Electronic device packaging thermocuring device and method

Abstract

The invention relates to the technical field of electronic component packaging, in particular to an electronic device packaging thermocuring device and method which can meet the packaging requirements of different electronic devices, especially thermosensitive printing head IC packaging, can carry out reliable bubble removal treatment and humidity control on curing glue, and can remarkably improve the production efficiency and the packaging quality. A material conveying mechanism is arranged in the curing bin, the curing bin is sequentially provided with a preheating defoaming bin body, a low-temperature curing bin body and a high-temperature curing bin body in the material conveying direction, tray sensors are arranged in the positions, close to an inlet and an outlet of the bin body, of the interior of each bin body respectively, and the tray sensors are used for detecting whether material trays are in place or not currently. Cabin doors and cabin door opening and closing control parts are arranged between the cabin bodies, and the material conveying mechanism is provided with a preheating defoaming cabin conveying mechanism, a low-temperature curing cabin conveying mechanism, a high-temperature curing cabin conveying mechanism and a discharging conveying mechanism which are independently driven and controlled respectively and correspond to the cabin bodies.

Description

Technical field:

[0001] The present invention relates to the technical field of electronic component packaging, and more specifically to an electronic component packaging heat curing device and method which can adapt to different electronic component packaging requirements, especially thermal print head IC packaging, can reliably degas the curing glue, control the humidity, and significantly improve the production efficiency and packaging quality. Background technology:

[0002] The existing equipment used for thermal curing of electronic device packaging is usually a continuous curing furnace or a curing box. A transmission mechanism is provided in the continuous curing furnace or the curing box. The cured devices are respectively transmitted to the preheating cabin, the curing cabin, and the cooling cabin through the transmission mechanism to complete the process of preheating, curing, and cooling of the cured devices in sequence. The curing box type curing equipment relies on internal hot air circulation, and realizes the curing and cooling of the packaging glue by controlling the temperature and time of heating, constant temperature, and cooling in each curing stage.

[0003] For ICs and thermal print heads with multi-layer bonding metal wires that are packaged with high-viscosity packaging glue, the high-viscosity glue penetrates between the metal wires during packaging, and some gases are encapsulated in the glue and difficult to discharge. When the gases remain in the packaging glue and solidify, pores will form, resulting in reduced product reliability or product scrapping due to pores. In addition, the packaging of some devices is sensitive to moisture, or the humidity in the packaging glue is high. During welding or heating, the moisture in the packaging glue expands due to heat and causes a popcorn effect. Some devices use metal aluminum as the electrode material, which is prone to hydrolysis reactions. Silver is used as the electrode, and moisture easily causes silver electromigration. Existing curing equipment cannot meet the above-mentioned packaging curing process requirements of full degassing and low moisture. Summary of the invention:

[0004] In view of the shortcomings and deficiencies in the prior art, the present invention proposes an electronic device packaging thermal curing device and method that can adapt to different electronic device packaging requirements, can reliably degas the curing glue, control the humidity, and significantly improve the production efficiency and packaging quality.

[0005] The present invention is achieved by the following measures:

[0006] A thermal curing device for electronic device packaging is provided with a curing cabin and a control component, characterized in that a material conveying mechanism is provided in the curing cabin, and the curing cabins are sequentially arranged along the material conveying direction as a preheating and degassing cabin, a low-temperature curing cabin, and a high-temperature curing cabin, and tray sensors are respectively provided inside each cabin near the cabin entrance and exit, and the tray sensors are used to detect whether there is a material tray in place at present, and cabin doors and cabin door opening and closing control components are provided between each cabin, and the material conveying mechanism is provided with a preheating and degassing cabin conveying mechanism, a low-temperature curing cabin conveying mechanism, a high-temperature curing cabin conveying mechanism and a material discharging conveying mechanism corresponding to each cabin, which are independently driven and controlled, and a driving motor for driving a transmission chain is respectively provided in each independently driven and controlled transmission mechanism, and the transmission chain is respectively meshed with the end gears of all the transmission rollers in the corresponding cabin, and the chain driving gear drives the rollers to operate, and the components to be cured carried by the tray are conveyed by the friction between the tray and the rollers.

[0007] The length of the transport tray of the present invention is at least 4 times the spacing between adjacent rollers in the curing chamber, the spacing between adjacent chambers is less than 2 times the spacing between adjacent rollers in each chamber, and the rollers in each chamber are in the same plane.

[0008] In the present invention, the preheating degassing cabin is provided with a preheating component, which includes two heating plates respectively arranged above and below the preheating degassing cabin conveying mechanism, and a heating control circuit connected to the heating plates. The preheating degassing cabin body is also connected to a negative pressure processing mechanism, and the negative pressure processing mechanism includes a vacuum sensor arranged in the preheating degassing cabin body, and also includes a negative pressure pump connected to the preheating degassing cabin body through a pipeline. Furthermore, sealed cabin doors are provided at the entrance and exit of the preheating degassing cabin, and a cabin door unlocking mechanism cooperating with the sealed cabin door is provided.

[0009] The preheating component in the preheating degassing cabin of the present invention adopts an infrared radiation heating plate, which is different from the usual hot air circulation heating method. It is used to improve the heat transfer efficiency in a vacuum environment. The heating at an appropriate temperature reduces the viscosity of the glue, which helps to reduce the resistance of bubbles to be discharged from the inside of the glue. The heating control circuit can set the working time range of the preheating component to within 120 minutes, and the degassing time is further preferably 5-30 minutes. After the glue degassing is completed, the negative pressure treatment mechanism and the sealed cabin door are switched to the working state, and the cabin door is unlocked.

[0010] The front end of the preheating and degassing chamber of the present invention is also provided with a preparation mechanism, and the preparation mechanism is provided with a material conveying mechanism for conveying the tray containing the components to be cured to the material conveying port of the preheating and degassing chamber.

[0011] In the present invention, a heating component is arranged below the material conveying mechanism in the low-temperature curing chamber and the high-temperature curing chamber. The heating component is provided with a circulating fan, an air intake pipeline, an air supply pipeline, and a heating body. The heating body adopts a heating module of a PTC thermistor and heat dissipation fins to replace the usual electric heating tube heater, which has the advantages of high temperature control accuracy, high thermal efficiency, low power consumption, rapid heating, etc. The air intake pipeline is connected to the air intake end of the circulating fan, and the delivery end of the circulating fan is connected to the heating body through a pipeline, so that the airflow is heated by the heating body and then delivered to the low-temperature curing chamber or the high-temperature curing chamber along the bottom of the material conveying mechanism. Furthermore, a humidity detection circuit is also provided in the cabin, and the humidity detection circuit is realized by a humidity sensor.

