Epoxy resin heat-conducting composite material containing adjustable isolation frame and preparation method of epoxy resin heat-conducting composite material

Abstract

The invention discloses an epoxy resin heat-conducting composite material containing an adjustable isolation frame and a preparation method of the epoxy resin heat-conducting composite material, and belongs to the technical field of heat-conducting materials. The epoxy resin heat-conducting composite material mainly comprises 10-20 g of epoxy resin prepolymer, 0.005 g of surfactant, 150-200 g of deionized water, 0.1-0.6 g of heat-conducting filler and 2.5-4 g of curing agent. A core-shell structure with graphene as a shell layer and an epoxy resin prepolymer as a core layer is prepared by utilizing an emulsion polymerization strategy, and meanwhile, the high-thermal-conductivity epoxy resin composite material with a graphene heat conduction path is designed by utilizing the bonding effect of the epoxy resin prepolymer; the epoxy resin heat-conducting composite material with an adjustable isolation path is obtained by utilizing an emulsion polymerization strategy, the heat transfer capability of the composite material is effectively improved by virtue of abundant heat transfer paths, and the epoxy resin heat-conducting composite material has the advantages of low addition amount, simple process and excellent performance.

Description

Technical Field

[0001] The invention belongs to the technical field of heat-conducting materials, and in particular is an epoxy resin heat-conducting composite material containing an adjustable isolation frame and a preparation method thereof. Background Art

[0002] With the rapid development of electronic equipment, the trend of miniaturization, high power and high integration of equipment is becoming increasingly obvious, and the heat generated by internal components during operation is gradually increasing. If the heat cannot be dissipated in a timely and effective manner, the accumulation of heat will lead to a decline in equipment performance, shortened life, and even cause safety hazards. Therefore, the development of materials with efficient heat dissipation function has become an urgent need for the electronics industry. High thermal conductivity polymer materials have become an ideal choice for heat dissipation materials due to their advantages such as light weight, easy processing, and good electrical insulation. However, the thermal conductivity of existing polymer materials is low and cannot meet the heat dissipation requirements of high-power electronic equipment. Therefore, the research and development of polymer-based composite materials with excellent thermal conductivity is of great significance to improving the heat dissipation efficiency and operating stability of electronic equipment.

[0003] Epoxy resin has been widely used in the electronics field due to its excellent electrical insulation and chemical corrosion resistance. However, with the continuous improvement of the power and integration of electronic devices, the low thermal conductivity of epoxy resin has become a bottleneck restricting its efficient heat dissipation application. Therefore, improving the thermal conductivity of epoxy resin has become an important direction for the current research and development of electronic packaging materials.

[0004] At present, the main means to improve the thermal conductivity of epoxy resin is by adding high thermal conductivity fillers, such as boron nitride, aluminum oxide, graphene, etc. This type of method can significantly improve the thermal conductivity of the composite material, and the filler selection is diverse and the cost is relatively controllable. However, these technologies also have some limitations, such as poor interface compatibility between the filler and the epoxy resin matrix, which leads to uneven dispersion of the filler and affects the construction of the thermal conductive channel. In order to solve the problem of uneven dispersion of traditional fillers, thermally conductive isolation structures have gradually become an effective way to improve the thermal conductivity of epoxy resin. Therefore, it is necessary to propose a thermally conductive composite material of epoxy resin containing an adjustable isolation frame and a preparation method thereof. Summary of the invention

[0005] The purpose of the present invention is to provide an epoxy resin thermal conductive composite material containing an adjustable isolation frame and a preparation method thereof. The method uses an emulsion polymerization strategy to prepare a core-shell structure with graphene as a shell layer and an epoxy resin prepolymer as a core layer; at the same time, the bonding effect of the epoxy resin prepolymer is used to design a high thermal conductivity epoxy resin composite material with a graphene thermal conductive path.

[0006] In order to achieve the above-mentioned purpose, the technical scheme of the present invention is as follows: a thermally conductive epoxy resin composite material containing an adjustable isolation frame, wherein the main components of the thermally conductive epoxy resin composite material are: 10-20g of epoxy resin prepolymer, 0.005g of surfactant, 150-200g of deionized water, 0.1-0.6g of thermally conductive filler and 2.5-4g of curing agent.

