Bonding wire arc deformation detection equipment and bonding wire arc deformation detection method

Abstract

The invention relates to the technical field of bonding wire design detection, in particular to bonding wire arc deformation detection equipment and a bonding wire arc deformation detection method.The bonding wire arc deformation detection equipment comprises a rotary disc, a test piece and an acquisition part, the rotary disc is provided with an axis, and the rotary disc rotates with the axis as the axis; the turntable is provided with a placement part extending along the radial direction of the turntable. The test piece is used for fixing a to-be-tested bonding wire arc, and the test piece is movably connected with the placement part, so that the test piece can be switched between a test state and a debugging state. When the test piece is in a debugging state, the test piece can slide along the placement part; when the test piece is in a test state, the test piece is fixed on the turntable. The collection part and the placement part are oppositely arranged in the extension direction of the axis. According to the bonding wire arc deformation detection equipment and the bonding wire arc deformation detection method provided by the invention, a physical test means in a dynamic service state of a bonding wire arc is filled up, and the reliability of bonding wire packaging is improved.

Description

Technical Field

[0001] The present application relates to the technical field of bonding wire design detection, and in particular to a bonding wire arc deformation detection device and a bonding wire arc deformation detection method. Background Art

[0002] Bonding wire is a thin metal wire used to connect the chip and pins or external circuits in semiconductor devices. Bonding wire is the bridge for electrical connection and information exchange between chip and external circuit. Bonding wire is formed by one welding, arc drawing and two welding. As the density of chip I / O pins increases, the pad spacing of each pin decreases, which makes the semiconductor device in dynamic service environment (for example, in the manufacturing process of semiconductor devices, semiconductor devices need to be transported between assembly, testing, glue filling and packaging processes in a high-speed transportation environment; for example, in the service and use of semiconductor devices, semiconductor devices often move, fall, collide and other special use environments). The arc of the bonding wire will deviate with movement or vibration. Once the stiffness of the bonding wire arc is insufficient and the offset during movement is too large, it is very easy for the bonding wire arc to contact other adjacent bonding wires, resulting in short circuit failure of the semiconductor device or wrong calculation results. Therefore, in the process of bonding wire selection and wire arc design for specific applications, checking the matching degree of wire arc offset and the spacing between adjacent bonding wires becomes the key to ensure the reliability of bonding wire packaging.

[0003] However, most of the existing detection schemes for bonding wire arcs are to obtain the resonant frequency and amplitude of the arc through computer modeling to achieve simulation and prediction of the usage status of the bonding wire arc. However, the input bonding wire physical properties, arc model accuracy, and boundary conditions have a great influence on the simulation and prediction data, resulting in a large deviation between the simulation and prediction data and the actual bonding wire arc service results, causing the reliability of the bonding wire packaging to deteriorate. Summary of the invention

[0004] The purpose of the present application is to provide a bonding wire arc deformation detection device and a bonding wire arc deformation detection method, so as to solve the existing bonding wire arc detection schemes in the prior art to a certain extent, most of which are to obtain the resonance frequency and amplitude of the arc through computer modeling calculation, and realize the simulation and prediction of the use status of the bonding wire arc according to the input bonding wire physical property parameters, arc model, and boundary conditions. Such computer simulation and prediction data is greatly affected by the input bonding wire physical property parameters, arc model accuracy, and boundary conditions, and there is a large deviation from the actual bonding wire arc service results, resulting in the technical problem of poor reliability of bonding wire packaging.

[0005] According to a first aspect of the present application, a bonding wire arc deformation detection device is provided, comprising a turntable, a test piece and a collection part, wherein the turntable is provided with an axis, the turntable can rotate about the axis, and the turntable is provided with a placement part extending in a radial direction of the turntable;

[0006] The test piece is used to fix the arc of the bonding wire to be tested, and the test piece is movably connected to the placement part so that the test piece can be switched between a test state and a debugging state;

[0007] When the test piece is in the debugging state, the test piece can slide along the placement portion;

[0008] When the test piece is in the test state, the test piece is fixed to the placement portion;

[0009] The collecting portion and the placing portion are arranged opposite to each other in the extending direction of the axis, so as to collect image information of arcs of the bonding wires to be tested on the test piece.

[0010] Preferably, the placement portion comprises a placement groove, the placement groove extends along the radial direction of the turntable, and the test piece can be embedded in the placement groove and slidably connected to the placement groove.

