Sealing door assembly, transmission chamber and semiconductor process equipment

By adopting a spherical fit design in the connection assembly of the sealing door assembly, the problem of large friction between the shaft sleeve and the guide rail in the transmission chamber is solved, reducing the generation of impurity particles and improving the quality of the wafer.

CN119400727AActive Publication Date: 2025-02-07BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Patent Information

Application Number
CN202411464927.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-18
Publication Date
2025-02-07
Estimated Expiration
2044-10-18

AI Technical Summary

Technical Problem

In the related art, the transmission chamber has a large friction between the shaft sleeve and the guide rail, resulting in more impurity particles and affecting the quality of the wafer.

Method used

A connecting assembly structure including a first bushing, a second bushing and a slider is adopted to make the first bushing and the second bushing angle compensate by spherical cooperation, thereby reducing friction between the bushing and the guide rail.

Benefits of technology

By reducing friction, impurity particles generated by friction are reduced, thereby improving the quality of the wafer.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a sealing door assembly, a transmission chamber and semiconductor process equipment, the sealing door assembly comprises a door plate, a guide rail and a connecting assembly, the connecting assembly comprises a first bushing, a second bushing and a sliding block, the second bushing is sleeved outside the first bushing, and the sliding block is sleeved outside the second bushing. The second lining is arranged on the sliding block, the inner surface of the second lining is in spherical fit with the outer surface of the first lining, the second lining is arranged on the sliding block, the door plate is connected with the sliding block, the first lining is arranged on the guide rail in a sliding and sleeving mode, and in the process that the door plate moves along the guide rail through sliding fit of the first lining and the guide rail, the second lining is arranged on the sliding block. And the first bushing and the second bushing perform angle compensation on the first bushing through spherical surface fit. According to the scheme, the problem that in a transmission cavity in the related technology, the friction between the shaft sleeve and the guide rail is large, and consequently the number of impurity particles is large can be solved.
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Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a sealed door assembly, a transfer chamber and semiconductor process equipment. Background Art

[0002] In semiconductor process equipment, the transfer chamber is used to provide a transition area between different process chambers to maintain the environmental conditions inside each process chamber and prevent the process chambers from contaminating each other or preventing external air from contaminating the inside of the process chamber. The transfer chamber has a transfer channel, and both ends of the transfer channel are provided with sealing door assemblies, which are used to seal or open the film transfer ports at both ends of the transfer channel. The sealing door assemblies at both ends of the transfer channel cannot be opened at the same time. Opening them at the same time will cause the process chambers on both sides of the transfer chamber to communicate with each other and destroy the environment of the process chamber.

[0003] In the related art, the door panel of the sealing door assembly is slidably mounted on the guide rail through a shaft sleeve, and the door panel can slide along the guide rail through the shaft sleeve, so that the door panel can be moved to a position opposite to or offset from the film transmission port. However, the door panel may have debugging errors during installation or may be deformed after long-term use. When the door panel has debugging errors during installation or is deformed after long-term use, the central axis of the shaft sleeve may be too far away from the extension direction of the guide rail, thereby increasing the friction between the shaft sleeve and the guide rail during the movement of the door panel. The increased friction between the shaft sleeve and the guide rail will produce more foreign particles, which are easy to fall on the wafer during the transmission process, thereby affecting the quality of the wafer. Therefore, the transmission chamber in the related art has the problem of more foreign particles due to the large friction between the shaft sleeve and the guide rail. Summary of the invention

[0004] The invention discloses a sealing door assembly, a transmission chamber and a semiconductor process equipment, so as to solve the problem that the friction between the shaft sleeve and the guide rail in the transmission chamber in the related art is large, resulting in a large number of foreign particles.

[0005] In order to solve the above-mentioned technical problems, the present invention is achieved as follows: In a first aspect, the present application discloses a sealing door assembly, which includes a door panel, a guide rail and a connecting assembly, wherein the connecting assembly includes a first bushing, a second bushing and a slider, wherein the second bushing is sleeved outside the first bushing, and the inner surface of the second bushing is spherically matched with the outer surface of the first bushing, the second bushing is arranged on the slider, the door panel is connected to the slider, the first bushing is slidably sleeved on the guide rail, and when the door panel moves along the guide rail through the sliding fit between the first bushing and the guide rail, the first bushing and the second bushing perform angle compensation for the first bushing through spherical fit.

[0006] In the second aspect, the present application further discloses a transmission chamber, which comprises a chamber body and the sealing door assembly described in the first aspect, wherein the chamber body has a film transmission opening, the guide rail is arranged on the chamber body, and the door panel can be moved to a position opposite to or offset from the film transmission opening through the sliding fit between the first bushing and the guide rail. During the movement of the door panel relative to the guide rail, the first bushing and the second bushing perform angle compensation for the first bushing through spherical fit.

[0007] In the third aspect, the present application also discloses a semiconductor process equipment, which includes a reaction chamber, a microenvironment chamber, an atmospheric chamber and the transmission chamber described in the second aspect, wherein the transmission chamber is connected between the atmospheric chamber and the microenvironment chamber, and the reaction chamber is connected to the microenvironment chamber.

[0008] The technical solution adopted by the present invention can achieve the following technical effects: The sealing door assembly disclosed in the embodiment of the present application is configured such that the second bushing is sleeved on the first bushing, and the inner surface of the second bushing is spherically matched with the outer surface of the first bushing, so that the first bushing can rotate in any direction relative to the second bushing; the second bushing is configured on the slider, the door panel is connected to the slider, and the first bushing is slidably sleeved on the guide rail, so that in the process of the door panel moving relative to the guide rail, if there is a debugging error in the door panel during installation or the door panel is deformed after long-term use, etc., resulting in a large angle between the extension direction of the central axis of the first bushing and the extension direction of the guide rail, the first bushing can rotate relative to the second bushing to compensate for the angle of the first bushing, so that the angle between the extension direction of the central axis of the first bushing and the extension direction of the guide rail is reduced, thereby reducing the friction force of the first bushing when sliding along the guide rail, and further reducing the foreign particles generated by the friction between the first bushing and the guide rail. After the foreign particles are reduced, the foreign particles falling on the wafers in the transmission process can be reduced, which is beneficial to improving the quality of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic structural diagram of a transmission chamber disclosed in an embodiment of the present invention at a first viewing angle; Figure 2 A partial schematic diagram of a sealing door assembly disclosed in an embodiment of the present invention; Figure 3 A partial cross-sectional view of a sealing door assembly disclosed in an embodiment of the present invention; Figure 4 It is a schematic structural diagram of the transmission chamber disclosed in an embodiment of the present invention at a second viewing angle; Figure 5A schematic diagram of a partial structure of a transmission chamber disclosed in an embodiment of the present invention; Figure 6 It is a partial schematic diagram of a wafer box positioning mechanism disclosed in an embodiment of the present invention, wherein a represents a first direction and b represents a second direction; Figure 7 A schematic diagram of the structure of a base disclosed in an embodiment of the present invention; Figure 8 It is a partial schematic diagram of a wafer box positioning mechanism disclosed in an embodiment of the present invention; Fig. 9 It is an overall schematic diagram of a wafer box positioning mechanism disclosed in an embodiment of the present invention; Fig.10 A schematic diagram of the cooperation between the wafer box positioning mechanism and the base disclosed in an embodiment of the present invention; Fig.11 A schematic diagram of a clamping assembly disclosed in an embodiment of the present invention without clamping a base; Fig.12 A schematic diagram of a clamping base of a clamping assembly disclosed in an embodiment of the present invention; Fig.13 A schematic diagram of the coordination of the exhaust branch pipe, the pressure controller, and the one-way valve disclosed in an embodiment of the present invention; Fig.14 A schematic structural diagram of a semiconductor process equipment disclosed in an embodiment of the present invention.