[0012] A cooling cabin is also provided at the rear end of the high-temperature curing cabin described in the present invention. A cooling cabin conveying mechanism is provided in the cooling cabin and is located in the same conveying plane as the high-temperature curing cabin conveying mechanism. The cooling cabin conveying mechanism is also an independently driven and controlled conveying mechanism and is provided with a driving motor, a transmission chain and more than two transmission rollers arranged at equal intervals. A controlled cooling treatment component is also provided in the cooling cabin. The controlled cooling treatment component is arranged below the material conveying mechanism and includes a circulating fan, an air intake pipeline, an air supply pipeline and a heating component. The heating component in the cooling cabin adopts a heating module of a PTC thermistor and a heat dissipating fin, which is used in conjunction with the air intake pipeline, the air supply pipeline and the circulating fan.

[0013] The high temperature curing chamber, low temperature curing chamber and cooling chamber described in the present invention are all provided with exhaust pipelines, and exhaust valves are arranged on the exhaust pipelines to timely discharge excess gas in the chamber to ensure the requirements of heating curing or temperature control cooling.

[0014] The present invention also provides a preparation mechanism, wherein a material preparation conveying mechanism is provided, which is arranged at the front end of the preheating and degassing chamber and is used to convey the device to be processed to the entrance of the preheating and degassing chamber.

[0015] The present invention also proposes a thermal curing method for electronic device packaging, characterized in that the material to be cured is placed on a tray, and is sequentially sent into a preheating degassing chamber, a low-temperature curing chamber, and a high-temperature curing chamber by a material conveying mechanism, and is respectively subjected to preheating degassing treatment, low-temperature curing treatment, and high-temperature curing treatment, and then sent into a cooling chamber for cooling treatment; wherein, when the preheating degassing treatment is performed, the pressure in the preheating degassing chamber is 50Pa-100Kpa, and a heating treatment is performed; when the low-temperature curing treatment is performed, the curing temperature range is 80-100°C and the heating time range is 30-120min under a protective atmosphere; when the high-temperature curing treatment is performed, the curing temperature range is 1 20-180℃, heating time range is 60-150min; the cooling treatment is a controlled cooling treatment, specifically: when the encapsulation glue is cooled from above the glass transition temperature Tg to near the glass transition temperature Tg, the cooling rate is 0.25-2℃ / min, when the curing temperature is lower than the glass transition temperature Tg, the cooling rate is ≤0.25-4℃ / min, the cooling mode is to control the cooling rate not to exceed the prescribed limit, and the cooling rate limit value is set by the temperature control instrument. If the cooling rate exceeds the set value, the heat generated by the heater is transferred in the cabin through the internal air through hot air circulation to suppress the cooling speed from being too fast. When the cooling rate is lower than the set value, the heating system stops outputting and implements free cooling.

[0016] The low-temperature curing treatment or high-temperature curing treatment in the present invention includes humidity control treatment. Different from the prior art which uses refrigeration dehumidification and adsorbent water absorption, this treatment is achieved by introducing one of the inert gases such as dry nitrogen, carbon dioxide, argon, etc., and at the same time, the air containing moisture in the cabin and the waste gas generated by the glue curing are discharged through the exhaust pipe. In this process, a humidity sensor is used to detect the moisture content in the cabin, and the amount of the protective gas introduced into the curing cabin is controlled jointly with the protective gas control device. The humidity control range inside the cabin is 0.1% RH-25% RH.

[0017] The low temperature curing treatment or high temperature curing treatment in the present invention also includes adjusting the gas pressure in the curing chamber to maintain a positive pressure in the curing chamber so that the pressure in the chamber is greater than the external air pressure to prevent external moisture from entering the chamber. The pressure in the chamber is 5-25Pa higher than the external air pressure.

[0018] The beneficial effects of the present invention are that, by independently controlling preheating vacuum degassing, independently controlling the humidity of the low-temperature curing chamber, and independently controlling the humidity of the high-temperature curing chamber, the curing of glue with special curing process requirements such as low moisture content can be met, and the curing process requirements of ordinary glue that does not require vacuum degassing and humidity control can also be met. The vacuum degassing can be used to eliminate the internal pores after the glue is cured, and the humidity control can be used to reduce the moisture in the glue. The present invention is particularly suitable for some thermal print head substrates that use aluminum electrodes for wiring, where water vapor can easily cause hydrolysis of the aluminum film and corrosion of the aluminum electrodes, and for thermal print head substrates that use silver as the wire electrode, where water vapor can easily cause silver migration, thereby meeting the high-reliability packaging requirements of the product. Description of the drawings:

[0019] Attached Figure 1 It is a structural schematic diagram of the present invention.

[0020] Attached Figure 2 Attached is a schematic diagram of the use process of the electronic device packaging and curing device in the present invention. Figure 3 The present invention is a flow chart of electronic device packaging and curing.

[0021] Attached Figure 4 The present invention relates to a packaging glue viscosity-preheating temperature relationship curve diagram.

[0022] Figure symbols: curing chamber 1, control unit 2, 2-1 main power switch, 2-4-1 temperature controller, 2-4-3 vacuum gauge, 2-4-5 timer, 2-5-1 temperature controller, 2-5-2 humidity controller, 2-5-3 differential pressure controller, 2-5-4 timer, 2-6-1 temperature controller, 2-6-2 humidity test controller, 2-6-3 differential pressure controller, 2-6-4 timer, 2-7-1 temperature controller, 2-7-5 timer, preparation unit 3, material preparation and conveying mechanism 3-9, preparation unit tray loading sensor 3-12-1, preparation unit tray unloading sensor 3-12-2, preheating and degassing chamber 4, preheating and degassing Cabin sealing door 4-6, vacuum sensor in preheating degassing cabin 4-7, vacuum unlocking device 4-8, preheating degassing cabin conveying mechanism 4-9, 4-10 thermocouple, 4-12-1 tray sensor, 4-12-2 tray sensor, upper heating plate in preheating degassing cabin 4-15-1, lower heating plate in preheating degassing cabin 4-15-2, 5 low-temperature curing cabin, low-temperature curing cabin sealing door 5-6, low-temperature curing pressure difference sensor 5-7, low-temperature curing exhaust mechanism 5-8, low-temperature curing conveying mechanism 5-9, thermocouple for low-temperature curing cabin 5-10, protective gas control mechanism 5-11, upper material tray sensor 5-12-1, lower material tray sensor 5-12-

