Wafer automatic test device and test method

Abstract

The invention discloses an automatic wafer testing device which comprises a supporting table body, a testing table body is arranged at the top of the supporting table body, a servo motor is arranged at the bottom of the supporting table body, the output end of the servo motor is connected with the middle of the bottom of the testing table body through a coupler, two supporting frames are arranged on the two opposite sides of the testing table body respectively, and the two supporting frames are arranged in parallel. A supporting plate is arranged at the tops of the two supporting frames, a linear module is arranged on the supporting plate, a testing mechanism is arranged below the supporting plate and connected with the linear module, the portion, below the testing mechanism, of the testing table body is set as a testing station, and the portion, on one side of the testing station, of the testing table body is set as a feeding and discharging station. By arranging a series of structures, multi-station operation is achieved, testing is convenient and efficient, wafer limiting testing is achieved, damage to wafers and testing probes caused by abnormal testing is avoided, running is safe, testing is accurate, the application range is wide, the testing structure surface is clean, testing interference is prevented, and the running life of testing equipment is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and in particular to an automatic wafer testing device and a testing method. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits, and its original material is silicon. Wafer testing is also called chip testing or wafer electrical testing. After wafer manufacturing is completed, testing the wafer is a very important step. Wafer testing is to perform needle testing on each grain on the wafer. A probe made of gold wire as thin as a hair is installed on the detection head to contact the contacts on the grain to test its electrical characteristics. Unqualified grains will be marked, and then when the wafer is cut into independent grains according to the grain unit, the unqualified grains marked with marks will be eliminated and will not be used for the next process, so as not to increase manufacturing costs and reduce the yield rate. During the test process, the electrical capabilities and circuit functions of each chip are detected.

[0003] During the current wafer testing process, the test probe moves down and contacts the tested surface of the wafer for testing. However, when the testing equipment is malfunctioning, the test probe moves downward without a limit stop, resulting in excessive downward movement of the test probe, causing a collision between the test probe and the wafer being tested that is greater than the test force, which may cause damage to the test probe and the wafer being tested. Contamination on the test surfaces of the test probe and the wafer being tested will affect the accuracy of the test. In addition, in the non-testing state, the test probe exposed to space is easily damaged by accidental contact, which affects the service life of the equipment. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a wafer automatic testing device and a testing method to solve the above-mentioned technical problems existing in the prior art.

[0005] The technical solution adopted by the present invention to solve the above technical problems is: A wafer automatic testing device comprises a supporting platform, a testing platform is provided on the top of the supporting platform, a servo motor is provided on the bottom of the supporting platform, an output end of the servo motor is connected to the middle of the bottom of the testing platform through a coupling, supporting frames are provided on opposite sides of the testing platform, two supporting frames are provided, a supporting plate is provided on the top of the two supporting frames, a linear module is provided on the supporting plate, a testing mechanism is provided below the supporting plate, the testing mechanism is connected to the linear module, the testing platform below the testing mechanism is set as a testing station, the testing platform on one side of the testing station is set as an upper unloading station, an electric telescopic rod is provided on the supporting plate on one side of the linear module, a cleaning plate is provided at the bottom of the electric telescopic rod, the testing platform below the cleaning plate is set as a cleaning station, a cleaning mechanism is provided on the top of the testing platform, a testing fixture is provided on the top of the testing platform, and a wafer body is clamped on the top of the testing platform through the testing fixture; The testing mechanism includes a carrier frame, a moving seat, a limiting mechanism, a No. 2 hydraulic cylinder and a wafer testing board. A moving seat is provided on the top of the carrier frame, and the moving seat is threadedly connected to the threaded rod on the linear module. A limiting mechanism is provided on the bottom of the carrier frame. A No. 2 hydraulic cylinder is provided below the carrier frame through the limiting mechanism. The output end of the No. 2 hydraulic cylinder is connected to the testing frame through a hydraulic rod. Both opposite ends of the testing frame are connected to the wafer testing board through a connecting frame. The wafer testing board moves downward and is limited by the limiting mechanism to test the wafer body on the testing station of the testing platform. The cleaning mechanism is arranged corresponding to the wafer testing board.