[0010] Description of reference numerals: A-Transmission chamber, 100-chamber body, 110-transmission channel, 210-door panel, 211-first position limiting recess, 212-transparent window, 220-guide rail, 230-connecting member, 240-door frame, 250-reset spring, 260-first driving member, 280-second driving member, 300-connection assembly, 310-first bushing, 311-recess, 320-second bushing, 321-boss, 330-slider, 331-mounting hole, 332-limiting overlap, 340-limiting baffle, 341-arc-shaped avoidance recess, 400-wafer box positioning mechanism, 410-carrier, 421-first support member, 421a-second limiting recess, 431-second support member, 431a-first boss, 431b-second boss, 441-clamping body, 442-elastic buffer, 443-back plate, 451-third driving member, 452-rotating shaft, 453-mounting seat, 454-transmission assembly, 454a-first rod, 454b-second rod, 510-base, 511-crossbeam, 511a-slot, 512-side beam, 610-exhaust branch pipe, 620-exhaust main pipe, 630-pressure controller, 640-check valve, 641-valve body, 641a-valve body inlet, 641b-valve body outlet, 642-blocking piece, 650-intake pipe, 710 - reaction chamber, 720 - microenvironment chamber, 721 - second manipulator, 730 - atmospheric chamber, 731 - first manipulator. DETAILED DESCRIPTION

[0011] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0012] The technical solutions disclosed in various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0013] Please refer to Figures 1 to 14 An embodiment of the present invention discloses a sealing door assembly, which is applied to a transmission chamber A and is used to seal a film transmission port of a chamber body 100 of the transmission chamber A.

[0014] The disclosed sealing door assembly includes a door plate 210, a guide rail 220, and a connecting assembly 300. The sealing door assembly seals the film transmission port of the chamber body 100 through the door plate 210. Specifically, a sealing strip may be provided on one side of the door plate 210 facing the chamber body 100, and when the door plate 210 is close to the film transmission port, the sealing strip may be sealed and connected between the door plate 210 and the chamber body 100, thereby sealing the film transmission port of the chamber body 100.

[0015] The guide rail 220 may be a cylindrical structure, a prismatic structure, or other structures. The embodiment of the present application does not impose any specific limitation on the structure of the guide rail 220 .

[0016] The connecting assembly 300 includes a first bushing 310, a second bushing 320 and a slider 330. The second bushing 320 is sleeved outside the first bushing 310, and the inner surface of the second bushing 320 is spherically matched with the outer surface of the first bushing 310. The inner surface of the second bushing 320 and the outer surface of the first bushing 310 are both part of a sphere, and the center of the inner surface of the second bushing 320 coincides with the center of the outer surface of the first bushing 310, and the second bushing 320 and the first bushing 310 can rotate relative to each other at any angle around the center of the sphere.

[0017] The second bushing 320 is disposed on the slider 330 , and the second bushing 320 can be connected to the slider 330 by bonding, welding, etc. The embodiment of the present application does not limit the connection method between the second bushing 320 and the slider 330 .

[0018] The door panel 210 is connected to the slider 330, and the door panel 210 and the slider 330 can be connected by bolt connection, welding, etc., and the embodiment of the present application does not limit the connection method between the door panel 210 and the slider 330. The first bushing 310 is slidably sleeved on the guide rail 220, and the first bushing 310 can slide along the guide rail 220, so that the door panel 210 moves along the guide rail 220 through the sliding fit between the first bushing 310 and the guide rail 220. The movement of the door panel 210 along the guide rail 220 can be driven by the second driving member 280, and the second driving member 280 can be a motor, a cylinder, etc., and the embodiment of the present application does not specifically limit the type of the second driving member 280.

[0019] When the door panel 210 moves along the guide rail 220 through the sliding fit between the first bushing 310 and the guide rail 220, the first bushing 310 and the second bushing 320 perform angle compensation on the first bushing 310 through spherical fit to reduce the angle between the extension direction of the central axis of the first bushing 310 and the extension direction of the guide rail 220.

[0020] The sealed door assembly disclosed in the embodiment of the present application is configured such that the connecting assembly 300 includes a first bushing 310, a second bushing 320 and a slider 330, so that the second bushing 320 is sleeved on the first bushing 310, and the inner surface of the second bushing 320 is spherically matched with the outer surface of the first bushing 310, so that the first bushing 310 can rotate in any direction relative to the second bushing 320; by arranging the second bushing 320 on the slider 330, the door panel 210 is connected to the slider 330, and the first bushing 310 is slidably sleeved on the guide rail 220, so that during the movement of the door panel 210 relative to the guide rail 220, if there is a debugging error in the door panel 210 during installation or the door panel 210 is used for a long time, When the plate 210 is deformed, resulting in a large angle between the extension direction of the central axis of the first bushing 310 and the extension direction of the guide rail 220, the first bushing 310 can be rotated relative to the second bushing 320 to compensate for the angle of the first bushing 310, so that the angle between the extension direction of the central axis of the first bushing 310 and the extension direction of the guide rail 220 is reduced, thereby reducing the friction force of the first bushing 310 when sliding along the guide rail 220, and further reducing the impurity particles generated by friction between the first bushing 310 and the guide rail 220. After the impurity particles are reduced, the impurity particles falling on the wafer during the transmission process can be reduced, which is beneficial to improving the quality of the wafer.

[0021] Specifically, the first bushing 310 and the second bushing 320 perform angle compensation on the first bushing 310 through spherical matching, so that the angle between the extension direction of the central axis of the first bushing 310 and the extension direction of the guide rail 220 can be reduced to a preset angle or below the preset angle. For example, the first bushing 310 and the second bushing 320 perform angle compensation on the first bushing 310 through spherical matching, so that the extension direction of the central axis of the first bushing 310 and the extension direction of the guide rail 220 can be parallel, so that the friction between the first bushing 310 and the guide rail 220 is kept to a minimum, and then the foreign particles generated by the friction can be further reduced.