[0023] 2. Humidity sensor 5-13. Low temperature curing circulation fan 5-14-1. Low temperature curing air intake duct 5-14-2. Low temperature curing circulation fan air supply duct 5-14-3. Low temperature curing circulation fan air intake duct 5-14-4. Low temperature curing chamber heater 5-15. High temperature curing chamber sealed door 6-6 is provided at the entrance of high temperature curing chamber 6. High temperature curing chamber 6. High temperature curing differential pressure sensor 6-7. High temperature curing chamber exhaust mechanism 6-8. High temperature curing transmission mechanism 6-9. High temperature curing thermocouple 6-10. High temperature curing protective gas control mechanism 6-11. High temperature curing loading tray sensor 6-12-1. High temperature curing unloading tray sensor 6-12-2. High temperature curing humidity sensor 6-13. High temperature curing circulation fan 6-14-1. Air intake duct 6-14-2. Air supply duct 6-14-3. Air intake duct 6-14-4. High temperature curing heater 6-15. Cooling chamber 7. Cooling chamber sealed door 7 -6, cooling chamber conveying mechanism 7-9, thermocouple in cooling chamber 7-10, cooling chamber feeding tray sensor 7-12-1, cooling chamber discharging tray sensor 7-12-2, cooling chamber circulating fan 7-14-1, cooling chamber circulating fan air intake duct 7-14-2, cooling chamber circulating fan air supply duct 7-14-3, cooling chamber circulating air intake duct 7-14-4, cooling chamber heater 7-15, 8 storage part, storage sealing door 8-6, discharging conveying mechanism 8- 9. Storage section loading tray sensor 8-12-1, storage section unloading tray sensor 8-12-2, tray 9, first tray 9-1, second tray 9-2, third tray 9-3, fourth tray 9-4, fifth tray 9-5, sixth tray 9-6, curing device 10, first curing device 10-1, second curing device 10-2, third curing device 10-3, fourth curing device 10-4, fifth curing device 10-5, sixth curing device 10-6. Specific implementation method:

[0024] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0025] The present invention proposes an electronic device packaging thermal curing device, which is provided with a curing chamber 1 and a control unit 2, and is also provided with a preparation unit 3, a preheating degassing chamber 4, a low-temperature curing chamber 5, a high-temperature curing chamber 6, a cooling chamber 7, and a storage unit 8, wherein the control unit 2 is provided with a main power switch 2-1, a temperature controller 2-4-1 corresponding to the preheating degassing chamber 4, a vacuum gauge 2-4-3, and a timer 2-4-5, a temperature controller 2-5-1 corresponding to the low-temperature curing chamber, a humidity controller 2-5-2, a pressure difference controller 2-5-3, and a timer 2-5-4, a temperature controller 2-6-1 corresponding to the high-temperature curing chamber 6, a humidity test controller 2-6-2, a pressure difference controller 2-6-3, and a timer 2-6-4, and a temperature controller 2-7-1 and a timer 2-7-5 corresponding to the cooling chamber;

[0026] The preparation part 3 includes a material preparation conveying mechanism 3-9, and a preparation part material tray loading sensor 3-12-1 and a preparation part material tray unloading sensor 3-12-2 respectively installed at the loading end and unloading end of 3-9;

[0027] The entrance of the preheating degassing cabin 4 is provided with a preheating degassing cabin sealing cabin door 4-6, and the preheating degassing cabin is provided with a preheating degassing cabin vacuum sensor 4-7, a vacuum unlocking device 4-8, a preheating degassing cabin conveying mechanism 4-9, a thermocouple 4-10, and a preheating degassing tray sensor 4-12-1 and a preheating degassing tray sensor 4-12-2 respectively installed at the loading end and the unloading end of 4-9, and the preheating degassing cabin is also provided with a preheating degassing cabin vacuum pump 4-14-1 and an exhaust pipe 4-14-2, and the upper heating plate 4-15-1 and the lower heating plate 4-15-2 in the preheating degassing cabin are respectively arranged on the upper and lower sides of the preheating degassing cabin conveying mechanism 4-9;

[0028] A low-temperature curing cabin sealing door 5-6 is provided at the entrance of the low-temperature curing cabin 5, and a low-temperature curing pressure difference sensor 5-7, a low-temperature curing exhaust mechanism 5-8, a low-temperature curing transmission mechanism 5-9, a low-temperature curing cabin thermocouple 5-10, a protective gas control mechanism 5-11, a loading tray sensor 5-12-1, a unloading tray sensor 5-12-2, a humidity sensor 5-13, a circulating fan 5-14-1, an air intake pipe 5-14-2, an air delivery pipe 5-14-3 an air delivery pipe, 5-14-4 an air intake pipe, and a low-temperature curing cabin heater 5-15 are also provided in the low-temperature curing cabin 5;

[0029] A high temperature curing cabin sealing door 6-6 is provided at the entrance of the high temperature curing cabin 6. The high temperature curing cabin 6 is also provided with a pressure difference sensor 6-7 for high temperature curing, an exhaust mechanism 6-8 for the high temperature curing cabin, a high temperature curing transmission mechanism 6-9, a thermocouple 6-10 for high temperature curing, a protective gas control mechanism 6-11 for high temperature curing, a high temperature curing loading tray sensor 6-12-1, a high temperature curing unloading tray sensor 6-12-2, a high temperature curing humidity sensor 6-13, a high temperature curing circulating fan 6-14-1, an air intake duct 6-14-2, an air supply duct 6-14-3, an air intake duct 6-14-4, and a high temperature curing heater 6-15.

[0030] A cooling cabin sealing door 7-6 is provided at the entrance of the cooling cabin 7, and a cooling cabin conveying mechanism 7-9, a cooling cabin thermocouple 7-10, a cooling cabin feed tray sensor 7-12-1, a cooling cabin discharge tray sensor 7-12-2, a cooling cabin circulating fan 7-14-1, a cooling cabin circulating fan air intake duct 7-14-2, a cooling cabin circulating fan air supply duct 7-14-3, a cooling cabin circulating fan air intake duct 7-14-4, and a cooling cabin heater 7-15 are provided in the cooling cabin 7;

[0031] The feeding end of the storage section 8 is provided with a storage sealing door 8-6, and a discharging conveying mechanism 8-9, and a loading tray sensor 8-12-1 and a unloading tray sensor 8-12-2 located at the loading end and unloading end of 8-9 respectively;

[0032] In the present invention, a preparation mechanism, a preheating and degassing chamber conveying mechanism, a low-temperature curing chamber conveying mechanism, a high-temperature curing chamber conveying mechanism, a cooling chamber conveying mechanism and a discharging conveying mechanism are sequentially arranged along the material conveying direction, and a preheating and degassing chamber, a low-temperature curing chamber, a high-temperature curing chamber and a cooling chamber are correspondingly arranged. Each conveying mechanism is independently controlled and driven, and each conveying mechanism adopts a motor to drive a transmission chain, and the chain is respectively engaged with the gears at the ends of all the rollers of the preparation mechanism, the preheating and degassing chamber, the low-temperature curing chamber, the high-temperature curing chamber, the cooling chamber and the discharging mechanism. The chain driving gear drives the roller to operate, and the tray and the curing devices contained in it are moved on the roller by friction with the roller, so as to realize the moving in and out of the devices and the tray. The tray sensors respectively arranged near the entrance and exit of each cabin body detect that the tray is transported to the set position, and the transport mechanism stops moving.

[0033] The length of the tray 9 of the present invention is at least 4 times the spacing between adjacent rollers in the cabin, the spacing between adjacent cabins is less than 2 times the spacing between adjacent rollers in each cabin, and the rollers in each cabin are in the same plane.