[0007] The beneficial effects of the basic program are:

[0008] 1. Epoxy resin is the matrix of composite materials and has excellent mechanical properties, dielectric properties and good processability.

[0009] 2. Surfactants can reduce the surface energy between particles, promote the dispersion and uniform distribution of particles, and prevent the aggregation and precipitation of thermal conductive fillers. It helps to improve the dispersibility and compatibility of thermal conductive fillers in the epoxy resin matrix, thereby optimizing the thermal conductivity of the composite material.

[0010] 3. Deionized water as a solvent or washing medium helps to achieve uniform mixing and dispersion of the components during the preparation of the composite material.

[0011] 4. Thermally conductive fillers form continuous or semi-continuous thermal conductive paths in the epoxy resin matrix, which helps to efficiently transfer heat within the material.

[0012] 5. The curing agent is used to solidify the epoxy resin, thermal conductive filler and other components into one, which is conducive to forming a stable composite material structure.

[0013] Furthermore, a method for preparing an epoxy resin thermally conductive composite material containing an adjustable isolation frame comprises the following steps:

[0014] Step 1: Mix epoxy resin prepolymer, surfactant and deionized water to prepare a stable oil-in-water emulsion.

[0015] Step 2: Add thermally conductive filler to the oil-in-water emulsion obtained in step 1, attach the thermally conductive filler to the surface of the epoxy oil droplet by centrifugal force and adhesive force, add a curing agent and cure to obtain a core-shell material with the thermally conductive filler as the shell layer and the epoxy resin prepolymer as the core layer.

[0016] Step three: Mix the epoxy resin prepolymer with the thermal conductive filler to prepare an epoxy resin adhesive for bonding the core-shell material obtained in step two, use the epoxy resin adhesive to bond the core-shell material to form an epoxy resin thermal conductive composite material, and then heat treat the epoxy resin thermal conductive composite material.

[0017] The principle of the basic scheme is to mix epoxy prepolymer, surfactant and deionized water to prepare a stable water-in-oil emulsion. This step utilizes the characteristics of the surfactant, which enables it to form a stable interface between the epoxy prepolymer and water, thereby obtaining an water-in-oil emulsion.

[0018] Thermally conductive fillers are added to the oil-in-water emulsion, and the thermally conductive fillers are attached to the surface of the epoxy oil droplets by centrifugal force and adhesive force. Under the action of centrifugal force, the thermally conductive fillers are centrifuged to the epoxy oil droplets, while the adhesive force makes them firmly attached to the surface of the oil droplets.

[0019] After the curing agent is added, the epoxy oil droplets are cured to form an epoxy resin prepolymer as a core layer, while the thermal conductive filler is cured on the surface of the epoxy resin prepolymer to form a shell layer.

[0020] The epoxy resin prepolymer is mixed with the thermal conductive filler to prepare the epoxy resin adhesive. Through the bonding effect of the adhesive, multiple core-shell materials are connected together to form a high thermal conductive epoxy resin composite material with a graphene thermal conductive path.

[0021] The beneficial effects of the basic program are:

[0022] 1. The epoxy resin thermal conductive composite material with adjustable isolation path is obtained by emulsion polymerization. The abundant heat transfer paths effectively improve the heat transfer capacity of the composite material, and it has the advantages of low addition amount, simple process and excellent performance.

[0023] 2. The size of epoxy resin prepolymer is regulated by the ratio of epoxy resin to water, thereby improving the thermal conductivity. No modification of thermal conductive filler is involved, and the sedimentation phenomenon caused by the decrease in epoxy resin viscosity during the curing process is avoided, thereby achieving directional distribution of graphene and effectively improving the thermal conductivity of epoxy resin.

[0024] 3. The formation of the core-shell structure and the bonding effect of the epoxy resin prepolymer can enhance the mechanical properties of the composite material, such as tensile strength, bending strength and impact strength, etc. This makes the composite material more stable and reliable when subjected to external forces.

[0025] Furthermore, in step one, the epoxy resin prepolymer is selected from at least one of bisphenol A type E-51, bisphenol A type E-44 and bisphenol A type E-128.

[0026] The beneficial effects of the basic scheme are: bisphenol A epoxy resin has excellent physical properties, such as high strength, high toughness, high heat resistance, etc. These properties make the prepared composite material more stable and reliable when subjected to external forces, and can meet the use requirements in various complex environments.