[0006] Furthermore, the wafer test board includes a test bench, a probe mounting plate and a test probe; the test bench is integrally provided at the edge of the top of the probe mounting plate, a T-shaped structure is arranged between the test bench and the probe mounting plate, the top of the probe mounting plate is arranged in a groove structure, a test probe is arranged on the probe mounting plate in the groove structure, and opposite ends of the top of the test bench are connected to the connecting frame; The limiting mechanism includes a No. 1 hydraulic cylinder, a guide rod, a limit platform, a limit hole and a sensor. A No. 1 hydraulic cylinder is provided at the bottom of the opposite sides of the support frame. The output end of the No. 1 hydraulic cylinder is connected to the guide rod through a hydraulic rod. There are two No. 1 hydraulic cylinders and two guide rods. The bottoms of the two guide rods are connected to the opposite sides of the top of the limit platform. A limit hole is provided on the limit platform between the two guide rods. The limit platform is correspondingly arranged with the test platform, and the limit holes are correspondingly arranged with the probe mounting plate. Sensors are provided at the bottom of the limit platform on the opposite sides of the limit holes, and the upper ends of the two guide rods are connected to the No. 2 hydraulic cylinder through the mounting frame.

[0007] Furthermore, a guide seat is provided on one side of the two connecting frames away from the test frame, the guide seat is slidably arranged on the guide rod, the probe mounting plate is arranged in a conical structure, the limiting hole is arranged in a circular hole structure, the probe mounting plate is arranged inside the limiting hole, the bottom of the test bench is arranged on the top of the limiting bench, and the test probe at the bottom of the probe mounting plate passes through the limiting hole and is arranged corresponding to the wafer body test on the test station.

[0008] Furthermore, the cleaning mechanism includes a cleaning seat and a cleaning core. The cleaning seat is provided on the top of the test bench body, and the lower end of the cleaning seat is embedded in the interior of the test bench body. A accommodating groove is provided on the cleaning seat, and a cleaning core is provided in the accommodating groove of the cleaning seat through a locking bolt, and the top of the cleaning core is arranged corresponding to the bottom of the test probe.

[0009] Furthermore, the test fixture is composed of a hydraulic cylinder and a clamping plate, the hydraulic cylinder is connected to the clamping plate through a hydraulic rod, the clamping plate is configured as an arc-shaped plate, and a buffer pad is provided at one end of the clamping plate away from the hydraulic rod.

[0010] Furthermore, a limiting groove is provided on the top of the support platform, and the test platform is arranged in a T-shaped truncated table structure, and the lower end of the test platform is rotatably arranged in the limiting groove of the support platform.

[0011] A test method for a wafer automatic test device, the test method comprising the following steps: Step 1, debugging: According to the model of the wafer body to be tested, the wafer testing equipment is debugged to make the wafer testing equipment compatible with the wafer body to be tested; Step 2, test: the wafer body to be tested is loaded and clamped at the upper unloading station - the cleaning plate cleans the tested surface of the wafer body at the cleaning station - the testing mechanism tests the wafer body at the testing station - after the test, the wafer body to be tested is unloaded from the upper unloading station; Step 3, cleaning: During the wafer body test, the cleaning mechanism on the test table rotates through the test mechanism, and the cleaning core cleans the test probes on the probe mounting plate.

[0012] Furthermore, the debugging includes testing mechanism debugging and cleaning mechanism debugging. The testing mechanism debugging adjusts the height of the limit table by means of the No. 1 hydraulic cylinder according to the thickness of the wafer body to be tested, and senses the wafer body to be tested by means of the sensor; the cleaning mechanism debugging adjusts the height of the top of the cleaning core on the cleaning seat according to the height of the limit table, so that the top of the cleaning core contacts the bottom of the limit table.