[0034] The electronic device packaging thermal curing device of the present invention can achieve the following Figure 2 The various curing operations shown are as follows: According to the different settings of the parameters of the preheating vacuum degassing stage, low temperature curing stage, high temperature curing stage, and cooling stage, there are at least 3 basic operation combination processes for curing, such as Figure 2①, ②, are set according to the requirements of the glue curing process; the present invention mainly focuses on the curing process flow of glue coating → curing preparation → preheating vacuum degassing stage → low-temperature curing stage → high-temperature curing stage → cooling stage → storage, wherein, preheating vacuum degassing: as in process ③, the thermal print head device after glue coating is placed in the tray 9 and waits in the preparation part 3. After the preheating degassing cabin is emptied, the entrance sealed cabin door is opened, and the material preparation conveying mechanism 3-9 and the preheating degassing cabin conveying mechanism 4-9 allow the material tray 9 together with the device 10 therein to enter the preheating degassing cabin 4, the preheating degassing cabin sealing door 4-6 and the low-temperature curing cabin sealing door 5-6 are closed, and the preheating degassing cabin The upper heating plate 4-15-1 and the lower heating plate 4-15-2 in the preheating degassing chamber start heating. After the temperature rises to the set value, the vacuum pump 4-13-1 starts to evacuate. After the vacuum degree in the preheating degassing chamber 4 reaches the set value, the timer 2-4-5 closes and starts timing. Until the set time of the timer 2-4-5 ends, the upper heating plate 4-15-1 and the lower heating plate 4-15-2 in the preheating degassing chamber stop heating, completing the preheating vacuum degassing operation of the device packaging glue. The tray 9-2 and the device 10-2 therein wait for subsequent low-temperature curing instructions. The activation state of the preheating vacuum degassing is determined according to the curing process requirements. For example, if processes ① and ② are not enabled, process ③ is enabled.

[0035] Low temperature curing: as in curing process ③, after the preheating and degassing of the device 10-2 in the preheating and degassing chamber 4 is completed, the low temperature curing chamber 4 is empty or the tray 9-2 and the device 10-2 completed in the low temperature curing chamber 5 enter the high temperature curing chamber 6 as the tray 9-3 and the device 10-3, the low temperature curing chamber 5 meets the opening condition, the preheating and degassing chamber vacuum unlocking device 4-8, the low temperature curing chamber 5 is empty or the product 10-3 completed by low temperature curing enters the high temperature curing chamber 6, the sealing door 5-6 between the preheating and degassing chamber 4 and the low temperature curing chamber 5 meets the opening condition, the device 10-2 and the tray 9-2 enter the low temperature curing chamber 5, the sealing door 5-6 between the preheating and degassing chamber 4 and the low temperature curing chamber 5 is closed, the sealing door 6-6 between the low temperature curing chamber 5 and the high temperature curing chamber 6 is closed, and the stage of waiting for low temperature curing is entered, one of the inert protective gases such as dry nitrogen, argon, carbon dioxide, etc., enters the low temperature curing chamber 5 through the protective gas control device 5-11, and the gas in the low temperature curing chamber 5 passes through the low temperature curing exhaust machine The humidity in the low-temperature curing chamber 5 is discharged by the structure 5-8, and the humidity detection system composed of the low-temperature curing chamber hygrometer 2-5-3 and the humidity sensor 5-13 analyzes the humidity in the low-temperature curing chamber 5. The protective gas control device 5-11 controls the continuous introduction of the protective gas to make the humidity in the chamber reach the set value, and the low-temperature curing exhaust mechanism 5-8 is closed. The low-temperature curing chamber pressure difference detection control device 2-5-4 and the pressure difference sensor 5-7 detect the pressure difference in the low-temperature curing chamber 5. When the pressure difference reaches the set value, the protective gas control device 5-11 turns off the protective gas, and the heater 5-15 works at the same time. The temperature controller 2-5-1 and the thermocouple 5-10 of the low-temperature curing chamber 5 detect the temperature in the low-temperature curing chamber 5. When the temperature reaches the set value, the timer 2-5-5 is started until the set time of the timer 2-5-5 ends, and the low-temperature curing stage of the humidity control of the packaging glue of the device 10-3 is completed. The heater 5-15 stops working, and the humidity and other functions maintain the initial set working state. After the low-temperature curing stage is completed, the high-temperature curing stage is to be carried out;

[0036] High temperature curing: as in curing process ③, the device 10-3 that has been cured at low temperature, the high temperature curing chamber 6 is empty or the tray 9-4 and the device 10-4 that have been cured in the high temperature curing chamber 6 enter the cooling chamber 7, the high temperature curing chamber 6 meets the opening conditions, the sealed door 6-6 is opened, the sealed door 7-6 between the high temperature curing chamber 6 and the cooling chamber 7 is closed, the tray 9-3 and the device 10-3 enter the high temperature curing chamber 6, the sealed door 6-6 between the low temperature curing chamber 5 and the high temperature curing chamber 6 is closed, and the stage of waiting for high temperature curing is entered. The high temperature curing stage inherits the humidity control parameters of the low temperature curing stage, and one of the inert protective gases such as dry nitrogen, argon, carbon dioxide, etc. enters the high temperature curing chamber 6 through the protective gas control device 6-11, and the gas in the chamber 6 is discharged through the exhaust device 6-8, and the high temperature The humidity detection device composed of the curing chamber hygrometer 2-6-3 and the humidity sensor 6-13 analyzes the humidity of the high-temperature curing chamber 6. The protective gas control device 6-11 controls the continuous introduction of inert gas to make the humidity in the chamber 6 reach the set value, and the exhaust device 6-8 is closed. The pressure difference detection control device 2-6-4 and the pressure difference sensor 6-7 detect the pressure difference in the high-temperature curing chamber 6. When the pressure difference reaches the set value, the protective gas control device 6-11 is closed, and the heater 6-15 works. The temperature controller 2-6-1 and the thermocouple 6-10 of the high-temperature curing chamber 6 detect the temperature in the high-temperature curing chamber 6. When the temperature reaches the set value, the timer 2-6-5 is started until the time set by the timer 2-6-5 ends, completing the humidity control high-temperature curing stage of the packaging glue of the thermal print head device 10-4;

[0037] Cooling: As in the curing process ③, the cooling chamber 7 is empty or the tray 9-5 and the cured device 10-5 in the cooling chamber 7 have been cooled. When the sealed door 8-6 meets the opening condition, they are transported to the storage section 8, the sealed door 8-6 is closed, and the cured device 10-4 and the tray 9-4 that have been cured at high temperature enter the cooling chamber 7, the sealed door 7-6 is closed, and the air cooling device 7-8, the cooling chamber thermocouple 7-10, the cooling chamber temperature controller 2-7-1, the cooling chamber circulation fan 7-14-1, the cooling chamber air intake duct 7-14-2, the cooling chamber air supply duct 7-14-3, the cooling chamber air intake duct 7-144, and the cooling chamber heater 7-15 are composed of a PTC thermistor and a heat dissipation The fins constitute a controlled cooling system of the cooling chamber 7, and the temperature is cooled according to the cooling rate set by the temperature controller 2-7-1. When the cooling rate is lower than the set value, the heater 7-15 is turned off and the cooling chamber is cooled freely. When the cooling rate is higher than the set value, the heater 7-15 generates heat to control the cooling rate to meet the set value. After the cooling chamber temperature drops to the set value and the set time of the timer 2-7-5 is completed, the outlet sealing door 8-6 is opened, and the conveying device 7-9 realizes the conveying device 8-9 that conveys the material tray 9-5 together with the curing device 10-5 from the cooling chamber 7 to the storage part 8, completing the curing process of the encapsulating glue of the thermal print head device 10-5.