[0022] Due to the assembly relationship of the various components of the sealing door assembly, if the rotation angle between the second bushing 320 and the first bushing 310 is too large, the inclination angle between the slider 330 and the guide rail 220 will increase, which will cause interference between the slider 330 and the guide rail 220. When the rotation angle between the second bushing 320 and the first bushing 310 is too large, it may also cause interference between the door panel 210 and the guide rail 220 or other components of the transmission chamber A.

[0023] In order to avoid the above-mentioned problem caused by the excessive rotation angle between the second bushing 320 and the first bushing 310, optionally, at the spherical mating position of the second bushing 320 and the first bushing 310, one may have a boss portion 321, and the other may have a recessed portion 311. The boss portion 321 may be a cylindrical boss, and the opening profile of the recessed portion 311 may be circular. Of course, the structures of the boss portion 321 and the recessed portion 311 may also be other structures, for example, the boss portion 321 may be a prismatic boss, and the opening profile of the recessed portion 311 may be elliptical. The embodiment of the present application does not limit the structures of the boss portion 321 and the recessed portion 311, and can be specifically designed according to the mating relationship between the various components of the sealing door assembly and the installation position of the sealing door assembly.

[0024] The top surface of the boss portion 321 can be spherically matched with the bottom surface of the recessed portion 311. The side of the boss portion 321 can be used to limit the side of the recessed portion 311 so that the angle between the central axis of the first bushing 310 and the central axis of the second bushing 320 is less than or equal to a preset angle.

[0025] It should be noted that the top surface of the boss portion 321 of the second bushing 320 or the bottom surface of the recessed portion 311 is a concave surface, and the bottom surface of the recessed portion 311 of the first bushing 310 or the top surface of the boss portion 321 is a convex surface. The side edge of the boss portion 321 is an annular side edge connected to the top surface of the boss portion 321, and the side edge of the recessed portion 311 is an annular side edge connected to the bottom surface of the recessed portion 311.

[0026] The sealing door assembly disclosed in the embodiment of the present application is configured such that a boss portion 321 is provided on one of the second bushing 320 and the first bushing 310, and a recessed portion 311 is provided on the other at the spherical mating position of the second bushing 320 and the first bushing 310, the top surface of the boss portion 321 and the bottom surface of the recessed portion 311 are spherically mated, and the side edge of the boss portion 321 and the side edge of the recessed portion 311 are limitedly mated, so that the angle between the central axis of the first bushing 310 and the central axis of the second bushing 320 is less than or equal to a preset angle, so that the rotation angle between the second bushing 320 and the first bushing 310 is prevented from being too large, thereby preventing the inclination angle between the slider 330 and the guide rail 220 from being too large, causing interference between the slider 330 and the guide rail 220, and preventing interference between the door panel 210 and the guide rail 220 or other components of the transmission chamber A. Moreover, the spherical matching of the top surface of the boss portion 321 and the bottom surface of the recessed portion 311 is helpful to reduce the contact area between the second bushing 320 and the first bushing 310 at the spherical matching point, thereby helping to reduce the friction between the second bushing 320 and the first bushing 310.

[0027] In order to stably limit the angle between the central axis of the first bushing 310 and the central axis of the second bushing 320 to be less than or equal to a preset angle, optionally, a first spherical fit and a second spherical fit may be provided between the second bushing 320 and the first bushing 310, and the second bushing 320 and the first bushing 310 may both be provided with a boss portion 321 or a recessed portion 311 at the first spherical fit and the second spherical fit, and the first spherical fit and the second spherical fit are symmetrically distributed on both sides of the central axis of the first bushing 310.

[0028] The sealing door assembly disclosed in the embodiment of the present application is provided with a boss portion 321 or a recessed portion 311 at the first spherical mating position and the second spherical mating position, so that under the limiting cooperation of the side edges of the two groups of boss portions 321 and the side edges of the recessed portion 311, the angle between the central axis of the first bushing 310 and the central axis of the second bushing 320 can be stably limited to be less than or equal to a preset angle.

[0029] In order to make the connection between the second bushing 320 and the slider 330 more stable, optionally, the slider 330 may be provided with a mounting hole 331, and the second bushing 320 may be arranged in the mounting hole 331. The mounting hole 331 may be a through hole, and the connection assembly 300 may further include a limit baffle 340, which may have an arc-shaped avoidance recess 341, and the limit baffle 340 may be arranged on the slider 330. The limit baffle 340 may be connected to the slider 330 by bonding, welding, bolt connection, etc., and the embodiment of the present application does not limit the connection method between the limit baffle 340 and the slider 330. The edge of the arc-shaped avoidance recess 341 is located at the orifice of the mounting hole 331, and the edge of the arc-shaped avoidance recess 341 can cover the area of ​​the mounting hole 331 opposite to the second bushing 320. The edge of the arc-shaped avoidance recess 341 can be limitedly matched with the second bushing 320 in the direction of the orifice of the mounting hole 331 to limit the second bushing 320 from moving out of the orifice of the mounting hole 331, thereby making the installation of the second bushing 320 more stable. The arc-shaped avoidance recess 341 avoids the guide rail 220. It should be noted that the second bushing 320 can be installed in the mounting hole 331 by interference fit, so that the second bushing 320 is fixedly installed in the mounting hole 331. Of course, the second bushing 320 can also be rotatably arranged in the mounting hole 331, and the mounting hole 331 can be a step hole, and the side of the second bushing 320 away from the limit baffle 340 can contact the step surface of the step hole.

[0030] In the related art, the door panel 210 and the slider 330 are connected by only one bolt, and the door panel 210 and the slider 330 are prone to rotation, and frequent rotations easily lead to poor connection stability between the door panel 210 and the slider 330. In order to improve the connection stability between the door panel 210 and the slider 330, optionally, the door panel 210 may have a first position-limiting recess 211, and the slider 330 may have a position-limiting overlap portion 332, and the position-limiting overlap portion 332 may overlap the first position-limiting recess 211, and the shape of the position-limiting overlap portion 332 is adapted to the shape of the first position-limiting recess 211.

[0031] The sealed door assembly disclosed in the embodiment of the present application is provided with a first limiting recess 211 on the door panel 210, and a limiting overlap portion 332 is provided on the slider 330, and the shape of the limiting overlap portion 332 is adapted to the shape of the first limiting recess 211, so that the door panel 210 is connected to the slider 330 through the connecting member 230, the limiting overlap portion 332 overlaps the first limiting recess 211, and the outer edge of the limiting overlap portion 332 is limitedly matched with the inner edge of the first limiting recess 211 to limit the rotation of the door panel 210 and the slider 330, thereby improving the connection stability between the door panel 210 and the slider 330. Furthermore, the sealing door assembly may further include a connecting member 230, and the door panel 210 may be connected to the slider 330 through the connecting member 230, so that the connection between the door panel 210 and the slider 330 is more stable. The connecting member 230 may be a connecting bolt, a connecting pin, or the like.