[0027] Bisphenol A epoxy resin has good compatibility with thermal conductive fillers. During the preparation process, the thermal conductive fillers can be evenly attached to the surface of epoxy oil droplets to form a thermal conductive network. This helps to improve the thermal conductivity of the composite material, allowing it to dissipate heat more effectively in high temperature environments.

[0028] Furthermore, in step 1, the surfactant is selected from at least one of cetyltrimethylammonium bromide (CTAB), fatty alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether and polyol polyoxyethylene ether fatty acid ester.

[0029] The beneficial effect of the basic scheme is that the surfactant can significantly reduce the surface tension between water and epoxy resin prepolymer, making the two easier to mix evenly to form a stable water-in-oil emulsion.

[0030] Surfactants can improve the dispersion of thermally conductive fillers in epoxy resin prepolymers, making them more evenly distributed in the composite material, thereby improving the overall performance of the composite material. By optimizing the dispersion of thermally conductive fillers, surfactants help form a more effective thermal conductive network, thereby improving the thermal conductivity of the composite material.

[0031] Furthermore, in step 2, the thermally conductive filler is selected from at least one of graphene, zinc oxide, boron nitride and aluminum oxide, and the added amount of the thermally conductive filler is 1wt%-6wt%.

[0032] The beneficial effects of the basic solution are: graphene, boron nitride and aluminum oxide all have high thermal conductivity, which can effectively improve the thermal conductivity of composite materials. Graphene has extremely high thermal conductivity, and its thermal conductivity along the fiber direction can even reach 2-3 times that of copper; the thermal conductivity of boron nitride and aluminum oxide is also relatively high and stable. Thermally conductive fillers can form an effective thermal conductive network in the composite material, allowing heat to be transferred and dispersed faster, thereby improving the heat dissipation efficiency of the composite material.

[0033] Furthermore, in step 2, the curing agent is selected from at least one of 1-(3-aminopropyl)imidazole, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenyl sulfone and phenolic resin.

[0034] The basic scheme has the following beneficial effects: 1-(3-aminopropyl)imidazole, as an imidazole curing agent, has the characteristics of medium temperature curing, fast curing speed, and can complete the curing process in a short time. Phenolic resin curing agents also have a high curing speed and can achieve rapid curing at a lower temperature.

[0035] These curing agents can react effectively with epoxy resin prepolymers to form stable chemical bonds, thereby improving the degree of curing of the composite material and ensuring that the cured material has excellent properties.

[0036] Furthermore, in step 2, the curing process parameters of the epoxy resin prepolymer are: curing at 80° C. for 2 hours.

[0037] The beneficial effect of the basic solution is that the curing temperature of 80°C is moderate, neither too high to cause decomposition of the epoxy resin prepolymer or curing agent, nor too low to cause a slow curing reaction rate. This temperature can ensure that the chemical reaction between the curing agent and the epoxy resin prepolymer is fully carried out to form a stable chemical bond.

[0038] Furthermore, in step three, reinforcing fibers are added when the epoxy resin prepolymer and the thermal conductive filler are mixed.

[0039] The benefits of the basic solution are: reinforcing fibers such as carbon fiber and glass fiber have high strength and stiffness. As skeleton materials, they can effectively bear and disperse external forces, thereby improving the overall strength and stiffness of the composite material. The addition of reinforcing fibers can also improve the toughness of the composite material, making it more resistant to impact and vibration.

[0040] Furthermore, the reinforcing fiber is selected from at least one of glass fiber, carbon fiber and aramid fiber.

[0041] The benefits of the basic solution are: glass fiber has the characteristics of high strength and high modulus, which can effectively improve the tensile strength and bending strength of composite materials. Carbon fiber has higher strength and modulus, and is the preferred material for enhancing the mechanical properties of composite materials, especially in application scenarios that need to withstand high loads and vibrations.

[0042] The reinforcing fibers form a three-dimensional network structure in the composite material, which helps to evenly distribute the thermal conductive filler and form a thermal conductive path, thereby improving the thermal conductivity of the composite material.

[0043] Furthermore, the heat treatment step in step three includes heating the epoxy resin thermal conductive composite material, and the process parameters of the heat treatment are: heating at 120° C. for 4 hours.