[0038] The glue curing process of the present invention also includes processes ①, ②, and ③. Other combinations of the process sections of the present invention also fall within the protection scope of the present invention.

[0039] The present invention also proposes a method for using an electronic device curing device, wherein the material to be cured is placed on a tray, and is sequentially sent into the preheating degassing chamber, the low-temperature curing chamber, and the high-temperature curing chamber by a material conveying mechanism, and is respectively subjected to vacuum degassing treatment, low-temperature curing treatment, and high-temperature curing treatment, and then sent into a cooling chamber for cooling; wherein, during the vacuum degassing treatment, it is considered that the viscosity of the encapsulating glue is usually 100-300Pa·S, and when the vacuum degree is low, the bubble overflow speed is slow, the degassing efficiency is low, and the degassing is insufficient. When the vacuum degree is high, the gas overflow speed is too fast, resulting in the expansion of the glue and irregular changes in shape, resulting in the product not meeting the requirements. The present invention can achieve degassing by using 50Pa-100Kpa, and further preferably 100Pa-50Kpa, which has a moderate degassing rate on the one hand and maintains a good shape of the glue on the other hand; proper heating during degassing can reduce the viscosity of the glue, reduce the resistance of the bubbles in the glue to overflow, and make degassing easier. The preheating temperature needs to be strictly controlled to prevent the glue from curing before the bubbles are removed. The present invention tests the relationship curve between the viscosity of the glue and the temperature (such as the attached Figure 4 As shown), determine the appropriate temperature range from room temperature to 55°C;

[0040] The low-temperature curing treatment of the present invention is in a protective atmosphere environment, the curing temperature range is 80-100°C, and the heating time range is 30-120min. The high-temperature curing treatment is in a protective atmosphere environment, the curing temperature range is 120-180°C, and the heating time range is 60-150min.

[0041] The cooling described in the present invention is a controlled temperature reduction process. Considering the thermal expansion coefficient of the thermal printing head heating substrate is 7±0.5×10 -6 / ℃, thermal print heads usually use epoxy encapsulation glue, and the thermal expansion coefficient is 80-120×10 above the glass transition temperature (hereinafter referred to as Tg, usually 80-180℃) -6 / ℃, thermal expansion coefficient below Tg temperature 20-30×10 -6 / ℃, due to the difference in material expansion coefficient, the cooling rate exceeding 5℃ / min will cause cracking at the interface between the packaging glue and the ceramic. When the packaging glue is cooled from above Tg to near Tg, the glue shrinks and deforms greatly. In order to prevent cracking at the interface between the glue and the ceramic substrate during the curing process, the cooling rate needs to be controlled. The temperature control instrument is set according to the program to control the cooling. The preferred cooling rate is 0.25-2℃ / min, and more preferably 0.5-1℃ / min. When the temperature is lower than Tg, the thermal expansion coefficient of the glue becomes lower, and the cooling rate can be appropriately increased, preferably ≤0.25-4℃ / min, and more preferably ≤0.5-2℃

[0042] / min, the cooling mode is to control the cooling rate not to exceed the specified limit. The cooling rate limit value is set by the temperature control instrument. If the cooling rate exceeds the set value, the hot air circulation device will transfer the heat generated by the heater in the cabin through the internal air to suppress the cooling rate from being too fast. When the cooling rate is lower than the set value, the heating system stops outputting and implements free cooling.

[0043] In the present invention, humidity control is provided in the low-temperature curing process or the high-temperature curing process. Different from the prior art which adopts refrigeration dehumidification and adsorbent water absorption, it is achieved by introducing one of the inert gases such as dry nitrogen, carbon dioxide, argon, etc., and at the same time, the air containing moisture in the cabin and the waste gas generated by the glue curing are discharged through the exhaust pipe. In this process, the moisture content in the cabin is detected by the humidity sensor, and the amount of the protective gas introduced into the curing cabin is controlled jointly with the protective gas control device. Aluminum electrodes are used for some thermal print head chips and heating substrate wiring. Water vapor can easily cause hydrolysis of the aluminum film and corrosion of the aluminum electrodes. In addition, the heating substrate uses silver as the wire electrode. Water vapor can easily cause silver migration when the device is charged. The lower the humidity during curing, the less the internal moisture content of the glue after curing, and the product The higher the reliability, the better the control range of the internal humidity of the cabin is 0.1%RH~25%RH, and the better the control range of the internal humidity of each cabin is 1%~10%RH. When the internal humidity content of the cabin is 0.1%RH~25%RH, the moisture content of the encapsulation glue after curing is less than 1%. Preferably, the internal humidity content of the cabin is 1%~10%RH, and the moisture content of the encapsulation glue after curing is less than 0.1%, which meets the high reliability requirements of the product. Further, the pressure difference detection control device controls the gas pressure in the curing cabin to maintain an appropriate positive pressure. The pressure in the cabin is greater than the external air pressure to prevent external moisture from entering the cabin. Usually, >5Pa can inhibit external gas from entering the curing cabin. According to experiments, the present invention determines the condition of 5~25Pa, and further optimizes 10~15Pa to better inhibit external moisture from entering the curing cabin.

[0044] In the present invention, the preparation mechanism, the preheating and degassing chamber, the low-temperature curing chamber, the high-temperature curing chamber, the cooling chamber and the product storage section located at the rear end of the cooling chamber are separated by automatic sealed doors respectively. The switch state of the door is controlled by the working state of the front and rear chambers and the timer of the chamber. When the curing device is moved in and out of the curing chamber, the corresponding inlet and outlet sealed doors are opened, and the feeding and unloading conveying structures work simultaneously. The conveying mechanism adopts a motor-driven transmission chain, and the chain is engaged with the gear at the end of the roller rod. The chain drives the gear to drive the roller rod to operate. The tray and the curing device contained therein are moved on the roller rod by friction with the roller rod. The feeding conveying is dragged in and the unloading conveying is pushed out. The two work together to realize the moving in and out of the device and the tray. After the sensor arranged near the entrance and exit inside the chamber detects that the tray is transported to the set position, the conveying mechanism stops.