[0011] Preferably, the placement portion further comprises a limit stop edge and a positioning stud, the placement groove extends along the radial direction, the limit stop edge is arranged on the side wall of the placement groove extending along the radial direction, and the limit stop edge extends from one side of the placement groove to the middle of the placement groove;

[0012] The limit stop is provided with a plurality of limit threaded holes extending along the axis and penetrating the limit stop. The plurality of limit threaded holes are arranged at intervals along the radial direction. The positioning stud can be threadedly connected with the limit threaded hole to penetrate the limit threaded hole and abut against the test piece in the placement groove.

[0013] Preferably, the placement unit includes:

[0014] A first scale extending along the radial direction, wherein the first scale is disposed on at least one side of the placement groove in a direction perpendicular to an extension direction of the placement groove;

[0015] The second ruler is arranged on the test piece, and the two ends of the arc of the bonding wire to be tested are fixedly connected to the first point and the second point of the test piece respectively, and the extension direction of the second ruler is perpendicular to the connection direction of the first point and the second point.

[0016] Preferably, it also includes a shell, the shell has a closed chamber, the turntable is rotatably arranged in the closed chamber, and a collection window is arranged on the side of the shell facing the placement part, and the collection part collects image information of the arc of the bonding wire to be tested on the test piece through the collection window.

[0017] Preferably, there are a plurality of the placement portions, and the plurality of the placement portions are evenly distributed along the circumferential direction of the rotating disk;

[0018] The bonding wire arc deformation detection device also includes:

[0019] A rotation driving unit, fixedly connected to the housing and drivingly connected to the turntable to drive the turntable to rotate;

[0020] The encoder is arranged between the rotation driving unit and the turntable, and the encoder is communicatively connected with the acquisition unit and the rotation driving unit.

[0021] Preferably, the housing further comprises:

[0022] A collection frame is fixed to the outside of the shell and is arranged on one side of the collection window, the collection frame extends along the radial direction, and the collection part is slidably connected to the collection frame along the radial direction;

[0023] The fill light is arranged on the inner wall of the shell and around the edge of the collection window.

[0024] According to the second aspect of the present application, a bonding wire arc deformation detection method is provided, which is used for the bonding wire arc deformation detection device described in any of the above technical solutions. Therefore, it has all the beneficial technical effects of the bonding wire arc deformation detection device, which will not be repeated here.

[0025] Specifically, the steps include:

[0026] Acquire detection parameters, and acquire velocity (v) and acceleration (a) data of the bonding wire arc to be tested in a limit state of movement according to the dynamic service environment of the bonding wire arc to be tested;

[0027] Installing the bonding wire arc to be tested, and bonding the bonding wire arc to be tested to a predetermined position of the test piece according to the design structure of the bonding wire arc to be tested;

[0028] Install and debug the test piece according to the formula: Calculating the rotation radius of the test piece and fixing the test piece at a corresponding position of the placement portion;

[0029] Adjust the position of the collecting unit according to the installation position of the test piece, so that the collecting unit is aligned with the test piece, and adjust the focal length;

[0030] Set the rotation parameters according to Calculating the rotational angular velocity of the test piece, and setting the rotational speed of the turntable according to the rotational angular velocity;

[0031] Acquire an image, drive the turntable to rotate, and control the acquisition unit to acquire test image data of the test piece whenever the test piece passes the position where the acquisition unit is located;

[0032] Calculate the offset, compare the test image data with the initial state of the test piece, and obtain the maximum offset distance d of the arc of the bond wire to be tested in the moving state 偏移 ;

[0033] Determine whether the stiffness of the arc of the bonding wire to be tested is qualified, and compare the offset distance d 偏移 The designed installation gap d between the arc of the bonding wire to be tested 间隙 , if d 偏移 ≥d 间隙 , then the stiffness of the arc of the bonding wire to be tested is unqualified and needs to be redesigned. 偏移 <d 间隙 , then the stiffness of the arc of the bonding wire to be tested is qualified and the design is completed.

[0034] Preferably, the shooting frame rate f of the acquisition unit should satisfy Where v is the speed and D is the diameter of the bonding wire;

[0035] And / or, between the two steps of installing and debugging the test piece and adjusting the position of the collection part, the step also includes adjusting the environment inside the closed chamber, and adjusting the air pressure and temperature inside the closed chamber according to the dynamic service environment of the bonding wire arc to be tested.

[0036] Preferably, the step of installing the bonding wire arc to be tested also includes fixing two ends of the bonding wire arc to be tested to the first point and the second point of the test piece respectively, and marking the highest point of the bonding wire arc to be tested;

[0037] The step of calculating the offset also includes measuring the offset of the highest point in the test image data relative to the line connecting the first point and the second point, which is recorded as the maximum offset distance d 偏移 .

