Two-component epoxy resin adhesive as well as preparation method and application thereof

Abstract

The invention belongs to the technical field of epoxy resin glue, and discloses two-component epoxy resin glue as well as a preparation method and application thereof. The two-component epoxy resin adhesive comprises a component A and a component B, the component A comprises 40-50 parts of epoxy resin, 40-45 parts of a first filler, 6-8 parts of a diluent, 2-3 parts of a first thixotropic agent and 0.5-1 part of a coupling agent; the epoxy resin is a mixture of liquid epoxy bisphenol A resin, semi-solid epoxy bisphenol A resin and epoxy toughened resin; the component B comprises 70-75 parts of a second filler, 20-25 parts of a curing agent, 5-6 parts of an additive and 1-2 parts of a second thixotropic agent; the curing agent is a mixture of polyether amine and m-xylylenediamine; the mass ratio of the component A to the component B is (1: 1)-(3: 1). The double-component epoxy resin adhesive provided by the invention is completely cured within 20 hours at the temperature of 20-30 DEG C, can quickly react at the low temperature of 0-10 DEG C, and also has high strength and high temperature resistance.

Description

Technical Field

[0001] The present invention relates to the technical field of epoxy resin adhesive, and in particular to a two-component epoxy resin adhesive and a preparation method and application thereof. Background Art

[0002] Concrete, stone and steel materials have cracks and pores in their structure due to factors such as casting technology and decoration construction during the construction process, as well as temperature changes, load effects, material aging and other factors during use. These defects not only affect the appearance of the structure, but may also reduce the bearing capacity of the structure and cause safety problems. Therefore, it is of great significance to reinforce and repair the above materials in a timely manner.

[0003] Crack repair glue requires good permeability, low curing temperature, short curing time, high strength and high bonding. In terms of curing time, the existing technology requires a long curing time and low strength, which affects the construction progress and also affects the curing and molding effect. Summary of the invention

[0004] The purpose of the present invention is to provide a two-component epoxy resin adhesive and a preparation method and application thereof, so as to solve the problem of long curing time of the existing crack repair adhesive.

[0005] In order to achieve the above-mentioned invention object, the present invention provides the following technical solutions

[0006] The present invention provides a two-component epoxy resin adhesive, comprising component A and component B;

[0007] The A component comprises the following raw materials in parts by weight:

[0008] 40-50 parts of epoxy resin,

[0009] 40-45 parts of the first filler,

[0010] 6 to 8 parts of diluent,

[0011] 2-3 parts of the first thixotropic agent,

[0012] Coupling agent 0.5-1 part;

[0013] The epoxy resin is a mixture of liquid epoxy bisphenol A resin, semi-solid epoxy bisphenol A resin and epoxy toughening resin;

[0014] The B component comprises the following raw materials in parts by weight:

[0015] 70-75 parts of the second filler,

[0016] 20-25 parts of curing agent,

[0017] 5-6 parts of additives,

[0018] 1-2 parts of the second thixotropic agent;

[0019] The curing agent is a mixture of polyetheramine and meta-xylylenediamine;

[0020] The mass ratio of component A to component B is 1 to 3:1.

[0021] Preferably, in the above-mentioned two-component epoxy resin adhesive, the mass ratio of the liquid epoxy bisphenol A resin, the semi-solid epoxy bisphenol A resin and the epoxy toughening resin is 5.5-6.5:2.5-3.5:0.5-1.5.

[0022] Preferably, in the above two-component epoxy resin adhesive, the first filler and the second filler are independently silicon powder.

[0023] Preferably, in the above two-component epoxy resin adhesive, the diluent is polypropylene glycol diglycidyl ether.

[0024] Preferably, in the above two-component epoxy resin adhesive, the coupling agent is a silane coupling agent.

[0025] Preferably, in the above two-component epoxy resin adhesive, the mass ratio of the polyetheramine to m-xylylenediamine is 5-10:1-3.

[0026] Preferably, in the above two-component epoxy resin adhesive, the additive is one or both of N-aminoethylpiperazine and lignocellulose.

[0027] Preferably, in the above two-component epoxy resin adhesive, the first thixotropic agent and the second thixotropic agent are independently fumed silica.

[0028] The present invention also provides a method for preparing a two-component epoxy resin adhesive, comprising the following steps:

[0029] The first filler, epoxy resin and coupling agent are mixed and dispersed, and then the first thixotropic agent and diluent are added to obtain component A;

[0030] Mixing the second filler, the curing agent, the additive and the second thixotropic agent to form component B;

[0031] Package component A and component B separately.

[0032] The invention also provides an application of a two-component epoxy resin adhesive in repairing crack defects in building materials.