[0013] Furthermore, the specific steps of the wafer body test are: the wafer body is clamped on the test station of the test bench, the No. 2 hydraulic cylinder drives the test frame and the wafer test plate to move downward through the hydraulic rod, the probe mounting plate and the test probe move downward in the limit hole, and the bottom of the test probe extends out of the limit table from the limit hole. When the bottom of the test bench moves down to the top of the limit table, the test probe passes through the limit hole and contacts the test surface of the wafer body on the test station for testing.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. The wafer automatic testing device and testing method described above are provided with a test table body on a supporting table body, and an unloading station, a cleaning station and a testing station are arranged on the test table body. The test equipment has a multi-station design, and the operation and testing are convenient and efficient. The test table, the probe mounting plate, the limit table and the limit hole on the test mechanism cooperate to realize the limit test function of the wafer body, and avoid damage to the wafer body and the test probe due to abnormal testing. The limit and test can adapt to the model thickness adjustment of the wafer body, so that the test equipment is safe in operation, accurate in testing and has a wide range of adaptability.

[0015] 2. The described wafer automatic testing device and testing method, through the electric telescopic rod and cleaning plate arranged on the support frame, the cleaning seat and cleaning core arranged on the test table, the cleaning plate cleans the tested surface of the wafer body rotating on the test table, and the cleaning core cleans the test probe rotating on the test table, that is, the test equipment has the function of cleaning the test surface, prevents the test surface contamination from interfering with the test, and the test is accurate.

[0016] 3. The wafer automatic testing device and testing method described above, by setting a limit table and a limit hole, the test probe is set in the limit hole, the limit table plays a protective role on the test probe, can prevent the test probe on the test equipment from being damaged, and extend the operating life of the test equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the test bench in the present invention; Figure 3 It is a structural schematic diagram of the testing mechanism in the present invention; Figure 4 It is a structural schematic diagram of a wafer testing board in the present invention; Figure 5 It is a structural schematic diagram of the test bench in the present invention; Figure 6 FIG. 4 is a diagram showing the working principle of the sensor in the present invention.

[0018] In the figure: 1. support platform; 11. servo motor; 2. test platform; 3. support frame; 31. support plate; 32. linear module; 4. test mechanism; 41. load frame; 42. moving seat; 43. No. 1 hydraulic cylinder; 44. guide rod; 45. No. 2 hydraulic cylinder; 451. mounting frame; 46. test frame; 47. connecting frame; 471. guide seat; 48. wafer test plate; 481. test platform; 482. probe mounting plate; 483. test probe; 49. limit platform; 491. limit hole; 410. sensor; 5. electric telescopic rod; 51. cleaning plate; 6. cleaning mechanism; 61. cleaning seat; 62. cleaning core; 7. test fixture; 8. wafer body. DETAILED DESCRIPTION