[0038] Compared with the prior art, the beneficial effects of this application are:

[0039] The bonding wire arc deformation detection device provided by the present application arranges a test piece for fixing the bonding wire arc to be tested in a placement portion of a turntable. On the one hand, when the test piece is in a test state, the test piece is fixed to the turntable, so that the bonding wire arc to be tested can rotate with the turntable, so as to simulate the state of the bonding wire arc in a dynamic service environment in a limited space, and collects image information of the bonding wire arc to be tested by arranging a collection portion relative to the placement portion in the extension direction of the axis, so as to obtain the maximum deviation of the bonding wire arc to be tested in a moving state by analyzing the image information of the bonding wire arc to be tested, thereby checking the rigidity of the bonding wire arc. The matching degree with the setting space provides physical verification data, effectively improves the data accuracy of testing the matching degree between the bonding wire arc rigidity and the setting space, and improves the reliability of the bonding wire arc package; on the other hand, when the test piece is in the debugging state, the test piece can slide along the placement part extending in the radial direction of the turntable, so that the bonding wire arc deformation detection equipment can simulate the dynamic service environment of the bonding wire arc at different rates, thereby improving the testing flexibility and adaptability of the bonding wire arc deformation detection equipment; furthermore, there are multiple placement parts distributed along the circumference of the rotating disk, and multiple test pieces can be arranged at the same time in one test to improve the efficiency of batch testing.

[0040] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0042] Figure 1 A schematic diagram of the isometric structure of a bonding wire arc deformation detection device provided in an embodiment of the present application;

[0043] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of the provided bonding wire arc deformation detection device at position A;

[0044] Figure 3 A schematic cross-sectional view of a bonding wire arc deformation detection device provided in an embodiment of the present application;

[0045] Figure 4 A schematic diagram of the axonometric structure of a turntable provided in an embodiment of the present application;

[0046] Figure 5A schematic diagram of a partially enlarged structure of a turntable provided in an embodiment of the present application;

[0047] Figure 6 A schematic cross-sectional view of a housing provided in an embodiment of the present application;

[0048] Figure 7 A schematic diagram of the structure of a test piece provided in an embodiment of the present application;

[0049] Figure 8 A schematic flow chart of a bonding wire arc deformation detection method provided in an embodiment of the present application.

[0050] Reference numerals:

[0051] 1-turntable; 2-placement part; 21-placement groove; 22-limit stop edge; 221-limit threaded hole; 23-positioning stud; 24-first scale; 3-test piece; 31-first point; 32-second point; 33-second scale; 4-collection part; 5-housing; 51-collection frame; 52-collection window; 53-fill light; 54-leg; 6-rotation drive part; 7-encoder; 8-bond wire arc to be tested. DETAILED DESCRIPTION

[0052] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0053] The components of the embodiments of the present application generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed, but merely represents the selected embodiments of the present application.

[0054] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of this application.

[0055] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0056] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0057] Refer to the following Figures 1 to 8 A bonding wire arc deformation detection device and a bonding wire arc deformation detection method according to some embodiments of the present application are described.

[0058] See also Figures 1 to 7 As shown, an embodiment of the first aspect of the present application provides a bonding wire arc deformation detection device, which includes a turntable 1, a test piece 3 and a collection part 4. The turntable 1 is provided with an axis, and the turntable 1 can rotate around the axis. The turntable 1 is provided with a placement part 2 extending in the radial direction of the turntable 1. The test piece 3 is used to fix the bonding wire arc 8 to be tested, and the test piece 3 is movably connected to the placement part 2 so that the test piece 3 can switch between a test state and a debugging state. Among them, when the test piece 3 is in the debugging state, the test piece 3 can slide along the placement part 2; when the test piece 3 is in the test state, the test piece 3 is fixed to the turntable 1. The collection part 4 is arranged relative to the placement part 2 in the extension direction of the axis, so as to collect image information of the bonding wire arc 8 to be tested on the test piece 3.

[0059] According to the bonding wire arc deformation detection device provided by the above technical features, the test piece 3 for fixing the bonding wire arc 8 to be tested is arranged in the placement part 2 of the turntable 1. On the one hand, when the test piece 3 is in the test state, the test piece 3 is fixed to the turntable 1, so that the bonding wire arc 8 to be tested can rotate with the turntable 1, so as to simulate the state of the bonding wire arc in a dynamic service environment in a limited space, and the image information of the bonding wire arc 8 to be tested is collected by relatively arranging the collection part 4 with respect to the placement part 2 in the extension direction of the axis, so as to obtain the bonding wire arc 8 to be tested in the moving state by analyzing the image information of the bonding wire arc 8 to be tested. The maximum deviation of arc 8 fills the physical test means of the moving state of the bonding wire arc, provides physical verification data for testing the matching degree of the rigidity of the bonding wire arc and the setting space, effectively improves the data accuracy of testing the matching degree of the rigidity of the bonding wire arc and the setting space, and improves the reliability of the bonding wire package; on the other hand, when the test piece 3 is in the debugging state, the test piece 3 can slide along the placement part 2 extending in the radial direction of the turntable 1, so that the bonding wire arc deformation detection equipment can simulate the dynamic service environment of the bonding wire arc at different speeds, thereby improving the testing flexibility and adaptability of the bonding wire arc deformation detection equipment.