[0032] Optionally, the sealing door assembly may further include a door frame 240, a reset spring 250 and a first driving member 260, the guide rail 220 may be provided on the door frame 240, and the door panel 210 may be provided on the door frame 240 through the connecting assembly 300 and the guide rail 220. The first end of the door frame 240 may be used to be connected to the chamber body 100 of the transmission chamber A through the reset spring 250, the first driving member 260 may be used to be connected between the second end of the door frame 240 and the chamber body 100, and the first end of the door frame 240 and the second end of the door frame 240 may be arranged opposite to each other. The first driving member 260 may be used to drive the second end of the door frame 240 to approach or move away from the chamber body 100, so that the door panel 210 is in sealing contact with the film transmission port or is separated from the film transmission port when the door panel 210 is opposite to the film transmission port of the chamber body 100.

[0033] Specifically, when the first driving member 260 drives the second end of the door frame 240 to approach the chamber body 100, the door frame 240 drives the door plate 210 to move toward the film transmission port, so that the door plate 210 is in sealing contact with the film transmission port. When the first driving member 260 drives the second end of the door frame 240 away from the chamber body 100, the door frame 240 drives the door plate 210 to move in a direction away from the film transmission port, so that the door plate 210 is separated from the film transmission port.

[0034] The sealing door assembly disclosed in the embodiment of the present application is provided with a door frame 240, a reset spring 250 and a first driving member 260, so that the first end of the door frame 240 is connected to the chamber body 100 of the transmission chamber A through the reset spring 250, and the first driving member 260 is connected between the second end of the door frame 240 and the chamber body 100. The guide rail 220 can be provided on the door frame 240, so that when the door panel 210 is opposite to the film transmission port of the chamber body 100, the first driving member 260 drives the second end of the door frame 240 to approach the chamber body 100, so that the door frame 240 drives the door panel 210 to be in sealing contact with the film transmission port, or the first driving member 260 drives the second end of the door frame 240 away from the chamber body 100, so that the door frame 240 drives the door panel 210 to separate from the film transmission port, thereby realizing the sealing contact and separation of the door panel 210 and the film transmission port. Moreover, the first end of the door frame 240 is connected to the chamber body 100 of the transmission chamber A through the reset spring 250, so that compared with the connection between the door frame 240 and the chamber body 100 through the pin shaft, friction can be avoided and the generation of foreign particles can be reduced.

[0035] The present application also discloses a transmission chamber A, which includes a chamber body 100 and a sealing door assembly disclosed in the above embodiment, wherein the chamber body 100 has a film transmission port, and a guide rail 220 is arranged on the chamber body 100. The door panel 210 can be moved to a position opposite to or offset from the film transmission port through the sliding fit between the first bushing 310 and the guide rail 220. During the movement of the door panel 210 relative to the guide rail 220, the first bushing 310 and the second bushing 320 perform angle compensation on the first bushing 310 through spherical fit.

[0036] The transmission chamber A disclosed in the embodiment of the present application can reduce the foreign particles generated by friction between the first bushing 310 and the guide rail 220 by setting the sealing door assembly disclosed in the above embodiment. After the foreign particles are reduced, the foreign particles falling on the wafer during the transmission process can be reduced, which is beneficial to improving the quality of the wafer.

[0037] During the specific application of the transfer chamber A, the wafer box carrying the wafer needs to be transferred from the atmospheric chamber 730 to the transfer channel 110 of the transfer chamber A by the first robot 731, and then the film transfer port of the transfer channel 110 connected to the atmospheric chamber 730 is closed by the sealing door assembly, and then the sealing door assembly on the film transfer port side of the transfer channel 110 connected to the microenvironment chamber 720 is opened, and the second robot 721 in the microenvironment chamber 720 grabs the wafer from the wafer box and transports it to the reaction chamber 710. After the process of the wafers in the reaction chamber 710 is completed, the second robot 721 transports the wafers to the wafer box. After the process of the wafers on the wafer box in the reaction chamber 710 is completed, the sealing door assembly on the side of the wafer transfer port of the transmission channel 110 connected to the micro-environment chamber 720 is closed, and the sealing door assembly on the side of the wafer transfer port of the transmission channel 110 connected to the atmospheric chamber 730 is opened, so that the wafer box is taken out of the transmission channel 110 by the first robot 731.

[0038] When the wafer box is transferred to the transfer channel 110, it needs to be placed on the wafer box positioning mechanism 400. In order to improve the stability of the wafer box placed on the wafer box positioning mechanism 400, the transfer chamber A may also include a wafer box positioning mechanism 400. The wafer box positioning mechanism 400 may include a carrier 410, a first support assembly and a second support assembly. The first support assembly may be spaced apart from the second support assembly along the first direction. The first support assembly may include two first support members 421, and the second support assembly may include two second support members 431. The two first support members 421 may be spaced apart on the carrier 410 along the second direction, and the two second support members 431 may be spaced apart on the carrier 410 along the second direction, and the first direction is perpendicular to the second direction.

[0039] The first support member 421 may have a first limiting portion, and the second support member 431 may have a second limiting portion. When the two first support members 421 and the two second support members 431 jointly support a wafer box, the first limiting portion and the second limiting portion may both limit the wafer box in the second direction.

[0040] Specifically, the first limiting part and the second limiting part can both be limiting posts or limiting grooves, and the wafer box can be provided with limiting grooves or limiting posts accordingly, and the first support member 421 and the second support member 431 can limit the wafer box by plugging and matching the limiting posts and the limiting grooves, so as to limit the movement of the wafer box in the second direction relative to the first support member 421 and the second support member 431. Of course, the first limiting part and the second limiting part can also be other structures, which will be described in detail later and will not be repeated here.

[0041] The transfer chamber A disclosed in the embodiment of the present application is provided with a wafer box positioning mechanism 400, and the wafer box positioning mechanism 400 is provided as a structure including a carrier 410, a first support assembly and a second support assembly, so that the first support assembly and the second support assembly are spaced apart along the first direction, and the two first support members 421 of the first support assembly are spaced apart along the second direction on the carrier 410, and the two second support members 431 of the second support assembly are spaced apart along the second direction on the carrier 410, and the first support member 421 has a first limiting portion, and the second support member 431 has a second limiting portion. When the two first support members 421 and the two second support members 431 jointly support the wafer box, the first limiting portion and the second limiting portion both limit the wafer box in the second direction, thereby improving the stability of the wafer box placed on the wafer box positioning mechanism 400.

[0042] In an optional embodiment, the first limiting portion may include a second limiting recess 421a provided on the first support member 421 and facing the inner side of the two first support members 421, and the second limiting portion may include a first boss 431a, and the first boss 431a may extend along the first direction. The base 510 of the wafer box may include a crossbeam 511 and two side beams 512 connected to both ends of the crossbeam 511. The crossbeam 511 is provided with a slot 511a.