[0019] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0020] Example 1: Figure 1-6As shown, the wafer automatic testing device includes a support platform 1, a test platform 2 is arranged on the top of the support platform 1, a servo motor 11 is arranged at the bottom of the support platform 1, the output end of the servo motor 11 is connected to the middle of the bottom of the test platform 2 through a coupling, support frames 3 are arranged on opposite sides of the test platform 2, and two support frames 3 are arranged, and support plates 31 are arranged on the top of the two support frames 3, and linear modules 32 are arranged on the support plates 31, and a test mechanism 4 is arranged below the support plates 31, and the test mechanism 4 is connected to the linear module 32, and the test platform below the test mechanism 4 The test bench body 2 is set as a test station, the test bench body 2 on one side of the test station is set as an upper unloading station, an electric telescopic rod 5 is provided on the support plate 31 on one side of the linear module 32, a cleaning plate 51 is provided at the bottom of the electric telescopic rod 5, and the test bench body 2 below the cleaning plate 51 is set as a cleaning station, a cleaning mechanism 6 is provided on the top of the test bench body 2, a test fixture 7 is provided on the top of the test bench body 2, and a wafer body 8 is clamped on the top of the test bench body 2 through the test fixture 7; the test mechanism 4 includes a carrier 41, a moving seat 42, a limit mechanism, a second hydraulic cylinder 45 and a wafer test plate 48, a moving seat 42 is provided on the top of the carrier 41, and the moving seat 42 is threadedly connected to the threaded rod on the linear module 32, and a limiting mechanism is provided at the bottom of the carrier 41. A second hydraulic cylinder 45 is provided below the carrier 41 through the limiting mechanism, and the output end of the second hydraulic cylinder 45 is connected to the test frame 46 through the hydraulic rod, and the opposite ends of the test frame 46 are connected to the wafer test board 48 through the connecting frame 47. The wafer test board 48 moves down and is limited by the limiting mechanism to test the wafer body 8 on the test station of the test platform 2, and the cleaning mechanism 6 is aligned with the wafer test board 48. It should be set up that the test table 2 of the test equipment is equipped with an unloading station, a cleaning station and a testing station. The test equipment has a multi-station design, which is convenient and efficient to operate and test, and realizes the limit test function of the wafer body 8 to avoid damage to the wafer body 8 and the test equipment due to abnormal testing. The limit and test can adapt to the model thickness adjustment of the wafer body 8. The test equipment has the function of cleaning the test surface to prevent the interference of test surface contamination on the test, and the test is accurate. Therefore, the test equipment is safe in operation, accurate in testing, has a wide range of adaptability, and extends the operating life of the test equipment.

[0021] Specifically, the wafer test board 48 includes a test table 481, a probe mounting plate 482 and a test probe 483; the edge of the top of the probe mounting plate 482 is integrally provided with the test table 481, a T-shaped structure is arranged between the test table 481 and the probe mounting plate 482, the top of the probe mounting plate 482 is arranged in a groove structure, and the probe mounting plate 482 in the groove structure is provided with a test probe 483, and the two opposite ends of the top of the test table 481 are connected to the connecting frame 47; the limiting mechanism includes a No. 1 hydraulic cylinder 43, Guide rod 44, limit table 49, limit hole 491 and sensor 410, the bottom of the two opposite sides of the carrier 41 is provided with a No. 1 hydraulic cylinder 43, the output end of the No. 1 hydraulic cylinder 43 is connected to the guide rod 44 through a hydraulic rod, and the No. 1 hydraulic cylinder 43 and the guide rod 44 are provided with two, the bottom of the two guide rods 44 are connected to the two opposite sides of the top of the limit table 49, and the limit table 49 between the two guide rods 44 is provided with a limit hole 491, and the limit table 49 is set corresponding to the test table 481, and the limit hole 491 is set corresponding to the test table 481. 1 is arranged corresponding to the probe mounting plate 482, and the bottom of the limiting platform 49 on both sides of the limiting hole 491 is provided with a sensor 410, and the upper ends of the two guide rods 44 are connected to the second hydraulic cylinder 45 through the mounting frame 451. The cleaned wafer body 8 is rotated to the test station below the test mechanism 4, and the second hydraulic cylinder 45 drives the test frame 46, the connecting frame 47, and the wafer test plate 48 to move downward through the hydraulic rod, and the probe mounting plate 482 and the test probe 483 move downward in the limiting hole 491, and the test probe 48 3 extends out of the limit platform 49 through the limit hole 491. Since the probe mounting plate 482 is arranged inside the limit hole 491, the bottom of the test platform 481 is arranged on the top of the limit platform 49, and the test probe 483 at the bottom of the probe mounting plate 482 passes through the limit hole 491 and is set corresponding to the wafer body 8 on the test station, when the bottom of the test platform 481 moves down to the top of the limit platform 49, the test probe 483 passes through the limit hole 491 and contacts the test surface of the wafer body 8 on the test station for testing.