[0033] It can be seen from the above technical solution that compared with the prior art, the present invention has the following beneficial effects:

[0034] (1) The amino group of the polyetheramine in the component B of the present invention and the oxygen atom in the epoxy resin in the component A undergo a nucleophilic addition reaction to form a macrocyclic compound. At the same time, the epoxy group of the epoxy resin reacts with the carboxyl group in the polyetheramine to form an amide structure; and to ensure complete curing within 24 hours, N-aminoethylpiperazine and m-xylenediamine are added as accelerators to speed up the reaction, and the polyetheramine is the main curing agent; wood cellulose is an additive to enhance the cross-linking effect of the structure, which can improve the structural strength of the glue after curing.

[0035] (2) The two-component epoxy resin adhesive provided by the present invention can be completely cured within 20 hours at a temperature of 20 to 30°C; the time for complete curing at a low temperature of 0 to 10°C can also be as short as 24 hours, while having high strength and high temperature resistance. DETAILED DESCRIPTION

[0036] The present invention provides a two-component epoxy resin adhesive, comprising component A and component B;

[0037] The A component comprises the following raw materials in parts by weight:

[0038] 40-50 parts of epoxy resin,

[0039] 40-45 parts of the first filler,

[0040] 6 to 8 parts of diluent,

[0041] 2-3 parts of the first thixotropic agent,

[0042] Coupling agent 0.5-1 part;

[0043] The epoxy resin is a mixture of liquid epoxy bisphenol A resin, semi-solid epoxy bisphenol A resin and epoxy toughening resin;

[0044] The B component comprises the following raw materials in parts by weight:

[0045] 70-75 parts of the second filler,

[0046] 20-25 parts of curing agent,

[0047] 5-6 parts of additives,

[0048] 1-2 parts of the second thixotropic agent;

[0049] The curing agent is a mixture of polyetheramine and meta-xylylenediamine;

[0050] The mass ratio of the component A to the component B is 1 to 3:1, preferably 1.3 to 2.7:1, more preferably 1.5 to 2.5:1, and more preferably 1.8 to 2:1.

[0051] In the present invention, the weight proportion of the epoxy resin in the component A is preferably 40 to 50 parts, more preferably 42 to 47 parts, and even more preferably 44 to 45 parts.

[0052] In the present invention, the weight portion of the first filler in the component A is preferably 40 to 45 parts, more preferably 41 to 44 parts, and even more preferably 42 to 43 parts.

[0053] In the present invention, the weight portion of the diluent in the component A is preferably 6 to 8 parts, more preferably 6.3 to 7.8 parts, and even more preferably 6.8 to 7.5 parts.

[0054] In the present invention, the weight portion of the first thixotropic agent in the component A is preferably 2 to 3 parts, more preferably 2.2 to 2.7 parts, and even more preferably 2.5 to 2.6 parts.

[0055] In the present invention, the weight portion of the coupling agent in the component A is preferably 0.5 to 1 part, more preferably 0.6 to 0.9 part, and even more preferably 0.7 to 0.8 part.

[0056] In the present invention, the weight portion of the second filler in the component B is preferably 70 to 75 parts, more preferably 71 to 74 parts, and even more preferably 72 to 73 parts.

[0057] In the present invention, the weight portion of the curing agent in the component B is preferably 20 to 25 parts, more preferably 21 to 24 parts, and even more preferably 22 to 23 parts.

[0058] In the present invention, the weight portion of the additive in the component B is preferably 5 to 6 parts, more preferably 5.2 to 5.8 parts, and even more preferably 5.4 to 5.5 parts.

[0059] In the present invention, the weight portion of the second thixotropic agent in the component B is preferably 1 to 2 parts, more preferably 1.2 to 1.8 parts, and even more preferably 1.4 to 1.6 parts.

[0060] In the present invention, the liquid epoxy bisphenol A resin is preferably Nan Ya 128E liquid epoxy bisphenol A resin; the semi-solid epoxy bisphenol A resin is preferably Nan Ya 134 semi-solid epoxy bisphenol A resin; and the epoxy toughening resin is preferably Evonik 2364 epoxy toughening resin.

[0061] In the present invention, liquid epoxy bisphenol A resin is used as a basic low-viscosity material to facilitate the subsequent addition of other fillers or additives; the addition of epoxy toughening resin can improve the rigidity of the colloid after curing, and provide toughness and cross-linking density; the addition of semi-solid epoxy bisphenol A resin can improve the molecular weight, and the large molecular weight structure is superior to the liquid epoxy bisphenol A resin in terms of weather resistance and structure, but the addition of excessive semi-solid epoxy bisphenol A resin will result in high viscosity.