[0045] Example:

[0046] like Figure 1 As shown, this example proposes a packaging glue heat curing device, in particular, a curing device suitable for epoxy resin glue for thermal print head IC packaging with a Tg temperature of 130±5°C, including: a curing chamber 1, a control part 2, a preparation part 3, a preheating degassing chamber 4, a low-temperature curing chamber 5, a high-temperature curing chamber 6, a cooling chamber 7, and a storage part 8. The preheating degassing chamber 4, the low-temperature curing chamber 5, the high-temperature curing chamber 6, the cooling chamber 7, and the storage part 8 are respectively isolated by sealing doors 4-6, sealing doors 5-6, sealing doors 6-6, sealing doors 7-6, and sealing doors 8-6 to achieve independent control of pressure, temperature, and humidity;

[0047] In this example, the low-temperature curing chamber 5 is provided with a humidity control system consisting of a humidity analyzer 2-5-3, a pressure difference detection control device 2-5-4, a low-temperature curing exhaust mechanism 5-8, a protective gas control device 5-11, and a humidity sensor 5-13. The high-temperature curing chamber 6 is provided with a humidity control system consisting of a humidity analyzer 2-6-3, a pressure difference detection control device 2-6-4, a high-temperature curing exhaust mechanism 6-8, a protective gas control device 6-11, and a humidity sensor 6-13. According to the curing requirements, one of the inert gases such as dry nitrogen, carbon dioxide, argon, etc. is introduced to discharge the air, moisture and waste gas generated by curing in the low-temperature curing chamber 5 and the high-temperature curing chamber 6. By filling with protective gas and humidity detection, the humidity control of the curing process is achieved. The vacuum degassing preheating chamber, the low-temperature curing chamber, the high-temperature curing chamber, and the cooling chamber are respectively provided with timers, and the time is independently adjustable.

[0048] The thermal print head device 10-2 which completes the vacuum degassing of the glue in the preheating degassing chamber 4 and the tray 9-2 sequentially enters the low-temperature curing chamber 5, the high-temperature curing chamber 6, and the cooling chamber 7 to complete different process stages of curing in the different chambers;

[0049] The preheating degassing chamber 4 is provided with a sealing door 4-6, which is connected with the sealing door 5-6 of the low-temperature solidification chamber 5 to realize the closure of the preheating degassing chamber 4, and isolate the influence of the preparation part 3 and the low-temperature solidification chamber 5 on the temperature and vacuum of the preheating degassing chamber 4. The preheating degassing chamber 4 is provided with a radiation upper heating device 4-15-1, a lower heating device 4-15-2, a thermocouple 4-10, and a temperature controller 2-4-1 to form a preheating system;

[0050] The thermal print head processed in this example is generally composed of multiple driver ICs, which are arranged in a straight line. The epoxy packaging glue that protects the IC is usually in the shape of a strip. During preheating, in order to prevent the glue from solidifying before the bubbles are removed, the present invention sets the preheating temperature ≤ 55°C by testing the relationship curve between the glue viscosity and the temperature. The present embodiment sets it at 50°C. Heating can reduce the viscosity of the glue that encapsulates the IC of the thermal print head and reduce the resistance to the overflow of bubbles. The encapsulation glue will not increase in viscosity after solidification. After the heating temperature reaches the set temperature of 50°C, the preheating vacuum degassing system equipped with a vacuum pump 4-14-1, an exhaust pipe 4-14-2, a vacuum gauge 2-4-3, and a vacuum sensor 4-7 starts to degas. The viscosity of the epoxy packaging glue for the thermal print head is usually 100-300Pa·S, and the vacuum degree is low. When the gas overflows slowly, the degassing efficiency is low, and the degassing is insufficient. When the vacuum degree is high, the gas overflows too quickly. The bubbles will cause the strip-shaped glue to expand and the shape of the packaging glue to change irregularly, resulting in the product not meeting the requirements. In this example, the vacuum degree of the preheating degassing chamber is set to 200Pa. On the one hand, it ensures that the glue has a moderate degassing rate, and on the other hand, the shape of the glue remains good. The timer 2-4-5 is set to 5-10min for sufficient degassing. After the preheating vacuum degassing time of the preheating degassing chamber 4 is completed, the timer controls the vacuum unlocking device 4-8 to release the vacuum of the preheating degassing chamber 4 and open the sealing door 4-6. The roller of the preheating degassing conveying mechanism 4-9 rotates to realize the conveying of the tray 9-2 together with the curing thermal print head 10-2 from the preheating degassing chamber 4 to the low-temperature curing chamber 5;

[0051] The low-temperature curing chamber 5 is provided with a sealed door 5-6, and a sealed door 6-6 of the high-temperature curing chamber 6, so as to close the low-temperature curing chamber 5 and isolate the influence of pressure, temperature and humidity of the preheating degassing chamber 4 and the high-temperature curing chamber 6. The low-temperature curing chamber 5 is provided with a pressure difference sensor 5-7 and a pressure difference detection control device 2-5-4 to form a pressure difference detection system. In this example, the pressure difference with the outside is 10Pa. The humidity sensor 5-12 and the hygrometer 2-5-2 form a humidity (moisture) detection system. In this example, the thin-film thermal print head substrate usually adopts metal aluminum wiring. Water vapor easily reacts chemically with aluminum, resulting in hydrolysis of the aluminum film and corrosion of the aluminum electrode. In addition, some thermal print head substrates use silver as the wire electrode. After testing by the inventor, at normal temperature and humidity of 35-55%, the silver electrode If the voltage difference between the electrodes is greater than 0.8V, migration will occur between the electrodes in a short time, resulting in abnormal operation and damage of the product. In this example, the thermal print head part adopts silver electrodes. In order to suppress the occurrence of silver migration, the humidity value is set to 5%RH during curing. The above-mentioned humidity detection system and pressure detection system, low-temperature curing exhaust mechanism 5-8, and protective gas control device 5-11 constitute a humidity control system to control the humidity of the low-temperature curing chamber 5; thermocouple 5-10, temperature controller 2-5-1, heater 5-14, circulating fan 5-13-1, circulating air intake duct 5-13-2, 5-13-3 constitute a heating control system of the low-temperature curing chamber 5, and the curing temperature of temperature controller 2-5-1 is set to 100℃, and the time of timer 2-5-5 is set to 120min;

[0052] The sealed door 5-6 of the low-temperature curing chamber 5 and the sealed door 6-6 of the high-temperature curing chamber 6 are in a closed state, the protective gas control device 5-11 introduces dry nitrogen as the protective gas, and the gas and moisture in the low-temperature curing chamber 5 are discharged through the low-temperature curing exhaust mechanism 5-8, the humidity sensor 5-12 and the hygrometer 2-5-2 detect the humidity in the low-temperature curing chamber 5, until the humidity in the chamber 5 is ≤5%RH, the low-temperature curing exhaust mechanism 5-8 is closed, the pressure difference sensor 5-7 and the pressure difference detection control device 2-5-4 form a pressure difference detection system, and the protective gas control device 5-11 is closed when the pressure difference is detected to be ≥10Pa;