[0043] When the two first support members 421 and the two second support members 431 jointly support a wafer box, the side beam 512 can be supported on the bottom surface of the second limiting recess 421a, the cross beam 511 can be supported on the first boss 431a through the bottom wall of the slot 511a, the side walls of the second limiting recess 421a located on the two first support members 421 can cooperate with the side beam 512 for limiting positioning in the second direction, and the first boss 431a located on the two second support members 431 can cooperate with the side walls of the slot 511a for limiting positioning in the second direction.

[0044] It should be noted that the side wall of the second limiting recess 421a is a side wall connected to the bottom surface of the second limiting recess 421a, and the side wall of the slot 511a is a side wall connected to the bottom wall of the slot 511a.

[0045] The transfer chamber A disclosed in the embodiment of the present application is configured such that the first limiting portion is configured to include a second limiting recess 421a opened on the first support member 421 and facing the inner side of the two first support members 421, and the second limiting portion is configured to include a first boss 431a, so that when the two first support members 421 and the two second support members 431 jointly support a wafer box, the side beam 512 is supported on the bottom surface of the second limiting recess 421a, the cross beam 511 is supported on the first boss 431a through the bottom wall of the slot 511a, the side wall of the second limiting recess 421a located on the two first support members 421 cooperates with the side beam 512 for limiting positioning in the second direction, and the first boss 431a located on the two second support members 431 cooperates with the side wall of the slot 511a for limiting positioning in the second direction, thereby improving the stability of the wafer box placed on the wafer box positioning mechanism 400.

[0046] In order to further improve the stability of the wafer box placed on the wafer box positioning mechanism 400, optionally, the second support member 431 may also include a second boss 431b, and the second boss 431b may extend along the second direction. The wafer box positioning mechanism 400 may also include a clamping assembly and a clamping drive mechanism, and the clamping drive mechanism may be provided on the carrier 410, and the clamping assembly may be connected to the clamping drive mechanism. In the case where the two first support members 421 and the two second support members 431 jointly support the wafer box, the clamping drive mechanism may drive the clamping assembly to clamp the crossbeam 511 between the second boss 431b and the clamping assembly to limit the wafer box in the first direction.

[0047] The transfer chamber A disclosed in the embodiment of the present application is provided with a clamping assembly and a clamping drive mechanism, and the second support member 431 is provided with a structure that also includes a second boss 431b, so that when the two first support members 421 and the two second support members 431 jointly support a wafer box, the clamping drive mechanism drives the clamping assembly to clamp the beam 511 between the second boss 431b and the clamping assembly to limit the wafer box in the first direction, so that the wafer box is limited in both the first direction and the second direction, which can further improve the stability of the wafer box placed on the wafer box positioning mechanism 400.

[0048] Since the wafer box is usually made of quartz, the wafer box is relatively brittle. In order to avoid damage to the wafer box due to a large rigid contact force when the clamping assembly contacts the crossbeam 511, the clamping assembly may optionally include a clamping body 441 and an elastic buffer 442. The clamping drive mechanism may be connected to the clamping body 441, and the elastic buffer 442 may be provided on the clamping body 441. The clamping drive mechanism may drive the elastic buffer 442 through the clamping body 441 to clamp the crossbeam 511 between the second boss 431b and the elastic buffer 442.

[0049] The transfer chamber A disclosed in the embodiment of the present application is configured with a clamping assembly to include a clamping body 441 and an elastic buffer 442, so that the clamping drive mechanism can drive the elastic buffer 442 through the clamping body 441 to clamp the beam 511 between the second boss 431b and the elastic buffer 442, thereby avoiding rigid contact of the wafer box under the buffering action of the elastic buffer 442, thereby avoiding damage to the wafer box.

[0050] Specifically, the elastic buffer 442 may be elastic rubber, a spring, etc., and the embodiment of the present application does not specifically limit the type of the elastic buffer 442 .

[0051] In the case where the wafer box positioning mechanism 400 includes at least two clamping assemblies, in order to make the at least two clamping assemblies move synchronously, optionally, the clamping drive mechanism may include a third drive member 451, a rotating shaft 452 and a mounting seat 453. The third drive member 451 and the mounting seat 453 may both be disposed on the carrier 410, the rotating shaft 452 may be rotatably disposed on the mounting seat 453, and the third drive member 451 may be connected to the rotating shaft 452. The wafer box positioning mechanism 400 may include at least two clamping assemblies, and the at least two clamping assemblies may be spaced apart along the second direction and both connected to the rotating shaft 452. The third drive member 451 may be used to drive the rotating shaft 452 to rotate, so that the rotating shaft 452 drives the clamping assembly to switch between the first position and the second position.

[0052] When the clamping assembly is located at the first position, the clamping assembly clamps the crossbeam 511 between the second boss 431 b and the clamping assembly. When the clamping assembly is located at the second position, the clamping assembly is separated from the crossbeam 511 .

[0053] The transmission chamber A disclosed in the embodiment of the present application is configured such that the clamping drive mechanism is configured to include a third drive member 451, a rotating shaft 452 and a mounting seat 453, so that the third drive member 451 can drive the rotating shaft 452 to rotate, so that the rotating shaft 452 drives at least two clamping components to switch between the first position and the second position, thereby allowing at least two clamping components to move synchronously.

[0054] Specifically, when the clamping assembly includes the clamping body 441 and the elastic buffer 442, the clamping assembly may further include a back plate 443, and the clamping body 441 may be connected to the rotating shaft 452 through the back plate 443. The rotating shaft 452 and the mounting seat 453 may be rotatably connected through a bearing, and the bearing may be an oil-free bushing, and the bearing may be made of a smooth resin material, which may reduce the friction of the mechanism rotation and reduce the generation of impurities.

[0055] Optionally, the clamping drive mechanism may further include a transmission assembly 454, which may include a first rod 454a and a second rod 454b. The first end of the first rod 454a may be hinged to the third drive member 451, the second end of the first rod 454a may be hinged to the first end of the second rod 454b, the second end of the second rod 454b may be fixedly connected to the rotating shaft 452, and the third drive member 451 may drive the rotating shaft 452 to rotate via the first rod 454a and the second rod 454b.

[0056] The transmission chamber A disclosed in the embodiment of the present application is configured such that the transmission assembly 454 is configured to include a first rod 454a and a second rod 454b, so that the first end of the first rod 454a is hinged to the third driving member 451, the second end of the first rod 454a is hinged to the first end of the second rod 454b, and the second end of the second rod 454b is fixedly connected to the rotating shaft 452. By configuring the first rod 454a and the second rod 454b, the third driving member 451 drives the rotating shaft 452 to rotate through the first rod 454a and the second rod 454b, thereby facilitating the arrangement of the third driving member 451, the rotating shaft 452 and other components.

[0057] In order to improve the transmission efficiency, the chamber body 100 is usually provided with a plurality of transmission channels 110, and the openings on both sides of the transmission channels 110 can be film transmission ports. In the case where the chamber body 100 is provided with a plurality of transmission channels 110, the plurality of transmission channels 110 share a common exhaust manifold 620. In order to prevent the gas in the transmission channel 110 in the atmospheric state from flowing back into the transmission channel 110 in the vacuum state through the exhaust manifold 620, the transmission chamber A can optionally further include an exhaust branch pipe 610, an exhaust manifold 620 and a pressure controller 630. Each transmission channel 110 can be respectively connected to an exhaust branch pipe 610, and the exhaust branch pipe 610 can be connected between the transmission channel 110 and the exhaust manifold 620.