[0062] In the present invention, the mass ratio of the liquid epoxy bisphenol A resin, the semi-solid epoxy bisphenol A resin and the epoxy toughening resin is preferably 5.5-6.5:2.5-3.5:0.5-1.5, more preferably 5.7-6.3:2.7-3.3:0.7-1.3, and more preferably 6:3:1.

[0063] In the present invention, the first filler and the second filler are preferably independently silicon powder.

[0064] In the present invention, the diluent is preferably polypropylene glycol diglycidyl ether.

[0065] In the present invention, the coupling agent is preferably a silane coupling agent.

[0066] In the present invention, the silane coupling agent is preferably methyltriethoxysilane; methyltriethoxysilane can improve the interfacial activity between the glue and the substrate and enhance the adhesion.

[0067] In the present invention, the mass ratio of the polyetheramine to meta-xylylenediamine is preferably 5-10:1-3, more preferably 6-9:1.5-2.5, and even more preferably 7-8:2-2.2.

[0068] In the present invention, the additive is preferably one or both of N-aminoethylpiperazine and lignocellulose.

[0069] In the present invention, the first thixotropic agent and the second thixotropic agent are independently preferably fumed silica.

[0070] The present invention also provides a method for preparing a two-component epoxy resin adhesive, comprising the following steps:

[0071] The first filler, epoxy resin and coupling agent are mixed and dispersed, and then the first thixotropic agent and diluent are added to obtain component A;

[0072] Mixing the second filler, the curing agent, the additive and the second thixotropic agent to form component B;

[0073] Package component A and component B separately.

[0074] The invention also provides an application of a two-component epoxy resin adhesive in repairing crack defects in building materials.

[0075] In the present invention, the building materials preferably include concrete columns, ceramics, stone or steel.

[0076] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0077] Example 1

[0078] A two-component epoxy resin adhesive, comprising component A and component B;

[0079] The component A comprises the following raw materials in parts by weight:

[0080] Epoxy resin (a mixture of Nan Ya 128E liquid epoxy bisphenol A resin, Nan Ya 134 semi-solid epoxy bisphenol A resin and Evonik 2364 epoxy toughening resin, the mass ratio of Nan Ya 128E liquid epoxy bisphenol A resin, Nan Ya 134 semi-solid epoxy bisphenol A resin and Evonik 2364 epoxy toughening resin is 6:3:1) 45 parts,

[0081] 44 parts of the first filler (silicon powder),

[0082] Diluent (polypropylene glycol diglycidyl ether) 7.5 parts,

[0083] 3 parts of the first thixotropic agent (fumed silica),

[0084] Silane coupling agent (methyltriethoxysilane) 0.5 parts;

[0085] The component B comprises the following raw materials in parts by weight:

[0086] 73 parts of the second filler (silicon powder),

[0087] Curing agent (a mixture of polyetheramine and meta-xylylenediamine, the mass ratio of polyetheramine and meta-xylylenediamine is 7:2) 20 parts,

[0088] 5 parts of additive (a mixture of N-aminoethylpiperazine and lignocellulose, with a mass ratio of N-aminoethylpiperazine to lignocellulose of 4:3),

[0089] 2 parts of the second thixotropic agent (fumed silica);

[0090] The mass ratio of component A to component B is 2:1;

[0091] The preparation method of the two-component epoxy resin adhesive comprises the following steps:

[0092] The first filler is added into the mixture of epoxy resin and silane coupling agent, and dispersed and stirred evenly; the first thixotropic agent and diluent are added to obtain component A;

[0093] adding the second filler to the homogeneous mixture of the curing agent, the additive and the second thixotropic agent to form component B;

[0094] Package component A and component B separately.

[0095] Comparative Example 1

[0096] The other conditions in Example 1 remain unchanged, and the composition of the epoxy resin is modified to be a mixture of Nan Ya 128E liquid epoxy bisphenol A resin and Nan Ya 134 semi-solid epoxy bisphenol A resin, and the mass ratio of Nan Ya 128E liquid epoxy bisphenol A resin to Nan Ya 134 semi-solid epoxy bisphenol A resin is 5:3.

[0097] Comparative Example 2

[0098] While keeping other conditions in Example 1 unchanged, the mass ratio of Nan Ya 128E liquid epoxy bisphenol A resin, Nan Ya 134 semi-solid epoxy bisphenol A resin and Evonik 2364 epoxy toughening resin in the epoxy resin was modified to 6:1:1.