[0022] Furthermore, a guide seat 471 is provided on one side of the two connecting frames 47 away from the test frame 46, and the guide seat 471 is slidably arranged on the guide rod 44, the probe mounting plate 482 is arranged in a conical structure, and the limiting hole 491 is arranged in a circular hole structure. The probe mounting plate 482 is arranged inside the limiting hole 491, and the bottom of the test table 481 is arranged on the top of the limiting table 49, and the test probe 483 at the bottom of the probe mounting plate 482 passes through the limiting hole 491 and is arranged corresponding to the wafer body 8 on the test station. The up and down movement of the needle mounting plate 482 is guided by the guide seat 471 sliding on the guide rod 44, so that the test movement of the connecting frame 47 and the probe mounting plate 482 is stable, and the conical structure of the probe mounting plate 482 corresponds to the limiting hole 491 of the circular hole structure. The probe mounting plate 482 is guided to move up and down in the limiting hole 491, and at the same time, the limiting hole 491 limits the downward movement of the probe mounting plate 482, that is, the lower limit of the downward movement of the probe mounting plate 482 in the limiting hole 491 corresponds to the test position of the test probe 483.

[0023] Furthermore, the cleaning mechanism 6 includes a cleaning seat 61 and a cleaning core 62. The cleaning seat 61 is provided on the top of the test bench body 2, and the lower end of the cleaning seat 61 is embedded in the interior of the test bench body 2. A receiving groove is provided on the cleaning seat 61, and a cleaning core 62 is provided in the receiving groove of the cleaning seat 61 through a locking bolt. The top of the cleaning core 62 is arranged corresponding to the bottom of the test probe 483, and the tightness of the locking bolt can adjust the height of the cleaning core 62 on the cleaning seat 61, which is convenient to adjust.

[0024] Furthermore, the test fixture 7 consists of a hydraulic cylinder and a clamping plate. The hydraulic cylinder is connected to the clamping plate through a hydraulic rod. The clamping plate is set as an arc-shaped plate. A buffer pad is provided at one end of the clamping plate away from the hydraulic rod. The height of the clamping plate is lower than the thickness of the wafer, which is convenient for clamping.

[0025] Furthermore, a limiting groove is provided on the top of the support platform 1, and the test platform 2 is arranged in a T-shaped truncated table structure. The lower end of the test platform 2 is rotatably arranged in the limiting groove of the support platform 1, and the test platform 2 rotates stably on the support platform 1.

[0026] Embodiment 2: A test method for a wafer automatic test device, the test method comprising the following steps: Step 1, debugging: According to the model of the wafer body 8 to be tested, the wafer testing equipment is debugged to make the wafer testing equipment compatible with the wafer body 8 to be tested; Step 2, testing: the wafer body 8 to be tested is loaded and clamped by the upper unloading station—the cleaning plate 51 cleans the tested surface of the wafer body 8 at the cleaning station—the testing mechanism 4 tests the wafer body 8 at the testing station—after the test, the wafer body 8 to be tested is unloaded by the upper unloading station; Step 3, cleaning: During the test of the wafer body 8 , the cleaning mechanism 6 on the test platform 2 rotates through the test mechanism 4 , and the cleaning core 62 cleans the test probes 483 on the probe mounting plate 482 .

[0027] Furthermore, the debugging includes debugging of the testing mechanism 4 and debugging of the cleaning mechanism 6. The debugging of the testing mechanism 4 adjusts the height of the limit table 49 by means of the No. 1 hydraulic cylinder 43 according to the thickness of the wafer body 8 to be tested, and senses the wafer body 8 to be tested by means of the sensor 410. The debugging of the cleaning mechanism 6 adjusts the height of the top of the cleaning core 62 on the cleaning seat 61 according to the height of the limit table 49, so that the top of the cleaning core 62 contacts the bottom of the limit table 49, and the test surface is cleaned.