[0058] The exhaust branch pipe 610 may be provided with a pressure controller 630, which may be used to control the gas pressure in the exhaust branch pipe 610 so that the internal pressure of the exhaust branch pipe 610 at a portion between the chamber body 100 and the pressure controller 630 is greater than the internal pressure of the exhaust branch pipe 610 at a portion between the pressure controller 630 and the exhaust main pipe 620.

[0059] The transmission chamber A disclosed in the embodiment of the present application is provided with a pressure controller 630 on the exhaust branch pipe 610, so that the pressure controller 630 can control the gas pressure in the exhaust branch pipe 610, so that the internal pressure of the exhaust branch pipe 610 located between the chamber body 100 and the pressure controller 630 is greater than the internal pressure of the exhaust branch pipe 610 located between the pressure controller 630 and the exhaust main pipe 620, thereby preventing the gas in the transmission channel 110 in the atmospheric state from flowing back into the transmission channel 110 in the vacuum state through the exhaust main pipe 620, thereby protecting the environmental state in each transmission channel 110.

[0060] It should be noted that the transmission chamber A may also include an air inlet pipe 650 , and the transmission chamber A may cooperate with the exhaust branch pipe 610 through the air inlet pipe 650 to adjust the environmental characteristics of the transmission channel 110 (such as switching between a vacuum environment and an atmospheric environment).

[0061] In order to further protect the environmental conditions in each transmission channel 110, the transmission chamber A may optionally further include a one-way valve 640, which may be provided in the exhaust branch pipe 610 and located between the transmission channel 110 and the pressure controller 630. When the gas pressure at the portion of the exhaust branch pipe 610 between the transmission channel 110 and the one-way valve 640 is greater than the gas pressure at the portion between the one-way valve 640 and the pressure controller 630, the one-way valve 640 may be in an open state. When the gas pressure at the portion of the exhaust branch pipe 610 between the transmission channel 110 and the one-way valve 640 is less than the gas pressure at the portion between the one-way valve 640 and the pressure controller 630, the one-way valve 640 may be in a closed state.

[0062] The transmission chamber A disclosed in the embodiment of the present application is provided with a one-way valve 640 in the exhaust branch pipe 610, and the one-way valve 640 is located between the transmission channel 110 and the pressure controller 630, so that when the gas pressure at the portion of the exhaust branch pipe 610 between the transmission channel 110 and the one-way valve 640 is lower than the gas pressure at the portion between the one-way valve 640 and the pressure controller 630, the one-way valve 640 is in a closed state, thereby further preventing the gas in the transmission channel 110 in the atmospheric state from flowing back into the transmission channel 110 in the vacuum state through the exhaust main pipe 620, thereby better protecting the environmental state in each transmission channel 110.

[0063] Specifically, the one-way valve 640 may be an electronic valve, and the one-way valve 640 may automatically control the opening and closing of the one-way valve 640 by detecting the pressure on both sides of the exhaust branch pipe 610 .

[0064] In another embodiment, the one-way valve 640 may include a valve body 641 and a baffle 642, the valve body 641 may have a valve body inlet 641a and a valve body outlet 641b, the portion of the exhaust branch pipe 610 located between the transmission channel 110 and the one-way valve 640 may be communicated with the valve body inlet 641a, the portion of the exhaust branch pipe 610 located between the one-way valve 640 and the pressure controller 630 may be communicated with the valve body outlet 641b, and the baffle 642 may be rotatably disposed in the valve body 641. When the gas pressure at the portion of the exhaust branch pipe 610 located between the transmission channel 110 and the one-way valve 640 is greater than the gas pressure at the portion between the one-way valve 640 and the pressure controller 630, the baffle 642 may open the valve body inlet 641a under the action of the pressure difference to achieve exhaust of the transmission channel 110. When the gas pressure at the portion of the exhaust branch pipe 610 between the transmission channel 110 and the one-way valve 640 is lower than the gas pressure at the portion between the one-way valve 640 and the pressure controller 630, the baffle 642 can block the valve body inlet under the action of gravity.

[0065] The transmission chamber A disclosed in the embodiment of the present application is configured such that the one-way valve 640 is configured to include a valve body 641 and a baffle 642, so that when the gas pressure at a portion of the exhaust branch pipe 610 between the transmission channel 110 and the one-way valve 640 is greater than the gas pressure at a portion between the one-way valve 640 and the pressure controller 630, the baffle 642 can open the valve body inlet under the action of the pressure difference; when the gas pressure at a portion of the exhaust branch pipe 610 between the transmission channel 110 and the one-way valve 640 is less than the gas pressure at a portion between the one-way valve 640 and the pressure controller 630, the baffle 642 can block the valve body inlet under the action of gravity, so that the one-way valve 640 can be opened and closed according to its own structural characteristics, and the structure of this one-way valve 640 is relatively simple.

[0066] In order to facilitate the operator to observe the situation in the transmission channel 110 , optionally, the door panel 210 may have a transparent window 212 , and the operator may observe the situation in the transmission channel 110 through the transparent window 212 .

[0067] In order to avoid the problem that the wafer protrudes out of the wafer box due to the unstable transmission of the first manipulator 731, which may cause wafer fragments when the second manipulator 721 grabs the wafer, optionally, the transmission chamber A may also include a wafer box positioning mechanism 400 and a sensor assembly. When the wafer box positioning mechanism 400 carries a wafer box, the sensor assembly may be used to detect whether the length of the wafer in the wafer box protruding from the wafer box exceeds a preset length. When the length of the wafer protruding from the wafer box exceeds a preset length, the second manipulator 721 may skip the wafer whose length protruding from the wafer box exceeds the preset length, and grab the next wafer, and so on, thereby avoiding the problem that the second manipulator 721 may easily cause wafer fragments when grabbing the wafer.

[0068] Specifically, the sensor assembly may include a laser sensor and a reflector, and the laser sensor and the reflector may be arranged opposite to each other and at intervals. The detection light emitted by the laser sensor reaches the reflector, and the reflector reflects the detection light emitted by the laser sensor and is received by the laser sensor. After the positions of the laser sensor and the reflector are set, it can be determined whether the wafer has a convex phenomenon according to whether the detection light emitted by the laser sensor is blocked.

[0069] Laser sensors and reflectors can also be used to detect different types of wafers. For example, when the wafer is made of a transparent material, the detection light emitted by the laser sensor can pass through the wafer and reach the reflector. The reflector reflects the detection light emitted by the laser sensor and is received by the laser sensor. When the detection light emitted by the laser sensor cannot pass through the wafer, it can be determined that the wafer is made of a non-transparent material.