[0060] like Figure 1 , Figure 3 and Figure 4 As shown, the dotted line shown in the figure may be an example of the above-mentioned axis.

[0061] Preferably, if Figures 2 to 4 As shown, the placement portion 2 may include a placement groove 21, which extends in the radial direction of the turntable 1. The test piece 3 can be embedded in the placement groove 21 and is slidably connected to the placement groove 21, so that in the debugging state, the test piece 3 and the placement portion 2 can slide. The placement portion 2 is arranged in the placement groove 21, which not only effectively compresses the space occupied by the placement portion 2 and the test piece 3, but also can effectively shorten the distance between the upper surface of the test piece 3 and the upper surface of the turntable 1, so that the acquisition portion 4 can focus on the first scale 24 and the second scale 33 described below.

[0062] However, it is not limited thereto. The placement portion 2 is not limited to the form of the placement groove 21. As long as the placement portion 2 and the test piece 3 can be slidably connected in the debugging state, the placement portion 2 may also include a slideway, a slide rail, etc.

[0063] Preferably, if Figure 5 As shown, in the extension direction of the above-mentioned axis, the size of the above-mentioned test piece 3 can be equal to the depth of the above-mentioned mounting groove 21. In this way, when the test piece 3 is set in the mounting groove 21, the upper surface of the test piece 3 can be set flush with the upper surface of the turntable 1, so as to further facilitate the above-mentioned acquisition part 4 to focus on the first scale 24 and the second scale 33 at the same time.

[0064] Preferably, if Figure 4 and Figure 5 As shown, the above-mentioned placement portion 2 may also include a limit stop edge 22 and a positioning stud 23. The limit stop edge 22 is fixedly arranged on one side of the placement groove 21 in the circumferential direction of the turntable 1. In the circumferential direction, the limit stop edge 22 extends from one side of the placement groove 21 to the middle of the placement groove 21. Figure 4 and Figure 5 As shown, the above-mentioned limit stop 22 is provided with a plurality of limit threaded holes 221 penetrating the limit stop 22 along the axial extension direction, and the plurality of limit threaded holes 221 are arranged at intervals along the radial direction. The positioning stud 23 can be threadedly connected with the limit threaded hole 221 to penetrate the limit threaded hole 221 and abut against the test piece 3 in the mounting groove 21. In this way, the test piece 3 is squeezed by both the bottom surface of the mounting groove 21 and the positioning stud 23 to achieve the fixation between the test piece 3 and the turntable 1 when the test piece 3 is in the test state, so as to achieve the fixation of the test piece 3 relative to the turntable 1 during the rotation of the turntable 1.

[0065] Optionally, not shown in the figures, the above-mentioned limit stop edges may be fixedly provided on both sides of the mounting groove in the circumferential direction of the turntable to further improve the fixing stability of the test piece.

[0066] However, it is not limited to this, and the structure for fixing the test piece 3 and the turntable 1 is not limited to the above-mentioned limit baffle and positioning stud 23. As long as the test piece 3 can be fixed relative to the turntable 1 during the rotation of the turntable 1, the fixing structure can also be other structures. For example, the fixing structure can also be a positioning pin that passes through the turntable 1 and the test piece 3 at the same time. For example, the fixing structure can also be a clamp fixedly set on the turntable 1.

[0067] Preferably, if Figure 5 As shown, in the radial direction of the turntable 1, the distance between two adjacent limiting threaded holes 221 is smaller than the size of the test piece 3. In this way, no matter where the test piece 3 is in the mounting groove 21, there is at least one limiting threaded hole 221 that can be opposite to the test piece 3, that is, there can be at least one positioning stud 23 that can abut against the test piece 3, which effectively improves the freedom of setting the position of the test piece 3 in the mounting groove 21.

[0068] Furthermore, the distance between two adjacent limiting threaded holes 221 is less than or equal to 1 / 2 of the width of the test piece, so as to further ensure that at least two studs are used to fasten the test piece when the test piece is fixed at any position in the extension direction of the axis, thereby increasing the reliability of fastening.