[0028] Furthermore, the specific steps of testing the wafer body 8 are as follows: the wafer body 8 is clamped on the test station of the test bench 2, the No. 2 hydraulic cylinder 45 drives the test frame 46 and the wafer test plate 48 to move downward through the hydraulic rod, the probe mounting plate 482 and the test probe 483 move downward in the limit hole 491, and the bottom of the test probe 483 extends out of the limit platform 49 through the limit hole 491. When the bottom of the test bench 481 moves down to the top of the limit platform 49, the test probe 483 passes through the limit hole 491 and contacts the test surface of the wafer body 8 on the test station for testing, and the wafer body 8 undergoes a limit test.

[0029] The method of using this embodiment is as follows: according to the model of the wafer body 8 to be tested, the wafer testing equipment is debugged to make the wafer testing equipment compatible with the wafer body 8 to be tested, that is, the testing mechanism 4 and the cleaning mechanism 6 on the testing equipment are debugged. When the testing mechanism 4 is debugged, one of the wafer bodies 8 is placed on the testing station of the testing table 2. According to the thickness of the wafer body 8 to be tested, the No. 1 hydraulic cylinder 43 drives the guide rod 44 to move up and down through the hydraulic rod. The mounting frame 451 and the limit platform 49 on the guide rod 44 move up and down synchronously. The downward movement height of the limit platform 49 is sensed by the sensor 410 at the bottom thereof to the wafer body 8 to be tested. When the sensor 410 contacts the wafer body 8 to be tested, The No. 1 hydraulic cylinder 43 stops debugging the limit table 49; when the cleaning mechanism 6 is debugged, the height of the top of the cleaning core 62 on the cleaning seat 61 is adjusted according to the height of the limit table 49 after debugging, so that the top of the cleaning core 62 contacts the bottom of the limit table 49; after the test equipment is debugged, the wafer bodies 8 to be tested in batches are loaded onto the test table 2 at the upper unloading station, the test fixture 7 fixes the wafer bodies 8, the servo motor 11 drives the test table 2 to rotate on the top of the support table 1, the wafer bodies 8 clamped at the upper unloading station on the test table 2 rotate through the cleaning station, and the electric telescopic rod 5 on the support frame 3 drives the cleaning plate 51 to move downward, and the cleaning plate 51 clamps the wafer bodies 8 on the test table 2. The wafer body 8 that has been cleaned by the test surface is rotated to the test station under the test mechanism 4. The No. 2 hydraulic cylinder 45 drives the test frame 46, the connecting frame 47, and the wafer test plate 48 to move downward through the hydraulic rod. The probe mounting plate 482 and the test probe 483 move downward in the limiting hole 491, and the bottom of the test probe 483 extends out of the limiting platform 49 from the limiting hole 491. Since the probe mounting plate 482 is arranged inside the limiting hole 491, the bottom of the test platform 481 is arranged on the top of the limiting platform 49, and the test probe 483 at the bottom of the probe mounting plate 482 passes through the limiting hole 491 and is set corresponding to the wafer body 8 test on the test station; when the test platform 481 When the bottom moves down to the top of the limit table 49, the test probe 483 passes through the limit hole 491 and contacts the test surface of the wafer body 8 on the test station for testing. After the test, the wafer body 8 is rotated to the upper unloading station to be removed. The test table body 2 of the test equipment is provided with an upper unloading station, a cleaning station and a test station. The test equipment has a multi-station design, which is convenient and efficient to operate and test. The test table 481 and the probe mounting plate 482 on the test mechanism 4 cooperate with the limit table 49 and the limit hole 491 to realize the limit test function of the wafer body 8, avoid damage to the wafer body 8 and the test probe 483 due to abnormal testing, and the limit and test can adapt to the model thickness adjustment of the wafer body 8;The test equipment has the function of cleaning the test surface, preventing the test surface pollution from interfering with the test, and the test is accurate, so that the test equipment is safe to operate, accurate to test, and has a wide range of applications. The test probe 483 is arranged in the limit hole 491, and the limit table 49 protects the test probe 483, which can prevent the test probe 483 on the test equipment from being damaged and extend the operating life of the test equipment. ;