[0099] The two-component epoxy resin adhesive prepared in Example 1 and Comparative Examples 1-2 was subjected to a performance test. The performance test process was as follows: 4 pieces of concrete (naturally cured for 7 days), marble, ceramic, and stainless steel substrates with a length of 20 cm and a width of 1 cm were taken and bonded with the two-component epoxy resin adhesive prepared in Example 1 and Comparative Examples 1-2, respectively, with a bonding area of ​​1 cm×1 cm. For the specific method, reference may be made to GB / T7124-2008. The results are shown in Table 1.

[0100] Table 1 Performance test results of two-component epoxy resin adhesive in Example 1 and Comparative Examples 1-2

[0101]

[0102]

[0103] As shown in Table 1, the two-component epoxy resin glue prepared in Example 1 has suitable viscosity and high shear strength when used, and can be adapted to various materials for bonding and repairing, while ensuring that the performance after repair is not reduced; the two-component epoxy resin glue prepared in Comparative Example 1 lacks Evonik 2364 epoxy toughening resin, which will lead to high viscosity of the finished product, not easy to penetrate, and at the same time, the structure is too rigid and easy to break, which leads to a decrease in strength; the proportion of Nan Ya 134 semi-solid epoxy bisphenol A resin in the two-component epoxy resin glue prepared in Example 3 is low, so that the bonding force of the finished product is insufficient, and the strength of the structure is not ideal and is easy to break. Among them, the test results of concrete meet the strength index of the safety identification standard for concrete crack repair glue in GB50728-2011.

[0104] Comparative Example 3

[0105] The other conditions in Example 1 were controlled unchanged, and the curing agent (a mixture of polyetheramine and meta-xylylenediamine, with a mass ratio of polyetheramine to meta-xylylenediamine of 14:1) was modified.

[0106] Comparative Example 4

[0107] The other conditions in Example 1 remain unchanged, and the curing agent is changed to a single polyetheramine.

[0108] In addition, the curing time of the two-component epoxy resin adhesive prepared in Example 1 and Comparative Examples 3 to 4 was tested, and the curing time of the two-component epoxy resin adhesive prepared in Example 1 and Comparative Examples 3 to 4 was obtained, as shown in Table 2.

[0109] Table 2 Curing time of two-component epoxy resin adhesive in Example 1 and Comparative Examples 3-4

[0110]

[0111]

[0112] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A two-component epoxy resin adhesive, characterized in that: It includes component A and component B; The A component comprises the following raw materials in parts by weight: 40-50 parts of epoxy resin, 40-45 parts of the first filler, 6 to 8 parts of diluent, 2-3 parts of the first thixotropic agent, Coupling agent 0.5-1 part; The epoxy resin is a mixture of liquid epoxy bisphenol A resin, semi-solid epoxy bisphenol A resin and epoxy toughening resin; The B component comprises the following raw materials in parts by weight: 70-75 parts of the second filler, 20-25 parts of curing agent, 5-6 parts of additives, 1-2 parts of the second thixotropic agent; The curing agent is a mixture of polyetheramine and meta-xylylenediamine; The mass ratio of component A to component B is 1 to 3:

1.

2. The two-component epoxy resin adhesive according to claim 1, characterized in that: The mass ratio of the liquid epoxy bisphenol A resin, the semi-solid epoxy bisphenol A resin and the epoxy toughening resin is 5.5-6.5:2.5-3.5:0.5-1.

5.

3. The two-component epoxy resin adhesive according to claim 2, characterized in that: The first filler and the second filler are independently silicon powder.

4. The two-component epoxy resin adhesive according to claim 3, characterized in that: The diluent is polypropylene glycol diglycidyl ether.

5. The two-component epoxy resin adhesive according to claim 4, characterized in that: The coupling agent is a silane coupling agent.

6. The two-component epoxy resin adhesive according to claim 4 or 5, characterized in that: The mass ratio of the polyetheramine to meta-xylylenediamine is 5-10:1-3.

7. The two-component epoxy resin adhesive according to claim 6, characterized in that: The additive is one or two of N-aminoethylpiperazine and lignocellulose.

8. The two-component epoxy resin adhesive according to claim 7, characterized in that: The first thixotropic agent and the second thixotropic agent are independently fumed silica.

9. The method for preparing the two-component epoxy resin adhesive according to any one of claims 1 to 8, characterized in that: The following steps are involved: The first filler, epoxy resin and coupling agent are mixed and dispersed, and then the first thixotropic agent and diluent are added to obtain component A; Mixing the second filler, the curing agent, the additive and the second thixotropic agent to form component B; Package component A and component B separately.

10. Use of the two-component epoxy resin adhesive according to any one of claims 1 to 8 in repairing crack defects in building materials.

Images