[0069] Preferably, if Figure 2 , Figure 4 and Figure 5 As shown, the placement portion 2 may further include a first scale 24 which may extend in a radial direction and is disposed on one side of the placement groove 21 in the circumferential direction of the turntable 1 to facilitate rapid positioning of the test piece 3 in an adjusted state.

[0070] Preferably, if Figure 4 As shown, a plurality of placement portions 2 may be provided on the above-mentioned turntable 1, and the plurality of placement portions 2 may be evenly distributed along the circumferential direction of the turntable 1 to achieve synchronous testing of a plurality of test pieces 3, thereby improving the testing efficiency of the bonding wire arc deformation detection device.

[0071] In an embodiment, Figure 5 and Figure 6As shown, the test piece 3 may include a first point 31 and a second point 32, and the two ends of the bonding wire arc 8 to be tested may be fixedly connected to the test piece 3 via the first point 31 and the second point 32, respectively. Optionally, the bonding wire arc 8 to be tested may be welded to the test piece 3 to simulate the connection mode between the bonding wire arc 8 to be tested and the semiconductor device, but not limited thereto, the connection mode between the bonding wire arc 8 to be tested and the test piece 3 may be adaptively adjusted according to the connection mode between the bonding wire arc 8 to be tested and the semiconductor device, and it should be noted that the first point 31 and the second point 32 may be understood as the first welding point and the second welding point formed during the bonding process of the bonding wire on the bonding machine.

[0072] Preferably, if Figure 5 and Figure 6 As shown, the upper surface of the test piece 3 may also be provided with a second scale 33, and the second scale 33 may be perpendicular to the direction of the line connecting the first point 31 and the second point 32. In this way, when the acquisition unit 4 acquires the image information of the arc 8 of the bonding wire to be tested on the test piece 3, the second scale 33 can be acquired together, and the analysis of the image information is facilitated by the reference of the second scale 33.

[0073] Optionally, the first scale 24 and the second scale 33 may be disposed on the surface of the turntable 1 and the test piece 3 by laser etching to ensure the durability and stability of the first scale 24 and the second scale 33. However, the present invention is not limited thereto, and the first scale 24 and the second scale 33 may also be fixed to the surface of the turntable 1 and the test piece 3 by other means, such as pasting, etching, printing, etc., as long as they can be clearly marked.

[0074] like Figure 7 As shown in the figure, among the two bond wire arcs 8 to be tested, the solid line in the figure represents the position of the bond wire arc 8 in the initial state, and the dotted line in the figure represents the position of the bond wire arc 8 in the test state. Preferably, as Figure 7 As shown, when the bonding wire arc 8 to be tested is assembled with the test piece 3 (the bonding wire arc 8 to be tested is in the initial state), the plane confirmed by the bonding wire arc 8 to be tested is perpendicular to the second scale 33, so as to quickly obtain the offset of the bonding wire arc 8 to be tested during the test process.

[0075] It should be noted that if Figure 5As shown in the figure, an example is shown in which the connection direction of the first point 31 and the second point 32 is perpendicular to the radial direction. However, it is not limited thereto. The angle between the connection direction of the first point 31 and the second point 32 and the extension direction of the placement groove 21 (i.e., the radial direction) can be adaptively adjusted according to the moving direction of the use environment of the bonding wire arc 8 to be tested and the direction of the minimum value of the installation gap of the bonding wire arc 8 to be tested. In other words, the setting angle of the bonding wire arc 8 to be tested and the second scale 33 can be adaptively adjusted according to the test requirements.

[0076] In an embodiment, preferably, Figures 1 to 3 As shown, the above-mentioned bonding wire arc deformation detection device can also include a shell 5, which has a closed chamber, and the turntable 1 is rotatably arranged in the closed chamber. In this way, on the one hand, through the protective effect of the shell 5 on the turntable 1, the influence of external factors on the test results can be effectively reduced, and the test accuracy can be improved; on the other hand, by adjusting the air pressure in the closed chamber (for example, vacuuming, pressurizing), it is possible to simulate the state of the bonding wire arc 8 to be tested in an extreme air pressure environment, thereby increasing the test adaptability range of the bonding wire arc deformation detection device.

[0077] Preferably, if Figure 2 As shown, a collection window 52 is provided on the side of the housing 5 facing the placement part 2, and the collection part 4 collects image information of the arc 8 of the bonding wire to be tested on the test piece 3 through the collection window 52. Specifically, the housing 5 may be provided with a collection port, which may be blocked by a transparent material (e.g., a glass plate, an acrylic plate, etc.) to form the collection window 52, ​​so as to take into account both the airtightness of the sealed chamber and the clarity of the collected image information of the collection part 4.

[0078] Optionally, the collection window 52 and the housing 5 are detachable to facilitate assembly of the test piece 3 and the turntable 1 .