[0044] The beneficial effects of the basic solution are: heat treatment can further promote the chemical reaction between epoxy resin and curing agent, making the curing more complete, thereby improving the overall performance of the composite material. Heat treatment helps to evenly disperse the thermal conductive filler in the epoxy resin matrix and reduce agglomeration, thereby further improving the thermal conductivity of the composite material. Heat treatment at 120°C for 4 hours can ensure that the chemical reaction between the epoxy resin and the curing agent is more complete, so that the curing process reaches the best state. This helps to improve the overall performance of the composite material. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 This is a method step diagram for preparing a method for epoxy resin thermally conductive composite material with an adjustable isolation frame in an embodiment of the present invention.

[0046] Figure 2 This is a diagram of the reinforcing fiber adding steps of a method for preparing an epoxy resin thermally conductive composite material with an adjustable isolation frame in an embodiment of the present invention.

[0047] Figure 3 This is a diagram of the heat treatment steps of a method for preparing an epoxy resin thermally conductive composite material with an adjustable isolation frame in an embodiment of the present invention. DETAILED DESCRIPTION

[0048] The following is further described in detail through specific implementation methods:

[0049] Basically as attached Figure 1 -Attached Figure 3 As shown, a thermally conductive epoxy resin composite material containing an adjustable isolation frame, the main components of the thermally conductive epoxy resin composite material are: 10-20g of epoxy resin prepolymer, 0.005g of surfactant, 150-200g of deionized water, 0.1-0.6g of thermal conductive filler and 2.5-4g of curing agent.

[0050] An epoxy resin thermally conductive composite material containing an adjustable isolation frame and a preparation method thereof, comprising the following steps:

[0051] Step 1: Mix epoxy resin prepolymer, surfactant and deionized water to prepare a stable water-in-oil emulsion. The epoxy resin prepolymer is selected from at least one of bisphenol A type E-51, bisphenol A type E-44 and bisphenol A type E-128. The surfactant is selected from at least one of hexadecyltrimethylammonium bromide CTAB, fatty alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether and polyol polyoxyethylene ether fatty acid ester.

[0052] Step 2: Add a thermally conductive filler to the oil-in-water emulsion obtained in step 1, use centrifugal force and adhesive force to attach the thermally conductive filler to the surface of the epoxy oil droplet, add a curing agent and cure to obtain a core-shell material with a thermally conductive filler as a shell layer and an epoxy resin prepolymer as a core layer. The thermally conductive filler is selected from at least one of graphene, zinc oxide, boron nitride and aluminum oxide, and the amount of the thermally conductive filler added is 1wt%-6wt%. The curing agent is selected from at least one of 1-(3-aminopropyl) imidazole, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenyl sulfone and phenolic resin. The curing process parameters of the epoxy resin prepolymer are: curing at 80°C for 2h.

[0053] Step 3: Mix the epoxy resin prepolymer with the thermally conductive filler to prepare an epoxy resin adhesive, which is used to bond the core-shell material obtained in step 2, and use the epoxy resin adhesive to bond the core-shell material to form an epoxy resin thermally conductive composite material. Add reinforcing fiber when the epoxy resin prepolymer is mixed with the thermally conductive filler. The reinforcing fiber is selected from at least one of glass fiber, carbon fiber and aramid fiber. The epoxy resin thermally conductive composite material is then heat-treated, and the heat treatment step includes heating the epoxy resin thermally conductive composite material, and the process parameters of the heat treatment are: heating at 120°C for 4 hours.

[0054] The specific implementation process is as follows: First, select 15g of epoxy resin prepolymer, 0.005g of surfactant and 175g of deionized water, then mix the surfactant and deionized water to ensure that the surfactant is completely dissolved, and then slowly add 15g of epoxy resin prepolymer to the surfactant aqueous solution under high-speed stirring to form a preliminary oil-water mixture. Finally, use an emulsifier to emulsify the mixture into a stable water-in-oil emulsion. In this embodiment, the epoxy resin prepolymer is bisphenol A type E-51, and the surfactant is hexadecyl trimethyl ammonium bromide CTAB. Bisphenol A type E-51 is taken from Shanghai Aladdin Biochemical Technology Co., Ltd. Hexadecyl trimethyl ammonium bromide CTAB is taken from Chengdu Cologne Chemical Reagent Co., Ltd.