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art may modify or replace the technical solutions described in the above embodiments. Any modification, equivalent replacement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer automatic testing device, comprising a support platform (1), characterized in that: A test bench body (2) is provided on the top of the support platform body (1), a servo motor (11) is provided on the bottom of the support platform body (1), an output end of the servo motor (11) is connected to the middle of the bottom of the test bench body (2) via a coupling, support frames (3) are provided on opposite sides of the test bench body (2), a support plate (31) is provided on the top of the support frame (3), a linear module (32) is provided on the support plate (31), a test mechanism (4) is provided below the support plate (31), the test mechanism (4) is connected to the linear module (32), and the test mechanism (4) is connected to the linear module (32). ) is set as a test station, the test station (2) on one side of the test station is set as an upper unloading station, an electric telescopic rod (5) is provided on the support plate (31) on one side of the linear module (32), a cleaning plate (51) is provided at the bottom of the electric telescopic rod (5), the test station (2) below the cleaning plate (51) is set as a cleaning station, a cleaning mechanism (6) is provided on the top of the test station (2), a test fixture (7) is provided on the top of the test station (2), and a wafer body (8) is clamped on the top of the test station (2) through the test fixture (7); The testing mechanism (4) comprises a carrier (41), a movable seat (42), a limiting mechanism, a second hydraulic cylinder (45) and a wafer testing board (48). The top of the carrier (41) is provided with a movable seat (42), the movable seat (42) is threadedly connected to a threaded rod on a linear module (32), the bottom of the carrier (41) is provided with a limiting mechanism, a second hydraulic cylinder (45) is provided below the carrier (41) through the limiting mechanism, the output end of the second hydraulic cylinder (45) is connected to a testing frame (46) through a hydraulic rod, the opposite ends of the testing frame (46) are connected to a wafer testing board (48) through a connecting frame (47), the wafer testing board (48) moves downward and is limited by the limiting mechanism to test a wafer body (8) on a testing station of the testing platform (2), and the cleaning mechanism (6) is arranged corresponding to the wafer testing board (48).

2. The wafer automatic testing device according to claim 1, characterized in that: The wafer test board (48) comprises a test table (481), a probe mounting plate (482) and a test probe (483); the test table (481) is integrally provided at the edge of the top of the probe mounting plate (482); a T-shaped structure is arranged between the test table (481) and the probe mounting plate (482); the top of the probe mounting plate (482) is arranged in a groove structure; the test probe (483) is arranged on the probe mounting plate (482) in the groove structure; and opposite ends of the top of the test table (481) are connected to a connecting frame (47); The limiting mechanism comprises a No. 1 hydraulic cylinder (43), a guide rod (44), a limiting platform (49), a limiting hole (491) and a sensor (410). The bottom of the supporting frame (41) is provided with a No. 1 hydraulic cylinder (43) on both sides opposite to each other. The output end of the No. 1 hydraulic cylinder (43) is connected to the guide rod (44) through a hydraulic rod. The No. 1 hydraulic cylinder (43) and the guide rod (44) are each provided with two. The bottoms of the two guide rods (44) are connected to the two sides opposite to each other at the top of the limiting platform (49). The limiting platform (49) between the two guide rods (44) is provided with a limiting hole (491). The limiting platform (49) and the test platform (481) are arranged correspondingly, and the limiting hole (491) and the probe mounting plate (482) are arranged correspondingly. The bottom of the limiting platform (49) on both sides opposite to the limiting hole (491) is provided with a sensor (410). The upper ends of the two guide rods (44) are connected to the No. 2 hydraulic cylinder (45) through a mounting frame (451).