[0079] Alternatively, if Figure 1 As shown, the bonding wire arc deformation detection device further includes a plurality of legs 54, and the housing 5 can be fixed on the legs 54, so as to erect the housing 5 at a predetermined height, so as to reserve installation space for the rotation drive unit 6 described below.

[0080] Optionally, not shown in the figures, the shell may also be provided with an air inlet pipe and a pressure relief valve, so as to realize the air injection and exhaust of the sealed chamber via the air inlet pipe and the pressure relief valve.

[0081] Optionally, not shown in the figures, a temperature regulating device may be embedded in the shell to control the temperature of the sealed chamber.

[0082] It should be noted that the sealing structure, the temperature regulating device, the intake pipe pressure relief valve and other structures provided on the housing 5 are all prior arts in the art and will not be described in detail here.

[0083] Preferably, if Figure 1 As shown, the above-mentioned bonding wire arc deformation detection equipment can also include a rotation driving unit 6, which is fixedly connected to the shell 5 and is transmission-connected to the turntable 1 to drive the turntable 1 to rotate. In this way, the automatic driving of the turntable 1 is realized, which facilitates the control of the rotation speed of the turntable 1.

[0084] Optionally, the rotation driving unit 6 may be a driving motor.

[0085] Preferably, if Figure 1 and Figure 3 As shown, the above-mentioned bonding wire arc deformation detection device can also include an encoder 7, which can be arranged between the rotating drive unit 6 and the turntable 1. The encoder 7 is communicatively connected with the acquisition unit 4 and the rotating drive unit 6. In this way, the positions of the above-mentioned acquisition window 52 and multiple placement units 2 can be marked by the encoder 7, and the rotation angle of the turntable 1 can be monitored, so that when the placement unit 2 passes through the acquisition window 52, ​​the acquisition unit 4 can automatically acquire image information.

[0086] Preferably, if Figure 1 and Figure 3 As shown, the shell 5 may further include a collection frame 51, which is fixed to the outside of the shell 5 and is disposed on one side of the collection window 52. The collection frame 51 extends in a radial direction, and the collection portion 4 is slidably connected to the collection frame 51 in a radial direction to adjust the position of the collection portion 4 in the radial direction, so as to facilitate adjusting the position of the collection portion 4 according to the position of the test piece 3.

[0087] Optionally, the collection rack 51 may be provided with a slideway and a slider slidably connected to each other, and the collection portion 4 may be detachably connected to the slider.

[0088] Preferably, the acquisition unit 4 may be a high-speed camera, so as to quickly and clearly capture the image information of the arc 8 of the bonding wire to be tested during the high-speed rotation of the test piece 3. Optionally, the acquisition unit 4 may have a magnifying lens, so as to analyze the information of the second scale 33 and improve the test accuracy of the arc 8 of the bonding wire to be tested.

[0089] Preferably, if Figure 3 and Figure 6 As shown, the shell 5 may further include a fill light 53, which may be disposed on the inner wall of the shell 5 and around the edge of the collection window 52, ​​so as to provide fill light for the collection unit 4 and ensure clarity of the image information collected by the collection unit 4.

[0090] Alternatively, if Figure 6 As shown, the fill light 53 can be arranged along an edge parallel to the extension direction of the collection window 52 .

[0091] Preferably, although not shown in the figure, the above-mentioned fill light 53 can also be arranged along the edge of the collection window 52 for at least one circle, so as to achieve the effect of a shadowless lamp through the distribution of the annular fill light, thereby avoiding the formation of linear arc shadows to interfere with the measurement of the collected image.

[0092] The embodiment of the second aspect of the present application also provides a bonding wire arc deformation detection method, which is used for the bonding wire arc deformation detection device described in any of the above embodiments. Therefore, it has all the beneficial technical effects of the bonding wire arc deformation detection device, which will not be repeated here.

[0093] The steps include:

[0094] S010 acquires detection parameters, and acquires speed (v) and acceleration (a) data of the bonding wire arc 8 to be tested in a limit state of movement according to the dynamic service environment of the bonding wire arc 8 to be tested.

[0095] S020 installs the bonding wire arc 8 to be tested, and bonds the bonding wire arc 8 to be tested to a predetermined position of the test piece 3 according to the design structure of the bonding wire arc 8 to be tested. It should be noted that the highest point of the bonding wire arc 8 to be tested, the first point 31 and the second point 32 of the bonding wire arc 8 to be tested after bonding are coplanar and perpendicular to the test piece substrate.

[0096] Optionally, the design structure of the bonding wire arc may include design arc height, span, solder joint form, etc.