[0055] The epoxy groups of bisphenol A type E-51 interact with the cationic active groups of hexadecyltrimethylammonium bromide CTAB to form stronger chemical bonds, thereby enhancing the bonding properties of the material. In addition, the combination of the heat resistance of bisphenol A type E-51 and the stability of CTAB helps to improve the stability of the material, allowing it to maintain stable performance in harsh environments such as high temperature and humidity.

[0056] Then select 0.35g of thermally conductive filler to add to the water-in-oil emulsion, and turn on the centrifugal device at the same time. In this embodiment, the centrifugal device uses a high-speed centrifuge of AXDL6M model, and uses the effect of centrifugal force and surfactant to make the thermally conductive filler adhere to the surface of the epoxy oil droplet. Select 3.5g of curing agent, add the curing agent evenly to the emulsion, continue stirring to ensure uniform mixing, and after curing, you can get a core-shell material with a thermally conductive filler as a shell layer and an epoxy resin prepolymer as a core layer. In this embodiment, graphene G0500 is used as the thermally conductive filler, and 1-(3-aminopropyl) imidazole A1185 is used as the curing agent. Graphene G0500 is taken from Chengdu Dingsheng Times Technology Co., Ltd. 1-3-(Aminopropyl) imidazole A1185 is taken from Chengdu Cologne Chemical Reagent Co., Ltd.

[0057] The high thermal conductivity of graphene G0500 gives the composite material a significant advantage in heat dissipation, and the high strength and high stiffness of graphene G0500 help improve the overall mechanical properties of the composite material, such as tensile strength and bending strength.

[0058] The epoxy resin system cured with 1-(3-aminopropyl)imidazole A1185 has high heat resistance and can ensure the stability of the composite material in high temperature environment.

[0059] Then, 15g of epoxy resin prepolymer and 0.35g of thermal conductive filler were mixed again to prepare epoxy resin adhesive, and reinforcing fiber was added when the epoxy resin prepolymer and the thermal conductive filler were mixed. In this embodiment, the reinforcing fiber was carbon fiber, which was obtained from Shengte Carbon Fiber Products Co., Ltd. The addition of reinforcing fiber can improve the toughness of the composite material, making it more able to withstand external forces such as impact and vibration, thereby improving the durability and service life of the material.

[0060] Carbon fiber is known for its excellent high strength and high modulus properties, which makes it an ideal choice for improving the mechanical properties of composite materials. When carbon fiber is added to the epoxy resin matrix, it can significantly improve the tensile strength, flexural strength and compressive strength of the composite material.

[0061] Subsequently, the epoxy resin adhesive is evenly coated on the surface of the core-shell material to be bonded in a mass ratio of 1g:20g of the epoxy resin adhesive to the core-shell structure, thereby obtaining an epoxy resin thermal conductive composite material containing an adjustable isolation frame.

[0062] Finally, the epoxy resin thermal conductive composite material is placed in a heat treatment device. In this embodiment, the heat treatment device preferably uses a WCK-120 model heat treatment temperature control box. The heat treatment device is then heated to 120°C and then maintained at this temperature for insulation treatment for 4 hours.

[0063] Heat treatment can enhance the interfacial bonding between epoxy resin, thermal conductive filler and reinforcing fiber, thereby improving the overall strength and hardness of the composite material. Moreover, heat treatment at high temperature can release the residual stress in the epoxy resin matrix and reduce the thermal stress caused by temperature changes, thereby improving the heat resistance of the composite material.

[0064] Embodiment 1:

[0065] The difference from the above embodiment is that in this embodiment, an experimental group 1 is set:

[0066] Experimental group 1: The curing agent is 1-(3-aminopropyl)imidazole. The ratio of epoxy resin prepolymer to deionized water is 10 g:200 g. The thermal conductive filler is graphene. The ratio of graphene to epoxy resin prepolymer is 0.1 g:10 g.

[0067] Embodiment 2:

[0068] The difference from the above embodiment is that in this embodiment, an experimental group 2 is set:

[0069] Experimental Group 2: The curing agent was 1-(3-aminopropyl)imidazole. The ratio of epoxy resin prepolymer to deionized water was 20 g:200 g. The thermal conductive filler was graphene. The ratio of graphene to epoxy resin prepolymer was 0.1 g:10 g.