[0053] After the low-temperature curing process parameters such as humidity are met, the heater 5-14 starts to work, and the circulating fan 5-14-1 extracts gas from the low-temperature curing chamber 5 through the circulating air intake pipes 5-14-2 and 5-14-3, and sends it into the heater 5-15 composed of a PTC thermistor and heat dissipation fins through the circulating air supply pipe 5-14-3, and transfers the heat generated by the heater 5-15 to the low-temperature curing chamber 5. The thermocouple 5-10 detects the temperature of the low-temperature curing chamber 5 and sends the signal to the temperature controller 2-5-1 to control the temperature of the low-temperature curing chamber 5. After the temperature reaches the set value of 100°C, the timer 2-5-5 starts timing until the curing time of 120 minutes is completed;

[0054] During the curing process, when the humidity of the cabin 5 is greater than the set value of 5%RH, the protective gas control device 5-11 automatically opens and fills in dry nitrogen as the protective gas. The low-temperature curing exhaust mechanism 5-8 opens to discharge the volatilized gas and moisture of the glue in the cabin. When the humidity sensor 5-12 and the hygrometer 2-5-2 detect that the humidity of the low-temperature curing cabin 5 meets ≤5%RH, the low-temperature curing exhaust mechanism 5-8 is closed. When the pressure detection system meets ≥10Pa, the protective gas control device 5-11 automatically closes the protective gas intake, and the heating system maintains the heating control state. After the set curing time of 120min is completed, the timer 2-5-5 stops heating, and the roller of the conveying device 5-9 rotates. Relying on the friction between the material tray 9-2 and the roller, the material tray 9-2 and the thermal print head 10-2 of the curing device are transported in the low-temperature curing cabin 5. According to the high-temperature curing process, the opening of the sealing door 6-6 is controlled to wait for high-temperature curing.

[0055] The high temperature curing cabin 6 is provided with a sealed door 6-6 and a sealed door 7-6 of the cooling cabin 7, so as to realize the closure of the high temperature curing cabin 5 and isolate the influence of the pressure, temperature and humidity of the low temperature curing cabin 6 and the cooling cabin 7. The high temperature curing cabin 6 is provided with a pressure difference sensor 6-7 and a pressure difference detection control device 2-6-4 to form a pressure difference detection system, and the pressure difference is set to 10Pa; the humidity sensor 6-12 and the hygrometer 2-6-2 form a humidity (moisture) detection system, and the humidity value is set to 5%RH. The above humidity detection system, the pressure detection system, the exhaust device 6-8, and the protective gas control device 6-11 form a humidity control system to control the humidity of the high temperature curing cabin 6;

[0056] Thermocouple 6-10, temperature controller 2-6-1, heater 6-15 composed of PTC thermistor and heat dissipation fins, circulating fan 6-14-1, circulating air intake ducts 6-14-2 and 6-14-3 constitute the heating control system of low-temperature curing chamber 6. The curing temperature of temperature controller 2-6-1 is set to 150°C, and the time of timer 2-6-5 is set to 60min.

[0057] When the humidity control system works in conjunction, when the humidity meets ≤5%RH, the exhaust device 6-8 is closed, the gas pressure in the high-temperature curing chamber 6 is ≥10Pa, and when the set value of the pressure difference detection control device 6-7 is met, the protective gas control device 6-11 closes the protective gas intake;

[0058] After the high-temperature curing process parameters such as humidity and atmosphere are met, the heater 6-15 starts to work, and the circulating fan 6-14-1 extracts gas from the inside of the high-temperature curing chamber 6 through the circulating air intake pipes 6-14-2 and 6-14-3, and sends it into the heater 6-15 through the circulating air supply pipe 6-14-3, and transfers the heat generated by the heater 6-15 to the inside of the high-temperature curing chamber 6. The thermocouple 6-10 detects the temperature of the high-temperature curing chamber 6 and sends the signal to the temperature controller 2-6-1 to control the temperature of the high-temperature curing chamber 6. After the temperature reaches the set value of 150°C, the timer 2-6-5 starts timing until the curing time of 60 minutes is completed;

[0059] After the set curing time is completed, the timer 2-6-5 stops heating, and the roller of the high-temperature curing conveying mechanism 6-9 rotates. Relying on the friction between the material tray 9-2 and the roller, the material tray 9-3 and the curing thermal print head 10-3 are transported in the high-temperature curing chamber 6. According to the high-temperature curing process, the sealing door 7-6 is controlled to open and wait for cooling;

[0060] The cooling chamber 7 is provided with a cooling chamber sealing door 7-6 and a sealing door 8-6 to prevent the temperature of the cooling chamber from being affected by factors other than the cooling chamber 7 and causing drastic fluctuations. The cooling chamber thermocouple 7-10, the cooling chamber temperature controller 2-7-1, the cooling chamber circulation fan 7-13-1, the cooling chamber air intake duct 7-13-2, the cooling chamber air supply duct 7-13-3, the cooling chamber air intake duct 7-13-4 and the cooling chamber heater 7-14 constitute a controlled cooling system of the cooling chamber 7. The temperature controller 2-7-1 sets the cooling rate to ≤1.5℃ / min for the section of 150℃→110℃. In this example, in order to eliminate the risk of cracking of the packaging glue, and considering that the Tg temperature of the packaging glue has a deviation of ±5℃, the terminal temperature of the slow cooling in this example is 20℃ lower than the Tg temperature of the base glaze, and the cooling rate in the section of 110℃→50℃ is ≤2℃ / min. According to the cooling rate set by the temperature controller 2-7-1, when the cooling rate is lower than the set value, the cooling chamber implements free When the cooling rate is higher than the set value, the heater 7-15 composed of a PTC thermistor and heat dissipating fins in the cooling chamber starts working, and the circulating fan 7-14-1 of the cooling cavity 7 draws the air in the cooling cavity 7 through the air inlet ducts 7-14-2 and 7-14-4 of the cooling cavity 7, and sends the air to the heater 7-15 through the air supply duct 7-14-3 of the cooling cavity 7, and the heat is dissipated to the cooling chamber 7. The heating is controlled by the cooling rate set by the temperature controller 2-7-1, and the cooling rate of 150℃→110℃ section is ≤1.5℃ / min, and the cooling rate of 110℃→50℃ section is ≤2℃ / min, so as to realize the controlled cooling of the solidified device 10-4 in the cooling chamber 7. After the set time of 60min of the cooling chamber timer 2-7-5 is completed, the outlet sealing door 8-6 is opened, and the conveying device 7-9 realizes the conveying device 8-9 that conveys the material tray 9-4 together with the solidified device 10-4 from the cooling chamber 7 to the storage part 8.

[0061] The packaging glue curing device of the present invention adopts vacuum degassing and humidity controlled curing, which greatly reduces the moisture content and internal pores of the packaging glue. After the glue of this embodiment is cured, the moisture content is ≤0.1%, and there are no visible pores inside, which greatly improves the packaging yield and reliability of the thermal print head.