[0097] Optionally, the step of installing the bonding wire arc 8 to be tested in S020 may also include fixing the two ends of the bonding wire arc 8 to be tested to the first point 31 and the second point 32 of the test piece 3 respectively, and marking the highest point of the bonding wire arc 8 to be tested.

[0098] Optionally, the number of test pieces 3 and the installation angles of the bonding wire arcs 8 to be tested of different test pieces 3 are selected according to the test requirements.

[0099] S030 installation and debugging test piece 3, according to the formula: The rotation radius of the test piece 3 is calculated, and the test piece 3 is fixed to the corresponding position of the placement portion 2. Preferably, after the rotation radius is calculated, the test piece 3 can be slid along the placement groove 21 to the position of the rotation radius shown by the first scale 24, and the positioning stud 23 is screwed into the corresponding limiting threaded hole 221 to clamp the test piece 3, thereby completing the installation of the test piece 3.

[0100] Optionally, if a plurality of test pieces 3 are selected, the plurality of test pieces 3 may be disposed in the plurality of placement slots 21 in a one-to-one correspondence.

[0101] Optionally, the bonding wire arc deformation detection method may further include S040 adjusting the environment inside the closed chamber, and adjusting the air pressure and temperature inside the closed chamber according to the dynamic service environment of the bonding wire arc 8 to be tested.

[0102] Optionally, the above-mentioned adjustment of the air pressure in the sealed chamber may include evacuating the sealed chamber, injecting gas (to simulate high pressure), heating, etc., to simulate different service environments of the bonding wire arc 8 to be tested.

[0103] S050: Adjust the position of the collecting part 4. According to the installation position of the test piece 3, adjust the position of the collecting part 4 so that the collecting part 4 is aligned with the test piece 3 and adjust the focal length.

[0104] S060 sets the rotation parameters according to The rotational angular velocity of the test piece 3 is calculated, and the output power of the rotational drive is set according to the rotational angular velocity, so that the rotational speed of the turntable 1 reaches ω.

[0105] S070 collects images and drives the turntable 1 to rotate. Whenever the test piece 3 passes the location of the collection unit 4 , the collection unit 4 is controlled to collect test image data of the test piece 3 .

[0106] Preferably, the shooting frame rate f of the acquisition unit should satisfy Wherein v is the speed, and D is the diameter of the bonding wire, so as to ensure that the acquisition unit can clearly obtain the image data of the arc 8 of the bonding wire to be tested in a dynamic service environment.

[0107] S080 calculates the offset, compares the test image data with the initial state of the test piece 3, and obtains the maximum offset distance d of the arc 8 of the bond wire to be tested in the moving state. 偏移 .

[0108] Measure the offset of the highest point in the test image data relative to the line connecting the first point 31 and the second point 32, which is recorded as the maximum offset distance d 偏移 .

[0109] Specifically, Figure 7 As shown, Among them, P 偏移 It can be the offset pixel of the highest point in the test image data, P 标尺 can be the pixel distance of the second scale 33, L 标尺 It can be the actual size of the second scale 33 .

[0110] S090 determines whether the stiffness of the arc 8 of the bonding wire to be tested is qualified, and compares the offset distance d偏移 Design installation gap d with the bonding wire arc 8 to be tested 间隙 .

[0111] If d 偏移 ≥d 间隙 , then the stiffness of the bonding wire arc 8 to be tested is unqualified and needs to be redesigned and the above test repeated.

[0112] Optionally, the above redesign may include replacing bonding wires of other components, changing wire diameters of bonding wires, or changing geometric dimensions of wire arcs.

[0113] If d 偏移 <d 间隙 , then the stiffness of the bonding wire arc 8 to be tested is qualified and the design is completed.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A bonding wire arc deformation detection device, characterized in that: The test piece comprises a turntable, a test piece and a collection part, wherein the turntable is provided with an axis, the turntable can rotate around the axis, and the turntable is provided with a placement part extending in the radial direction of the turntable; The test piece is used to fix the arc of the bonding wire to be tested, and the test piece is movably connected to the placement part so that the test piece can be switched between a test state and a debugging state; When the test piece is in the debugging state, the test piece can slide along the placement portion; When the test piece is in the test state, the test piece is fixed to the placement portion; The collecting portion and the placing portion are arranged opposite to each other in the extending direction of the axis, so as to collect image information of arcs of the bonding wires to be tested on the test piece.

2. The bonding wire arc deformation detection device according to claim 1, characterized in that: The placement portion comprises a placement groove, the placement groove extends along the radial direction of the rotating disk, and the test piece can be embedded in the placement groove and slidably connected with the placement groove.