3. The wafer automatic testing device according to claim 2, characterized in that: A guide seat (471) is provided on one side of the two connecting frames (47) away from the test frame (46); the guide seat (471) is slidably arranged on the guide rod (44); the probe mounting plate (482) is arranged in a conical structure; the limiting hole (491) is arranged in a circular hole structure; the probe mounting plate (482) is arranged inside the limiting hole (491); the bottom of the test table (481) is arranged on the top of the limiting table (49); and the test probe (483) at the bottom of the probe mounting plate (482) passes through the limiting hole (491) and is arranged corresponding to the wafer body (8) on the test station for testing.

4. The wafer automatic testing device according to claim 2, characterized in that: The cleaning mechanism (6) comprises a cleaning seat (61) and a cleaning core (62); the cleaning seat (61) is provided on the top of the test bench body (2); the lower end of the cleaning seat (61) is embedded in the interior of the test bench body (2); a receiving groove is provided on the cleaning seat (61); the cleaning core (62) is provided in the receiving groove of the cleaning seat (61) via a locking bolt; the top of the cleaning core (62) is arranged corresponding to the bottom of the test probe (483).

5. The wafer automatic testing device according to claim 1, characterized in that: The test fixture (7) is composed of a hydraulic cylinder and a clamping plate. The hydraulic cylinder is connected to the clamping plate via a hydraulic rod. The clamping plate is provided in the form of an arc-shaped plate. A buffer pad is provided at one end of the clamping plate away from the hydraulic rod.

6. The wafer automatic testing device according to claim 1, characterized in that: The top of the support platform (1) is provided with a limiting groove, the test platform (2) is arranged in a T-shaped truncated platform structure, and the lower end of the test platform (2) is rotatably arranged in the limiting groove of the support platform (1).

7. A test method for a wafer automatic test device according to any one of claims 1 to 6, characterized in that: The test method includes the following steps: Step 1, debugging: According to the model of the wafer body (8) to be tested, the wafer testing equipment is debugged to make the wafer testing equipment compatible with the wafer body (8) to be tested; Step 2, testing: the wafer body (8) to be tested is loaded and clamped at the upper unloading station - the cleaning plate (51) cleans the tested surface of the wafer body (8) at the cleaning station - the testing mechanism (4) tests the wafer body (8) at the testing station - after the test, the wafer body (8) to be tested is unloaded from the upper unloading station; Step 3, cleaning: During the test of the wafer body (8), the cleaning mechanism (6) on the test platform (2) rotates through the test mechanism (4), and the cleaning core (62) cleans the test probe (483) on the probe mounting plate (482).

8. The test method of the wafer automatic test device according to claim 7, characterized in that: The debugging includes debugging of the testing mechanism (4) and debugging of the cleaning mechanism (6). The debugging of the testing mechanism (4) is to adjust the height of the limit table (49) through the No. 1 hydraulic cylinder (43) according to the thickness of the wafer body (8) to be tested, and sense the wafer body (8) to be tested through the sensor (410); the debugging of the cleaning mechanism (6) is to adjust the height of the top of the cleaning core (62) on the cleaning seat (61) according to the height of the limit table (49), so that the top of the cleaning core (62) contacts the bottom of the limit table (49).

9. The test method of the wafer automatic test device according to claim 7, characterized in that: The specific steps of testing the wafer body (8) are as follows: the wafer body (8) is clamped on the test station of the test bench body (2); the No. 2 hydraulic cylinder (45) drives the test frame (46) and the wafer test plate (48) to move downward through the hydraulic rod; the probe mounting plate (482) and the test probe (483) move downward in the limit hole (491); the bottom of the test probe (483) extends out of the limit table (49) from the limit hole (491); when the bottom of the test bench (481) moves down to the top of the limit table (49), the test probe (483) passes through the limit hole (491) and contacts the test surface of the wafer body (8) on the test station for testing.

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