Claims

1. An electronic device packaging thermal curing device, provided with a curing chamber and a control component, characterized in that: A material conveying mechanism is provided in the curing cabin, and the curing cabins are sequentially arranged along the material conveying direction as a preheating and degassing cabin, a low-temperature curing cabin, and a high-temperature curing cabin. Tray sensors are respectively provided inside each cabin near the cabin entrance and exit. The tray sensor is used to detect whether there is a material tray in place. A cabin door and a cabin door opening and closing control component are provided between each cabin. The material conveying mechanism is provided with a preheating and degassing cabin conveying mechanism, a low-temperature curing cabin conveying mechanism, a high-temperature curing cabin conveying mechanism and a material discharging conveying mechanism, which are independently driven and controlled, corresponding to each cabin. A driving motor for driving a transmission chain is respectively provided in each independently driven and controlled conveying mechanism. The transmission chains are respectively meshed with the end gears of all the transmission rollers in the corresponding cabin, and the chain driving gear drives the rollers to operate. The devices to be cured carried by the tray rely on the friction between the tray and the rollers to realize the transmission of the devices and the tray.

2. The electronic device packaging thermal curing device according to claim 1, characterized in that: The length of the transport tray is at least 4 times the spacing between adjacent rollers in the curing chamber, the spacing between adjacent chambers is less than 2 times the spacing between adjacent rollers in each chamber, and the rollers in each chamber are in the same plane.

3. The electronic device packaging thermal curing device according to claim 1, characterized in that: The preheating and degassing cabin is provided with a preheating component, which includes two heating plates respectively arranged above and below the preheating and degassing cabin conveying mechanism, and a heating control circuit connected to the heating plates. The preheating and degassing cabin body is also connected to a negative pressure processing mechanism, and the negative pressure processing mechanism includes a vacuum sensor arranged in the preheating and degassing cabin body, and also includes a negative pressure pump connected to the preheating and degassing cabin body through a pipeline. Sealed cabin doors are provided at the entrance and exit of the preheating and degassing cabin, and a cabin door unlocking mechanism cooperating with the sealed cabin doors is provided.

4. The electronic device packaging thermal curing device according to claim 3, characterized in that: The preheating component in the preheating and degassing chamber adopts an infrared radiation heating plate.

5. The electronic device packaging thermal curing device according to claim 1, characterized in that: A preparation mechanism is also provided at the front end of the preheating and degassing chamber, and a material conveying mechanism for conveying a tray containing the components to be cured to a material conveying port of the preheating and degassing chamber is provided in the preparation mechanism.

6. The electronic device packaging thermal curing device according to claim 1, characterized in that: A heating component is arranged below the material conveying mechanism in the low-temperature curing chamber and the high-temperature curing chamber. The heating component is provided with a circulating fan, an air intake pipeline, an air supply pipeline, and a heating body. The heating body adopts a heating module of a PTC thermistor and a heat dissipation fin, wherein the air intake pipeline is connected to the air intake end of the circulating fan, and the delivery end of the circulating fan is connected to the heating body via a pipeline, so that the airflow is heated by the heating body and then sent to the low-temperature curing chamber or the high-temperature curing chamber along the bottom of the material conveying mechanism. A humidity detection circuit is also arranged in the low-temperature curing chamber, and the humidity detection circuit is realized by a humidity sensor.

7. The electronic device packaging thermal curing device according to claim 1, characterized in that: A cooling cabin is also provided at the rear end of the high-temperature curing cabin. A cooling cabin conveying mechanism is provided in the cooling cabin and is located in the same conveying plane as the high-temperature curing cabin conveying mechanism. The cooling cabin conveying mechanism is also an independently driven and controlled conveying mechanism and is provided with a driving motor, a transmission chain and more than two transmission rollers arranged at equal intervals. A controlled cooling treatment component is also provided in the cooling cabin. The controlled cooling treatment component is arranged below the material conveying mechanism and includes a circulating fan, an air intake pipeline, an air supply pipeline and a heating component. The heating component in the cooling cabin adopts a heating module of a PTC thermistor and a heat dissipating fin, which is used in conjunction with the air intake pipeline, the air supply pipeline and the circulating fan.

8. The electronic device packaging thermal curing device according to claim 1, characterized in that: The high-temperature curing chamber, the low-temperature curing chamber and the cooling chamber are all provided with exhaust pipelines, and exhaust valves are arranged on the exhaust pipelines to timely discharge the excess gas in the chamber to ensure the requirements of heating curing or temperature-controlled cooling.

9. A curing method using the electronic device packaging thermal curing device according to any one of claims 1 to 8, characterized in that: The material to be solidified is placed on a tray and sent to the preheating degassing cabin, the low-temperature solidification cabin, and the high-temperature solidification cabin in turn by the material conveying mechanism. After preheating degassing treatment, low-temperature solidification treatment, and high-temperature solidification treatment, the material is sent to the cooling cabin for cooling treatment. When the preheating degassing treatment is carried out, the pressure in the preheating degassing cabin is 50Pa-100Kpa during the vacuum degassing treatment, and heating treatment is carried out. When the low-temperature solidification treatment is carried out, the solidification temperature range is 80-100℃ and the heating time range is 30-120min under the protective atmosphere. When the high-temperature solidification treatment is carried out, the solidification temperature range is 120-180℃ and the heating time range is 150-200min under the protective atmosphere. The heat time range is 60-150min; the cooling treatment is a controlled cooling treatment, specifically: when the packaging glue is cooled from above the glass transition temperature Tg to near the glass transition temperature Tg, the cooling rate is 0.25-2℃ / min, when the curing temperature is lower than the glass transition temperature Tg, the cooling rate is ≤0.25-4℃ / min, and the cooling mode is to control the cooling rate not to exceed the specified limit. The cooling rate limit value is set by the temperature control instrument. If the cooling rate exceeds the set value, the heat generated by the heater is transferred in the cabin through the internal air through hot air circulation to suppress the cooling speed from being too fast. When the cooling rate is lower than the set value, the heating system stops outputting and implements free cooling.

10. The electronic device packaging thermal curing method according to claim 9, characterized in that: Low-temperature curing treatment or high-temperature curing treatment includes humidity control treatment. Different from the prior art which uses refrigeration dehumidification and adsorbent water absorption, it is achieved by introducing one of dry nitrogen, carbon dioxide, and argon, and at the same time, the air containing moisture in the cabin and the waste gas generated by glue curing are discharged through the exhaust pipe. In this process, the moisture content in the cabin is detected by a humidity sensor, and the amount of the protective gas introduced into the curing cabin is controlled jointly with the protective gas control device. The humidity control range inside the cabin is 0.1% RH-25% RH. It also includes adjusting the gas pressure in the curing cabin and maintaining a positive pressure in the curing cabin so that the pressure in the cabin is greater than the external air pressure to prevent external moisture from entering the cabin. The pressure inside the cabin is 5-25Pa higher than the external air pressure.

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