by this application does not involve improvements to software and methods. The common sense such as the known specific structures and characteristics in the scheme is not described in detail here. Ordinary technicians in the relevant field know all the common technical knowledge in the technical field of the invention before the application date or priority date, can obtain all the prior art in the field, and have the ability to apply conventional experimental means before that date. Ordinary technicians in the relevant field can improve and implement this scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for ordinary technicians in the relevant field to implement this application. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, which should also be regarded as the scope of protection of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent.

Claims

1. A film coating device for high-end integrated circuit chip packaging, comprising a frame (100) and a film feeding mechanism (200) installed on the top of the frame (100), characterized in that: It also includes a film coating mechanism (300) arranged above the film feeding mechanism (200), and a lifting mechanism (400) arranged below the film feeding mechanism (200) and used for lifting the wafer; The film laminating mechanism (300) comprises a first lifting component (301), a mounting plate (302) and a film pressing and cutting component (304); the film pressing and cutting component (304) is rotatably connected to the mounting plate (302); the film pressing and cutting component (304) is connected to a power device for driving the film pressing and cutting component (304) to rotate; the first lifting component (301) is connected to the mounting plate (302) to drive the film pressing and cutting component (304) to move up and down; The film pressing and cutting assembly (304) comprises a cutting assembly (3028). The film pressing and cutting assembly (304) moves downward to cover the film material (202) below the wafer. The film pressing and cutting assembly (304) rotates to drive the cutting assembly (3028) to move circumferentially around the periphery of the wafer to cut the film material (202).

2. A film coating device for high-end integrated circuit chip packaging as claimed in claim 1, characterized in that: The film pressing and cutting assembly (304) further comprises a central rotating shaft (3021), a spherical block (3022) being arranged at the bottom of the central rotating shaft (3021), a hollow connecting rod (3027) being connected to the upper part of the central rotating shaft (3021), the cutting assembly (3028) being connected to the hollow connecting rod (3027), and the central rotating shaft (3021) rotating drives the cutting assembly (3028) to rotate via the hollow connecting rod (3027).

3. A coating device for high-end integrated circuit chip packaging as claimed in claim 2, characterized in that: The outer periphery of the spherical block (3022) is connected to a plurality of connecting shafts (3023), a film pressing roller sleeve (3024) is provided on the connecting shaft (3023), the end of the connecting shaft (3023) is connected to a rubber wheel (3026), and a first spring (3025) is provided between the film pressing roller sleeve (3024) and the rubber wheel (3026).

4. A film coating device for high-end integrated circuit chip packaging as claimed in claim 3, characterized in that: The connecting shaft (3023) is inserted into the interior of the film pressing roller sleeve (3024), and the film pressing roller sleeve (3024) is movable relative to the connecting shaft (3023).

5. The laminating device for high-end integrated circuit chip packaging as claimed in claim 3, characterized in that: The plurality of connecting shafts (3023) are arranged in a circular array, and the axes of the connecting shafts (3023) do not intersect with the virtual vertical center line of the spherical block (3022).

6. A film coating device for high-end integrated circuit chip packaging as claimed in claim 2, characterized in that: The central rotating shaft (3021) is a hollow structure. A central pressure rod (3029) that can be raised and lowered is arranged inside the central rotating shaft (3021). The bottom of the central pressure rod (3029) is connected to a hemispherical block (30291). The top of the central pressure rod (3029) is connected to a truncated cone-shaped top block (30294). A hole for the central pressure rod (3029) to pass through is arranged inside the spherical block (3022). In an initial state, the hemispherical block (30291) is exposed outside the spherical block (3022).

7. A film coating device for high-end integrated circuit chip packaging as claimed in claim 6, characterized in that: The cutting assembly (3028) comprises a movable plate (30281), a first connecting frame (30283), and a cutter (30282); the middle portion of the movable plate (30281) is hinged on the first connecting frame (30283); the first connecting frame (30283) and a hollow connecting rod (3027) are fixedly connected; the cutter (30282) is vertically fixedly connected to the middle portion of the movable plate (30281); the upper end of the movable plate (30281) is hinged with a second connecting frame (30284); and the second connecting frame (30284) is connected to a hinge rod (30285); A horizontal connecting rod (30272) is horizontally arranged inside the hollow connecting rod (3027), one end of the horizontal connecting rod (30272) extends into the central rotating shaft (3021) and is connected to a wedge block (30271), the hinge rod (30285) passes through the hollow connecting rod (3027) and is hinged to the other end of the horizontal connecting rod (30272), the central pressure rod (3029) moves upward through the cooperation of the top block (30294) and the wedge block (30271) to move upward against the horizontal connecting rod (30272), the horizontal connecting rod (30272) drives the movable plate (30281) to rotate through the hinge rod (30285) and the second connecting frame (30284), so that the cutter (30282) rotates toward one side of the wafer and approaches the film material (202).

8. A film coating device for high-end integrated circuit chip packaging as claimed in claim 7, characterized in that: A second spring (30274) is provided between the inner wall of the horizontal connecting rod (30272) and the hollow connecting rod (3027).

9. A film coating device for high-end integrated circuit chip packaging as claimed in claim 6, characterized in that: The outer wall of the central pressure rod (3029) is connected to a second connecting piece (30292), and the inner wall of the central rotating shaft (3021) is provided with a first connecting piece (30211). The second connecting piece (30292) is slidably connected to the first connecting piece (30211). The upward movement of the central pressure rod (3029) can drive the second connecting piece (30292) to slide off the first connecting piece (30211), so that the central pressure rod (3029) is disconnected from the central rotating shaft (3021).

10. The laminating device for high-end integrated circuit chip packaging according to claim 1, characterized in that: The lifting mechanism (400) comprises a processing table assembly (403) and a second lifting assembly (402) connected to the processing table assembly (403); The processing table assembly (403) comprises an outer ring seat (4031) and a processing table (4032), an annular cavity (4033) is formed between the outer ring seat (4031) and the processing table (4032), a suction hood (404) is connected to the bottom of the outer ring seat (4031), and a suction pump (405) is connected to the suction hood (404), and the suction pump (405) sucks the working annular cavity (4033) to generate negative pressure, so that the film material (202) moves downward and approaches the wafer on the processing table (4032).

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