[0070] Embodiment 3:

[0071] The difference from the above embodiment is that in this embodiment, an experimental group 3 is set:

[0072] Experimental group 3: The curing agent is 1-(3-aminopropyl)imidazole. The ratio of epoxy resin prepolymer to deionized water is 20g:150g. The thermal conductive filler is graphene. The ratio of graphene to epoxy resin prepolymer is 0.1g:10g.

[0073] Embodiment 4:

[0074] The difference from the above embodiment is that in this embodiment, an experimental group 4 is set:

[0075] Experimental Group 4: The curing agent was 1-(3-aminopropyl)imidazole. The ratio of epoxy resin prepolymer to deionized water was 10 g:200 g. The thermal conductive filler was graphene. The ratio of graphene to epoxy resin prepolymer was 0.3 g:10 g.

[0076] Embodiment 5:

[0077] The difference from the above embodiment is that in this embodiment, an experimental group 5 is set:

[0078] Experimental Group 5: The curing agent was 1-(3-aminopropyl)imidazole. The ratio of epoxy resin prepolymer to deionized water was 10 g:200 g. The thermal conductive filler was graphene. The ratio of graphene to epoxy resin prepolymer was 0.6 g:10 g.

[0079] Comparative Example 1:

[0080] The difference from the above embodiment is that, in this embodiment, a comparison group 1 is set:

[0081] Comparative Group 1: The curing agent is 1-(3-aminopropyl)imidazole. The ratio of epoxy resin prepolymer to deionized water is 10g:200g. The thermal conductive filler is zinc oxide powder. The ratio of zinc oxide powder to epoxy resin prepolymer is 0.1g:10g.

[0082] Comparative Example 2:

[0083] The difference from the above embodiment is that, in this embodiment, a comparison group 2 is set:

[0084] Comparative Group 2: The curing agent is 1-(3-aminopropyl)imidazole. The ratio of epoxy resin prepolymer to deionized water is 10 g:200 g. The thermal conductive filler is boron nitride powder. The ratio of boron nitride powder to epoxy resin prepolymer is 0.1 g:10 g.

[0085] Comparative Example 3:

[0086] The difference from the above embodiment is that, in this embodiment, a comparison group 3 is set:

[0087] Comparative Group 3: The curing agent is 1-(3-aminopropyl)imidazole. The ratio of epoxy resin prepolymer to deionized water is 10g:200g. The thermal conductive filler is aluminum oxide powder. The ratio of aluminum oxide powder to epoxy resin prepolymer is 0.1g:10g.

[0088] Comparative Example 4:

[0089] The difference from the above embodiment is that, in this embodiment, a comparison group 4 is set:

[0090] Comparative group 4: The curing agent is 1-(3-aminopropyl)imidazole, and the thermal conductive filler is simply mixed and dispersed.

[0091] Experimental results: Experimental groups 1, 2, 3, 4 and 5 were subjected to thermal conductivity tests according to ASTM-D5470 standard. The test results are shown in Table 1:

[0092] Table 1: Performance test results of experimental group 1, experimental group 2, experimental group 3, experimental group 4 and experimental group 5

[0093] Experimental Group 1 Experimental Group 2 Experimental Group 3 Experimental Group 4 Experimental Group 5 Thermal conductivity / w / mk 2.5 1.9 1.5 2.6 2.6 Tensile strength / MPa 40.6 41.5 41.6 38.9 36.5 cost Low Low Low high high

[0094] As shown in Table 1, the comparison among experimental groups 1, 2 and 3 shows that when the ratio of epoxy resin prepolymer to deionized water is 10g:200g, the thermal conductivity is optimal and the mechanical properties are good; the comparison among experimental groups 1, 4 and 5 shows that the thermal conductivity of the composite material first increases and then tends to be flat with the increase of graphene content, and the cost performance is highest when the ratio of graphene to epoxy resin prepolymer is 0.3g:10g.