3. The bonding wire arc deformation detection device according to claim 2, characterized in that: The placement portion further includes a limit stop edge and a positioning stud, the placement groove extends along the radial direction, the limit stop edge is arranged on the side wall of the placement groove extending along the radial direction, and the limit stop edge extends from one side of the placement groove to the middle of the placement groove; The limit stop is provided with a plurality of limit threaded holes extending along the axis and penetrating the limit stop. The plurality of limit threaded holes are arranged at intervals along the radial direction. The positioning stud can be threadedly connected with the limit threaded hole to penetrate the limit threaded hole and abut against the test piece in the placement groove.

4. The bonding wire arc deformation detection device according to claim 2, characterized in that: The placement unit includes: A first scale extending along the radial direction, wherein the first scale is disposed on at least one side of the placement groove in a direction perpendicular to an extension direction of the placement groove; The second ruler is arranged on the test piece, and the two ends of the arc of the bonding wire to be tested are fixedly connected to the first point and the second point of the test piece respectively, and the extension direction of the second ruler is perpendicular to the connection direction of the first point and the second point.

5. The bonding wire arc deformation detection device according to any one of claims 1 to 4, characterized in that: It also includes a shell, which has a sealed chamber. The turntable is rotatably arranged in the sealed chamber. A collection window is arranged on the side of the shell facing the placement part. The collection part collects image information of the arc of the bonding wire to be tested on the test piece through the collection window.

6. The bonding wire arc deformation detection device according to claim 5, characterized in that: The number of the placement parts is multiple, and the multiple placement parts are evenly distributed along the circumferential direction of the rotating disk; The bonding wire arc deformation detection device also includes: A rotation driving unit, fixedly connected to the housing and drivingly connected to the turntable to drive the turntable to rotate; The encoder is arranged between the rotation driving unit and the turntable, and the encoder is communicatively connected with the acquisition unit and the rotation driving unit.

7. The bonding wire arc deformation detection device according to claim 5, characterized in that: The housing further comprises: A collection frame is fixed to the outside of the shell and is arranged on one side of the collection window, the collection frame extends along the radial direction, and the collection part is slidably connected to the collection frame along the radial direction; The fill light is arranged on the inner wall of the shell and around the edge of the collection window.

8. A method for detecting arc deformation of a bonding wire, characterized in that: Using the bonding wire arc deformation detection device according to any one of claims 5 to 7; The steps include: Acquire detection parameters, and acquire velocity (v) and acceleration (a) data of the bonding wire arc to be tested in a limit state of movement according to the dynamic service environment of the bonding wire arc to be tested; Installing the bonding wire arc to be tested, and bonding the bonding wire arc to be tested to a predetermined position of the test piece according to the design structure of the bonding wire arc to be tested; Install and debug the test piece according to the formula: Calculating the rotation radius of the test piece and fixing the test piece at a corresponding position of the placement portion; Adjust the position of the collecting unit according to the installation position of the test piece, so that the collecting unit is aligned with the test piece, and adjust the focal length; Set the rotation parameters according to Calculating the rotational angular velocity of the test piece, and setting the rotational speed of the turntable according to the rotational angular velocity; Acquire an image, drive the turntable to rotate, and control the acquisition unit to acquire test image data of the test piece whenever the test piece passes the position where the acquisition unit is located; Calculate the offset, compare the test image data with the initial state of the test piece, and obtain the maximum offset distance d of the arc of the bond wire to be tested in the moving state 偏移 ; Determine whether the stiffness of the arc of the bonding wire to be tested is qualified, and compare the offset distance d 偏移 The designed installation gap d between the arc of the bonding wire to be tested 间隙 , if d 偏移 ≥d 间隙 , then the stiffness of the arc of the bonding wire to be tested is unqualified and needs to be redesigned. 偏移 <d 间隙 , then the stiffness of the arc of the bonding wire to be tested is qualified and the design is completed.

9. The bonding wire arc deformation detection method according to claim 8, characterized in that: The shooting frame rate f of the acquisition unit should satisfy Where v is the speed and D is the diameter of the bonding wire; And / or, between the two steps of installing and debugging the test piece and adjusting the position of the collection part, the step also includes adjusting the environment inside the closed chamber, and adjusting the air pressure and temperature inside the closed chamber according to the dynamic service environment of the bonding wire arc to be tested.

10. The bonding wire arc deformation detection method according to claim 8, characterized in that: The step of installing the bonding wire arc to be tested also includes fixing two ends of the bonding wire arc to be tested to the first point and the second point of the test piece respectively, and marking the highest point of the bonding wire arc to be tested; The step of calculating the offset also includes measuring the offset of the highest point in the test image data relative to the line connecting the first point and the second point, which is recorded as the maximum offset distance d 偏移 .

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