[0070] The sensor assembly can be movably arranged on the chamber body 100. By setting the position of the sensor assembly, it can be applied to detecting whether there are protrusions on wafers of different sizes (e.g., six-inch wafers and eight-inch wafers). The sensor assembly can also be used to detect notched wafers and flat-edge wafers, which is related to the setting position of the sensor assembly, and the specific setting will not be repeated.

[0071] The present application also discloses a semiconductor process equipment, which includes a reaction chamber 710, a microenvironment chamber 720, an atmospheric chamber 730 and the transmission chamber A disclosed in the above embodiment, wherein the transmission chamber A is connected between the atmospheric chamber 730 and the microenvironment chamber 720, and the reaction chamber 710 is connected to the microenvironment chamber 720.

[0072] Specifically, a first manipulator 731 may be provided in the atmospheric chamber 730, and a second manipulator 721 may be provided in the microenvironment chamber 720. When it is necessary to transfer the wafer located in the atmospheric chamber 730 to the reaction chamber 710, the film transfer port of the transfer channel 110 of the transfer chamber A connected to the microenvironment chamber 720 is first closed by the sealing door assembly, and the sealing door assembly on the film transfer port of the transfer channel 110 connected to the atmospheric chamber 730 is opened. The first manipulator 731 can transfer the wafer box carrying the wafer from the atmospheric chamber 730 to the transfer channel 110, and place the wafer box on the wafer box positioning mechanism 400. Then, the sealing door assembly on the film transfer port of the transfer channel 110 connected to the atmospheric chamber 730 is closed, and the sealing door assembly on the film transfer port of the transfer channel 110 connected to the microenvironment chamber 720 is opened, and the second manipulator 721 grabs the wafer from the wafer box and transfers it to the reaction chamber 710.

[0073] After the process of the wafers in the reaction chamber 710 is completed, the second robot 721 transports the wafers to the wafer box. After the process of the wafers on the wafer box in the reaction chamber 710 is completed, the sealing door assembly on the side of the wafer transfer port of the transmission channel 110 connected to the micro-environment chamber 720 is closed, and the sealing door assembly on the side of the wafer transfer port of the transmission channel 110 connected to the atmospheric chamber 730 is opened. The wafer box is transferred from the transmission channel 110 to the atmospheric chamber 730 by the first robot 731.

[0074] The semiconductor process chamber disclosed in the embodiment of the present application can reduce the impurity particles generated by friction between the first bushing 310 and the guide rail 220 by setting the transfer chamber A disclosed in the above embodiment. After the impurity particles are reduced, the impurity particles falling on the wafer during the transfer process can be reduced, which is beneficial to improving the quality of the wafer.

[0075] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0076] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A sealed door assembly, characterized in that: The invention comprises a door panel (210), a guide rail (220) and a connection assembly (300), wherein the connection assembly (300) comprises a first bushing (310), a second bushing (320) and a slider (330), wherein the second bushing (320) is sleeved outside the first bushing (310), and the inner surface of the second bushing (320) is spherically matched with the outer surface of the first bushing (310), the second bushing (320) is arranged on the slider (330), the door panel (210) is connected to the slider (330), the first bushing (310) is slidably sleeved on the guide rail (220), and when the door panel (210) moves along the guide rail (220) through the sliding match between the first bushing (310) and the guide rail (220), the first bushing (310) and the second bushing (320) perform angle compensation for the first bushing (310) through spherical match.

2. The sealing door assembly according to claim 1, characterized in that: At the spherical mating position of the second bushing (320) and the first bushing (310), one has a boss portion (321) and the other has a recessed portion (311); the top surface of the boss portion (321) and the bottom surface of the recessed portion (311) are spherically mated; the side edge of the boss portion (321) is used to be limitedly mated with the side edge of the recessed portion (311) so that the angle between the central axis of the first bushing (310) and the central axis of the second bushing (320) is less than or equal to a preset angle.

3. The sealing door assembly according to claim 2, characterized in that: A first spherical fitting portion and a second spherical fitting portion are provided between the second bushing (320) and the first bushing (310), and the second bushing (320) and the first bushing (310) are both provided with the boss portion (321) or the recessed portion (311) at the first spherical fitting portion and the second spherical fitting portion, and the first spherical fitting portion and the second spherical fitting portion are symmetrically distributed on both sides of the central axis of the first bushing (310).

4. The sealing door assembly according to claim 1, characterized in that: The slider (330) is provided with a mounting hole (331), the second bushing (320) is arranged in the mounting hole (331), the connection assembly (300) further comprises a limit baffle (340), the limit baffle (340) has an arc-shaped avoidance recess (341), the limit baffle (340) is arranged on the slider (330), the edge of the arc-shaped avoidance recess (341) is located at the opening of the mounting hole (331), so as to cooperate with the second bushing (320) in a direction of the opening of the mounting hole (331), and the arc-shaped avoidance recess (341) avoids the guide rail (220).

5. The sealing door assembly according to claim 1, characterized in that: The door panel (210) has a first position-limiting recess (211), and the sliding block (330) has a position-limiting overlapping portion (332), the position-limiting overlapping portion (332) overlaps the first position-limiting recess (211), and the shape of the position-limiting overlapping portion (332) matches the shape of the first position-limiting recess (211).

6. The sealing door assembly according to claim 1, characterized in that: The sealed door assembly further comprises a door frame (240), a reset spring (250) and a first driving member (260); the guide rail (220) is arranged on the door frame (240); a first end of the door frame (240) is connected to a chamber body (100) of the transmission chamber via the reset spring (250); and the first driving member (260) is connected between a second end of the door frame (240) and the chamber body (100) and is used for driving the second end of the door frame (240) to move closer to or farther from the chamber body (100).

7. A transmission chamber, characterized in that: The invention comprises a chamber body (100) and a sealing door assembly as claimed in any one of claims 1 to 6, wherein the chamber body (100) has a film transmission opening, the guide rail (220) is arranged on the chamber body (100), and the door panel (210) can be moved to a position opposite to or offset from the film transmission opening through the sliding fit between the first bushing (310) and the guide rail (220). During the movement of the door panel (210) relative to the guide rail (220), the first bushing (310) and the second bushing (320) perform angle compensation for the first bushing (310) through spherical fit.

8. The transfer chamber according to claim 7, characterized in that: The transfer chamber (A) further comprises a wafer box positioning mechanism (400), wherein the wafer box positioning mechanism (400) comprises a carrier (410), a first support assembly and a second support assembly, wherein the first support assembly and the second support assembly are spaced apart along the first direction, the first support assembly comprises two first support members (421), and the second support assembly comprises two second support members (431), the two first support members (421) are spaced apart along the second direction on the carrier (410), and the two second support members (431) are spaced apart along the second direction on the carrier (410), the first direction is perpendicular to the second direction, the first support member (421) has a first limiting portion, and the second support member (431) has a second limiting portion, and when the two first support members (421) and the two second support members (431) jointly support a wafer box, the first limiting portion and the second limiting portion both limit the wafer box in the second direction.