[0095] The thermal conductivity of experimental group 1, comparative group 1, comparative group 2, comparative group 3 and comparative group 4 was tested according to the ASTM-D5470 standard. The test results are shown in Table 2:

[0096] Table 2: Performance test results of experimental group 1, comparison group 1, comparison group 2, comparison group 3 and comparison group 4

[0097] Experimental Group 1 Comparison group 1 Comparison group 2 Comparison group 3 Comparison group 4 Thermal conductivity / w / mk 2.5 0.5 0.8 1.5 0.8 Tensile strength / MPa 40.6 30.5 29.5 38.9 35.5 cost Low Low Low Low Low

[0098] As shown in Table 2, the comparison among experimental group 1, comparison group 1, comparison group 2 and comparison group 3 shows that the thermal conductivity and tensile strength are best when graphene is selected as the thermal conductive filler; the comparison between experimental group 1 and comparison group 4 shows that the epoxy resin composite material containing an adjustable isolation frame obtained by the emulsion polymerization method has better thermal conductivity and better mechanical properties.

[0099] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0100] The above is only an embodiment of the present invention. The common sense such as the known specific structure and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field know all the common technical knowledge in the technical field of the invention before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement this scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for ordinary technicians in the relevant field to implement this application. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, which should also be regarded as the protection scope of the present invention, which will not affect the effect of the implementation of the present invention and the practicality of the patent. The protection scope required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. An epoxy resin thermally conductive composite material containing an adjustable isolation frame, characterized in that: The epoxy resin thermal conductive composite material comprises: 10-20 g of epoxy resin prepolymer, 0.005 g of surfactant, 150-200 g of deionized water, 0.1-0.6 g of thermal conductive filler and 2.5-4 g of curing agent.

2. A method for preparing an epoxy resin thermally conductive composite material containing an adjustable isolation frame, the method for preparing an epoxy resin thermally conductive composite material containing an adjustable isolation frame according to claim 1, comprising the following steps: Step 1: mixing epoxy resin prepolymer, surfactant and deionized water to prepare a stable oil-in-water emulsion; Step 2: Add a thermally conductive filler to the oil-in-water emulsion obtained in step 1, attach the thermally conductive filler to the surface of the epoxy oil droplet by utilizing centrifugal force and adhesive force, add a curing agent and cure to obtain a core-shell material having the thermally conductive filler as a shell layer and the epoxy resin prepolymer as a core layer; Step three: Mix the epoxy resin prepolymer with the thermal conductive filler to prepare an epoxy resin adhesive for bonding the core-shell material obtained in step two, use the epoxy resin adhesive to bond the core-shell material to form an epoxy resin thermal conductive composite material, and then heat treat the epoxy resin thermal conductive composite material.

3. The method for preparing the epoxy resin thermally conductive composite material containing an adjustable isolation frame according to claim 2, characterized in that: In step 1, the epoxy resin prepolymer is selected from at least one of bisphenol A type E-51, bisphenol A type E-44 and bisphenol A type E-128.

4. The method for preparing the epoxy resin thermally conductive composite material containing an adjustable isolation frame according to claim 3, characterized in that: In step 1, the surfactant is selected from at least one of cetyltrimethylammonium bromide (CTAB), fatty alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether and polyol polyoxyethylene ether fatty acid ester.

5. The method for preparing the epoxy resin thermally conductive composite material containing an adjustable isolation frame according to claim 4, characterized in that: In step 2, the thermal conductive filler is selected from at least one of graphene, zinc oxide, boron nitride and aluminum oxide, and the added amount of the thermal conductive filler is 1wt%-6wt%.

6. The method for preparing the epoxy resin thermally conductive composite material containing an adjustable isolation frame according to claim 5, characterized in that: In step 2, the curing agent is selected from at least one of 1-3-aminopropyl imidazole, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenyl sulfone and phenolic resin.

7. The method for preparing the epoxy resin thermally conductive composite material containing an adjustable isolation frame according to claim 6, characterized in that: In step 2, the curing process parameters of the epoxy resin prepolymer are: curing at 80° C. for 2 hours.

8. The method for preparing the epoxy resin thermally conductive composite material containing an adjustable isolation frame according to claim 7, characterized in that: In step three, reinforcing fibers are added when the epoxy resin prepolymer is mixed with the thermally conductive filler.

9. The method for preparing the epoxy resin thermally conductive composite material containing an adjustable isolation frame according to claim 8, characterized in that: The reinforcing fiber is selected from at least one of glass fiber, carbon fiber and aramid fiber.

10. The method for preparing the epoxy resin thermally conductive composite material containing an adjustable isolation frame according to claim 9, characterized in that: In step three, the heat treatment step includes heating the epoxy resin thermal conductive composite material, and the process parameters of the heat treatment are: heating at 120° C. for 4 hours.

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