9. The transfer chamber according to claim 8, characterized in that: The first limiting portion comprises a second limiting recess (421a) formed on the first supporting member (421) and facing the inner side of the two first supporting members (421), and the second limiting portion comprises a first protrusion (431a), and the first protrusion (431a) extends along the first direction; The base (510) of the wafer box comprises a crossbeam (511) and two side beams (512) connected to both ends of the crossbeam (511); the crossbeam (511) is provided with a slot (511a); when the two first support members (421) and the two second support members (431) jointly support the wafer box, the side beams (512) are supported on the bottom surface of the second limiting recess (421a); ​​the crossbeam (511) is supported on the first boss (431a) through the bottom wall of the slot (511a); the side walls of the second limiting recess (421a) located on the two first support members (421) cooperate with the side beam (512) for limiting position in the second direction; and the first boss (431a) located on the two second support members (431) cooperate with the side walls of the slot (511a) for limiting position in the second direction.

10. The transfer chamber according to claim 8, characterized in that: The second support member (431) further includes a second boss (431b), and the second boss (431b) extends along the second direction. The wafer box positioning mechanism (400) further includes a clamping assembly and a clamping drive mechanism. The clamping drive mechanism is arranged on the carrier (410), and the clamping assembly is connected to the clamping drive mechanism. When the two first support members (421) and the two second support members (431) jointly support the wafer box, the clamping drive mechanism drives the clamping assembly to clamp the beam (511) between the second boss (431b) and the clamping assembly.

11. The transfer chamber according to claim 10, characterized in that: The clamping assembly comprises a clamping body (441) and an elastic buffer (442), the clamping drive mechanism is connected to the clamping body (441), the elastic buffer (442) is arranged on the clamping body (441), and the clamping drive mechanism drives the elastic buffer (442) through the clamping body (441) to clamp the crossbeam (511) between the second boss (431b) and the elastic buffer (442).

12. The transfer chamber according to claim 10, characterized in that: The clamping drive mechanism comprises a third drive member (451), a rotating shaft (452) and a mounting seat (453); the third drive member (451) and the mounting seat (453) are both arranged on the carrier (410); the rotating shaft (452) is rotatably arranged on the mounting seat (453); and the third drive member (451) is connected to the rotating shaft (452); The wafer box positioning mechanism (400) comprises at least two clamping assemblies, which are spaced apart along the second direction and are both connected to the rotating shaft (452); the third driving member (451) is used to drive the rotating shaft (452) to rotate, so that the rotating shaft (452) drives the clamping assembly to switch between the first position and the second position; When the clamping assembly is located at the first position, the clamping assembly clamps the crossbeam (511) between the second boss (431b) and the clamping assembly; When the clamping assembly is located at the second position, the clamping assembly is separated from the crossbeam (511).

13. The transfer chamber according to claim 12, characterized in that: The clamping drive mechanism also includes a transmission assembly (454), which includes a first rod (454a) and a second rod (454b), wherein the first end of the first rod (454a) is hinged to the third drive member (451), the second end of the first rod (454a) is hinged to the first end of the second rod (454b), and the second end of the second rod (454b) is fixedly connected to the rotating shaft (452), and the third drive member (451) drives the rotating shaft (452) to rotate via the first rod (454a) and the second rod (454b).

14. The transfer chamber according to claim 7, characterized in that: The chamber body (100) is provided with a plurality of transmission channels (110), the openings on both sides of the transmission channels (110) being the film transmission ports, the transmission chamber (A) further comprising an exhaust branch pipe (610), an exhaust main pipe (620) and a pressure controller (630), each of the transmission channels (110) being respectively connected to the exhaust branch pipe (610), and the exhaust branch pipe (610) being connected between the transmission channels (110) and the exhaust main pipe (620); The exhaust branch pipe (610) is provided with the pressure controller (630), and the pressure controller (630) is used to control the gas pressure in the exhaust branch pipe (610) so that the internal pressure of the exhaust branch pipe (610) located between the chamber body (100) and the pressure controller (630) is greater than the internal pressure of the exhaust branch pipe (610) located between the pressure controller (630) and the exhaust main pipe (620).

15. The transfer chamber according to claim 14, characterized in that: The transmission chamber (A) further comprises a one-way valve (640), wherein the one-way valve (640) is arranged on the exhaust branch pipe (610) and is located between the transmission channel (110) and the pressure controller (630); When the gas pressure at a portion of the exhaust branch pipe (610) between the transmission channel (110) and the one-way valve (640) is greater than the gas pressure at a portion between the one-way valve (640) and the pressure controller (630), the one-way valve (640) is in an open state; When the gas pressure at a portion of the exhaust branch pipe (610) between the transmission channel (110) and the one-way valve (640) is lower than the gas pressure at a portion between the one-way valve (640) and the pressure controller (630), the one-way valve (640) is in a closed state.

16. The transfer chamber according to claim 15, characterized in that: The one-way valve (640) comprises a valve body (641) and a baffle (642); the valve body (641) has a valve body inlet (641a) and a valve body outlet (641b); a portion of the exhaust branch pipe (610) located between the transmission channel (110) and the one-way valve (640) is communicated with the valve body inlet (641a); a portion of the exhaust branch pipe (610) located between the one-way valve (640) and the pressure controller (630) is communicated with the valve body outlet (641b); and the baffle (642) is rotatably disposed in the valve body (641); When the gas pressure at a portion of the exhaust branch pipe (610) between the transmission channel (110) and the one-way valve (640) is greater than the gas pressure at a portion between the one-way valve (640) and the pressure controller (630), the baffle (642) opens the valve body inlet (641a) under the action of the pressure difference; When the gas pressure at a portion of the exhaust branch pipe (610) between the transmission channel (110) and the one-way valve (640) is lower than the gas pressure at a portion between the one-way valve (640) and the pressure controller (630), the baffle (642) blocks the valve body inlet (641a) under the action of gravity.

17. The transfer chamber according to claim 7, characterized in that: The door panel (210) has a transparent window (212).

18. The transfer chamber according to claim 7, characterized in that: The transfer chamber (A) further comprises a wafer box positioning mechanism (400) and a sensor assembly. When the wafer box positioning mechanism (400) carries a wafer box, the sensor assembly is used to detect whether the length of the wafer in the wafer box extending out of the wafer box exceeds a preset length.

19. A semiconductor process equipment, characterized in that: It comprises a reaction chamber (710), a microenvironment chamber (720), an atmospheric chamber (730) and a transmission chamber (A) according to any one of claims 7 to 18, wherein the transmission chamber (A) is connected between the atmospheric chamber (730) and the microenvironment chamber (720), and the reaction chamber (710) is connected to the microenvironment chamber (720).

Citation Information

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Cited By

  • Sealing door assembly, transfer chamber, and semiconductor process device

    WO2026081790A1